| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayesian estimation of reliability model using the linex loss function
|
Pandey, M.
|
|
1994
|
100-101 |
9 |
p. 1519-1523
5 p.
|
artikel
|
| 2 |
A comparison between microwave reflectance, thermal wave modulated reflectance and defect etching for detecting transition metals in silicon
|
|
|
1993
|
100-101 |
9 |
p. 1434-
1 p.
|
artikel
|
| 3 |
A comparison of radiation and hot-electron-induced damages in MOS capacitors with rapid thermally nitrided thin-gate oxides
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 4 |
A comprehensive approach for the analysis of package induced stress in ICs using analytical and empirical methods
|
|
|
1992
|
100-101 |
9 |
p. 1333-
1 p.
|
artikel
|
| 5 |
A computer approach for reliability evaluation of telecommunication networks with heterogeneous link-capacities
|
|
|
1992
|
100-101 |
9 |
p. 1335-
1 p.
|
artikel
|
| 6 |
A computer program for component life estimation using multiply censored system life data
|
|
|
1992
|
100-101 |
9 |
p. 1332-
1 p.
|
artikel
|
| 7 |
A configurable integrated test methodology for monolithic microwave integrated circuit production
|
|
|
1993
|
100-101 |
9 |
p. 1431-
1 p.
|
artikel
|
| 8 |
A decomposition method for optimization of large-system reliability
|
|
|
1993
|
100-101 |
9 |
p. 1423-
1 p.
|
artikel
|
| 9 |
A directed-graph classifier of semiconductor wafer-test patterns
|
|
|
1993
|
100-101 |
9 |
p. 1420-
1 p.
|
artikel
|
| 10 |
Advanced ceramic substrates for multichip modules with multilevel thin film interconnects
|
|
|
1992
|
100-101 |
9 |
p. 1346-
1 p.
|
artikel
|
| 11 |
A generic computer simulation model to characterize photolithography manufacturing area in an IC FAB facility
|
|
|
1992
|
100-101 |
9 |
p. 1339-
1 p.
|
artikel
|
| 12 |
A method for ion etching depth control
|
|
|
1993
|
100-101 |
9 |
p. 1438-
1 p.
|
artikel
|
| 13 |
A Monte Carlo simulation algorithm for finding MTBF
|
|
|
1993
|
100-101 |
9 |
p. 1423-
1 p.
|
artikel
|
| 14 |
A multi-period design model for survivable network architecture selection for SONET interoffice networks
|
|
|
1992
|
100-101 |
9 |
p. 1336-
1 p.
|
artikel
|
| 15 |
An additional temperature increase within GaAs/(AlGa)As diode lasers caused by the deterioration of an indium solder
|
|
|
1992
|
100-101 |
9 |
p. 1347-
1 p.
|
artikel
|
| 16 |
An age replacement policy with minimal repair and general random repair cost
|
Sheu, Shey-Huei
|
|
1992
|
100-101 |
9 |
p. 1283-1289
7 p.
|
artikel
|
| 17 |
An algorithm for designing rings for survivable fiber networks
|
|
|
1992
|
100-101 |
9 |
p. 1332-
1 p.
|
artikel
|
| 18 |
Analysis of a fault-tolerance scheme for processor ensembles
|
|
|
1993
|
100-101 |
9 |
p. 1425-1426
2 p.
|
artikel
|
| 19 |
Analysis of alternative rework strategies for printed wiring assembly manufacturing systems
|
|
|
1992
|
100-101 |
9 |
p. 1337-
1 p.
|
artikel
|
| 20 |
Analyzing quality for better testing
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
|
artikel
|
| 21 |
An approximate method for computing performance-related reliability of gracefully degrading systems
|
Tian, Zhiyu
|
|
1994
|
100-101 |
9 |
p. 1529-1536
8 p.
|
artikel
|
| 22 |
An approximation optimal inspection policy
|
Chung, Kun-Jen
|
|
1994
|
100-101 |
9 |
p. 1485-1488
4 p.
|
artikel
|
| 23 |
An automated electrical defect identification and location method for CMOS processes using a specially designed test chip
|
|
|
1993
|
100-101 |
9 |
p. 1421-1422
2 p.
|
artikel
|
| 24 |
An automated oracle for software testing
|
|
|
1993
|
100-101 |
9 |
p. 1425-
1 p.
|
artikel
|
| 25 |
An efficient approach for channel routing in VLSI
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 26 |
An empirical study on complexity metrics of Petri nets
|
Lee, Gang Soo
|
|
1992
|
100-101 |
9 |
p. 1215-1221
7 p.
|
artikel
|
| 27 |
An evaluation of CAD-aided programming systems for coordinate measuring machines
|
|
|
1993
|
100-101 |
9 |
p. 1428-
1 p.
|
artikel
|
| 28 |
A new algorithm for reliability evaluation of three-state device complex networks: Minimal cut-minimal path method
|
Dong-Kui, Li
|
|
1994
|
100-101 |
9 |
p. 1537-1540
4 p.
|
artikel
|
| 29 |
A new technique in a cutset evaluation
|
Elias, S.S.
|
|
1993
|
100-101 |
9 |
p. 1351-1355
5 p.
|
artikel
|
| 30 |
A new threshold voltage model for deep-submicron MOSFETs with nonuniform substrate dopings
|
Zhang, Wen-liang
|
|
1998
|
100-101 |
9 |
p. 1465-1469
5 p.
|
artikel
|
| 31 |
An expert aid to fault diagnosis and trouble-shooting in satellite communications
|
|
|
1992
|
100-101 |
9 |
p. 1336-
1 p.
|
artikel
|
| 32 |
An expert system framework for machine fault diagnosis
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
|
artikel
|
| 33 |
An exponential SRGM with a bound on the number of failures
|
Kapur, P.K.
|
|
1993
|
100-101 |
9 |
p. 1245-1249
5 p.
|
artikel
|
| 34 |
An information model for a CAM data base to support flexible manufacture of printed circuit boards
|
|
|
1993
|
100-101 |
9 |
p. 1421-
1 p.
|
artikel
|
| 35 |
An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments
|
|
|
1993
|
100-101 |
9 |
p. 1430-
1 p.
|
artikel
|
| 36 |
An interarrival hyperexponential machine interference with balking and reneging
|
Abou El-Ata, M.O.
|
|
1992
|
100-101 |
9 |
p. 1251-1256
6 p.
|
artikel
|
| 37 |
Announcement Call for papers
|
|
|
1996
|
100-101 |
9 |
p. 1319-1321
3 p.
|
artikel
|
| 38 |
An O(kn) algorithm for a circular consecutive-k-out-of-n:F system
|
|
|
1993
|
100-101 |
9 |
p. 1426-
1 p.
|
artikel
|
| 39 |
A note on reliability allocation under a preventive maintenance schedule
|
Wong, Jsun Y.
|
|
1993
|
100-101 |
9 |
p. 1411-1414
4 p.
|
artikel
|
| 40 |
A novel technique for in-line monitoring of micro-contamination and process induced damage
|
|
|
1993
|
100-101 |
9 |
p. 1429-
1 p.
|
artikel
|
| 41 |
A novel technique for the simultaneous measurement of ambipolar carrier lifetime and diffusion coefficient in silicon
|
|
|
1993
|
100-101 |
9 |
p. 1433-
1 p.
|
artikel
|
| 42 |
An overview of X-ray lithography for use in semiconductor device preparation
|
|
|
1992
|
100-101 |
9 |
p. 1344-
1 p.
|
artikel
|
| 43 |
A phenomenon of charge trapping saturation induced by rapid thermal annealing
|
Wong, Shyh-Chyi
|
|
1998
|
100-101 |
9 |
p. 1391-1399
9 p.
|
artikel
|
| 44 |
Application of direct-tunneling gate oxides to high-performance CMOS
|
Momose, Hisayo Sasaki
|
|
1998
|
100-101 |
9 |
p. 1413-1423
11 p.
|
artikel
|
| 45 |
A precision vertical interconnect technology
|
|
|
1992
|
100-101 |
9 |
p. 1337-
1 p.
|
artikel
|
| 46 |
A process control methodology applied to manufacturing GaAs MMICs
|
|
|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
|
| 47 |
A proposed approach to computer-supported TQM in maintenance work induction and accomplishment
|
|
|
1992
|
100-101 |
9 |
p. 1335-
1 p.
|
artikel
|
| 48 |
A queueing system with stepwise randomly available additional space
|
Garg, R.L.
|
|
1994
|
100-101 |
9 |
p. 1549-1555
7 p.
|
artikel
|
| 49 |
A reliability analysis technique for object-oriented model using a reliability petri net
|
Kim, Kapsu
|
|
1996
|
100-101 |
9 |
p. 1237-1247
11 p.
|
artikel
|
| 50 |
A simple method for generating K-trees of a network
|
Rath, Debaraj
|
|
1993
|
100-101 |
9 |
p. 1241-1244
4 p.
|
artikel
|
| 51 |
A stochastic algorithm for high speed capacitance extraction in integrated circuits
|
|
|
1993
|
100-101 |
9 |
p. 1420-1421
2 p.
|
artikel
|
| 52 |
A study of tilt angle effect on Halo PMOS performance
|
Su, Jiong-Guang
|
|
1998
|
100-101 |
9 |
p. 1503-1512
10 p.
|
artikel
|
| 53 |
A transistor fault model for nMOS combinational circuits
|
|
|
1992
|
100-101 |
9 |
p. 1335-
1 p.
|
artikel
|
| 54 |
A two-layer high density printed circuit board and its reliability
|
Zhang, S.
|
|
1999
|
100-101 |
9 |
p. 1337-1341
5 p.
|
artikel
|
| 55 |
A two-unit cold standby system with major and minor failures and preparation time in the case of major failure
|
Rander, M.C.
|
|
1992
|
100-101 |
9 |
p. 1199-1204
6 p.
|
artikel
|
| 56 |
A unified mobility model for device simulation—II. Temperature dependence of carrier mobility and life-time
|
|
|
1993
|
100-101 |
9 |
p. 1424-
1 p.
|
artikel
|
| 57 |
Automatic resistor-generation and thick film circuit layout using the Magic layout editor
|
|
|
1992
|
100-101 |
9 |
p. 1345-
1 p.
|
artikel
|
| 58 |
Availability for 2/n: F and secondary subsystems with general repair-time distributions and shut-off rules
|
Chen, Yow-Mow
|
|
1992
|
100-101 |
9 |
p. 1257-1270
14 p.
|
artikel
|
| 59 |
Back-surface washing system enhances circuit board reliability
|
|
|
1993
|
100-101 |
9 |
p. 1431-
1 p.
|
artikel
|
| 60 |
BaPbO3-based thick film resistor
|
|
|
1993
|
100-101 |
9 |
p. 1435-
1 p.
|
artikel
|
| 61 |
Basics and applications of charge pumping in submicron MOSFETs© 1997 IEEE. Reprinted, with permission, from Proc. 1997 21st International Conference on Microelectronics, Nis, Yugoslavia, 14–17 September 1997, Vol. 2, pp. 581–589.
|
Groeseneken, Guido
|
|
1998
|
100-101 |
9 |
p. 1379-1389
11 p.
|
artikel
|
| 62 |
Bayes attribute acceptance-sampling plan
|
|
|
1993
|
100-101 |
9 |
p. 1424-
1 p.
|
artikel
|
| 63 |
Bayes binomial sampling by attributes with a general-beta prior distribution
|
|
|
1993
|
100-101 |
9 |
p. 1426-
1 p.
|
artikel
|
| 64 |
Bayesian estimation under Poisson testing using the LINEX loss function
|
Jaisingh, Lloyd R.
|
|
1993
|
100-101 |
9 |
p. 1259-1265
7 p.
|
artikel
|
| 65 |
Board level reliability assessment of chip scale packages
|
Wang, Z.P
|
|
1999
|
100-101 |
9 |
p. 1351-1356
6 p.
|
artikel
|
| 66 |
Bonding state in GaAs/Si interface
|
|
|
1993
|
100-101 |
9 |
p. 1435-
1 p.
|
artikel
|
| 67 |
Breakdown voltage of diffused epitaxial junctions
|
|
|
1992
|
100-101 |
9 |
p. 1344-
1 p.
|
artikel
|
| 68 |
CAFE—the MIT computer-aided fabrication environment
|
|
|
1993
|
100-101 |
9 |
p. 1429-
1 p.
|
artikel
|
| 69 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1992
|
100-101 |
9 |
p. 1327-1329
3 p.
|
artikel
|
| 70 |
Catastrophic damage in diode lasers caused by an increase in their facet reflectivity
|
|
|
1992
|
100-101 |
9 |
p. 1331-
1 p.
|
artikel
|
| 71 |
Causes of cracks in SMD and type specific remedies
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 72 |
CEPT—a computer-aided manufacturing application for managing equipment reliability and availability in the semiconductor industry
|
|
|
1992
|
100-101 |
9 |
p. 1331-
1 p.
|
artikel
|
| 73 |
Characteristics of the resist development process in electron beam lithography
|
|
|
1993
|
100-101 |
9 |
p. 1437-
1 p.
|
artikel
|
| 74 |
Characterization of a JFET operational amplifier by planned experimentation and its impact on IC manufacturing
|
|
|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
|
| 75 |
Characterization of chip scale packaging materials
|
Amagai, Masazumi
|
|
1999
|
100-101 |
9 |
p. 1365-1377
13 p.
|
artikel
|
| 76 |
Choosing from redundant designs of power systems using system outage rate and cost
|
Vallarino, C.R.
|
|
1996
|
100-101 |
9 |
p. 1269-1274
6 p.
|
artikel
|
| 77 |
Closed-form analytical solutions for avalanche breakdown quantities in high-voltage diffused junctions
|
|
|
1992
|
100-101 |
9 |
p. 1344-
1 p.
|
artikel
|
| 78 |
Combination of numerical and experimental methods for stress analysis of small electronic components
|
|
|
1992
|
100-101 |
9 |
p. 1333-
1 p.
|
artikel
|
| 79 |
Common-cause failure analysis of a parallel system with warm standby
|
Dhillon, B.S.
|
|
1993
|
100-101 |
9 |
p. 1321-1342
22 p.
|
artikel
|
| 80 |
Comparison of bipolar NPN polysilicon emitter interface formation at three different manufacturing sites
|
|
|
1993
|
100-101 |
9 |
p. 1434-
1 p.
|
artikel
|
| 81 |
Comparison of latchup immunity for silicided source/drain at different n+ implant energy
|
Leong, Kam-Chew
|
|
1998
|
100-101 |
9 |
p. 1401-1405
5 p.
|
artikel
|
| 82 |
Composite solders
|
|
|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
|
| 83 |
Computer integrated manufacturing and networking in advanced IC manufacturing
|
|
|
1992
|
100-101 |
9 |
p. 1337-
1 p.
|
artikel
|
| 84 |
Computerization of the R-ABC algorithm
|
Shen, Yuanlong
|
|
1996
|
100-101 |
9 |
p. 1219-1221
3 p.
|
artikel
|
| 85 |
Computerized tolerance techniques
|
|
|
1992
|
100-101 |
9 |
p. 1334-1335
2 p.
|
artikel
|
| 86 |
Computer vision for quality control in automated manufacturing systems
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 87 |
Concurrent engineering for consumer, industrial products, and Government systems
|
|
|
1993
|
100-101 |
9 |
p. 1419-
1 p.
|
artikel
|
| 88 |
Confidence limits for steady-state availability of systems with a mixture of exponential and gamma operating time and lognormal repair time
|
Chandrasekhar, P.
|
|
1996
|
100-101 |
9 |
p. 1303-1304
2 p.
|
artikel
|
| 89 |
Constructing lifetime distributions with bathtub shaped failure rate from DFR distributions
|
SchÄbe, Hendrik
|
|
1994
|
100-101 |
9 |
p. 1501-1508
8 p.
|
artikel
|
| 90 |
Contact resistivity of shallow junctions formed by implantation through Pt or PtSi
|
|
|
1993
|
100-101 |
9 |
p. 1437-
1 p.
|
artikel
|
| 91 |
Continual progress marks electronic componentinstallation techniques
|
|
|
1993
|
100-101 |
9 |
p. 1422-
1 p.
|
artikel
|
| 92 |
Cost analysis of a man-machine system operating under changing operator conditions
|
Singh, S.K.
|
|
1993
|
100-101 |
9 |
p. 1267-1274
8 p.
|
artikel
|
| 93 |
Cost analysis of the M/M/R machine-repair problem with mixed standby spares
|
Wang, Kuo-Hsiung
|
|
1993
|
100-101 |
9 |
p. 1293-1301
9 p.
|
artikel
|
| 94 |
Cost saving opportunities with multichip modules
|
|
|
1993
|
100-101 |
9 |
p. 1427-
1 p.
|
artikel
|
| 95 |
CSCC for mean of an inverse Gaussian distribution under type I censoring
|
Shankar, Gauri
|
|
1996
|
100-101 |
9 |
p. 1309-1311
3 p.
|
artikel
|
| 96 |
Current status of failure analysis for ULSIs© 1997 IEEE. Reprinted with permission, from Proc. 1997 21st International Conference on Microelectronics, Nis, Yugoslavia, 14–17 September 1997, Vol. 2, pp. 591–598.
|
Nakajima, S
|
|
1998
|
100-101 |
9 |
p. 1369-1377
9 p.
|
artikel
|
| 97 |
Data flow model of a total service quality management system
|
|
|
1992
|
100-101 |
9 |
p. 1335-1336
2 p.
|
artikel
|
| 98 |
Defect clustering viewed through generalized Poisson distribution
|
|
|
1993
|
100-101 |
9 |
p. 1426-
1 p.
|
artikel
|
| 99 |
Defect localization induced by hot carrier injection in short-channel MOSFETs: Concept, modeling and characterization
|
Cristoloveanu, Sorin
|
|
1993
|
100-101 |
9 |
p. 1365-1385
21 p.
|
artikel
|
| 100 |
Defect size distribution in VLSI chips
|
|
|
1992
|
100-101 |
9 |
p. 1332-
1 p.
|
artikel
|
| 101 |
3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules
|
|
|
1992
|
100-101 |
9 |
p. 1341-
1 p.
|
artikel
|
| 102 |
Design of a VLSI digit slicing fast Fourier transform processor
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 103 |
Design of metallizations and components for aluminum nitride packages for VLSIC
|
|
|
1992
|
100-101 |
9 |
p. 1340-
1 p.
|
artikel
|
| 104 |
Design of survivable communications networks under performance constraints
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 105 |
Determination of the trapped charge distribution in scaled silicon nitride MONOS nonvolatile memory devices by tunneling spectroscopy
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 106 |
Development of temperature-stable thick-film dielectrics: III. Role of glass on the microstructure evolution of a thick-film dielectric
|
|
|
1992
|
100-101 |
9 |
p. 1345-
1 p.
|
artikel
|
| 107 |
Diffusion equation for GIx/G/r machine interference problem with spare machines
|
Jain, M.
|
|
1993
|
100-101 |
9 |
p. 1415-1418
4 p.
|
artikel
|
| 108 |
Discrete random dopant distribution effects in nanometer-scale MOSFETs
|
Philip Wong, Hon-Sum
|
|
1998
|
100-101 |
9 |
p. 1447-1456
10 p.
|
artikel
|
| 109 |
Downward laser trimming of thick film resistors
|
|
|
1992
|
100-101 |
9 |
p. 1346-
1 p.
|
artikel
|
| 110 |
Editorial
|
|
|
1998
|
100-101 |
9 |
p. 1367-1368
2 p.
|
artikel
|
| 111 |
Editorial
|
Stojadinović, Ninoslav
|
|
1997
|
100-101 |
9 |
p. iii-
1 p.
|
artikel
|
| 112 |
Effective buffer insertion of clock tree for high-speed VLSI circuits
|
|
|
1993
|
100-101 |
9 |
p. 1431-1432
2 p.
|
artikel
|
| 113 |
Effect of component interactions on the removal of organic impurities in ultrapure water systems
|
|
|
1992
|
100-101 |
9 |
p. 1333-
1 p.
|
artikel
|
| 114 |
Effect of gold on the reliability of fine pitch surface mount solder joints
|
|
|
1993
|
100-101 |
9 |
p. 1422-
1 p.
|
artikel
|
| 115 |
Effects of backend processing on counter-doped N+ poly-Si resistance
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 116 |
Efficient computation of the P.M.F. and the C.D.F. of the generalized binomial distribution
|
Rushdi, Ali M.
|
|
1994
|
100-101 |
9 |
p. 1489-1499
11 p.
|
artikel
|
| 117 |
Electrical characterization of hole transport in heavily-doped shallow implanted emitters
|
|
|
1993
|
100-101 |
9 |
p. 1436-
1 p.
|
artikel
|
| 118 |
Electroplated solder joints for flip-chip applications
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 119 |
Emerging trends in e-beam diagnostics
|
|
|
1993
|
100-101 |
9 |
p. 1427-
1 p.
|
artikel
|
| 120 |
Empirical formulas and global reliability evaluation of reliability graphs
|
Aziz, M.A.
|
|
1993
|
100-101 |
9 |
p. 1233-1236
4 p.
|
artikel
|
| 121 |
Enhanced conductivity and breakdown of oxides grown on heavily implanted substrates
|
|
|
1992
|
100-101 |
9 |
p. 1347-
1 p.
|
artikel
|
| 122 |
Enhanced self-test techniques for VLSI systems applied to the IBM enterprise system/9000 type 9121 processor
|
|
|
1992
|
100-101 |
9 |
p. 1335-
1 p.
|
artikel
|
| 123 |
ESD degradation in GaAs MES structures
|
|
|
1992
|
100-101 |
9 |
p. 1344-
1 p.
|
artikel
|
| 124 |
ESD-degradation mechanisms of GaAs microwave devices and device protection
|
Bock, K.
|
|
1993
|
100-101 |
9 |
p. 1397-1410
14 p.
|
artikel
|
| 125 |
Estimation of capability index based on bootstrap method
|
Choi, Kuey Chung
|
|
1996
|
100-101 |
9 |
p. 1141-1153
13 p.
|
artikel
|
| 126 |
Evaluation of modelling refinements on work sampling statistics
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
|
artikel
|
| 127 |
Evaluation of the dielectric breakdown of reoxidized nitrided oxide (ONO) in flash memory devices using constant current-stressing technique
|
Cha, C.L.
|
|
1998
|
100-101 |
9 |
p. 1439-1446
8 p.
|
artikel
|
| 128 |
Exhaust gas detoxifying systems used in microelectronics
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 129 |
Extended tables for the moments of gamma-distribution order statistics
|
|
|
1993
|
100-101 |
9 |
p. 1424-
1 p.
|
artikel
|
| 130 |
Extraordinary technologies enhance usefulness of standard cells, ASICs
|
|
|
1993
|
100-101 |
9 |
p. 1430-
1 p.
|
artikel
|
| 131 |
Fault tolerant packet-switched network design and its sensitivity
|
|
|
1992
|
100-101 |
9 |
p. 1333-
1 p.
|
artikel
|
| 132 |
Fine pitch wire bonding development using a new multipurpose, multipad pitch test die
|
|
|
1992
|
100-101 |
9 |
p. 1339-
1 p.
|
artikel
|
| 133 |
Fixed-time life tests based on fuzzy life characteristics
|
|
|
1993
|
100-101 |
9 |
p. 1425-
1 p.
|
artikel
|
| 134 |
Fixed-width confidence interval estimation of the inverse coefficient of variation in a normal population
|
Chaturvedi, Ajit
|
|
1996
|
100-101 |
9 |
p. 1305-1308
4 p.
|
artikel
|
| 135 |
Flexible connectors adapt to SMT requirements
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 136 |
Flow graph development method
|
Qamber, Isa S.
|
|
1993
|
100-101 |
9 |
p. 1387-1395
9 p.
|
artikel
|
| 137 |
1/f noise due to temperature fluctuations in heat conduction in bipolar transistors
|
Forbes, L
|
|
1999
|
100-101 |
9 |
p. 1357-1364
8 p.
|
artikel
|
| 138 |
Functional AlGaAs/GaAs heterostructure-emitter bipolar transistor with a pseudomorphic InGaAs/GaAs quantum-well base
|
Tsai, Jung-Hui
|
|
1999
|
100-101 |
9 |
p. 1379-1387
9 p.
|
artikel
|
| 139 |
Fusion: a plan for developing a familiar user system interface for the IC fabrication industry
|
|
|
1992
|
100-101 |
9 |
p. 1339-1340
2 p.
|
artikel
|
| 140 |
Fuzzy reliability modelling — Linguistic approach
|
Ramachandran, V.
|
|
1992
|
100-101 |
9 |
p. 1311-1318
8 p.
|
artikel
|
| 141 |
GaAs/AlGaAs (SQW GRIN-SCH) LEDs monolithically integrated with Si-MOS drivers
|
|
|
1993
|
100-101 |
9 |
p. 1431-
1 p.
|
artikel
|
| 142 |
GaAs-GaInP multilayers for high performance electronic devices
|
|
|
1992
|
100-101 |
9 |
p. 1340-
1 p.
|
artikel
|
| 143 |
Generation of vertex and edge cutsets
|
Prasad, V.C.
|
|
1992
|
100-101 |
9 |
p. 1291-1310
20 p.
|
artikel
|
| 144 |
GERT analysis of a two-unit warm standby system with repair
|
Shankar, Gauri
|
|
1996
|
100-101 |
9 |
p. 1275-1278
4 p.
|
artikel
|
| 145 |
Grain boundary sliding in surface mount solders during thermal cycling
|
|
|
1992
|
100-101 |
9 |
p. 1337-1338
2 p.
|
artikel
|
| 146 |
Graphical representation of two mixed-Weibull distributions
|
|
|
1993
|
100-101 |
9 |
p. 1422-
1 p.
|
artikel
|
| 147 |
Growth by molecular beam epitaxy (MBE) and structural characterization of GaAs and AlGaAs on silicon
|
|
|
1993
|
100-101 |
9 |
p. 1433-1434
2 p.
|
artikel
|
| 148 |
Growth of thin thermal silicon dioxide films with low defect density
|
|
|
1993
|
100-101 |
9 |
p. 1433-
1 p.
|
artikel
|
| 149 |
Hardware fault latency: Model validation
|
Soh, B.C.
|
|
1996
|
100-101 |
9 |
p. 1231-1235
5 p.
|
artikel
|
| 150 |
Hardware fault latency: Problem formulation and solution
|
Soh, B.C.
|
|
1996
|
100-101 |
9 |
p. 1223-1230
8 p.
|
artikel
|
| 151 |
Hermetic sealing process with atmospheric pressure vibration for LSI packages
|
|
|
1992
|
100-101 |
9 |
p. 1338-1339
2 p.
|
artikel
|
| 152 |
High density microelectronic packaging with thick film hermetic packages
|
|
|
1992
|
100-101 |
9 |
p. 1344-1345
2 p.
|
artikel
|
| 153 |
Highly flat GexSi1−x/Si heterointerfaces grown by molecular beam epitaxy in two-dimensional growth mode
|
|
|
1993
|
100-101 |
9 |
p. 1434-1435
2 p.
|
artikel
|
| 154 |
Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips
|
|
|
1992
|
100-101 |
9 |
p. 1339-
1 p.
|
artikel
|
| 155 |
High mechanical reliability of back-ground GaAs LSI chips with low thermal resistance
|
|
|
1992
|
100-101 |
9 |
p. 1332-1333
2 p.
|
artikel
|
| 156 |
High temperature device simulation and thermal characteristics of GaAs MESFETs on CVD diamond substrates
|
Shu, L.H.
|
|
1996
|
100-101 |
9 |
p. 1177-1189
13 p.
|
artikel
|
| 157 |
Hints and kinks
|
|
|
1993
|
100-101 |
9 |
p. 1419-1420
2 p.
|
artikel
|
| 158 |
Hybrid IC makers embrace “small is good” trends
|
|
|
1992
|
100-101 |
9 |
p. 1346-
1 p.
|
artikel
|
| 159 |
IC manufacturing diagnosis based on statistical analysis techniques
|
|
|
1993
|
100-101 |
9 |
p. 1428-1429
2 p.
|
artikel
|
| 160 |
Impact of low-temperature transient-enhanced diffusion of dopants in silicon
|
|
|
1993
|
100-101 |
9 |
p. 1434-
1 p.
|
artikel
|
| 161 |
Implementing total quality management at the U.S. Department of Defense
|
|
|
1992
|
100-101 |
9 |
p. 1337-
1 p.
|
artikel
|
| 162 |
Improved thermal conductivity in microelectronic encapsulants
|
|
|
1992
|
100-101 |
9 |
p. 1341-
1 p.
|
artikel
|
| 163 |
Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques
|
|
|
1992
|
100-101 |
9 |
p. 1340-1341
2 p.
|
artikel
|
| 164 |
Improving hot-electron hardness of narrow channel MOSFETs by fluorine implantation
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 165 |
Improving manufacturing reliability in IC package assembly using the FMEA technique
|
|
|
1992
|
100-101 |
9 |
p. 1341-
1 p.
|
artikel
|
| 166 |
Incorporation of impurities in GaAs grown by MOCVD
|
|
|
1992
|
100-101 |
9 |
p. 1344-
1 p.
|
artikel
|
| 167 |
Influence of environment on the fatigue of Pb-Sn solder joints
|
|
|
1992
|
100-101 |
9 |
p. 1341-
1 p.
|
artikel
|
| 168 |
Integrating economics into quality control charts
|
|
|
1992
|
100-101 |
9 |
p. 1331-
1 p.
|
artikel
|
| 169 |
Intelligence implementation on silicon based on four-terminal device electronics
|
Ohmi, T.
|
|
1997
|
100-101 |
9 |
p. 1315-1328
14 p.
|
artikel
|
| 170 |
Interconnection techniques for GaAs packaging
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 171 |
Investigations of laser soldered TAB inner lead contacts
|
|
|
1992
|
100-101 |
9 |
p. 1346-1347
2 p.
|
artikel
|
| 172 |
Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable?
|
Harsányi, Gábor
|
|
1999
|
100-101 |
9 |
p. 1407-1411
5 p.
|
artikel
|
| 173 |
Kinetics of triode mode reactive ion etching of Si(100) wafers by chlorine plasmas: temperature and d.c. self-bias effects
|
|
|
1992
|
100-101 |
9 |
p. 1347-
1 p.
|
artikel
|
| 174 |
Laser interconnection techniques for defect avoidance in large-area restructurable silicon systems
|
|
|
1993
|
100-101 |
9 |
p. 1437-
1 p.
|
artikel
|
| 175 |
Load balancing in heterogenous distributed systems
|
Gopal, T.V.
|
|
1996
|
100-101 |
9 |
p. 1279-1286
8 p.
|
artikel
|
| 176 |
Long-channel silicon-on-insulator MOSFET theory
|
|
|
1993
|
100-101 |
9 |
p. 1432-
1 p.
|
artikel
|
| 177 |
Lower confidence bound on the percentage improvement in comparing two failure rates
|
|
|
1993
|
100-101 |
9 |
p. 1424-
1 p.
|
artikel
|
| 178 |
Low loss static induction devices (transistors and thyristors)
|
Tadano, H.
|
|
1997
|
100-101 |
9 |
p. 1389-1396
8 p.
|
artikel
|
| 179 |
Low temperature characterization of silicon CMOS devices
|
Ghibaudo, G.
|
|
1997
|
100-101 |
9 |
p. 1353-1366
14 p.
|
artikel
|
| 180 |
Low temperature CMOS—a brief review
|
|
|
1993
|
100-101 |
9 |
p. 1433-
1 p.
|
artikel
|
| 181 |
Low-temperature degradation studies of AlGaAs/GaAs modulation-doped field effect transistors
|
|
|
1992
|
100-101 |
9 |
p. 1332-
1 p.
|
artikel
|
| 182 |
Makers tackle challenge of improving automatic assembly technology
|
|
|
1993
|
100-101 |
9 |
p. 1430-
1 p.
|
artikel
|
| 183 |
Maximum likelihood estimates, from censored data, for mixed-Weibull distributions
|
|
|
1993
|
100-101 |
9 |
p. 1423-
1 p.
|
artikel
|
| 184 |
Maximum likelihood estimation of Burr XII distribution parameters under Type II censoring
|
Wingo, Dallas R.
|
|
1993
|
100-101 |
9 |
p. 1251-1257
7 p.
|
artikel
|
| 185 |
Maximum likelihood predictive densities for the inverse Gaussian distribution with applications to reliability and lifetime predictions
|
Yang, Zhenlin
|
|
1999
|
100-101 |
9 |
p. 1413-1421
9 p.
|
artikel
|
| 186 |
Measurements of interface state density in partially- and fully-depleted silicon-on-insulator MOSFETs by a high-low-frequency transconductance method
|
|
|
1993
|
100-101 |
9 |
p. 1435-
1 p.
|
artikel
|
| 187 |
Measuring software reliability
|
|
|
1993
|
100-101 |
9 |
p. 1427-
1 p.
|
artikel
|
| 188 |
Measuring the opaque substrate temperature by infrared laser beams
|
|
|
1993
|
100-101 |
9 |
p. 1437-
1 p.
|
artikel
|
| 189 |
Mechanical behaviour of ceramic capacitors
|
|
|
1992
|
100-101 |
9 |
p. 1332-
1 p.
|
artikel
|
| 190 |
Mechanism analysis of gate-induced drain leakage in off-state n-MOSFET
|
Huang, L.
|
|
1998
|
100-101 |
9 |
p. 1425-1431
7 p.
|
artikel
|
| 191 |
Metallurgical changes in tin-lead platings due to heat ageing
|
|
|
1992
|
100-101 |
9 |
p. 1341-1342
2 p.
|
artikel
|
| 192 |
Method for controlling the manufacturing quality of diode lasers based on investigations of their transient thermal properties
|
|
|
1992
|
100-101 |
9 |
p. 1347-
1 p.
|
artikel
|
| 193 |
Method for semiconductor process optimization using functional representations of spatial variations and selectivity
|
|
|
1993
|
100-101 |
9 |
p. 1430-
1 p.
|
artikel
|
| 194 |
Microelectronics based on compound semiconductors
|
Hartnagel, Hans L.
|
|
1997
|
100-101 |
9 |
p. 1397-1400
4 p.
|
artikel
|
| 195 |
Microelectronics technology takes on hybrid ICs
|
|
|
1992
|
100-101 |
9 |
p. 1346-
1 p.
|
artikel
|
| 196 |
Microstructural evolution in Sn/Pb solder and Pd/Ag thick film conductor metallization
|
|
|
1992
|
100-101 |
9 |
p. 1346-
1 p.
|
artikel
|
| 197 |
Microwave IC control components for phased-array antennas
|
|
|
1993
|
100-101 |
9 |
p. 1431-
1 p.
|
artikel
|
| 198 |
MIL reliability: a new approach
|
|
|
1993
|
100-101 |
9 |
p. 1419-
1 p.
|
artikel
|
| 199 |
Minimizing damage and contamination in RIE processes by extracted-plasma-parameter analysis
|
|
|
1993
|
100-101 |
9 |
p. 1438-
1 p.
|
artikel
|
| 200 |
Modelling of a high throughput hot-wall reactor for selective epitaxial growth of silicon
|
|
|
1993
|
100-101 |
9 |
p. 1434-
1 p.
|
artikel
|
| 201 |
Modelling of deep silicon etching in multicomponent plasma
|
|
|
1993
|
100-101 |
9 |
p. 1434-
1 p.
|
artikel
|
| 202 |
Modelling the sidewall masked oxidation process using the boundary element method
|
|
|
1992
|
100-101 |
9 |
p. 1340-
1 p.
|
artikel
|
| 203 |
Molecular beam epitaxy—aspects and applications
|
|
|
1993
|
100-101 |
9 |
p. 1437-
1 p.
|
artikel
|
| 204 |
MOS device structure development for ULSI: Low power/high speed operation
|
Lee, Woo-Hyeong
|
|
1997
|
100-101 |
9 |
p. 1309-1314
6 p.
|
artikel
|
| 205 |
MOSFET prediction in space environments
|
Shvetzov-Shilovsky, I.N.
|
|
1997
|
100-101 |
9 |
p. 1367-1373
7 p.
|
artikel
|
| 206 |
MOS technology: Trends and challenges in the ULSI era
|
Shah, Ashwin
|
|
1997
|
100-101 |
9 |
p. 1301-1307
7 p.
|
artikel
|
| 207 |
Multilayer ceramic chip capacitors gain acceptance
|
|
|
1992
|
100-101 |
9 |
p. 1332-
1 p.
|
artikel
|
| 208 |
Multiple function trends sweep into hybrid IC field
|
|
|
1993
|
100-101 |
9 |
p. 1435-
1 p.
|
artikel
|
| 209 |
Multi-ring structures for contact resistance measurements on metal-thin-layer semiconductors
|
|
|
1992
|
100-101 |
9 |
p. 1343-
1 p.
|
artikel
|
| 210 |
New applications of low temperature PECVD silicon nitride films for microelectronics device fabrication
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 211 |
New physical model of multiplication-induced breakdown in MOSFETs
|
|
|
1992
|
100-101 |
9 |
p. 1344-
1 p.
|
artikel
|
| 212 |
New trimming technology of a thick film resistor by the pulse voltage method
|
|
|
1992
|
100-101 |
9 |
p. 1345-
1 p.
|
artikel
|
| 213 |
Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy
|
Yang, Jicheng
|
|
1996
|
100-101 |
9 |
p. 1291-1295
5 p.
|
artikel
|
| 214 |
Note on MTBF versus mean-wear-life versus Mil-Hdbk-217
|
Badenius, Duncan
|
|
1992
|
100-101 |
9 |
p. 1241-1242
2 p.
|
artikel
|
| 215 |
Novel effects of heating rate on the activation/recrystallization of boron-implanted Si substrates
|
|
|
1993
|
100-101 |
9 |
p. 1437-
1 p.
|
artikel
|
| 216 |
Novel near-field probe for on-wafer integrated circuit measurements
|
|
|
1993
|
100-101 |
9 |
p. 1430-
1 p.
|
artikel
|
| 217 |
n+/p ultra-shallow junction formation with plasma immersion ion implantation
|
Yang, B.L
|
|
1998
|
100-101 |
9 |
p. 1489-1494
6 p.
|
artikel
|
| 218 |
N2 reflow soldering assists environmental protection
|
|
|
1993
|
100-101 |
9 |
p. 1422-
1 p.
|
artikel
|
| 219 |
Object oriented programming approach for quality improvement based on systematic diagram method
|
|
|
1992
|
100-101 |
9 |
p. 1331-
1 p.
|
artikel
|
| 220 |
On a method for comparison of pseudo-random number generators
|
Sezgin, Fatin
|
|
1994
|
100-101 |
9 |
p. 1557-1563
7 p.
|
artikel
|
| 221 |
Once more on measures of importance of system components
|
Finkelstein, M.S.
|
|
1994
|
100-101 |
9 |
p. 1431-1439
9 p.
|
artikel
|
| 222 |
On Murphy's yield integral
|
|
|
1992
|
100-101 |
9 |
p. 1336-
1 p.
|
artikel
|
| 223 |
On Onaga's upper bound on the mean values of probabilistic maximum flows
|
|
|
1993
|
100-101 |
9 |
p. 1424-
1 p.
|
artikel
|
| 224 |
On the development of chip-net
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 225 |
On the expected revenue of a production system subject to operator condition
|
Singh, S.K.
|
|
1994
|
100-101 |
9 |
p. 1525-1528
4 p.
|
artikel
|
| 226 |
On the time-dependent degradation of LDD n-MOSFETs under hot-carrier stress
|
Ang, D.S
|
|
1999
|
100-101 |
9 |
p. 1311-1322
12 p.
|
artikel
|
| 227 |
Optimal design of accelerated life tests for the Weibull distribution under periodic inspection and type I censoring
|
Islam, A.
|
|
1994
|
100-101 |
9 |
p. 1459-1468
10 p.
|
artikel
|
| 228 |
Optimization models for selection of programmes, considering cost and reliability
|
|
|
1993
|
100-101 |
9 |
p. 1425-
1 p.
|
artikel
|
| 229 |
Optimization of GaAs-on-silicon MESFET structures
|
|
|
1992
|
100-101 |
9 |
p. 1338-
1 p.
|
artikel
|
| 230 |
Optimization of high performance BiCMOS buffer circuit for chip area, delay and power dissipation
|
|
|
1993
|
100-101 |
9 |
p. 1431-
1 p.
|
artikel
|
| 231 |
Optimization of interconnect thickness for minimum propagation delays in VLSI
|
|
|
1992
|
100-101 |
9 |
p. 1339-
1 p.
|
artikel
|
| 232 |
Optimization of restoration cost for complex technical systems at centralized structure of repair
|
Martynenko, O.N.
|
|
1993
|
100-101 |
9 |
p. 1227-1232
6 p.
|
artikel
|
| 233 |
Order statistics based modeling of gracefully degrading computing systems
|
Chaganty, N.R.
|
|
1993
|
100-101 |
9 |
p. 1281-1291
11 p.
|
artikel
|
| 234 |
Palladium as a lead finish for surface mount integrated circuit packages
|
|
|
1992
|
100-101 |
9 |
p. 1340-
1 p.
|
artikel
|
| 235 |
Parallel algorithms for terminal-pair reliability
|
|
|
1993
|
100-101 |
9 |
p. 1423-1424
2 p.
|
artikel
|
| 236 |
Parametric empirical Bayes approach to reliability analysis for the geometric life model
|
Tyagi, Ravindra K.
|
|
1992
|
100-101 |
9 |
p. 1271-1282
12 p.
|
artikel
|
| 237 |
PCB continuous line system proceeds from manufacture to inspection
|
|
|
1993
|
100-101 |
9 |
p. 1422-
1 p.
|
artikel
|
| 238 |
Photoresist silylation and dry development for sub-micron photolithography
|
|
|
1992
|
100-101 |
9 |
p. 1341-
1 p.
|
artikel
|
| 239 |
Plasma doping for ultra-shallow junctions
|
Chan, Chung
|
|
1998
|
100-101 |
9 |
p. 1485-1488
4 p.
|
artikel
|
| 240 |
Polymer thick film technology in telecommunication applications
|
|
|
1992
|
100-101 |
9 |
p. 1345-
1 p.
|
artikel
|
| 241 |
Power MOS devices: Structure evolutions and modelling approaches
|
Rossel, P.
|
|
1997
|
100-101 |
9 |
p. 1375-1388
14 p.
|
artikel
|
| 242 |
Prediction of electromigration failure in W/Al-Cu multilayered metallizations by 1/f noise measurements
|
|
|
1993
|
100-101 |
9 |
p. 1421-
1 p.
|
artikel
|
| 243 |
Pre-tinning and flux considerations on the reliability of solder surfaces
|
|
|
1993
|
100-101 |
9 |
p. 1430-
1 p.
|
artikel
|
| 244 |
Preventive replacement in systems with dependent components
|
|
|
1993
|
100-101 |
9 |
p. 1421-
1 p.
|
artikel
|
| 245 |
Principle of operation of IC-prescalers and their application in microwave frequency counters
|
|
|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
|
| 246 |
Probabilistic approach to some problems of system safety
|
Finkelstein, M.S.
|
|
1994
|
100-101 |
9 |
p. 1441-1457
17 p.
|
artikel
|
| 247 |
Procedure of creating a reliability-functional model for a chosen computer system
|
Jóźwiak, I.J.
|
|
1996
|
100-101 |
9 |
p. 1213-1217
5 p.
|
artikel
|
| 248 |
Process-based cost modelling
|
|
|
1993
|
100-101 |
9 |
p. 1428-
1 p.
|
artikel
|
| 249 |
Production and inspection—flexible and integrated
|
|
|
1993
|
100-101 |
9 |
p. 1429-
1 p.
|
artikel
|
| 250 |
Production scheduling algorithms for a semiconductor test facility
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
|
artikel
|
| 251 |
Product, technology trends spur interest in IC memory cards
|
|
|
1992
|
100-101 |
9 |
p. 1337-
1 p.
|
artikel
|
| 252 |
Programs/projects management and integrated product/process development in high technology electronic products industries
|
|
|
1992
|
100-101 |
9 |
p. 1337-
1 p.
|
artikel
|
| 253 |
Progress in high-speed and high-resolution CMOS data converters
|
Liberali, Valentino
|
|
1997
|
100-101 |
9 |
p. 1411-1420
10 p.
|
artikel
|
| 254 |
Promising alternative approach for high-power GaAs/Si MESFETs fabrication
|
|
|
1993
|
100-101 |
9 |
p. 1432-
1 p.
|
artikel
|
| 255 |
Properties of a consistent estimation procedure in ultrastructural model when reliability ratio is known
|
Srivastava, Anil K.
|
|
1996
|
100-101 |
9 |
p. 1249-1252
4 p.
|
artikel
|
| 256 |
Pulsed particle beam treatment of implanted silicon
|
|
|
1993
|
100-101 |
9 |
p. 1438-
1 p.
|
artikel
|
| 257 |
Quality certification in the single European market
|
|
|
1993
|
100-101 |
9 |
p. 1427-1428
2 p.
|
artikel
|
| 258 |
Quality increases competitiveness
|
|
|
1993
|
100-101 |
9 |
p. 1428-
1 p.
|
artikel
|
| 259 |
Quality of hybrid circuits after soldering with “no residue” flux
|
|
|
1993
|
100-101 |
9 |
p. 1435-
1 p.
|
artikel
|
| 260 |
Quality of service and supervision in the French network
|
|
|
1993
|
100-101 |
9 |
p. 1419-
1 p.
|
artikel
|
| 261 |
Quantum-size p - n junctions in silicon
|
|
|
1992
|
100-101 |
9 |
p. 1343-1344
2 p.
|
artikel
|
| 262 |
Rapid thermal processing uniformity using multivariable control of a circularly symmetric three zone lamp
|
|
|
1993
|
100-101 |
9 |
p. 1429-1430
2 p.
|
artikel
|
| 263 |
Reactive ion etching technology in thin-film-transistor processing
|
|
|
1993
|
100-101 |
9 |
p. 1436-
1 p.
|
artikel
|
| 264 |
Recent advances and trends in numerical techniques for process simulation
|
Joppich, W.
|
|
1997
|
100-101 |
9 |
p. 1329-1339
11 p.
|
artikel
|
| 265 |
Reconfigurable fault tolerant networks for fast packet switching
|
|
|
1992
|
100-101 |
9 |
p. 1336-
1 p.
|
artikel
|
| 266 |
Relative mean residual life: Theory and related topics
|
Wei, Xianhua
|
|
1992
|
100-101 |
9 |
p. 1319-1326
8 p.
|
artikel
|
| 267 |
Reliability analyses for a tree-structured hierarchic control system
|
|
|
1993
|
100-101 |
9 |
p. 1424-
1 p.
|
artikel
|
| 268 |
Reliability analysis and optimization applications of a two-unit standby redundant system with spare units
|
Agrafiotis, G.K.
|
|
1994
|
100-101 |
9 |
p. 1469-1475
7 p.
|
artikel
|
| 269 |
Reliability analysis and redundancy optimisation of a multimodular fault tolerant system
|
Goel, L.R.
|
|
1992
|
100-101 |
9 |
p. 1243-1250
8 p.
|
artikel
|
| 270 |
Reliability analysis of a complex system with a deteriorating standby unit under common-cause failure and critical human error
|
Narmada, S.
|
|
1996
|
100-101 |
9 |
p. 1287-1290
4 p.
|
artikel
|
| 271 |
Reliability analysis of a multicomponent system in a multistate Markovian environment
|
Deng, Yonglu
|
|
1993
|
100-101 |
9 |
p. 1237-1239
3 p.
|
artikel
|
| 272 |
Reliability analysis of a two-unit redundant system with a replaceable repair facility
|
Guo, Tongde
|
|
1992
|
100-101 |
9 |
p. 1237-1240
4 p.
|
artikel
|
| 273 |
Reliability and availability analysis of a system with warm standby and common cause failures
|
Dhillon, B.S.
|
|
1993
|
100-101 |
9 |
p. 1343-1349
7 p.
|
artikel
|
| 274 |
Reliability comparison of token-ring network schemes
|
|
|
1993
|
100-101 |
9 |
p. 1425-
1 p.
|
artikel
|
| 275 |
Reliability enhancement by time and space redundancy in multistage interconnection networks
|
|
|
1992
|
100-101 |
9 |
p. 1336-
1 p.
|
artikel
|
| 276 |
Reliability growth in the probability and possibility contexts
|
Utkin, L.V.
|
|
1996
|
100-101 |
9 |
p. 1155-1166
12 p.
|
artikel
|
| 277 |
Reliability of commercial relays during life tests at low electrical contact load
|
|
|
1993
|
100-101 |
9 |
p. 1420-
1 p.
|
artikel
|
| 278 |
Reliability of fully and partially replicated systems
|
|
|
1993
|
100-101 |
9 |
p. 1422-1423
2 p.
|
artikel
|
| 279 |
Reliability optimization of communication networks using simulated annealing
|
Atiqullah, Mir M.
|
|
1993
|
100-101 |
9 |
p. 1303-1319
17 p.
|
artikel
|
| 280 |
Reliable laminated ceramic capacitor carries innovative external electrodes
|
|
|
1992
|
100-101 |
9 |
p. 1333-
1 p.
|
artikel
|
| 281 |
Remarks on maximum likelihood estimation for the Burr XII distribution
|
Watkins, A.J.
|
|
1996
|
100-101 |
9 |
p. 1313-1314
2 p.
|
artikel
|
| 282 |
Repair of circuits by laser seeding and constriction induced plating
|
|
|
1993
|
100-101 |
9 |
p. 1436-
1 p.
|
artikel
|
| 283 |
Representing monitored systems: A critical process in data collection
|
Xu, Myron
|
|
1994
|
100-101 |
9 |
p. 1477-1484
8 p.
|
artikel
|
| 284 |
Robust character of exponential SPRT
|
Sharma, K.K.
|
|
1993
|
100-101 |
9 |
p. 1223-1225
3 p.
|
artikel
|
| 285 |
Safety-related systems. Competence, liability and practice
|
|
|
1993
|
100-101 |
9 |
p. 1420-
1 p.
|
artikel
|
| 286 |
Semi-insulating polysilicon heterojunctions on silicon
|
|
|
1992
|
100-101 |
9 |
p. 1344-
1 p.
|
artikel
|
| 287 |
Sensor microsystems
|
Popovic, R.S.
|
|
1997
|
100-101 |
9 |
p. 1401-1409
9 p.
|
artikel
|
| 288 |
Sequential imperfect preventive maintenance policies: A case study
|
Jayabalan, V.
|
|
1992
|
100-101 |
9 |
p. 1223-1229
7 p.
|
artikel
|
| 289 |
Short and long loop manufacturing feedback using a multisensor assembly test chip
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
|
artikel
|
| 290 |
Silicon wafer cleaning with CF4/H2 plasma and its effect on the properties of dry thermally grown oxide
|
|
|
1993
|
100-101 |
9 |
p. 1432-
1 p.
|
artikel
|
| 291 |
Simulation of electronic structure of Si–Si bond traps in oxide/nitride/oxide structure
|
Gritsenko, V.A.
|
|
1998
|
100-101 |
9 |
p. 1457-1464
8 p.
|
artikel
|
| 292 |
Simulation of multiple etch fronts
|
|
|
1992
|
100-101 |
9 |
p. 1340-
1 p.
|
artikel
|
| 293 |
Single chip bumping and reliability for flip chip processes
|
Klein, M.
|
|
1999
|
100-101 |
9 |
p. 1389-1397
9 p.
|
artikel
|
| 294 |
Smart power ICs technologies and applications
|
G.W.A.D.,
|
|
1996
|
100-101 |
9 |
p. 1315-1316
2 p.
|
artikel
|
| 295 |
Soldering equipment works in freon-free environment
|
|
|
1993
|
100-101 |
9 |
p. 1431-
1 p.
|
artikel
|
| 296 |
Some reliability measures of a system of components sharing a common environment
|
Sharma, G.C.
|
|
1996
|
100-101 |
9 |
p. 1297-1301
5 p.
|
artikel
|
| 297 |
SPC and setup analysis for screen printed thick films
|
|
|
1992
|
100-101 |
9 |
p. 1346-
1 p.
|
artikel
|
| 298 |
Special mechanisms in thin-film SOI MOSFETs
|
Balestra, F.
|
|
1997
|
100-101 |
9 |
p. 1341-1351
11 p.
|
artikel
|
| 299 |
SPRAM technology cultivates characteristics useful in many fields
|
|
|
1993
|
100-101 |
9 |
p. 1432-
1 p.
|
artikel
|
| 300 |
Stability of NiSi in boron-doped polysilicon lines
|
Poon, M.C
|
|
1998
|
100-101 |
9 |
p. 1499-1502
4 p.
|
artikel
|
| 301 |
Statistical control of VLSI fabrication processes
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
|
artikel
|
| 302 |
Statistical design techniques for high-speed circuit boards with correlated structure distributions
|
|
|
1992
|
100-101 |
9 |
p. 1340-
1 p.
|
artikel
|
| 303 |
Statistical simulation of IC technology: A bipolar process example
|
Sanders, T.J.
|
|
1996
|
100-101 |
9 |
p. 1191-1205
15 p.
|
artikel
|
| 304 |
Stencil printing of solder paste for fine-pitch surface mount assembly
|
|
|
1992
|
100-101 |
9 |
p. 1341-
1 p.
|
artikel
|
| 305 |
Stochastic analysis of an Erlangian arrival with linear cost structure
|
Arora, R.T.
|
|
1992
|
100-101 |
9 |
p. 1205-1213
9 p.
|
artikel
|
| 306 |
Stochastic analysis of a system operating in a multiple environment
|
Agnihotri, R.K.
|
|
1993
|
100-101 |
9 |
p. 1219-1222
4 p.
|
artikel
|
| 307 |
Stochastic behaviour of various specific computer reliability models
|
Singh Rana, Virendra
|
|
1994
|
100-101 |
9 |
p. 1541-1548
8 p.
|
artikel
|
| 308 |
Study of MOS gate dielectric breakdown due to drain avalanche breakdown
|
Wong, H.
|
|
1998
|
100-101 |
9 |
p. 1433-1438
6 p.
|
artikel
|
| 309 |
Study of plasma CVD silicon-germanium films using electron beam techniques
|
|
|
1992
|
100-101 |
9 |
p. 1347-
1 p.
|
artikel
|
| 310 |
Sub-micron self-aligned-gate HEMT for microwave applications
|
|
|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
|
| 311 |
Sub-quarter micron silicon integrated circuits and single wafer processing
|
Singh, R
|
|
1998
|
100-101 |
9 |
p. 1471-1483
13 p.
|
artikel
|
| 312 |
Suppression of hot-electron-induced interface degradation in metal-oxide-semiconductor devices by backsurface argon bombardment
|
Huang, M.Q
|
|
1998
|
100-101 |
9 |
p. 1407-1411
5 p.
|
artikel
|
| 313 |
Surge test characteristics of high K multilayer ceramic capacitors
|
|
|
1992
|
100-101 |
9 |
p. 1331-1332
2 p.
|
artikel
|
| 314 |
Synthesis of VLSI circuits from behavioral descriptions
|
|
|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
|
| 315 |
System reliability estimation using simulation combined with network reductions
|
Suh, Jae-Joon
|
|
1996
|
100-101 |
9 |
p. 1263-1267
5 p.
|
artikel
|
| 316 |
Systolic VLSI arrays for the metric approach to pattern recognition
|
|
|
1993
|
100-101 |
9 |
p. 1432-
1 p.
|
artikel
|
| 317 |
TAB as a high leadcount PGA replacement
|
|
|
1992
|
100-101 |
9 |
p. 1339-
1 p.
|
artikel
|
| 318 |
Technology Development: focus on manufacturability
|
|
|
1992
|
100-101 |
9 |
p. 1337-
1 p.
|
artikel
|
| 319 |
Temperature dependence of reactive ion beam etching of GaAs with CH4/H2
|
|
|
1993
|
100-101 |
9 |
p. 1437-
1 p.
|
artikel
|
| 320 |
Testers for printed circuit boards adopt latest system concept
|
|
|
1992
|
100-101 |
9 |
p. 1333-
1 p.
|
artikel
|
| 321 |
Test sequencing and diagnosis in electronic system with decision table
|
Zhou, Huiyang
|
|
1996
|
100-101 |
9 |
p. 1167-1175
9 p.
|
artikel
|
| 322 |
The changing face of surface mount technology
|
|
|
1993
|
100-101 |
9 |
p. 1427-
1 p.
|
artikel
|
| 323 |
The effect of applied frequencies and multiple firing on the resistance of thick film resistors
|
|
|
1993
|
100-101 |
9 |
p. 1435-
1 p.
|
artikel
|
| 324 |
The effect of the number of defect mechanisms on fault clustering and its detection using yield model parameters
|
|
|
1993
|
100-101 |
9 |
p. 1427-
1 p.
|
artikel
|
| 325 |
The effects of implantation dose and anneal temperature on the layered structure and electrical properties of oxygen-ion-implanted silicon-on-insulator
|
|
|
1992
|
100-101 |
9 |
p. 1347-
1 p.
|
artikel
|
| 326 |
The European quality award
|
|
|
1993
|
100-101 |
9 |
p. 1428-
1 p.
|
artikel
|
| 327 |
The median for a trapezoidal fuzzy number
|
Yamashiro, Mitsuo
|
|
1994
|
100-101 |
9 |
p. 1509-1511
3 p.
|
artikel
|
| 328 |
The per-unit-length capacitance matrix of flaring VLSI packaging interconnections
|
|
|
1992
|
100-101 |
9 |
p. 1339-
1 p.
|
artikel
|
| 329 |
The power function distribution: A useful and simple distribution to assess electrical component reliability
|
Meniconi, M.
|
|
1996
|
100-101 |
9 |
p. 1207-1212
6 p.
|
artikel
|
| 330 |
The principles of a new method of determining ion beam profile density distribution
|
|
|
1992
|
100-101 |
9 |
p. 1347-
1 p.
|
artikel
|
| 331 |
The reliability modelling of RAM/ROM fault tolerant memories
|
Kontoleon, J.M.
|
|
1992
|
100-101 |
9 |
p. 1231-1236
6 p.
|
artikel
|
| 332 |
The reliability model on a two stage CIMS production line
|
Min, Tan
|
|
1993
|
100-101 |
9 |
p. 1275-1280
6 p.
|
artikel
|
| 333 |
Thermally stimulated current in SiO2
|
Fleetwood, D.M
|
|
1999
|
100-101 |
9 |
p. 1323-1336
14 p.
|
artikel
|
| 334 |
Thermal management of power electronics modules packaged by a stacked-plate technique
|
Haque, Shatil
|
|
1999
|
100-101 |
9 |
p. 1343-1349
7 p.
|
artikel
|
| 335 |
Thermal stability of cobalt and nickel silicides
|
Poon, M.C
|
|
1998
|
100-101 |
9 |
p. 1495-1498
4 p.
|
artikel
|
| 336 |
Thermal stability of polysilicon resistors
|
|
|
1993
|
100-101 |
9 |
p. 1435-1436
2 p.
|
artikel
|
| 337 |
The role of plastic package adhesion in performance
|
|
|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
|
| 338 |
The study of a maintenance float model with Burr failure distribution
|
Shankar, Gauri
|
|
1994
|
100-101 |
9 |
p. 1513-1517
5 p.
|
artikel
|
| 339 |
The SURE approach to reliability analysis
|
|
|
1993
|
100-101 |
9 |
p. 1426-
1 p.
|
artikel
|
| 340 |
Thick film resistor fabricated with YBa2Cu3O7−x superconducting powder
|
|
|
1992
|
100-101 |
9 |
p. 1345-
1 p.
|
artikel
|
| 341 |
Thin-film transistor/liquid crystal display technology—an introduction
|
|
|
1993
|
100-101 |
9 |
p. 1436-
1 p.
|
artikel
|
| 342 |
Throughput availability in Markov systems
|
|
|
1993
|
100-101 |
9 |
p. 1424-
1 p.
|
artikel
|
| 343 |
Time-series models for reliability evaluation of power systems including wind energy
|
Billinton, R.
|
|
1996
|
100-101 |
9 |
p. 1253-1261
9 p.
|
artikel
|
| 344 |
Transition of MCM-C applications to MCM-L using rigid flex substrates
|
Keating, James
|
|
1999
|
100-101 |
9 |
p. 1399-1406
8 p.
|
artikel
|
| 345 |
Two approaches to array fault tolerance in the IBM enterprise system/9000™ type 9121 processor
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
|
artikel
|
| 346 |
Uncertainty importance of system components by fuzzy and interval probability
|
Utkin, Lev V.
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1993
|
100-101 |
9 |
p. 1357-1364
8 p.
|
artikel
|
| 347 |
Usefulness of MTTF of s-independent case in other cases
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1993
|
100-101 |
9 |
p. 1425-
1 p.
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artikel
|
| 348 |
Use of screening and response surface experimental designs for development of a 0.5 μm CMOS self-aligned titanium silicide process
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|
1992
|
100-101 |
9 |
p. 1342-
1 p.
|
artikel
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| 349 |
Using a software reliability model to design a telecommunications software architecture
|
|
|
1992
|
100-101 |
9 |
p. 1335-
1 p.
|
artikel
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| 350 |
Using distributed topology update and preplanned configurations to achieve trunk network survivability
|
|
|
1992
|
100-101 |
9 |
p. 1334-
1 p.
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artikel
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| 351 |
Using reliability analysis software
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1993
|
100-101 |
9 |
p. 1425-
1 p.
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artikel
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| 352 |
Versatile COF, COB HIC technology attracts industry attention
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|
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1993
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100-101 |
9 |
p. 1420-
1 p.
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artikel
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| 353 |
VLSI chip design with the hardware description language verilog An introduction based on a large RISC processor design
|
G.W.A.D.,
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|
1996
|
100-101 |
9 |
p. 1316-1317
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| 354 |
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1993
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100-101 |
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p. 1421-
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artikel
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| 355 |
World semiconductor market recovers gradually
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1993
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100-101 |
9 |
p. 1428-
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