Digitale Bibliotheek
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                             355 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayesian estimation of reliability model using the linex loss function Pandey, M.
1994
100-101 9 p. 1519-1523
5 p.
artikel
2 A comparison between microwave reflectance, thermal wave modulated reflectance and defect etching for detecting transition metals in silicon 1993
100-101 9 p. 1434-
1 p.
artikel
3 A comparison of radiation and hot-electron-induced damages in MOS capacitors with rapid thermally nitrided thin-gate oxides 1992
100-101 9 p. 1343-
1 p.
artikel
4 A comprehensive approach for the analysis of package induced stress in ICs using analytical and empirical methods 1992
100-101 9 p. 1333-
1 p.
artikel
5 A computer approach for reliability evaluation of telecommunication networks with heterogeneous link-capacities 1992
100-101 9 p. 1335-
1 p.
artikel
6 A computer program for component life estimation using multiply censored system life data 1992
100-101 9 p. 1332-
1 p.
artikel
7 A configurable integrated test methodology for monolithic microwave integrated circuit production 1993
100-101 9 p. 1431-
1 p.
artikel
8 A decomposition method for optimization of large-system reliability 1993
100-101 9 p. 1423-
1 p.
artikel
9 A directed-graph classifier of semiconductor wafer-test patterns 1993
100-101 9 p. 1420-
1 p.
artikel
10 Advanced ceramic substrates for multichip modules with multilevel thin film interconnects 1992
100-101 9 p. 1346-
1 p.
artikel
11 A generic computer simulation model to characterize photolithography manufacturing area in an IC FAB facility 1992
100-101 9 p. 1339-
1 p.
artikel
12 A method for ion etching depth control 1993
100-101 9 p. 1438-
1 p.
artikel
13 A Monte Carlo simulation algorithm for finding MTBF 1993
100-101 9 p. 1423-
1 p.
artikel
14 A multi-period design model for survivable network architecture selection for SONET interoffice networks 1992
100-101 9 p. 1336-
1 p.
artikel
15 An additional temperature increase within GaAs/(AlGa)As diode lasers caused by the deterioration of an indium solder 1992
100-101 9 p. 1347-
1 p.
artikel
16 An age replacement policy with minimal repair and general random repair cost Sheu, Shey-Huei
1992
100-101 9 p. 1283-1289
7 p.
artikel
17 An algorithm for designing rings for survivable fiber networks 1992
100-101 9 p. 1332-
1 p.
artikel
18 Analysis of a fault-tolerance scheme for processor ensembles 1993
100-101 9 p. 1425-1426
2 p.
artikel
19 Analysis of alternative rework strategies for printed wiring assembly manufacturing systems 1992
100-101 9 p. 1337-
1 p.
artikel
20 Analyzing quality for better testing 1992
100-101 9 p. 1334-
1 p.
artikel
21 An approximate method for computing performance-related reliability of gracefully degrading systems Tian, Zhiyu
1994
100-101 9 p. 1529-1536
8 p.
artikel
22 An approximation optimal inspection policy Chung, Kun-Jen
1994
100-101 9 p. 1485-1488
4 p.
artikel
23 An automated electrical defect identification and location method for CMOS processes using a specially designed test chip 1993
100-101 9 p. 1421-1422
2 p.
artikel
24 An automated oracle for software testing 1993
100-101 9 p. 1425-
1 p.
artikel
25 An efficient approach for channel routing in VLSI 1992
100-101 9 p. 1343-
1 p.
artikel
26 An empirical study on complexity metrics of Petri nets Lee, Gang Soo
1992
100-101 9 p. 1215-1221
7 p.
artikel
27 An evaluation of CAD-aided programming systems for coordinate measuring machines 1993
100-101 9 p. 1428-
1 p.
artikel
28 A new algorithm for reliability evaluation of three-state device complex networks: Minimal cut-minimal path method Dong-Kui, Li
1994
100-101 9 p. 1537-1540
4 p.
artikel
29 A new technique in a cutset evaluation Elias, S.S.
1993
100-101 9 p. 1351-1355
5 p.
artikel
30 A new threshold voltage model for deep-submicron MOSFETs with nonuniform substrate dopings Zhang, Wen-liang
1998
100-101 9 p. 1465-1469
5 p.
artikel
31 An expert aid to fault diagnosis and trouble-shooting in satellite communications 1992
100-101 9 p. 1336-
1 p.
artikel
32 An expert system framework for machine fault diagnosis 1992
100-101 9 p. 1334-
1 p.
artikel
33 An exponential SRGM with a bound on the number of failures Kapur, P.K.
1993
100-101 9 p. 1245-1249
5 p.
artikel
34 An information model for a CAM data base to support flexible manufacture of printed circuit boards 1993
100-101 9 p. 1421-
1 p.
artikel
35 An innovative bonding technique for optical chips using solder bumps that eliminate chip positioning adjustments 1993
100-101 9 p. 1430-
1 p.
artikel
36 An interarrival hyperexponential machine interference with balking and reneging Abou El-Ata, M.O.
1992
100-101 9 p. 1251-1256
6 p.
artikel
37 Announcement Call for papers 1996
100-101 9 p. 1319-1321
3 p.
artikel
38 An O(kn) algorithm for a circular consecutive-k-out-of-n:F system 1993
100-101 9 p. 1426-
1 p.
artikel
39 A note on reliability allocation under a preventive maintenance schedule Wong, Jsun Y.
1993
100-101 9 p. 1411-1414
4 p.
artikel
40 A novel technique for in-line monitoring of micro-contamination and process induced damage 1993
100-101 9 p. 1429-
1 p.
artikel
41 A novel technique for the simultaneous measurement of ambipolar carrier lifetime and diffusion coefficient in silicon 1993
100-101 9 p. 1433-
1 p.
artikel
42 An overview of X-ray lithography for use in semiconductor device preparation 1992
100-101 9 p. 1344-
1 p.
artikel
43 A phenomenon of charge trapping saturation induced by rapid thermal annealing Wong, Shyh-Chyi
1998
100-101 9 p. 1391-1399
9 p.
artikel
44 Application of direct-tunneling gate oxides to high-performance CMOS Momose, Hisayo Sasaki
1998
100-101 9 p. 1413-1423
11 p.
artikel
45 A precision vertical interconnect technology 1992
100-101 9 p. 1337-
1 p.
artikel
46 A process control methodology applied to manufacturing GaAs MMICs 1992
100-101 9 p. 1342-
1 p.
artikel
47 A proposed approach to computer-supported TQM in maintenance work induction and accomplishment 1992
100-101 9 p. 1335-
1 p.
artikel
48 A queueing system with stepwise randomly available additional space Garg, R.L.
1994
100-101 9 p. 1549-1555
7 p.
artikel
49 A reliability analysis technique for object-oriented model using a reliability petri net Kim, Kapsu
1996
100-101 9 p. 1237-1247
11 p.
artikel
50 A simple method for generating K-trees of a network Rath, Debaraj
1993
100-101 9 p. 1241-1244
4 p.
artikel
51 A stochastic algorithm for high speed capacitance extraction in integrated circuits 1993
100-101 9 p. 1420-1421
2 p.
artikel
52 A study of tilt angle effect on Halo PMOS performance Su, Jiong-Guang
1998
100-101 9 p. 1503-1512
10 p.
artikel
53 A transistor fault model for nMOS combinational circuits 1992
100-101 9 p. 1335-
1 p.
artikel
54 A two-layer high density printed circuit board and its reliability Zhang, S.
1999
100-101 9 p. 1337-1341
5 p.
artikel
55 A two-unit cold standby system with major and minor failures and preparation time in the case of major failure Rander, M.C.
1992
100-101 9 p. 1199-1204
6 p.
artikel
56 A unified mobility model for device simulation—II. Temperature dependence of carrier mobility and life-time 1993
100-101 9 p. 1424-
1 p.
artikel
57 Automatic resistor-generation and thick film circuit layout using the Magic layout editor 1992
100-101 9 p. 1345-
1 p.
artikel
58 Availability for 2/n: F and secondary subsystems with general repair-time distributions and shut-off rules Chen, Yow-Mow
1992
100-101 9 p. 1257-1270
14 p.
artikel
59 Back-surface washing system enhances circuit board reliability 1993
100-101 9 p. 1431-
1 p.
artikel
60 BaPbO3-based thick film resistor 1993
100-101 9 p. 1435-
1 p.
artikel
61 Basics and applications of charge pumping in submicron MOSFETs© 1997 IEEE. Reprinted, with permission, from Proc. 1997 21st International Conference on Microelectronics, Nis, Yugoslavia, 14–17 September 1997, Vol. 2, pp. 581–589. Groeseneken, Guido
1998
100-101 9 p. 1379-1389
11 p.
artikel
62 Bayes attribute acceptance-sampling plan 1993
100-101 9 p. 1424-
1 p.
artikel
63 Bayes binomial sampling by attributes with a general-beta prior distribution 1993
100-101 9 p. 1426-
1 p.
artikel
64 Bayesian estimation under Poisson testing using the LINEX loss function Jaisingh, Lloyd R.
1993
100-101 9 p. 1259-1265
7 p.
artikel
65 Board level reliability assessment of chip scale packages Wang, Z.P
1999
100-101 9 p. 1351-1356
6 p.
artikel
66 Bonding state in GaAs/Si interface 1993
100-101 9 p. 1435-
1 p.
artikel
67 Breakdown voltage of diffused epitaxial junctions 1992
100-101 9 p. 1344-
1 p.
artikel
68 CAFE—the MIT computer-aided fabrication environment 1993
100-101 9 p. 1429-
1 p.
artikel
69 Calendar of international conferences, symposia, lectures and meetings of interest 1992
100-101 9 p. 1327-1329
3 p.
artikel
70 Catastrophic damage in diode lasers caused by an increase in their facet reflectivity 1992
100-101 9 p. 1331-
1 p.
artikel
71 Causes of cracks in SMD and type specific remedies 1992
100-101 9 p. 1338-
1 p.
artikel
72 CEPT—a computer-aided manufacturing application for managing equipment reliability and availability in the semiconductor industry 1992
100-101 9 p. 1331-
1 p.
artikel
73 Characteristics of the resist development process in electron beam lithography 1993
100-101 9 p. 1437-
1 p.
artikel
74 Characterization of a JFET operational amplifier by planned experimentation and its impact on IC manufacturing 1992
100-101 9 p. 1342-
1 p.
artikel
75 Characterization of chip scale packaging materials Amagai, Masazumi
1999
100-101 9 p. 1365-1377
13 p.
artikel
76 Choosing from redundant designs of power systems using system outage rate and cost Vallarino, C.R.
1996
100-101 9 p. 1269-1274
6 p.
artikel
77 Closed-form analytical solutions for avalanche breakdown quantities in high-voltage diffused junctions 1992
100-101 9 p. 1344-
1 p.
artikel
78 Combination of numerical and experimental methods for stress analysis of small electronic components 1992
100-101 9 p. 1333-
1 p.
artikel
79 Common-cause failure analysis of a parallel system with warm standby Dhillon, B.S.
1993
100-101 9 p. 1321-1342
22 p.
artikel
80 Comparison of bipolar NPN polysilicon emitter interface formation at three different manufacturing sites 1993
100-101 9 p. 1434-
1 p.
artikel
81 Comparison of latchup immunity for silicided source/drain at different n+ implant energy Leong, Kam-Chew
1998
100-101 9 p. 1401-1405
5 p.
artikel
82 Composite solders 1992
100-101 9 p. 1342-
1 p.
artikel
83 Computer integrated manufacturing and networking in advanced IC manufacturing 1992
100-101 9 p. 1337-
1 p.
artikel
84 Computerization of the R-ABC algorithm Shen, Yuanlong
1996
100-101 9 p. 1219-1221
3 p.
artikel
85 Computerized tolerance techniques 1992
100-101 9 p. 1334-1335
2 p.
artikel
86 Computer vision for quality control in automated manufacturing systems 1992
100-101 9 p. 1338-
1 p.
artikel
87 Concurrent engineering for consumer, industrial products, and Government systems 1993
100-101 9 p. 1419-
1 p.
artikel
88 Confidence limits for steady-state availability of systems with a mixture of exponential and gamma operating time and lognormal repair time Chandrasekhar, P.
1996
100-101 9 p. 1303-1304
2 p.
artikel
89 Constructing lifetime distributions with bathtub shaped failure rate from DFR distributions SchÄbe, Hendrik
1994
100-101 9 p. 1501-1508
8 p.
artikel
90 Contact resistivity of shallow junctions formed by implantation through Pt or PtSi 1993
100-101 9 p. 1437-
1 p.
artikel
91 Continual progress marks electronic componentinstallation techniques 1993
100-101 9 p. 1422-
1 p.
artikel
92 Cost analysis of a man-machine system operating under changing operator conditions Singh, S.K.
1993
100-101 9 p. 1267-1274
8 p.
artikel
93 Cost analysis of the M/M/R machine-repair problem with mixed standby spares Wang, Kuo-Hsiung
1993
100-101 9 p. 1293-1301
9 p.
artikel
94 Cost saving opportunities with multichip modules 1993
100-101 9 p. 1427-
1 p.
artikel
95 CSCC for mean of an inverse Gaussian distribution under type I censoring Shankar, Gauri
1996
100-101 9 p. 1309-1311
3 p.
artikel
96 Current status of failure analysis for ULSIs© 1997 IEEE. Reprinted with permission, from Proc. 1997 21st International Conference on Microelectronics, Nis, Yugoslavia, 14–17 September 1997, Vol. 2, pp. 591–598. Nakajima, S
1998
100-101 9 p. 1369-1377
9 p.
artikel
97 Data flow model of a total service quality management system 1992
100-101 9 p. 1335-1336
2 p.
artikel
98 Defect clustering viewed through generalized Poisson distribution 1993
100-101 9 p. 1426-
1 p.
artikel
99 Defect localization induced by hot carrier injection in short-channel MOSFETs: Concept, modeling and characterization Cristoloveanu, Sorin
1993
100-101 9 p. 1365-1385
21 p.
artikel
100 Defect size distribution in VLSI chips 1992
100-101 9 p. 1332-
1 p.
artikel
101 3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules 1992
100-101 9 p. 1341-
1 p.
artikel
102 Design of a VLSI digit slicing fast Fourier transform processor 1992
100-101 9 p. 1343-
1 p.
artikel
103 Design of metallizations and components for aluminum nitride packages for VLSIC 1992
100-101 9 p. 1340-
1 p.
artikel
104 Design of survivable communications networks under performance constraints 1992
100-101 9 p. 1343-
1 p.
artikel
105 Determination of the trapped charge distribution in scaled silicon nitride MONOS nonvolatile memory devices by tunneling spectroscopy 1992
100-101 9 p. 1343-
1 p.
artikel
106 Development of temperature-stable thick-film dielectrics: III. Role of glass on the microstructure evolution of a thick-film dielectric 1992
100-101 9 p. 1345-
1 p.
artikel
107 Diffusion equation for GIx/G/r machine interference problem with spare machines Jain, M.
1993
100-101 9 p. 1415-1418
4 p.
artikel
108 Discrete random dopant distribution effects in nanometer-scale MOSFETs Philip Wong, Hon-Sum
1998
100-101 9 p. 1447-1456
10 p.
artikel
109 Downward laser trimming of thick film resistors 1992
100-101 9 p. 1346-
1 p.
artikel
110 Editorial 1998
100-101 9 p. 1367-1368
2 p.
artikel
111 Editorial Stojadinović, Ninoslav
1997
100-101 9 p. iii-
1 p.
artikel
112 Effective buffer insertion of clock tree for high-speed VLSI circuits 1993
100-101 9 p. 1431-1432
2 p.
artikel
113 Effect of component interactions on the removal of organic impurities in ultrapure water systems 1992
100-101 9 p. 1333-
1 p.
artikel
114 Effect of gold on the reliability of fine pitch surface mount solder joints 1993
100-101 9 p. 1422-
1 p.
artikel
115 Effects of backend processing on counter-doped N+ poly-Si resistance 1992
100-101 9 p. 1343-
1 p.
artikel
116 Efficient computation of the P.M.F. and the C.D.F. of the generalized binomial distribution Rushdi, Ali M.
1994
100-101 9 p. 1489-1499
11 p.
artikel
117 Electrical characterization of hole transport in heavily-doped shallow implanted emitters 1993
100-101 9 p. 1436-
1 p.
artikel
118 Electroplated solder joints for flip-chip applications 1992
100-101 9 p. 1338-
1 p.
artikel
119 Emerging trends in e-beam diagnostics 1993
100-101 9 p. 1427-
1 p.
artikel
120 Empirical formulas and global reliability evaluation of reliability graphs Aziz, M.A.
1993
100-101 9 p. 1233-1236
4 p.
artikel
121 Enhanced conductivity and breakdown of oxides grown on heavily implanted substrates 1992
100-101 9 p. 1347-
1 p.
artikel
122 Enhanced self-test techniques for VLSI systems applied to the IBM enterprise system/9000 type 9121 processor 1992
100-101 9 p. 1335-
1 p.
artikel
123 ESD degradation in GaAs MES structures 1992
100-101 9 p. 1344-
1 p.
artikel
124 ESD-degradation mechanisms of GaAs microwave devices and device protection Bock, K.
1993
100-101 9 p. 1397-1410
14 p.
artikel
125 Estimation of capability index based on bootstrap method Choi, Kuey Chung
1996
100-101 9 p. 1141-1153
13 p.
artikel
126 Evaluation of modelling refinements on work sampling statistics 1992
100-101 9 p. 1334-
1 p.
artikel
127 Evaluation of the dielectric breakdown of reoxidized nitrided oxide (ONO) in flash memory devices using constant current-stressing technique Cha, C.L.
1998
100-101 9 p. 1439-1446
8 p.
artikel
128 Exhaust gas detoxifying systems used in microelectronics 1992
100-101 9 p. 1338-
1 p.
artikel
129 Extended tables for the moments of gamma-distribution order statistics 1993
100-101 9 p. 1424-
1 p.
artikel
130 Extraordinary technologies enhance usefulness of standard cells, ASICs 1993
100-101 9 p. 1430-
1 p.
artikel
131 Fault tolerant packet-switched network design and its sensitivity 1992
100-101 9 p. 1333-
1 p.
artikel
132 Fine pitch wire bonding development using a new multipurpose, multipad pitch test die 1992
100-101 9 p. 1339-
1 p.
artikel
133 Fixed-time life tests based on fuzzy life characteristics 1993
100-101 9 p. 1425-
1 p.
artikel
134 Fixed-width confidence interval estimation of the inverse coefficient of variation in a normal population Chaturvedi, Ajit
1996
100-101 9 p. 1305-1308
4 p.
artikel
135 Flexible connectors adapt to SMT requirements 1992
100-101 9 p. 1343-
1 p.
artikel
136 Flow graph development method Qamber, Isa S.
1993
100-101 9 p. 1387-1395
9 p.
artikel
137 1/f noise due to temperature fluctuations in heat conduction in bipolar transistors Forbes, L
1999
100-101 9 p. 1357-1364
8 p.
artikel
138 Functional AlGaAs/GaAs heterostructure-emitter bipolar transistor with a pseudomorphic InGaAs/GaAs quantum-well base Tsai, Jung-Hui
1999
100-101 9 p. 1379-1387
9 p.
artikel
139 Fusion: a plan for developing a familiar user system interface for the IC fabrication industry 1992
100-101 9 p. 1339-1340
2 p.
artikel
140 Fuzzy reliability modelling — Linguistic approach Ramachandran, V.
1992
100-101 9 p. 1311-1318
8 p.
artikel
141 GaAs/AlGaAs (SQW GRIN-SCH) LEDs monolithically integrated with Si-MOS drivers 1993
100-101 9 p. 1431-
1 p.
artikel
142 GaAs-GaInP multilayers for high performance electronic devices 1992
100-101 9 p. 1340-
1 p.
artikel
143 Generation of vertex and edge cutsets Prasad, V.C.
1992
100-101 9 p. 1291-1310
20 p.
artikel
144 GERT analysis of a two-unit warm standby system with repair Shankar, Gauri
1996
100-101 9 p. 1275-1278
4 p.
artikel
145 Grain boundary sliding in surface mount solders during thermal cycling 1992
100-101 9 p. 1337-1338
2 p.
artikel
146 Graphical representation of two mixed-Weibull distributions 1993
100-101 9 p. 1422-
1 p.
artikel
147 Growth by molecular beam epitaxy (MBE) and structural characterization of GaAs and AlGaAs on silicon 1993
100-101 9 p. 1433-1434
2 p.
artikel
148 Growth of thin thermal silicon dioxide films with low defect density 1993
100-101 9 p. 1433-
1 p.
artikel
149 Hardware fault latency: Model validation Soh, B.C.
1996
100-101 9 p. 1231-1235
5 p.
artikel
150 Hardware fault latency: Problem formulation and solution Soh, B.C.
1996
100-101 9 p. 1223-1230
8 p.
artikel
151 Hermetic sealing process with atmospheric pressure vibration for LSI packages 1992
100-101 9 p. 1338-1339
2 p.
artikel
152 High density microelectronic packaging with thick film hermetic packages 1992
100-101 9 p. 1344-1345
2 p.
artikel
153 Highly flat GexSi1−x/Si heterointerfaces grown by molecular beam epitaxy in two-dimensional growth mode 1993
100-101 9 p. 1434-1435
2 p.
artikel
154 Highly reliable Au-Sn eutectic bonding with background GaAs LSI chips 1992
100-101 9 p. 1339-
1 p.
artikel
155 High mechanical reliability of back-ground GaAs LSI chips with low thermal resistance 1992
100-101 9 p. 1332-1333
2 p.
artikel
156 High temperature device simulation and thermal characteristics of GaAs MESFETs on CVD diamond substrates Shu, L.H.
1996
100-101 9 p. 1177-1189
13 p.
artikel
157 Hints and kinks 1993
100-101 9 p. 1419-1420
2 p.
artikel
158 Hybrid IC makers embrace “small is good” trends 1992
100-101 9 p. 1346-
1 p.
artikel
159 IC manufacturing diagnosis based on statistical analysis techniques 1993
100-101 9 p. 1428-1429
2 p.
artikel
160 Impact of low-temperature transient-enhanced diffusion of dopants in silicon 1993
100-101 9 p. 1434-
1 p.
artikel
161 Implementing total quality management at the U.S. Department of Defense 1992
100-101 9 p. 1337-
1 p.
artikel
162 Improved thermal conductivity in microelectronic encapsulants 1992
100-101 9 p. 1341-
1 p.
artikel
163 Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques 1992
100-101 9 p. 1340-1341
2 p.
artikel
164 Improving hot-electron hardness of narrow channel MOSFETs by fluorine implantation 1992
100-101 9 p. 1343-
1 p.
artikel
165 Improving manufacturing reliability in IC package assembly using the FMEA technique 1992
100-101 9 p. 1341-
1 p.
artikel
166 Incorporation of impurities in GaAs grown by MOCVD 1992
100-101 9 p. 1344-
1 p.
artikel
167 Influence of environment on the fatigue of Pb-Sn solder joints 1992
100-101 9 p. 1341-
1 p.
artikel
168 Integrating economics into quality control charts 1992
100-101 9 p. 1331-
1 p.
artikel
169 Intelligence implementation on silicon based on four-terminal device electronics Ohmi, T.
1997
100-101 9 p. 1315-1328
14 p.
artikel
170 Interconnection techniques for GaAs packaging 1992
100-101 9 p. 1338-
1 p.
artikel
171 Investigations of laser soldered TAB inner lead contacts 1992
100-101 9 p. 1346-1347
2 p.
artikel
172 Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable? Harsányi, Gábor
1999
100-101 9 p. 1407-1411
5 p.
artikel
173 Kinetics of triode mode reactive ion etching of Si(100) wafers by chlorine plasmas: temperature and d.c. self-bias effects 1992
100-101 9 p. 1347-
1 p.
artikel
174 Laser interconnection techniques for defect avoidance in large-area restructurable silicon systems 1993
100-101 9 p. 1437-
1 p.
artikel
175 Load balancing in heterogenous distributed systems Gopal, T.V.
1996
100-101 9 p. 1279-1286
8 p.
artikel
176 Long-channel silicon-on-insulator MOSFET theory 1993
100-101 9 p. 1432-
1 p.
artikel
177 Lower confidence bound on the percentage improvement in comparing two failure rates 1993
100-101 9 p. 1424-
1 p.
artikel
178 Low loss static induction devices (transistors and thyristors) Tadano, H.
1997
100-101 9 p. 1389-1396
8 p.
artikel
179 Low temperature characterization of silicon CMOS devices Ghibaudo, G.
1997
100-101 9 p. 1353-1366
14 p.
artikel
180 Low temperature CMOS—a brief review 1993
100-101 9 p. 1433-
1 p.
artikel
181 Low-temperature degradation studies of AlGaAs/GaAs modulation-doped field effect transistors 1992
100-101 9 p. 1332-
1 p.
artikel
182 Makers tackle challenge of improving automatic assembly technology 1993
100-101 9 p. 1430-
1 p.
artikel
183 Maximum likelihood estimates, from censored data, for mixed-Weibull distributions 1993
100-101 9 p. 1423-
1 p.
artikel
184 Maximum likelihood estimation of Burr XII distribution parameters under Type II censoring Wingo, Dallas R.
1993
100-101 9 p. 1251-1257
7 p.
artikel
185 Maximum likelihood predictive densities for the inverse Gaussian distribution with applications to reliability and lifetime predictions Yang, Zhenlin
1999
100-101 9 p. 1413-1421
9 p.
artikel
186 Measurements of interface state density in partially- and fully-depleted silicon-on-insulator MOSFETs by a high-low-frequency transconductance method 1993
100-101 9 p. 1435-
1 p.
artikel
187 Measuring software reliability 1993
100-101 9 p. 1427-
1 p.
artikel
188 Measuring the opaque substrate temperature by infrared laser beams 1993
100-101 9 p. 1437-
1 p.
artikel
189 Mechanical behaviour of ceramic capacitors 1992
100-101 9 p. 1332-
1 p.
artikel
190 Mechanism analysis of gate-induced drain leakage in off-state n-MOSFET Huang, L.
1998
100-101 9 p. 1425-1431
7 p.
artikel
191 Metallurgical changes in tin-lead platings due to heat ageing 1992
100-101 9 p. 1341-1342
2 p.
artikel
192 Method for controlling the manufacturing quality of diode lasers based on investigations of their transient thermal properties 1992
100-101 9 p. 1347-
1 p.
artikel
193 Method for semiconductor process optimization using functional representations of spatial variations and selectivity 1993
100-101 9 p. 1430-
1 p.
artikel
194 Microelectronics based on compound semiconductors Hartnagel, Hans L.
1997
100-101 9 p. 1397-1400
4 p.
artikel
195 Microelectronics technology takes on hybrid ICs 1992
100-101 9 p. 1346-
1 p.
artikel
196 Microstructural evolution in Sn/Pb solder and Pd/Ag thick film conductor metallization 1992
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197 Microwave IC control components for phased-array antennas 1993
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198 MIL reliability: a new approach 1993
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199 Minimizing damage and contamination in RIE processes by extracted-plasma-parameter analysis 1993
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200 Modelling of a high throughput hot-wall reactor for selective epitaxial growth of silicon 1993
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201 Modelling of deep silicon etching in multicomponent plasma 1993
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202 Modelling the sidewall masked oxidation process using the boundary element method 1992
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203 Molecular beam epitaxy—aspects and applications 1993
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204 MOS device structure development for ULSI: Low power/high speed operation Lee, Woo-Hyeong
1997
100-101 9 p. 1309-1314
6 p.
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205 MOSFET prediction in space environments Shvetzov-Shilovsky, I.N.
1997
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7 p.
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206 MOS technology: Trends and challenges in the ULSI era Shah, Ashwin
1997
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207 Multilayer ceramic chip capacitors gain acceptance 1992
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208 Multiple function trends sweep into hybrid IC field 1993
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209 Multi-ring structures for contact resistance measurements on metal-thin-layer semiconductors 1992
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210 New applications of low temperature PECVD silicon nitride films for microelectronics device fabrication 1992
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211 New physical model of multiplication-induced breakdown in MOSFETs 1992
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212 New trimming technology of a thick film resistor by the pulse voltage method 1992
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213 Non-destructive identification of defects in integrated circuit packages by scanning acoustic microscopy Yang, Jicheng
1996
100-101 9 p. 1291-1295
5 p.
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214 Note on MTBF versus mean-wear-life versus Mil-Hdbk-217 Badenius, Duncan
1992
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2 p.
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215 Novel effects of heating rate on the activation/recrystallization of boron-implanted Si substrates 1993
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216 Novel near-field probe for on-wafer integrated circuit measurements 1993
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217 n+/p ultra-shallow junction formation with plasma immersion ion implantation Yang, B.L
1998
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6 p.
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218 N2 reflow soldering assists environmental protection 1993
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219 Object oriented programming approach for quality improvement based on systematic diagram method 1992
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220 On a method for comparison of pseudo-random number generators Sezgin, Fatin
1994
100-101 9 p. 1557-1563
7 p.
artikel
221 Once more on measures of importance of system components Finkelstein, M.S.
1994
100-101 9 p. 1431-1439
9 p.
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222 On Murphy's yield integral 1992
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1 p.
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223 On Onaga's upper bound on the mean values of probabilistic maximum flows 1993
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224 On the development of chip-net 1992
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225 On the expected revenue of a production system subject to operator condition Singh, S.K.
1994
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4 p.
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226 On the time-dependent degradation of LDD n-MOSFETs under hot-carrier stress Ang, D.S
1999
100-101 9 p. 1311-1322
12 p.
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227 Optimal design of accelerated life tests for the Weibull distribution under periodic inspection and type I censoring Islam, A.
1994
100-101 9 p. 1459-1468
10 p.
artikel
228 Optimization models for selection of programmes, considering cost and reliability 1993
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1 p.
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229 Optimization of GaAs-on-silicon MESFET structures 1992
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1 p.
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230 Optimization of high performance BiCMOS buffer circuit for chip area, delay and power dissipation 1993
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231 Optimization of interconnect thickness for minimum propagation delays in VLSI 1992
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232 Optimization of restoration cost for complex technical systems at centralized structure of repair Martynenko, O.N.
1993
100-101 9 p. 1227-1232
6 p.
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233 Order statistics based modeling of gracefully degrading computing systems Chaganty, N.R.
1993
100-101 9 p. 1281-1291
11 p.
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234 Palladium as a lead finish for surface mount integrated circuit packages 1992
100-101 9 p. 1340-
1 p.
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235 Parallel algorithms for terminal-pair reliability 1993
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2 p.
artikel
236 Parametric empirical Bayes approach to reliability analysis for the geometric life model Tyagi, Ravindra K.
1992
100-101 9 p. 1271-1282
12 p.
artikel
237 PCB continuous line system proceeds from manufacture to inspection 1993
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1 p.
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238 Photoresist silylation and dry development for sub-micron photolithography 1992
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1 p.
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239 Plasma doping for ultra-shallow junctions Chan, Chung
1998
100-101 9 p. 1485-1488
4 p.
artikel
240 Polymer thick film technology in telecommunication applications 1992
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241 Power MOS devices: Structure evolutions and modelling approaches Rossel, P.
1997
100-101 9 p. 1375-1388
14 p.
artikel
242 Prediction of electromigration failure in W/Al-Cu multilayered metallizations by 1/f noise measurements 1993
100-101 9 p. 1421-
1 p.
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243 Pre-tinning and flux considerations on the reliability of solder surfaces 1993
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1 p.
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244 Preventive replacement in systems with dependent components 1993
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1 p.
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245 Principle of operation of IC-prescalers and their application in microwave frequency counters 1992
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1 p.
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246 Probabilistic approach to some problems of system safety Finkelstein, M.S.
1994
100-101 9 p. 1441-1457
17 p.
artikel
247 Procedure of creating a reliability-functional model for a chosen computer system Jóźwiak, I.J.
1996
100-101 9 p. 1213-1217
5 p.
artikel
248 Process-based cost modelling 1993
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249 Production and inspection—flexible and integrated 1993
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1 p.
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250 Production scheduling algorithms for a semiconductor test facility 1992
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1 p.
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251 Product, technology trends spur interest in IC memory cards 1992
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1 p.
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252 Programs/projects management and integrated product/process development in high technology electronic products industries 1992
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1 p.
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253 Progress in high-speed and high-resolution CMOS data converters Liberali, Valentino
1997
100-101 9 p. 1411-1420
10 p.
artikel
254 Promising alternative approach for high-power GaAs/Si MESFETs fabrication 1993
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255 Properties of a consistent estimation procedure in ultrastructural model when reliability ratio is known Srivastava, Anil K.
1996
100-101 9 p. 1249-1252
4 p.
artikel
256 Pulsed particle beam treatment of implanted silicon 1993
100-101 9 p. 1438-
1 p.
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257 Quality certification in the single European market 1993
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2 p.
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258 Quality increases competitiveness 1993
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1 p.
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259 Quality of hybrid circuits after soldering with “no residue” flux 1993
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260 Quality of service and supervision in the French network 1993
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1 p.
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261 Quantum-size p - n junctions in silicon 1992
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2 p.
artikel
262 Rapid thermal processing uniformity using multivariable control of a circularly symmetric three zone lamp 1993
100-101 9 p. 1429-1430
2 p.
artikel
263 Reactive ion etching technology in thin-film-transistor processing 1993
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1 p.
artikel
264 Recent advances and trends in numerical techniques for process simulation Joppich, W.
1997
100-101 9 p. 1329-1339
11 p.
artikel
265 Reconfigurable fault tolerant networks for fast packet switching 1992
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266 Relative mean residual life: Theory and related topics Wei, Xianhua
1992
100-101 9 p. 1319-1326
8 p.
artikel
267 Reliability analyses for a tree-structured hierarchic control system 1993
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1 p.
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268 Reliability analysis and optimization applications of a two-unit standby redundant system with spare units Agrafiotis, G.K.
1994
100-101 9 p. 1469-1475
7 p.
artikel
269 Reliability analysis and redundancy optimisation of a multimodular fault tolerant system Goel, L.R.
1992
100-101 9 p. 1243-1250
8 p.
artikel
270 Reliability analysis of a complex system with a deteriorating standby unit under common-cause failure and critical human error Narmada, S.
1996
100-101 9 p. 1287-1290
4 p.
artikel
271 Reliability analysis of a multicomponent system in a multistate Markovian environment Deng, Yonglu
1993
100-101 9 p. 1237-1239
3 p.
artikel
272 Reliability analysis of a two-unit redundant system with a replaceable repair facility Guo, Tongde
1992
100-101 9 p. 1237-1240
4 p.
artikel
273 Reliability and availability analysis of a system with warm standby and common cause failures Dhillon, B.S.
1993
100-101 9 p. 1343-1349
7 p.
artikel
274 Reliability comparison of token-ring network schemes 1993
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1 p.
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275 Reliability enhancement by time and space redundancy in multistage interconnection networks 1992
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1 p.
artikel
276 Reliability growth in the probability and possibility contexts Utkin, L.V.
1996
100-101 9 p. 1155-1166
12 p.
artikel
277 Reliability of commercial relays during life tests at low electrical contact load 1993
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1 p.
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278 Reliability of fully and partially replicated systems 1993
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2 p.
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279 Reliability optimization of communication networks using simulated annealing Atiqullah, Mir M.
1993
100-101 9 p. 1303-1319
17 p.
artikel
280 Reliable laminated ceramic capacitor carries innovative external electrodes 1992
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1 p.
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281 Remarks on maximum likelihood estimation for the Burr XII distribution Watkins, A.J.
1996
100-101 9 p. 1313-1314
2 p.
artikel
282 Repair of circuits by laser seeding and constriction induced plating 1993
100-101 9 p. 1436-
1 p.
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283 Representing monitored systems: A critical process in data collection Xu, Myron
1994
100-101 9 p. 1477-1484
8 p.
artikel
284 Robust character of exponential SPRT Sharma, K.K.
1993
100-101 9 p. 1223-1225
3 p.
artikel
285 Safety-related systems. Competence, liability and practice 1993
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1 p.
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286 Semi-insulating polysilicon heterojunctions on silicon 1992
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1 p.
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287 Sensor microsystems Popovic, R.S.
1997
100-101 9 p. 1401-1409
9 p.
artikel
288 Sequential imperfect preventive maintenance policies: A case study Jayabalan, V.
1992
100-101 9 p. 1223-1229
7 p.
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289 Short and long loop manufacturing feedback using a multisensor assembly test chip 1992
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1 p.
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290 Silicon wafer cleaning with CF4/H2 plasma and its effect on the properties of dry thermally grown oxide 1993
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291 Simulation of electronic structure of Si–Si bond traps in oxide/nitride/oxide structure Gritsenko, V.A.
1998
100-101 9 p. 1457-1464
8 p.
artikel
292 Simulation of multiple etch fronts 1992
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1 p.
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293 Single chip bumping and reliability for flip chip processes Klein, M.
1999
100-101 9 p. 1389-1397
9 p.
artikel
294 Smart power ICs technologies and applications G.W.A.D.,
1996
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2 p.
artikel
295 Soldering equipment works in freon-free environment 1993
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1 p.
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296 Some reliability measures of a system of components sharing a common environment Sharma, G.C.
1996
100-101 9 p. 1297-1301
5 p.
artikel
297 SPC and setup analysis for screen printed thick films 1992
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1 p.
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298 Special mechanisms in thin-film SOI MOSFETs Balestra, F.
1997
100-101 9 p. 1341-1351
11 p.
artikel
299 SPRAM technology cultivates characteristics useful in many fields 1993
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1 p.
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300 Stability of NiSi in boron-doped polysilicon lines Poon, M.C
1998
100-101 9 p. 1499-1502
4 p.
artikel
301 Statistical control of VLSI fabrication processes 1992
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1 p.
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302 Statistical design techniques for high-speed circuit boards with correlated structure distributions 1992
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1 p.
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303 Statistical simulation of IC technology: A bipolar process example Sanders, T.J.
1996
100-101 9 p. 1191-1205
15 p.
artikel
304 Stencil printing of solder paste for fine-pitch surface mount assembly 1992
100-101 9 p. 1341-
1 p.
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305 Stochastic analysis of an Erlangian arrival with linear cost structure Arora, R.T.
1992
100-101 9 p. 1205-1213
9 p.
artikel
306 Stochastic analysis of a system operating in a multiple environment Agnihotri, R.K.
1993
100-101 9 p. 1219-1222
4 p.
artikel
307 Stochastic behaviour of various specific computer reliability models Singh Rana, Virendra
1994
100-101 9 p. 1541-1548
8 p.
artikel
308 Study of MOS gate dielectric breakdown due to drain avalanche breakdown Wong, H.
1998
100-101 9 p. 1433-1438
6 p.
artikel
309 Study of plasma CVD silicon-germanium films using electron beam techniques 1992
100-101 9 p. 1347-
1 p.
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310 Sub-micron self-aligned-gate HEMT for microwave applications 1992
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1 p.
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311 Sub-quarter micron silicon integrated circuits and single wafer processing Singh, R
1998
100-101 9 p. 1471-1483
13 p.
artikel
312 Suppression of hot-electron-induced interface degradation in metal-oxide-semiconductor devices by backsurface argon bombardment Huang, M.Q
1998
100-101 9 p. 1407-1411
5 p.
artikel
313 Surge test characteristics of high K multilayer ceramic capacitors 1992
100-101 9 p. 1331-1332
2 p.
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314 Synthesis of VLSI circuits from behavioral descriptions 1992
100-101 9 p. 1342-
1 p.
artikel
315 System reliability estimation using simulation combined with network reductions Suh, Jae-Joon
1996
100-101 9 p. 1263-1267
5 p.
artikel
316 Systolic VLSI arrays for the metric approach to pattern recognition 1993
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1 p.
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317 TAB as a high leadcount PGA replacement 1992
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1 p.
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318 Technology Development: focus on manufacturability 1992
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1 p.
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319 Temperature dependence of reactive ion beam etching of GaAs with CH4/H2 1993
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1 p.
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320 Testers for printed circuit boards adopt latest system concept 1992
100-101 9 p. 1333-
1 p.
artikel
321 Test sequencing and diagnosis in electronic system with decision table Zhou, Huiyang
1996
100-101 9 p. 1167-1175
9 p.
artikel
322 The changing face of surface mount technology 1993
100-101 9 p. 1427-
1 p.
artikel
323 The effect of applied frequencies and multiple firing on the resistance of thick film resistors 1993
100-101 9 p. 1435-
1 p.
artikel
324 The effect of the number of defect mechanisms on fault clustering and its detection using yield model parameters 1993
100-101 9 p. 1427-
1 p.
artikel
325 The effects of implantation dose and anneal temperature on the layered structure and electrical properties of oxygen-ion-implanted silicon-on-insulator 1992
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1 p.
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326 The European quality award 1993
100-101 9 p. 1428-
1 p.
artikel
327 The median for a trapezoidal fuzzy number Yamashiro, Mitsuo
1994
100-101 9 p. 1509-1511
3 p.
artikel
328 The per-unit-length capacitance matrix of flaring VLSI packaging interconnections 1992
100-101 9 p. 1339-
1 p.
artikel
329 The power function distribution: A useful and simple distribution to assess electrical component reliability Meniconi, M.
1996
100-101 9 p. 1207-1212
6 p.
artikel
330 The principles of a new method of determining ion beam profile density distribution 1992
100-101 9 p. 1347-
1 p.
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331 The reliability modelling of RAM/ROM fault tolerant memories Kontoleon, J.M.
1992
100-101 9 p. 1231-1236
6 p.
artikel
332 The reliability model on a two stage CIMS production line Min, Tan
1993
100-101 9 p. 1275-1280
6 p.
artikel
333 Thermally stimulated current in SiO2 Fleetwood, D.M
1999
100-101 9 p. 1323-1336
14 p.
artikel
334 Thermal management of power electronics modules packaged by a stacked-plate technique Haque, Shatil
1999
100-101 9 p. 1343-1349
7 p.
artikel
335 Thermal stability of cobalt and nickel silicides Poon, M.C
1998
100-101 9 p. 1495-1498
4 p.
artikel
336 Thermal stability of polysilicon resistors 1993
100-101 9 p. 1435-1436
2 p.
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337 The role of plastic package adhesion in performance 1992
100-101 9 p. 1342-
1 p.
artikel
338 The study of a maintenance float model with Burr failure distribution Shankar, Gauri
1994
100-101 9 p. 1513-1517
5 p.
artikel
339 The SURE approach to reliability analysis 1993
100-101 9 p. 1426-
1 p.
artikel
340 Thick film resistor fabricated with YBa2Cu3O7−x superconducting powder 1992
100-101 9 p. 1345-
1 p.
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341 Thin-film transistor/liquid crystal display technology—an introduction 1993
100-101 9 p. 1436-
1 p.
artikel
342 Throughput availability in Markov systems 1993
100-101 9 p. 1424-
1 p.
artikel
343 Time-series models for reliability evaluation of power systems including wind energy Billinton, R.
1996
100-101 9 p. 1253-1261
9 p.
artikel
344 Transition of MCM-C applications to MCM-L using rigid flex substrates Keating, James
1999
100-101 9 p. 1399-1406
8 p.
artikel
345 Two approaches to array fault tolerance in the IBM enterprise system/9000™ type 9121 processor 1992
100-101 9 p. 1334-
1 p.
artikel
346 Uncertainty importance of system components by fuzzy and interval probability Utkin, Lev V.
1993
100-101 9 p. 1357-1364
8 p.
artikel
347 Usefulness of MTTF of s-independent case in other cases 1993
100-101 9 p. 1425-
1 p.
artikel
348 Use of screening and response surface experimental designs for development of a 0.5 μm CMOS self-aligned titanium silicide process 1992
100-101 9 p. 1342-
1 p.
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349 Using a software reliability model to design a telecommunications software architecture 1992
100-101 9 p. 1335-
1 p.
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350 Using distributed topology update and preplanned configurations to achieve trunk network survivability 1992
100-101 9 p. 1334-
1 p.
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351 Using reliability analysis software 1993
100-101 9 p. 1425-
1 p.
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352 Versatile COF, COB HIC technology attracts industry attention 1993
100-101 9 p. 1420-
1 p.
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353 VLSI chip design with the hardware description language verilog An introduction based on a large RISC processor design G.W.A.D.,
1996
100-101 9 p. 1316-1317
2 p.
artikel
354 Wear and contamination of electroplated gold films in line contact 1993
100-101 9 p. 1421-
1 p.
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355 World semiconductor market recovers gradually 1993
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1 p.
artikel
                             355 gevonden resultaten
 
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