Digitale Bibliotheek
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                             572 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayes procedure for estimation of current system reliability 1994
100-101 8 p. 1414-
1 p.
artikel
2 A bitstream readback-based automatic functional test and diagnosis method for Xilinx FPGAs Ruan, Aiwu
2014
100-101 8 p. 1627-1635
9 p.
artikel
3 A carrier-mobility model for high-k gate-dielectric Ge MOSFETs with metal gate electrode Xu, J.P.
2010
100-101 8 p. 1081-1086
6 p.
artikel
4 A cautionary tale about Weibull analysis 1997
100-101 8 p. 1281-
1 p.
artikel
5 Accelerated life time testing and optical degradation of remote phosphor plates Yazdan Mehr, M.
2014
100-101 8 p. 1544-1548
5 p.
artikel
6 A class of efficient tests for increasing-failure-rate-average distribution under random censoring 1994
100-101 8 p. 1417-
1 p.
artikel
7 A clustered yield model for SMT boards and MCM's 1997
100-101 8 p. 1284-1285
2 p.
artikel
8 A CMOS circuit for evaluating the NBTI over a wide frequency range Fernández-García, R.
2009
100-101 8 p. 885-891
7 p.
artikel
9 A consecutive k-out-of-n reliability system in random environment Råde, Lennart
1994
100-101 8 p. 1311-1318
8 p.
artikel
10 A cost analysis study for testability purposes on silicon active substrates 1997
100-101 8 p. 1288-1289
2 p.
artikel
11 Adaptive fuzzy systems 1994
100-101 8 p. 1416-
1 p.
artikel
12 A detailed study of current–voltage characteristics in Au/SiO2/n-GaAs in wide temperature range Altuntaş, H.
2009
100-101 8 p. 904-911
8 p.
artikel
13 A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects Yan, M.Y.
2006
100-101 8 p. 1392-1395
4 p.
artikel
14 A discrete Bayes explanation of a failure-rate paradox 1994
100-101 8 p. 1416-
1 p.
artikel
15 A domain decomposition method for the simulation of fracture in polysilicon MEMS Confalonieri, Federica
2013
100-101 8 p. 1045-1054
10 p.
artikel
16 Advanced “contact engineering” for submicron VLSI multilevel metallization 1994
100-101 8 p. 1422-
1 p.
artikel
17 Advances in capacitor designs keep pace with trends in portable equipment 1994
100-101 8 p. 1413-
1 p.
artikel
18 A failure-repair model with minimal and major maintenance 1994
100-101 8 p. 1414-1415
2 p.
artikel
19 A fault-tolerant communications switch prototype Loh, Peter K.K.
1997
100-101 8 p. 1193-1196
4 p.
artikel
20 A general maintenance model and its application to repair limit replacement policies Beichelt, F.
1992
100-101 8 p. 1185-1196
12 p.
artikel
21 A high-density and low-power charge-based Hamming network 1994
100-101 8 p. 1419-
1 p.
artikel
22 A high-speed two's complement multiplier using differential split-level CMOS 1994
100-101 8 p. 1427-
1 p.
artikel
23 A homogeneous Markov model for phased-mission reliability characteristics Goel, L.R.
1993
100-101 8 p. 1107-1111
5 p.
artikel
24 A layout-driven yield predictor and fault generator for VLSI 1994
100-101 8 p. 1421-1422
2 p.
artikel
25 All-inkjet printed organic transistors: Dielectric surface passivation techniques for improved operational stability and lifetime Gomes, H.L.
2015
100-101 8 p. 1192-1195
4 p.
artikel
26 All opportunity-triggered replacement policy for multiple-unit systems 1997
100-101 8 p. 1287-
1 p.
artikel
27 A model for optimal repair-effort decision for standby redundant systems with common-cause failures and its application to pulverizer systems Das, K.K.
1993
100-101 8 p. 1119-1125
7 p.
artikel
28 A model for the integrity assessment of ageing repairable systems 1994
100-101 8 p. 1415-
1 p.
artikel
29 A Monte Carlo approach for power estimation 1994
100-101 8 p. 1426-
1 p.
artikel
30 A multi-attribute classification fusion system for insulated gate bipolar transistor diagnostics Tamilselvan, Prasanna
2013
100-101 8 p. 1117-1129
13 p.
artikel
31 A multichip packaged GaAs 16 × 16 parallel multiplier 1994
100-101 8 p. 1427-
1 p.
artikel
32 An accurate MOSFET aging model for 28nm integrated circuit simulation Tudor, Bogdan
2012
100-101 8 p. 1565-1570
6 p.
artikel
33 An AI constraint network-based approach to bed-of-nails DFT for digital circuit design 1994
100-101 8 p. 1421-
1 p.
artikel
34 Analog circuit fault diagnosis based on noise measurement Dai, Yisong
1999
100-101 8 p. 1293-1298
6 p.
artikel
35 Analogue electronic circuit diagnosis based on ANNs Litovski, Vančo
2006
100-101 8 p. 1382-1391
10 p.
artikel
36 An alternate and simpler method for finding the field-dependent defect density of SiO2 films using MOS capacitor devices Bhan, R.K.
1994
100-101 8 p. 1361-1364
4 p.
artikel
37 Analysis of a two unit standby system with preparation time and correlated failures and repairs Goel, L.R.
1995
100-101 8 p. 1163-1165
3 p.
artikel
38 Analysis of a two-unit system with connecting and disconnecting effect Goel, C.K.
1997
100-101 8 p. 1271-1274
4 p.
artikel
39 Analysis of drain breakdown voltage in enhancement-mode SOI MOSFETs 1994
100-101 8 p. 1429-
1 p.
artikel
40 Analysis of flicker and thermal noise in p-channel Underlap DG FinFET Swain, Sanjit Kumar
2014
100-101 8 p. 1549-1554
6 p.
artikel
41 Analysis of high power microwave induced degradation and damage effects in AlGaAs/InGaAs pHEMTs Yu, Xinhai
2015
100-101 8 p. 1174-1179
6 p.
artikel
42 An efficient minimizing algorithm for sum of disjoint products Zhao, Lian-Chang
1995
100-101 8 p. 1157-1162
6 p.
artikel
43 An empirical model for enhancement-induced defect activity in software 1997
100-101 8 p. 1278-
1 p.
artikel
44 A neural implementation of complex activation functions for digital VLSI neural networks 1994
100-101 8 p. 1427-
1 p.
artikel
45 A new approach to optimal replacement times for complex systems Schäbe, Hendrik
1995
100-101 8 p. 1125-1130
6 p.
artikel
46 A new formulation for state equation representation for Petri nets Kaushal, R.P.
1992
100-101 8 p. 1083-1090
8 p.
artikel
47 A new type of fiber optic connector designed for military optical backplanes 1994
100-101 8 p. 1410-
1 p.
artikel
48 An experimental procedure for measuring silicon lattice heating due to hot carriers in MOSFETs 1994
100-101 8 p. 1428-
1 p.
artikel
49 An experimental study of popcorning in plastic encapsulated microcircuits 1997
100-101 8 p. 1288-
1 p.
artikel
50 An expert process planning system for electronics PCB assembly 1994
100-101 8 p. 1423-1424
2 p.
artikel
51 An introduction to fast wafer level reliability monitoring for integrated circuit mass production Martin, Andreas
2004
100-101 8 p. 1209-1231
23 p.
artikel
52 An inventory control model with gamma distribution Yeh, Quey-Jen
1997
100-101 8 p. 1197-1201
5 p.
artikel
53 Annealing behaviour of hole traps in irradiated gate oxides 1994
100-101 8 p. 1427-
1 p.
artikel
54 An O (k · n)-time algorithm for computing the reliability of a circular consecutive-k-out-of-n:F system 1994
100-101 8 p. 1416-
1 p.
artikel
55 Anomalous gate oxide conduction on isolation edges: analysis and process optimization Ghetti, A.
2003
100-101 8 p. 1229-1235
7 p.
artikel
56 Anomalous latchup failure induced by on-chip ESD protection circuit in a high-voltage CMOS IC product Lin, I-Cheng
2003
100-101 8 p. 1295-1301
7 p.
artikel
57 An O (n · log(n)) algorithm to compute the all-terminal reliability of (K5, K2,2,2 ) free networks 1994
100-101 8 p. 1414-
1 p.
artikel
58 An ordering policy with age-dependent minimal repair and age-dependent random repair costs Sheu, Shey-Huei
1992
100-101 8 p. 1105-1113
9 p.
artikel
59 A note on solving a system reliability problem involving nonlinear constraints Wong, Jsun Y.
1993
100-101 8 p. 1213-1217
5 p.
artikel
60 A novel gate-suppression technique for ESD protection Miao, Meng
2012
100-101 8 p. 1598-1601
4 p.
artikel
61 A novel impact test system for more efficient reliability testing Hokka, Jussi
2010
100-101 8 p. 1125-1133
9 p.
artikel
62 A novel power-clamp assisted complementary MOSFET for robust ESD protection Wu, Jian
2012
100-101 8 p. 1593-1597
5 p.
artikel
63 A novel simulation technique for testing analog ICs Dhifi, M
2002
100-101 8 p. 1243-1248
6 p.
artikel
64 A novel stability and process sensitivity driven model for optimal sized FinFET based SRAM Yadav, Nandakishor
2015
100-101 8 p. 1131-1143
13 p.
artikel
65 Application of direct strain measurement of fatigue studies in surface solder joints 1997
100-101 8 p. 1276-
1 p.
artikel
66 Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet Pan, C.T.
2006
100-101 8 p. 1369-1381
13 p.
artikel
67 Application of ring oscillators to characterize transmission lines in VLSI circuits 1997
100-101 8 p. 1284-
1 p.
artikel
68 Application of the hierarchical fault model to reliability considerations Bemmann, Hans-Bernhard
1992
100-101 8 p. 1063-1066
4 p.
artikel
69 Applications of finite element methods for reliability study of ULSI interconnections Tan, Cher Ming
2012
100-101 8 p. 1539-1545
7 p.
artikel
70 Applying the fWLR concept to Stress induced leakage current in non-volatile memory processes Tao, Guoqiao
2004
100-101 8 p. 1269-1273
5 p.
artikel
71 A proposed DG-FinFET based SRAM cell design with RadHard capabilities Rathod, S.S.
2010
100-101 8 p. 1181-1188
8 p.
artikel
72 A real-time clustering microchip neural engine 1997
100-101 8 p. 1285-
1 p.
artikel
73 Are components still the major problem: a review of electronic system and device field failure returns 1994
100-101 8 p. 1409-
1 p.
artikel
74 A reliability and cost analysis of an automatic prototype generator test paradigm 1994
100-101 8 p. 1417-
1 p.
artikel
75 A review of modern power semiconductor devices 1994
100-101 8 p. 1411-1412
2 p.
artikel
76 A review of reliability prediction methods for electronic devices Foucher, B
2002
100-101 8 p. 1155-1162
8 p.
artikel
77 A sequential test to control up and down times when their distributions are gamma Jain, Sudha
1994
100-101 8 p. 1375-1376
2 p.
artikel
78 A shapeshifting evolvable hardware mechanism based on reconfigurable memFETs crossbar architecture Martin-Martinez, J.
2014
100-101 8 p. 1500-1510
11 p.
artikel
79 A silicon-on-silicon field programmable multichip model (FPMCM)—integrating FPGA and MCM technologies 1997
100-101 8 p. 1285-
1 p.
artikel
80 A statistical method for obtaining the factors in electronic-component reliability-prediction models 1994
100-101 8 p. 1412-
1 p.
artikel
81 A study of failures identified during board level environmental stress testing 1994
100-101 8 p. 1422-
1 p.
artikel
82 A study on MIS Schottky diode based hydrogen sensor using La2O3 as gate insulator Chen, Gang
2012
100-101 8 p. 1660-1664
5 p.
artikel
83 A study on the improved programming characteristics of flash memory with Si3N4/SiO2 stacked tunneling dielectric Liu, L.
2009
100-101 8 p. 912-915
4 p.
artikel
84 A symbolic approach to design centering of analog circuits Grasso, Francesco
2007
100-101 8 p. 1288-1295
8 p.
artikel
85 A two-unit system with allowed down time and random check of standby Gupta, Rakesh
1994
100-101 8 p. 1381-1385
5 p.
artikel
86 Automated malfunction diagnosis of semiconductor fabrication equipment: a plasma etch application 1994
100-101 8 p. 1421-
1 p.
artikel
87 Automated wafer level QBD measurement for production control 1994
100-101 8 p. 1422-
1 p.
artikel
88 Automated X-ray inspection of chip-to-chip interconnections of Si-on-Si MCM's 1997
100-101 8 p. 1288-
1 p.
artikel
89 Automatic assembly equipment gains capabilities, improves performance 1994
100-101 8 p. 1426-
1 p.
artikel
90 Availability and reliability of the system with pre-emptive priorities and shut-off rules Chen, Yow-mow
1992
100-101 8 p. 1053-1061
9 p.
artikel
91 Availability of pavements with random crack times and regular inspection Alidrisi, Mustafa M.
1993
100-101 8 p. 1133-1140
8 p.
artikel
92 b and its temperature dependence are the important criteria of the reliability of semiconductor lasers Jiawei, Shi
1994
100-101 8 p. 1405-1408
4 p.
artikel
93 Barrier layer thickness analysis for reliable copper plug process in CMOS technology Manhas, S.K.
2011
100-101 8 p. 1365-1371
7 p.
artikel
94 Basic hybrid IC technology must adapt to dense mounting 1994
100-101 8 p. 1429-
1 p.
artikel
95 Bayes computation for life testing and reliability estimation 1994
100-101 8 p. 1419-
1 p.
artikel
96 Bayesian analysis of the mixture of exponential failure distributions Singh, Nand Kishore
1993
100-101 8 p. 1113-1117
5 p.
artikel
97 Bayesian analysis of the parameters of a doubly truncated weibull distribution Shalaby, O.A.
1993
100-101 8 p. 1199-1211
13 p.
artikel
98 Bayesian inference for partially accelerated life tests using Gibbs sampling Madi, Mohamed T.
1997
100-101 8 p. 1165-1168
4 p.
artikel
99 Bayesian prediction of the jth order statistic with burr distribution and a random sample size Ashour, S.K.
1993
100-101 8 p. 1179-1188
10 p.
artikel
100 Bayes parameter estimation for the bivariate Weibull model of Marshall-Olkin for censored data 1994
100-101 8 p. 1417-
1 p.
artikel
101 Bias temperature instability assessment of n- and p-channel MOS transistors using a polysilicon resistive heated scribe lane test structure Muth, Werner
2004
100-101 8 p. 1251-1262
12 p.
artikel
102 Bias-temperature stress of Al on porous low-k dielectrics He, Ming
2011
100-101 8 p. 1342-1345
4 p.
artikel
103 Bootstrap prediction intervals for the birnbaum-saunders distribution Lu, Ming-Che
1997
100-101 8 p. 1213-1216
4 p.
artikel
104 Boundary walking test: an accelerated scan method for greater system reliability 1994
100-101 8 p. 1411-
1 p.
artikel
105 Bounds for reliability of consecutive k-within-m-out-of-n:F systems 1994
100-101 8 p. 1414-
1 p.
artikel
106 Bounds for reliability of k-within connected-(r, s)-out-of-(m, n) failure systems Makri, F.S.
1997
100-101 8 p. 1217-1224
8 p.
artikel
107 Calendar 2009
100-101 8 p. I-III
nvt p.
artikel
108 Calendar 2001
100-101 8 p. I-V
nvt p.
artikel
109 Calendar for forthcoming events 2002
100-101 8 p. I-V
nvt p.
artikel
110 Calendar of forthcoming events 2003
100-101 8 p. I-IV
nvt p.
artikel
111 Calendar of forthcoming events 1997
100-101 8 p. 1293-1299
7 p.
artikel
112 Calendar of international conferences, symposia, lectures and meetings of interest 1995
100-101 8 p. 1199-1201
3 p.
artikel
113 Call for Papers for the MIEL 2010 Conference 2009
100-101 8 p. IV-
1 p.
artikel
114 Carrier injection efficiency for the reliability study of 3.5–1.2 nm thick gate-oxide CMOS technologies Bravaix, A.
2003
100-101 8 p. 1241-1246
6 p.
artikel
115 CBS-CAD: a CAD process management system 1994
100-101 8 p. 1420-
1 p.
artikel
116 Characterisation and passivation of interface defects in (100)-Si/SiO2/HfO2/TiN gate stacks Hurley, P.K.
2007
100-101 8 p. 1195-1201
7 p.
artikel
117 Characteristics analysis and optimization design of a new ESD power clamp circuit Liu, Hongxia
2010
100-101 8 p. 1087-1093
7 p.
artikel
118 Characteristics and potential application of polyimide-core bump to flip chip 1997
100-101 8 p. 1286-
1 p.
artikel
119 Characterization and modeling of hot carrier injection in LDMOS for L-band radar application Lachéze, L.
2011
100-101 8 p. 1289-1294
6 p.
artikel
120 Characterization of a small peripheral array package 1997
100-101 8 p. 1288-
1 p.
artikel
121 Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling Nguyen, Tung T.
2011
100-101 8 p. 1385-1392
8 p.
artikel
122 Characterization of flip chip bonded structure with Cu ABL power bumps Ma, Junsung
2014
100-101 8 p. 1598-1602
5 p.
artikel
123 Characterization of intermetallic compounds in Cu–Al ball bonds: Mechanical properties, interface delamination and thermal conductivity Kouters, M.H.M.
2013
100-101 8 p. 1068-1075
8 p.
artikel
124 Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing Lantz, Leon
2002
100-101 8 p. 1163-1170
8 p.
artikel
125 Characterization of the viscoelastic properties of an epoxy molding compound during cure Sadeghinia, M.
2012
100-101 8 p. 1711-1718
8 p.
artikel
126 Characterizations of GaN films grown with indium surfactant by RF-plasma assisted molecular beam epitaxy Fong, W.K
2002
100-101 8 p. 1179-1184
6 p.
artikel
127 Charge-based model for symmetric double-gate MOSFETs with inclusion of channel doping effect Zhang, Lining
2010
100-101 8 p. 1062-1070
9 p.
artikel
128 Charge storage and data retention characteristics of forming gas-annealed Gd2O3-nanocrystal nonvolatile memory cell Wang, Jer-Chyi
2012
100-101 8 p. 1627-1631
5 p.
artikel
129 Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips Jinka, K.K.
2007
100-101 8 p. 1246-1250
5 p.
artikel
130 Chi-square tests-of-fit for location-scale families using type-II censored data 1994
100-101 8 p. 1414-
1 p.
artikel
131 Circuit implications of gate oxide breakdown Stathis, J.H.
2003
100-101 8 p. 1193-1197
5 p.
artikel
132 Coding theorems on a generalized “useful” inaccuracy Bhatia, P.K.
1993
100-101 8 p. 1085-1087
3 p.
artikel
133 Cohesive zone modeling for structural integrity analysis of IC interconnects van Hal, B.A.E.
2007
100-101 8 p. 1251-1261
11 p.
artikel
134 Co-implantation of Mg and Si in GaAs MESFETs 1994
100-101 8 p. 1429-1430
2 p.
artikel
135 Commercial-components initiative: ground benign systems—plastic encapsulated microcircuits 1997
100-101 8 p. 1282-
1 p.
artikel
136 Comparative analysis of yield optimized pulsed flip-flops Lanuzza, Marco
2012
100-101 8 p. 1679-1689
11 p.
artikel
137 Comparison between BSIM4.X and HSPICE flicker noise models in NMOS and PMOS transistors in all operating regions Noulis, T.
2007
100-101 8 p. 1222-1227
6 p.
artikel
138 Compound semiconductor activation energy in humidity Roesch, William J.
2006
100-101 8 p. 1238-1246
9 p.
artikel
139 Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages Tee, Tong Yan
2003
100-101 8 p. 1329-1338
10 p.
artikel
140 Computational and experimental environments for fuzzy logic and control 1994
100-101 8 p. 1419-
1 p.
artikel
141 Computationally-efficient phased-mission reliability analysis for systems with variable configurations 1994
100-101 8 p. 1420-
1 p.
artikel
142 Conduction mechanisms in contaminant layers on printed circuit boards 1994
100-101 8 p. 1413-
1 p.
artikel
143 Confidence limits for steady state availability of systems Chandrasekhar, P.
1994
100-101 8 p. 1365-1367
3 p.
artikel
144 Connecting parametric ageing to catastrophic failure through thermodynamics 1997
100-101 8 p. 1286-1287
2 p.
artikel
145 Constitutive relations for tin-based solder joints 1994
100-101 8 p. 1412-
1 p.
artikel
146 Contact resistance and adhesion performance of ACF interconnections to aluminum metallization Zhang, J.H
2003
100-101 8 p. 1303-1310
8 p.
artikel
147 Continuous state reliability analysis 1997
100-101 8 p. 1280-1281
2 p.
artikel
148 Coprocessor design for multilayer surface-mounted PCB routing 1994
100-101 8 p. 1425-1426
2 p.
artikel
149 Correlating gate sinking and electrical performance of pseudomorphic high electron mobility transistors Berechman, Ronen A.
2007
100-101 8 p. 1202-1207
6 p.
artikel
150 Correlation between localized strain and damage in shear-loaded Pb-free solders Matin, M.A.
2007
100-101 8 p. 1262-1272
11 p.
artikel
151 Correlation of SiO2 lifetimes from constant and ramped voltage measurements 1997
100-101 8 p. 1279-
1 p.
artikel
152 Corrosion and adhesion of multilayer pad structures for packaging applications 1997
100-101 8 p. 1283-
1 p.
artikel
153 Corrosion protection of anisotropically conductive adhesive joined flip chips Kokko, Kati
2010
100-101 8 p. 1152-1158
7 p.
artikel
154 Cost analysis for two-unit warm standby systems Sridharan, V.
1992
100-101 8 p. 1079-1081
3 p.
artikel
155 Cost analysis of the M/M/R machine repair problem with spares operating under variable service rates Wang, K.-H.
1992
100-101 8 p. 1171-1183
13 p.
artikel
156 Cost-benefit analysis of a two-unit standby system with a proviso of repair-machine failure Gupta, Rakesh
1994
100-101 8 p. 1391-1394
4 p.
artikel
157 Cost-optimal periodical replacement policy for a system subjected to shock damage Lai, Min-Tsai
1993
100-101 8 p. 1159-1168
10 p.
artikel
158 Critical reliability challenges in scaling SiO2-based dielectric to its limit Wu, E.Y.
2003
100-101 8 p. 1175-1184
10 p.
artikel
159 Crosstalk bandwidth and stability analysis in graphene nanoribbon interconnects Bagheri, Amin
2015
100-101 8 p. 1262-1268
7 p.
artikel
160 Crystal size and direction dependence of the elastic properties of Cu3Sn through molecular dynamics simulation and nanoindentation testing Chen, Wen-Hwa
2012
100-101 8 p. 1699-1710
12 p.
artikel
161 Curiosities in choosing system components: a Bayes analysis 1994
100-101 8 p. 1411-
1 p.
artikel
162 C-V characterization of MOS capacitors in SOI structures 1997
100-101 8 p. 1275-1276
2 p.
artikel
163 Decision theory in maintenance strategy of standby system with gamma-distribution repair-time 1997
100-101 8 p. 1281-
1 p.
artikel
164 Defining the safe operating area for HBTs with an InGaP emitter across temperature and current density Whitman, Charles S.
2007
100-101 8 p. 1166-1174
9 p.
artikel
165 Degradation behaviors of GaN light-emitting diodes under high-temperature and high-current stressing Liu, J.
2012
100-101 8 p. 1636-1639
4 p.
artikel
166 Degradation mapping in high power IGBT modules using four-point probing Pedersen, Kristian Bonderup
2015
100-101 8 p. 1196-1204
9 p.
artikel
167 Degradation properties of MOVPE-grown GaInP/GaAs HBTs under combined temperature and current stressing Würfl, Joachim
2001
100-101 8 p. 1103-1108
6 p.
artikel
168 Demand grows for industrial-use semiconductor lasers 1994
100-101 8 p. 1430-
1 p.
artikel
169 Depth profile analysis of porous Si film by ERDA using a ΔE - E detector telescope 1997
100-101 8 p. 1289-
1 p.
artikel
170 Design and implementation of configurable ESD protection cell for 60-GHz RF circuits in a 65-nm CMOS process Lin, Chun-Yu
2011
100-101 8 p. 1315-1324
10 p.
artikel
171 Design methodologies for reliability of SSL LED boards Jakovenko, J.
2013
100-101 8 p. 1076-1083
8 p.
artikel
172 Design of a low-cost wire bond tape ball grid array package 1997
100-101 8 p. 1288-
1 p.
artikel
173 Design of a novel chip on glass package solution for CMOS image sensor device Chen, Ching-Yang
2006
100-101 8 p. 1326-1334
9 p.
artikel
174 Design of field-plate terminated 4H-SiC Schottky diodes using high-k dielectrics Kumta, A.
2006
100-101 8 p. 1295-1302
8 p.
artikel
175 Design of precision capacitors for analog applications 1994
100-101 8 p. 1410-
1 p.
artikel
176 Deteriorated radiation effects impact on the characteristics of MOS transistors with multi-finger configuration Wang, Jian
2010
100-101 8 p. 1094-1097
4 p.
artikel
177 Determination of transistor infant failure probability in InGaP/GaAs heterojunction bipolar technology Alt, K.W.
2007
100-101 8 p. 1175-1179
5 p.
artikel
178 Determining factors affecting ESD failure voltage using DOE Whitman, Charles
2006
100-101 8 p. 1228-1237
10 p.
artikel
179 Developing reliable software 1997
100-101 8 p. 1275-
1 p.
artikel
180 Developing reusable modeling capabilities for simulating high volume electronics manufacturing systems 1997
100-101 8 p. 1287-1288
2 p.
artikel
181 Development of a novel stack package to fabricate high density memory modules for high-end application Kuo, Chinguo
2010
100-101 8 p. 1116-1120
5 p.
artikel
182 Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive Harr, Kyoung-Moo
2015
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183 Development proceeds on chip fixed inductors, their applications 1994
100-101 8 p. 1413-
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184 Developments of new concept analytical instruments for failure analyses of sub-100 nm devices Mitsui, Yasuhiro
2001
100-101 8 p. 1171-1183
13 p.
artikel
185 Devices’ optimization against hot-carrier degradation in high voltage pLEDMOS transistor Wu, Hong
2010
100-101 8 p. 1071-1076
6 p.
artikel
186 Diagnosis of fully differential circuits based on a fault dictionary implemented in the microcontroller systems Toczek, Wojciech
2011
100-101 8 p. 1413-1421
9 p.
artikel
187 Dielectric breakdown I: a review of oxide breakdown 1997
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188 Dielectric breakdown II: related projects at the University of twente 1997
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189 Dielectric degradation of Pt/SiO2/Si structures during thermal annealing 1994
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190 DIGamber: a digital design and diagnostic tool in expert system environment 1994
100-101 8 p. 1426-
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191 Digital design and computer architecture; Hassan A. Farhat. CRC Press, Boca Raton: 2004. Hardcover, 487pp, plus XXII. ISBN 0-8493-1191-8 Stojcev, Mile
2004
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192 Direct chip interconnect with adhesive conductor films 1994
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193 Discrete surface mount products for power applications 1994
100-101 8 p. 1423-
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194 Domination of k-out-of-n systems 1997
100-101 8 p. 1277-
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195 3-D simulation study of single event effects of SiGe heterojunction bipolar transistor in extreme environment Zhang, Jin-xin
2015
100-101 8 p. 1180-1186
7 p.
artikel
196 Dynamic reliability analysis of coherent multistate system 1997
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197 Early-life reliability prediction methodology for integrated circuits Menon, S.S.
1995
100-101 8 p. 1147-1155
9 p.
artikel
198 Editorial Anderson, Wallace T
2001
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artikel
199 Effect of annealing on the microstructure and bonding interface properties of Ag–2Pd alloy wire Tseng, Yi-Wei
2015
100-101 8 p. 1256-1261
6 p.
artikel
200 Effect of IC layout on the reliability of CMOS amplifiers He, Feifei
2012
100-101 8 p. 1575-1580
6 p.
artikel
201 Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn–58Bi solder joints Hu, Tianwei
2015
100-101 8 p. 1226-1233
8 p.
artikel
202 Effect of oval defects in GaAs on the reliability of SiN x metal–insulator–metal capacitors van der Wel, P.J.
2007
100-101 8 p. 1188-1193
6 p.
artikel
203 Effect of PCB finish on the reliability and wettability of ball grid array packages 1997
100-101 8 p. 1283-
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204 Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA Wang, Tong Hong
2011
100-101 8 p. 1372-1376
5 p.
artikel
205 Effect of the direct current on microstructure, tensile property and bonding strength of pure silver wires Hsueh, Hao-Wen
2013
100-101 8 p. 1159-1163
5 p.
artikel
206 Effects of Al on the failure mechanism of the Sn–Ag–Zn eutectic solder Wei, C.
2010
100-101 8 p. 1142-1145
4 p.
artikel
207 Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature Chan, Y.C
2002
100-101 8 p. 1185-1194
10 p.
artikel
208 Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure Chan, Y.C
2002
100-101 8 p. 1195-1204
10 p.
artikel
209 Effects of impurity concentration, hydrogen plasma process and crystallization temperature on poly-crystalline films obtained from PECVD a-Si:H layers Garcı́a, R.
2003
100-101 8 p. 1281-1287
7 p.
artikel
210 Efficient algorithm for reliability of a circular consecutive-k-out-of-n F system 1994
100-101 8 p. 1414-
1 p.
artikel
211 Efficiently analyzing the impact of aging effects on large integrated circuits Lorenz, Dominik
2012
100-101 8 p. 1546-1552
7 p.
artikel
212 Electrical characterisation and reliability of HfO2 and Al2O3–HfO2 MIM capacitors Mondon, F.
2003
100-101 8 p. 1259-1266
8 p.
artikel
213 Electrical characteristics of advanced lateral insulated-gate bipolar transistor structures at 77 K Vellvehi, M.
1999
100-101 8 p. 1239-1246
8 p.
artikel
214 Electrical characterization of the hafnium oxide prepared by direct sputtering of Hf in oxygen with rapid thermal annealing Ng, K.L.
2003
100-101 8 p. 1289-1293
5 p.
artikel
215 Electrical characterization of zirconium silicate films obtained from novel MOCVD precursors Paskaleva, Albena
2003
100-101 8 p. 1253-1257
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216 Electrical measurement of silicon film and oxide thicknesses in partially depleted SOI technologies 1997
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217 Electrical probing of deep sub-micron integrated circuits using scanning probes Krieg, K
2001
100-101 8 p. 1185-1191
7 p.
artikel
218 Electrochemical corrosion behaviour of copper under periodic wet–dry cycle condition Huang, Hualiang
2013
100-101 8 p. 1149-1158
10 p.
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219 Electromigration and electrochemical reaction mixed failure mechanism in gold interconnection system Murayama, Hide
2001
100-101 8 p. 1265-1272
8 p.
artikel
220 Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines 1997
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221 Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence Gousseau, Simon
2015
100-101 8 p. 1205-1213
9 p.
artikel
222 Electromigration-induced failures at Cu/Sn/Cu flip-chip joint interfaces Tseng, H.W.
2010
100-101 8 p. 1159-1162
4 p.
artikel
223 Electromigration: Investigation of heterogeneous systems Vanhecke, B.
1993
100-101 8 p. 1141-1157
17 p.
artikel
224 Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy Lai, Yi-Shao
2007
100-101 8 p. 1273-1279
7 p.
artikel
225 Electromigration: the time bomb in deep-submicron ICs 1997
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226 Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages Lai, Yi-Shao
2006
100-101 8 p. 1357-1368
12 p.
artikel
227 Ellipsometric measurements of surface roughness of silicon wafers 1994
100-101 8 p. 1429-
1 p.
artikel
228 Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test Chen, Sihan Joseph
2012
100-101 8 p. 1632-1635
4 p.
artikel
229 Erratum to “An algorithm for calculating the lower confidence bounds of C PU and C PL with application to low-drop-out linear regulators” [Microelectronics Reliability 2003;43:495–502] Pearn, W.L.
2003
100-101 8 p. 1349-
1 p.
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230 Estimating defects in commercial software during operational use 1994
100-101 8 p. 1415-
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231 Estimating the cumulativenance strategy of standby system with gamma-distribution repair-time 1997
100-101 8 p. 1281-
1 p.
artikel
232 Estimation methods for the mean of the exponential distribution based on grouped and censored data 1994
100-101 8 p. 1416-
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artikel
233 Estimation of the degradation of InGaN/AlGaN blue light-emitting diodes Yanagisawa, Takeshi
1997
100-101 8 p. 1239-1241
3 p.
artikel
234 Estimation of the degradation rate of multi-crystalline silicon photovoltaic module under thermal cycling stress Park, Nochang
2014
100-101 8 p. 1562-1566
5 p.
artikel
235 Evaluating layout area tradeoffs for high level applications 1994
100-101 8 p. 1416-1417
2 p.
artikel
236 Evaluating the abrasive wear of Zn1− x Mn x O heteroepitaxial layers using a nanoscratch technique Chang, Yu-Ming
2010
100-101 8 p. 1111-1115
5 p.
artikel
237 Evaluating the performance of software-reliability models 1994
100-101 8 p. 1418-
1 p.
artikel
238 Evaluation methods of ion migration by dew condensation cycle test—part 2 1997
100-101 8 p. 1287-
1 p.
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239 Evaluation of gate oxide breakdown effect on cascode class E power amplifier performance Kutty, Karan
2011
100-101 8 p. 1302-1308
7 p.
artikel
240 Evaluation of performance–reliability trade-offs in a Si–Ge BiCMOS process using fast wafer level techniques O'Connell, Barry
2004
100-101 8 p. 1263-1268
6 p.
artikel
241 Evaluation of protocols for availability, reliability and consistency of replicated files Dear, Roger G.
1995
100-101 8 p. 1143-1145
3 p.
artikel
242 Evaluation of SiGe:C HBT intrinsic reliability using conventional and step stress methodologies Gaw, Craig
2006
100-101 8 p. 1272-1278
7 p.
artikel
243 Exciton wavefunction coupled surface plasmon resonance for In-rich InGaN film with perforated aluminum cylindrical micropillar arrays Hu, Yeu-Jent
2010
100-101 8 p. 1107-1110
4 p.
artikel
244 Experimental and analytical studies of encapsulated flip chip solder bumps on surface laminar circuit boards 1994
100-101 8 p. 1410-
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245 Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress Lim, Meng Keong
2012
100-101 8 p. 1553-1558
6 p.
artikel
246 Experimental characterization of simultaneous switching noise for multichip modules 1997
100-101 8 p. 1288-
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247 Experimental investigations and model study of moisture behaviors in polymeric materials Fan, X.J.
2009
100-101 8 p. 861-871
11 p.
artikel
248 Fabrication and characterization of low-cost ultrathin flexible polyimide interposer Huang, Yu-Jung
2015
100-101 8 p. 1248-1255
8 p.
artikel
249 Failure analysis from the back side of a die Liebert, Silke
2001
100-101 8 p. 1193-1201
9 p.
artikel
250 Failure investigation on copper-plated blind vias in PCB Ji, Li-Na
2010
100-101 8 p. 1163-1170
8 p.
artikel
251 Failure mechanism models for Ductile fracture 1994
100-101 8 p. 1413-1414
2 p.
artikel
252 Failure modes in surface micromachined microelectromechanical actuation systems Miller, S.L
1999
100-101 8 p. 1229-1237
9 p.
artikel
253 Fast enumeration of every path in a reliability graph using subgraphs Aziz, M.A.
1994
100-101 8 p. 1395-1396
2 p.
artikel
254 Fast wafer level reliability: methods and experiences Vollertsen, Rolf-Peter
2004
100-101 8 p. 1207-1208
2 p.
artikel
255 Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads Gao, Li-Lan
2011
100-101 8 p. 1393-1397
5 p.
artikel
256 Fatigue life studies on defect-free solder joints fabricated from modified reflow soldering 1997
100-101 8 p. 1276-1277
2 p.
artikel
257 Fault detection in resistive ladder network with minimal measurements Shashank, S.B.
2012
100-101 8 p. 1586-1592
7 p.
artikel
258 Fault location in multi-modular redundant systems Noore, A.
1997
100-101 8 p. 1267-1269
3 p.
artikel
259 Fault severity models for fault-correction activity 1997
100-101 8 p. 1277-1278
2 p.
artikel
260 Fault-tolerant TMR and DMR circuits with latchup protection switches Petrović, V.
2014
100-101 8 p. 1613-1626
14 p.
artikel
261 Fault tree analysis and binary decision diagrams 1997
100-101 8 p. 1281-1282
2 p.
artikel
262 Feature-scale simulation of resist-patterned electrode-position 1994
100-101 8 p. 1424-
1 p.
artikel
263 Field returns, a source of natural failure mechanisms Roesch, William J.
2007
100-101 8 p. 1156-1165
10 p.
artikel
264 Finding nonfaulty subtrees in faulty binary tree architectures Mittal, Ravi
1994
100-101 8 p. 1301-1310
10 p.
artikel
265 Finite range survival model Siddiqui, S.A.
1994
100-101 8 p. 1377-1380
4 p.
artikel
266 First-principles study of the effects of oxygen vacancy on hole tunneling current Mao, L.F.
2007
100-101 8 p. 1213-1217
5 p.
artikel
267 Fixed resistors serve to reduce equipment size 1994
100-101 8 p. 1410-
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268 Fluid–solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing Chen, Zhaohui
2012
100-101 8 p. 1726-1734
9 p.
artikel
269 Forced convection air-cooling of a commercial electronic chassis: and experimental and computational case study 1997
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270 Functional flexibility keeps ASICs in demand 1994
100-101 8 p. 1419-
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271 Fuzzy logic based network reliability evaluation Nahman, J.
1997
100-101 8 p. 1161-1164
4 p.
artikel
272 Gaussian parametric failure-rate model with application to Quartz-Crystal device aging 1994
100-101 8 p. 1412-
1 p.
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273 Generating sub-1V reference voltages from a resistorless CMOS bandgap reference circuit by using a piecewise curvature temperature compensation technique Tam, Wing-Shan
2010
100-101 8 p. 1054-1061
8 p.
artikel
274 Generation of reduced dynamic thermal models of electronic systems from time constant spectra of transient temperature responses Janicki, Marcin
2011
100-101 8 p. 1351-1355
5 p.
artikel
275 Geometry effect on mechanical performance and fracture behavior of micro-scale ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints Qin, H.B.
2015
100-101 8 p. 1214-1225
12 p.
artikel
276 Gigabit age microelectronics and their manufacture 1994
100-101 8 p. 1420-
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277 Global fault localization using induced voltage alteration Cole Jr, Edward I
2001
100-101 8 p. 1145-1159
15 p.
artikel
278 Gold-to-aluminum bonding for TAB applications 1994
100-101 8 p. 1424-
1 p.
artikel
279 Goodness-of-fit tests for the power-law process based on the TTT-plot 1994
100-101 8 p. 1418-
1 p.
artikel
280 Graphical techniques for analyzing failure data with the percentile residual-life function 1994
100-101 8 p. 1415-
1 p.
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281 Grown-in-deep-level defects in vapour phase epitaxial GaAs 1 − x P x 1994
100-101 8 p. 1428-
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282 Guest Editorial: 2008 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems Wymysłowski, Artur
2009
100-101 8 p. 823-824
2 p.
artikel
283 Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems Wymysłowski, Artur
2013
100-101 8 p. 1043-1044
2 p.
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284 HIC application technologies enhance high density mounting in printed circuit boards 1994
100-101 8 p. 1425-
1 p.
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285 High electrical performance liquid-phase HBr oxidation gate insulator of InAlAs/InGaAs metamorphic MOS-mHEMT Chiu, Hsien-Chin
2011
100-101 8 p. 1337-1341
5 p.
artikel
286 High-precision Berenger modes of dual-layer micro-waveguides terminated with a perfectly matched layer for on-chip optical interconnections Zhu, Jianxin
2013
100-101 8 p. 1164-1167
4 p.
artikel
287 High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package Xie, Huimin
2002
100-101 8 p. 1219-1227
9 p.
artikel
288 HIMOS: an attractive flash EEPROM cell for embedded memory applications 1994
100-101 8 p. 1411-
1 p.
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289 Historical review of compound semiconductor reliability Roesch, William J.
2006
100-101 8 p. 1218-1227
10 p.
artikel
290 HKMG CMOS technology qualification: The PBTI reliability challenge Ioannou, Dimitris P.
2014
100-101 8 p. 1489-1499
11 p.
artikel
291 Hot-carrier-induced time dependent dielectric breakdown in high voltage pMOSFETs Alagi, F.
2011
100-101 8 p. 1283-1288
6 p.
artikel
292 ICMAT 2011 – Reliability and variability of semiconductor devices and ICs Asenov, Asen
2012
100-101 8 p. 1531-
1 p.
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293 IC technology and ASIC design for the Cray J90 supercomputer 1997
100-101 8 p. 1287-
1 p.
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294 2006 IEEE International Integrated Reliability Workshop (IIRW) 2006
100-101 8 p. 1400-
1 p.
artikel
295 Ignorance and uncertainty in reliability reasoning Dohnal, M.
1992
100-101 8 p. 1157-1170
14 p.
artikel
296 Immunity against temperature variability and bias point invariability in double gate tunnel field effect transistor Narang, Rakhi
2012
100-101 8 p. 1617-1620
4 p.
artikel
297 Impact of defect on I(V) instabilities observed on Ti/4H–SiC high voltage Schottky diodes Abdelwahed, N.
2015
100-101 8 p. 1169-1173
5 p.
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298 Impact of gate stack process on conduction and reliability of 0.18 μm PMOSFET Ghidini, G.
2003
100-101 8 p. 1221-1227
7 p.
artikel
299 Impacts of NBTI/PBTI on performance of domino logic circuits with high-k metal-gate devices in nanoscale CMOS Houshmand Kaffashian, Masaoud
2012
100-101 8 p. 1655-1659
5 p.
artikel
300 Impact strength of Sn–3.0Ag–0.5Cu solder bumps during isothermal aging Wang, JianXin
2014
100-101 8 p. 1583-1591
9 p.
artikel
301 Improved low frequency noise characteristics of sub-micron MOSFETs with TaSiN/TiN gate on ALD HfO2 dielectric Devireddy, Siva Prasad
2007
100-101 8 p. 1228-1232
5 p.
artikel
302 Improved yield and performance of ball-grid array packages: design and processing guidelines for uniform and nonuniform arrays 1997
100-101 8 p. 1283-
1 p.
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303 Improving the electrical characteristics of MOS transistors with CeO2/La2O3 stacked gate dielectric Yang, B.L.
2012
100-101 8 p. 1613-1616
4 p.
artikel
304 Including spatial correlations of channel length and threshold voltage variation in circuit simulations Watts, Josef
2012
100-101 8 p. 1571-1574
4 p.
artikel
305 Incomplete ionization in a semiconductor and its implications to device modeling Xiao, G
1999
100-101 8 p. 1299-1303
5 p.
artikel
306 Increased reliability of drypumps due to process related adaptation and prefailure warning 1994
100-101 8 p. 1412-1413
2 p.
artikel
307 Independent control of ion density and ion bombardment energy in a dual RF excitation plasma 1994
100-101 8 p. 1430-
1 p.
artikel
308 Inferring coverage probabilities by optimum 3-stage sampling 1997
100-101 8 p. 1280-
1 p.
artikel
309 Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy Ahmed, Mansur
2010
100-101 8 p. 1134-1141
8 p.
artikel
310 Influence of multi-finger layout on the subthreshold behavior of nanometer MOS transistors Siu, S.-L.
2012
100-101 8 p. 1606-1609
4 p.
artikel
311 Influence of thermal contact resistance on thermal impedance of microelectronic structures Vermeersch, B.
2007
100-101 8 p. 1233-1238
6 p.
artikel
312 Inside front cover - Editorial board 2009
100-101 8 p. IFC-
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313 Inside front cover - Editorial board 2014
100-101 8 p. IFC-
1 p.
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314 Inside front cover - Editorial board 2015
100-101 8 p. IFC-
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315 Inside front cover - Editorial board 2013
100-101 8 p. IFC-
1 p.
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316 Inside front cover - Editorial board 2012
100-101 8 p. IFC-
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317 Inside front cover - Editorial board 2011
100-101 8 p. IFC-
1 p.
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318 Inside front cover - Editorial board 2010
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1 p.
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319 In situ measurement of wafer temperatures in a low pressure chemical vapor deposition furnace 1994
100-101 8 p. 1428-1429
2 p.
artikel
320 Insulated Cu wire free air ball characterization Leong, HungYang
2014
100-101 8 p. 1567-1574
8 p.
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321 Interconnect fabrication processes and the development of low-cost wiring for CMOS products 1997
100-101 8 p. 1285-
1 p.
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322 Interconnect reliability dependence on fast diffusivity paths Ceric, Hajdin
2012
100-101 8 p. 1532-1538
7 p.
artikel
323 Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes Liu, Yang
2015
100-101 8 p. 1234-1240
7 p.
artikel
324 In the memory of Georges Charitat Bafleur, Marise
2002
100-101 8 p. 1153-1154
2 p.
artikel
325 Investigation of defect on copper bond pad surface in copper/low k process integration Zheng, Y.S.
2003
100-101 8 p. 1311-1316
6 p.
artikel
326 Investigation of ESD protection strategy in high voltage Bipolar–CMOS–DMOS process Ma, Fei
2012
100-101 8 p. 1640-1644
5 p.
artikel
327 Investigation of geometry dependence on MOSFET linearity in the impact ionization region using Volterra series Lee, Chie-In
2015
100-101 8 p. 1163-1168
6 p.
artikel
328 Investigation of the reliability of 4H–SiC MOS devices for high temperature applications Le-Huu, Martin
2011
100-101 8 p. 1346-1350
5 p.
artikel
329 Investigation on the effect of annealing process parameters on AuGeNi ohmic contact to n-GaAs using microstructural characteristics Tahamtan, S.
2011
100-101 8 p. 1330-1336
7 p.
artikel
330 Ion implantation and secondary ion mass spectrometry of compound semiconductors 1997
100-101 8 p. 1290-
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331 Ionising radiation effects on MOSFET drain current Cimino, S.
2003
100-101 8 p. 1247-1251
5 p.
artikel
332 Is boundary scan short on fault coverage? 1994
100-101 8 p. 1410-
1 p.
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333 Ka-band InP high electron mobility transistor monolithic microwave integrated circuit reliability Paine, B.M
2001
100-101 8 p. 1115-1122
8 p.
artikel
334 Limiting distributions of the residual lifetimes of several repairable systems Li, Wei
1993
100-101 8 p. 1069-1072
4 p.
artikel
335 Locally delineating of junctions and defects by local cross-section electron-beam-induced-current technique Koyama, T
2001
100-101 8 p. 1243-1253
11 p.
artikel
336 Location of defective cells in HBT power amplifier arrays using IR emission microscopy Dai, Peter
2001
100-101 8 p. 1137-1141
5 p.
artikel
337 Low frequency noise and technology induced mechanical stress in MOSFETs Fantini, Paolo
2007
100-101 8 p. 1218-1221
4 p.
artikel
338 Low gate interface traps AlGaN/GaN HEMTs using a lattice matched ZrZnO transparent gate design Chiu, Hsien-Chin
2013
100-101 8 p. 1130-1136
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artikel
339 Low moisture polymer adhesive for hermetic packages 1994
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340 Low-temperature chemical vapour deposition processes and dielectrics for microelectronic circuit manufacturing at IBM 1997
100-101 8 p. 1285-1286
2 p.
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341 Low-temperature impurity breakdown in semiconductors: an approach towards efficient device simulation 1997
100-101 8 p. 1289-1290
2 p.
artikel
342 Majority carrier mobility in ultra heavily doped n-type Si in the presence of defects and dislocations 1994
100-101 8 p. 1429-
1 p.
artikel
343 Marked graphs and hamiltonian graphs Thirusangu, K.
1997
100-101 8 p. 1243-1250
8 p.
artikel
344 Material property, compatibility, and reliability issues in diamond-enhanced, GaAs-based plastic packages Fabis, Philip M.
1999
100-101 8 p. 1275-1291
17 p.
artikel
345 Mechanical design failure models for buckling 1994
100-101 8 p. 1409-
1 p.
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346 Mechanical problems of novel back contact solar modules Kraemer, Frank
2013
100-101 8 p. 1095-1100
6 p.
artikel
347 Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads Ratchev, Petar
2006
100-101 8 p. 1315-1325
11 p.
artikel
348 Mechanism of pre-annealing effect on electromigration immunity of Al–Cu line Mazumder, M.K
2001
100-101 8 p. 1259-1264
6 p.
artikel
349 Microstructure and elevated-temperature shear strength of Zn–4Al–3Mg–xSn high-temperature lead-free solders Mahmudi, R.
2014
100-101 8 p. 1592-1597
6 p.
artikel
350 Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging Hu, Xiaowu
2014
100-101 8 p. 1575-1582
8 p.
artikel
351 Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling 1997
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1 p.
artikel
352 MIM capacitance variation under electrical stress Besset, C.
2003
100-101 8 p. 1237-1240
4 p.
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353 Mining equipment reliability: A review Dhillon, B.S.
1992
100-101 8 p. 1137-1156
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artikel
354 Mixing 3-V and 5-V ICs 1994
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1 p.
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355 Modeling and analysis of multichip module power supply planes 1997
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2 p.
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356 Modeling and characterization of molding compound properties during cure Jansen, K.M.B.
2009
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5 p.
artikel
357 Modeling narrow-channel effect in VLSI MESA-isolated SOI MOS devices using a quasi-two-dimensional approach 1997
100-101 8 p. 1290-
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358 Modeling of ionizing irradiation influence on Schottky-gate field-effect transistor Demarina, N.V
1999
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359 Modeling of terminal ring structures for high-voltage power MOSFETs Tam, Wing-Shan
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360 Modelling methodology for thermal analysis of hot solder dip process Stoyanov, Stoyan
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361 Modelling, optimization and control of spatial uniformity in manufacturing processes 1994
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362 Modular sensor chip design for package stress evaluation and reliability characterisation Trigg, A.D.
2012
100-101 8 p. 1581-1585
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363 Molecularly derived mesoscale modeling of an epoxy/Cu interface: Interface roughness Iwamoto, Nancy
2013
100-101 8 p. 1101-1110
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364 MOS power transistor model for Electromagnetic Susceptibility analysis Bona, C.
2011
100-101 8 p. 1356-1364
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365 New approximation for parameters of normal distribution using type II-censored sampling Sultan, A.M.
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100-101 8 p. 1169-1171
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366 New insights into the change of voltage acceleration and temperature activation of oxide breakdown Ribes, G.
2003
100-101 8 p. 1211-1214
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367 New nanometer manipulators for surface research 1997
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368 No-flow underfill flip chip assembly––an experimental and modeling analysis Lu, H
2002
100-101 8 p. 1205-1212
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369 Nonparametric estimation of mean time to failure with unknown stochastic censoring Schäbe, Hendrik
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100-101 8 p. 1291-1299
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370 [No title] Ghibaudo, G.
2003
100-101 8 p. 1173-
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371 [No title] Barton, Daniel L
2001
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372 [No title] Williard, Nicholas
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100-101 8 p. 1749-
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373 [No title] Ersland, Peter
2007
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374 [No title] Stojcev, Mile
2007
100-101 8 p. 1308-1309
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375 [No title] Stojcev, Mile
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376 [No title] Jankovic, Nebojsa
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377 [No title] Stojcev, Mile
2006
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378 [No title] Stojcev, Mile
2006
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379 [No title] Ersland, Peter
2006
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380 Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics van der Sluis, O.
2009
100-101 8 p. 853-860
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381 Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling Chen, H.T.
2006
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382 Numerical methods for reliability evaluation of Markov closed fault-tolerant systems 1997
100-101 8 p. 1279-
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383 Observation of the internal waveforms in high-speed high-density LSIs using an EOS prober Hashimoto, Chisato
2001
100-101 8 p. 1203-1209
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384 OFF-state degradation and correlated gate dielectric breakdown in high voltage drain extended transistors: A review Varghese, D.
2014
100-101 8 p. 1477-1488
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385 On a characterization by residual moment Yehia, A.Y.
1993
100-101 8 p. 1127-1132
6 p.
artikel
386 On a general imperfect debugging software reliability growth model Kapur, P.K.
1994
100-101 8 p. 1397-1403
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artikel
387 On a two-dissimilar-unit system with three modes and random check Baohe, Su
1997
100-101 8 p. 1233-1238
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388 On-chip electrostatic discharge protection for CMOS gas sensor systems-on-a-chip (SoC) Salcedo, Javier A.
2006
100-101 8 p. 1285-1294
10 p.
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389 On-chip reliability monitors for measuring circuit degradation Keane, John
2010
100-101 8 p. 1039-1053
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390 On the extraction of the source and drain series resistances of MOSFETs Garcı́a Sánchez, F.J.
1999
100-101 8 p. 1173-1184
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391 On the failure path in shear-tested solder joints Moy, W.H.
2007
100-101 8 p. 1300-1305
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392 On the interval reliability of systems modelled by finite semi-Markov processes Csenki, A.
1994
100-101 8 p. 1319-1335
17 p.
artikel
393 On the optimal design of k-out-of-n:G subsystems 1994
100-101 8 p. 1418-1419
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394 On the role of holes in oxide breakdown mechanism in inverted nMOSFETs Monsieur, F
2003
100-101 8 p. 1199-1202
4 p.
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395 On-wafer measurement of the reverse-recovery time of integrated diodes by Transmission-Line-Pulsing (TLP) Sauter, Martin
2011
100-101 8 p. 1309-1314
6 p.
artikel
396 Operational behaviour and profit function for a bleaching and screening system in the paper industry Kumar, Dinesh
1993
100-101 8 p. 1101-1105
5 p.
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397 Optimal apportionment of reliability and redundancy in series systems under multiple objectives 1994
100-101 8 p. 1417-
1 p.
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398 Optimal configuration of reduntant real-time systems in the face of correlated failure 1997
100-101 8 p. 1281-
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399 Optimal design of parallel-series systems with competing failure modes 1994
100-101 8 p. 1416-
1 p.
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400 Optimal operation of a markovian queueing system with a removable and non-reliable server Wang, Kuo-Hsiung
1995
100-101 8 p. 1131-1136
6 p.
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401 Optimal properties of the Laplace trend test for soft-ware-reliability models 1994
100-101 8 p. 1416-
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artikel
402 Optimal test-times for intermittent faults 1997
100-101 8 p. 1277-
1 p.
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403 Optimization of process parameters for laser soldering of surface mounted devices 1994
100-101 8 p. 1430-
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404 Optimization of SiN X :H films deposited by PECVD for reliability of electronic, microsystems and optical applications Herth, E.
2010
100-101 8 p. 1103-1106
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405 Optimizing force and geometry parameters in design of reduced insertion force connectors 1994
100-101 8 p. 1411-
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406 Optimizing the fabrication process for high performance graphene field effect transistors Wang, Yanjie
2012
100-101 8 p. 1602-1605
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407 Optimum design of sampling plans in electronic industry Sultan, Torky I.
1994
100-101 8 p. 1369-1373
5 p.
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408 Packaging of high-density fiber/laser modules using passive alignment techniques 1994
100-101 8 p. 1430-
1 p.
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409 Particles on surfaces detection, adhesion, and removal G.W.A.D.,
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100-101 8 p. 1195-
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410 Percentiles of pivotal ratios for the MLE of the parameters of a Weibull regression model 1994
100-101 8 p. 1414-
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411 Performance of commercial foundry-level AlGaN/GaN HEMTs after hot electron stressing Poling, B.S.
2015
100-101 8 p. 1187-1191
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artikel
412 Performance properties in thick film silicate dielectric layers using molecular modeling Iwamoto, Nancy
2009
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artikel
413 Performance testing of cellular modems 1994
100-101 8 p. 1426-
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artikel
414 Periodic boundary conditions for the numerical analysis of semiconductor devices 1997
100-101 8 p. 1289-
1 p.
artikel
415 Phenomenon of resist debris formation in electron-beam lithography and its possible application 1997
100-101 8 p. 1290-1291
2 p.
artikel
416 pH sensing reliability of flexible ITO/PET electrodes on EGFETs prepared by a roll-to-roll process Lue, Cheng-En
2012
100-101 8 p. 1651-1654
4 p.
artikel
417 Physical analysis of electromigration damage under non-d.c. conditions Castaño, E.
1993
100-101 8 p. 1189-1198
10 p.
artikel
418 Plasma-enhanced flexible metal–insulator–metal capacitor using high-k ZrO2 film as gate dielectric with improved reliability Chu, Min-Ching
2010
100-101 8 p. 1098-1102
5 p.
artikel
419 Plastic packaging is highly reliable 1997
100-101 8 p. 1286-
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artikel
420 Portable, cordless phone requirements give rise to chip monolithic microfilters 1994
100-101 8 p. 1411-
1 p.
artikel
421 Positron annihilation spectroscopy of vacancy-related defects in semiconductors 1994
100-101 8 p. 1429-
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422 Power Distribution Networks in High Speed Integrated Circuits; Andrey Mezhiba, Eby Friedman. Kluwer Academic Publishers, Boston; 2004. Hardcover, 280pp, plus XXIII, 129 euro. ISBN 1-4020-7534-0 Stojcev, Mile
2004
100-101 8 p. 1277-1278
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423 Power semiconductor devices for the 1990s 1994
100-101 8 p. 1410-1411
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424 Practical methods for reliability data analysis (Oxford statistical science series - 14) G.W.A.D.,
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100-101 8 p. 1196-1197
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425 Pre-breakdown noise in electrically stressed thin SiO2 layers of MOS devices observed with C-AFM Porti, M.
2003
100-101 8 p. 1203-1209
7 p.
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426 Precision flip-chip solder bump interconnects for optical packaging 1994
100-101 8 p. 1424-1425
2 p.
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427 Predicting performability of a fault-tolerant microcomputer for process control 1994
100-101 8 p. 1418-
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428 Prediction of equilibrium shapes and pedestal heights to solder joints for leadless chip components 1997
100-101 8 p. 1276-
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429 Preliminary assessment of the stability of thin- and polymer thick-film resistors embedded into printed wiring boards Stęplewski, Wojciech
2012
100-101 8 p. 1719-1725
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430 Profit analysis of a system with two-units having guarantee periods and delayed operation of standby Gupta, Rakesh
1994
100-101 8 p. 1387-1390
4 p.
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431 Profit analysis of a two-unit priority standby system subject to degradation and random shocks Gupta, Rakesh
1993
100-101 8 p. 1073-1079
7 p.
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432 Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads Lall, Pradeep
2009
100-101 8 p. 825-838
14 p.
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433 Pseudomorphic high electron mobility transistor monolithic microwave integrated circuits reliability study Anderson, W.T
2001
100-101 8 p. 1109-1113
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434 Publications, notices, calls for papers, etc. 1995
100-101 8 p. 1203-1205
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435 Quantifying charging damage in gate oxides of antenna structures for WLR monitoring Smeets, David
2004
100-101 8 p. 1245-1250
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artikel
436 Ramped current stress for fast and reliable wafer level reliability monitoring of thin gate oxide reliability Martin, Andreas
2003
100-101 8 p. 1215-1220
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artikel
437 Real-time soft-error rate measurements: A review Autran, J.L.
2014
100-101 8 p. 1455-1476
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438 Recent fluid–structure interaction modeling challenges in IC encapsulation – A review Khor, C.Y.
2014
100-101 8 p. 1511-1526
16 p.
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439 Recursive estimation of time-dependent reliability Singh, N.
1994
100-101 8 p. 1355-1359
5 p.
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440 Reduction of computations in enumeration of terminal and multiterminal pathsets by the method of indexing Aziz, M.A.
1992
100-101 8 p. 1067-1072
6 p.
artikel
441 Reinforcing effect of coverlayers on the fatigue life of copper-kapton flex cables 1997
100-101 8 p. 1276-
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442 Reliability allocation in a general system with non-identical components—A practical approach Aggarwal, K.K.
1993
100-101 8 p. 1089-1093
5 p.
artikel
443 Reliability analysis of a cold standby system with multiple critical errors Chung, Who Kee
1994
100-101 8 p. 1343-1347
5 p.
artikel
444 Reliability analysis of a M1 x1 /Mx2/G1, G21 Queueing system with a repairable service station Yue, Dequan
1997
100-101 8 p. 1225-1231
7 p.
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445 Reliability analysis of software with JUSE-RASI 1997
100-101 8 p. 1278-1279
2 p.
artikel
446 Reliability and ageing of repairable systems Kurien, K.C.
1993
100-101 8 p. 1095-1100
6 p.
artikel
447 Reliability and availability analysis of a k-out-of-N:G redundant system with repair in the presence of chance of multiple critical errors Chung, Who Kee
1994
100-101 8 p. 1337-1341
5 p.
artikel
448 Reliability and availability analysis of two-unit warm standby microcomputer systems with self-reset function and repair facility Tan, Zhi-Bin
1997
100-101 8 p. 1251-1253
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449 Reliability and performance of a true enhancement mode HIGFET for wireless applications Gaw, Craig
2007
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8 p.
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450 Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies Kangasvieri, T.
2006
100-101 8 p. 1335-1347
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451 Reliability approximation of a Markov queueing system with server breakdown and repair Li, Quan-Lin
1997
100-101 8 p. 1203-1212
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452 Reliability assessment of high lead count TAB package 1994
100-101 8 p. 1422-1423
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453 Reliability bounds for some static system models using lifetime data on their components Sharma, K.K.
1993
100-101 8 p. 1081-1083
3 p.
artikel
454 Reliability design of current stress in LSI interconnects using the estimation of failure rate due to electromigration Hiraoka, Kazunori
1997
100-101 8 p. 1185-1191
7 p.
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455 Reliability/energy trade-off in Bluetooth error control schemes Khodadoustan, Safieh
2011
100-101 8 p. 1398-1412
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456 Reliability evaluation of process models 1997
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457 Reliability investigation and characterization of failure modes in Schottky diodes Somisetty, Shivarajiv
2006
100-101 8 p. 1254-1260
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458 Reliability issues in GaN-based light-emitting diodes: Effect of dc and PWM stress Meneghini, M.
2012
100-101 8 p. 1621-1626
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459 Reliability modeling of soldered interconnections 1994
100-101 8 p. 1412-
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artikel
460 Reliability models of a class of self-healing rings Lee, John
1997
100-101 8 p. 1179-1183
5 p.
artikel
461 Reliability of a space shuttle subject to space erosion Vanderperre, E.J.
1992
100-101 8 p. 1051-1052
2 p.
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462 Reliability of a two-way circular consecutively connected system with multistate components Malinowski, Jacek
1997
100-101 8 p. 1255-1258
4 p.
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463 Reliability of Computer Systems and Networks: Fault Tolerance, Analysis and Design; Martin L. Shooman. John Wiley and Sons Inc., New York; 2002. Hardcover, pp. 528, plus XXII. Stojcev, Mile
2004
100-101 8 p. 1275-1276
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464 Reliability of large periphery GaN-on-Si HFETs Singhal, S.
2006
100-101 8 p. 1247-1253
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465 Reliability of radio frequency/microwave power packages: the effects of component materials and assembly processes Fabis, Philip M
1999
100-101 8 p. 1265-1274
10 p.
artikel
466 Reliability of systems with two failure modes by using structure functions Yuge, Totsushi
1995
100-101 8 p. 1137-1142
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artikel
467 Reliability optimization of analog integrated circuits considering the trade-off between lifetime and area Pan, Xin
2012
100-101 8 p. 1559-1564
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468 Reliability prediction using nondestructive accelerated-degradation data: case study on power supplies 1997
100-101 8 p. 1277-
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artikel
469 Reliability results of HBTs with an InGaP emitter Whitman, Charles S.
2006
100-101 8 p. 1261-1271
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470 Reliability studies of barrier layers for Cu/PAE low-k interconnects Nguyen, H.S.
2006
100-101 8 p. 1309-1314
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471 Reliability testing: Bibliography Dhillon, B.S.
1992
100-101 8 p. 1115-1135
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472 Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses Tsai, Tsung-Yueh
2007
100-101 8 p. 1239-1245
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473 Review. A survey of the present status of vacuum microelectronics 1994
100-101 8 p. 1419-1420
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474 Rework of multi-chip modules: device removal 1994
100-101 8 p. 1410-
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475 RF modeling approach to determining end-of-life reliability for InP-based HBTs Thomas III, S
2001
100-101 8 p. 1129-1135
7 p.
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476 Scanning probe microscopy in semiconductor failure analysis Ebersberger, B
2001
100-101 8 p. 1231-1236
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477 Scanning SQUID microscopy for current imaging Knauss, L.A.
2001
100-101 8 p. 1211-1229
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478 Scanning thermal microscopy studies of local temperature distribution of micron-sized metallization lines Ji, Yuan
2001
100-101 8 p. 1255-1258
4 p.
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479 SCRAP: Sequential circuits reliability analysis program Seyyed Mahdavi, S.J.
2009
100-101 8 p. 924-933
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480 Searching for appropriate humidity accelerated migration reliability tests methods Bojta, P
2002
100-101 8 p. 1213-1218
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481 Selecting the most reliable design under Type-II censored accelerated testing 1994
100-101 8 p. 1418-
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482 Self-alignment of micro-parts using capillary interaction: Unified modeling and misalignment analysis Gao, ShiQing
2013
100-101 8 p. 1137-1148
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483 SEM in situ study on high cyclic fatigue of SnPb-solder joint in the electronic packaging Wang, Xi-Shu
2011
100-101 8 p. 1377-1384
8 p.
artikel
484 Sheet resistance adn layout effects in accelerated tests for dielectric reliability evaluation 1997
100-101 8 p. 1276-
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artikel
485 Short-pulse propagation technique for characterizing resistive package interconnections 1994
100-101 8 p. 1413-
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artikel
486 Shrunken estimators of Weibull shape parameter from Type-II censored samples 1994
100-101 8 p. 1418-
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artikel
487 SIGMA: a VLSI systolic array implementation of a Galois Field [ GF(2)m)] based multiplication and division algorithm 1994
100-101 8 p. 1419-
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artikel
488 Silicides and local interconnections for high-performance VLSI applications 1997
100-101 8 p. 1284-
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489 Silicon micromachining technique for fabricating high temperature superconducting microbolometers 1997
100-101 8 p. 1282-
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490 Silicon oxide conductivity of hydrogen ion implanted polysilicon thin film transistors 1997
100-101 8 p. 1290-
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491 Silver-induced volatile species generation from conductive die attach adhesives 1994
100-101 8 p. 1424-
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492 Simulating IC reliability with emphasis on process-flaw related early failures 1997
100-101 8 p. 1284-
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493 Simulation based analysis of secondary effects on solder fatigue Dudek, Rainer
2009
100-101 8 p. 839-845
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494 Simulation study of Insulated Shallow Extension Silicon On Nothing (ISESON) MOSFET for high temperature applications Kumari, Vandana
2012
100-101 8 p. 1610-1612
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495 Single contact optical beam induced currents Chin, J.M
2001
100-101 8 p. 1237-1242
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496 Single-electron trapping in sub-μm sized MOSFETs 1997
100-101 8 p. 1289-
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artikel
497 Single-quantum well InGaN green light emitting diode degradation under high electrical stress Barton, Daniel L.
1999
100-101 8 p. 1219-1227
9 p.
artikel
498 Small pulsed electron-ion sources for radiation technologies and surface modification of materials 1997
100-101 8 p. 1290-
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499 Society of reliability engineers bulletin Reiche, Hans
1992
100-101 8 p. 1197-1198
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500 Software-reliability growth with a Weibull test-effort: a model and application 1994
100-101 8 p. 1415-
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501 SOI (Silicon-on-insulator)—materials and devices 1997
100-101 8 p. 1290-
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502 Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull Zaal, J.J.M.
2009
100-101 8 p. 846-852
7 p.
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503 Some practical considerations for effective and efficient wafer-level reliability control Tseng, Summer F.C.
2004
100-101 8 p. 1233-1243
11 p.
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504 Spectroscopic photon emission microscopy: a unique tool for failure analysis of microelectronics devices De Wolf, Ingrid
2001
100-101 8 p. 1161-1169
9 p.
artikel
505 Spin coating over topography 1994
100-101 8 p. 1422-
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506 Standards encourage use of ultra-mini connectors for IC cards 1994
100-101 8 p. 1413-
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507 Statistical analysis of the geometric de-eutrophication software-reliability model 1994
100-101 8 p. 1418-
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artikel
508 Statistics of soft and hard breakdown in thin SiO2 gate oxides Suñé, J.
2003
100-101 8 p. 1185-1192
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artikel
509 Stochastic model of k-parallel service channels Sharma, S.D.
1992
100-101 8 p. 1073-1077
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510 Studies on solder bump electromigration in Cu/Sn–3Ag–0.5Cu/Cu system Yamanaka, Kimihiro
2007
100-101 8 p. 1280-1287
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511 Study of dc conduction mechanisms in dysprosium–manganese oxide insulator thin films grown on Si substrates Dakhel, A.A.
2006
100-101 8 p. 1303-1308
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512 Study of the effect of reflow time and temperature on Cu–Sn intermetallic compound layer reliability Huang, Wei
2002
100-101 8 p. 1229-1234
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513 Sub-threshold behavior of long channel undoped cylindrical surrounding-gate MOSFETs Bian, Wei
2009
100-101 8 p. 897-903
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514 Suggested procedure for preventive maintenance policy El-Damcese, M.A.
1997
100-101 8 p. 1173-1177
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515 Switching times variation of power MOSFET devices after electrical stress Habchi, R.
2007
100-101 8 p. 1296-1299
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516 Synthesis and characterization of sub-micron sized copper–ruthenium–tantalum composites for interconnection application Sule, R.
2012
100-101 8 p. 1690-1698
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517 Systematic design of phase-shifting masks with extended depth of focus and/or shifted focus plane 1994
100-101 8 p. 1421-
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518 System-level design optimization of reliable and low power multiprocessor system-on-chip Shafik, Rishad A.
2012
100-101 8 p. 1735-1748
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519 System-on-package: a broad perspective from system design to technology development Zheng, Li-Rong
2003
100-101 8 p. 1339-1348
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520 Temperature behavior and modeling of ohmic contacts to Si+ implanted n-type GaN Pérez-Tomás, A.
2011
100-101 8 p. 1325-1329
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521 Temperature dependence of the interface state distribution due to hot carrier effect in FinFET device Ma, Chenyue
2010
100-101 8 p. 1077-1080
4 p.
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522 Temperature dependent model for threshold voltage and subthreshold slope of strained-Si channel MOSFETs with a polysilicon gate Biswas, Abhijit
2014
100-101 8 p. 1527-1533
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523 Testing process performance based on the yield: an application to the liquid-crystal display module Chen, Jann-Pygn
2002
100-101 8 p. 1235-1241
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524 Testing the effects of temperature cycling on tantalum capacitors Virkki, J.
2010
100-101 8 p. 1121-1124
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525 The analysis of a three-phase queueing servicing system with renewable servers Mokaddis, G.S.
1992
100-101 8 p. 1091-1104
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526 The coupling effects of temperature, electric current and stress on the adhesion and electrical properties of COG assembly Gao, Hong
2014
100-101 8 p. 1603-1612
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527 The damped dynamics of printed circuit board and analysis of distorted and deformed half-sine excitation Wong, E.H.
2009
100-101 8 p. 916-923
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528 The device characteristics of missing LDD implantation via nanoprobing techniques for localized failure analysis Lai, LiLung
2015
100-101 8 p. 1144-1151
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529 The effect of fan-reliability and cooling-performance on electronic-chassis reliability 1994
100-101 8 p. 1421-
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530 The effect of tin grain structure on whisker growth Yu, Cheng-Fu
2010
100-101 8 p. 1146-1151
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100-101 8 p. 1429-
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532 The evolution of interconnection technology at IBM 1997
100-101 8 p. 1282-1283
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533 The impact of workload on the reliability of real-time processor triads Krishna, C.M.
1993
100-101 8 p. 1169-1178
10 p.
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534 The influence of Sn–Cu–Ni(Au) and Sn–Au intermetallic compounds on the solder joint reliability of flip chips on low temperature co-fired ceramic substrates Duan, N.
2003
100-101 8 p. 1317-1327
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535 The inventory replenishment problem with a linear trend in demand 1994
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543 The transition from a two-dimensional to a zero-dimensional electron system on silicon 1994
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545 Thin RF sputtered and thermal Ta2O5 on Si for high density DRAM application Atanassova, E
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546 11th International Symposium on Silicon-on-Insulator Technology and Devices 2002
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547 Three-phase queueing servicing system with renewable servers Metwally, S.A.
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552 Transport of moisture at epoxy–SiO2 interfaces investigated by molecular modeling Hölck, O.
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553 Trend transformation of drain-current degradation under drain-avalanche hot-carrier stress for CLC n-TFTs Hsieh, Zhen-Ying
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554 Tutorial: Electrolytic models for metallic electromigration failure mechanisms 1997
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555 Two effective methods to mitigate soft error effects in SRAM-based FPGAs Rohani, Alireza
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556 Two new replacement policies 1994
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557 Two unit redundant system with adjustable failure rate, critical human error (CHE) and inspection Agnihotri, R.K.
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558 Ultra-high-density interconnection technology of three-dimensional packaging Takahashi, Kenji
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559 Ultra-miniature chip inductors for communications equipment down-sizing requirements 1994
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560 Use of cooperating expert systems for real-time fault detection and correction in a manufacturing cell 1994
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561 Use of failure-intensity models in the software-validation phase for telecommunications 1997
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562 Using formal methods in a design for reliability as applied to an electronic system that integrates software and hardware to perform a function Gwandu, B.A.L.
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565 VLSI on-chip interconnection performance simulations and measurements 1997
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570 Wire bonding—toward 6-σ yield and fine pitch 1994
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571 Workload and temperature dependent evaluation of BTI-induced lifetime degradation in digital circuits Eghbalkhah, Behzad
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572 World abstracts on microelectronics and reliability 1995
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