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                             3078 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayes approach to simultaneous evaluation of similar assemblies 1990
100-101 6 p. 1202-
1 p.
artikel
2 A Bayesian approach to parameter and reliability estimation in the Poisson distribution 1972
100-101 6 p. 472-
1 p.
artikel
3 A Bayesian estimate of reliability in the Weibull distribution 1974
100-101 6 p. 442-
1 p.
artikel
4 A Bayesian reliability model with a stochastically memotone failure rate 1974
100-101 6 p. 445-
1 p.
artikel
5 A 6-bit monolithic video flash converter Lonsborough, M.
1981
100-101 6 p. 837-850
14 p.
artikel
6 A bonding-wire failure mode in plastic encaponlated integrated circuits 1973
100-101 6 p. 494-
1 p.
artikel
7 A case for large Auger recombination cross sections associated with deep centers in semiconductors 1978
100-101 6 p. 566-
1 p.
artikel
8 Accelerated life test calculations using the method of maximum likelihood: an improvement over least squares Whitman, Charles S.
2003
100-101 6 p. 859-864
6 p.
artikel
9 Accelerated life testing for LSI failure mechanisms 1978
100-101 6 p. 476-
1 p.
artikel
10 Accelerated life testing of small-geometry printed circuit boards 1985
100-101 6 p. 1161-
1 p.
artikel
11 Accelerated life testing of thick-film resistors 1972
100-101 6 p. 484-
1 p.
artikel
12 Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages 1978
100-101 6 p. 476-
1 p.
artikel
13 Accelerated testing in FAMOS Devices—8K EPROM 1978
100-101 6 p. 478-
1 p.
artikel
14 Accelerated versus real time aging tests 1980
100-101 6 p. 905-
1 p.
artikel
15 Acceleration factors for environmental testing of integrated circuits 1971
100-101 6 p. 412-
1 p.
artikel
16 Acceleration of the growth of Cu3Sn voids in solder joints Borgesen, Peter
2012
100-101 6 p. 1121-1127
7 p.
artikel
17 Accuracy of univariate, bivariate and a “modified double Monte Carlo” technique for finding lower confidence limits of system reliability 1983
100-101 6 p. 1174-
1 p.
artikel
18 Accurate IC logic delay measurements 1972
100-101 6 p. 482-
1 p.
artikel
19 A charge-sheet model of the MOSFET 1978
100-101 6 p. 564-
1 p.
artikel
20 Achieving high reliability in sonar power supplies 1980
100-101 6 p. 902-
1 p.
artikel
21 A circuit for high-speed carry propagation in I.S.I.-F.E.T. technology 1976
100-101 6 p. 527-
1 p.
artikel
22 A classification system for reliability models 1985
100-101 6 p. 1163-
1 p.
artikel
23 A class of distributions useful in life testing and reliability 1977
100-101 6 p. 646-
1 p.
artikel
24 A CMOS LSSD test generation system 1985
100-101 6 p. 1159-1160
2 p.
artikel
25 A combined digital and linear custom designed array optimised for large volume consumer applications Tero, J.
1981
100-101 6 p. 769-773
5 p.
artikel
26 A common cause failure availability model Dhillon, Balbir S.
1978
100-101 6 p. 583-584
2 p.
artikel
27 A comparative evaluation of IC packages in commercial real-time computer terminals 1976
100-101 6 p. 520-
1 p.
artikel
28 A comparison of methods for analyzing censored life data to estimate relationships between and product life 1974
100-101 6 p. 442-
1 p.
artikel
29 A complex system having four types of components with pre-emptive repeat priority repairs Singh, I.P.
1989
100-101 6 p. 959-962
4 p.
artikel
30 A complex three-unit system 1985
100-101 6 p. 1162-
1 p.
artikel
31 A comprehensive model for PMOS NBTI degradation: Recent progress Alam, M.A.
2007
100-101 6 p. 853-862
10 p.
artikel
32 A computational technique for maximum likelihood estimation with Weibull models 1980
100-101 6 p. 906-
1 p.
artikel
33 A computer program for evaluation of system reliability 1972
100-101 6 p. 478-
1 p.
artikel
34 A contribution to the current gain temperature dependence of bipolar transistors 1978
100-101 6 p. 566-
1 p.
artikel
35 A cost model for skip-lot destructive sampling 1977
100-101 6 p. 644-
1 p.
artikel
36 Acoustic microscopy improves internal reliability of IC packaging 1985
100-101 6 p. 1159-
1 p.
artikel
37 A creep-rupture model for two-phase eutectic solders 1989
100-101 6 p. 1094-
1 p.
artikel
38 A critical evaluation of RGA testing 1990
100-101 6 p. 1205-
1 p.
artikel
39 Active filters: new tools for separating frequencies 1971
100-101 6 p. 417-
1 p.
artikel
40 Active trimming of hybrid integrated circuits 1984
100-101 6 p. 1105-1106
2 p.
artikel
41 A current conduction mechanism in laser recrystallized silicon metal-oxide-semiconductor transistors 1984
100-101 6 p. 1106-1107
2 p.
artikel
42 A current pulse screening test for metal step coverage 1973
100-101 6 p. 499-
1 p.
artikel
43 A cutset approach to reliability evaluation in communication networks 1983
100-101 6 p. 1173-
1 p.
artikel
44 A cyclic queueing system with three servers and optional two-way feedback Madan, K.C.
1988
100-101 6 p. 873-875
3 p.
artikel
45 A damage integral approach to thermal fatigue of solder joints 1990
100-101 6 p. 1200-
1 p.
artikel
46 Adaption aux ensembles des condensateurs a dielectrique polypropylene metallise 1978
100-101 6 p. 560-
1 p.
artikel
47 Adaptive fault-tolerant DVFS with dynamic online AVF prediction Firouzi, Farshad
2012
100-101 6 p. 1197-1208
12 p.
artikel
48 Adaptive probability distribution estimation based upon maximum entropy 1985
100-101 6 p. 1164-
1 p.
artikel
49 A data base management (DBMP) program for integrated logistics support (ILS) 1976
100-101 6 p. 524-
1 p.
artikel
50 A datebase design for automated RAM analysis 1987
100-101 6 p. 1028-
1 p.
artikel
51 Adding intelligence to the proper/handler-tester interface 1986
100-101 6 p. 1194-
1 p.
artikel
52 Addressing, packaging and assembly weaknesses 1985
100-101 6 p. 1168-
1 p.
artikel
53 A definition of probability for reliability prediction 1974
100-101 6 p. 444-
1 p.
artikel
54 A delta-star transformation approach for reliability evaluation 1978
100-101 6 p. 480-
1 p.
artikel
55 A design method for field service centres 1985
100-101 6 p. 1163-
1 p.
artikel
56 A design-sensitive maintainability-prediction technique 1972
100-101 6 p. 475-
1 p.
artikel
57 Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation Zhang, Wenjing
2012
100-101 6 p. 1157-1164
8 p.
artikel
58 A distributed algorithm for fault simulation of combinatorial and asynchronous sequential digital designs, utilizing circuit partitioning, on loosely-coupled parallel processors Ghosh, Sumit
1995
100-101 6 p. 947-967
21 p.
artikel
59 Advanced dielectric isolation through selective epitaxial growth techniques 1986
100-101 6 p. 1197-
1 p.
artikel
60 Advanced electron-beam lithography for 0.5 μm to 0.25 μm device fabrication 1989
100-101 6 p. 1103-
1 p.
artikel
61 Advances in automated wire and die bonding 1983
100-101 6 p. 1181-
1 p.
artikel
62 Advances in c.c.d. scanners with on-chip signal processing for electronic imaging 1980
100-101 6 p. 912-
1 p.
artikel
63 Advances in ceramic chip carriers and multilayer substrate technologies 1978
100-101 6 p. 482-
1 p.
artikel
64 Advances in customization free VLSI system designers 1983
100-101 6 p. 1182-
1 p.
artikel
65 Advances in GaAs LSI/VLSI processing technology 1980
100-101 6 p. 911-
1 p.
artikel
66 Advances in laser assisted semiconductor processing 1987
100-101 6 p. 1039-
1 p.
artikel
67 Advances in low cost silver-containing thick film conductors 1982
100-101 6 p. 1194-
1 p.
artikel
68 Advances in metalizations technology 1986
100-101 6 p. 1193-
1 p.
artikel
69 Advances in wafer process control 1980
100-101 6 p. 909-
1 p.
artikel
70 Advances in wire bonding technology for high lead count, high-density devices 1989
100-101 6 p. 1100-
1 p.
artikel
71 Advantage of further scaling in gate dielectrics below 0.5nm of equivalent oxide thickness with La2O3 gate dielectrics Kakushima, K.
2010
100-101 6 p. 790-793
4 p.
artikel
72 AES sputter depth profiling of Cr/Ni multilayers using Ar+, O2 + and N2 + ions 1990
100-101 6 p. 1209-
1 p.
artikel
73 A European program on wafer scale integration 1989
100-101 6 p. 1100-
1 p.
artikel
74 A field study of connector reliability 1985
100-101 6 p. 1160-
1 p.
artikel
75 A flip chip interconnection and packaging system 1970
100-101 6 p. 456-
1 p.
artikel
76 AFTP fault tree analysis program 1985
100-101 6 p. 1163-
1 p.
artikel
77 A further study on the microstructure of glass-bonded Ag thick-film conductors 1985
100-101 6 p. 1173-
1 p.
artikel
78 A GaAs MESFET sample and hold switch 1980
100-101 6 p. 910-
1 p.
artikel
79 A 2000 gate 10 n sec uncommitted logic array for telecommunications and computer applications Dean, A.
1981
100-101 6 p. 779-782
4 p.
artikel
80 A generalized computer program for the estimation of the optimum number of trials for establishing a systems reliability 1980
100-101 6 p. 902-
1 p.
artikel
81 A general-purpose memory reliability simulator 1984
100-101 6 p. 1097-
1 p.
artikel
82 A general software reliability model for performance prediction 1982
100-101 6 p. 1186-
1 p.
artikel
83 Age replacement policies for Weibull failure times 1980
100-101 6 p. 900-
1 p.
artikel
84 Aging of highly N-doped α-Ta thin-film capacitors 1978
100-101 6 p. 484-
1 p.
artikel
85 A go-not-go reliability assessment procedure—“HI-FMECA” 1978
100-101 6 p. 479-
1 p.
artikel
86 A graphical method applicable to age-replacement problems 1983
100-101 6 p. 1174-
1 p.
artikel
87 A guidebook for software reliability assessment 1980
100-101 6 p. 900-
1 p.
artikel
88 A hermetically sealed 20-GHz integrated mixer 1974
100-101 6 p. 451-452
2 p.
artikel
89 A heuristic algorithm for system failure frequency 1982
100-101 6 p. 1188-
1 p.
artikel
90 A heuristic method to upgrade system availability for hot or cold standby and voting systems 1986
100-101 6 p. 1190-
1 p.
artikel
91 A high frequency microcircuit packaging and interconnection system 1974
100-101 6 p. 447-
1 p.
artikel
92 A high-performance 16-bit bipolar microprocessor — The Am 29116 Harmon Jr., William J.
1981
100-101 6 p. 851-869
19 p.
artikel
93 A high speed 64 × 4 bit 100K-compatible ECL-RAM with 6 NS access time 1980
100-101 6 p. 908-
1 p.
artikel
94 A high speed multiplier using subnanosecond bipolar VLSI technologies 1980
100-101 6 p. 908-
1 p.
artikel
95 A hybrid thin-film radiosonde transmitter 1971
100-101 6 p. 419-
1 p.
artikel
96 Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part 1 1984
100-101 6 p. 1105-
1 p.
artikel
97 Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part II 1984
100-101 6 p. 1105-
1 p.
artikel
98 Airflow controller improves photoresist spin/coat uniformity 1987
100-101 6 p. 1037-
1 p.
artikel
99 Air through hollow cards cools high-power LSI 1974
100-101 6 p. 447-
1 p.
artikel
100 A-k-out-of-N:G redundant system with cold standby units and common-cause failures 1985
100-101 6 p. 1165-
1 p.
artikel
101 A K-out-of-N:G three-state unit redundant system with common-cause failures and replacements 1982
100-101 6 p. 1187-
1 p.
artikel
102 Algorithmic trimming on active circuitry 1974
100-101 6 p. 453-
1 p.
artikel
103 Algorithms for strict consecutive-k-out-of-n:F systems 1987
100-101 6 p. 1035-
1 p.
artikel
104 A life cycle costing methodology for the assessment of process heat generation by solar energy Sherie, Yosef S.
1983
100-101 6 p. 1069-1074
6 p.
artikel
105 Alignment signals for electron beam lithography 1984
100-101 6 p. 1106-
1 p.
artikel
106 Allocation of man-machine reliability 1976
100-101 6 p. 522-
1 p.
artikel
107 Alloyed thick-film gold conductor for high reliability high-yield wire bonding 1980
100-101 6 p. 916-
1 p.
artikel
108 A low cost lead frame technology for automated laser packaging 1987
100-101 6 p. 1040-
1 p.
artikel
109 A lower bound for system availability computation 1987
100-101 6 p. 1031-
1 p.
artikel
110 A low-noise integrated s.-band amplifier 1974
100-101 6 p. 448-
1 p.
artikel
111 Alternating space-charge-limited currents in hydrogenated amorphous silicon 1983
100-101 6 p. 1183-
1 p.
artikel
112 Alternative methods for determining chip inductor parameters 1978
100-101 6 p. 568-
1 p.
artikel
113 Alternative schemes for utility services to semiconductor process equipment 1986
100-101 6 p. 1196-
1 p.
artikel
114 Aluminium alloy as an interconnecting material in the fabrication of integrated circuits 1980
100-101 6 p. 911-
1 p.
artikel
115 Aluminum alloy bonding wires in corrosive environments 1987
100-101 6 p. 1036-
1 p.
artikel
116 Aluminum collector electrodes formed by the plasma spraying method for electric double-layer capacitors 1989
100-101 6 p. 1095-
1 p.
artikel
117 Aluminum corrosion at pad bond in the humidity tests 1989
100-101 6 p. 1094-
1 p.
artikel
118 Aluminum plasma etch considerations for VLSI production 1982
100-101 6 p. 1191-
1 p.
artikel
119 Aluminum-silicon OHMIC contact on “shallow” n + /p junctions 1980
100-101 6 p. 913-
1 p.
artikel
120 Aluminum-SOS Schottky diodes 1978
100-101 6 p. 564-
1 p.
artikel
121 A Markov approach to wear-out modelling 1983
100-101 6 p. 1174-1175
2 p.
artikel
122 A mass production of thick-film car voltage regulators 1978
100-101 6 p. 568-
1 p.
artikel
123 A mechanism of evaluation in MAOS systems 1971
100-101 6 p. 421-
1 p.
artikel
124 A melting model for pulsed laser heating of silicon 1985
100-101 6 p. 1171-
1 p.
artikel
125 A MEMS-based wireless multisensor module for environmental monitoring Hautefeuille, Mathieu
2008
100-101 6 p. 906-910
5 p.
artikel
126 A merger of CAD and CAT is breaking the VLSI test bottleneck 1984
100-101 6 p. 1097-
1 p.
artikel
127 A method for the splash-free evaporation of aluminium and other metals 1978
100-101 6 p. 568-
1 p.
artikel
128 A method of predicting availability characteristics of series-parallel systems 1985
100-101 6 p. 1164-
1 p.
artikel
129 A method of rapid Markov reliability calculation 1986
100-101 6 p. 1192-
1 p.
artikel
130 A method to test whether a system is near failure Nakashima, Kyoichi
1990
100-101 6 p. 1049-1054
6 p.
artikel
131 A 70 MHz static shift register with high integration density Kasperkovitz, D.
1972
100-101 6 p. 493-496
4 p.
artikel
132 A microelectronic analog to digital converter 1974
100-101 6 p. 448-
1 p.
artikel
133 A microprocessor-controlled mask inspection and repair system 1976
100-101 6 p. 527-
1 p.
artikel
134 A miniature FM telemetry device using thick-film circuitry 1971
100-101 6 p. 420-
1 p.
artikel
135 Ammonium persulfate as a stripping and cleaning oxidant 1984
100-101 6 p. 1100-
1 p.
artikel
136 A model for an estimation of the product warranty return rate 1977
100-101 6 p. 648-649
2 p.
artikel
137 A model for system reliability with common-cause failures 1990
100-101 6 p. 1202-
1 p.
artikel
138 A model for the critical voltage for electrical degradation of GaN high electron mobility transistors Joh, Jungwoo
2010
100-101 6 p. 767-773
7 p.
artikel
139 A model for the prediction of assembly, rework and test yields 1983
100-101 6 p. 1176-
1 p.
artikel
140 A modeling technique for characterizing ion-implanted material using C-V and DLTS data 1984
100-101 6 p. 1108-
1 p.
artikel
141 A model of substrate surface roughness effect on the electrical properties of thin films 1987
100-101 6 p. 1038-
1 p.
artikel
142 A model to quantify reliability of human performance in man-machine systems 1978
100-101 6 p. 559-
1 p.
artikel
143 A modification of Bayesian approach in nuclear plant data analysis Wang, Qun
1991
100-101 6 p. 1137-1141
5 p.
artikel
144 A modification to fault tree “AND” gate Dhillon, Balbir S.
1976
100-101 6 p. 625-626
2 p.
artikel
145 A modified block replacement with two variables 1983
100-101 6 p. 1176-
1 p.
artikel
146 A moisture protection screening test for hybrid circuit encapsulants 1982
100-101 6 p. 1196-
1 p.
artikel
147 A moment approach to evaluation and optimization of complex system reliability 1978
100-101 6 p. 478-
1 p.
artikel
148 Amorphous-silicon devices start to shape up 1983
100-101 6 p. 1184-
1 p.
artikel
149 An abstract language for specifying Markov reliability models 1987
100-101 6 p. 1033-
1 p.
artikel
150 An acceptance-rectification sampling plan for maximising expected monetary return 1976
100-101 6 p. 521-
1 p.
artikel
151 An age replacement policy with minimal repair cost limit 1987
100-101 6 p. 1030-
1 p.
artikel
152 An algorithm for direct computation in consecutive-k-out-of-n:F systems 1987
100-101 6 p. 1033-
1 p.
artikel
153 An algorithm for exact fault-tree probabilities without cut sets 1987
100-101 6 p. 1032-
1 p.
artikel
154 An algorithm for reducing cut sets in fault-tree analysis 1987
100-101 6 p. 1029-
1 p.
artikel
155 An algorithm for the placement of large scale integrated circuit elements 1970
100-101 6 p. 459-
1 p.
artikel
156 An algorithm for the reliability evaluation of redundant networks 1971
100-101 6 p. 415-
1 p.
artikel
157 An algorithmic approach to increased reliability through standby redundancy 1990
100-101 6 p. 1203-
1 p.
artikel
158 Analog modeling simulates the faults of electromechanical components 1983
100-101 6 p. 1169-
1 p.
artikel
159 Analogue sampling ICs in data acquisition systems 1980
100-101 6 p. 913-
1 p.
artikel
160 Analogue-signal commutation using MOS ICs 1972
100-101 6 p. 482-
1 p.
artikel
161 An alternative approach towards the design of control units 1985
100-101 6 p. 1169-
1 p.
artikel
162 An alternative approach towards the design of control units Jain, Rajiv
1984
100-101 6 p. 1009-1012
4 p.
artikel
163 Analyse de la composition des surfaces et des couches minces par diffusion d'ions de brasse energie 1977
100-101 6 p. 657-
1 p.
artikel
164 Analysis and improvement of a static shift register Kasperkovitz, D.
1974
100-101 6 p. 501-512
12 p.
artikel
165 Analysis of a hot-standby system with 2 identical, dependent units and a general Erlang failure time distribution 1982
100-101 6 p. 1185-
1 p.
artikel
166 Analysis of a k-out-of-n unit system with two types of failure and preventive maintenance 1985
100-101 6 p. 1166-
1 p.
artikel
167 Analysis of a repairable 2-unit parallel redundant system with dependent failures 1987
100-101 6 p. 1030-
1 p.
artikel
168 Analysis of a standby system with Rayleigh down time and gamma failure time distributions Gupta, Rakesh
1993
100-101 6 p. 793-796
4 p.
artikel
169 Analysis of a two-unit cold standby system with three modes Goel, L.R.
1983
100-101 6 p. 1041-1044
4 p.
artikel
170 Analysis of a two-unit hot standby system with three modes Goel, L.R.
1983
100-101 6 p. 1029-1033
5 p.
artikel
171 Analysis of a two-unit parallel redundant system with phase type failure and general repair 1982
100-101 6 p. 1187-
1 p.
artikel
172 Analysis of a two unit standby system with partial failure and two types of repairs 1985
100-101 6 p. 1166-
1 p.
artikel
173 Analysis of causes of failure in soldering 1972
100-101 6 p. 480-
1 p.
artikel
174 Analysis of dielectric breakdown in CoFeB/MgO/CoFeB magnetic tunnel junction Khan, Ayaz Arif
2015
100-101 6 p. 894-902
9 p.
artikel
175 Analysis of distribution of boron and phosphorus concentration in poly Si-SiO2-Si 1985
100-101 6 p. 1172-
1 p.
artikel
176 Analysis of electrical overstress failures 1973
100-101 6 p. 491-
1 p.
artikel
177 Analysis of integrated circuit failure modes and failure mechanisms derived from high temperature operating life tests 1973
100-101 6 p. 495-
1 p.
artikel
178 Analysis of reliability and optimization of ESD protection devices supported by modeling and simulation Chvala, A.
2012
100-101 6 p. 1031-1038
8 p.
artikel
179 Analysis of surface and bulk impurities in silicon single crystal slices by neutron activation 1970
100-101 6 p. 463-
1 p.
artikel
180 Analysis of systems subject to inspection and repair: a state-of-the-art survey 1985
100-101 6 p. 1167-
1 p.
artikel
181 Analysis of the development of large area surface topography during ion etching 1990
100-101 6 p. 1210-
1 p.
artikel
182 Analysis of the interaction of an electron beam with a solar cell—I 1978
100-101 6 p. 485-
1 p.
artikel
183 Analysis of the interaction of an electron beam with solar cell—II 1978
100-101 6 p. 485-
1 p.
artikel
184 Analysis of the reservoir effect on electromigration reliability Jeon, Insu
2004
100-101 6 p. 917-928
12 p.
artikel
185 Analysis of thermal cycle fatigue damage in microsocket solder joints 1982
100-101 6 p. 1189-
1 p.
artikel
186 Analysis of thin film fire sensors 1984
100-101 6 p. 1105-
1 p.
artikel
187 Analytical approximations for diffused junctions under high-level conditions 1976
100-101 6 p. 530-
1 p.
artikel
188 Analytical evaluation of reliability models for multiplex systems El-Damcese, M.A.
1995
100-101 6 p. 981-983
3 p.
artikel
189 Analytical i.g.f.e.t. model including drift and diffusion currents 1978
100-101 6 p. 565-
1 p.
artikel
190 Analytical solutions for the breakdown voltage of abrupt cylindrical and spherical junctions 1976
100-101 6 p. 529-
1 p.
artikel
191 Analytical spares screening evaluation technique (ASSET) 1987
100-101 6 p. 1033-1034
2 p.
artikel
192 Analytical techniques for electronic materials—A comparative evaluation 1978
100-101 6 p. 476-
1 p.
artikel
193 Analyzing and interpreting field failure data 1970
100-101 6 p. 453-
1 p.
artikel
194 Analyzing the effect of permanent, intermittent and transient faults on a gracefully degrading microcomputer Constantinescu, Cristian
1992
100-101 6 p. 861-866
6 p.
artikel
195 An analysis of MIL-STD-471 test methods 1980
100-101 6 p. 903-
1 p.
artikel
196 An analytical model for the MISIS structure in SOI MOS devices 1990
100-101 6 p. 1207-
1 p.
artikel
197 An analytic and accurate model for the threshold voltage of short channel MOSFETs in VLSI 1985
100-101 6 p. 1171-
1 p.
artikel
198 An analytic method for uncertainty analysis of nonlinear output functions, with applications to fault-tree analysis 1983
100-101 6 p. 1173-
1 p.
artikel
199 An application of spectroscopic emission microscopy and cathodoluminescence to the failure analysis of near-infrared light emitting diodes Pey, K.L.
1995
100-101 6 p. 935-946
12 p.
artikel
200 An application of the STD process to hybrid microelectronics 1971
100-101 6 p. 417-
1 p.
artikel
201 An approach of numerical multi-objective optimization in stacked packaging Dowhań, Łukasz
2008
100-101 6 p. 851-857
7 p.
artikel
202 An approach to ensure stability of precision laser trimmed thick film resistors 1983
100-101 6 p. 1185-
1 p.
artikel
203 An approximate solution for electrolyte concentration distribution in physics-based lithium-ion cell models Luo, Weilin
2013
100-101 6 p. 797-804
8 p.
artikel
204 Anatomy of a clean room robot 1985
100-101 6 p. 1169-1170
2 p.
artikel
205 8- and 16-bit processors round out high-level C-MOS architecture options 1984
100-101 6 p. 1103-
1 p.
artikel
206 An efficient algorithm for drilling printed circuit boards 1990
100-101 6 p. 1201-
1 p.
artikel
207 An efficient approach to the measurement and characterization of MOSFET capacitances Sadowski, M
2000
100-101 6 p. 1045-1049
5 p.
artikel
208 An efficient method for reliability evaluation of a general network 1978
100-101 6 p. 479-
1 p.
artikel
209 An efficient simple algorithm for fault tree automatic synthesis from the reliability graph 1978
100-101 6 p. 479-
1 p.
artikel
210 An elementary guide to reliability. 4th edition Manfield, Henry G.
1991
100-101 6 p. 1285-1286
2 p.
artikel
211 An elusive open-circuit failure mode in thin-film chip resistors 1973
100-101 6 p. 494-
1 p.
artikel
212 An empirically developed Fourier series model for describing software failures 1985
100-101 6 p. 1164-1165
2 p.
artikel
213 An ensemble model for predicting the remaining useful performance of lithium-ion batteries Xing, Yinjiao
2013
100-101 6 p. 811-820
10 p.
artikel
214 An error analysis for reliability quantification 1983
100-101 6 p. 1171-
1 p.
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215 An error detection model for application during software development 1982
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216 A new air film technique for low contact handling of silicon wafers 1980
100-101 6 p. 911-
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217 A new algorithm for the reliability analysis of multi-terminal networks 1982
100-101 6 p. 1187-1188
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218 A new algorithm for the reliability evaluation of computer-communication network Xu, Wenxin
1986
100-101 6 p. 1013-1017
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219 A new approach for network reliability analysis 1983
100-101 6 p. 1177-
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220 A new approach to the dynamic thermal modelling of semiconductor packages Masana, F.N
2001
100-101 6 p. 901-912
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221 A new assurance technology for computer software 1976
100-101 6 p. 524-
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222 A new complementary bipolar transistor structure 1973
100-101 6 p. 500-
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223 A new electrostatic discharge failure mode 1978
100-101 6 p. 483-
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224 A new empirical distribution for the uncertainty analysis of the top event of a fault tree Kulkarni, Rajaram N.
1990
100-101 6 p. 1055-1059
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225 A new estimation approach based on periodic inspection 1990
100-101 6 p. 1202-
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226 A new finite element approach to stress analysis in microfabrication technology Mijalković, Slobodan
2001
100-101 6 p. 837-845
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227 A new heuristic approach for redundancy optimization problem 1985
100-101 6 p. 1167-
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228 A new heuristic approach for redundancy optimization problem Murty, V.Dakshina
1984
100-101 6 p. 1013-1017
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229 A new mathematical model for semiconductor-on-insulator structures 1990
100-101 6 p. 1207-
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230 A new method for reliability evaluation of composite power systems Patra, Susanta
1994
100-101 6 p. 983-998
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231 A new method for reliability optimization Gopal, Krishna
1978
100-101 6 p. 605-608
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232 A new method of studying on the dynamic parameters of bulk traps in thin SiO2 layer of MOS structures Bing, Xie
2000
100-101 6 p. 1039-1043
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233 A new model of software reliability prediction Govil, K.K.
1983
100-101 6 p. 1009-1010
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234 A new moisture sensor for in situ monitoring of sealed packages 1978
100-101 6 p. 563-
1 p.
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235 A new multichip module using a copper polyimide multilayer substrate 1990
100-101 6 p. 1206-
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236 A new package-related failure mechanism for leadless ceramic chip carriers (LC-3s) solder-attached to Alumina substrates 1983
100-101 6 p. 1169-1170
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237 A new photoimageable platinum conductor Achmatowicz, Selim
2009
100-101 6 p. 579-584
6 p.
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238 A new physical mechanism for soft errors in dynamic memories 1978
100-101 6 p. 480-
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239 A new R & M measure and its estimation 1989
100-101 6 p. 1096-
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240 A new simple algorithm for enumerating all minimal paths and cuts of a graph Shen, Yuanlong
1995
100-101 6 p. 973-976
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241 A new simplified method to measure moisture in micro enclosures 1974
100-101 6 p. 443-
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242 A new static shift register with dynamic transfer 1973
100-101 6 p. 499-
1 p.
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243 A new technique for the evaluation of the temperatures arising from some geometries which commonly occur in microelectronics 1982
100-101 6 p. 1192-
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244 A new technique in the global reliability of cyclic communications network Sjogren, Jon A.
1989
100-101 6 p. 1069-1086
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245 A new technique of cancelation of the MOSFET leakage currents and parasitic capacitances El-Hennawy, Adel E.
1994
100-101 6 p. 1039-1045
7 p.
artikel
246 A new ultra low power ULA and its application 1980
100-101 6 p. 912-
1 p.
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247 An experimental approach to vapor phase reflow solder assembly 1984
100-101 6 p. 1105-
1 p.
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248 An experimental evaluation of thermal performance of DIPs on expoxy metal vs. epoxy glass printed wiring boards 1977
100-101 6 p. 653-
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249 An expert system for fault tree construction 1985
100-101 6 p. 1165-1166
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250 An explicit closed-form formula for profit-maximizing k-out-of-n systems subject to two kinds of failures Sah, Raaj K.
1990
100-101 6 p. 1123-1130
8 p.
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251 An extension of the block preventive maintenance policy for stochastically failing items 1983
100-101 6 p. 1177-
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252 An image method application to multilayer spreading resistance analysis 1977
100-101 6 p. 655-656
2 p.
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253 An improved architecture for advanced universal microprocessor development systems 1982
100-101 6 p. 1192-
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254 An improved autoregressive model by particle swarm optimization for prognostics of lithium-ion batteries Long, Bing
2013
100-101 6 p. 821-831
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255 An improved management approach to upgrade avionic system reliability 1977
100-101 6 p. 646-
1 p.
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256 An influence of the rate of epitaxial growth on physical properties of gallium nitride 1980
100-101 6 p. 914-
1 p.
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257 An integrated circuit v.h.f. radio receiver 1980
100-101 6 p. 912-
1 p.
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258 An integrated missile reliability growth program 1984
100-101 6 p. 1097-
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259 An interactive design system for hybrid ICs 1982
100-101 6 p. 1196-
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260 An interactive two-dimensional finite element process modelling package for a single user mini-computer 1985
100-101 6 p. 1170-
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261 An introduction to the studies of reliability of systems using the Weibull proportional hazards model Jóźwiak, Ireneusz J.
1997
100-101 6 p. 915-918
4 p.
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262 An investigation into flip chip bonding Johnson, K.I.
1971
100-101 6 p. 451-452
2 p.
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263 An investigation of the interface state density in metal-silieon nitride-silicon structures 1980
100-101 6 p. 913-914
2 p.
artikel
264 An investigation of the valley splitting in n-channel silicon (100) inversion layers 1980
100-101 6 p. 913-
1 p.
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265 An investigation on the influence of electromagnetic interference induced in conducting wire of universal LEDs Tsai, Han-Chang
2007
100-101 6 p. 959-966
8 p.
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266 An irreversible resistance transition in polycrystalline silicon thin film resistors 1990
100-101 6 p. 1208-
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267 An LSI technology fully compatible EAROM cell 1983
100-101 6 p. 1179-
1 p.
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268 An (m, M) machine repair problem with spares and state dependent rates: A diffusion process approach Jain, Madhu
1997
100-101 6 p. 929-933
5 p.
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269 Annealing behaviour of aluminium implanted germanium 1982
100-101 6 p. 1198-
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270 Annealing effects on transition temperature of r.f. sputtered Bi-Sr-Ca-Cu-O thin films Misra, Vinita
1991
100-101 6 p. 1279-1281
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271 Annealing of damage in Se+-implanted indium phosphide 1985
100-101 6 p. 1172-
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272 An observation by photoconductivity of strain splitting of shallow bulk donors located near to the surface in silicon MOS devices 1976
100-101 6 p. 530-
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273 Anomalous diffusion in semiconductors—A quantitative analysis 1970
100-101 6 p. 461-
1 p.
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274 Anomalous drain voltage dependence in bias temperature instability measurements on high-κ field effect transistors Mee, J.K.
2011
100-101 6 p. 1113-1117
5 p.
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275 Anomalous narrow width effect in p-channel metal–oxide–semiconductor surface channel transistors using shallow trench isolation technology Lau, W.S.
2008
100-101 6 p. 919-922
4 p.
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276 An operating system for a microprocessor-based interactive graphic terminal 1978
100-101 6 p. 483-
1 p.
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277 An optimal inspection policy for a storage system with high reliability Ito, Kodo
1995
100-101 6 p. 875-882
8 p.
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278 A note on convergence problems in numerical techniques for accelerated life-testing analysis 1989
100-101 6 p. 1099-
1 p.
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279 A note on repair limit suspension policies for a 2-unit standby redundant system with two phase repairs Kapur, P.K.
1978
100-101 6 p. 591-592
2 p.
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280 A note on the statistics of reliability assessment 1974
100-101 6 p. 442-
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281 A novel approach for fabricating light-emitting porous polysilicon films Han, P.G.
2002
100-101 6 p. 929-933
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282 A novel boron spin-on dopant 1985
100-101 6 p. 1168-
1 p.
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283 A novel memory device for VLSI E2 PROM 1984
100-101 6 p. 1103-
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284 A novel method to improve cell endurance window in source-side injection split gate flash memory Tsair, Yong-Shiuan
2012
100-101 6 p. 1055-1059
5 p.
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285 An overview of laser functional trimming techniques 1974
100-101 6 p. 453-
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286 An overview of thickness measurement techniques for metallic thin films 1983
100-101 6 p. 1186-
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287 An S-shaped software reliability growth model with two types of errors Kareer, Nishi
1990
100-101 6 p. 1085-1090
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288 Anticipatory test monitors IC suppliers process control 1971
100-101 6 p. 412-413
2 p.
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289 A numerical analysis of various cross sheet resistor test structures 1977
100-101 6 p. 655-
1 p.
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290 A numerical study of field-aided diffusion 1974
100-101 6 p. 449-
1 p.
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291 A paste manufacturer's view of the hybrid industry Tait, Richard
1981
100-101 6 p. 801-811
11 p.
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292 A peripheral-oriented microcomputer system 1976
100-101 6 p. 528-
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293 A 500-picosecond system design capability 1980
100-101 6 p. 909-
1 p.
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294 A postal service field evaluation of letter sorting machine keyboards 1977
100-101 6 p. 649-
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295 4813732 Apparatus and method for automated wafer handling Klem, DavidC
1989
100-101 6 p. i-
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296 4657172 Apparatus and method of solder coating integrated circuit leads Lee, JongS
1987
100-101 6 p. 1041-
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297 4965515 Apparatus and method of testing a semiconductor wafer Karasawa, Watar
1991
100-101 6 p. 1295-
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298 4481628 Apparatus for testing dynamic noise immunity of digital integrated circuits Pasquinelli, Rossan
1985
100-101 6 p. 1175-1176
2 p.
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299 Application de la gravure ionique a la microelectronique Dubée, André
1974
100-101 6 p. 455-456
2 p.
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300 Application of a software reliability model to decide software release time 1983
100-101 6 p. 1171-
1 p.
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301 Application of electron beams in thermal processing of semiconductor materials and devices 1984
100-101 6 p. 1107-
1 p.
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302 Application of fluorinert liquid in the failure analysis of semiconductor integrated circuits 1978
100-101 6 p. 559-
1 p.
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303 Application of life cycle costing to the DoD system acquisition decision process 1974
100-101 6 p. 441-
1 p.
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304 Application of MTBF guarantee program for RCA AVQ-3OX weather radar system on Boeing 747 jet-liners 1972
100-101 6 p. 478-
1 p.
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305 Application of photoresists in semiconductor manufacturing 1971
100-101 6 p. 418-419
2 p.
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306 Application of the direct observation of nuclear reaction to the study of ion implantation 1976
100-101 6 p. 532-
1 p.
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307 Application-oriented description of the quality of electronic components (ppm concept) 1982
100-101 6 p. 1184-
1 p.
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308 Applications of ellipsometry to in situ study of the growth of hydrogenated amorphous films 1983
100-101 6 p. 1183-
1 p.
artikel
309 Applications of infrared spectroscopy to the annealing of silicon 1982
100-101 6 p. 1193-
1 p.
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310 Applied stresses, cyclotron masses and charge-density-waves in silicon inversion layers 1977
100-101 6 p. 657-
1 p.
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311 Approaches to resists for two-level RIE pattern transfer applications 1986
100-101 6 p. 1195-
1 p.
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312 Approaches toward silicon compilation 1986
100-101 6 p. 1193-
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313 Approximated reliability of r-out-of-n(F) system with common cause failure and maintenance Hidaka, Toshimitsu
1992
100-101 6 p. 817-832
16 p.
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314 Approximate tolerance limits and confidence limits on reliability for the Gamma distribution 1985
100-101 6 p. 1164-
1 p.
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315 Approximation method for estimating meaningful parameters for a soft-controlled electro-mechanical system 1976
100-101 6 p. 523-
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316 A practical approach to quality control G.W.A.D.,
1972
100-101 6 p. 487-
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317 A practical end-of-life model for semiconductor devices 1990
100-101 6 p. 1200-
1 p.
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318 A practical implementation of the factoring theorem for network reliability 1989
100-101 6 p. 1098-
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319 A practical method of optimizing system life cycle costs vs availability 1978
100-101 6 p. 561-
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320 A precision noise measurement and analysis method used to estimate reliability of semiconductor devices Yisong Dai,
1997
100-101 6 p. 893-899
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321 A probability bound estimation method in Markov reliability analysis 1986
100-101 6 p. 1192-
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322 A projection system for inspecting wafers, integrated circuits and photomasks 1976
100-101 6 p. 527-
1 p.
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323 Aqueous developable bilayer resist system 1986
100-101 6 p. 1193-
1 p.
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324 A RAMCAD/ULCE workstation shell structure 1987
100-101 6 p. 1034-
1 p.
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325 Architecture and applications of a 12-bit CMOS microprocessor 1976
100-101 6 p. 528-
1 p.
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326 A redundancy analysis technique 1970
100-101 6 p. 454-
1 p.
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327 A reliability analysis of the electrostatic discharge sensitivity of CMOS devices Barry, D.M.
1989
100-101 6 p. 1051-1060
10 p.
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328 A reliability control tool during manufacturing 1977
100-101 6 p. 647-
1 p.
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329 A reliability growth model 1984
100-101 6 p. 1096-
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330 A reliability optimization computer algorithm for complex systems Cǎtuneanu, V.M.
1986
100-101 6 p. 1019-1023
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331 A reliability problem treated by the additional event method Råde, L.
1974
100-101 6 p. 483-485
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332 A reliability-program case-history on design review 1986
100-101 6 p. 1191-1192
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333 A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits Ročak, D.
2007
100-101 6 p. 986-995
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334 A reliable dry ceramic dual in-line package (CERDIP) 1978
100-101 6 p. 476-
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335 A repairable system with N failure modes and one standby unit Yamashiro, Mitsuo
1980
100-101 6 p. 831-835
5 p.
artikel
336 A replacement policy based on limits for the repair cost rate 1983
100-101 6 p. 1177-
1 p.
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337 A review of microprocessor software 1980
100-101 6 p. 912-
1 p.
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338 A review of thick film glaze resistors 1989
100-101 6 p. 1103-
1 p.
artikel
339 A review of thick film microwave integrated circuit technology 1984
100-101 6 p. 1099-
1 p.
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340 Argon content of SiO2 films deposited by rf sputtering in argon 1970
100-101 6 p. 464-
1 p.
artikel
341 Army aviation warranty concepts 1987
100-101 6 p. 1027-
1 p.
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342 Ascertaining the value of reliability for a software package before release Aggarwal, K.K.
1992
100-101 6 p. 833-838
6 p.
artikel
343 A second-order moments method for uncertainty analysis 1983
100-101 6 p. 1171-
1 p.
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344 A see-saw IC logic astable oscillator 1973
100-101 6 p. 499-
1 p.
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345 A shorter truncated sequential test 1971
100-101 6 p. 414-
1 p.
artikel
346 A shrinkage testimator for scale parameter of an exponential distribution Pandey, B.N.
1987
100-101 6 p. 949-951
3 p.
artikel
347 A simple approach for constrained redundancy optimization problem 1972
100-101 6 p. 477-
1 p.
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348 A simple but effective method of electrical connections checking of IC layout and its implementation 1986
100-101 6 p. 1194-
1 p.
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349 A simple cure for a form of window staining which occurs during the etching of silicon integrated circuits Hines, R.E.
1972
100-101 6 p. 537-
1 p.
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350 A simple method of calculating the minority-carrier current in heavily doped silicon 1986
100-101 6 p. 1196-
1 p.
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351 A simple method of photomask yield optimization by defect inspection 1985
100-101 6 p. 1169-
1 p.
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352 A simple model for fatigue life 1989
100-101 6 p. 1098-
1 p.
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353 A simplified base failure rate model-estimation of parameters Babar, A.K.
1982
100-101 6 p. 1177-1179
3 p.
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354 A simplified cost-oriented control chart for attributes 1976
100-101 6 p. 521-
1 p.
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355 A simplified design-procedure for fixed-time life tests based on Kullback-Leibler information 1987
100-101 6 p. 1030-1031
2 p.
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356 A simplified design procedure for life tests based on Kullback-Leibler information 1986
100-101 6 p. 1190-
1 p.
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357 A simplified yield modeling method for design rule trade-off in interconnection substrates Scheffler, Michael
2001
100-101 6 p. 861-869
9 p.
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358 A simulative approach to electron conduction in thick-film resistors 1983
100-101 6 p. 1185-
1 p.
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359 A small instrument manufacturer's experience with medical instrument reliability 1972
100-101 6 p. 480-481
2 p.
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360 A software development workshop for programmable microelectronics 1978
100-101 6 p. 562-
1 p.
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361 A software reliability model with multiple-error introduction and removal 1987
100-101 6 p. 1030-
1 p.
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362 A software reliability program 1970
100-101 6 p. 456-
1 p.
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363 A software tool for designing burn-in programs 1987
100-101 6 p. 1035-
1 p.
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364 As packaging density increases, focus shifts to SSI and MSI chips 1984
100-101 6 p. 1102-
1 p.
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365 A spreadsheet heuristic approach for the stocking and retention of slow-moving, obsolescent items 1990
100-101 6 p. 1203-
1 p.
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366 Assembly equipment users speak out 1983
100-101 6 p. 1178-
1 p.
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367 Assessing missile system reliability 1972
100-101 6 p. 476-
1 p.
artikel
368 Assessing product liability through material failure analysis 1978
100-101 6 p. 479-
1 p.
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369 Assessing the value of a lead-free solder control plan using cost-based FMEA Lillie, Edwin
2015
100-101 6 p. 969-979
11 p.
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370 Assessing throughput and reliability in communication and computer networks 1989
100-101 6 p. 1097-
1 p.
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371 A statistical prediction interval for availability 1971
100-101 6 p. 414-
1 p.
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372 A Stochastic method of allocation of components to maximize reliability 1974
100-101 6 p. 442-
1 p.
artikel
373 A stochastic model of a system with two phases of operation Moafi B., S.E.
1992
100-101 6 p. 799-803
5 p.
artikel
374 A structured approach to the design of microprocessor applications software Halsall, F.
1981
100-101 6 p. 871-885
15 p.
artikel
375 A study of accelerated storage test conditions applicable to semiconductor devices and microcircuits 1978
100-101 6 p. 474-
1 p.
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376 A study of Al/PtSi/Si thin film reaction kinetics by X-ray diffraction 1978
100-101 6 p. 483-484
2 p.
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377 A study of PtSi formation 1980
100-101 6 p. 917-
1 p.
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378 A study of the gold acceptor in a silicon p + n junction and an n-type MOS capacitor by thermally stimulated current and capacitance measurements 1976
100-101 6 p. 529-
1 p.
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379 A study of three environmental reliability tests 1980
100-101 6 p. 903-
1 p.
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380 A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages Jang, Kyung-Woon
2012
100-101 6 p. 1174-1181
8 p.
artikel
381 A support system life cycle cost model 1977
100-101 6 p. 647-
1 p.
artikel
382 A survey of corrosion failure mechanisms in microelectronic devices 1980
100-101 6 p. 899-900
2 p.
artikel
383 A survey of published information on universal logic arrays Hurst, S.L.
1977
100-101 6 p. 663-674
12 p.
artikel
384 Asymmetric channel doping profile and temperature reduction influence on the performance of current mirrors implemented with FD SOI nMOSFETs de Souza, Michelly
2013
100-101 6 p. 848-855
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artikel
385 Asymptotic analysis of a heterogeneous renewable complex system with random environments Sztrik, J.
1992
100-101 6 p. 875-886
12 p.
artikel
386 Asymptotic behaviour of a multiple parallel system attended by a multiple repairstation Vanderperre, E.J.
1992
100-101 6 p. 811-815
5 p.
artikel
387 Asymptotic distribution of downtime for a cold-standby system 1980
100-101 6 p. 900-
1 p.
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388 A systematic procedure for the generation of cost-minimized designs 1972
100-101 6 p. 477-
1 p.
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389 A system reliability and maintainability simulation exercise 1978
100-101 6 p. 562-
1 p.
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390 A systems unavailability trade-off program 1970
100-101 6 p. 455-
1 p.
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391 A technique for transparent fault injection and simulation in VHDL Zwolinski, Mark
2001
100-101 6 p. 797-804
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artikel
392 A test structure for the electrical measurement of the misalignment between gate and diffusion regions in MOS/LSI circuits 1986
100-101 6 p. 1194-
1 p.
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393 A theoretical study of the electronic structure for twin stacking faults in silicon 1987
100-101 6 p. 1038-
1 p.
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394 A thick film base metal resistor and compatible hybrid system 1978
100-101 6 p. 567-
1 p.
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395 A thick film hybrid IC amplifier for industrial use 1982
100-101 6 p. 1196-
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396 A time-variable ratio useful in reliability theory 1983
100-101 6 p. 1172-
1 p.
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397 A transmission line model of a VLSI package 1983
100-101 6 p. 1180-
1 p.
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398 A trimmable planar capacitor for hybrid applications 1974
100-101 6 p. 450-
1 p.
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399 A Truncation methodology for evaluating large fault trees 1985
100-101 6 p. 1167-
1 p.
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400 A tutorial on fault tolerance issues with applications in distributed systems Walker, Dennis
1990
100-101 6 p. 1029-1037
9 p.
artikel
401 A two-gun ion beam system for dynamic recoil implantation 1978
100-101 6 p. 485-
1 p.
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402 A two level metal CMOS process for VLSI circuits 1985
100-101 6 p. 1170-
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403 A two non-identical three-state units redundant system with common-cause failures and one standby unit 1982
100-101 6 p. 1187-
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404 A two-unit parallel redundant system with three modes and bivariate exponential lifetimes 1984
100-101 6 p. 1098-
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405 A type-II censored, log test-time based, component-testing procedure for a parallel system 1989
100-101 6 p. 1093-1094
2 p.
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406 Auditing—A product liability prevention tool 1978
100-101 6 p. 479-
1 p.
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407 A ULA is more than silicon 1980
100-101 6 p. 909-
1 p.
artikel
408 A unified approach to the development of an exceedingly efficient algorithm for digital filter design Arora, R.K.
1990
100-101 6 p. 1075-1079
5 p.
artikel
409 A unifying reliability analysis philosophy 1970
100-101 6 p. 455-
1 p.
artikel
410 A useful property of “Graphical” estimators of location and scale parameters 1982
100-101 6 p. 1188-
1 p.
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411 Auto-Auto Relay Set controlled by LSI Programmable Logic 1973
100-101 6 p. 499-
1 p.
artikel
412 Automated electronic masking machine 1974
100-101 6 p. 447-
1 p.
artikel
413 Automated inspection of circular parts 1989
100-101 6 p. 1095-
1 p.
artikel
414 Automated inspection of general shapes 1989
100-101 6 p. 1102-
1 p.
artikel
415 Automated inspection of wafer patterns with applications in stepping, projection and direct-write lithography 1984
100-101 6 p. 1106-
1 p.
artikel
416 Automated parametric testers to monitor the integrated circuit process 1982
100-101 6 p. 1191-
1 p.
artikel
417 Automated shock in particle impact noise (PIN) testing 1977
100-101 6 p. 654-
1 p.
artikel
418 Automated test methods to check fast analogue-to-digital converters 1976
100-101 6 p. 526-
1 p.
artikel
419 Automatic detection of semiconductor mask defects Marcin Wójcik, Zbigniew
1976
100-101 6 p. 585-593
9 p.
artikel
420 Automatic hardware synthesis 1983
100-101 6 p. 1181-
1 p.
artikel
421 Automatic heart disease diagnostic system using a MOS-IC'ed learning machine 1974
100-101 6 p. 447-
1 p.
artikel
422 Automatic impedance matching system for rf sputtering 1970
100-101 6 p. 465-466
2 p.
artikel
423 Automatic interconnection system for electronic components 1970
100-101 6 p. 459-
1 p.
artikel
424 Automatic nine-barrel repeater ANR 4 of VEB Carl Zeiss JENA a photolithographic mask-making system for the semiconductor industry 1974
100-101 6 p. 447-
1 p.
artikel
425 Automatic registration in an electron-beam lithographic system 1978
100-101 6 p. 485-
1 p.
artikel
426 Automatic testing of integrated circuits 1977
100-101 6 p. 646-
1 p.
artikel
427 Automating electronics manufacturing 1987
100-101 6 p. 1036-
1 p.
artikel
428 Availability analysis of a repairable system with non-repairable stand-by units Dhillon, Balbir S.
1976
100-101 6 p. 561-562
2 p.
artikel
429 Availability analysis of a two unit repairable parallel redundant system with common-mode failures and arbitrarily distributed down times Dichirico, Canio
1986
100-101 6 p. 1183-1188
6 p.
artikel
430 Availability analysis of transit systems 1985
100-101 6 p. 1162-
1 p.
artikel
431 Availability—concepts and definitions 1976
100-101 6 p. 521-
1 p.
artikel
432 Availability evaluation of flow networks with varying throughput-demand and deferred repair 1990
100-101 6 p. 1202-
1 p.
artikel
433 Availability measures for various multi-unit systems Kapur, P.K.
1986
100-101 6 p. 1089-1097
9 p.
artikel
434 Availability, MTBF and MTTR for repairable m out of n system 1982
100-101 6 p. 1188-
1 p.
artikel
435 Availability of an (m, N) system with repair Rao, K.V.
1978
100-101 6 p. 571-573
3 p.
artikel
436 Availability of a reduadant system 1978
100-101 6 p. 478-
1 p.
artikel
437 Availability of a series system with warm spares Cui, Lirong
1994
100-101 6 p. 1057-1069
13 p.
artikel
438 Availability of the feeding system in the sugar industry Kumar, Dinesh
1988
100-101 6 p. 867-871
5 p.
artikel
439 Avalanche breakdown characteristics of alloyed silicon p-n junctions 1973
100-101 6 p. 492-
1 p.
artikel
440 Avalanche breakdown in polycrystalline silicon films 1973
100-101 6 p. 501-
1 p.
artikel
441 Avalanche breakdown voltage of diffused junctions in silicon 1973
100-101 6 p. 500-
1 p.
artikel
442 Avalanche injection in MNOS gate controlled diodes 1980
100-101 6 p. 914-
1 p.
artikel
443 A Vamfo-Caris method for determining thicknesses of transparent films with small number of interference extrema 1971
100-101 6 p. 423-
1 p.
artikel
444 A variational diagnosis method for stuck-faults in combinatorial networks 1972
100-101 6 p. 474-
1 p.
artikel
445 A versatile design giving both N-type and S-type of negative-resistances Sharma, C.K.
1972
100-101 6 p. 499-500
2 p.
artikel
446 Aviation supply office FFW/RIW case history, 2. Abex Pump 1976
100-101 6 p. 525-
1 p.
artikel
447 A view from inside “the surface-mounting revolution” 1986
100-101 6 p. 1193-
1 p.
artikel
448 Avoiding low temperature thermal donors in CMOS 1989
100-101 6 p. 1102-
1 p.
artikel
449 A voltage variable resistor most Townsend, W.G.
1970
100-101 6 p. 491-496
6 p.
artikel
450 A warm standby redundant system with correlated failures and repairs Goel, L.R.
1992
100-101 6 p. 793-797
5 p.
artikel
451 A weighted estimator for the scale parameter of an exponential distribution Mishra, G.C.
1992
100-101 6 p. 755-757
3 p.
artikel
452 A “Zero-Time” VLSI sorter 1983
100-101 6 p. 1178-
1 p.
artikel
453 Back-end soft and hard defect monitoring using a single test chip Rigaud, Fabrice
2011
100-101 6 p. 1136-1141
6 p.
artikel
454 Backside probing of flip–chip circuits using electrostatic force sampling Qi, R
2000
100-101 6 p. 997-1003
7 p.
artikel
455 Band bending variation of the Si(111) surface during its thermal oxidation 1984
100-101 6 p. 1104-
1 p.
artikel
456 Barrier-height measurements of tantalum silicide on silicon 1986
100-101 6 p. 1196-
1 p.
artikel
457 Barrier layer multilayer ceramic capacitor processing: effects of termination and plating process parameters 1990
100-101 6 p. 1200-
1 p.
artikel
458 Base-buried layer isolation process for digital LSI circuit 1984
100-101 6 p. 1100-
1 p.
artikel
459 Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling Hölck, O.
2011
100-101 6 p. 1027-1034
8 p.
artikel
460 Batch bonded crossovers for thin film circuits 1976
100-101 6 p. 531-
1 p.
artikel
461 Bayes estimation of reliability for the inverse Gaussian model 1982
100-101 6 p. 1185-
1 p.
artikel
462 Bayes estimation of the parameters and reliability function of the 3-parameter Weibull distribution 1989
100-101 6 p. 1096-
1 p.
artikel
463 Bayes estimation of the reliability function of normal distribution 1986
100-101 6 p. 1190-
1 p.
artikel
464 Bayesian analysis of reliability and hazard rate function of a mixture model Siddiqui, S.A.
1997
100-101 6 p. 935-941
7 p.
artikel
465 Bayesian analysis of system availability Sharma, K.K.
1993
100-101 6 p. 809-811
3 p.
artikel
466 Bayesian approach to life testing and reliability estimation under competing exponential failure distributions Papadopoulos, Alex S.
1989
100-101 6 p. 1039-1050
12 p.
artikel
467 Bayesian approach to the prediction problem in the exponential population 1978
100-101 6 p. 480-
1 p.
artikel
468 Bayesian estimation under exponential failure distribution Jaisingh, Lloyd R.
1991
100-101 6 p. 1229-1235
7 p.
artikel
469 Bayesian limits for the reliability of pass/fail parallel units 1976
100-101 6 p. 522-
1 p.
artikel
470 Bayesian prediction for the range with a burr distribution and a random sample size Ashour, S.K.
1994
100-101 6 p. 1121-1125
5 p.
artikel
471 Bayesian reliability and availability—a review 1983
100-101 6 p. 1174-
1 p.
artikel
472 Bayesian reliability assessment from test data 1976
100-101 6 p. 522-
1 p.
artikel
473 Bayesian shrinkage estimation of reliability from a censored sample from a finite range failure time model Pandey, M.
1989
100-101 6 p. 955-958
4 p.
artikel
474 Bayesian techniques to reduce the sample size in automotive electronics attribute testing Kleyner, Andre
1997
100-101 6 p. 879-883
5 p.
artikel
475 Bayes inference from failure data contaminated due to maintenance 1986
100-101 6 p. 1191-
1 p.
artikel
476 Bayes interval for the Weibull parameters utilizing guessed estimates Singh, S.K.
1993
100-101 6 p. 909-912
4 p.
artikel
477 Bayes reliability assessment of a two-unit hot-standby redundant system 1985
100-101 6 p. 1167-
1 p.
artikel
478 Behaviour of amorphous Ge contacts to monocrystalline silicon 1977
100-101 6 p. 656-
1 p.
artikel
479 Behaviour of a two correlated units redundant system with many types of failure 1978
100-101 6 p. 479-480
2 p.
artikel
480 Behaviour of line contacts upon the effect of fault currents 1980
100-101 6 p. 898-
1 p.
artikel
481 Bell Labs' new thin-film hybrid may be most complex ever built 1973
100-101 6 p. 502-
1 p.
artikel
482 Berechnung der Kapazitäts-und Induktivitätsbeläge ebener Streifenleitungen durch konforme Abbildung 1970
100-101 6 p. 460-
1 p.
artikel
483 Bibliography of inductance simulation by active RC methods Dutta Roy, Suhash C.
1976
100-101 6 p. 637-639
3 p.
artikel
484 Bibliography of literature on chemical systems reliability Dhillon, Balbir S.
1984
100-101 6 p. 1087-1093
7 p.
artikel
485 Bibliography of literature on fault trees 1978
100-101 6 p. 473-
1 p.
artikel
486 Bibliography of literature on mining equipment reliability Dhillon, Balbir S.
1986
100-101 6 p. 1131-1138
8 p.
artikel
487 Bibliography of literature on nuclear system reliability Dhillon, Balbir S.
1983
100-101 6 p. 1143-1161
19 p.
artikel
488 Biochips, fact or fiction? 1986
100-101 6 p. 1193-
1 p.
artikel
489 Bipolar compatible MOS ICs 1970
100-101 6 p. 463-
1 p.
artikel
490 Bipolar gate array delivers fast signal processing 1984
100-101 6 p. 1103-
1 p.
artikel
491 Bipolar Schottky logic device failure modes due to contact metallurgical degradation Canali, C.
1982
100-101 6 p. 1155-1175
21 p.
artikel
492 Bipolar Schottky logic device failure modes due to contact metallurgical degradation 1983
100-101 6 p. 1169-
1 p.
artikel
493 Bipolar VLSI builds 16-bit controller handling many fast peripherals at once 1982
100-101 6 p. 1190-
1 p.
artikel
494 16-bit bipolar microprocessor marches to standard instruction set 1983
100-101 6 p. 1182-
1 p.
artikel
495 16-bit microprocessor enters virtual memory domain 1980
100-101 6 p. 912-
1 p.
artikel
496 Black aluminium films 1987
100-101 6 p. 1038-
1 p.
artikel
497 Board level investigation of BGA solder joint deformation strength Sinkovics, B.
2009
100-101 6 p. 573-578
6 p.
artikel
498 Bondability problems associated with the TiPtAu metallization of hybrid microwave thin film circuits 1982
100-101 6 p. 1197-
1 p.
artikel
499 Bonded crossovers for thin film circuits 1971
100-101 6 p. 423-
1 p.
artikel
500 Bonding degradation in the tantalum nitride-chromium-gold metallization system 1973
100-101 6 p. 493-
1 p.
artikel
501 Bonding temperature measurements during device assembly 1983
100-101 6 p. 1181-
1 p.
artikel
502 Boundary element analysis of thermal fatigue effects on high power IGBT modules Khatir, Z.
2004
100-101 6 p. 929-938
10 p.
artikel
503 Bounding algorithms for two-terminal network reliability Thangamani, G.
1994
100-101 6 p. 969-981
13 p.
artikel
504 Bounds evaluation of coefficients in the reliability polynomial Camarda, Pietro
1990
100-101 6 p. 1099-1110
12 p.
artikel
505 Bounds on reliability of a coherent system with positively correlated components 1987
100-101 6 p. 1028-
1 p.
artikel
506 Bounds on reliability of a noncoherent system using its length & width 1983
100-101 6 p. 1174-
1 p.
artikel
507 Bounds on the reliability of binary coherent systems 1990
100-101 6 p. 1204-
1 p.
artikel
508 Breakdown voltage of discrete capacitors under single-pulse conditions 1982
100-101 6 p. 1184-
1 p.
artikel
509 Broader functions and improved reliability of printed circuit boards using dry film solder mask systems 1983
100-101 6 p. 1170-
1 p.
artikel
510 BS9000 and integrated circuits 1970
100-101 6 p. 450-
1 p.
artikel
511 B-Si masks for storage ring X-ray lithography 1985
100-101 6 p. 1169-
1 p.
artikel
512 Bubble-memory support chips allow tailored-system design 1983
100-101 6 p. 1179-
1 p.
artikel
513 Build an ON-OFF timer using inexpensive ICs 1972
100-101 6 p. 482-
1 p.
artikel
514 Building quality analog circuits with C-MOS logic arrays 1982
100-101 6 p. 1191-
1 p.
artikel
515 Building reliability into reed switches 1973
100-101 6 p. 493-
1 p.
artikel
516 Built-in test for complex digital integrated circuits 1980
100-101 6 p. 907-
1 p.
artikel
517 Bulk lifetime determination of MOS structures by a voltage step response method 1978
100-101 6 p. 560-
1 p.
artikel
518 Bulk trapping effect on carrier diffusion length as determined by the surface photovoltage method: Theory 1970
100-101 6 p. 462-463
2 p.
artikel
519 Burn-in to improve which measure of reliability? Guess, Frank
1992
100-101 6 p. 759-762
4 p.
artikel
520 CAD systems for VLSI in Japan 1983
100-101 6 p. 1178-
1 p.
artikel
521 CAD toolbox holds all gear for the design of custom logic arrays 1982
100-101 6 p. 1191-
1 p.
artikel
522 CAD tool for GaAs digital integrated circuits 1982
100-101 6 p. 1192-
1 p.
artikel
523 CAE systems include actual IC to avoid simulation obstacle 1984
100-101 6 p. 1102-
1 p.
artikel
524 Calculating the failure frequency of a repairable system 1983
100-101 6 p. 1175-
1 p.
artikel
525 Calculating the probability of Boolean expression being 1 1977
100-101 6 p. 645-
1 p.
artikel
526 Calculation of the current density in the contacts of a thin film resistor 1970
100-101 6 p. 464-
1 p.
artikel
527 Calculation of the extended-state electron mobility in hydrogenated amorphous silicon 1985
100-101 6 p. 1172-
1 p.
artikel
528 Calculations of systems unreliability by algebraic manipulation of failure event 1985
100-101 6 p. 1163-1164
2 p.
artikel
529 Calendar 2009
100-101 6 p. I-III
nvt p.
artikel
530 Calendar 2010
100-101 6 p. I-III
nvt p.
artikel
531 Calendar 2008
100-101 6 p. I-III
nvt p.
artikel
532 Calendar of forthcoming events 2003
100-101 6 p. I-VIII
nvt p.
artikel
533 Calendar of forthcoming events 2002
100-101 6 p. I-VI
nvt p.
artikel
534 Calendar of forthcoming events 1997
100-101 6 p. 981-982
2 p.
artikel
535 Calendar of international conferences, symposia, lectures and meetings of interest 1991
100-101 6 p. 1287-1290
4 p.
artikel
536 Calendar of international conferences, symposia, lectures and meetings of interest 1993
100-101 6 p. 917-919
3 p.
artikel
537 Calendar of international conferences, symposia, lectures and meetings of interest 1984
100-101 6 p. 1007-1008
2 p.
artikel
538 Calendar of international conferences, symposia, lectures and meetings of interest 1982
100-101 6 p. 1057-1059
3 p.
artikel
539 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1988
100-101 6 p. 841-843
3 p.
artikel
540 Calendar of international conferences, symposia, lectures and meetings of interest 1986
100-101 6 p. 1003-1004
2 p.
artikel
541 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1978
100-101 6 p. 451-454
4 p.
artikel
542 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1973
100-101 6 p. 485-486
2 p.
artikel
543 Calendar of international conferences, symposia, lectures and meetings of interest 1980
100-101 6 p. 769-770
2 p.
artikel
544 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1972
100-101 6 p. 465-466
2 p.
artikel
545 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1978
100-101 6 p. 543-546
4 p.
artikel
546 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1971
100-101 6 p. 401-402
2 p.
artikel
547 Calendar of international conferences, symposia, lectures and meetings of interest 1976
100-101 6 p. 503-504
2 p.
artikel
548 Calendar of international conferences, symposia, lectures and meetings of interest 1974
100-101 6 p. 433-434
2 p.
artikel
549 Calendar of international conferences, symposia, lectures and meetings of interest 1977
100-101 6 p. 627-628
2 p.
artikel
550 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1970
100-101 6 p. 440-442
3 p.
artikel
551 4724378 Calibrated automatic test system Murray, DonaldF
1988
100-101 6 p. 999-
1 p.
artikel
552 Call for paper 1970
100-101 6 p. 443-444
2 p.
artikel
553 Call for papers 1997
100-101 6 p. 977-979
3 p.
artikel
554 Call for papers 1971
100-101 6 p. 403-406
4 p.
artikel
555 Calls for papers, etc. 1978
100-101 6 p. 455-461
7 p.
artikel
556 Can ATE be trusted by QC? 1982
100-101 6 p. 1183-
1 p.
artikel
557 Capacitive and resistive electronic components Campbell, D.S.
1995
100-101 6 p. 1009-1010
2 p.
artikel
558 Capacitors in microwave integrated circuits 1971
100-101 6 p. 419-
1 p.
artikel
559 Capacitors of thin insulating films of photoresist materials 1978
100-101 6 p. 484-
1 p.
artikel
560 Capacity planning with flow and reliability evaluation using Monte Carlo simulation 1987
100-101 6 p. 1034-
1 p.
artikel
561 Capless annealing of silicon implanted gallium arsenide 1983
100-101 6 p. 1186-
1 p.
artikel
562 Careless pump maintenance will cost you 1989
100-101 6 p. 1094-
1 p.
artikel
563 Carrier heating effects in junctions at very low currents 1973
100-101 6 p. 500-
1 p.
artikel
564 Carrier system for testing and conditioning of beam lead devices 1977
100-101 6 p. 653-
1 p.
artikel
565 Cast leads for surface attachment 1985
100-101 6 p. 1169-
1 p.
artikel
566 Catastrophic failure modes limit redundancy effectiveness 1985
100-101 6 p. 1164-
1 p.
artikel
567 Cavity perturbation method for measurement of permittivity and conductivity of medium lossy semiconductors and dielectrics 1971
100-101 6 p. 421-
1 p.
artikel
568 Cell layout boosts speed of low-power 64-K ROM 1978
100-101 6 p. 564-
1 p.
artikel
569 Ceramic capacitor insulation resistance failures accelerated by low voltage 1978
100-101 6 p. 475-
1 p.
artikel
570 Ceramic-chip-capacitor attachment 1978
100-101 6 p. 559-560
2 p.
artikel
571 4821142 Ceramic multilayer circuit board and semiconductor module Ushifusa, Nobuyuki
1989
100-101 6 p. iii-
1 p.
artikel
572 Ceramic on metal substrates produced by plasma spraying for thick film technology 1983
100-101 6 p. 1185-
1 p.
artikel
573 Cermet resistors on ceramic substrates 1982
100-101 6 p. 1197-
1 p.
artikel
574 Challenges and developments of copper wire bonding technology Liu, Peisheng
2012
100-101 6 p. 1092-1098
7 p.
artikel
575 Challenges of Ta2O5 as high-k dielectric for nanoscale DRAMs Atanassova, E.
2007
100-101 6 p. 913-923
11 p.
artikel
576 Changes in breakdown characteristics of planar Al/n-Si Schottky diodes during the postmetallization heat treatment 1984
100-101 6 p. 1096-
1 p.
artikel
577 Changes in effective channel length due to hot-electron trapping in short-channel m.o.s.t.s. 1978
100-101 6 p. 565-
1 p.
artikel
578 Characterisation of chemical vapour-deposition processes. Part 1 1977
100-101 6 p. 656-
1 p.
artikel
579 Characterisation of chemical vapour-deposition processes Part II 1977
100-101 6 p. 656-
1 p.
artikel
580 Characterisation of embedded filters in advanced printed wiring boards O'Reilly, Stephen
2001
100-101 6 p. 781-788
8 p.
artikel
581 Characteristics of aluminum-silicon Schottky barrier diode 1970
100-101 6 p. 460-461
2 p.
artikel
582 Characteristics of size dependent conductivity of the CNT-interconnects formed by low temperature process Chiu, Wei-Chih
2013
100-101 6 p. 906-911
6 p.
artikel
583 Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging Yim, Byung-Seung
2012
100-101 6 p. 1165-1173
9 p.
artikel
584 Characteristics of thin chromium films obtained by different methods of deposition 1985
100-101 6 p. 1168-
1 p.
artikel
585 Characteristic traits of semiconductor failures 1970
100-101 6 p. 452-
1 p.
artikel
586 Characterization and reliability of nMOSFETs on flexible substrates under mechanical strain Kao, Hsuan-ling
2012
100-101 6 p. 999-1004
6 p.
artikel
587 Characterization of high-density current stressed IGBTs and simulation with an adapted SPICE sub-circuit Maouad, A
2000
100-101 6 p. 973-979
7 p.
artikel
588 Characterization of localized defects in dielecteric films for electron devices 1974
100-101 6 p. 443-
1 p.
artikel
589 Characterization of LPCVD and thermal silicon nitride films 1983
100-101 6 p. 1185-
1 p.
artikel
590 Characterization of semiconductor materials and devices by surface analysis techniques 1985
100-101 6 p. 1171-
1 p.
artikel
591 Characterization of silicon by ion beam techniques 1984
100-101 6 p. 1107-
1 p.
artikel
592 Characterization of surface states in HCL-grown oxides using MOS transient currents 1980
100-101 6 p. 914-
1 p.
artikel
593 Characterizations of gamma and negative binomial distributions 1989
100-101 6 p. 1096-
1 p.
artikel
594 Characterizing plasma deposited silicon nitride 1986
100-101 6 p. 1196-1197
2 p.
artikel
595 Charge-coupled devices and applications 1974
100-101 6 p. 446-
1 p.
artikel
596 Charged device model metrology: limitations and problems Henry, Leo G.
2002
100-101 6 p. 919-927
9 p.
artikel
597 Charge injection from a surface depletion region—the Al2O3-silicon system 1980
100-101 6 p. 914-
1 p.
artikel
598 Charge neutrality in semiconductors with implanted impurity profiles 1971
100-101 6 p. 424-
1 p.
artikel
599 Charge storage in MNOS transistors at electric fields near gate insulator breakdown 1971
100-101 6 p. 420-
1 p.
artikel
600 Charge trapping and detrapping phenomena in thin oxidenitride-oxide stacked films 1989
100-101 6 p. 1102-
1 p.
artikel
601 Checking request policies for a one-unit system and their comparisons Yamada, Shigeru
1980
100-101 6 p. 859-874
16 p.
artikel
602 Check list for 4,096—bit RAMs flags potential problems in memory design 1976
100-101 6 p. 525-
1 p.
artikel
603 Chemical beam epitaxy 1989
100-101 6 p. 1103-
1 p.
artikel
604 Chemical impurities and structural imperfections in semiconductor silicon. Part I 1983
100-101 6 p. 1183-
1 p.
artikel
605 Chemiluminescence during photoresist stripping processes 1982
100-101 6 p. 1189-
1 p.
artikel
606 Chip carrier packaging applications 1980
100-101 6 p. 911-
1 p.
artikel
607 Chip carriers as a means for high-density packaging 1978
100-101 6 p. 482-
1 p.
artikel
608 Chip-carriers change their course 1983
100-101 6 p. 1179-
1 p.
artikel
609 Chip carriers, lids and sots—an analysis of cost and performance tradeoffs for hybrid applications 1977
100-101 6 p. 659-
1 p.
artikel
610 Chip carriers—their application and future direction 1982
100-101 6 p. 1190-
1 p.
artikel
611 Chips make fast math a snap for microprocessors 1980
100-101 6 p. 912-
1 p.
artikel
612 Chi-square probabilities are Poisson probabilities in disguise 1986
100-101 6 p. 1190-1191
2 p.
artikel
613 Chopper circuit put on op-amp chip 1973
100-101 6 p. 499-
1 p.
artikel
614 Chopper-stabilized IC op amps achieve precision, speed, economy 1973
100-101 6 p. 499-
1 p.
artikel
615 CICC ranges from floppy-dish controllers to analog custom arrays, laser probing 1984
100-101 6 p. 1099-
1 p.
artikel
616 Circuit analysis, logic simulation and design verification for VLSI 1983
100-101 6 p. 1181-
1 p.
artikel
617 4816756 Circuit and method for statically testing rotating rectifiers in brushless alternators Fox, DavidA
1989
100-101 6 p. ii-
1 p.
artikel
618 Circuit-board packaging considerations for optimum utilization of chip carriers 1980
100-101 6 p. 911-
1 p.
artikel
619 Circuit design selection—A reliability factor 1970
100-101 6 p. 454-
1 p.
artikel
620 Circuit level prediction of device performance degradation due to negative bias temperature stress Kuroda, Rihito
2007
100-101 6 p. 930-936
7 p.
artikel
621 Circuit model distribution with statistical dependence 1972
100-101 6 p. 479-
1 p.
artikel
622 Circuits intégrés diviseurs de fréquence réalisés sur arséniure de gallium 1983
100-101 6 p. 1182-
1 p.
artikel
623 4967147 Circuit tester having mechanical fingers and pogo probes for causing electrical contact with test fixture assemblies Woods, Ernest
1991
100-101 6 p. 1296-
1 p.
artikel
624 Classes of discrete decreasing and increasing mean-residual-life distributions 1987
100-101 6 p. 1030-
1 p.
artikel
625 Clean rooms for ULSI manufacturing: class 1 practice 1986
100-101 6 p. 1194-
1 p.
artikel
626 Clean rooms: the common sense approach to effectiveness 1984
100-101 6 p. 1099-
1 p.
artikel
627 Clinch-river breeder-reactor plant system reliability 1976
100-101 6 p. 521-522
2 p.
artikel
628 C-MOS. A designer's dream with the best yet to come 1984
100-101 6 p. 1103-
1 p.
artikel
629 C-MOS and bipolar technologies are more partners than rivals 1984
100-101 6 p. 1102-
1 p.
artikel
630 C-MOS challenges bipolars in static-RAM race 1984
100-101 6 p. 1102-
1 p.
artikel
631 C-MOS may help majority logic win designers' vote 1973
100-101 6 p. 498-
1 p.
artikel
632 C-MOS multiplier speeds task for microprocessors 1980
100-101 6 p. 912-
1 p.
artikel
633 C-MOS offers alternatives to linear-IC design 1984
100-101 6 p. 1103-
1 p.
artikel
634 C-MOS paces development of application-specific circuits 1984
100-101 6 p. 1102-
1 p.
artikel
635 CMOS reliability 1977
100-101 6 p. 644-
1 p.
artikel
636 CMOS reliability 1978
100-101 6 p. 560-
1 p.
artikel
637 C-MOS support logic helps build unified, high-speed systems 1982
100-101 6 p. 1192-
1 p.
artikel
638 Collector diffusion isolation packs many functions on a chip 1972
100-101 6 p. 483-
1 p.
artikel
639 Combination of thick-film dielectric/thin film conductor for fine pattern formation of multi-layer substrate 1982
100-101 6 p. 1195-
1 p.
artikel
640 Combinatorial reliability analysis of multiprocessor computers 1983
100-101 6 p. 1173-
1 p.
artikel
641 Comment on: extension of the Duane plotting technique 1987
100-101 6 p. 1030-
1 p.
artikel
642 Comment on: queueing model of a bi-level Markov service-system and its solution using recursion 1990
100-101 6 p. 1203-
1 p.
artikel
643 Comment on the paper “failure of aluminium contacts to silicon in shallow diffused transistors” Cunningham, J.A.
1970
100-101 6 p. 515-516
2 p.
artikel
644 Comments on “Reliability and component importance of a consecutive-k-out-of-n system” by Zuo Hwang, Frank K.
2000
100-101 6 p. 1061-1063
3 p.
artikel
645 Comments on the hole mass in silicon inversion layers 1976
100-101 6 p. 529-
1 p.
artikel
646 Common-cause failure analysis of a three-state device system 1980
100-101 6 p. 904-905
2 p.
artikel
647 Common-cause failure considerations in predicting HTGR cooling system reliability 1976
100-101 6 p. 521-
1 p.
artikel
648 Common cause failures—a dilemma in perspective 1980
100-101 6 p. 903-
1 p.
artikel
649 Communications satellite systems reliability 1972
100-101 6 p. 474-475
2 p.
artikel
650 Comparative compliance of representative lead designs for surface-mounted components 1990
100-101 6 p. 1206-
1 p.
artikel
651 Comparative thermal performances of various substrate materials in a simple packaging application: actual versus predicted 1990
100-101 6 p. 1205-
1 p.
artikel
652 Comparing HAST results of differently pretreated plastic encapsulated integrated circuits Fokkens, K.
1989
100-101 6 p. 1003-1009
7 p.
artikel
653 Comparison of mean time to first failure and mean up time 1983
100-101 6 p. 1170-
1 p.
artikel
654 Comparison of parametric models for estimating maintenance times from small samples 1982
100-101 6 p. 1189-
1 p.
artikel
655 Comparison of the stability of gold and palladium alloy connector contacts subjected to vibration 1987
100-101 6 p. 1028-
1 p.
artikel
656 Comparison of TID response in core, input/output and high voltage transistors for flash memory Liu, Zhangli
2011
100-101 6 p. 1148-1151
4 p.
artikel
657 Comparison of two dissimilar unit reliability models with three types of repair facilities Mokaddis, G.S.
1989
100-101 6 p. 925-945
21 p.
artikel
658 Comparison of two stochastic models for two-unit series system with cold standbys Moafi, S.E.
1991
100-101 6 p. 1105-1111
7 p.
artikel
659 Comparison of two unit cold standby reliability models with three types of repair facilities 1984
100-101 6 p. 1098-
1 p.
artikel
660 Comparison of variants of integrated digital circuits 1971
100-101 6 p. 417-
1 p.
artikel
661 Complex mission worth optimization by redundancies 1972
100-101 6 p. 476-
1 p.
artikel
662 Complex two-unit system with preventive maintenance 1982
100-101 6 p. 1186-
1 p.
artikel
663 Component failure and compensators 1983
100-101 6 p. 1173-
1 p.
artikel
664 Component linearity test improves reliability screening through measurement of third harmonic index 1973
100-101 6 p. 491-
1 p.
artikel
665 Component reliability Rackstraw, R.R.
1971
100-101 6 p. 425-426
2 p.
artikel
666 Component reliability exposed to thermal neutron environment—III Lal, Krishan
1977
100-101 6 p. 675-677
3 p.
artikel
667 Component reliability under environmental stress Yadav, R.P.S.
1974
100-101 6 p. 473-475
3 p.
artikel
668 Composite-type pin grid array package 1987
100-101 6 p. 1037-
1 p.
artikel
669 Composition and stress state of thin films deposited by ion beam sputtering 1977
100-101 6 p. 659-
1 p.
artikel
670 Comprehensive test strategies help cut costs of manufacturing 1982
100-101 6 p. 1189-
1 p.
artikel
671 Computationally efficient large-change statistical analysis of linear electronic circuits Ilić, T.
2000
100-101 6 p. 1023-1038
16 p.
artikel
672 Computation of mean time to failure for a system with simple redundancy 1987
100-101 6 p. 1034-
1 p.
artikel
673 Computer-aided design of an eight bit binary counter N-MOS chip for large scale integration (LSI) 1985
100-101 6 p. 1170-
1 p.
artikel
674 Computer aided design of LSI: an I2L case study 1980
100-101 6 p. 909-
1 p.
artikel
675 Computer-aided determination of tests for the detection and localisation of faults in electronic circuits and systems 1980
100-101 6 p. 903-
1 p.
artikel
676 Computer aided mask generation for integrated circuits 1974
100-101 6 p. 446-
1 p.
artikel
677 Computer-aided reliability analysis of complicated networks 1972
100-101 6 p. 479-
1 p.
artikel
678 Computer-aided sequential testing for equipment reliability Lafond, G.
1974
100-101 6 p. 477-482
6 p.
artikel
679 Computer aided synthesis of fault-trees 1977
100-101 6 p. 645-
1 p.
artikel
680 Computer communication networks—A study in the Indian context Arora, R.K.
1990
100-101 6 p. 1081-1084
4 p.
artikel
681 Computer contracts: negotiating user protection 1985
100-101 6 p. 1159-
1 p.
artikel
682 Computer controlled batch process manufacture of thin film resistor networks on ceramic substrates 1971
100-101 6 p. 424-
1 p.
artikel
683 Computerized reliability analysis using REACT 1970
100-101 6 p. 450-
1 p.
artikel
684 Computerized system uses laser for functional trimming 1976
100-101 6 p. 531-
1 p.
artikel
685 Computer program for approximating the reliability characteristics of acyclic directed graphs 1977
100-101 6 p. 644-
1 p.
artikel
686 Computers are like cancer because they are completely out of sync with their total environment Gianelle, W.H.
1970
100-101 6 p. 437-
1 p.
artikel
687 Computers help design reliable telephone systems Gambrill, L.M.
1973
100-101 6 p. 505-511
7 p.
artikel
688 Computer simulation of hybrid integrated circuits including combined electrical and thermal effects 1983
100-101 6 p. 1186-
1 p.
artikel
689 Computer software quality measurements and metrics Sherif, Y.S.
1985
100-101 6 p. 1105-1150
46 p.
artikel
690 4482953 Computer with console addressable PLA storing control microcode and microinstructions for self-test of internal registers and ALU Burke, GaryR
1985
100-101 6 p. 1176-
1 p.
artikel
691 Computing failure frequency, MTBF & MTTR via mixed products of availabilities and unavailabilities 1982
100-101 6 p. 1184-
1 p.
artikel
692 Computing k-out-of-n system reliability 1985
100-101 6 p. 1167-
1 p.
artikel
693 Condemnation rates from failure data 1976
100-101 6 p. 525-526
2 p.
artikel
694 Conference 1976
100-101 6 p. 515-518
4 p.
artikel
695 Conference report Mittal, K.L.
1978
100-101 6 p. 471-472
2 p.
artikel
696 Conference Report “Testing in Electronics” G.W.A.D,
1972
100-101 6 p. 489-492
4 p.
artikel
697 Confidence bounds for the percentiles of a wearout failure distribution 1986
100-101 6 p. 1192-
1 p.
artikel
698 Confidence intervals for comparing two life distributions 1980
100-101 6 p. 901-902
2 p.
artikel
699 Confidence intervals for reliability from stress - strength relationships 1985
100-101 6 p. 1162-
1 p.
artikel
700 Confidence limits 1971
100-101 6 p. 411-
1 p.
artikel
701 Confidence limits for steady state availability of systems with lognormal operating time and inverse Gaussian repair time Chandrasekhar, P.
1997
100-101 6 p. 969-971
3 p.
artikel
702 Confidence limits on the failure rate and a rapid projection nomogram for the lognormal distribution 1984
100-101 6 p. 1098-
1 p.
artikel
703 Configuration management: The interface of enigneering, production, and quality control 1970
100-101 6 p. 448-
1 p.
artikel
704 Connection between ESR and electrical conduction in amorphous Si films 1977
100-101 6 p. 656-
1 p.
artikel
705 Consideration for effective warranty application 1976
100-101 6 p. 519-
1 p.
artikel
706 Considerations in formulation and manufacturing of thick film inks 1982
100-101 6 p. 1195-
1 p.
artikel
707 Constant current stress-induced leakage current in mixed HfO2–Ta2O5 stacks Atanassova, E.
2010
100-101 6 p. 794-800
7 p.
artikel
708 Constructing fault-trees by stepwise refinement 1983
100-101 6 p. 1172-
1 p.
artikel
709 Contact failures of crossbar switching system 1973
100-101 6 p. 496-497
2 p.
artikel
710 Contact hole etching in a load-locked hexagonal reactive ion etching system 1985
100-101 6 p. 1174-
1 p.
artikel
711 Contamination control: new dimensions in VLSI manufacturing 1984
100-101 6 p. 1099-1100
2 p.
artikel
712 Contamination control using HCl gas: effects on silica glass and minority carrier lifetime 1986
100-101 6 p. 1196-
1 p.
artikel
713 Contract bid evaluation Reiche, Hans
1977
100-101 6 p. 699-700
2 p.
artikel
714 Contribution of discrete and flat thick film resistors to logic circuit reliability 1970
100-101 6 p. 465-
1 p.
artikel
715 Contribution to ion implantation through a narrow slit at higher energies 1983
100-101 6 p. 1187-
1 p.
artikel
716 Control chip handles error checking and character-hased protocols easily 1980
100-101 6 p. 913-
1 p.
artikel
717 Controlled collapse reflow chip joining 1970
100-101 6 p. 457-458
2 p.
artikel
718 Controlling potential static charge problems 1977
100-101 6 p. 641-
1 p.
artikel
719 Controlling static in wafer fabrication 1986
100-101 6 p. 1193-
1 p.
artikel
720 Controlling the quality of soldering of PTH solder joints 1985
100-101 6 p. 1161-1162
2 p.
artikel
721 Control of Boron diffusion in polysilicon for constructing overlapping polysilicon gate charge-coupled devices 1983
100-101 6 p. 1187-
1 p.
artikel
722 Control of film properties by r.f-sputtering techniques 1972
100-101 6 p. 484-485
2 p.
artikel
723 Control of polysilicon film properties 1984
100-101 6 p. 1102-
1 p.
artikel
724 Cooling of microelectronics 1971
100-101 6 p. 417-
1 p.
artikel
725 Core excitons in Si x Ge 1−x alloys 1984
100-101 6 p. 1104-
1 p.
artikel
726 Corrected bounds for reliability when strength and stress distributions are known Sharma, K.K.
1991
100-101 6 p. 1077-1079
3 p.
artikel
727 Correlation between thick-film resistance values 1977
100-101 6 p. 657-
1 p.
artikel
728 Correlation considerations: Real HBM to TLP and HBM testers Barth, Jon
2002
100-101 6 p. 909-917
9 p.
artikel
729 Correlation of reliability performance measurements 1970
100-101 6 p. 455-
1 p.
artikel
730 Corrosion of in-base solders 1978
100-101 6 p. 476-
1 p.
artikel
731 Corrosion resistance of several integrated-circuit metallization systems 1971
100-101 6 p. 412-
1 p.
artikel
732 Cost analyses for avionics acquisition 1980
100-101 6 p. 903-
1 p.
artikel
733 Cost analysis of a 3-state 2-unit repairable system 1984
100-101 6 p. 1098-
1 p.
artikel
734 Cost analysis of a three-state parallel redundant complex system Gupta, P.P.
1985
100-101 6 p. 1021-1027
7 p.
artikel
735 Cost analysis of a three-state standby redundant electronic equipment Gupta, P.P.
1985
100-101 6 p. 1029-1033
5 p.
artikel
736 Cost analysis of a two-dissimilar unit cold standby redundant system with administrative delay and no priority in repair Elias, S.S.
1990
100-101 6 p. 1155-1177
23 p.
artikel
737 Cost analysis of a two-unit chargeable standby system with interchangeable units and two types of failure Goel, L.R.
1992
100-101 6 p. 775-779
5 p.
artikel
738 Cost analysis of a two-unit standby system with two types of repairmen 1985
100-101 6 p. 1166-1167
2 p.
artikel
739 Cost analysis of a two unit, three state standby redundant complex system with two types of repair facilities under waiting Gupta, P.P.
1987
100-101 6 p. 959-963
5 p.
artikel
740 Cost analysis of the machine-repair problem with R non-reliable service stations Wang, K.-H.
1995
100-101 6 p. 923-934
12 p.
artikel
741 Cost-benefit analysis of a n-unit two-server system with preventive maintenance Gopalan, M.N.
1986
100-101 6 p. 1077-1081
5 p.
artikel
742 Cost-benefit analysis of a 2-unit cold standby system subject to slow switch Gopalan, M.N.
1984
100-101 6 p. 1019-1021
3 p.
artikel
743 Cost-benefit analysis of repairable systems subject to slow switch: A state-of-art survey Gopalan, M.N.
1986
100-101 6 p. 1083-1087
5 p.
artikel
744 Cost-benefit analysis of single-server n-unit imperfect switch system with adjustable repair Gopalan, M.N.
1991
100-101 6 p. 1085-1087
3 p.
artikel
745 Cost effectiveness analysis of utilizing flow improvers for crude oil Abdel Halim, M.M.
1985
100-101 6 p. 1151-1156
6 p.
artikel
746 Cost-effective reliable software engineering and development 1985
100-101 6 p. 1164-
1 p.
artikel
747 Cost effective semiconductor memory testing 1980
100-101 6 p. 907-
1 p.
artikel
748 Cost function analysis of a 3-state repairable system 1984
100-101 6 p. 1098-
1 p.
artikel
749 Cost study of a complex system under waiting Gupta, P.P.
1986
100-101 6 p. 1051-1054
4 p.
artikel
750 Courses 1978
100-101 6 p. 553-
1 p.
artikel
751 Courses 1977
100-101 6 p. 629-631
3 p.
artikel
752 Courses 1976
100-101 6 p. 505-507
3 p.
artikel
753 Courses in microelectronics and reliability 1970
100-101 6 p. 438-439
2 p.
artikel
754 Cpk applications—Uses and abuses Anjard Sr, R.P.
1991
100-101 6 p. 1123-1125
3 p.
artikel
755 CP/M—A route to cheap software 1982
100-101 6 p. 1192-
1 p.
artikel
756 Creep-fatigue interactions in solders 1990
100-101 6 p. 1200-
1 p.
artikel
757 Critical concentration for metallization of doped germanium and silicon 1976
100-101 6 p. 529-
1 p.
artikel
758 Croissance de monoscristaux de GaAs semi-isolant “non dopés”: trois façons de parvenir au résultat 1983
100-101 6 p. 1184-
1 p.
artikel
759 Cross-modulation and intermodulation performance of MOS-FET's in tuned high-frequency amplifiers 1978
100-101 6 p. 482-
1 p.
artikel
760 Culprits causing avionic equipment failures 1987
100-101 6 p. 1032-1033
2 p.
artikel
761 Current aspects of CAD for integrated circuits 1980
100-101 6 p. 908-
1 p.
artikel
762 Current gain degradation induced by emitter-base avalanche breakdown in silicon planar transistors Melia, A.J.
1976
100-101 6 p. 619-623
5 p.
artikel
763 Current-leakage failures in hybrid microcircuits 1987
100-101 6 p. 1039-
1 p.
artikel
764 Current multiplication in metal-insulator-semiconductor (MIS) tunnel diodes 1974
100-101 6 p. 449-
1 p.
artikel
765 Current noise in thick and thin film resistors 1983
100-101 6 p. 1185-
1 p.
artikel
766 Current reliability issues and future technologies for systems on silicon – processes, circuits, chip architecture, and design Takeda, Eiji
2000
100-101 6 p. 897-908
12 p.
artikel
767 Current transport in metal semiconductor contacts—a unified approach 1972
100-101 6 p. 482-
1 p.
artikel
768 Custom ECL chips boost performance in smaller mainframes 1980
100-101 6 p. 913-
1 p.
artikel
769 Custom power hybrids 1986
100-101 6 p. 1197-
1 p.
artikel
770 Data needs for software reliability modelling 1980
100-101 6 p. 906-
1 p.
artikel
771 D.c. and high-frequency characteristics of built-in channel MOS-FETs 1978
100-101 6 p. 564-
1 p.
artikel
772 Deadlock resolution for distributed real-time database systems Yeung, Chin-Fu
1996
100-101 6 p. 807-820
14 p.
artikel
773 Dealing with hot-carrier aging in nMOS and DMOS, models, simulations and characterizations Mouthaan, A.J
2000
100-101 6 p. 909-917
9 p.
artikel
774 Decision tools for use by management 1978
100-101 6 p. 473-
1 p.
artikel
775 Decoding scheme smooths 18-bit converter's nonlinearity 1980
100-101 6 p. 911-
1 p.
artikel
776 Dedrudging reliability prediction 1987
100-101 6 p. 1035-
1 p.
artikel
777 Deep centers in neutron-transmutation-doped gallium arsenide 1986
100-101 6 p. 1197-1198
2 p.
artikel
778 Deep level defects involved in MOS device instabilities Lenahan, P.M.
2007
100-101 6 p. 890-898
9 p.
artikel
779 Deep levels within the forbidden gap of silicon-on-sapphire films 1970
100-101 6 p. 461-
1 p.
artikel
780 Defect analysis using QC data 1983
100-101 6 p. 1170-
1 p.
artikel
781 Defect Complexes in Semiconductor Structures G.W.A.D.,
1983
100-101 6 p. 1168-
1 p.
artikel
782 Deformation measurement of RF MEMS switches by optical interference Ying, Yu
2004
100-101 6 p. 951-955
5 p.
artikel
783 Degradation of bipolar transistor electrical parameters during sem evaluation Pease, R.L.
1974
100-101 6 p. 549-550
2 p.
artikel
784 Degradation of InGaN blue light-emitting diodes under continuous and low-speed pulse operations Yanagisawa, Takeshi
2003
100-101 6 p. 977-980
4 p.
artikel
785 Degradation of PVF2 capacitors during accelerated test 1978
100-101 6 p. 478-
1 p.
artikel
786 Degradation of thermocompression bonds to Ti-Cu-Au and Ti-Cu thin films by thermal aging 1980
100-101 6 p. 898-
1 p.
artikel
787 Delay line using thick film ferromagnetic material 1974
100-101 6 p. 452-
1 p.
artikel
788 Delay related reliability: A new performance index for computer communication network dynamics Aggarwal, K.K.
1994
100-101 6 p. 1079-1087
9 p.
artikel
789 Demand-paged memory management boosts 16-bit microsystem throughput 1983
100-101 6 p. 1182-
1 p.
artikel
790 Demands of LSI are turning chip makers towards automation, production innovations 1977
100-101 6 p. 650-
1 p.
artikel
791 Dense, interchangeable ROMs work with fast microprocessors 1978
100-101 6 p. 564-
1 p.
artikel
792 Density upgrading in tape automated bonding 1983
100-101 6 p. 1179-
1 p.
artikel
793 Dependability modeling of real-time systems using stochastic reward nets Constantinescu, Cristian
1995
100-101 6 p. 903-914
12 p.
artikel
794 Dependability modeling of safety systems 1983
100-101 6 p. 1176-
1 p.
artikel
795 Dependability of Engineering Systems Stojadinovic, Ninoslav
2002
100-101 6 p. 993-
1 p.
artikel
796 Dependence of activation energy on subband splitting and magnetic field in silicon inversion layers 1989
100-101 6 p. 1102-
1 p.
artikel
797 Dependence of the operating point on h.f. characteristics of bipolar integrated transistors 1978
100-101 6 p. 481-482
2 p.
artikel
798 Depletion—capacitance-induced distortion in surface-channel c.c.d. transversal filters 1977
100-101 6 p. 653-
1 p.
artikel
799 Deposited oxide contours in multi-layer metal circuitry 1971
100-101 6 p. 416-
1 p.
artikel
800 Deposited oxide contours in multi-layer metal circuitry 1971
100-101 6 p. 416-417
2 p.
artikel
801 Deposition and Auger analysis of deposited SiO2 on AlxGa (1 − x) As 1974
100-101 6 p. 449-
1 p.
artikel
802 Deposition and patterning of the tungsten and tantalum polycides 1984
100-101 6 p. 1099-
1 p.
artikel
803 Depth chemical profiles of MNOS structures measured by AES 1977
100-101 6 p. 656-
1 p.
artikel
804 Design and cost analysis of a refining system in the sugar industry Kumar, Dinesh
1990
100-101 6 p. 1025-1028
4 p.
artikel
805 Design and evaluation methodology for built-in-test 1982
100-101 6 p. 1186-1187
2 p.
artikel
806 Design and implementation of flexible and stretchable systems Gonzalez, Mario
2011
100-101 6 p. 1069-1076
8 p.
artikel
807 Design and performance of micron-size devices 1978
100-101 6 p. 562-
1 p.
artikel
808 Design and realization of microwave amplifiers for S-band by thin film distributed networks 1974
100-101 6 p. 452-453
2 p.
artikel
809 Design aspects and reliability of a synchronizer made in MOS technology 1980
100-101 6 p. 908-
1 p.
artikel
810 Design, development and reliability testing of a low power bridge-type micromachined hotplate Prasad, Mahanth
2015
100-101 6 p. 937-944
8 p.
artikel
811 Design for reliability in hostile environment 1977
100-101 6 p. 649-
1 p.
artikel
812 Design for testability—a survey 1983
100-101 6 p. 1179-
1 p.
artikel
813 Design-for-test for Digital ICs and Embedded Core Systems; Alfred L. Crouch. Prentice Hall, Inc., Upper Saddle River, NJ, 07458, hardcover, p. 349, CD ROM included, ISBN: 0-13-084827-1, $80,50. Stojcev, M
2000
100-101 6 p. 1065-
1 p.
artikel
814 Designing built-in test for microprocessors 1984
100-101 6 p. 1097-
1 p.
artikel
815 Designing for reliable operation of urea synthesis in the fertilizer industry Singh, Jai
1990
100-101 6 p. 1021-1024
4 p.
artikel
816 Designing logic boards for automatic testing 1974
100-101 6 p. 446-447
2 p.
artikel
817 Design limits when using Gold-Al bonds 1971
100-101 6 p. 412-
1 p.
artikel
818 Design of a comprehensive process evaluation vehicle for development of small geometry CMOS process 1985
100-101 6 p. 1169-
1 p.
artikel
819 Design of a single-stress relaxation test for pressure connections 1977
100-101 6 p. 653-
1 p.
artikel
820 Design of complex microstrip circuits by measurement and computer modelling 1971
100-101 6 p. 415-
1 p.
artikel
821 Design of customised microelectronics masks using off-line and on-line computer aids 1971
100-101 6 p. 418-
1 p.
artikel
822 Design of differential low-noise amplifier with cross-coupled-SCR ESD protection scheme Lin, Chun-Yu
2010
100-101 6 p. 831-838
8 p.
artikel
823 Design of highly reliable electronic transformer 1972
100-101 6 p. 473-
1 p.
artikel
824 Design of metal interconnects for stretchable electronic circuits Gonzalez, Mario
2008
100-101 6 p. 825-832
8 p.
artikel
825 Design of reliable yet economical industrial control systems 1970
100-101 6 p. 453-
1 p.
artikel
826 Design of temperature-controlled substrate for hybrid microcircuits 1974
100-101 6 p. 452-
1 p.
artikel
827 Design rules for microstrip capacitance 1989
100-101 6 p. 1101-
1 p.
artikel
828 Design trade-offs between organic polymer-on-metal PWB's and ceramic thick-film PWB's for high-density operation using leadless ceramic chip carriers 1989
100-101 6 p. 1101-
1 p.
artikel
829 Detection-Correction decoding for system reliability 1971
100-101 6 p. 414-
1 p.
artikel
830 Detection of internal crystal imperfections 1970
100-101 6 p. 452-
1 p.
artikel
831 Determination of contact parameters of Ni/n-GaP Schottky contacts Duman, S.
2012
100-101 6 p. 1005-1011
7 p.
artikel
832 Determination of effective burn-in time for printed board assembly Koh, J.S.
1995
100-101 6 p. 893-902
10 p.
artikel
833 Determination of GaN HEMT reliability by monitoring I DSS Pazirandeh, R.
2010
100-101 6 p. 763-766
4 p.
artikel
834 Determination of neutral region carrier concentrations in P-N junctions using quasi fermi levels 1973
100-101 6 p. 500-
1 p.
artikel
835 Determination of optimal overhaul intervals and inspection frequencies—A case study 1978
100-101 6 p. 562-
1 p.
artikel
836 Determination of optimum burn-in time: A composite criterion 1971
100-101 6 p. 411-
1 p.
artikel
837 Determination of reliability from ramped voltage breakdown experiments: application to dual dielectric MIM capacitors 1985
100-101 6 p. 1161-
1 p.
artikel
838 Determination of software release instant using a nonhomogeneous error detection rate model Aggarwal, K.K.
1993
100-101 6 p. 803-807
5 p.
artikel
839 Determination of strain in 10 μm spots using a microdiffractometer 1978
100-101 6 p. 482-
1 p.
artikel
840 Determination of surface state density from gm-Vg characteristics of MOSFETs 1978
100-101 6 p. 566-
1 p.
artikel
841 Determination of the mobility profile in silicon-on-sapphire material using the “fat” FET principle 1989
100-101 6 p. 1102-
1 p.
artikel
842 Determine project risk using statistical methods 1983
100-101 6 p. 1171-
1 p.
artikel
843 Determining heat sink requirements for ceramic LCCs 1987
100-101 6 p. 1036-
1 p.
artikel
844 Determining optimum reliability programs 1970
100-101 6 p. 449-
1 p.
artikel
845 Determining sample size when searching for rare items 1983
100-101 6 p. 1172-
1 p.
artikel
846 Deterministic failure prediction 1987
100-101 6 p. 1034-
1 p.
artikel
847 Developing an approach to semiconductor failure analysis and curve tracer interpretation 1978
100-101 6 p. 483-
1 p.
artikel
848 Developing a working mix-and-match lithography system 1986
100-101 6 p. 1195-
1 p.
artikel
849 Development and evaluation of a pre-encapsulation cleaning process to improve reliability of HIC's with aluminum metallized chips 1982
100-101 6 p. 1198-
1 p.
artikel
850 Development and reliability evaluation of high reliability IC memory card 1989
100-101 6 p. 1095-
1 p.
artikel
851 Development of a coated wire bonding technology 1990
100-101 6 p. 1206-
1 p.
artikel
852 Development of a novel resistor system for nitrogen firing applications 1985
100-101 6 p. 1173-
1 p.
artikel
853 Development of embedded piezoelectric acoustic sensor array architecture Ghoshal, Anindya
2010
100-101 6 p. 857-863
7 p.
artikel
854 Development of highly reliable surface mount packages 1989
100-101 6 p. 1094-
1 p.
artikel
855 Development of performance functions for communication/computer systems and its application to dynamic performance analysis Sumita, Ushio
1989
100-101 6 p. 973-991
19 p.
artikel
856 Development of ship equipment maintenance history 1987
100-101 6 p. 1035-
1 p.
artikel
857 Development of stress screens 1987
100-101 6 p. 1032-
1 p.
artikel
858 Development of substrate-pumped nMOS protection for a 0.13 μm technology Salling, Craig
2002
100-101 6 p. 887-899
13 p.
artikel
859 Development of the thick-film capacitor and its application for hybrid circuit modules 1980
100-101 6 p. 915-
1 p.
artikel
860 Developments in crystal growth from high-temperature solutions 1983
100-101 6 p. 1183-
1 p.
artikel
861 Developments likely to improve the reliability of plastic encapsulated devices 1978
100-101 6 p. 560-
1 p.
artikel
862 Device failure analysis in VLSI circuits due to missing flashes in mask fabrication process—A case study Srivastava, A.
1988
100-101 6 p. 885-888
4 p.
artikel
863 Device modeling 1983
100-101 6 p. 1180-
1 p.
artikel
864 4660069 Device with captivate chip capacitor devices and method of making the same Kochanski, Ronald
1987
100-101 6 p. 1042-
1 p.
artikel
865 Diagnostic specification—a proposed approach 1982
100-101 6 p. 1186-
1 p.
artikel
866 Die attach evaluation using test chips containing localized temperature measurement diodes 1987
100-101 6 p. 1036-
1 p.
artikel
867 Die attach in hi-rel P-dips: polyimides or low chloride epoxies? 1985
100-101 6 p. 1168-
1 p.
artikel
868 Die-attachment solutions for SiC power devices Kisiel, R.
2009
100-101 6 p. 627-629
3 p.
artikel
869 Die Berechnung des komplexen Widerstandes von Dünnschichtkondensatoren 1970
100-101 6 p. 465-
1 p.
artikel
870 Dielectric breakdown of gate insulator due to reactive ion etching 1984
100-101 6 p. 1106-
1 p.
artikel
871 Dielectric films for Ge planar devices 1970
100-101 6 p. 463-
1 p.
artikel
872 Dielectric insulating method VM for manufacturing transistors and integrated circuits 1972
100-101 6 p. 480-
1 p.
artikel
873 Dielectric/semiconductor interfaces analysis using spectroscopic ellipsometry 1983
100-101 6 p. 1183-
1 p.
artikel
874 DIFAR Reliability experience: 781 and Field 1976
100-101 6 p. 526-
1 p.
artikel
875 Differential pressure test: A quantitative stress test method for bonded beam-leaded devices 1971
100-101 6 p. 412-
1 p.
artikel
876 Difficulties in fault-tree synthesis for process plant 1980
100-101 6 p. 902-903
2 p.
artikel
877 Diffusion barriers in advanced semiconductor device technology 1986
100-101 6 p. 1197-
1 p.
artikel
878 Diffusion characteristics of antimony and phosphorus spin-on sources 1983
100-101 6 p. 1184-
1 p.
artikel
879 Diffusion data Vol. 5, No. 1. (1971) Rule, A.F.E.
1971
100-101 6 p. 426-
1 p.
artikel
880 Diffusion studies of Be-implanted GaAs by SIMS and electrical profiling 1978
100-101 6 p. 569-
1 p.
artikel
881 Digital computer systems reliability 1985
100-101 6 p. 1167-1168
2 p.
artikel
882 Digital filter analysis with personal computer Bozic, S.M.
1980
100-101 6 p. 836-845
10 p.
artikel
883 4730316 Digital integrated circuits Desyllas, PeterLL
1988
100-101 6 p. 1000-
1 p.
artikel
884 4730317 Digital integrated circuits Desyllas, PeterLL
1988
100-101 6 p. 1000-
1 p.
artikel
885 Digital system diagnostics-design/evaluation 1980
100-101 6 p. 905-
1 p.
artikel
886 Digital TV: makers bet on VLSI 1983
100-101 6 p. 1181-
1 p.
artikel
887 Digitizing, layout, rule checking—the everyday tasks of chip designers 1983
100-101 6 p. 1180-
1 p.
artikel
888 Digraphs and their applications in fault tree analysis 1980
100-101 6 p. 904-
1 p.
artikel
889 Direct computation for consecutive-k-out-of-n: F systems 1983
100-101 6 p. 1172-
1 p.
artikel
890 Direct gold and copper wires bonding on copper Ho, Hong Meng
2003
100-101 6 p. 913-923
11 p.
artikel
891 Direct liquid cooling of microelectronics 1971
100-101 6 p. 416-
1 p.
artikel
892 Direct observation of the ground state splitting of the indirect free exciton in silicon 1976
100-101 6 p. 530-
1 p.
artikel
893 Direct optimisation for calculating maximum likelihood estimates of parameters of the Weibull distribution 1982
100-101 6 p. 1187-
1 p.
artikel
894 Discussion about the number of wiring layers for logic LSL 1973
100-101 6 p. 498-
1 p.
artikel
895 Dissolution rates and reliability effects of Au, Ag, Ni and Cu in lead base solders 1973
100-101 6 p. 493-
1 p.
artikel
896 Distributed computer network takes charge in IC faeility 1980
100-101 6 p. 913-
1 p.
artikel
897 Distributed mosfet amplifier using Microstrip 1973
100-101 6 p. 499-
1 p.
artikel
898 Distribution function relaxation times in gallium arsenide 1977
100-101 6 p. 655-
1 p.
artikel
899 Distribution of a life ratio and its application 1983
100-101 6 p. 1171-
1 p.
artikel
900 Distribution of downtimes 1974
100-101 6 p. 445-
1 p.
artikel
901 DMA controller adds muscle to offload microprocessor 1983
100-101 6 p. 1182-
1 p.
artikel
902 3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package Liu, Yong
2008
100-101 6 p. 811-824
14 p.
artikel
903 Does ultrasonic cleaning damage components? 1990
100-101 6 p. 1205-
1 p.
artikel
904 Donor-acceptor pair capture cross-section for highly excited electrons in polar semiconductors 1984
100-101 6 p. 1103-1104
2 p.
artikel
905 Donor generation in monocrystalline silicon by Halogen implantation 1983
100-101 6 p. 1187-
1 p.
artikel
906 Don't let avoidable reed-relay pitfalls cripple your equipment designs 1972
100-101 6 p. 472-
1 p.
artikel
907 Dopant profiles on thin layer silicon structures with the spreading resistance technique 1982
100-101 6 p. 1192-
1 p.
artikel
908 Dormant storage reliability assessments—data based 1982
100-101 6 p. 1184-1185
2 p.
artikel
909 Double failure and other related problems in standby redundancy 1972
100-101 6 p. 477-
1 p.
artikel
910 Double level metallurgy defect study 1978
100-101 6 p. 483-
1 p.
artikel
911 Double-sided photolithography 1978
100-101 6 p. 481-
1 p.
artikel
912 Draft DoD directive 5000.xx, Reliability and Maintainability 1980
100-101 6 p. 897-
1 p.
artikel
913 Drain characteristics of thin film MOS FET's 1977
100-101 6 p. 658-
1 p.
artikel
914 Dry etching induced damage in Si and GaAs 1984
100-101 6 p. 1101-
1 p.
artikel
915 Dual-frequency addressing of liquid crystal devices Clark, Michael G.
1981
100-101 6 p. 887-900
14 p.
artikel
916 Duplicateur de masques a rayons X pour lithographie submicronique 1982
100-101 6 p. 1192-
1 p.
artikel
917 Durability and stability of various insulating films against the high temperature water in an autoclave 1971
100-101 6 p. 421-
1 p.
artikel
918 Dynamic characterization of surface-mount component leads for solder joint inspection 1990
100-101 6 p. 1200-
1 p.
artikel
919 Dynamic I2L random-access memory competes with MOS designs 1976
100-101 6 p. 528-
1 p.
artikel
920 Dynamic modeling for resin self-alignment mechanism Kim, J.M.
2004
100-101 6 p. 983-992
10 p.
artikel
921 Dynamic NBTI characteristics of PMOSFETs with PE-SiN capping Lu, C.Y.
2007
100-101 6 p. 924-929
6 p.
artikel
922 Dynamic performance of Schottky-barrier field-effect transistors 1970
100-101 6 p. 459-460
2 p.
artikel
923 Dynamic properties of microelectronic digital systems 1983
100-101 6 p. 1182-
1 p.
artikel
924 Dynamic-RAM fabrication poised for continuing C-H-MOS invasion 1984
100-101 6 p. 1103-
1 p.
artikel
925 Dynamic redundancy allocation using Monte-Carlo optimization Ramachandran, V.
1990
100-101 6 p. 1131-1136
6 p.
artikel
926 Dynamics of spin coating on very rough surfaces Hershcovitz, M.
1993
100-101 6 p. 869-880
12 p.
artikel
927 Early design phase life cycle reliability modeling 1987
100-101 6 p. 1033-
1 p.
artikel
928 E-beam probing systems: filling the submicron gap 1986
100-101 6 p. 1198-
1 p.
artikel
929 Economic benefits of part quality knowledge 1985
100-101 6 p. 1165-
1 p.
artikel
930 Economic considerations in multilayer thick film hybrids 1974
100-101 6 p. 452-
1 p.
artikel
931 Economic design of the mean prognostic distance for canary-equipped electronic systems Wang, Wenbin
2012
100-101 6 p. 1086-1091
6 p.
artikel
932 Economics of functional testing at selected levels 1982
100-101 6 p. 1185-
1 p.
artikel
933 E/D gate MOSFET 1974
100-101 6 p. 448-
1 p.
artikel
934 Editorial Grasser, Tibor
2007
100-101 6 p. 839-840
2 p.
artikel
935 Editorial Ersland, Peter
2010
100-101 6 p. 757-
1 p.
artikel
936 EE-PROMs open new application areas to the design engineer 1984
100-101 6 p. 1102-
1 p.
artikel
937 Effective lifetimes in high quality silicon devices 1984
100-101 6 p. 1104-
1 p.
artikel
938 Effective reliability planning and implementation 1976
100-101 6 p. 526-
1 p.
artikel
939 Effect of annealing treatment and nanomechanical properties for multilayer Si0.8Ge0.2–Si films He, Bo-Ching
2010
100-101 6 p. 851-856
6 p.
artikel
940 Effect of band structure on the voltage-current characteristics of metal-insulator-metal tunnel junctions 1972
100-101 6 p. 483-
1 p.
artikel
941 Effect of geometry on double injection in semiconductors 1971
100-101 6 p. 421-
1 p.
artikel
942 Effect of high-temperature H2-anneals on the slow-trapping instability of MOS structures 1978
100-101 6 p. 566-567
2 p.
artikel
943 Effect of intermittent repair in a two unit redundant system with standby failure Rastogi, A.K.
1983
100-101 6 p. 1051-1054
4 p.
artikel
944 Effect of ion beam etching on metal-Si and metal-GaAs barriers 1985
100-101 6 p. 1174-
1 p.
artikel
945 Effect of ionizing radiation on second breakdown 1973
100-101 6 p. 492-
1 p.
artikel
946 Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling 1990
100-101 6 p. 1201-
1 p.
artikel
947 Effect of localised charges on nanoscale cylindrical surrounding gate MOSFET: Analog performance and linearity analysis Gautam, Rajni
2012
100-101 6 p. 989-994
6 p.
artikel
948 Effect of oxidation on the breakdown characteristics of aluminium diffused junctions 1977
100-101 6 p. 643-644
2 p.
artikel
949 Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys Chavali, S.
2013
100-101 6 p. 892-898
7 p.
artikel
950 Effect of reliability programs on life cycle cost—a case history 1978
100-101 6 p. 561-
1 p.
artikel
951 Effect of shunt capacitance on tapered distributed RC network characteristics Au, K.D.
1980
100-101 6 p. 847-852
6 p.
artikel
952 Effect of strain rate on fatigue of low-tin lead-base solder 1990
100-101 6 p. 1201-
1 p.
artikel
953 Effect of switch failure on 2 redundant systems 1980
100-101 6 p. 900-
1 p.
artikel
954 Effect of system processes on error repetition: a probabilistic and measurement approach 1987
100-101 6 p. 1032-
1 p.
artikel
955 Effect of temperature-dependent band shifts on semiconductor transport properties 1977
100-101 6 p. 656-
1 p.
artikel
956 Effect of time-dependent development process on the limit of proximity exposure compensation in electron beam lithography Deshmukh, P.R.
1991
100-101 6 p. 1091-1096
6 p.
artikel
957 Effect of uncertainty in failure rates on memory system reliability 1987
100-101 6 p. 1030-
1 p.
artikel
958 Effects of ambient atmosphere on aluminum-copper wirebond reliability 1985
100-101 6 p. 1160-
1 p.
artikel
959 Effects of annealing on the electric noise in semiconductor lasers Shi, Yingxue
2004
100-101 6 p. 957-961
5 p.
artikel
960 Effects of design automation on the reliability and maintainability design of electronic systems 1978
100-101 6 p. 560-561
2 p.
artikel
961 Effects of electron beam generated in vacuum photo-thermal processing on metal–silicon contacts Golan, G
2001
100-101 6 p. 871-879
9 p.
artikel
962 Effects of field implants on small geometry CMOS devices Roy, J.N.
1987
100-101 6 p. 953-957
5 p.
artikel
963 Effects of industrial air pollutants on electrical contact materials 1974
100-101 6 p. 442-
1 p.
artikel
964 Effects of MBE growth conditions on carbon contamination in GaAs 1983
100-101 6 p. 1183-
1 p.
artikel
965 Effects of oxygen and internal gettering on donor formation 1985
100-101 6 p. 1171-
1 p.
artikel
966 Effects of redundancy management on reliability modeling 1990
100-101 6 p. 1203-
1 p.
artikel
967 Effects of tip clearance and fin density on the performance of heat sinks for VLSI packages 1990
100-101 6 p. 1206-
1 p.
artikel
968 Effects of Weibull hazard rate on common cause failure analysis of reliability networks 1978
100-101 6 p. 562-
1 p.
artikel
969 Effects on LCC of test equipment standardization 1976
100-101 6 p. 524-
1 p.
artikel
970 Efficient algorithms to accurately compute derating factors of digital circuits Asadi, Hossein
2012
100-101 6 p. 1215-1226
12 p.
artikel
971 Efficient test pattern generators based on specific cellular automata structures Garbolino, T.
2002
100-101 6 p. 975-983
9 p.
artikel
972 Ein schnelles Verfahren zur Berechnung der Auswirkungen von Bauelementetoleranzen bei einer Klasse von Zweitorschaltungen 1971
100-101 6 p. 415-
1 p.
artikel
973 Electrical activation and impurity redistribution during pulsed laser annealing of BF+ 2 implanted amorphized silicon 1982
100-101 6 p. 1198-
1 p.
artikel
974 Electrical and structural dependence of operating temperature of AlGaN/GaN HEMTs Heller, Eric
2013
100-101 6 p. 872-877
6 p.
artikel
975 Electrical breakdown and selfhealing in solid tantalum capacitors 1971
100-101 6 p. 413-
1 p.
artikel
976 Electrical characteristics of ion-implanted p-channel MOS transistors 1974
100-101 6 p. 453-
1 p.
artikel
977 Electrical characteristics of r.f.-sputtered CdTe thin-films for photovoltaic applications 1984
100-101 6 p. 1105-
1 p.
artikel
978 Electrical characterization of silicon surface after reactive ion etching of silicon dioxide by CHF3 Tong, K.Y.
1990
100-101 6 p. 1111-1116
6 p.
artikel
979 Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators Chen, Bing-Liang
2012
100-101 6 p. 1080-1085
6 p.
artikel
980 Electrically conductive epoxies for screen printing applications 1977
100-101 6 p. 651-
1 p.
artikel
981 Electrically-conductive epoxies—today's bonding material for microelectronics 1972
100-101 6 p. 480-
1 p.
artikel
982 4376947 Electrically programmable floating gate semiconductor memory device Chiu, Te-Long
1983
100-101 6 p. 1196-
1 p.
artikel
983 Electrical overstress failure analysis in microcircuits 1978
100-101 6 p. 476-
1 p.
artikel
984 Electrical properties of Cr-Al alloy thin films 1987
100-101 6 p. 1038-1039
2 p.
artikel
985 Electrical properties of silicon doped with platinum 1970
100-101 6 p. 460-
1 p.
artikel
986 Electrical properties of (SN) x films 1978
100-101 6 p. 484-
1 p.
artikel
987 Electrical properties of thin films-metal-semiconductor contacts. 1. Metal-semiconductor junctions-related to deposition of thin films 1977
100-101 6 p. 657-
1 p.
artikel
988 Electrical ratings of electronic components from the viewpoint of reliability 1977
100-101 6 p. 642-643
2 p.
artikel
989 Electrical resistivity and surface profile due to Al/Si/Ti reaction kinetics on an oxidised silicon wafer 1987
100-101 6 p. 1037-
1 p.
artikel
990 Electrical stress and plasma-induced traps in SiO2 Paskaleva, A.
2000
100-101 6 p. 933-940
8 p.
artikel
991 Electric measuring equipment output to reach ¥700 billion 1990
100-101 6 p. 1204-
1 p.
artikel
992 Electric subbands in p-type germanium inversion layers 1983
100-101 6 p. 1184-
1 p.
artikel
993 Electroless nickel resistors formed on IMST substrate 1982
100-101 6 p. 1196-
1 p.
artikel
994 Electromigration and hall effect in cobalt films 1977
100-101 6 p. 658-
1 p.
artikel
995 Electromigration behavior analysis of aluminum alloys thin film conductors using maximum likelihood methods Weis, E.A.
1992
100-101 6 p. 887-900
14 p.
artikel
996 Electromigration failure under pulse test conditions 1978
100-101 6 p. 474-475
2 p.
artikel
997 Electromigration-induced failures in VLSI interconnects 1983
100-101 6 p. 1169-
1 p.
artikel
998 Electromigration in integrated circuits 1970
100-101 6 p. 451-
1 p.
artikel
999 Electromigration mechanism in aluminium conductors 1980
100-101 6 p. 898-
1 p.
artikel
1000 Electromigration mechanisms in aluminium lines 1986
100-101 6 p. 1196-
1 p.
artikel
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