| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayes approach to simultaneous evaluation of similar assemblies
|
|
|
1990
|
100-101 |
6 |
p. 1202-
1 p.
|
artikel
|
| 2 |
A Bayesian approach to parameter and reliability estimation in the Poisson distribution
|
|
|
1972
|
100-101 |
6 |
p. 472-
1 p.
|
artikel
|
| 3 |
A Bayesian estimate of reliability in the Weibull distribution
|
|
|
1974
|
100-101 |
6 |
p. 442-
1 p.
|
artikel
|
| 4 |
A Bayesian reliability model with a stochastically memotone failure rate
|
|
|
1974
|
100-101 |
6 |
p. 445-
1 p.
|
artikel
|
| 5 |
A 6-bit monolithic video flash converter
|
Lonsborough, M.
|
|
1981
|
100-101 |
6 |
p. 837-850
14 p.
|
artikel
|
| 6 |
A bonding-wire failure mode in plastic encaponlated integrated circuits
|
|
|
1973
|
100-101 |
6 |
p. 494-
1 p.
|
artikel
|
| 7 |
A case for large Auger recombination cross sections associated with deep centers in semiconductors
|
|
|
1978
|
100-101 |
6 |
p. 566-
1 p.
|
artikel
|
| 8 |
Accelerated life test calculations using the method of maximum likelihood: an improvement over least squares
|
Whitman, Charles S.
|
|
2003
|
100-101 |
6 |
p. 859-864
6 p.
|
artikel
|
| 9 |
Accelerated life testing for LSI failure mechanisms
|
|
|
1978
|
100-101 |
6 |
p. 476-
1 p.
|
artikel
|
| 10 |
Accelerated life testing of small-geometry printed circuit boards
|
|
|
1985
|
100-101 |
6 |
p. 1161-
1 p.
|
artikel
|
| 11 |
Accelerated life testing of thick-film resistors
|
|
|
1972
|
100-101 |
6 |
p. 484-
1 p.
|
artikel
|
| 12 |
Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages
|
|
|
1978
|
100-101 |
6 |
p. 476-
1 p.
|
artikel
|
| 13 |
Accelerated testing in FAMOS Devices—8K EPROM
|
|
|
1978
|
100-101 |
6 |
p. 478-
1 p.
|
artikel
|
| 14 |
Accelerated versus real time aging tests
|
|
|
1980
|
100-101 |
6 |
p. 905-
1 p.
|
artikel
|
| 15 |
Acceleration factors for environmental testing of integrated circuits
|
|
|
1971
|
100-101 |
6 |
p. 412-
1 p.
|
artikel
|
| 16 |
Acceleration of the growth of Cu3Sn voids in solder joints
|
Borgesen, Peter
|
|
2012
|
100-101 |
6 |
p. 1121-1127
7 p.
|
artikel
|
| 17 |
Accuracy of univariate, bivariate and a “modified double Monte Carlo” technique for finding lower confidence limits of system reliability
|
|
|
1983
|
100-101 |
6 |
p. 1174-
1 p.
|
artikel
|
| 18 |
Accurate IC logic delay measurements
|
|
|
1972
|
100-101 |
6 |
p. 482-
1 p.
|
artikel
|
| 19 |
A charge-sheet model of the MOSFET
|
|
|
1978
|
100-101 |
6 |
p. 564-
1 p.
|
artikel
|
| 20 |
Achieving high reliability in sonar power supplies
|
|
|
1980
|
100-101 |
6 |
p. 902-
1 p.
|
artikel
|
| 21 |
A circuit for high-speed carry propagation in I.S.I.-F.E.T. technology
|
|
|
1976
|
100-101 |
6 |
p. 527-
1 p.
|
artikel
|
| 22 |
A classification system for reliability models
|
|
|
1985
|
100-101 |
6 |
p. 1163-
1 p.
|
artikel
|
| 23 |
A class of distributions useful in life testing and reliability
|
|
|
1977
|
100-101 |
6 |
p. 646-
1 p.
|
artikel
|
| 24 |
A CMOS LSSD test generation system
|
|
|
1985
|
100-101 |
6 |
p. 1159-1160
2 p.
|
artikel
|
| 25 |
A combined digital and linear custom designed array optimised for large volume consumer applications
|
Tero, J.
|
|
1981
|
100-101 |
6 |
p. 769-773
5 p.
|
artikel
|
| 26 |
A common cause failure availability model
|
Dhillon, Balbir S.
|
|
1978
|
100-101 |
6 |
p. 583-584
2 p.
|
artikel
|
| 27 |
A comparative evaluation of IC packages in commercial real-time computer terminals
|
|
|
1976
|
100-101 |
6 |
p. 520-
1 p.
|
artikel
|
| 28 |
A comparison of methods for analyzing censored life data to estimate relationships between and product life
|
|
|
1974
|
100-101 |
6 |
p. 442-
1 p.
|
artikel
|
| 29 |
A complex system having four types of components with pre-emptive repeat priority repairs
|
Singh, I.P.
|
|
1989
|
100-101 |
6 |
p. 959-962
4 p.
|
artikel
|
| 30 |
A complex three-unit system
|
|
|
1985
|
100-101 |
6 |
p. 1162-
1 p.
|
artikel
|
| 31 |
A comprehensive model for PMOS NBTI degradation: Recent progress
|
Alam, M.A.
|
|
2007
|
100-101 |
6 |
p. 853-862
10 p.
|
artikel
|
| 32 |
A computational technique for maximum likelihood estimation with Weibull models
|
|
|
1980
|
100-101 |
6 |
p. 906-
1 p.
|
artikel
|
| 33 |
A computer program for evaluation of system reliability
|
|
|
1972
|
100-101 |
6 |
p. 478-
1 p.
|
artikel
|
| 34 |
A contribution to the current gain temperature dependence of bipolar transistors
|
|
|
1978
|
100-101 |
6 |
p. 566-
1 p.
|
artikel
|
| 35 |
A cost model for skip-lot destructive sampling
|
|
|
1977
|
100-101 |
6 |
p. 644-
1 p.
|
artikel
|
| 36 |
Acoustic microscopy improves internal reliability of IC packaging
|
|
|
1985
|
100-101 |
6 |
p. 1159-
1 p.
|
artikel
|
| 37 |
A creep-rupture model for two-phase eutectic solders
|
|
|
1989
|
100-101 |
6 |
p. 1094-
1 p.
|
artikel
|
| 38 |
A critical evaluation of RGA testing
|
|
|
1990
|
100-101 |
6 |
p. 1205-
1 p.
|
artikel
|
| 39 |
Active filters: new tools for separating frequencies
|
|
|
1971
|
100-101 |
6 |
p. 417-
1 p.
|
artikel
|
| 40 |
Active trimming of hybrid integrated circuits
|
|
|
1984
|
100-101 |
6 |
p. 1105-1106
2 p.
|
artikel
|
| 41 |
A current conduction mechanism in laser recrystallized silicon metal-oxide-semiconductor transistors
|
|
|
1984
|
100-101 |
6 |
p. 1106-1107
2 p.
|
artikel
|
| 42 |
A current pulse screening test for metal step coverage
|
|
|
1973
|
100-101 |
6 |
p. 499-
1 p.
|
artikel
|
| 43 |
A cutset approach to reliability evaluation in communication networks
|
|
|
1983
|
100-101 |
6 |
p. 1173-
1 p.
|
artikel
|
| 44 |
A cyclic queueing system with three servers and optional two-way feedback
|
Madan, K.C.
|
|
1988
|
100-101 |
6 |
p. 873-875
3 p.
|
artikel
|
| 45 |
A damage integral approach to thermal fatigue of solder joints
|
|
|
1990
|
100-101 |
6 |
p. 1200-
1 p.
|
artikel
|
| 46 |
Adaption aux ensembles des condensateurs a dielectrique polypropylene metallise
|
|
|
1978
|
100-101 |
6 |
p. 560-
1 p.
|
artikel
|
| 47 |
Adaptive fault-tolerant DVFS with dynamic online AVF prediction
|
Firouzi, Farshad
|
|
2012
|
100-101 |
6 |
p. 1197-1208
12 p.
|
artikel
|
| 48 |
Adaptive probability distribution estimation based upon maximum entropy
|
|
|
1985
|
100-101 |
6 |
p. 1164-
1 p.
|
artikel
|
| 49 |
A data base management (DBMP) program for integrated logistics support (ILS)
|
|
|
1976
|
100-101 |
6 |
p. 524-
1 p.
|
artikel
|
| 50 |
A datebase design for automated RAM analysis
|
|
|
1987
|
100-101 |
6 |
p. 1028-
1 p.
|
artikel
|
| 51 |
Adding intelligence to the proper/handler-tester interface
|
|
|
1986
|
100-101 |
6 |
p. 1194-
1 p.
|
artikel
|
| 52 |
Addressing, packaging and assembly weaknesses
|
|
|
1985
|
100-101 |
6 |
p. 1168-
1 p.
|
artikel
|
| 53 |
A definition of probability for reliability prediction
|
|
|
1974
|
100-101 |
6 |
p. 444-
1 p.
|
artikel
|
| 54 |
A delta-star transformation approach for reliability evaluation
|
|
|
1978
|
100-101 |
6 |
p. 480-
1 p.
|
artikel
|
| 55 |
A design method for field service centres
|
|
|
1985
|
100-101 |
6 |
p. 1163-
1 p.
|
artikel
|
| 56 |
A design-sensitive maintainability-prediction technique
|
|
|
1972
|
100-101 |
6 |
p. 475-
1 p.
|
artikel
|
| 57 |
Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparation
|
Zhang, Wenjing
|
|
2012
|
100-101 |
6 |
p. 1157-1164
8 p.
|
artikel
|
| 58 |
A distributed algorithm for fault simulation of combinatorial and asynchronous sequential digital designs, utilizing circuit partitioning, on loosely-coupled parallel processors
|
Ghosh, Sumit
|
|
1995
|
100-101 |
6 |
p. 947-967
21 p.
|
artikel
|
| 59 |
Advanced dielectric isolation through selective epitaxial growth techniques
|
|
|
1986
|
100-101 |
6 |
p. 1197-
1 p.
|
artikel
|
| 60 |
Advanced electron-beam lithography for 0.5 μm to 0.25 μm device fabrication
|
|
|
1989
|
100-101 |
6 |
p. 1103-
1 p.
|
artikel
|
| 61 |
Advances in automated wire and die bonding
|
|
|
1983
|
100-101 |
6 |
p. 1181-
1 p.
|
artikel
|
| 62 |
Advances in c.c.d. scanners with on-chip signal processing for electronic imaging
|
|
|
1980
|
100-101 |
6 |
p. 912-
1 p.
|
artikel
|
| 63 |
Advances in ceramic chip carriers and multilayer substrate technologies
|
|
|
1978
|
100-101 |
6 |
p. 482-
1 p.
|
artikel
|
| 64 |
Advances in customization free VLSI system designers
|
|
|
1983
|
100-101 |
6 |
p. 1182-
1 p.
|
artikel
|
| 65 |
Advances in GaAs LSI/VLSI processing technology
|
|
|
1980
|
100-101 |
6 |
p. 911-
1 p.
|
artikel
|
| 66 |
Advances in laser assisted semiconductor processing
|
|
|
1987
|
100-101 |
6 |
p. 1039-
1 p.
|
artikel
|
| 67 |
Advances in low cost silver-containing thick film conductors
|
|
|
1982
|
100-101 |
6 |
p. 1194-
1 p.
|
artikel
|
| 68 |
Advances in metalizations technology
|
|
|
1986
|
100-101 |
6 |
p. 1193-
1 p.
|
artikel
|
| 69 |
Advances in wafer process control
|
|
|
1980
|
100-101 |
6 |
p. 909-
1 p.
|
artikel
|
| 70 |
Advances in wire bonding technology for high lead count, high-density devices
|
|
|
1989
|
100-101 |
6 |
p. 1100-
1 p.
|
artikel
|
| 71 |
Advantage of further scaling in gate dielectrics below 0.5nm of equivalent oxide thickness with La2O3 gate dielectrics
|
Kakushima, K.
|
|
2010
|
100-101 |
6 |
p. 790-793
4 p.
|
artikel
|
| 72 |
AES sputter depth profiling of Cr/Ni multilayers using Ar+, O2 + and N2 + ions
|
|
|
1990
|
100-101 |
6 |
p. 1209-
1 p.
|
artikel
|
| 73 |
A European program on wafer scale integration
|
|
|
1989
|
100-101 |
6 |
p. 1100-
1 p.
|
artikel
|
| 74 |
A field study of connector reliability
|
|
|
1985
|
100-101 |
6 |
p. 1160-
1 p.
|
artikel
|
| 75 |
A flip chip interconnection and packaging system
|
|
|
1970
|
100-101 |
6 |
p. 456-
1 p.
|
artikel
|
| 76 |
AFTP fault tree analysis program
|
|
|
1985
|
100-101 |
6 |
p. 1163-
1 p.
|
artikel
|
| 77 |
A further study on the microstructure of glass-bonded Ag thick-film conductors
|
|
|
1985
|
100-101 |
6 |
p. 1173-
1 p.
|
artikel
|
| 78 |
A GaAs MESFET sample and hold switch
|
|
|
1980
|
100-101 |
6 |
p. 910-
1 p.
|
artikel
|
| 79 |
A 2000 gate 10 n sec uncommitted logic array for telecommunications and computer applications
|
Dean, A.
|
|
1981
|
100-101 |
6 |
p. 779-782
4 p.
|
artikel
|
| 80 |
A generalized computer program for the estimation of the optimum number of trials for establishing a systems reliability
|
|
|
1980
|
100-101 |
6 |
p. 902-
1 p.
|
artikel
|
| 81 |
A general-purpose memory reliability simulator
|
|
|
1984
|
100-101 |
6 |
p. 1097-
1 p.
|
artikel
|
| 82 |
A general software reliability model for performance prediction
|
|
|
1982
|
100-101 |
6 |
p. 1186-
1 p.
|
artikel
|
| 83 |
Age replacement policies for Weibull failure times
|
|
|
1980
|
100-101 |
6 |
p. 900-
1 p.
|
artikel
|
| 84 |
Aging of highly N-doped α-Ta thin-film capacitors
|
|
|
1978
|
100-101 |
6 |
p. 484-
1 p.
|
artikel
|
| 85 |
A go-not-go reliability assessment procedure—“HI-FMECA”
|
|
|
1978
|
100-101 |
6 |
p. 479-
1 p.
|
artikel
|
| 86 |
A graphical method applicable to age-replacement problems
|
|
|
1983
|
100-101 |
6 |
p. 1174-
1 p.
|
artikel
|
| 87 |
A guidebook for software reliability assessment
|
|
|
1980
|
100-101 |
6 |
p. 900-
1 p.
|
artikel
|
| 88 |
A hermetically sealed 20-GHz integrated mixer
|
|
|
1974
|
100-101 |
6 |
p. 451-452
2 p.
|
artikel
|
| 89 |
A heuristic algorithm for system failure frequency
|
|
|
1982
|
100-101 |
6 |
p. 1188-
1 p.
|
artikel
|
| 90 |
A heuristic method to upgrade system availability for hot or cold standby and voting systems
|
|
|
1986
|
100-101 |
6 |
p. 1190-
1 p.
|
artikel
|
| 91 |
A high frequency microcircuit packaging and interconnection system
|
|
|
1974
|
100-101 |
6 |
p. 447-
1 p.
|
artikel
|
| 92 |
A high-performance 16-bit bipolar microprocessor — The Am 29116
|
Harmon Jr., William J.
|
|
1981
|
100-101 |
6 |
p. 851-869
19 p.
|
artikel
|
| 93 |
A high speed 64 × 4 bit 100K-compatible ECL-RAM with 6 NS access time
|
|
|
1980
|
100-101 |
6 |
p. 908-
1 p.
|
artikel
|
| 94 |
A high speed multiplier using subnanosecond bipolar VLSI technologies
|
|
|
1980
|
100-101 |
6 |
p. 908-
1 p.
|
artikel
|
| 95 |
A hybrid thin-film radiosonde transmitter
|
|
|
1971
|
100-101 |
6 |
p. 419-
1 p.
|
artikel
|
| 96 |
Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part 1
|
|
|
1984
|
100-101 |
6 |
p. 1105-
1 p.
|
artikel
|
| 97 |
Air and nitrogen-fireable multilayer systems: materials and performance characteristics. Part II
|
|
|
1984
|
100-101 |
6 |
p. 1105-
1 p.
|
artikel
|
| 98 |
Airflow controller improves photoresist spin/coat uniformity
|
|
|
1987
|
100-101 |
6 |
p. 1037-
1 p.
|
artikel
|
| 99 |
Air through hollow cards cools high-power LSI
|
|
|
1974
|
100-101 |
6 |
p. 447-
1 p.
|
artikel
|
| 100 |
A-k-out-of-N:G redundant system with cold standby units and common-cause failures
|
|
|
1985
|
100-101 |
6 |
p. 1165-
1 p.
|
artikel
|
| 101 |
A K-out-of-N:G three-state unit redundant system with common-cause failures and replacements
|
|
|
1982
|
100-101 |
6 |
p. 1187-
1 p.
|
artikel
|
| 102 |
Algorithmic trimming on active circuitry
|
|
|
1974
|
100-101 |
6 |
p. 453-
1 p.
|
artikel
|
| 103 |
Algorithms for strict consecutive-k-out-of-n:F systems
|
|
|
1987
|
100-101 |
6 |
p. 1035-
1 p.
|
artikel
|
| 104 |
A life cycle costing methodology for the assessment of process heat generation by solar energy
|
Sherie, Yosef S.
|
|
1983
|
100-101 |
6 |
p. 1069-1074
6 p.
|
artikel
|
| 105 |
Alignment signals for electron beam lithography
|
|
|
1984
|
100-101 |
6 |
p. 1106-
1 p.
|
artikel
|
| 106 |
Allocation of man-machine reliability
|
|
|
1976
|
100-101 |
6 |
p. 522-
1 p.
|
artikel
|
| 107 |
Alloyed thick-film gold conductor for high reliability high-yield wire bonding
|
|
|
1980
|
100-101 |
6 |
p. 916-
1 p.
|
artikel
|
| 108 |
A low cost lead frame technology for automated laser packaging
|
|
|
1987
|
100-101 |
6 |
p. 1040-
1 p.
|
artikel
|
| 109 |
A lower bound for system availability computation
|
|
|
1987
|
100-101 |
6 |
p. 1031-
1 p.
|
artikel
|
| 110 |
A low-noise integrated s.-band amplifier
|
|
|
1974
|
100-101 |
6 |
p. 448-
1 p.
|
artikel
|
| 111 |
Alternating space-charge-limited currents in hydrogenated amorphous silicon
|
|
|
1983
|
100-101 |
6 |
p. 1183-
1 p.
|
artikel
|
| 112 |
Alternative methods for determining chip inductor parameters
|
|
|
1978
|
100-101 |
6 |
p. 568-
1 p.
|
artikel
|
| 113 |
Alternative schemes for utility services to semiconductor process equipment
|
|
|
1986
|
100-101 |
6 |
p. 1196-
1 p.
|
artikel
|
| 114 |
Aluminium alloy as an interconnecting material in the fabrication of integrated circuits
|
|
|
1980
|
100-101 |
6 |
p. 911-
1 p.
|
artikel
|
| 115 |
Aluminum alloy bonding wires in corrosive environments
|
|
|
1987
|
100-101 |
6 |
p. 1036-
1 p.
|
artikel
|
| 116 |
Aluminum collector electrodes formed by the plasma spraying method for electric double-layer capacitors
|
|
|
1989
|
100-101 |
6 |
p. 1095-
1 p.
|
artikel
|
| 117 |
Aluminum corrosion at pad bond in the humidity tests
|
|
|
1989
|
100-101 |
6 |
p. 1094-
1 p.
|
artikel
|
| 118 |
Aluminum plasma etch considerations for VLSI production
|
|
|
1982
|
100-101 |
6 |
p. 1191-
1 p.
|
artikel
|
| 119 |
Aluminum-silicon OHMIC contact on “shallow” n + /p junctions
|
|
|
1980
|
100-101 |
6 |
p. 913-
1 p.
|
artikel
|
| 120 |
Aluminum-SOS Schottky diodes
|
|
|
1978
|
100-101 |
6 |
p. 564-
1 p.
|
artikel
|
| 121 |
A Markov approach to wear-out modelling
|
|
|
1983
|
100-101 |
6 |
p. 1174-1175
2 p.
|
artikel
|
| 122 |
A mass production of thick-film car voltage regulators
|
|
|
1978
|
100-101 |
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A modification of Bayesian approach in nuclear plant data analysis
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Amorphous-silicon devices start to shape up
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An algorithm for the reliability evaluation of redundant networks
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An approximate solution for electrolyte concentration distribution in physics-based lithium-ion cell models
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Anatomy of a clean room robot
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A new static shift register with dynamic transfer
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A new technique for the evaluation of the temperatures arising from some geometries which commonly occur in microelectronics
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A new technique in the global reliability of cyclic communications network
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A new technique of cancelation of the MOSFET leakage currents and parasitic capacitances
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A new ultra low power ULA and its application
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An experimental approach to vapor phase reflow solder assembly
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An experimental evaluation of thermal performance of DIPs on expoxy metal vs. epoxy glass printed wiring boards
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An expert system for fault tree construction
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An explicit closed-form formula for profit-maximizing k-out-of-n systems subject to two kinds of failures
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An extension of the block preventive maintenance policy for stochastically failing items
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An image method application to multilayer spreading resistance analysis
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An improved architecture for advanced universal microprocessor development systems
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An improved autoregressive model by particle swarm optimization for prognostics of lithium-ion batteries
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An improved management approach to upgrade avionic system reliability
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An influence of the rate of epitaxial growth on physical properties of gallium nitride
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An integrated circuit v.h.f. radio receiver
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An integrated missile reliability growth program
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An interactive design system for hybrid ICs
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An interactive two-dimensional finite element process modelling package for a single user mini-computer
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An introduction to the studies of reliability of systems using the Weibull proportional hazards model
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An investigation into flip chip bonding
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An investigation of the interface state density in metal-silieon nitride-silicon structures
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An investigation of the valley splitting in n-channel silicon (100) inversion layers
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An investigation on the influence of electromagnetic interference induced in conducting wire of universal LEDs
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An irreversible resistance transition in polycrystalline silicon thin film resistors
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An LSI technology fully compatible EAROM cell
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An (m, M) machine repair problem with spares and state dependent rates: A diffusion process approach
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Annealing behaviour of aluminium implanted germanium
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Annealing effects on transition temperature of r.f. sputtered Bi-Sr-Ca-Cu-O thin films
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Annealing of damage in Se+-implanted indium phosphide
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An observation by photoconductivity of strain splitting of shallow bulk donors located near to the surface in silicon MOS devices
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Anomalous diffusion in semiconductors—A quantitative analysis
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Anomalous drain voltage dependence in bias temperature instability measurements on high-κ field effect transistors
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Anomalous narrow width effect in p-channel metal–oxide–semiconductor surface channel transistors using shallow trench isolation technology
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An operating system for a microprocessor-based interactive graphic terminal
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An optimal inspection policy for a storage system with high reliability
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A note on convergence problems in numerical techniques for accelerated life-testing analysis
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A note on repair limit suspension policies for a 2-unit standby redundant system with two phase repairs
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A note on the statistics of reliability assessment
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A novel approach for fabricating light-emitting porous polysilicon films
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A novel boron spin-on dopant
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A novel memory device for VLSI E2 PROM
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A novel method to improve cell endurance window in source-side injection split gate flash memory
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An overview of laser functional trimming techniques
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An overview of thickness measurement techniques for metallic thin films
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An S-shaped software reliability growth model with two types of errors
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Kareer, Nishi
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Anticipatory test monitors IC suppliers process control
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A numerical analysis of various cross sheet resistor test structures
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A numerical study of field-aided diffusion
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A paste manufacturer's view of the hybrid industry
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A peripheral-oriented microcomputer system
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A 500-picosecond system design capability
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A postal service field evaluation of letter sorting machine keyboards
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4813732 Apparatus and method for automated wafer handling
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4657172 Apparatus and method of solder coating integrated circuit leads
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4965515 Apparatus and method of testing a semiconductor wafer
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4481628 Apparatus for testing dynamic noise immunity of digital integrated circuits
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Application de la gravure ionique a la microelectronique
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Application of a software reliability model to decide software release time
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Application of electron beams in thermal processing of semiconductor materials and devices
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Application of fluorinert liquid in the failure analysis of semiconductor integrated circuits
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Application of life cycle costing to the DoD system acquisition decision process
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Application of MTBF guarantee program for RCA AVQ-3OX weather radar system on Boeing 747 jet-liners
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Application of photoresists in semiconductor manufacturing
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Application of the direct observation of nuclear reaction to the study of ion implantation
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Application-oriented description of the quality of electronic components (ppm concept)
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Applications of ellipsometry to in situ study of the growth of hydrogenated amorphous films
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Applications of infrared spectroscopy to the annealing of silicon
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Applied stresses, cyclotron masses and charge-density-waves in silicon inversion layers
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Approaches to resists for two-level RIE pattern transfer applications
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Approaches toward silicon compilation
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Approximated reliability of r-out-of-n(F) system with common cause failure and maintenance
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Approximate tolerance limits and confidence limits on reliability for the Gamma distribution
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Approximation method for estimating meaningful parameters for a soft-controlled electro-mechanical system
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A practical approach to quality control
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A practical end-of-life model for semiconductor devices
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A practical implementation of the factoring theorem for network reliability
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A practical method of optimizing system life cycle costs vs availability
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A precision noise measurement and analysis method used to estimate reliability of semiconductor devices
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A probability bound estimation method in Markov reliability analysis
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A projection system for inspecting wafers, integrated circuits and photomasks
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Aqueous developable bilayer resist system
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A RAMCAD/ULCE workstation shell structure
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Architecture and applications of a 12-bit CMOS microprocessor
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A redundancy analysis technique
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A reliability analysis of the electrostatic discharge sensitivity of CMOS devices
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A reliability control tool during manufacturing
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Argon content of SiO2 films deposited by rf sputtering in argon
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A simple cure for a form of window staining which occurs during the etching of silicon integrated circuits
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A small instrument manufacturer's experience with medical instrument reliability
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A software development workshop for programmable microelectronics
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6 |
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1 p.
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A software reliability model with multiple-error introduction and removal
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1987
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1 p.
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A software reliability program
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1970
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100-101 |
6 |
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1 p.
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A software tool for designing burn-in programs
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As packaging density increases, focus shifts to SSI and MSI chips
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A spreadsheet heuristic approach for the stocking and retention of slow-moving, obsolescent items
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1990
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Assembly equipment users speak out
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Assessing missile system reliability
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6 |
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1 p.
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Assessing product liability through material failure analysis
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6 |
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1 p.
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artikel
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Assessing the value of a lead-free solder control plan using cost-based FMEA
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Lillie, Edwin
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2015
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11 p.
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Assessing throughput and reliability in communication and computer networks
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A statistical prediction interval for availability
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A Stochastic method of allocation of components to maximize reliability
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A stochastic model of a system with two phases of operation
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Moafi B., S.E.
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5 p.
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A structured approach to the design of microprocessor applications software
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15 p.
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A study of accelerated storage test conditions applicable to semiconductor devices and microcircuits
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1 p.
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A study of Al/PtSi/Si thin film reaction kinetics by X-ray diffraction
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A study of PtSi formation
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6 |
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1 p.
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A study of the gold acceptor in a silicon p + n junction and an n-type MOS capacitor by thermally stimulated current and capacitance measurements
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6 |
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1 p.
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A study of three environmental reliability tests
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1 p.
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A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages
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Jang, Kyung-Woon
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2012
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8 p.
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A support system life cycle cost model
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6 |
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1 p.
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A survey of corrosion failure mechanisms in microelectronic devices
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2 p.
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A survey of published information on universal logic arrays
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Hurst, S.L.
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12 p.
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Asymmetric channel doping profile and temperature reduction influence on the performance of current mirrors implemented with FD SOI nMOSFETs
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2013
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8 p.
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Asymptotic analysis of a heterogeneous renewable complex system with random environments
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12 p.
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Asymptotic behaviour of a multiple parallel system attended by a multiple repairstation
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Vanderperre, E.J.
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Asymptotic distribution of downtime for a cold-standby system
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A systematic procedure for the generation of cost-minimized designs
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A system reliability and maintainability simulation exercise
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1 p.
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A systems unavailability trade-off program
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A technique for transparent fault injection and simulation in VHDL
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Zwolinski, Mark
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8 p.
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A test structure for the electrical measurement of the misalignment between gate and diffusion regions in MOS/LSI circuits
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1986
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A theoretical study of the electronic structure for twin stacking faults in silicon
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A thick film base metal resistor and compatible hybrid system
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A thick film hybrid IC amplifier for industrial use
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A time-variable ratio useful in reliability theory
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1983
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1 p.
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A transmission line model of a VLSI package
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A trimmable planar capacitor for hybrid applications
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A Truncation methodology for evaluating large fault trees
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A tutorial on fault tolerance issues with applications in distributed systems
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Walker, Dennis
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1990
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A two-gun ion beam system for dynamic recoil implantation
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A two level metal CMOS process for VLSI circuits
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A two non-identical three-state units redundant system with common-cause failures and one standby unit
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1982
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A two-unit parallel redundant system with three modes and bivariate exponential lifetimes
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1984
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A type-II censored, log test-time based, component-testing procedure for a parallel system
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2 p.
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Auditing—A product liability prevention tool
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A ULA is more than silicon
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A unified approach to the development of an exceedingly efficient algorithm for digital filter design
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Arora, R.K.
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A unifying reliability analysis philosophy
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A useful property of “Graphical” estimators of location and scale parameters
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1982
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Auto-Auto Relay Set controlled by LSI Programmable Logic
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Automated electronic masking machine
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Automated inspection of circular parts
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1989
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6 |
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Automated inspection of general shapes
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1989
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1 p.
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Automated inspection of wafer patterns with applications in stepping, projection and direct-write lithography
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1984
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Automated parametric testers to monitor the integrated circuit process
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1982
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Automated shock in particle impact noise (PIN) testing
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Automated test methods to check fast analogue-to-digital converters
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1 p.
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Automatic detection of semiconductor mask defects
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Marcin Wójcik, Zbigniew
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9 p.
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Automatic hardware synthesis
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Automatic heart disease diagnostic system using a MOS-IC'ed learning machine
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1974
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6 |
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1 p.
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Automatic impedance matching system for rf sputtering
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2 p.
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Automatic interconnection system for electronic components
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1 p.
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Automatic nine-barrel repeater ANR 4 of VEB Carl Zeiss JENA a photolithographic mask-making system for the semiconductor industry
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1974
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6 |
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1 p.
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Automatic registration in an electron-beam lithographic system
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6 |
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1 p.
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Automatic testing of integrated circuits
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1 p.
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Automating electronics manufacturing
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1 p.
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Availability analysis of a repairable system with non-repairable stand-by units
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Dhillon, Balbir S.
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2 p.
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Availability analysis of a two unit repairable parallel redundant system with common-mode failures and arbitrarily distributed down times
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Dichirico, Canio
|
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1986
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6 p.
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Availability analysis of transit systems
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1 p.
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Availability—concepts and definitions
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Availability evaluation of flow networks with varying throughput-demand and deferred repair
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1990
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1 p.
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Availability measures for various multi-unit systems
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Kapur, P.K.
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1986
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Availability, MTBF and MTTR for repairable m out of n system
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1982
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6 |
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1 p.
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Availability of an (m, N) system with repair
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Rao, K.V.
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6 |
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3 p.
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Availability of a reduadant system
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6 |
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1 p.
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Availability of a series system with warm spares
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Cui, Lirong
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1994
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13 p.
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Availability of the feeding system in the sugar industry
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Kumar, Dinesh
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1988
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5 p.
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Avalanche breakdown characteristics of alloyed silicon p-n junctions
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1973
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1 p.
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Avalanche breakdown in polycrystalline silicon films
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1973
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6 |
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1 p.
|
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Avalanche breakdown voltage of diffused junctions in silicon
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6 |
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1 p.
|
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Avalanche injection in MNOS gate controlled diodes
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1980
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6 |
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1 p.
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A Vamfo-Caris method for determining thicknesses of transparent films with small number of interference extrema
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1971
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|
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A variational diagnosis method for stuck-faults in combinatorial networks
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1972
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|
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A versatile design giving both N-type and S-type of negative-resistances
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Sharma, C.K.
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2 p.
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Aviation supply office FFW/RIW case history, 2. Abex Pump
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1976
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A view from inside “the surface-mounting revolution”
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1986
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1 p.
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Avoiding low temperature thermal donors in CMOS
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1989
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1 p.
|
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A voltage variable resistor most
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6 p.
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A warm standby redundant system with correlated failures and repairs
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1992
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5 p.
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A weighted estimator for the scale parameter of an exponential distribution
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Mishra, G.C.
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1992
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3 p.
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A “Zero-Time” VLSI sorter
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1983
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6 |
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1 p.
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Back-end soft and hard defect monitoring using a single test chip
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2011
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6 p.
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Backside probing of flip–chip circuits using electrostatic force sampling
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Qi, R
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2000
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7 p.
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Band bending variation of the Si(111) surface during its thermal oxidation
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1984
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1 p.
|
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Barrier-height measurements of tantalum silicide on silicon
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1986
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1 p.
|
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Barrier layer multilayer ceramic capacitor processing: effects of termination and plating process parameters
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1990
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Base-buried layer isolation process for digital LSI circuit
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1984
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|
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Basic thermo-mechanical property estimation of a 3D-crosslinked epoxy/SiO2 interface using molecular modelling
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Hölck, O.
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2011
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8 p.
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Batch bonded crossovers for thin film circuits
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1 p.
|
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Bayes estimation of reliability for the inverse Gaussian model
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1982
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1 p.
|
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Bayes estimation of the parameters and reliability function of the 3-parameter Weibull distribution
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1989
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6 |
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1 p.
|
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Bayes estimation of the reliability function of normal distribution
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1986
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1 p.
|
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Bayesian analysis of reliability and hazard rate function of a mixture model
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7 p.
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Bayesian analysis of system availability
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1993
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3 p.
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Bayesian approach to life testing and reliability estimation under competing exponential failure distributions
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Papadopoulos, Alex S.
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12 p.
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Bayesian approach to the prediction problem in the exponential population
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Bayesian estimation under exponential failure distribution
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Jaisingh, Lloyd R.
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Bayesian limits for the reliability of pass/fail parallel units
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1976
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Bayesian prediction for the range with a burr distribution and a random sample size
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Ashour, S.K.
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Bayesian reliability and availability—a review
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Bayesian reliability assessment from test data
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1 p.
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Bayesian shrinkage estimation of reliability from a censored sample from a finite range failure time model
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4 p.
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Bayesian techniques to reduce the sample size in automotive electronics attribute testing
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1997
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Bayes inference from failure data contaminated due to maintenance
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1986
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Bayes interval for the Weibull parameters utilizing guessed estimates
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1993
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Bayes reliability assessment of a two-unit hot-standby redundant system
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1 p.
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Behaviour of amorphous Ge contacts to monocrystalline silicon
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1 p.
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Behaviour of a two correlated units redundant system with many types of failure
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Bell Labs' new thin-film hybrid may be most complex ever built
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Berechnung der Kapazitäts-und Induktivitätsbeläge ebener Streifenleitungen durch konforme Abbildung
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Dhillon, Balbir S.
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Dhillon, Balbir S.
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Biochips, fact or fiction?
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Bipolar compatible MOS ICs
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Bipolar gate array delivers fast signal processing
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Bipolar Schottky logic device failure modes due to contact metallurgical degradation
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Canali, C.
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Bipolar VLSI builds 16-bit controller handling many fast peripherals at once
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16-bit bipolar microprocessor marches to standard instruction set
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16-bit microprocessor enters virtual memory domain
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Black aluminium films
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Board level investigation of BGA solder joint deformation strength
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Bondability problems associated with the TiPtAu metallization of hybrid microwave thin film circuits
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Bonded crossovers for thin film circuits
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Bonding degradation in the tantalum nitride-chromium-gold metallization system
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Bonding temperature measurements during device assembly
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Boundary element analysis of thermal fatigue effects on high power IGBT modules
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Khatir, Z.
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Bounding algorithms for two-terminal network reliability
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Bounds on reliability of a coherent system with positively correlated components
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Bounds on reliability of a noncoherent system using its length & width
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Bounds on the reliability of binary coherent systems
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Breakdown voltage of discrete capacitors under single-pulse conditions
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Broader functions and improved reliability of printed circuit boards using dry film solder mask systems
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BS9000 and integrated circuits
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B-Si masks for storage ring X-ray lithography
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Bubble-memory support chips allow tailored-system design
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Build an ON-OFF timer using inexpensive ICs
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Building reliability into reed switches
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Built-in test for complex digital integrated circuits
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Bulk lifetime determination of MOS structures by a voltage step response method
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Bulk trapping effect on carrier diffusion length as determined by the surface photovoltage method: Theory
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Burn-in to improve which measure of reliability?
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Guess, Frank
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CAD tool for GaAs digital integrated circuits
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Calculating the probability of Boolean expression being 1
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Calculation of the extended-state electron mobility in hydrogenated amorphous silicon
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2009
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nvt p.
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Careless pump maintenance will cost you
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Cavity perturbation method for measurement of permittivity and conductivity of medium lossy semiconductors and dielectrics
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Cermet resistors on ceramic substrates
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Challenges and developments of copper wire bonding technology
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Changes in effective channel length due to hot-electron trapping in short-channel m.o.s.t.s.
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Checking request policies for a one-unit system and their comparisons
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100-101 |
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16 p.
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Check list for 4,096—bit RAMs flags potential problems in memory design
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Chemical beam epitaxy
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Chemical impurities and structural imperfections in semiconductor silicon. Part I
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Chemiluminescence during photoresist stripping processes
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Chip carrier packaging applications
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Chip carriers as a means for high-density packaging
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Chip-carriers change their course
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Chip carriers, lids and sots—an analysis of cost and performance tradeoffs for hybrid applications
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Chip carriers—their application and future direction
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1 p.
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Chips make fast math a snap for microprocessors
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6 |
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1 p.
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Chi-square probabilities are Poisson probabilities in disguise
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2 p.
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Chopper circuit put on op-amp chip
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Chopper-stabilized IC op amps achieve precision, speed, economy
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CICC ranges from floppy-dish controllers to analog custom arrays, laser probing
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Circuit analysis, logic simulation and design verification for VLSI
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4816756 Circuit and method for statically testing rotating rectifiers in brushless alternators
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Circuit-board packaging considerations for optimum utilization of chip carriers
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Circuit design selection—A reliability factor
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Circuit level prediction of device performance degradation due to negative bias temperature stress
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Kuroda, Rihito
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7 p.
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Circuit model distribution with statistical dependence
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Circuits intégrés diviseurs de fréquence réalisés sur arséniure de gallium
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1983
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1 p.
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4967147 Circuit tester having mechanical fingers and pogo probes for causing electrical contact with test fixture assemblies
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Woods, Ernest
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Classes of discrete decreasing and increasing mean-residual-life distributions
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Clean rooms for ULSI manufacturing: class 1 practice
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1 p.
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Clean rooms: the common sense approach to effectiveness
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Clinch-river breeder-reactor plant system reliability
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2 p.
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C-MOS. A designer's dream with the best yet to come
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1984
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C-MOS and bipolar technologies are more partners than rivals
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1984
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C-MOS challenges bipolars in static-RAM race
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C-MOS may help majority logic win designers' vote
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C-MOS multiplier speeds task for microprocessors
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C-MOS offers alternatives to linear-IC design
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1 p.
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C-MOS paces development of application-specific circuits
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1984
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CMOS reliability
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6 |
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CMOS reliability
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C-MOS support logic helps build unified, high-speed systems
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1982
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Collector diffusion isolation packs many functions on a chip
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1972
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Combination of thick-film dielectric/thin film conductor for fine pattern formation of multi-layer substrate
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Combinatorial reliability analysis of multiprocessor computers
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Comment on: extension of the Duane plotting technique
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Comment on: queueing model of a bi-level Markov service-system and its solution using recursion
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1990
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Comment on the paper “failure of aluminium contacts to silicon in shallow diffused transistors”
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Cunningham, J.A.
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1970
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Comments on “Reliability and component importance of a consecutive-k-out-of-n system” by Zuo
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2000
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Comments on the hole mass in silicon inversion layers
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Common-cause failure analysis of a three-state device system
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Common-cause failure considerations in predicting HTGR cooling system reliability
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Common cause failures—a dilemma in perspective
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Communications satellite systems reliability
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Comparative compliance of representative lead designs for surface-mounted components
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1990
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Comparative thermal performances of various substrate materials in a simple packaging application: actual versus predicted
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1990
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6 |
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Comparing HAST results of differently pretreated plastic encapsulated integrated circuits
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Fokkens, K.
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1989
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7 p.
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Comparison of mean time to first failure and mean up time
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Comparison of parametric models for estimating maintenance times from small samples
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1982
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Comparison of the stability of gold and palladium alloy connector contacts subjected to vibration
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1987
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Comparison of TID response in core, input/output and high voltage transistors for flash memory
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Liu, Zhangli
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2011
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Comparison of two dissimilar unit reliability models with three types of repair facilities
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Mokaddis, G.S.
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Comparison of two stochastic models for two-unit series system with cold standbys
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Moafi, S.E.
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Comparison of two unit cold standby reliability models with three types of repair facilities
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Comparison of variants of integrated digital circuits
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Complex mission worth optimization by redundancies
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Complex two-unit system with preventive maintenance
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Component failure and compensators
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Component linearity test improves reliability screening through measurement of third harmonic index
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Component reliability
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Component reliability exposed to thermal neutron environment—III
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Component reliability under environmental stress
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Composite-type pin grid array package
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Composition and stress state of thin films deposited by ion beam sputtering
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Comprehensive test strategies help cut costs of manufacturing
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Computationally efficient large-change statistical analysis of linear electronic circuits
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Computer-aided design of an eight bit binary counter N-MOS chip for large scale integration (LSI)
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Computer aided design of LSI: an I2L case study
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Computer-aided determination of tests for the detection and localisation of faults in electronic circuits and systems
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Computer-aided reliability analysis of complicated networks
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Computer-aided sequential testing for equipment reliability
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Computer aided synthesis of fault-trees
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Computer communication networks—A study in the Indian context
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Computer contracts: negotiating user protection
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Computer controlled batch process manufacture of thin film resistor networks on ceramic substrates
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Computerized reliability analysis using REACT
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Computerized system uses laser for functional trimming
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Computer program for approximating the reliability characteristics of acyclic directed graphs
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Computers are like cancer because they are completely out of sync with their total environment
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Computers help design reliable telephone systems
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Computer simulation of hybrid integrated circuits including combined electrical and thermal effects
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Computer software quality measurements and metrics
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4482953 Computer with console addressable PLA storing control microcode and microinstructions for self-test of internal registers and ALU
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Computing failure frequency, MTBF & MTTR via mixed products of availabilities and unavailabilities
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Conference
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Configuration management: The interface of enigneering, production, and quality control
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Consideration for effective warranty application
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Considerations in formulation and manufacturing of thick film inks
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Constant current stress-induced leakage current in mixed HfO2–Ta2O5 stacks
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Contact hole etching in a load-locked hexagonal reactive ion etching system
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Contamination control using HCl gas: effects on silica glass and minority carrier lifetime
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Contract bid evaluation
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Controlling potential static charge problems
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Controlling static in wafer fabrication
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Controlling the quality of soldering of PTH solder joints
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Control of Boron diffusion in polysilicon for constructing overlapping polysilicon gate charge-coupled devices
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1983
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100-101 |
6 |
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Control of film properties by r.f-sputtering techniques
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1972
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100-101 |
6 |
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2 p.
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artikel
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Control of polysilicon film properties
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1984
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100-101 |
6 |
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artikel
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| 724 |
Cooling of microelectronics
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1971
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100-101 |
6 |
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artikel
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| 725 |
Core excitons in Si x Ge 1−x alloys
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1984
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100-101 |
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artikel
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| 726 |
Corrected bounds for reliability when strength and stress distributions are known
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Sharma, K.K.
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1991
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100-101 |
6 |
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3 p.
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artikel
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| 727 |
Correlation between thick-film resistance values
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1977
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100-101 |
6 |
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artikel
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| 728 |
Correlation considerations: Real HBM to TLP and HBM testers
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Barth, Jon
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2002
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6 |
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9 p.
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| 729 |
Correlation of reliability performance measurements
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1970
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100-101 |
6 |
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artikel
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| 730 |
Corrosion of in-base solders
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1978
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100-101 |
6 |
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artikel
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| 731 |
Corrosion resistance of several integrated-circuit metallization systems
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1971
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100-101 |
6 |
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artikel
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| 732 |
Cost analyses for avionics acquisition
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1980
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100-101 |
6 |
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artikel
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Cost analysis of a 3-state 2-unit repairable system
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1984
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100-101 |
6 |
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artikel
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| 734 |
Cost analysis of a three-state parallel redundant complex system
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Gupta, P.P.
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1985
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100-101 |
6 |
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7 p.
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artikel
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| 735 |
Cost analysis of a three-state standby redundant electronic equipment
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Gupta, P.P.
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1985
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100-101 |
6 |
p. 1029-1033
5 p.
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artikel
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| 736 |
Cost analysis of a two-dissimilar unit cold standby redundant system with administrative delay and no priority in repair
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Elias, S.S.
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1990
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100-101 |
6 |
p. 1155-1177
23 p.
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artikel
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| 737 |
Cost analysis of a two-unit chargeable standby system with interchangeable units and two types of failure
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Goel, L.R.
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1992
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100-101 |
6 |
p. 775-779
5 p.
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artikel
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| 738 |
Cost analysis of a two-unit standby system with two types of repairmen
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1985
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100-101 |
6 |
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2 p.
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artikel
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| 739 |
Cost analysis of a two unit, three state standby redundant complex system with two types of repair facilities under waiting
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Gupta, P.P.
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1987
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100-101 |
6 |
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artikel
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| 740 |
Cost analysis of the machine-repair problem with R non-reliable service stations
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Wang, K.-H.
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1995
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100-101 |
6 |
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artikel
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| 741 |
Cost-benefit analysis of a n-unit two-server system with preventive maintenance
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Gopalan, M.N.
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1986
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100-101 |
6 |
p. 1077-1081
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artikel
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| 742 |
Cost-benefit analysis of a 2-unit cold standby system subject to slow switch
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Gopalan, M.N.
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1984
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100-101 |
6 |
p. 1019-1021
3 p.
|
artikel
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| 743 |
Cost-benefit analysis of repairable systems subject to slow switch: A state-of-art survey
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Gopalan, M.N.
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1986
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100-101 |
6 |
p. 1083-1087
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artikel
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| 744 |
Cost-benefit analysis of single-server n-unit imperfect switch system with adjustable repair
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Gopalan, M.N.
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1991
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100-101 |
6 |
p. 1085-1087
3 p.
|
artikel
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| 745 |
Cost effectiveness analysis of utilizing flow improvers for crude oil
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Abdel Halim, M.M.
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1985
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100-101 |
6 |
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6 p.
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artikel
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| 746 |
Cost-effective reliable software engineering and development
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1985
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100-101 |
6 |
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artikel
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| 747 |
Cost effective semiconductor memory testing
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1980
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100-101 |
6 |
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artikel
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| 748 |
Cost function analysis of a 3-state repairable system
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1984
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100-101 |
6 |
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artikel
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| 749 |
Cost study of a complex system under waiting
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Gupta, P.P.
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1986
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100-101 |
6 |
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4 p.
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artikel
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| 750 |
Courses
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1978
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artikel
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| 751 |
Courses
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1977
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6 |
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artikel
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| 752 |
Courses
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1976
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6 |
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| 753 |
Courses in microelectronics and reliability
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1970
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| 754 |
Cpk applications—Uses and abuses
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Anjard Sr, R.P.
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1991
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CP/M—A route to cheap software
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1982
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6 |
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Creep-fatigue interactions in solders
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1990
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6 |
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artikel
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| 757 |
Critical concentration for metallization of doped germanium and silicon
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1976
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100-101 |
6 |
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artikel
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| 758 |
Croissance de monoscristaux de GaAs semi-isolant “non dopés”: trois façons de parvenir au résultat
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1983
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100-101 |
6 |
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artikel
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| 759 |
Cross-modulation and intermodulation performance of MOS-FET's in tuned high-frequency amplifiers
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1978
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100-101 |
6 |
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artikel
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| 760 |
Culprits causing avionic equipment failures
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1987
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6 |
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2 p.
|
artikel
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| 761 |
Current aspects of CAD for integrated circuits
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1980
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100-101 |
6 |
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artikel
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| 762 |
Current gain degradation induced by emitter-base avalanche breakdown in silicon planar transistors
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Melia, A.J.
|
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1976
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100-101 |
6 |
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|
artikel
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| 763 |
Current-leakage failures in hybrid microcircuits
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1987
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6 |
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| 764 |
Current multiplication in metal-insulator-semiconductor (MIS) tunnel diodes
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1974
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6 |
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| 765 |
Current noise in thick and thin film resistors
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1983
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6 |
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| 766 |
Current reliability issues and future technologies for systems on silicon – processes, circuits, chip architecture, and design
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Takeda, Eiji
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2000
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| 767 |
Current transport in metal semiconductor contacts—a unified approach
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1972
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| 768 |
Custom ECL chips boost performance in smaller mainframes
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1980
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6 |
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Custom power hybrids
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1986
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6 |
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Data needs for software reliability modelling
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1980
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6 |
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| 771 |
D.c. and high-frequency characteristics of built-in channel MOS-FETs
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1978
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100-101 |
6 |
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artikel
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| 772 |
Deadlock resolution for distributed real-time database systems
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Yeung, Chin-Fu
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1996
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artikel
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| 773 |
Dealing with hot-carrier aging in nMOS and DMOS, models, simulations and characterizations
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Mouthaan, A.J
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2000
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6 |
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Decision tools for use by management
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1978
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6 |
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Decoding scheme smooths 18-bit converter's nonlinearity
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1980
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6 |
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Dedrudging reliability prediction
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1987
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6 |
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Deep centers in neutron-transmutation-doped gallium arsenide
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1986
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6 |
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| 778 |
Deep level defects involved in MOS device instabilities
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Lenahan, P.M.
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2007
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| 779 |
Deep levels within the forbidden gap of silicon-on-sapphire films
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1970
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6 |
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Defect analysis using QC data
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1983
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Defect Complexes in Semiconductor Structures
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G.W.A.D.,
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1983
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100-101 |
6 |
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artikel
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| 782 |
Deformation measurement of RF MEMS switches by optical interference
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Ying, Yu
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2004
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|
artikel
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| 783 |
Degradation of bipolar transistor electrical parameters during sem evaluation
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Pease, R.L.
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1974
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6 |
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artikel
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| 784 |
Degradation of InGaN blue light-emitting diodes under continuous and low-speed pulse operations
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Yanagisawa, Takeshi
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2003
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6 |
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Degradation of PVF2 capacitors during accelerated test
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1978
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Degradation of thermocompression bonds to Ti-Cu-Au and Ti-Cu thin films by thermal aging
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1980
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6 |
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Delay line using thick film ferromagnetic material
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1974
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Delay related reliability: A new performance index for computer communication network dynamics
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1994
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Demand-paged memory management boosts 16-bit microsystem throughput
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1983
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Demands of LSI are turning chip makers towards automation, production innovations
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1977
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Dense, interchangeable ROMs work with fast microprocessors
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1978
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Density upgrading in tape automated bonding
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1983
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Dependability modeling of real-time systems using stochastic reward nets
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Constantinescu, Cristian
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1995
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Dependability modeling of safety systems
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1983
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artikel
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Dependability of Engineering Systems
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Stojadinovic, Ninoslav
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2002
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Dependence of activation energy on subband splitting and magnetic field in silicon inversion layers
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1989
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Dependence of the operating point on h.f. characteristics of bipolar integrated transistors
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1978
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6 |
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Depletion—capacitance-induced distortion in surface-channel c.c.d. transversal filters
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1977
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Deposited oxide contours in multi-layer metal circuitry
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1971
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Deposited oxide contours in multi-layer metal circuitry
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Deposition and Auger analysis of deposited SiO2 on AlxGa (1 − x) As
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1974
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Deposition and patterning of the tungsten and tantalum polycides
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1984
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Depth chemical profiles of MNOS structures measured by AES
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1977
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Design and cost analysis of a refining system in the sugar industry
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Kumar, Dinesh
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1990
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Design and evaluation methodology for built-in-test
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1982
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artikel
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Design and implementation of flexible and stretchable systems
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Gonzalez, Mario
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2011
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artikel
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Design and performance of micron-size devices
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1978
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artikel
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Design and realization of microwave amplifiers for S-band by thin film distributed networks
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1974
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Design aspects and reliability of a synchronizer made in MOS technology
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1980
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artikel
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Design, development and reliability testing of a low power bridge-type micromachined hotplate
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Prasad, Mahanth
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2015
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Design for reliability in hostile environment
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1977
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Design for testability—a survey
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1983
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Design-for-test for Digital ICs and Embedded Core Systems; Alfred L. Crouch. Prentice Hall, Inc., Upper Saddle River, NJ, 07458, hardcover, p. 349, CD ROM included, ISBN: 0-13-084827-1, $80,50.
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2000
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Designing built-in test for microprocessors
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1984
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artikel
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Designing for reliable operation of urea synthesis in the fertilizer industry
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Singh, Jai
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1990
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Designing logic boards for automatic testing
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1974
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Design limits when using Gold-Al bonds
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1971
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artikel
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Design of a comprehensive process evaluation vehicle for development of small geometry CMOS process
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1985
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Design of a single-stress relaxation test for pressure connections
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1977
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artikel
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Design of complex microstrip circuits by measurement and computer modelling
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1971
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Design of customised microelectronics masks using off-line and on-line computer aids
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1971
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Design of differential low-noise amplifier with cross-coupled-SCR ESD protection scheme
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2010
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Design of highly reliable electronic transformer
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1972
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Design of metal interconnects for stretchable electronic circuits
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2008
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Design of reliable yet economical industrial control systems
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1970
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Design of temperature-controlled substrate for hybrid microcircuits
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1974
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Design rules for microstrip capacitance
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1989
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Design trade-offs between organic polymer-on-metal PWB's and ceramic thick-film PWB's for high-density operation using leadless ceramic chip carriers
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1989
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6 |
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Detection-Correction decoding for system reliability
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1971
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Detection of internal crystal imperfections
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1970
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Determination of contact parameters of Ni/n-GaP Schottky contacts
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2012
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Determination of effective burn-in time for printed board assembly
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1995
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Determination of GaN HEMT reliability by monitoring I DSS
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2010
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Determination of neutral region carrier concentrations in P-N junctions using quasi fermi levels
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Determination of optimal overhaul intervals and inspection frequencies—A case study
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Determination of optimum burn-in time: A composite criterion
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| 837 |
Determination of reliability from ramped voltage breakdown experiments: application to dual dielectric MIM capacitors
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1985
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100-101 |
6 |
p. 1161-
1 p.
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artikel
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| 838 |
Determination of software release instant using a nonhomogeneous error detection rate model
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Aggarwal, K.K.
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1993
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100-101 |
6 |
p. 803-807
5 p.
|
artikel
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| 839 |
Determination of strain in 10 μm spots using a microdiffractometer
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1978
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100-101 |
6 |
p. 482-
1 p.
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artikel
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| 840 |
Determination of surface state density from gm-Vg characteristics of MOSFETs
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1978
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100-101 |
6 |
p. 566-
1 p.
|
artikel
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| 841 |
Determination of the mobility profile in silicon-on-sapphire material using the “fat” FET principle
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1989
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100-101 |
6 |
p. 1102-
1 p.
|
artikel
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| 842 |
Determine project risk using statistical methods
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1983
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100-101 |
6 |
p. 1171-
1 p.
|
artikel
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| 843 |
Determining heat sink requirements for ceramic LCCs
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1987
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100-101 |
6 |
p. 1036-
1 p.
|
artikel
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| 844 |
Determining optimum reliability programs
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1970
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100-101 |
6 |
p. 449-
1 p.
|
artikel
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| 845 |
Determining sample size when searching for rare items
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1983
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100-101 |
6 |
p. 1172-
1 p.
|
artikel
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| 846 |
Deterministic failure prediction
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1987
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100-101 |
6 |
p. 1034-
1 p.
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artikel
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| 847 |
Developing an approach to semiconductor failure analysis and curve tracer interpretation
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1978
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100-101 |
6 |
p. 483-
1 p.
|
artikel
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| 848 |
Developing a working mix-and-match lithography system
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1986
|
100-101 |
6 |
p. 1195-
1 p.
|
artikel
|
| 849 |
Development and evaluation of a pre-encapsulation cleaning process to improve reliability of HIC's with aluminum metallized chips
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1982
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100-101 |
6 |
p. 1198-
1 p.
|
artikel
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| 850 |
Development and reliability evaluation of high reliability IC memory card
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1989
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100-101 |
6 |
p. 1095-
1 p.
|
artikel
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| 851 |
Development of a coated wire bonding technology
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1990
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100-101 |
6 |
p. 1206-
1 p.
|
artikel
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| 852 |
Development of a novel resistor system for nitrogen firing applications
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1985
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100-101 |
6 |
p. 1173-
1 p.
|
artikel
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| 853 |
Development of embedded piezoelectric acoustic sensor array architecture
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Ghoshal, Anindya
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2010
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100-101 |
6 |
p. 857-863
7 p.
|
artikel
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| 854 |
Development of highly reliable surface mount packages
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1989
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100-101 |
6 |
p. 1094-
1 p.
|
artikel
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| 855 |
Development of performance functions for communication/computer systems and its application to dynamic performance analysis
|
Sumita, Ushio
|
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1989
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100-101 |
6 |
p. 973-991
19 p.
|
artikel
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| 856 |
Development of ship equipment maintenance history
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1987
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100-101 |
6 |
p. 1035-
1 p.
|
artikel
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| 857 |
Development of stress screens
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1987
|
100-101 |
6 |
p. 1032-
1 p.
|
artikel
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| 858 |
Development of substrate-pumped nMOS protection for a 0.13 μm technology
|
Salling, Craig
|
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2002
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100-101 |
6 |
p. 887-899
13 p.
|
artikel
|
| 859 |
Development of the thick-film capacitor and its application for hybrid circuit modules
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1980
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100-101 |
6 |
p. 915-
1 p.
|
artikel
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| 860 |
Developments in crystal growth from high-temperature solutions
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1983
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100-101 |
6 |
p. 1183-
1 p.
|
artikel
|
| 861 |
Developments likely to improve the reliability of plastic encapsulated devices
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1978
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100-101 |
6 |
p. 560-
1 p.
|
artikel
|
| 862 |
Device failure analysis in VLSI circuits due to missing flashes in mask fabrication process—A case study
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Srivastava, A.
|
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1988
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100-101 |
6 |
p. 885-888
4 p.
|
artikel
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| 863 |
Device modeling
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1983
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100-101 |
6 |
p. 1180-
1 p.
|
artikel
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| 864 |
4660069 Device with captivate chip capacitor devices and method of making the same
|
Kochanski, Ronald
|
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1987
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100-101 |
6 |
p. 1042-
1 p.
|
artikel
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| 865 |
Diagnostic specification—a proposed approach
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1982
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100-101 |
6 |
p. 1186-
1 p.
|
artikel
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| 866 |
Die attach evaluation using test chips containing localized temperature measurement diodes
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1987
|
100-101 |
6 |
p. 1036-
1 p.
|
artikel
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| 867 |
Die attach in hi-rel P-dips: polyimides or low chloride epoxies?
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1985
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100-101 |
6 |
p. 1168-
1 p.
|
artikel
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| 868 |
Die-attachment solutions for SiC power devices
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Kisiel, R.
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2009
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100-101 |
6 |
p. 627-629
3 p.
|
artikel
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| 869 |
Die Berechnung des komplexen Widerstandes von Dünnschichtkondensatoren
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1970
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100-101 |
6 |
p. 465-
1 p.
|
artikel
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| 870 |
Dielectric breakdown of gate insulator due to reactive ion etching
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1984
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100-101 |
6 |
p. 1106-
1 p.
|
artikel
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| 871 |
Dielectric films for Ge planar devices
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1970
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100-101 |
6 |
p. 463-
1 p.
|
artikel
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| 872 |
Dielectric insulating method VM for manufacturing transistors and integrated circuits
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1972
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100-101 |
6 |
p. 480-
1 p.
|
artikel
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| 873 |
Dielectric/semiconductor interfaces analysis using spectroscopic ellipsometry
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1983
|
100-101 |
6 |
p. 1183-
1 p.
|
artikel
|
| 874 |
DIFAR Reliability experience: 781 and Field
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1976
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100-101 |
6 |
p. 526-
1 p.
|
artikel
|
| 875 |
Differential pressure test: A quantitative stress test method for bonded beam-leaded devices
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1971
|
100-101 |
6 |
p. 412-
1 p.
|
artikel
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| 876 |
Difficulties in fault-tree synthesis for process plant
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1980
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100-101 |
6 |
p. 902-903
2 p.
|
artikel
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| 877 |
Diffusion barriers in advanced semiconductor device technology
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1986
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100-101 |
6 |
p. 1197-
1 p.
|
artikel
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| 878 |
Diffusion characteristics of antimony and phosphorus spin-on sources
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1983
|
100-101 |
6 |
p. 1184-
1 p.
|
artikel
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| 879 |
Diffusion data Vol. 5, No. 1. (1971)
|
Rule, A.F.E.
|
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1971
|
100-101 |
6 |
p. 426-
1 p.
|
artikel
|
| 880 |
Diffusion studies of Be-implanted GaAs by SIMS and electrical profiling
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1978
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100-101 |
6 |
p. 569-
1 p.
|
artikel
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| 881 |
Digital computer systems reliability
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1985
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100-101 |
6 |
p. 1167-1168
2 p.
|
artikel
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| 882 |
Digital filter analysis with personal computer
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Bozic, S.M.
|
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1980
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100-101 |
6 |
p. 836-845
10 p.
|
artikel
|
| 883 |
4730316 Digital integrated circuits
|
Desyllas, PeterLL
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1988
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100-101 |
6 |
p. 1000-
1 p.
|
artikel
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| 884 |
4730317 Digital integrated circuits
|
Desyllas, PeterLL
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1988
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100-101 |
6 |
p. 1000-
1 p.
|
artikel
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| 885 |
Digital system diagnostics-design/evaluation
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1980
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100-101 |
6 |
p. 905-
1 p.
|
artikel
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| 886 |
Digital TV: makers bet on VLSI
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1983
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100-101 |
6 |
p. 1181-
1 p.
|
artikel
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| 887 |
Digitizing, layout, rule checking—the everyday tasks of chip designers
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1983
|
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6 |
p. 1180-
1 p.
|
artikel
|
| 888 |
Digraphs and their applications in fault tree analysis
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1980
|
100-101 |
6 |
p. 904-
1 p.
|
artikel
|
| 889 |
Direct computation for consecutive-k-out-of-n: F systems
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1983
|
100-101 |
6 |
p. 1172-
1 p.
|
artikel
|
| 890 |
Direct gold and copper wires bonding on copper
|
Ho, Hong Meng
|
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2003
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100-101 |
6 |
p. 913-923
11 p.
|
artikel
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| 891 |
Direct liquid cooling of microelectronics
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1971
|
100-101 |
6 |
p. 416-
1 p.
|
artikel
|
| 892 |
Direct observation of the ground state splitting of the indirect free exciton in silicon
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1976
|
100-101 |
6 |
p. 530-
1 p.
|
artikel
|
| 893 |
Direct optimisation for calculating maximum likelihood estimates of parameters of the Weibull distribution
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1982
|
100-101 |
6 |
p. 1187-
1 p.
|
artikel
|
| 894 |
Discussion about the number of wiring layers for logic LSL
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1973
|
100-101 |
6 |
p. 498-
1 p.
|
artikel
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| 895 |
Dissolution rates and reliability effects of Au, Ag, Ni and Cu in lead base solders
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1973
|
100-101 |
6 |
p. 493-
1 p.
|
artikel
|
| 896 |
Distributed computer network takes charge in IC faeility
|
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1980
|
100-101 |
6 |
p. 913-
1 p.
|
artikel
|
| 897 |
Distributed mosfet amplifier using Microstrip
|
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1973
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100-101 |
6 |
p. 499-
1 p.
|
artikel
|
| 898 |
Distribution function relaxation times in gallium arsenide
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1977
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100-101 |
6 |
p. 655-
1 p.
|
artikel
|
| 899 |
Distribution of a life ratio and its application
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1983
|
100-101 |
6 |
p. 1171-
1 p.
|
artikel
|
| 900 |
Distribution of downtimes
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1974
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100-101 |
6 |
p. 445-
1 p.
|
artikel
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| 901 |
DMA controller adds muscle to offload microprocessor
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1983
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100-101 |
6 |
p. 1182-
1 p.
|
artikel
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| 902 |
3D Modeling of electromigration combined with thermal–mechanical effect for IC device and package
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Liu, Yong
|
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2008
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6 |
p. 811-824
14 p.
|
artikel
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| 903 |
Does ultrasonic cleaning damage components?
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1990
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6 |
p. 1205-
1 p.
|
artikel
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| 904 |
Donor-acceptor pair capture cross-section for highly excited electrons in polar semiconductors
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1984
|
100-101 |
6 |
p. 1103-1104
2 p.
|
artikel
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| 905 |
Donor generation in monocrystalline silicon by Halogen implantation
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1983
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6 |
p. 1187-
1 p.
|
artikel
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| 906 |
Don't let avoidable reed-relay pitfalls cripple your equipment designs
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1972
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100-101 |
6 |
p. 472-
1 p.
|
artikel
|
| 907 |
Dopant profiles on thin layer silicon structures with the spreading resistance technique
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1982
|
100-101 |
6 |
p. 1192-
1 p.
|
artikel
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| 908 |
Dormant storage reliability assessments—data based
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1982
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100-101 |
6 |
p. 1184-1185
2 p.
|
artikel
|
| 909 |
Double failure and other related problems in standby redundancy
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1972
|
100-101 |
6 |
p. 477-
1 p.
|
artikel
|
| 910 |
Double level metallurgy defect study
|
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1978
|
100-101 |
6 |
p. 483-
1 p.
|
artikel
|
| 911 |
Double-sided photolithography
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1978
|
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6 |
p. 481-
1 p.
|
artikel
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| 912 |
Draft DoD directive 5000.xx, Reliability and Maintainability
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1980
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100-101 |
6 |
p. 897-
1 p.
|
artikel
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| 913 |
Drain characteristics of thin film MOS FET's
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1977
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100-101 |
6 |
p. 658-
1 p.
|
artikel
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| 914 |
Dry etching induced damage in Si and GaAs
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1984
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100-101 |
6 |
p. 1101-
1 p.
|
artikel
|
| 915 |
Dual-frequency addressing of liquid crystal devices
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Clark, Michael G.
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1981
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100-101 |
6 |
p. 887-900
14 p.
|
artikel
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| 916 |
Duplicateur de masques a rayons X pour lithographie submicronique
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1982
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100-101 |
6 |
p. 1192-
1 p.
|
artikel
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| 917 |
Durability and stability of various insulating films against the high temperature water in an autoclave
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1971
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100-101 |
6 |
p. 421-
1 p.
|
artikel
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| 918 |
Dynamic characterization of surface-mount component leads for solder joint inspection
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1990
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100-101 |
6 |
p. 1200-
1 p.
|
artikel
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| 919 |
Dynamic I2L random-access memory competes with MOS designs
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1976
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100-101 |
6 |
p. 528-
1 p.
|
artikel
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| 920 |
Dynamic modeling for resin self-alignment mechanism
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Kim, J.M.
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2004
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100-101 |
6 |
p. 983-992
10 p.
|
artikel
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| 921 |
Dynamic NBTI characteristics of PMOSFETs with PE-SiN capping
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Lu, C.Y.
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2007
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6 |
p. 924-929
6 p.
|
artikel
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| 922 |
Dynamic performance of Schottky-barrier field-effect transistors
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1970
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6 |
p. 459-460
2 p.
|
artikel
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| 923 |
Dynamic properties of microelectronic digital systems
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1983
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100-101 |
6 |
p. 1182-
1 p.
|
artikel
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| 924 |
Dynamic-RAM fabrication poised for continuing C-H-MOS invasion
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1984
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6 |
p. 1103-
1 p.
|
artikel
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| 925 |
Dynamic redundancy allocation using Monte-Carlo optimization
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Ramachandran, V.
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1990
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100-101 |
6 |
p. 1131-1136
6 p.
|
artikel
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| 926 |
Dynamics of spin coating on very rough surfaces
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Hershcovitz, M.
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1993
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6 |
p. 869-880
12 p.
|
artikel
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| 927 |
Early design phase life cycle reliability modeling
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1987
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6 |
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1 p.
|
artikel
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| 928 |
E-beam probing systems: filling the submicron gap
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1986
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6 |
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1 p.
|
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| 929 |
Economic benefits of part quality knowledge
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1985
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6 |
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1 p.
|
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| 930 |
Economic considerations in multilayer thick film hybrids
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1974
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6 |
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1 p.
|
artikel
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| 931 |
Economic design of the mean prognostic distance for canary-equipped electronic systems
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Wang, Wenbin
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2012
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6 |
p. 1086-1091
6 p.
|
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| 932 |
Economics of functional testing at selected levels
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1982
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6 |
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1 p.
|
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E/D gate MOSFET
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1974
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6 |
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1 p.
|
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| 934 |
Editorial
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Grasser, Tibor
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2007
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6 |
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2 p.
|
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| 935 |
Editorial
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Ersland, Peter
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2010
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|
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| 936 |
EE-PROMs open new application areas to the design engineer
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1984
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6 |
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1 p.
|
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| 937 |
Effective lifetimes in high quality silicon devices
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1984
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6 |
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1 p.
|
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Effective reliability planning and implementation
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1976
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6 |
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1 p.
|
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| 939 |
Effect of annealing treatment and nanomechanical properties for multilayer Si0.8Ge0.2–Si films
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He, Bo-Ching
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2010
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6 p.
|
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Effect of band structure on the voltage-current characteristics of metal-insulator-metal tunnel junctions
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1972
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6 |
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1 p.
|
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| 941 |
Effect of geometry on double injection in semiconductors
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1971
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1 p.
|
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Effect of high-temperature H2-anneals on the slow-trapping instability of MOS structures
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1978
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6 |
p. 566-567
2 p.
|
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| 943 |
Effect of intermittent repair in a two unit redundant system with standby failure
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Rastogi, A.K.
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1983
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6 |
p. 1051-1054
4 p.
|
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Effect of ion beam etching on metal-Si and metal-GaAs barriers
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1985
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6 |
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1 p.
|
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Effect of ionizing radiation on second breakdown
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1973
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1 p.
|
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| 946 |
Effect of lead frame material on plastic-encapsulated IC package cracking under temperature cycling
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1990
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100-101 |
6 |
p. 1201-
1 p.
|
artikel
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| 947 |
Effect of localised charges on nanoscale cylindrical surrounding gate MOSFET: Analog performance and linearity analysis
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Gautam, Rajni
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2012
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100-101 |
6 |
p. 989-994
6 p.
|
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| 948 |
Effect of oxidation on the breakdown characteristics of aluminium diffused junctions
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1977
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p. 643-644
2 p.
|
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| 949 |
Effect of pad surface finish and reflow cooling rate on the microstructure and the mechanical behavior of SnAgCu solder alloys
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Chavali, S.
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2013
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100-101 |
6 |
p. 892-898
7 p.
|
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Effect of reliability programs on life cycle cost—a case history
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1978
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6 |
p. 561-
1 p.
|
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| 951 |
Effect of shunt capacitance on tapered distributed RC network characteristics
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Au, K.D.
|
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1980
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100-101 |
6 |
p. 847-852
6 p.
|
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Effect of strain rate on fatigue of low-tin lead-base solder
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1990
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6 |
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1 p.
|
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| 953 |
Effect of switch failure on 2 redundant systems
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1980
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6 |
p. 900-
1 p.
|
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| 954 |
Effect of system processes on error repetition: a probabilistic and measurement approach
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1987
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6 |
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1 p.
|
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| 955 |
Effect of temperature-dependent band shifts on semiconductor transport properties
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1977
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100-101 |
6 |
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1 p.
|
artikel
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| 956 |
Effect of time-dependent development process on the limit of proximity exposure compensation in electron beam lithography
|
Deshmukh, P.R.
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1991
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100-101 |
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6 p.
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artikel
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Effect of uncertainty in failure rates on memory system reliability
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1987
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100-101 |
6 |
p. 1030-
1 p.
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artikel
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Effects of ambient atmosphere on aluminum-copper wirebond reliability
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1985
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100-101 |
6 |
p. 1160-
1 p.
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artikel
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| 959 |
Effects of annealing on the electric noise in semiconductor lasers
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Shi, Yingxue
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2004
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100-101 |
6 |
p. 957-961
5 p.
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artikel
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| 960 |
Effects of design automation on the reliability and maintainability design of electronic systems
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1978
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100-101 |
6 |
p. 560-561
2 p.
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artikel
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| 961 |
Effects of electron beam generated in vacuum photo-thermal processing on metal–silicon contacts
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Golan, G
|
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2001
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100-101 |
6 |
p. 871-879
9 p.
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artikel
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| 962 |
Effects of field implants on small geometry CMOS devices
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Roy, J.N.
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1987
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100-101 |
6 |
p. 953-957
5 p.
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artikel
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| 963 |
Effects of industrial air pollutants on electrical contact materials
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1974
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100-101 |
6 |
p. 442-
1 p.
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artikel
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| 964 |
Effects of MBE growth conditions on carbon contamination in GaAs
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1983
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100-101 |
6 |
p. 1183-
1 p.
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artikel
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| 965 |
Effects of oxygen and internal gettering on donor formation
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1985
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100-101 |
6 |
p. 1171-
1 p.
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artikel
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| 966 |
Effects of redundancy management on reliability modeling
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1990
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100-101 |
6 |
p. 1203-
1 p.
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artikel
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| 967 |
Effects of tip clearance and fin density on the performance of heat sinks for VLSI packages
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1990
|
100-101 |
6 |
p. 1206-
1 p.
|
artikel
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| 968 |
Effects of Weibull hazard rate on common cause failure analysis of reliability networks
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1978
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100-101 |
6 |
p. 562-
1 p.
|
artikel
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| 969 |
Effects on LCC of test equipment standardization
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1976
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100-101 |
6 |
p. 524-
1 p.
|
artikel
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| 970 |
Efficient algorithms to accurately compute derating factors of digital circuits
|
Asadi, Hossein
|
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2012
|
100-101 |
6 |
p. 1215-1226
12 p.
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artikel
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| 971 |
Efficient test pattern generators based on specific cellular automata structures
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Garbolino, T.
|
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2002
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100-101 |
6 |
p. 975-983
9 p.
|
artikel
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| 972 |
Ein schnelles Verfahren zur Berechnung der Auswirkungen von Bauelementetoleranzen bei einer Klasse von Zweitorschaltungen
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1971
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100-101 |
6 |
p. 415-
1 p.
|
artikel
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| 973 |
Electrical activation and impurity redistribution during pulsed laser annealing of BF+ 2 implanted amorphized silicon
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1982
|
100-101 |
6 |
p. 1198-
1 p.
|
artikel
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| 974 |
Electrical and structural dependence of operating temperature of AlGaN/GaN HEMTs
|
Heller, Eric
|
|
2013
|
100-101 |
6 |
p. 872-877
6 p.
|
artikel
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| 975 |
Electrical breakdown and selfhealing in solid tantalum capacitors
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1971
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100-101 |
6 |
p. 413-
1 p.
|
artikel
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| 976 |
Electrical characteristics of ion-implanted p-channel MOS transistors
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1974
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100-101 |
6 |
p. 453-
1 p.
|
artikel
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| 977 |
Electrical characteristics of r.f.-sputtered CdTe thin-films for photovoltaic applications
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1984
|
100-101 |
6 |
p. 1105-
1 p.
|
artikel
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| 978 |
Electrical characterization of silicon surface after reactive ion etching of silicon dioxide by CHF3
|
Tong, K.Y.
|
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1990
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100-101 |
6 |
p. 1111-1116
6 p.
|
artikel
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| 979 |
Electrical failure analysis of peristaltic micropumps fabricated with PZT actuators
|
Chen, Bing-Liang
|
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2012
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100-101 |
6 |
p. 1080-1085
6 p.
|
artikel
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| 980 |
Electrically conductive epoxies for screen printing applications
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1977
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100-101 |
6 |
p. 651-
1 p.
|
artikel
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| 981 |
Electrically-conductive epoxies—today's bonding material for microelectronics
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1972
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100-101 |
6 |
p. 480-
1 p.
|
artikel
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| 982 |
4376947 Electrically programmable floating gate semiconductor memory device
|
Chiu, Te-Long
|
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1983
|
100-101 |
6 |
p. 1196-
1 p.
|
artikel
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| 983 |
Electrical overstress failure analysis in microcircuits
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1978
|
100-101 |
6 |
p. 476-
1 p.
|
artikel
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| 984 |
Electrical properties of Cr-Al alloy thin films
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1987
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100-101 |
6 |
p. 1038-1039
2 p.
|
artikel
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| 985 |
Electrical properties of silicon doped with platinum
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1970
|
100-101 |
6 |
p. 460-
1 p.
|
artikel
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| 986 |
Electrical properties of (SN) x films
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1978
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100-101 |
6 |
p. 484-
1 p.
|
artikel
|
| 987 |
Electrical properties of thin films-metal-semiconductor contacts. 1. Metal-semiconductor junctions-related to deposition of thin films
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1977
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100-101 |
6 |
p. 657-
1 p.
|
artikel
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| 988 |
Electrical ratings of electronic components from the viewpoint of reliability
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1977
|
100-101 |
6 |
p. 642-643
2 p.
|
artikel
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| 989 |
Electrical resistivity and surface profile due to Al/Si/Ti reaction kinetics on an oxidised silicon wafer
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1987
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100-101 |
6 |
p. 1037-
1 p.
|
artikel
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| 990 |
Electrical stress and plasma-induced traps in SiO2
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Paskaleva, A.
|
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2000
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100-101 |
6 |
p. 933-940
8 p.
|
artikel
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| 991 |
Electric measuring equipment output to reach ¥700 billion
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1990
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100-101 |
6 |
p. 1204-
1 p.
|
artikel
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| 992 |
Electric subbands in p-type germanium inversion layers
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1983
|
100-101 |
6 |
p. 1184-
1 p.
|
artikel
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| 993 |
Electroless nickel resistors formed on IMST substrate
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1982
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100-101 |
6 |
p. 1196-
1 p.
|
artikel
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| 994 |
Electromigration and hall effect in cobalt films
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1977
|
100-101 |
6 |
p. 658-
1 p.
|
artikel
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| 995 |
Electromigration behavior analysis of aluminum alloys thin film conductors using maximum likelihood methods
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Weis, E.A.
|
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1992
|
100-101 |
6 |
p. 887-900
14 p.
|
artikel
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| 996 |
Electromigration failure under pulse test conditions
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1978
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6 |
p. 474-475
2 p.
|
artikel
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| 997 |
Electromigration-induced failures in VLSI interconnects
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1983
|
100-101 |
6 |
p. 1169-
1 p.
|
artikel
|
| 998 |
Electromigration in integrated circuits
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1970
|
100-101 |
6 |
p. 451-
1 p.
|
artikel
|
| 999 |
Electromigration mechanism in aluminium conductors
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1980
|
100-101 |
6 |
p. 898-
1 p.
|
artikel
|
| 1000 |
Electromigration mechanisms in aluminium lines
|
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1986
|
100-101 |
6 |
p. 1196-
1 p.
|
artikel
|
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