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                             3051 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayesian approach to reliability: theory and simulation 1972
100-101 5 p. 409-
1 p.
artikel
2 A Bayesian methodology for assessing reliability during product development 1991
100-101 5 p. 1042-
1 p.
artikel
3 A Bayesian note on reliability growth during a development testing program 1978
100-101 5 p. 486-
1 p.
artikel
4 A Bayesian time-to-failure distribution 1971
100-101 5 p. 301-
1 p.
artikel
5 A Bayes procedure combining black box estimates and laboratory tests 1984
100-101 5 p. 994-
1 p.
artikel
6 A Bayes sensitivity analysis when using the beta distribution as a prior 1989
100-101 5 p. 892-
1 p.
artikel
7 A bibliography on charge-coupled devices 1976
100-101 5 p. 377-
1 p.
artikel
8 A bibliography on electron beam induced current analysis of semiconductor devices 1977
100-101 5 p. 553-
1 p.
artikel
9 A bipolar control storage memory-design-considerations and test problems 1973
100-101 5 p. 414-
1 p.
artikel
10 A 2400-bit/s microprocessor-based modem 1981
100-101 5 p. 758-759
2 p.
artikel
11 A boolean algebra method for reliability calculations Gupta, P.P.
1983
100-101 5 p. 863-865
3 p.
artikel
12 Abstracts and book lists Dummer, G.W.A.
1970
100-101 5 p. 357-
1 p.
artikel
13 A bulk queueing system with random failures and two phase repairs Madan, K.C.
1992
100-101 5 p. 669-677
9 p.
artikel
14 A burn-in programme for wearout unaffected equipments 1976
100-101 5 p. 375-
1 p.
artikel
15 A case study in availability forecasting Baxter, Laurence A.
1985
100-101 5 p. 927-942
16 p.
artikel
16 Accelerated dielectric breakdown and wear out standard testing methods and structures for reliability evaluation of thin oxides Ghibaudo, G
1999
100-101 5 p. 597-613
17 p.
artikel
17 Accelerated vibration fatigue life testing of leads and soldered joints 1976
100-101 5 p. 372-
1 p.
artikel
18 Accurate natural convection modelling for magnetic components Valchev, Vencislav
2003
100-101 5 p. 795-802
8 p.
artikel
19 Accurate two-port model of the metal-oxide semiconductor transistor Kumar, Umesh
1978
100-101 5 p. 427-432
6 p.
artikel
20 Aceelerated testing of air-to-air guided minsiles 1973
100-101 5 p. 409-
1 p.
artikel
21 A ceramic capacitor substrate for high speed switching VLSI chips 1983
100-101 5 p. 1003-
1 p.
artikel
22 Achieving reliable consumer products through total program management of new models 1978
100-101 5 p. 406-
1 p.
artikel
23 A class of shrinkage estimators for the variance of a normal population Singh, Housila P.
1997
100-101 5 p. 863-867
5 p.
artikel
24 A CMOS process for VLSI instrumentation 1983
100-101 5 p. 1000-
1 p.
artikel
25 A cold standby system with multiple switch-over devices attended by a monitor Vanderperre, E.J.
1994
100-101 5 p. 921-923
3 p.
artikel
26 A comparison between noise measurements and conventional electromigration reliability testing 1989
100-101 5 p. 898-
1 p.
artikel
27 A comparison of algorithms for terminal-pair reliability 1989
100-101 5 p. 891-
1 p.
artikel
28 A comparison of copper and gold wire bonding on integrated circuit devices 1991
100-101 5 p. 1038-
1 p.
artikel
29 A comparison of four Monte Carlo methods for estimating the probability of s-t connectedness 1987
100-101 5 p. 935-936
2 p.
artikel
30 A comparison of SIMS with other techniques based on ion-beam solid interactions 1984
100-101 5 p. 1002-
1 p.
artikel
31 A compilation technique for exact system reliability 1982
100-101 5 p. 1040-
1 p.
artikel
32 A complete reliability program 1972
100-101 5 p. 410-
1 p.
artikel
33 A computer-aided design system for hybrid circuits 1981
100-101 5 p. 764-
1 p.
artikel
34 A computer-aided method for allocation of discrete tolerances in electric networks Pillai, K.R.
1981
100-101 5 p. 711-715
5 p.
artikel
35 A computer algorithm for accurate and repeatable profile analysis using anodization and stripping of silicon 1977
100-101 5 p. 553-
1 p.
artikel
36 A consideration of reliability in economic distribution quantity for a warehouse Ntuen, Celestine A.
1991
100-101 5 p. 913-917
5 p.
artikel
37 A consistent shape parameter estimator for the Weibull distribution 1973
100-101 5 p. 405-406
2 p.
artikel
38 A continuous time model of multiple intermittent faults in digital systems 1981
100-101 5 p. 752-
1 p.
artikel
39 A contractor view of warranty contracting 1976
100-101 5 p. 371-
1 p.
artikel
40 A 6800 coprocessor for error detection in microcomputers: the PAD 1987
100-101 5 p. 938-
1 p.
artikel
41 A cost effective approach to weapon acceptance 1977
100-101 5 p. 547-
1 p.
artikel
42 A cost model for skip-lot non-destructive sampling 1980
100-101 5 p. 754-
1 p.
artikel
43 Acoustic-emission-monitored tests for TAB inner lead bond quality 1983
100-101 5 p. 992-
1 p.
artikel
44 AC product defect level and yield loss 1991
100-101 5 p. 1039-
1 p.
artikel
45 A critique of MOS/LSI testing 1971
100-101 5 p. 307-
1 p.
artikel
46 A cubical logic circuit modelling for reliability studies Dokouzgiannis, S.P.
1987
100-101 5 p. 823-831
9 p.
artikel
47 A cut set method for reliability evaluation of systems having s-dependent components 1981
100-101 5 p. 753-
1 p.
artikel
48 A/D converter based on a new memory cell implemented using the switched current technique Śniatała, Paweł
2004
100-101 5 p. 861-867
7 p.
artikel
49 A decomposition scheme for the analysis of fault trees and other combinatorial circuits 1990
100-101 5 p. 1011-
1 p.
artikel
50 A delay-differential equation related to a renewable parallel system Vanderperre, E.J.
1997
100-101 5 p. 739-741
3 p.
artikel
51 A design procedure for discard VS repair decisions 1971
100-101 5 p. 306-
1 p.
artikel
52 A device analysis system based on laser scanning techniques Nagase, Masashi
1980
100-101 5 p. 717-735
19 p.
artikel
53 Adhesion measurement of thin films 1976
100-101 5 p. 381-382
2 p.
artikel
54 Adhesion work analysis through molecular modeling and wetting angle measurement Król, Dawid Jan
2015
100-101 5 p. 758-764
7 p.
artikel
55 Adhesive techniques in microelectronics 1984
100-101 5 p. 1002-
1 p.
artikel
56 A different approach to the analysis of data in life-tests of laser diodes Bonfiglio, A.
1998
100-101 5 p. 767-771
5 p.
artikel
57 A diffusion method for reliability prediction 1970
100-101 5 p. 379-
1 p.
artikel
58 A direct algorithm for computing reliability of a consecutive-k cycle 1989
100-101 5 p. 891-892
2 p.
artikel
59 A direct method to calculate the frequency and duration of failures for large networks 1978
100-101 5 p. 486-
1 p.
artikel
60 A discussion of yield modeling with defect clustering, circuit repair and circuit redundancy 1991
100-101 5 p. 1037-
1 p.
artikel
61 Admissibility of a test procedure based on preliminary test of significance for life data Singh, S.K.
1989
100-101 5 p. 721-722
2 p.
artikel
62 Admissible, minimax and equivariant estimators of life distributions from Type II censored samples 1981
100-101 5 p. 753-754
2 p.
artikel
63 Advanced copper/polyimide hybrid technology 1988
100-101 5 p. 835-
1 p.
artikel
64 Advanced lithographies: finding a niche 1987
100-101 5 p. 942-
1 p.
artikel
65 Advanced manufacturing techniques of discrete packs 1978
100-101 5 p. 408-
1 p.
artikel
66 Advances in BiMOS integrated circuits 1978
100-101 5 p. 408-
1 p.
artikel
67 Advances in film extend component capabilities 1977
100-101 5 p. 557-
1 p.
artikel
68 Advances in reduced pressure silicon epitaxy 1980
100-101 5 p. 762-
1 p.
artikel
69 Advances in resistor fabrication yield monolithic 10-bit DACs 1973
100-101 5 p. 417-
1 p.
artikel
70 Advantages of a floating annular ring in three-layer tab assembly 1988
100-101 5 p. 832-833
2 p.
artikel
71 A dynamic bias system for burn-in or thermal endurance treatments of 8085A microprocessors 1983
100-101 5 p. 993-
1 p.
artikel
72 A dynamic synchronization method to realize soft defect localization applied on digital and mixed-mode analog ICs in failure analysis Wu, Chunlei
2014
100-101 5 p. 993-999
7 p.
artikel
73 AECL's reliability and maintainability program 1977
100-101 5 p. 548-
1 p.
artikel
74 Aegis An/Spy radar system—design for availability 1973
100-101 5 p. 410-
1 p.
artikel
75 Aegis operational readiness test system—design for system effectiveness 1973
100-101 5 p. 410-
1 p.
artikel
76 A facelifting for NASA's reliability requirements 1971
100-101 5 p. 302-
1 p.
artikel
77 A fast algorithm for the performance index of a telecommunication network 1989
100-101 5 p. 891-
1 p.
artikel
78 A fast algorithm to formulate Markov system equations Luis Roca, J.
1984
100-101 5 p. 897-898
2 p.
artikel
79 A faster generation of MOS devices with low thresholds is riding the crest of the new wave, silicon-gate ICs 1970
100-101 5 p. 390-
1 p.
artikel
80 A fast, flexible, and easy-to-develop FPGA-based fault injection technique Ebrahimi, Mojtaba
2014
100-101 5 p. 1000-1008
9 p.
artikel
81 A fast logic gate for large scale integration 1973
100-101 5 p. 414-
1 p.
artikel
82 A fast response non-contact type potentiometer using an improved CdSe film 1978
100-101 5 p. 412-
1 p.
artikel
83 A field study of the electrical performance of separable connectors 1978
100-101 5 p. 400-401
2 p.
artikel
84 A fringing-capacitance model for deep-submicron MOSFET with high-k gate dielectric Ji, F.
2008
100-101 5 p. 693-697
5 p.
artikel
85 AFSATCOM terminal segment reliability test program 1977
100-101 5 p. 549-
1 p.
artikel
86 After CFCs? options for cleaning electronics assemblies G.W.A.D.,
1992
100-101 5 p. 737-738
2 p.
artikel
87 A gaseous detector device for an environmental SEM 1984
100-101 5 p. 1000-
1 p.
artikel
88 A general age replacement model with minimal repair and general random repair cost Sheu, Shey-Huei
1991
100-101 5 p. 1009-1017
9 p.
artikel
89 A generalized block-replacement policy 1982
100-101 5 p. 1041-
1 p.
artikel
90 A generalized fault simulator for combinational logic circuits 1990
100-101 5 p. 1010-
1 p.
artikel
91 A generalized multi-standby multi-failure mode system with various repair facilities Chryssaphinou, O.
1997
100-101 5 p. 721-724
4 p.
artikel
92 A general method for turning a coherent system's structure function to SLE Lu, Pei-En
1985
100-101 5 p. 833-835
3 p.
artikel
93 A general replacement of a system subject to shocks Sheu, Shey-Huei
1992
100-101 5 p. 657-662
6 p.
artikel
94 A general software reliability model for performance prediction Shanthikumar, J.G.
1981
100-101 5 p. 671-682
12 p.
artikel
95 A geometric programming approach for optimum tolerance assignment in circuits Pillai, K.R.
1981
100-101 5 p. 731-735
5 p.
artikel
96 A glow discharge ion gun for etching 1973
100-101 5 p. 418-
1 p.
artikel
97 A Heuristic approach to the generation of tests for faults on the intermediate lines 1983
100-101 5 p. 995-
1 p.
artikel
98 A high energy ion scattering/channeling and low energy ion scattering apparatus for surface analysis 1991
100-101 5 p. 1056-
1 p.
artikel
99 A high performance thick film capacitor system 1978
100-101 5 p. 413-
1 p.
artikel
100 A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging Marks, M.R.
1995
100-101 5 p. 807-815
9 p.
artikel
101 A high speed ECL multiplexer in beam lead, hybrid technology 1978
100-101 5 p. 487-488
2 p.
artikel
102 A high stability RC circuit using high nitrogen doped tantalum 1978
100-101 5 p. 414-
1 p.
artikel
103 A history of value engineering 1970
100-101 5 p. 380-
1 p.
artikel
104 A hybrid fuzzy neural network-expert system for a short term unit commitment problem Padhy, Narayana Prasad
1997
100-101 5 p. 733-737
5 p.
artikel
105 A hybrid repeater using integrated circuits 1971
100-101 5 p. 309-
1 p.
artikel
106 A hydrogen sensor based on a metamorphic high electron mobility transistor (MHEMT) Tsai, Tsung-Han
2010
100-101 5 p. 734-737
4 p.
artikel
107 Air force systems command approach to R&M 1988
100-101 5 p. 830-
1 p.
artikel
108 A Kolmogorov-Smirnov goodness-of-fit test for the two-parameter Weibull distribution when the parameters are estimated from the data 1983
100-101 5 p. 996-
1 p.
artikel
109 A k-out-of-n three-state devices system with common-cause failures Dhillon, Balbir S.
1978
100-101 5 p. 447-448
2 p.
artikel
110 Alcohol modified RTV silicone encapsulation for integrated circuit device packaging 1984
100-101 5 p. 998-
1 p.
artikel
111 Algebraical algorithm for computing complex systems reliability Luis Roca, J.
1984
100-101 5 p. 901-903
3 p.
artikel
112 Algorithm transformation methods to reduce the overhead of software-based fault tolerance techniques Azambuja, José Rodrigo
2014
100-101 5 p. 1050-1055
6 p.
artikel
113 A linear-time algorithm to compute the reliability of planar cube-free networks 1991
100-101 5 p. 1046-
1 p.
artikel
114 A literature survey of the human reliability component in a man-machine system 1989
100-101 5 p. 885-
1 p.
artikel
115 Alloy element additions to gold thick film conductors: Effects on indium/lead soldering and ultrasonic aluminum wire bonding 1978
100-101 5 p. 493-
1 p.
artikel
116 Alloy scattering and high field transport in ternary and quaternary III–V semiconductors 1978
100-101 5 p. 491-
1 p.
artikel
117 A low cost thick-film active filter for consumer application 1978
100-101 5 p. 414-
1 p.
artikel
118 A low-leakage-current CdSe thin film transistor 1981
100-101 5 p. 764-
1 p.
artikel
119 A low-power circuit block for digital telephone exchanges 1976
100-101 5 p. 378-
1 p.
artikel
120 A low power thermal head realizing high quality printing 1978
100-101 5 p. 412-
1 p.
artikel
121 Alpha-particle-induced soft-error mechanism in semi-insulating GaAs substrate 1989
100-101 5 p. 896-
1 p.
artikel
122 Alteration of diffusion profiles in semiconductors due to p-n junctions 1983
100-101 5 p. 1001-
1 p.
artikel
123 Aluminium corrosion in the presence of phosphosilicate glass and moisture 1977
100-101 5 p. 554-
1 p.
artikel
124 Aluminum-aluminum oxide metallurgy for enhanced electromigration resistance in monolithic circuits 1971
100-101 5 p. 304-
1 p.
artikel
125 Aluminum metallization—Advantages and limitations for integrated circuit applications 1970
100-101 5 p. 391-
1 p.
artikel
126 Aluminum wire to thick film connections for high temperature operation 1978
100-101 5 p. 408-
1 p.
artikel
127 A maintenance philosophy for mainframe computers 1984
100-101 5 p. 995-
1 p.
artikel
128 A management guide to reliability predictions 1984
100-101 5 p. 995-
1 p.
artikel
129 A manufacturer's approach to reliability in capacitor production for the domestic market 1978
100-101 5 p. 400-
1 p.
artikel
130 A manufacturing reliability program for xerographic copying machines Douglas Ekings, J.
1976
100-101 5 p. 437-450
14 p.
artikel
131 A many-state Markov model for computer software performance parameters 1976
100-101 5 p. 375-
1 p.
artikel
132 A mathematical analysis of human-machine interface configurations for a safety monitoring system 1989
100-101 5 p. 885-
1 p.
artikel
133 A mathematical study of space-charge layer capacitance for an abrupt p-n semiconductor junction 1977
100-101 5 p. 556-
1 p.
artikel
134 A 0.35μm CMOS divide-by-2 quadrature injection-locked frequency divider based on voltage–current feedback topology Jang, Sheng-Lyang
2010
100-101 5 p. 594-598
5 p.
artikel
135 A 0.18μm CMOS linear-in-dB AGC post-amplifier for optical communications Aznar, Francisco
2011
100-101 5 p. 959-964
6 p.
artikel
136 A method for calculation of network reliability 1976
100-101 5 p. 376-
1 p.
artikel
137 A method for computing steady-state reliability indexes of a network with limited repair Gagin, Alexander A.
1991
100-101 5 p. 985-999
15 p.
artikel
138 A method for estimating the reliability of ICs 1978
100-101 5 p. 483-
1 p.
artikel
139 A method for microprocessor software reliability prediction 1989
100-101 5 p. 892-
1 p.
artikel
140 A method for obtaining software reliability measures during development 1989
100-101 5 p. 891-
1 p.
artikel
141 A method for predicting the probability of effective maintenance 1972
100-101 5 p. 414-
1 p.
artikel
142 A method for the rheological characterization of thick-film pastes 1980
100-101 5 p. 764-
1 p.
artikel
143 A method of automatic centering of chips, masks and semiconductor wafers 1978
100-101 5 p. 487-
1 p.
artikel
144 A method of detecting the nature of IC defects 1989
100-101 5 p. 886-
1 p.
artikel
145 A method of grading mica for use in high-reliability capacitors 1976
100-101 5 p. 373-374
2 p.
artikel
146 A method to estimate the Weibull parameters for progressively censored tests 1988
100-101 5 p. 830-
1 p.
artikel
147 A microelectronics packaging technology for consumer product applications 1978
100-101 5 p. 408-
1 p.
artikel
148 A microprocessor-based semiconductor measurement system 1978
100-101 5 p. 410-
1 p.
artikel
149 AMIS: a sharp eye on integrated-circuit masks 1977
100-101 5 p. 553-
1 p.
artikel
150 A model for mechanisms in plastic encapsulated microelectronic devices during temperature-humidity tests—I Matthaei, Guenter
1990
100-101 5 p. 835-838
4 p.
artikel
151 A model for mechanisms in plastic-encapsulated microelectronic devices during temperature-humidity tests—II Matthäi, Günter
1991
100-101 5 p. 873-878
6 p.
artikel
152 A model for productivity measurement in the electronics industry Sultan, Torky I.
1991
100-101 5 p. 907-912
6 p.
artikel
153 A model for the breakdown characteristics of p-channel MOS transistor protection devices 1981
100-101 5 p. 759-
1 p.
artikel
154 A modified Monte Carlo technique for confidence limits of system reliability using pass-fail data 1988
100-101 5 p. 828-829
2 p.
artikel
155 A modified technique for computing network reliability 1989
100-101 5 p. 891-
1 p.
artikel
156 A moment method for the calculation of a confidence interval for the failure probability of a system 1972
100-101 5 p. 414-
1 p.
artikel
157 Amorphous semiconducting silicon-hydrogen alloys 1978
100-101 5 p. 488-
1 p.
artikel
158 A MOS model for computer-aided design 1976
100-101 5 p. 377-
1 p.
artikel
159 A multicomponent two-unit cold standby system with three modes Goel, L.R.
1983
100-101 5 p. 799-803
5 p.
artikel
160 A multi-standby multi-failure mode system with repair and replacement policy Goel, L.R.
1983
100-101 5 p. 809-812
4 p.
artikel
161 A multi-state system model 1977
100-101 5 p. 550-
1 p.
artikel
162 A multistate system with general repair time distribution 1981
100-101 5 p. 752-
1 p.
artikel
163 A multistate system with several failure modes and cold standby units Yamashiro, Mitsuo
1980
100-101 5 p. 673-677
5 p.
artikel
164 An active R filter using CMOS transistor arrays 1976
100-101 5 p. 378-379
2 p.
artikel
165 An algorithm for determining the most reliable path of a network Jain, V.K.
1986
100-101 5 p. 883-884
2 p.
artikel
166 An algorithm for evaluating all the minimal cuts of a graph Singh, Brijendra
1995
100-101 5 p. 865-867
3 p.
artikel
167 An algorithm for symbolic reliability computation with path-sets or cut-sets 1988
100-101 5 p. 829-
1 p.
artikel
168 An algorithm to determine the reliability of a complex system 1970
100-101 5 p. 383-
1 p.
artikel
169 An alternate approach to syndrome algebra for diagnostics 1983
100-101 5 p. 996-
1 p.
artikel
170 Analysis and evaluation of TAB bonds 1990
100-101 5 p. 1007-
1 p.
artikel
171 Analysis and test procedures for NOR flash memory defects Mohammad, Mohammad Gh.
2008
100-101 5 p. 698-709
12 p.
artikel
172 Analysis of a degraded multistate system with general repair-time distributions Yamashiro, Mitsuo
1980
100-101 5 p. 647-650
4 p.
artikel
173 Analysis of a k-out-of-n unit system with two types of failure and preventive maintenance Goel, L.R.
1984
100-101 5 p. 877-880
4 p.
artikel
174 Analysis of a one-server two-unit parallel system Gopalan, M.N.
1985
100-101 5 p. 859-863
5 p.
artikel
175 Analysis of a repairable system which operates at discrete times 1976
100-101 5 p. 375-
1 p.
artikel
176 Analysis of a system having super-priority, priority and ordinary units with arbitrary distributions Gupta, Rakesh
1997
100-101 5 p. 851-856
6 p.
artikel
177 Analysis of a three-state system with two types of components 1976
100-101 5 p. 374-
1 p.
artikel
178 Analysis of a three-unit redundant system with two types of repair and inspection Goel, L.R.
1989
100-101 5 p. 769-773
5 p.
artikel
179 Analysis of a two unit deteriorating standby system with repair Jacob, Mendus
1997
100-101 5 p. 857-861
5 p.
artikel
180 Analysis of a two-unit repairable system with random inspection subject to two types of failure 1984
100-101 5 p. 992-993
2 p.
artikel
181 Analysis of a two unit standby system with partial failure and two types of repairs Goel, L.R.
1984
100-101 5 p. 873-876
4 p.
artikel
182 Analysis of CMOS transistor instabilities 1988
100-101 5 p. 825-826
2 p.
artikel
183 Analysis of coherent multistate systems 1982
100-101 5 p. 1040-
1 p.
artikel
184 Analysis of early failures in unequal size samples 1973
100-101 5 p. 406-
1 p.
artikel
185 Analysis of ESD discharge current distribution and area optimization of VDMOS gate protection structure Tam, Wing-Shan
2010
100-101 5 p. 622-626
5 p.
artikel
186 Analysis of external latch-up protection test structure design using numerical simulation Palser, Kevin
1999
100-101 5 p. 647-659
13 p.
artikel
187 Analysis of faults of integrated circuits with the JENATECH-inspection microscope 1990
100-101 5 p. 1008-
1 p.
artikel
188 Analysis of implanted layers by means of secondary ion mass spectrometry (SIMS) 1976
100-101 5 p. 384-
1 p.
artikel
189 Analysis of interconnect capacitance for sub nano CMOS technology using the low dielectric material Joshi, Bhavana N.
2011
100-101 5 p. 953-958
6 p.
artikel
190 Analysis of logistic supportability for complex systems 1991
100-101 5 p. 1045-1046
2 p.
artikel
191 Analysis of mission-oriented systems 1970
100-101 5 p. 383-
1 p.
artikel
192 Analysis of non-catastrophic failures in electronic devices due to random noise Prakash, Chandra
1977
100-101 5 p. 587-588
2 p.
artikel
193 Analysis of optical properties of fundamental-mode in waveguide tapered fibers Lee, Cheng-Ling
2010
100-101 5 p. 726-729
4 p.
artikel
194 Analysis of 1-out-of-n: G adjustable operating system 1984
100-101 5 p. 989-
1 p.
artikel
195 Analysis of package cracking during reflow soldering process 1989
100-101 5 p. 894-
1 p.
artikel
196 Analysis of performance-degradation data from accelerated tests 1982
100-101 5 p. 1042-
1 p.
artikel
197 Analysis of quality parameters in the electronic industry to determine the optimum quality level Sultan, Torky I.
1993
100-101 5 p. 689-696
8 p.
artikel
198 Analysis of reliability block diagrams with multiple blocks per component 1991
100-101 5 p. 1042-
1 p.
artikel
199 Analysis of reliability data from operational control equipment 1970
100-101 5 p. 384-
1 p.
artikel
200 Analysis of retrospective failure data using computer graphics 1978
100-101 5 p. 405-
1 p.
artikel
201 Analysis of series deviance in a parallel state transition diagram and applications to fault tolerant computing Lombardi, Fabrizio
1983
100-101 5 p. 963-980
18 p.
artikel
202 Analysis of series deviance in a parallel state transition diagram and applications to fault tolerant computing 1984
100-101 5 p. 989-
1 p.
artikel
203 Analysis of series-parallel production networks without buffers 1987
100-101 5 p. 938-
1 p.
artikel
204 Analysis of Stochastic Petri Net model with non-exponential distributions using a generalized Markov Renewal Process Jin, Qun
1991
100-101 5 p. 933-939
7 p.
artikel
205 Analysis of systems subject to inspection and repair: A state-of-the-art survey Subramanyam Naidu, R.
1984
100-101 5 p. 939-945
7 p.
artikel
206 Analysis of television test and field data affected by spread in running time 1970
100-101 5 p. 384-385
2 p.
artikel
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218 An analytical approach to determining optimum reliability and maintainability requirements 1978
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272 An improved silicon p-channel MESFET with a BF2 implanted thin channel and ErSi2 gate 1990
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275 An integrated analytic approach for reliability improvement 1991
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277 An integrated LSI design aids system 1982
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279 An interactive knowledge-based system for forecasting new product reliability 1990
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280 An investigation of carrier transport in thin silicon-on-sapphire films using MIS deep depletion Hall effect structures 1972
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293 An optimal annealing technique for OHMIC contacts to ion-implanted n-layers in semi-insulating indium phosphide 1987
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295 A notation for designing restoring logic circuitry in CMOS 1983
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308 An X-ray fluorescence technique for the rapid determination of phosphorous in PSG film 1977
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309 A 1-out-of-N: G system with common-cause failures and critical human errors Singh, Jai
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310 A perspective on CMOS technology trends 1987
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311 A perspective on computer reliability 1972
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313 A Petri net approach to enumerate all system success paths for reliability evaluation of a complex system 1983
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314 A physical interpretation of dispersive transport in disordered semiconductors 1981
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1990
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1982
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1986
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322 Application of copper conductor and ruthenium containing oxides-glass resistor to high-frequency hybrid ICs for a protable cellular radio 1989
100-101 5 p. 898-
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323 Application of molecular beam epitaxy to III–V microwave and high speed device fabrication 1983
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324 Application of sputtering in the fabrication of semiconductor devices 1971
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325 Application of tape automated bonding technology to hybrid microcircuits 1977
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327 Application of thermal analysis to the semiconductor plastic package thermal shock testing reliability Ritchie, Kim
1976
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328 Application of thermodiffusion for the purification of solids 1980
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329 Applications determine the design, materials, processes and package 1971
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330 Applications of ion-implantation in semiconductor devices 1976
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331 Applications of magnetic levitation based micro-automation in semiconductor manufacturing 1991
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332 Applications of massspectrometers to plasma process monitoring & control 1978
100-101 5 p. 411-
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333 Applied electromagnetics in materials G.W.A.D.,
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334 Applying signature analysis to existing processor-based products 1981
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335 Approach to reliability for the SM-2 Missile 1973
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336 Approximate expressions for steady-state reliability indexes of Markov systems 1987
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348 A proposal for a standard procedure for moderately accelerated electromigration tests on metal lines Scorzoni, A.
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349 A radiation hardened 256 × 4 bulk CMOS RAM 1983
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350 Architectural factors influencing the reliability of fault-tolerant VLSI arrays Bobbio, Andrea
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351 A real life MTBF growth program for a deployed radar 1980
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352 A recursive algorithm for bounding network reliability 1978
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353 A redundant metal-polyimide thin film interconnection process for wafer scale dimensions 1991
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354 A re-extrapolation technique in Newton-Sor computer simulation of semiconductor devices 1983
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357 A reliability cost-benefit analysis study 1972
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360 A reliability physics model for parallel system 1984
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361 A reliability study of relay suitable for surface mount process using high-temperature-resistant plastics 1989
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362 A repairable system with N failure modes and K standby units 1983
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363 Are U.S. C-MOS makers falling behind? 1981
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364 A review of electronics reliability engineering practice Sandiford, S.L.
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365 A review of fault detection methods for large system 1976
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366 A review of flatness effects in microlithographic technology 1981
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367 A review of IC fabrication design and assembly defects manifested as field failures in Air Force avionic equipment 1989
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368 A review of reactive ion beam etching for production 1984
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369 A review of thermal enhancement techniques for electronic systems 1991
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371 Argon and reactive ion beam etching for SAW devices 1984
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372 ARIES—an automated reliability estimation system for redundant digital structures 1977
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376 A semi-parametric approach to testing for reliability growth, with application to software systems 1987
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377 A semi-regenerative process of two-unit warm standby system 1983
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379 ASIC photolithography: characterization challenges 1989
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1986
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1987
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1995
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1986
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1991
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1983
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400 Assessment of system reliability in electronics 1978
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415 A testing method for assessing solder joint reliability of FCBGA packages Wang, Jinlin
2004
100-101 5 p. 833-840
8 p.
artikel
416 A test of the exponential MTBF and comparison of power functions in the random censoring case 1989
100-101 5 p. 892-
1 p.
artikel
417 A test to identify the uniform distribution, with applications to probability plotting and other distributions 1988
100-101 5 p. 832-
1 p.
artikel
418 A thick film active filter for PCM communication systems 1978
100-101 5 p. 413-
1 p.
artikel
419 A thick film capacitive temperature sensor 1978
100-101 5 p. 413-
1 p.
artikel
420 A time-dependent complex system with pre-emptive priority repairs 1970
100-101 5 p. 383-
1 p.
artikel
421 A time series control chart for a nuclear reactor 1980
100-101 5 p. 755-
1 p.
artikel
422 At last, a bipolar shift register with the same bit capacity as MOS 1970
100-101 5 p. 389-
1 p.
artikel
423 Atomic beam scattering 1989
100-101 5 p. 899-
1 p.
artikel
424 Atomic layer growth of GaAs by molecular beam epitaxy using desorption of excess Ga atoms 1991
100-101 5 p. 1055-
1 p.
artikel
425 A transient solution of the state-dependent queue: M/M/1/N with balking and reflecting barrier Abou-El-Ata, M.O.
1993
100-101 5 p. 681-688
8 p.
artikel
426 A transmission-line analog simulating thin-film distributed-RC elements 1980
100-101 5 p. 763-
1 p.
artikel
427 A travelling-wave rate equation analysis for semiconductor lasers 1987
100-101 5 p. 942-943
2 p.
artikel
428 A two dissimilar unit multi-component system with correlated failures and repairs Gupta, Rakesh
1997
100-101 5 p. 845-849
5 p.
artikel
429 A two non-identical three-state units redundant system with common-cause failures and one standby unit Chung, Who Kee
1981
100-101 5 p. 707-709
3 p.
artikel
430 A two-unit cold standby system with three modes and correlated failures and repairs Goel, L.R.
1991
100-101 5 p. 835-840
6 p.
artikel
431 A two-unit standby power plant with imperfect switching Gupta, P.P.
1990
100-101 5 p. 865-867
3 p.
artikel
432 Auftrag, Aufgaben, Arbeitsweise eines Qualitätsprüflabors für Bauelemente 1973
100-101 5 p. 407-408
2 p.
artikel
433 A unified availability analysis method for sysstems containing design errors 1978
100-101 5 p. 486-
1 p.
artikel
434 A unified method for analyzing mission reliability for fault tolerant computer systems 1973
100-101 5 p. 408-409
2 p.
artikel
435 A unified switching theory with applications to VLSI design 1983
100-101 5 p. 998-999
2 p.
artikel
436 A 4-unit redundant system with common-cause failures 1978
100-101 5 p. 484-
1 p.
artikel
437 Automated generation of reliability models 1989
100-101 5 p. 890-
1 p.
artikel
438 Automated reliability life data analysis of missiles in storage and flight 1991
100-101 5 p. 1044-
1 p.
artikel
439 Automated semiconductor line speeds custom chip production 1981
100-101 5 p. 756-
1 p.
artikel
440 Automated visual inspection of bare printed circuit boards 1991
100-101 5 p. 1040-
1 p.
artikel
441 Automated wire bonding versus tape automated bonding: What are the tradeoffs? 1978
100-101 5 p. 408-
1 p.
artikel
442 Automatic alignment considerations in wafer fabrication 1976
100-101 5 p. 377-
1 p.
artikel
443 Automatically tuned filter uses IC operational amplifiers 1972
100-101 5 p. 417-
1 p.
artikel
444 Automatic photoresist develop process end point detection software 1978
100-101 5 p. 407-
1 p.
artikel
445 Automatic testing of metallized ceramic-polyimide (MCP), substrates 1991
100-101 5 p. 1041-
1 p.
artikel
446 Automatic unit troubleshoots systems 1981
100-101 5 p. 752-
1 p.
artikel
447 Automation of solder joint inspection procedures utilizing laser induced infrared 1988
100-101 5 p. 836-
1 p.
artikel
448 Auto slump drags IC prices down 1981
100-101 5 p. 755-
1 p.
artikel
449 Availability analysis of steam and power generation systems in the thermal power plant Arora, Navneet
1997
100-101 5 p. 795-799
5 p.
artikel
450 Availability analysis of systems with two types of repair facilities Dhillon, Balbir S
1980
100-101 5 p. 679-686
8 p.
artikel
451 Availability calculations with exhaustible spares 1990
100-101 5 p. 1011-
1 p.
artikel
452 Availability formulae for standby systems of similar units that are preventively maintained 1991
100-101 5 p. 1046-
1 p.
artikel
453 Availability measures for an intermittently used repairable system Kapur, P.K.
1983
100-101 5 p. 841-844
4 p.
artikel
454 Availability measures for an intermittently used repairable system 1984
100-101 5 p. 992-
1 p.
artikel
455 Availability modeling of energy management systems Fricks, Ricardo M.
1998
100-101 5 p. 727-743
17 p.
artikel
456 Availability of a 2-component dependent system 1982
100-101 5 p. 1041-
1 p.
artikel
457 Availability of a washing system in the paper industry Kumar, Dinesh
1989
100-101 5 p. 775-778
4 p.
artikel
458 Availability of CNC machines: multiple-input transfer-function modeling 1990
100-101 5 p. 1010-
1 p.
artikel
459 Availability of repairable units when failure and restoration rates age in real time 1976
100-101 5 p. 376-
1 p.
artikel
460 Avalanche currents in planar structures 1971
100-101 5 p. 311-
1 p.
artikel
461 A variance expression for a security-of-supply model 1984
100-101 5 p. 990-
1 p.
artikel
462 A variational model for transistors 1987
100-101 5 p. 941-
1 p.
artikel
463 A view of the reliability on solid tantalum capacitors 1970
100-101 5 p. 382-
1 p.
artikel
464 Avionic reliability experience. AR-104 and 7818 1977
100-101 5 p. 550-551
2 p.
artikel
465 Avoiding electrolytic and strain-induced shorting mechanisms—a review 1990
100-101 5 p. 1005-
1 p.
artikel
466 A workable software quality/reliability plan 1978
100-101 5 p. 406-
1 p.
artikel
467 4337524 Backup power circuit for biasing bit lines of a static semiconductor memory Parkinson, W.D.
1982
100-101 5 p. 1051-
1 p.
artikel
468 Ball grid array & fine pitch peripheral interconnections A handbook of technology & applications for microelectronics/electronics manufacturing 1996
100-101 5 p. 712-
1 p.
artikel
469 Bandwidth availability of multiprocessor systems Prasad, E.V.
1994
100-101 5 p. 939-942
4 p.
artikel
470 4812755 Base board for testing integrated circuits Toshiyuki, Nakaie
1989
100-101 5 p. ii-iii
nvt p.
artikel
471 Base component of gain and delay time in base-implanted bipolar transistors 1981
100-101 5 p. 765-
1 p.
artikel
472 Base metal thick film conductors 1981
100-101 5 p. 764-
1 p.
artikel
473 Battlefield damage assessment and repair (BDAR) of electronic equipment 1989
100-101 5 p. 889-
1 p.
artikel
474 Bayes estimation of P(Y > X) in the geometric case Ahmad, K.E.
1995
100-101 5 p. 817-820
4 p.
artikel
475 Bayesian analysis of the Weibull process with unknown scale and shape parameters 1970
100-101 5 p. 379-
1 p.
artikel
476 Bayesian decomposition method for computing the reliability of an oriented network 1976
100-101 5 p. 377-
1 p.
artikel
477 Bayesian prediction for the range based on a two-parameter exponential distribution with a random sample size Salem, S.A.
1993
100-101 5 p. 623-632
10 p.
artikel
478 Bayesian 1-sample prediction for the 2-parameter Weibull distribution 1981
100-101 5 p. 753-
1 p.
artikel
479 Bayesian shrinkage estimation of reliability in parallel system with exponential failure of the components Pandey, M.
1985
100-101 5 p. 899-903
5 p.
artikel
480 Bayes interval estimation for the shape parameter of the power distribution 1987
100-101 5 p. 939-
1 p.
artikel
481 Bayes weighted availability for a digital radio transmission system 1987
100-101 5 p. 938-
1 p.
artikel
482 Beam-induced broadening effects in sputter depth profiling 1984
100-101 5 p. 1003-
1 p.
artikel
483 Beam leads gaining 1973
100-101 5 p. 411-
1 p.
artikel
484 Beam leads start to connect 1972
100-101 5 p. 415-
1 p.
artikel
485 Behavioural analysis of shell gasification and carbon recovery process in a urea fertilizer plant Kumar, Sunand
1996
100-101 5 p. 671-673
3 p.
artikel
486 Behaviour analysis of a urea decomposition system in the fertilizer industry under general repair policy Kumar, Dinesh
1991
100-101 5 p. 851-854
4 p.
artikel
487 Behaviour of a complex system with stand-by redundancy under different repair echelons Srivastava, S.S.
1971
100-101 5 p. 375-380
6 p.
artikel
488 Behaviour of a priority standby redundant system with different types of repair facilities Singh Joorel, J.P.
1995
100-101 5 p. 833-836
4 p.
artikel
489 Behaviour of a two correlated units redundant system with many types of failure Itoi, Takashi
1978
100-101 5 p. 517-522
6 p.
artikel
490 Benefits of real-time, in situ particle monitoring in production medium current implantation 1990
100-101 5 p. 1016-
1 p.
artikel
491 Best estimates of functions of the parameters of the Gaussian and gamma distributions 1976
100-101 5 p. 374-
1 p.
artikel
492 Best linear unbiased estimators for normal distribution quantiles for sample sizes up to to 20 1987
100-101 5 p. 936-
1 p.
artikel
493 Better graphs for dependability modeling Schneeweiss, Winfrid G.
1998
100-101 5 p. 807-820
14 p.
artikel
494 Biased estimates of variance components Shaban, Adel Magid M.
1995
100-101 5 p. 777-782
6 p.
artikel
495 Bias humidity performance and failure mechanisms of nonhermetic aluminium SIC's in an environment contaminated with SO2 1983
100-101 5 p. 992-993
2 p.
artikel
496 Bibliography of literature on fault trees Dhillon, Balbir S.
1978
100-101 5 p. 501-503
3 p.
artikel
497 Bibliography of literature on medical equipment reliability Dhillon, Balbir S
1980
100-101 5 p. 737-742
6 p.
artikel
498 Biomedical applications of microprocessors 1978
100-101 5 p. 488-
1 p.
artikel
499 Biphase data transmission system uses IC one-shot as converter doubler 1973
100-101 5 p. 412-
1 p.
artikel
500 Bipolar bit slices advance fast 1976
100-101 5 p. 377-
1 p.
artikel
501 Bipolar memories Alfke, P.
1974
100-101 5 p. 339-343
5 p.
artikel
502 Bipolar techniques approach MOS in density, cost and power drain, yet retain speed 1972
100-101 5 p. 418-
1 p.
artikel
503 Bipolar trends 1987
100-101 5 p. 939-940
2 p.
artikel
504 BIST architecture for oscillation test of analog ICs and investigation of test hardware influence Arbet, D.
2014
100-101 5 p. 985-992
8 p.
artikel
505 BIT detectability/reliability in expendable weapons 1984
100-101 5 p. 993-
1 p.
artikel
506 1024-Bit, N-Channel, MOS high-speed read/write memory 1973
100-101 5 p. 412-
1 p.
artikel
507 4096-Bit RAMs are on the doorstep 1973
100-101 5 p. 413-
1 p.
artikel
508 16-bit wave gathering speed 1978
100-101 5 p. 489-
1 p.
artikel
509 Bivariate mean residual life 1990
100-101 5 p. 1008-1009
2 p.
artikel
510 Bivariate survival model derived from a Weibull distribution 1982
100-101 5 p. 1042-
1 p.
artikel
511 Blend ECL and TTL ICs to obtain high frequency counter circuits. Counters up to 500 MHz can be built for systems or beach use 1973
100-101 5 p. 411-412
2 p.
artikel
512 Board level reliability of PBGA using flex substrate Hung, S.C
2001
100-101 5 p. 677-687
11 p.
artikel
513 4959507 Bonded ceramic metal composite substrate, circuit board constructed therewith and methods for production thereof Tanaka, Tadashi
1991
100-101 5 p. 1058-
1 p.
artikel
514 Bond pad structure reliability 1989
100-101 5 p. 888-
1 p.
artikel
515 Book review 1998
100-101 5 p. 841-
1 p.
artikel
516 Book review 1998
100-101 5 p. 839-840
2 p.
artikel
517 Book review 1999
100-101 5 p. 719-
1 p.
artikel
518 Boolean functions with engineering applications and computer programs G.W.A.D.,
1991
100-101 5 p. 1031-
1 p.
artikel
519 Boron implantation effects on Au: GaAs Schottky barrier 1988
100-101 5 p. 836-
1 p.
artikel
520 Boron implantation influence on the backgating effect in GaAs MESFETs 1988
100-101 5 p. 836-
1 p.
artikel
521 Boundary conditions at p-n junctions 1971
100-101 5 p. 311-
1 p.
artikel
522 Boundary conditions at p-n junctions 1980
100-101 5 p. 763-
1 p.
artikel
523 Bounding network-reliability using consecutive minimal cutsets 1989
100-101 5 p. 892-
1 p.
artikel
524 Bounds for reliability of large consecutive-k-out-of-n:F systems with unequal component reliability 1987
100-101 5 p. 936-
1 p.
artikel
525 Bounds for the probability of failure resulting from stress/strength interference 1990
100-101 5 p. 1009-
1 p.
artikel
526 Bounds of age replacement time 1983
100-101 5 p. 995-
1 p.
artikel
527 Bounds on reliability of a k-out-of-n system Lai, C.D.
1993
100-101 5 p. 697-703
7 p.
artikel
528 Bounds on the reliability of networks 1987
100-101 5 p. 936-
1 p.
artikel
529 Breakdown in ceramic capacitors under pulsed high voltage stress 1978
100-101 5 p. 400-
1 p.
artikel
530 Breakdown properties of thin oxides in irradiated MOS capacitors Brozek, T.
1993
100-101 5 p. 649-657
9 p.
artikel
531 British Railway's experience with electronic control gear on locomotives: 1966–1968 1970
100-101 5 p. 385-
1 p.
artikel
532 4956604 Broad band contactor assembly for testing integrated circuit devices Cedrone, Nicholas
1991
100-101 5 p. 1058-
1 p.
artikel
533 Broad-beam ion source technology and applications 1990
100-101 5 p. 1016-
1 p.
artikel
534 Bromine based aluminium etching 1989
100-101 5 p. 895-
1 p.
artikel
535 BS 9000 and custom-built microelectromics 1973
100-101 5 p. 410-411
2 p.
artikel
536 BS 9000 components and reliability quality factors: Suggested use of MIL-HDBK-217C factors based on a comparative product assurance analysis Gissing, J.G.
1981
100-101 5 p. 683-697
15 p.
artikel
537 Bubble memory family extends to megabit size 1980
100-101 5 p. 761-
1 p.
artikel
538 Bulk built in current sensors for single event transient detection in deep-submicron technologies Wirth, Gilson
2008
100-101 5 p. 710-715
6 p.
artikel
539 Bumped tape automated bonding (BTAB) practical application guidelines 1980
100-101 5 p. 760-
1 p.
artikel
540 Buried coaxial conductors for high-speed interconnections 1988
100-101 5 p. 834-
1 p.
artikel
541 Burn-in board design, material and component selection 1983
100-101 5 p. 992-
1 p.
artikel
542 Burn-in forever? There must be a better way! 1978
100-101 5 p. 402-
1 p.
artikel
543 Busy-period analysis of a two-unit warm standby system with inspection time 1984
100-101 5 p. 992-
1 p.
artikel
544 CAD in circuit packaging 1973
100-101 5 p. 411-
1 p.
artikel
545 CAD in electronics construction effects on the designing engineer and on the construction result 1984
100-101 5 p. 999-
1 p.
artikel
546 CAD's interface between design and mask-making 1984
100-101 5 p. 997-
1 p.
artikel
547 CAD station aims at VLSI design 1981
100-101 5 p. 759-
1 p.
artikel
548 CAD techniques for improved maintainability design 1989
100-101 5 p. 889-
1 p.
artikel
549 Calculate coherent system's reliability by using SLE Lu, Pei-En
1985
100-101 5 p. 829-831
3 p.
artikel
550 Calculating the failure frequency of a repairable system Zhi, Huang Xi
1982
100-101 5 p. 945-947
3 p.
artikel
551 Calculation of age-replacement with Weibull failure times 1982
100-101 5 p. 1042-
1 p.
artikel
552 Calculation of avalanche breakdown voltage and depletion layer thickness in a p-n junction with a double error function doping profile 1973
100-101 5 p. 415-
1 p.
artikel
553 Calculation of hot electron phenomena 1978
100-101 5 p. 492-
1 p.
artikel
554 Calculation of lattice dynamical properties from electronic energies. Application to C, Si and Ge 1976
100-101 5 p. 380-
1 p.
artikel
555 Calculation of the self-induced field profile produced by steady-state distribution of signal carriers in charge-coupled device 1981
100-101 5 p. 761-
1 p.
artikel
556 Calendar 2009
100-101 5 p. I-III
nvt p.
artikel
557 Calendar 2008
100-101 5 p. I-III
nvt p.
artikel
558 Calendar 2010
100-101 5 p. I-III
nvt p.
artikel
559 Calendar of forthcoming events 2003
100-101 5 p. I-IX
nvt p.
artikel
560 Calendar of international conferences, symposia, lectures and meetings of interest 1992
100-101 5 p. 747-750
4 p.
artikel
561 Calendar of international conferences, symposia, lectures and meetings of interest 1996
100-101 5 p. 725-727
3 p.
artikel
562 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1984
100-101 5 p. 827-829
3 p.
artikel
563 Calendar of international conferences, symposia, lectures and meetings of interest 1989
100-101 5 p. 671-675
5 p.
artikel
564 Calendar of international conferences, symposia, lectures and meetings of interest 1981
100-101 5 p. 623-625
3 p.
artikel
565 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1985
100-101 5 p. 815-817
3 p.
artikel
566 Calendar of international conferences, symposia, lectures and meetings of interest 1990
100-101 5 p. 995-997
3 p.
artikel
567 Calendar of international conferences, symposia, lectures and meetings of interest 1983
100-101 5 p. 767-771
5 p.
artikel
568 Calendar of international conferences, symposia, lectures and meetings of interest 1987
100-101 5 p. 797-802
6 p.
artikel
569 Calendar of international conferences, symposia, lectures and meetings of interest 1988
100-101 5 p. 673-675
3 p.
artikel
570 Calendar of international conferences, symposia, lectures and meetings of interest 1976
100-101 5 p. 357-358
2 p.
artikel
571 Calendar of international conferences, symposia, lectures and meetings of interest 1977
100-101 5 p. 527-529
3 p.
artikel
572 Calendar of international conferences, symposia, lectures and meetings of interest 1980
100-101 5 p. 553-555
3 p.
artikel
573 Calendar of international conferences, symposia, lectures and meetings of interest 1978
100-101 5 p. 469-472
4 p.
artikel
574 Calendar of international conferences, symposia, lectures and meetings of interest 1978
100-101 5 p. 379-381
3 p.
artikel
575 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1970
100-101 5 p. 373-374
2 p.
artikel
576 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1973
100-101 5 p. 397-398
2 p.
artikel
577 Calendar of international conferences, symposia, lectures and meetings of interest 1972
100-101 5 p. 401-402
2 p.
artikel
578 Call for papers 1985
100-101 5 p. 819-825
7 p.
artikel
579 Call for papers 1971
100-101 5 p. 297-
1 p.
artikel
580 Call for papers 1970
100-101 5 p. 375-376
2 p.
artikel
581 Call for Papers - ROCS 2008 Workshop 2008
100-101 5 p. IV-
1 p.
artikel
582 Calls for papers 1972
100-101 5 p. 405-408
4 p.
artikel
583 Can velocity overshoot or ballistic transport be efficient in submicron devices? 1983
100-101 5 p. 999-
1 p.
artikel
584 Capabilities of molecular beam epitaxy and materials prospects 1984
100-101 5 p. 1005-
1 p.
artikel
585 Capacitance voltage measurements on N-type InAs MOS diodes 1971
100-101 5 p. 311-
1 p.
artikel
586 Capacitor techniques for integrated circuit application 1970
100-101 5 p. 388-
1 p.
artikel
587 Carrier distributions function in semiconductors 1978
100-101 5 p. 492-
1 p.
artikel
588 Carrier heating or cooling in semiconductor devices 1973
100-101 5 p. 415-416
2 p.
artikel
589 Carrier mobilities in silicon semi-empirically related to temperature, doping and injection level 1982
100-101 5 p. 1044-
1 p.
artikel
590 Carrier mobility in inversion layers and rf plasma induced radiation defects at the Si-SiO2 interface 1984
100-101 5 p. 1000-
1 p.
artikel
591 Carrier mobility in inversion layers of Si–thin Ta2O5 structures Atanassova, E.
1998
100-101 5 p. 833-837
5 p.
artikel
592 Carrier multiplication and avalanche breakdown in selfaligned bipolar transistors 1990
100-101 5 p. 1015-
1 p.
artikel
593 Carrier transport simulator for silicon based on carrier distribution function evolutions 1990
100-101 5 p. 1014-
1 p.
artikel
594 Case study: reliability of the INEL-site power system 1990
100-101 5 p. 1010-1011
2 p.
artikel
595 Cathodoluminescence and photoluminescence of amorphous silicon oxynitride Gritsenko, V.A.
1999
100-101 5 p. 715-718
4 p.
artikel
596 CCD memory circuits of highest packing density—technological and electrical improvements 1978
100-101 5 p. 487-
1 p.
artikel
597 CEDAR: Modeling impact of component error derating and read frequency on system-level vulnerability in high-performance processors Asadi, Hossein
2014
100-101 5 p. 1009-1021
13 p.
artikel
598 Censored life-data analysis using linguistic variables 1989
100-101 5 p. 892-
1 p.
artikel
599 Censored sample size selection for life tests 1973
100-101 5 p. 406-
1 p.
artikel
600 Ceramics in substitutive and reconstructive surgery Andronescu, Ecaterina
1993
100-101 5 p. 767-
1 p.
artikel
601 CERT technology applied to an airborne radar 1980
100-101 5 p. 758-
1 p.
artikel
602 Change of the electron effective mass in extremely heavily doped n-type Si obtained by ion implantation and laser annealing 1981
100-101 5 p. 765-
1 p.
artikel
603 Characterisation of linearly graded p-n junction 1980
100-101 5 p. 762-
1 p.
artikel
604 Characterisation of Se implanted layers for GaAs FETs Singh, B.R.
1983
100-101 5 p. 857-861
5 p.
artikel
605 Characteristics of an indium—tin oxide transparent conductor deposited from organometallic compositions 1978
100-101 5 p. 411-
1 p.
artikel
606 Characteristics of an ion-implantation set-up for research 1976
100-101 5 p. 383-
1 p.
artikel
607 Characteristics of low ohmic, high-power, metallized thick-film resistors 1978
100-101 5 p. 413-414
2 p.
artikel
608 Characteristics of pH sensors fabricated by using protein-mediated CdSe/ZnS quantum dots Maikap, S.
2010
100-101 5 p. 747-752
6 p.
artikel
609 Characteristics optimization of N2O annealing on tungsten nanocrystal with W/Si dual-sputtered method for nonvolatile memory application Wang, Jer-Chyi
2010
100-101 5 p. 639-642
4 p.
artikel
610 Characterization of electromigration parameters in VLSI metallizations by 1 tf noise measurements 1991
100-101 5 p. 1051-
1 p.
artikel
611 Characterization of MIS structures and PTFTs using TiOx deposited by spin-coating Meneses, C.
2014
100-101 5 p. 893-898
6 p.
artikel
612 Characterization of thermal compression wire bonds to thick-film conductors on procelain substrates 1980
100-101 5 p. 764-
1 p.
artikel
613 Characterization of the silicon nitride–thermal oxide interface in oxide–nitride–oxide structures by ELS, XPS, ellipsometry, and numerical simulation Gritsenko, V.A.
1998
100-101 5 p. 745-751
7 p.
artikel
614 Characterization of thick film capicitors 1978
100-101 5 p. 493-
1 p.
artikel
615 Charge coupled device applications Alfke, P.
1974
100-101 5 p. 345-347
3 p.
artikel
616 Charge coupled devices—Basic operation and principles Arora, R.K.
1976
100-101 5 p. 475-483
9 p.
artikel
617 Charge pumping effect and its application in the MOS transistors investigations 1977
100-101 5 p. 556-
1 p.
artikel
618 Charges and defects in SiO2 films deposited by plasma-enhanced chemical vapor deposition at low temperatures 1991
100-101 5 p. 1054-
1 p.
artikel
619 Charge transfer devices 1971
100-101 5 p. 311-
1 p.
artikel
620 CHAS seeks title of global CAD system 1981
100-101 5 p. 758-
1 p.
artikel
621 Chemical etching of silicon, germanium, gallium arsenide, and gallium phosphide 1978
100-101 5 p. 411-
1 p.
artikel
622 Chemically vapour-deposited borophosphosilicate glasses for silicon device applications 1983
100-101 5 p. 992-
1 p.
artikel
623 Chemical-system reliability: a review 1989
100-101 5 p. 885-
1 p.
artikel
624 Chemical vapor deposition for microelectronics G.W.A.D.,
1988
100-101 5 p. 821-
1 p.
artikel
625 Chip and package-related degradation of high power white LEDs Meneghini, Matteo
2012
100-101 5 p. 804-812
9 p.
artikel
626 Chip bonding: promises and perils 1970
100-101 5 p. 387-
1 p.
artikel
627 Chip carriers mounted on large thick film multilayer boards 1982
100-101 5 p. 1045-
1 p.
artikel
628 Chip handling equipment for hybrid microcircuits 1971
100-101 5 p. 308-
1 p.
artikel
629 Chip-joining—A review 1978
100-101 5 p. 408-
1 p.
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630 Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball–wedge bond wires Jinka, K.K.
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631 Chip set bestows virtual memory on 16-bit minis 1981
100-101 5 p. 758-
1 p.
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632 Chip set makes a powerful processor 1972
100-101 5 p. 418-
1 p.
artikel
633 Chips for graphics—making the pixels fly 1987
100-101 5 p. 941-
1 p.
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634 Chipstrate interconnection substrates for advanced electronic systems 1983
100-101 5 p. 1002-
1 p.
artikel
635 Chip yield modeling related to photolithographic defects Stamenković, Z.
1992
100-101 5 p. 663-668
6 p.
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636 Choosing a practical MTTF model for ECC memory chip 1984
100-101 5 p. 988-
1 p.
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637 Choosing a wafer-probing technique 1989
100-101 5 p. 895-
1 p.
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638 Choosing sides in digital watch technology 1976
100-101 5 p. 377-
1 p.
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639 4493059 Circuit and method for writing in a semiconductor memory device 1985
100-101 5 p. 1012-
1 p.
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640 4961053 Circuit arrangement for testing integrated circuit components Krug, Heinz
1991
100-101 5 p. 1059-
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641 Circuit designer can influence custom i.c. yields 1973
100-101 5 p. 411-
1 p.
artikel
642 Circuits intégrés logiques GaAs et leurs évaluations 1988
100-101 5 p. 834-
1 p.
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643 Circuit theory and design 1978
100-101 5 p. 417-
1 p.
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644 Circuit tolerancing—A new approach to hybrid manufacture 1970
100-101 5 p. 388-
1 p.
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645 Classification of fault trees and algorithms of fault tree analysis Chunning, Yan
1990
100-101 5 p. 891-895
5 p.
artikel
646 Classifying combined hardware/software R models 1984
100-101 5 p. 994-
1 p.
artikel
647 Closed formulas for the failure probability of a strict-consecutive-k-out-of-n:F system 1988
100-101 5 p. 832-
1 p.
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648 C-MOS a-d converter interfaces easily with many microprocessors 1981
100-101 5 p. 759-
1 p.
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649 C-MOS—A status report Bishop, A.
1974
100-101 5 p. 363-372
10 p.
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650 CMOS digital wristwatch features liquid crystal display 1972
100-101 5 p. 418-
1 p.
artikel
651 C-MOS holds down parts count for digital clocks 1973
100-101 5 p. 414-
1 p.
artikel
652 C-MOS inspires the best chips yet for computer, consumer, and communication applications 1982
100-101 5 p. 1043-
1 p.
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653 C-MOS picks up ground 1980
100-101 5 p. 759-
1 p.
artikel
654 COFT program—a tailored R&M approach 1989
100-101 5 p. 891-
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655 Collection of maintenance data: impact of PORTER on R&M 1989
100-101 5 p. 890-
1 p.
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656 Collector coupling minimizes interconnections in chip 1972
100-101 5 p. 415-
1 p.
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657 Color TV fires: a persistent problem 1977
100-101 5 p. 549-
1 p.
artikel
658 Colour decoder using integrated circuits 1972
100-101 5 p. 418-
1 p.
artikel
659 Comment on: reliability of modified designs—a Bayes analysis of an accelerated test of electronic assemblies 1991
100-101 5 p. 1047-
1 p.
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660 Comments on a paper by melia Harrett, T.
1977
100-101 5 p. 605-
1 p.
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661 Comments on “Experimental evidence against the shell model of bound multiexciton complexes in silicon” 1978
100-101 5 p. 490-
1 p.
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662 Comments on “Stochastic analysis of a two unit cold standby system with preparation time for repair” De, Guo Tong
1988
100-101 5 p. 687-
1 p.
artikel
663 Common cause failure consideration in a cold standby duplex system Singh, H.R.
1989
100-101 5 p. 723-728
6 p.
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664 Common errors in application of MIL-STD-781 1984
100-101 5 p. 995-
1 p.
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665 Common mode failure analysis of reliability networks 1977
100-101 5 p. 547-
1 p.
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666 Communications chip interfaces with most microprocessors 1978
100-101 5 p. 489-
1 p.
artikel
667 Comparison of availability results evaluated by numerical and analytical methods for the exponential case Basker, B.A.
1977
100-101 5 p. 567-569
3 p.
artikel
668 Comparison of DPA results on electronic components 1976
100-101 5 p. 373-
1 p.
artikel
669 Comparison of low-temperature electrical characteristics of gate-all-around nanowire FETs, Fin FETs and fully-depleted SOI FETs Tachi, Kiichi
2011
100-101 5 p. 885-888
4 p.
artikel
670 Comparison of some ratio-type estimators Sisodia, B.V.S.
1990
100-101 5 p. 873-876
4 p.
artikel
671 Comparison of thermo-mechanical behavior of lead-free copper and tin–lead column grid array packages Park, S.B.
2008
100-101 5 p. 763-772
10 p.
artikel
672 Comparison of wafer scale integration with VLSI packaging approaches 1988
100-101 5 p. 832-
1 p.
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673 Compensation-induced optical transitions within the ground state of shallow donors in Ge and Si 1984
100-101 5 p. 1001-
1 p.
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674 Complete ranking of reliability-related distributions 1978
100-101 5 p. 484-
1 p.
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675 Complete sample estimation techniques for reparameterized Weibull distributions 1970
100-101 5 p. 379-380
2 p.
artikel
676 4567433 Complex probe card for testing a semiconductor wafer Ohkubo, Masao
1986
100-101 5 p. 999-
1 p.
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677 Complex system reliability with general repair time distributions under head-of-line-repair-discipline Gupta, P.P.
1973
100-101 5 p. 445-449
5 p.
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678 Compliance test plans for availability 1980
100-101 5 p. 756-
1 p.
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679 Component defects and system reliability 1973
100-101 5 p. 407-
1 p.
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680 Component reliability exposed to thermal neutron environment—II Lal, Krishan
1977
100-101 5 p. 583-585
3 p.
artikel
681 Components of the integrated TTL circuit 1972
100-101 5 p. 418-
1 p.
artikel
682 Computational complexity of network reliability analysis: an overview 1987
100-101 5 p. 938-
1 p.
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683 Computationally efficient and stable order reduction methods for a large-scale model of MEMS piezoelectric energy harvester Kudryavtsev, M.
2015
100-101 5 p. 747-757
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684 Computation of transients in Lossy VLSI packaging interconnections 1991
100-101 5 p. 1049-
1 p.
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685 Computer-aided design of an eight bit binary counter N-MOS chip for large scale integration (LSI) Srivastava, Ashok
1984
100-101 5 p. 885-896
12 p.
artikel
686 Computer-aided drawing equipment for integrated-circuit manufacture 1972
100-101 5 p. 415-
1 p.
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687 Computer-aided evaluation of circuits and test structures 1972
100-101 5 p. 416-
1 p.
artikel
688 Computer aided life cycle engineering 1989
100-101 5 p. 890-
1 p.
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689 Computer aided quality management in electronics and production—a challenge for the entire enterprise 1984
100-101 5 p. 991-
1 p.
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690 Computer aided reliability assurance system for ICs 1971
100-101 5 p. 304-
1 p.
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691 Computer-aided reliability diagnostic system 1989
100-101 5 p. 891-
1 p.
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692 Computer algorithm to determine MOS process-parameters 1976
100-101 5 p. 378-
1 p.
artikel
693 Computer analysis on the collection of alpha-generated charge for reflecting and absorbing surface conditions around the collector 1984
100-101 5 p. 1000-
1 p.
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694 Computer-assisted development of hybrid integrated hyperfrequency circuits 1982
100-101 5 p. 1046-
1 p.
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695 Computer guided logic IC fault location 1988
100-101 5 p. 826-
1 p.
artikel
696 Computer networks and systems: queueing theory and performance evaluation Popentiu, Florin
1991
100-101 5 p. 1029-
1 p.
artikel
697 Computers help design reliable telephone systems 1973
100-101 5 p. 408-
1 p.
artikel
698 Computer simulation of the thermal environment of large-scale integrated circuits: computer time-saving techniques 1972
100-101 5 p. 414-
1 p.
artikel
699 Computers make a big difference in MOS designs 1970
100-101 5 p. 387-
1 p.
artikel
700 Concurrent design 1990
100-101 5 p. 1006-
1 p.
artikel
701 Conditional availability of intermittently-used systems in non-Markov environment 1987
100-101 5 p. 936-
1 p.
artikel
702 Conductance noise investigations on symmetrical planar resistors with finite contacts 1980
100-101 5 p. 763-
1 p.
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703 Conductance of small semiconductor devices 1982
100-101 5 p. 1044-
1 p.
artikel
704 Conduction mechanisms in MOS gate dielectric films Yang, B.L.
2004
100-101 5 p. 709-718
10 p.
artikel
705 Conduction mechanisms in screen-and-fired film resistors 1973
100-101 5 p. 417-
1 p.
artikel
706 Conductivity of complementary error function n-type diffused layers in gallium arsenide 1977
100-101 5 p. 556-
1 p.
artikel
707 Conductor film metallizations for use in tantalum film integrated circuits 1971
100-101 5 p. 312-
1 p.
artikel
708 Conference report Jacobs, Richard M
1980
100-101 5 p. 565-570
6 p.
artikel
709 Conference report Reliability and Maintainability Symposium (RAMS 1990) Jacobs, Richard M.
1990
100-101 5 p. 987-991
5 p.
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710 Confidence calculations for Mil-Std-781 1972
100-101 5 p. 410-
1 p.
artikel
711 Confidence estimates of reliability for complex systems 1982
100-101 5 p. 1041-
1 p.
artikel
712 Confidence regions for distribution bounds 1981
100-101 5 p. 753-
1 p.
artikel
713 Consonance sets for 2-parameter Weibull and exponential distributions 1980
100-101 5 p. 754-
1 p.
artikel
714 4812756 Contactless technique for semicondutor wafer testing Curtis, Huntington
1989
100-101 5 p. iii-
1 p.
artikel
715 Contact resistance in metal-semiconductor systems 1980
100-101 5 p. 762-
1 p.
artikel
716 Contaminant induced aging in integrated circuit packages 1978
100-101 5 p. 401-
1 p.
artikel
717 Contamination in solder baths 1977
100-101 5 p. 546-
1 p.
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718 Contour maps reveal non-uniformity in semiconductor processing 1977
100-101 5 p. 553-
1 p.
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719 Contracting for liability relief 1984
100-101 5 p. 987-
1 p.
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720 Contractor experience using RADC ORACLE 1984
100-101 5 p. 994-
1 p.
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721 Contractor initiatives for R&M/cost improvement 1978
100-101 5 p. 403-
1 p.
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722 Contractor risk associated with reliability improvement warranty 1978
100-101 5 p. 399-
1 p.
artikel
723 Contribution to range statistics of Boron implanted into Silicon at high energies 1981
100-101 5 p. 765-
1 p.
artikel
724 Control charts for Weibull processes with standards given 1980
100-101 5 p. 754-
1 p.
artikel
725 Control chip and driver program unlock magnetic-bubble potential 1981
100-101 5 p. 758-
1 p.
artikel
726 Controlled electromigration for field failure acceleration 1988
100-101 5 p. 828-
1 p.
artikel
727 Controlling semiconductor processes 1983
100-101 5 p. 998-
1 p.
artikel
728 Controlling switching supplies with LSI circuits 1977
100-101 5 p. 555-
1 p.
artikel
729 Control of the transistor base sheet resistance in constructing a monolithic analog integrated circuit with symmetric I–V characteristics Srivastava, A.
1981
100-101 5 p. 743-744
2 p.
artikel
730 Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability Stepniak, Frank
2001
100-101 5 p. 735-744
10 p.
artikel
731 Convexity results for some approximations of M[X]/G/1 and M[X]/D/1 queueing systems Moustafa, Magdi Sami
1994
100-101 5 p. 905-908
4 p.
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732 Coplamos keeps n-channels in line 1972
100-101 5 p. 417-
1 p.
artikel
733 Copperhead design to unit production cost 1977
100-101 5 p. 552-
1 p.
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734 Copper impurity levels in silicon 1983
100-101 5 p. 1001-
1 p.
artikel
735 Copper tape set to carry IC chips 1976
100-101 5 p. 377-378
2 p.
artikel
736 Copy Japanese, U.S. managers urged 1981
100-101 5 p. 755-
1 p.
artikel
737 CORDIS—an improved high-current ion source for gases 1984
100-101 5 p. 1004-
1 p.
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738 Correlation between electrical resistance and microstructure in gold wirebonds on aluminum films 1991
100-101 5 p. 1049-
1 p.
artikel
739 Correlation of thin film adhesion with current noise measurements of Ta2N-Cr-Au resistors on sapphire and alumina substrates 1978
100-101 5 p. 412-
1 p.
artikel
740 Corrosive effects of solder flux on printed-circuit boards 1972
100-101 5 p. 412-
1 p.
artikel
741 Cost analysis of a multi-component parallel redundant complex system with overloading effect and waiting under critical human error Gupta, P.P.
1991
100-101 5 p. 865-868
4 p.
artikel
742 Cost analysis of a two unit cold standby system with preparation time for repair Singh, H.R.
1989
100-101 5 p. 729-732
4 p.
artikel
743 Cost analysis of a two-unit electronic parallel redundant system with overloading effect Gupta, P.P.
1985
100-101 5 p. 847-851
5 p.
artikel
744 Cost analysis of a two-unit standby system with two types of repairmen Goyal, Vibha
1984
100-101 5 p. 849-855
7 p.
artikel
745 Cost analysis of a 2-unit standby redundant electronic system with critical human errors Gupta, P.P.
1986
100-101 5 p. 841-846
6 p.
artikel
746 Cost based reliability growth apportionment Govil, K.K.
1983
100-101 5 p. 789-792
4 p.
artikel
747 Cost-benefit analysis of a multi-component standby system with inspection and slow switch Gupta, Rakesh
1986
100-101 5 p. 879-882
4 p.
artikel
748 Cost-benefit analysis of a multi-unit parallel trichotomous system with random shocks Gupta, Rakesh
1996
100-101 5 p. 701-706
6 p.
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749 Cost-benefit analysis of a one-server two-nonidentical-unit cold standby system with repair and preventive maitenance Gopalan, M.N.
1985
100-101 5 p. 991-1000
10 p.
artikel
750 Cost-benefit analysis of a one-server two-unit cold standby system with repair and age replacement Gopalan, M.N.
1985
100-101 5 p. 977-990
14 p.
artikel
751 Cost-benefit analysis of a one-server two-unit imperfect switch system with delayed repair Gopalan, M.N.
1985
100-101 5 p. 865-867
3 p.
artikel
752 Cost-benefit analysis of a two-unit adaptive system subject to slow switch with random service Radhakrishnan, R.
1985
100-101 5 p. 869-875
7 p.
artikel
753 Cost-benefit analysis of a two unit cold standby system with random switchover and service time Singh, H.R.
1989
100-101 5 p. 711-716
6 p.
artikel
754 Cost-benefit analysis of a two-unit deteriorating standby system with detector Goel, L.R.
1986
100-101 5 p. 863-866
4 p.
artikel
755 Cost-benefit analysis of one-server two-unit imperfect switch system with degradation Gopalan, M.N.
1985
100-101 5 p. 949-958
10 p.
artikel
756 Cost-benefit analysis of one-server two-unit parallel system subject to random service Gopalan, M.N.
1985
100-101 5 p. 959-975
17 p.
artikel
757 Cost-benefit analysis of one-server two-unit replacement system with imperfect switch Gopalan, M.N.
1985
100-101 5 p. 877-879
3 p.
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758 Cost-density analysis of interconnections 1988
100-101 5 p. 827-
1 p.
artikel
759 Cost-effective reliability testing 1978
100-101 5 p. 403-
1 p.
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760 Cost function analysis of a standby redundant non-repairable system subjected to different types of failures Gupta, P.P.
1986
100-101 5 p. 835-839
5 p.
artikel
761 Cost limit replacement policy under minimal repair 1984
100-101 5 p. 992-
1 p.
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762 Cost reliability trade off in an electronic module Surendran, K.
1976
100-101 5 p. 493-496
4 p.
artikel
763 Cost savings by establishing life limits 1984
100-101 5 p. 996-
1 p.
artikel
764 Coupling capacitances in the planar conductive path system of the hybrid circuit with dielectric layer Wisz, Bogusław
2008
100-101 5 p. 724-733
10 p.
artikel
765 Courses 1974
100-101 5 p. 314-
1 p.
artikel
766 Courses 1972
100-101 5 p. 403-404
2 p.
artikel
767 Courses 1978
100-101 5 p. 389-391
3 p.
artikel
768 Courses in microelectronics and reliability 1971
100-101 5 p. 293-295
3 p.
artikel
769 Courses International Society for Hybrid Microelectronics 1978
100-101 5 p. 477-
1 p.
artikel
770 Cracking of solder connections on paper-base-phenolic printed wiring board 1990
100-101 5 p. 1007-1008
2 p.
artikel
771 Creating the integrated engineering design office 1983
100-101 5 p. 999-
1 p.
artikel
772 Credible and HPD intervals of the parameter and reliability of Rayleigh distribution 1984
100-101 5 p. 991-
1 p.
artikel
773 Creep behaviour of Sn–3.8Ag–0.7Cu under the effect of electromigration: Experiments and modelling Su, Fei
2011
100-101 5 p. 1020-1024
5 p.
artikel
774 Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder 1991
100-101 5 p. 1039-
1 p.
artikel
775 Creep of thin metallic films 1991
100-101 5 p. 1054-
1 p.
artikel
776 Critical component requirements for vapor phase soldering leadless components on circuit board assemblies for military electronics 1984
100-101 5 p. 1001-
1 p.
artikel
777 Cross-cell interference variability aware model of fully planar NAND Flash memory including line edge roughness Poliakov, Pavel
2011
100-101 5 p. 919-924
6 p.
artikel
778 Cumulative reference list of published books on microelectronics and reliability 1970
100-101 5 p. 359-372
14 p.
artikel
779 Cumulative sum control charts for the mean of an exponential distribution using extremes 1984
100-101 5 p. 989-
1 p.
artikel
780 Current density distribution across the pn junction of a partially contacted diode at high forward bias 1971
100-101 5 p. 310-311
2 p.
artikel
781 Current developments in product liability affecting international commerce 1982
100-101 5 p. 1039-
1 p.
artikel
782 Current emission from sandwich metal layers Al-Al2O3-Au 1976
100-101 5 p. 380-
1 p.
artikel
783 Current transport mechanisms of electrochemically deposited CdS/CdTe heterojunction 1984
100-101 5 p. 1000-
1 p.
artikel
784 Custom designed integrated circuits 1970
100-101 5 p. 388-
1 p.
artikel
785 Custom designed LSI for intrumentation 1980
100-101 5 p. 760-
1 p.
artikel
786 CVD Tungsten interconnect and contact barrier technology for VLSI 1983
100-101 5 p. 999-
1 p.
artikel
787 CW laser annealing of boron and arsenic-implanted silicon; electrical properties, crystalline structure and limitations 1980
100-101 5 p. 765-
1 p.
artikel
788 D—a converter has versatile on-chip up-down counter 1982
100-101 5 p. 1043-
1 p.
artikel
789 Damage effects in silicon and MNOS structures caused by beams of ionized and neutral argon atoms with energies below 5 keV 1984
100-101 5 p. 1004-
1 p.
artikel
790 Damage in silicon caused by magnetron ion etching and its recovery effect 1991
100-101 5 p. 1056-
1 p.
artikel
791 Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter Tan, Cher Ming
2014
100-101 5 p. 960-964
5 p.
artikel
792 Data bank for probabilistic risk-assessment of nuclear-fuel reprocessing plants 1989
100-101 5 p. 892-
1 p.
artikel
793 Data collection techniques 1972
100-101 5 p. 410-
1 p.
artikel
794 Data communications and the minicomputer 1973
100-101 5 p. 414-
1 p.
artikel
795 Data sources for microcomputer component selection 1989
100-101 5 p. 893-
1 p.
artikel
796 DC conduction mechanisms in thin polyimide films Nevin, Joseph H.
1981
100-101 5 p. 699-705
7 p.
artikel
797 DC leakage currents in trichloroethylene oxides 1983
100-101 5 p. 1001-
1 p.
artikel
798 3D CMOS devices in recrystallized silicon 1991
100-101 5 p. 1039-
1 p.
artikel
799 dc voltage effects on saw device interdigital electrodes 1978
100-101 5 p. 484-
1 p.
artikel
800 Debunking the learning curve 1983
100-101 5 p. 991-
1 p.
artikel
801 Decision tools for use by management Ryerson, C.M.
1978
100-101 5 p. 527-542
16 p.
artikel
802 Decomposition method for computing the reliability of complex networks 1982
100-101 5 p. 1040-
1 p.
artikel
803 Dedicated LSI chips aim at communications 1978
100-101 5 p. 489-
1 p.
artikel
804 Defect cluster analysis for wafer-scale integration 1991
100-101 5 p. 1046-
1 p.
artikel
805 Defect levels in chromium-doped silicon 1983
100-101 5 p. 1001-1002
2 p.
artikel
806 Defects in high-dose oxygen implanted silicon: a TEM study 1991
100-101 5 p. 1056-
1 p.
artikel
807 Deferred state sampling procedures 1971
100-101 5 p. 301-
1 p.
artikel
808 Defining the issues in wafer fab 1984
100-101 5 p. 999-
1 p.
artikel
809 Degradation and passivation of light emitting diodes 1971
100-101 5 p. 304-
1 p.
artikel
810 Degradation of silicone in white LEDs during device operation: a finite element approach to product reliability prediction Watzke, S.
2015
100-101 5 p. 733-737
5 p.
artikel
811 Delay times in fault tree analysis 1983
100-101 5 p. 994-
1 p.
artikel
812 Demonstrating reliability and reliability growth with environmental stress screening data 1991
100-101 5 p. 1044-
1 p.
artikel
813 Density of states modifications in amorphous and hydrogenated amorphous germanium and their effect on 3d core levels binding energy 1984
100-101 5 p. 1000-
1 p.
artikel
814 Density of states of superconductors with overlapping bands 1972
100-101 5 p. 420-
1 p.
artikel
815 Density variation in the strain-confined electron-hole liquid in Ge 1978
100-101 5 p. 492-493
2 p.
artikel
816 Dependability modeling of safety systems Laprie, J.C.
1982
100-101 5 p. 997-1026
30 p.
artikel
817 Dependency of thermal spreading resistance on convective heat transfer coefficient Vermeersch, B.
2008
100-101 5 p. 734-738
5 p.
artikel
818 Dependent components with increasing failure rates and failure rate averages 1978
100-101 5 p. 400-
1 p.
artikel
819 Depletion layer formation, space-charge injection and current-voltage characteristics for the silicon p-n-p (n-p-n) structure 1972
100-101 5 p. 419-
1 p.
artikel
820 Deposition and properties of RF reactively sputtered SiO2 layers 1983
100-101 5 p. 1000-
1 p.
artikel
821 Derivation of an exact expression for mean time to repair 1987
100-101 5 p. 937-
1 p.
artikel
822 Derivation of fault-detection tests using Boolean matrices 1978
100-101 5 p. 485-
1 p.
artikel
823 Design and evaluation of RC active filters for hybrid thick film implementation 1982
100-101 5 p. 1045-
1 p.
artikel
824 Design evaluation of distributed saturation characteristics in integrated devices 1971
100-101 5 p. 310-
1 p.
artikel
825 Design for reliability Dryden, M.H.
1976
100-101 5 p. 399-436
38 p.
artikel
826 Designing electronics for automated inspection 1989
100-101 5 p. 895-896
2 p.
artikel
827 Designing-in reliability—A new approach 1978
100-101 5 p. 405-
1 p.
artikel
828 Designing reliable communication networks in a planned failure environment 1983
100-101 5 p. 997-
1 p.
artikel
829 Designing the CF-18 to be operationally ready 1983
100-101 5 p. 994-
1 p.
artikel
830 Design of a comprehensive process evaluation vehicle for development of small geometry CMOS process Bandyopadhyay, A.
1984
100-101 5 p. 905-909
5 p.
artikel
831 Design of a pattern on a photomask-like physical standard for evaluation and calibration of linewidth-measuring systems 1978
100-101 5 p. 487-
1 p.
artikel
832 Design of a reliable multiple contact for the coin telephone totalizer 1970
100-101 5 p. 382-
1 p.
artikel
833 Design of fault-tolerant computing systems using real-time performance monitors Heaney, Albert A.
1989
100-101 5 p. 783-800
18 p.
artikel
834 Design parameters of four-terminal distributed thin film integrated band-reject filter Singh, H.R.
1983
100-101 5 p. 795-797
3 p.
artikel
835 Design-safety enhancement through the use of hazard and risk analysis 1989
100-101 5 p. 885-
1 p.
artikel
836 Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process Weng, Yi-Hsin
2011
100-101 5 p. 871-878
8 p.
artikel
837 Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafers 1990
100-101 5 p. 1013-
1 p.
artikel
838 4567428 Detection of catastrophic failure of dielectric improper connection, and temperature of a printed circuit assembly via one wire Zbinden, TerryB
1986
100-101 5 p. 999-
1 p.
artikel
839 Detection of conductive condensates resulting from adhesive outgassing in hybrid microcircuits 1978
100-101 5 p. 414-
1 p.
artikel
840 Detection of cracking during rotational soldering of a high reliability and voltage ceramic capacitor 1978
100-101 5 p. 401-
1 p.
artikel
841 Detection of junction spiking and its induced latch-up by emission microscopy 1989
100-101 5 p. 886-
1 p.
artikel
842 Detection of loose particles within electronic component cavities 1971
100-101 5 p. 303-
1 p.
artikel
843 Determination of local stress in PECVD nitride films Gspan, G.
1990
100-101 5 p. 911-913
3 p.
artikel
844 Determination of low energy barriers in metal-insulator-metal tunneling junctions 1972
100-101 5 p. 420-
1 p.
artikel
845 Determination of temperature of integrated-circuit chips in hybrid packaging 1976
100-101 5 p. 379-
1 p.
artikel
846 4726023 Determination of testability of combined logic end memory by ignoring memory Carter, JohnL
1988
100-101 5 p. 838-
1 p.
artikel
847 Determination of the doping structure of integrated bipolar transistorized circuits, evaluating electric data by means of a computer 1972
100-101 5 p. 419-
1 p.
artikel
848 Determination of the oxygen precipitate-free zone width in silicon wafers from surface photovoltage measurements 1983
100-101 5 p. 1001-
1 p.
artikel
849 Determination of the thickness and refractive index of films on silicon using split-beam ellipsometry 1970
100-101 5 p. 389-
1 p.
artikel
850 Determining DC/RF survivability limits of GaAs semiconductor circuits Gil, C.
2009
100-101 5 p. 484-487
4 p.
artikel
851 Determining maximum reliable load lines for power transistors 1970
100-101 5 p. 382-
1 p.
artikel
852 Determining operating and support costs with USAF D056 maintenance data collection system 1984
100-101 5 p. 993-
1 p.
artikel
853 Determining shelf life of epoxy molding compounds 1989
100-101 5 p. 894-
1 p.
artikel
854 Deterrence and strict liability for defective products in the United Kingdom 1980
100-101 5 p. 753-
1 p.
artikel
855 Detour ahead for IC equipment makers? 1981
100-101 5 p. 755-
1 p.
artikel
856 Developing criteria for determining corrective action thresholds during reliability verification testing (RVT) 1991
100-101 5 p. 1042-
1 p.
artikel
857 Development of adhesive die attach technology in cerdip packages; material issues 1984
100-101 5 p. 999-
1 p.
artikel
858 Development of a life cycle management cost model 1978
100-101 5 p. 403-
1 p.
artikel
859 Development of a methodology for evaluating computer integrated manufacturing (CIM) implementation performance 1991
100-101 5 p. 1051-
1 p.
artikel
860 Development of a model for distributed saturation characteristics in integrated devices 1971
100-101 5 p. 310-
1 p.
artikel
861 Development of a new low-stress hyperred LED encapsulant 1990
100-101 5 p. 1012-
1 p.
artikel
862 Development of a thermal resistance model for chip-on-board packaging of high power LED arrays Ha, Minseok
2012
100-101 5 p. 836-844
9 p.
artikel
863 Development of bubble memory chip test system 1976
100-101 5 p. 378-
1 p.
artikel
864 Development of copper wire bonding application technology 1991
100-101 5 p. 1049-
1 p.
artikel
865 Development of in-flight steady-state failure rates 1980
100-101 5 p. 757-
1 p.
artikel
866 Development of nondestructive pull test requirements for gold wires on multilayer thick-film hybrid microcircuits 1984
100-101 5 p. 1002-
1 p.
artikel
867 Development of the green plastic encapsulation for high density wirebonded leaded packages Lin, T.Y.
2003
100-101 5 p. 811-817
7 p.
artikel
868 Development of the tab-process at SAAB-SCANIA 1978
100-101 5 p. 409-
1 p.
artikel
869 Developments in printed circuits—II. Packaged circuits 1970
100-101 5 p. 386-
1 p.
artikel
870 Device and circuit level suppression techniques for random-dopant-induced static noise margin fluctuation in 16-nm-gate SRAM cell Lee, Kuo-Fu
2010
100-101 5 p. 647-651
5 p.
artikel
871 Device design of E/D gate MOSFET 1973
100-101 5 p. 411-
1 p.
artikel
872 4724965 Device for conveying components, particularly integrated chips, from an input magazine to an output magazine Willberg, Hans-Heinrich
1988
100-101 5 p. 837-
1 p.
artikel
873 4811344 Device for the testing and checking of the operation of blocks within an integrated circuit Chauvel, Gerard
1989
100-101 5 p. i-
1 p.
artikel
874 4727317 Device orientation test method suitable for automatic test equipment Oliver, MartinJ
1988
100-101 5 p. 838-
1 p.
artikel
875 Devices and circuits for bipolar (V) LSI 1982
100-101 5 p. 1043-
1 p.
artikel
876 Devices meeting probes the limits of semiconductors and circuitry 1983
100-101 5 p. 997-
1 p.
artikel
877 4963824 Diagnostics of a board containing a plurality of hybrid electronic components Hsieh, EdwardP
1991
100-101 5 p. 1060-
1 p.
artikel
878 Diamond layout style impact on SOI MOSFET in high temperature environment Gimenez, Salvador Pinillos
2015
100-101 5 p. 783-788
6 p.
artikel
879 Diaphragm connection—a new package for complex ICs 1971
100-101 5 p. 308-
1 p.
artikel
880 Die and wire bonding capabilities of thick-film conductors 1970
100-101 5 p. 394-
1 p.
artikel
881 Dielectric breakdown properties in silicon dioxide films 1976
100-101 5 p. 381-
1 p.
artikel
882 Dielectric isolation techniques for integrated circuits 1976
100-101 5 p. 378-
1 p.
artikel
883 Dielectric spectroscopy of silicon barrier devices 1989
100-101 5 p. 897-
1 p.
artikel
884 Die stress drift measurement in IC plastic packages using the piezo-Hall effect Manic, D
2001
100-101 5 p. 767-771
5 p.
artikel
885 Diffusion length and surface recombination velocity measurements with the scanning electron microscope: the highly-doped emitter of a p-n junction 1984
100-101 5 p. 1000-
1 p.
artikel
886 Diffusion theory of the steady-state flow of minority-carrier current through the Schottky barrier 1981
100-101 5 p. 762-
1 p.
artikel
887 Diffusivity and growth rate of silicon in solid-phase epitaxy with an aluminium medium 1983
100-101 5 p. 1001-
1 p.
artikel
888 Diffusivity of charged carriers in semiconductors in strong electric fields 1977
100-101 5 p. 556-
1 p.
artikel
889 Digital GaAs ICs hit gigahertz speed mark 1984
100-101 5 p. 999-
1 p.
artikel
890 Digital IC applications—Hybrid interconnection of digital circuits Naylor, R.
1974
100-101 5 p. 411-412
2 p.
artikel
891 Digital ICs offer new solutions for rough industrial problems 1972
100-101 5 p. 418-
1 p.
artikel
892 Digitally programmable CMOS transconductor for very high frequency Otı́n, Aránzazu
2004
100-101 5 p. 869-875
7 p.
artikel
893 Digital panel meter. Design, operation and construction of an instrument with a salid-state display and based on an MOS, LSI chip 1973
100-101 5 p. 412-
1 p.
artikel
894 Digital signal processing in the U.K. 1987
100-101 5 p. 941-
1 p.
artikel
895 Digital systems with algorithm implementation G.W.A.D.,
1983
100-101 5 p. 989-
1 p.
artikel
896 Digital testing costs can be cut 1972
100-101 5 p. 415-
1 p.
artikel
897 Digital testing oscilloscope cushions against mounting costs of troubleshooting 1978
100-101 5 p. 483-
1 p.
artikel
898 Discharge of MNOS structures 1973
100-101 5 p. 413-
1 p.
artikel
899 Discontinuities in homogeneous markov processes and their use in modelling technical systems under inspection Becker, G.
1994
100-101 5 p. 771-788
18 p.
artikel
900 Discounting utilization in order to optimise reliability choices on an economic level 1973
100-101 5 p. 406-
1 p.
artikel
901 Discrete wire bonding using laser energy 1989
100-101 5 p. 898-
1 p.
artikel
902 Distributional errors in reliability Livson, B.U.
1978
100-101 5 p. 449-
1 p.
artikel
903 Distribution of a random variable defined through a constitutive equation 1976
100-101 5 p. 376-
1 p.
artikel
904 Distribution of failures in an array of cells 1987
100-101 5 p. 936-
1 p.
artikel
905 Distribution of order statistics with varying number of components in reliability systems Singh, N.
1996
100-101 5 p. 581-587
7 p.
artikel
906 Distribution profiles of boron-implanted layers in silicon using a high resolution anodic oxidation cell 1976
100-101 5 p. 383-
1 p.
artikel
907 3−d MOS FETs shrink static RAM cells and analog circuit blocks 1981
100-101 5 p. 759-
1 p.
artikel
908 DoD/industry—R & M case study analysis 1984
100-101 5 p. 995-
1 p.
artikel
909 DoD/industry studies related to CALS R&M 1990
100-101 5 p. 1006-
1 p.
artikel
910 Do flame retardants affect the reliability of molded plastic packages 1982
100-101 5 p. 1039-
1 p.
artikel
911 Do not be confused by IC switching time specifications 1972
100-101 5 p. 416-
1 p.
artikel
912 Doped silicon oxide as diffusion source 1976
100-101 5 p. 379-
1 p.
artikel
913 Doping profile measurements on silicon epitaxial layers with field controlled planar diodes 1970
100-101 5 p. 392-
1 p.
artikel
914 Doping uniformity and reproducibility of ion implanted wafers 1976
100-101 5 p. 383-
1 p.
artikel
915 Dormancy effects on nonelectronics 1977
100-101 5 p. 546-
1 p.
artikel
916 Dose accuracy and doping uniformity of ion implantation equipment 1981
100-101 5 p. 765-766
2 p.
artikel
917 Double-diffused MOS transistor achieves microwave gain 1971
100-101 5 p. 309-
1 p.
artikel
918 Double implant low dose technique in analog IC fabrication 1990
100-101 5 p. 1017-
1 p.
artikel
919 ‘Double-R/half-M’, a reasonable design objective? 1988
100-101 5 p. 832-
1 p.
artikel
920 Drawing the lines for v.l.s.i. 1980
100-101 5 p. 760-
1 p.
artikel
921 Dry etching of III–V semiconductors: influence of substrate temperature on the anisotropy and induced damage 1991
100-101 5 p. 1055-
1 p.
artikel
922 Dry processing in microelectronics: towards low pressure plasma technology 1991
100-101 5 p. 1055-
1 p.
artikel
923 Dual-port RAM hikes throughput in input/output controller board 1978
100-101 5 p. 409-
1 p.
artikel
924 Duane growth model: estimation of final MTBF with confidence limits using a hand calculator 1977
100-101 5 p. 550-
1 p.
artikel
925 Duration of hidden faults in randomly checked systems 1978
100-101 5 p. 486-
1 p.
artikel
926 Dynamic decision elements for 3-unit systems 1978
100-101 5 p. 486-
1 p.
artikel
927 Dynamic inspection of large scale integrated circuits 1976
100-101 5 p. 374-
1 p.
artikel
928 Dynamic models for statistical inference from accelerated life tests 1991
100-101 5 p. 1042-
1 p.
artikel
929 Dynamic reconfiguration schemes for megabit BiCMOS SRAMs and performance evaluation Rayapati, Venlatapathi N.
1997
100-101 5 p. 785-794
10 p.
artikel
930 4812678 Easily testable semiconductor LSI device Abe, Seiichi
1989
100-101 5 p. ii-
1 p.
artikel
931 E-beam lithography: a story of dual identities 1984
100-101 5 p. 1005-
1 p.
artikel
932 EBS amplifiers debut 1971
100-101 5 p. 309-
1 p.
artikel
933 ECC tackles fiber optics, bonding, hybrid technology 1981
100-101 5 p. 755-
1 p.
artikel
934 ECL memories speeding to market 1978
100-101 5 p. 407-
1 p.
artikel
935 Economically based acceptance sampling plans 1990
100-101 5 p. 1009-
1 p.
artikel
936 Economic formulation of reliability objectives 1971
100-101 5 p. 301-302
2 p.
artikel
937 Economic inventory and replacement management of a system in which components are subject to failure Sivazlian, B.D.
1989
100-101 5 p. 861-881
21 p.
artikel
938 Economic models for statellite system effectiveness 1973
100-101 5 p. 408-
1 p.
artikel
939 Economics influence the design of consumer microcircuits 1973
100-101 5 p. 411-
1 p.
artikel
940 Economics of reliability for spacecraft computers 1972
100-101 5 p. 414-
1 p.
artikel
941 Economics of thick and thin film hybrid production in Europe 1978
100-101 5 p. 493-
1 p.
artikel
942 Edge passivation and related electrical stability in silicon power devices 1990
100-101 5 p. 1008-
1 p.
artikel
943 Editorial Ersland, Peter
2009
100-101 5 p. 467-
1 p.
artikel
944 Editorial 1999
100-101 5 p. 595-596
2 p.
artikel
945 Editorial 1999
100-101 5 p. 551-
1 p.
artikel
946 Effective masses in (100) silicon inversion layers 1977
100-101 5 p. 557-
1 p.
artikel
947 Effectiveness of reliability system testing on quality and reliability 1977
100-101 5 p. 552-
1 p.
artikel
948 Effective testing of digital integrated circuits 1972
100-101 5 p. 415-
1 p.
artikel
949 Effect of a trace of water vapor on Ohmic contact formation for AlGaN/GaN epitaxial wafers Lau, W.S.
2008
100-101 5 p. 794-797
4 p.
artikel
950 Effect of BIT on expendable weapon test results 1989
100-101 5 p. 889-
1 p.
artikel
951 Effect of bump size on current density and temperature distributions in flip-chip solder joints Kuan, Wei-Chih
2009
100-101 5 p. 544-550
7 p.
artikel
952 Effect of device reliability on memory reliability 1981
100-101 5 p. 754-
1 p.
artikel
953 Effect of electric field polarity on inter-poly dielectric during cell operation for the retention characteristics Moon, Pyung
2015
100-101 5 p. 795-798
4 p.
artikel
954 Effect of gate barrier and channel buffer layer on electric properties and transparence of the a-IGZO thin film transistor Lin, Cheng-I
2014
100-101 5 p. 905-910
6 p.
artikel
955 Effect of heat treatment on chemical and electronic structure of solid SiO; an electron spectroscopy study 1977
100-101 5 p. 556-
1 p.
artikel
956 Effect of metal line geometry on electromigration lifetime in Al-Cu submicron interconnects 1989
100-101 5 p. 887-
1 p.
artikel
957 Effect of microwave preheating on the bonding performance of flip chip on flex joint Islam, R.A.
2004
100-101 5 p. 815-821
7 p.
artikel
958 Effect of oxidation on orientation-dependent boron diffusion in silicon 1973
100-101 5 p. 415-
1 p.
artikel
959 Effect of oxide glass on the sintering behaviour and electrical properties in Ag thick films 1989
100-101 5 p. 897-
1 p.
artikel
960 Effect of reactor geometry on growth rate of epitaxial silicon 1970
100-101 5 p. 391-
1 p.
artikel
961 Effect of RuO2 on the behaviour of silver at thick-film terminations 1989
100-101 5 p. 897-
1 p.
artikel
962 Effect of standby redundancy on system reliability 1976
100-101 5 p. 376-
1 p.
artikel
963 Effect of temperature on the electrophysical properties of Si–polymer composite varistors Ghafouri, M.
2014
100-101 5 p. 965-971
7 p.
artikel
964 Effect of thermal instability on ultra-high frequency performance of insulated-gate field-effect transistors 1970
100-101 5 p. 389-390
2 p.
artikel
965 Effect of trench edge on pMOSFET reliability Lee, Yung-Huei
2001
100-101 5 p. 689-696
8 p.
artikel
966 Effects of accelerated temperature testing on the low-frequency noise of planar NPN transistors Stojadinović, N.D.
1983
100-101 5 p. 899-901
3 p.
artikel
967 Effects of annealing temperature on electromigration performance of multilayer metallisation systems 1989
100-101 5 p. 893-
1 p.
artikel
968 Effects of base doping and width on the J-V characteristics of the n+-n-p+ structure 1972
100-101 5 p. 421-
1 p.
artikel
969 Effects of contamination on aluminum films. Part 1: room temperature deposition 1989
100-101 5 p. 894-
1 p.
artikel
970 Effects of device passivation materials on solderable metallization of IGBTs Haque, Shatil
2001
100-101 5 p. 639-647
9 p.
artikel
971 Effects of “on-off” cycling on equipment reliability 1978
100-101 5 p. 405-
1 p.
artikel
972 Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor Wong, Oi Ying
2009
100-101 5 p. 506-509
4 p.
artikel
973 Effects of polymer/metal interaction in thin-film multichip module applications 1991
100-101 5 p. 1040-
1 p.
artikel
974 Effects of RF power on the structural, optical and electrical properties of Al-doped zinc oxide films Kuo, Shou-Yi
2010
100-101 5 p. 730-733
4 p.
artikel
975 Effects of soft segment mixtures with different molecular weight on the properties and reliability of UV curable adhesives for electrodes protection of plasma display panel (PDP) Hwang, Jin-Sang
2009
100-101 5 p. 517-522
6 p.
artikel
976 Effects of temperature on avionics reliability 1977
100-101 5 p. 552-
1 p.
artikel
977 Effects of the atmosphere on the resistance of ITO thin films 1988
100-101 5 p. 834-
1 p.
artikel
978 Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates An, Tong
2014
100-101 5 p. 932-938
7 p.
artikel
979 Effects of the sputtering deposition process of metal gate electrode on the gate dielectric characteristics Yamada, Takayuki
2001
100-101 5 p. 697-704
8 p.
artikel
980 Efficient algorithms for reliability analysis of planar networks—a survey 1987
100-101 5 p. 937-
1 p.
artikel
981 Efficient evaluation of system reliability by Monte Carlo method 1978
100-101 5 p. 486-
1 p.
artikel
982 Eigenvalue-eigenvector solutions for two general markov models in reliability Johnson, L.Ensign
1986
100-101 5 p. 917-933
17 p.
artikel
983 Eight-bit microprocessor aims at control applications 1976
100-101 5 p. 379-
1 p.
artikel
984 Elastoplastic analysis of surface-mount solder joints 1988
100-101 5 p. 827-
1 p.
artikel
985 Electrical and reliability characteristics of GaAs MOSHEMTs utilizing high-k IIIB and IVB oxide layers Chiu, Hsien-Chin
2010
100-101 5 p. 631-634
4 p.
artikel
986 Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors Dziedzic, Andrzej
2001
100-101 5 p. 669-676
8 p.
artikel
987 Electrical characteristics and reliability properties of metal–oxide–semiconductor capacitors with HfZrLaO gate dielectrics Liu, C.H.
2010
100-101 5 p. 599-602
4 p.
artikel
988 Electrical characteristics of nMOSFETs fabricated on hybrid orientation substrate with amorphization/templated recrystallization method Huang, Po Chin
2010
100-101 5 p. 662-665
4 p.
artikel
989 Electrical characteristics of polymer thick film resistors, Part I: experimental results 1982
100-101 5 p. 1045-
1 p.
artikel
990 Electrical characteristics of sputtering-induced defects in n-type silicon 1978
100-101 5 p. 490-
1 p.
artikel
991 Electrical conduction mechanisms of barium-titanate-based thick-film capacitors 1988
100-101 5 p. 827-828
2 p.
artikel
992 Electrical instability of sintered Ta films on (vacuum evaporated) polysilicon structures Eranna, G.
1994
100-101 5 p. 943-945
3 p.
artikel
993 Electrical junction delineation by scanning electron beam technique 1971
100-101 5 p. 313-
1 p.
artikel
994 Electrical modeling of interconnections in multilayer packaging structures 1988
100-101 5 p. 833-
1 p.
artikel
995 Electrical performances of devices made in SiO films obtained by lamp ZMR 1988
100-101 5 p. 832-
1 p.
artikel
996 Electrical properties of anodic aluminium oxide films 1980
100-101 5 p. 763-
1 p.
artikel
997 Electrical properties of Cd x Hg 1−x Te thin films for hall effect device applications 1977
100-101 5 p. 557-
1 p.
artikel
998 Electrical properties of thin Ta2O5 films obtained by thermal oxidation of Ta on Si Atanassova, E.
1998
100-101 5 p. 827-832
6 p.
artikel
999 Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide Lee, Chihoon
2003
100-101 5 p. 735-739
5 p.
artikel
1000 Electric equivalent models of glass thick films 1980
100-101 5 p. 764-
1 p.
artikel
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