| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A Bayesian approach to reliability: theory and simulation
|
|
|
1972
|
100-101 |
5 |
p. 409-
1 p.
|
artikel
|
| 2 |
A Bayesian methodology for assessing reliability during product development
|
|
|
1991
|
100-101 |
5 |
p. 1042-
1 p.
|
artikel
|
| 3 |
A Bayesian note on reliability growth during a development testing program
|
|
|
1978
|
100-101 |
5 |
p. 486-
1 p.
|
artikel
|
| 4 |
A Bayesian time-to-failure distribution
|
|
|
1971
|
100-101 |
5 |
p. 301-
1 p.
|
artikel
|
| 5 |
A Bayes procedure combining black box estimates and laboratory tests
|
|
|
1984
|
100-101 |
5 |
p. 994-
1 p.
|
artikel
|
| 6 |
A Bayes sensitivity analysis when using the beta distribution as a prior
|
|
|
1989
|
100-101 |
5 |
p. 892-
1 p.
|
artikel
|
| 7 |
A bibliography on charge-coupled devices
|
|
|
1976
|
100-101 |
5 |
p. 377-
1 p.
|
artikel
|
| 8 |
A bibliography on electron beam induced current analysis of semiconductor devices
|
|
|
1977
|
100-101 |
5 |
p. 553-
1 p.
|
artikel
|
| 9 |
A bipolar control storage memory-design-considerations and test problems
|
|
|
1973
|
100-101 |
5 |
p. 414-
1 p.
|
artikel
|
| 10 |
A 2400-bit/s microprocessor-based modem
|
|
|
1981
|
100-101 |
5 |
p. 758-759
2 p.
|
artikel
|
| 11 |
A boolean algebra method for reliability calculations
|
Gupta, P.P.
|
|
1983
|
100-101 |
5 |
p. 863-865
3 p.
|
artikel
|
| 12 |
Abstracts and book lists
|
Dummer, G.W.A.
|
|
1970
|
100-101 |
5 |
p. 357-
1 p.
|
artikel
|
| 13 |
A bulk queueing system with random failures and two phase repairs
|
Madan, K.C.
|
|
1992
|
100-101 |
5 |
p. 669-677
9 p.
|
artikel
|
| 14 |
A burn-in programme for wearout unaffected equipments
|
|
|
1976
|
100-101 |
5 |
p. 375-
1 p.
|
artikel
|
| 15 |
A case study in availability forecasting
|
Baxter, Laurence A.
|
|
1985
|
100-101 |
5 |
p. 927-942
16 p.
|
artikel
|
| 16 |
Accelerated dielectric breakdown and wear out standard testing methods and structures for reliability evaluation of thin oxides
|
Ghibaudo, G
|
|
1999
|
100-101 |
5 |
p. 597-613
17 p.
|
artikel
|
| 17 |
Accelerated vibration fatigue life testing of leads and soldered joints
|
|
|
1976
|
100-101 |
5 |
p. 372-
1 p.
|
artikel
|
| 18 |
Accurate natural convection modelling for magnetic components
|
Valchev, Vencislav
|
|
2003
|
100-101 |
5 |
p. 795-802
8 p.
|
artikel
|
| 19 |
Accurate two-port model of the metal-oxide semiconductor transistor
|
Kumar, Umesh
|
|
1978
|
100-101 |
5 |
p. 427-432
6 p.
|
artikel
|
| 20 |
Aceelerated testing of air-to-air guided minsiles
|
|
|
1973
|
100-101 |
5 |
p. 409-
1 p.
|
artikel
|
| 21 |
A ceramic capacitor substrate for high speed switching VLSI chips
|
|
|
1983
|
100-101 |
5 |
p. 1003-
1 p.
|
artikel
|
| 22 |
Achieving reliable consumer products through total program management of new models
|
|
|
1978
|
100-101 |
5 |
p. 406-
1 p.
|
artikel
|
| 23 |
A class of shrinkage estimators for the variance of a normal population
|
Singh, Housila P.
|
|
1997
|
100-101 |
5 |
p. 863-867
5 p.
|
artikel
|
| 24 |
A CMOS process for VLSI instrumentation
|
|
|
1983
|
100-101 |
5 |
p. 1000-
1 p.
|
artikel
|
| 25 |
A cold standby system with multiple switch-over devices attended by a monitor
|
Vanderperre, E.J.
|
|
1994
|
100-101 |
5 |
p. 921-923
3 p.
|
artikel
|
| 26 |
A comparison between noise measurements and conventional electromigration reliability testing
|
|
|
1989
|
100-101 |
5 |
p. 898-
1 p.
|
artikel
|
| 27 |
A comparison of algorithms for terminal-pair reliability
|
|
|
1989
|
100-101 |
5 |
p. 891-
1 p.
|
artikel
|
| 28 |
A comparison of copper and gold wire bonding on integrated circuit devices
|
|
|
1991
|
100-101 |
5 |
p. 1038-
1 p.
|
artikel
|
| 29 |
A comparison of four Monte Carlo methods for estimating the probability of s-t connectedness
|
|
|
1987
|
100-101 |
5 |
p. 935-936
2 p.
|
artikel
|
| 30 |
A comparison of SIMS with other techniques based on ion-beam solid interactions
|
|
|
1984
|
100-101 |
5 |
p. 1002-
1 p.
|
artikel
|
| 31 |
A compilation technique for exact system reliability
|
|
|
1982
|
100-101 |
5 |
p. 1040-
1 p.
|
artikel
|
| 32 |
A complete reliability program
|
|
|
1972
|
100-101 |
5 |
p. 410-
1 p.
|
artikel
|
| 33 |
A computer-aided design system for hybrid circuits
|
|
|
1981
|
100-101 |
5 |
p. 764-
1 p.
|
artikel
|
| 34 |
A computer-aided method for allocation of discrete tolerances in electric networks
|
Pillai, K.R.
|
|
1981
|
100-101 |
5 |
p. 711-715
5 p.
|
artikel
|
| 35 |
A computer algorithm for accurate and repeatable profile analysis using anodization and stripping of silicon
|
|
|
1977
|
100-101 |
5 |
p. 553-
1 p.
|
artikel
|
| 36 |
A consideration of reliability in economic distribution quantity for a warehouse
|
Ntuen, Celestine A.
|
|
1991
|
100-101 |
5 |
p. 913-917
5 p.
|
artikel
|
| 37 |
A consistent shape parameter estimator for the Weibull distribution
|
|
|
1973
|
100-101 |
5 |
p. 405-406
2 p.
|
artikel
|
| 38 |
A continuous time model of multiple intermittent faults in digital systems
|
|
|
1981
|
100-101 |
5 |
p. 752-
1 p.
|
artikel
|
| 39 |
A contractor view of warranty contracting
|
|
|
1976
|
100-101 |
5 |
p. 371-
1 p.
|
artikel
|
| 40 |
A 6800 coprocessor for error detection in microcomputers: the PAD
|
|
|
1987
|
100-101 |
5 |
p. 938-
1 p.
|
artikel
|
| 41 |
A cost effective approach to weapon acceptance
|
|
|
1977
|
100-101 |
5 |
p. 547-
1 p.
|
artikel
|
| 42 |
A cost model for skip-lot non-destructive sampling
|
|
|
1980
|
100-101 |
5 |
p. 754-
1 p.
|
artikel
|
| 43 |
Acoustic-emission-monitored tests for TAB inner lead bond quality
|
|
|
1983
|
100-101 |
5 |
p. 992-
1 p.
|
artikel
|
| 44 |
AC product defect level and yield loss
|
|
|
1991
|
100-101 |
5 |
p. 1039-
1 p.
|
artikel
|
| 45 |
A critique of MOS/LSI testing
|
|
|
1971
|
100-101 |
5 |
p. 307-
1 p.
|
artikel
|
| 46 |
A cubical logic circuit modelling for reliability studies
|
Dokouzgiannis, S.P.
|
|
1987
|
100-101 |
5 |
p. 823-831
9 p.
|
artikel
|
| 47 |
A cut set method for reliability evaluation of systems having s-dependent components
|
|
|
1981
|
100-101 |
5 |
p. 753-
1 p.
|
artikel
|
| 48 |
A/D converter based on a new memory cell implemented using the switched current technique
|
Śniatała, Paweł
|
|
2004
|
100-101 |
5 |
p. 861-867
7 p.
|
artikel
|
| 49 |
A decomposition scheme for the analysis of fault trees and other combinatorial circuits
|
|
|
1990
|
100-101 |
5 |
p. 1011-
1 p.
|
artikel
|
| 50 |
A delay-differential equation related to a renewable parallel system
|
Vanderperre, E.J.
|
|
1997
|
100-101 |
5 |
p. 739-741
3 p.
|
artikel
|
| 51 |
A design procedure for discard VS repair decisions
|
|
|
1971
|
100-101 |
5 |
p. 306-
1 p.
|
artikel
|
| 52 |
A device analysis system based on laser scanning techniques
|
Nagase, Masashi
|
|
1980
|
100-101 |
5 |
p. 717-735
19 p.
|
artikel
|
| 53 |
Adhesion measurement of thin films
|
|
|
1976
|
100-101 |
5 |
p. 381-382
2 p.
|
artikel
|
| 54 |
Adhesion work analysis through molecular modeling and wetting angle measurement
|
Król, Dawid Jan
|
|
2015
|
100-101 |
5 |
p. 758-764
7 p.
|
artikel
|
| 55 |
Adhesive techniques in microelectronics
|
|
|
1984
|
100-101 |
5 |
p. 1002-
1 p.
|
artikel
|
| 56 |
A different approach to the analysis of data in life-tests of laser diodes
|
Bonfiglio, A.
|
|
1998
|
100-101 |
5 |
p. 767-771
5 p.
|
artikel
|
| 57 |
A diffusion method for reliability prediction
|
|
|
1970
|
100-101 |
5 |
p. 379-
1 p.
|
artikel
|
| 58 |
A direct algorithm for computing reliability of a consecutive-k cycle
|
|
|
1989
|
100-101 |
5 |
p. 891-892
2 p.
|
artikel
|
| 59 |
A direct method to calculate the frequency and duration of failures for large networks
|
|
|
1978
|
100-101 |
5 |
p. 486-
1 p.
|
artikel
|
| 60 |
A discussion of yield modeling with defect clustering, circuit repair and circuit redundancy
|
|
|
1991
|
100-101 |
5 |
p. 1037-
1 p.
|
artikel
|
| 61 |
Admissibility of a test procedure based on preliminary test of significance for life data
|
Singh, S.K.
|
|
1989
|
100-101 |
5 |
p. 721-722
2 p.
|
artikel
|
| 62 |
Admissible, minimax and equivariant estimators of life distributions from Type II censored samples
|
|
|
1981
|
100-101 |
5 |
p. 753-754
2 p.
|
artikel
|
| 63 |
Advanced copper/polyimide hybrid technology
|
|
|
1988
|
100-101 |
5 |
p. 835-
1 p.
|
artikel
|
| 64 |
Advanced lithographies: finding a niche
|
|
|
1987
|
100-101 |
5 |
p. 942-
1 p.
|
artikel
|
| 65 |
Advanced manufacturing techniques of discrete packs
|
|
|
1978
|
100-101 |
5 |
p. 408-
1 p.
|
artikel
|
| 66 |
Advances in BiMOS integrated circuits
|
|
|
1978
|
100-101 |
5 |
p. 408-
1 p.
|
artikel
|
| 67 |
Advances in film extend component capabilities
|
|
|
1977
|
100-101 |
5 |
p. 557-
1 p.
|
artikel
|
| 68 |
Advances in reduced pressure silicon epitaxy
|
|
|
1980
|
100-101 |
5 |
p. 762-
1 p.
|
artikel
|
| 69 |
Advances in resistor fabrication yield monolithic 10-bit DACs
|
|
|
1973
|
100-101 |
5 |
p. 417-
1 p.
|
artikel
|
| 70 |
Advantages of a floating annular ring in three-layer tab assembly
|
|
|
1988
|
100-101 |
5 |
p. 832-833
2 p.
|
artikel
|
| 71 |
A dynamic bias system for burn-in or thermal endurance treatments of 8085A microprocessors
|
|
|
1983
|
100-101 |
5 |
p. 993-
1 p.
|
artikel
|
| 72 |
A dynamic synchronization method to realize soft defect localization applied on digital and mixed-mode analog ICs in failure analysis
|
Wu, Chunlei
|
|
2014
|
100-101 |
5 |
p. 993-999
7 p.
|
artikel
|
| 73 |
AECL's reliability and maintainability program
|
|
|
1977
|
100-101 |
5 |
p. 548-
1 p.
|
artikel
|
| 74 |
Aegis An/Spy radar system—design for availability
|
|
|
1973
|
100-101 |
5 |
p. 410-
1 p.
|
artikel
|
| 75 |
Aegis operational readiness test system—design for system effectiveness
|
|
|
1973
|
100-101 |
5 |
p. 410-
1 p.
|
artikel
|
| 76 |
A facelifting for NASA's reliability requirements
|
|
|
1971
|
100-101 |
5 |
p. 302-
1 p.
|
artikel
|
| 77 |
A fast algorithm for the performance index of a telecommunication network
|
|
|
1989
|
100-101 |
5 |
p. 891-
1 p.
|
artikel
|
| 78 |
A fast algorithm to formulate Markov system equations
|
Luis Roca, J.
|
|
1984
|
100-101 |
5 |
p. 897-898
2 p.
|
artikel
|
| 79 |
A faster generation of MOS devices with low thresholds is riding the crest of the new wave, silicon-gate ICs
|
|
|
1970
|
100-101 |
5 |
p. 390-
1 p.
|
artikel
|
| 80 |
A fast, flexible, and easy-to-develop FPGA-based fault injection technique
|
Ebrahimi, Mojtaba
|
|
2014
|
100-101 |
5 |
p. 1000-1008
9 p.
|
artikel
|
| 81 |
A fast logic gate for large scale integration
|
|
|
1973
|
100-101 |
5 |
p. 414-
1 p.
|
artikel
|
| 82 |
A fast response non-contact type potentiometer using an improved CdSe film
|
|
|
1978
|
100-101 |
5 |
p. 412-
1 p.
|
artikel
|
| 83 |
A field study of the electrical performance of separable connectors
|
|
|
1978
|
100-101 |
5 |
p. 400-401
2 p.
|
artikel
|
| 84 |
A fringing-capacitance model for deep-submicron MOSFET with high-k gate dielectric
|
Ji, F.
|
|
2008
|
100-101 |
5 |
p. 693-697
5 p.
|
artikel
|
| 85 |
AFSATCOM terminal segment reliability test program
|
|
|
1977
|
100-101 |
5 |
p. 549-
1 p.
|
artikel
|
| 86 |
After CFCs? options for cleaning electronics assemblies
|
G.W.A.D.,
|
|
1992
|
100-101 |
5 |
p. 737-738
2 p.
|
artikel
|
| 87 |
A gaseous detector device for an environmental SEM
|
|
|
1984
|
100-101 |
5 |
p. 1000-
1 p.
|
artikel
|
| 88 |
A general age replacement model with minimal repair and general random repair cost
|
Sheu, Shey-Huei
|
|
1991
|
100-101 |
5 |
p. 1009-1017
9 p.
|
artikel
|
| 89 |
A generalized block-replacement policy
|
|
|
1982
|
100-101 |
5 |
p. 1041-
1 p.
|
artikel
|
| 90 |
A generalized fault simulator for combinational logic circuits
|
|
|
1990
|
100-101 |
5 |
p. 1010-
1 p.
|
artikel
|
| 91 |
A generalized multi-standby multi-failure mode system with various repair facilities
|
Chryssaphinou, O.
|
|
1997
|
100-101 |
5 |
p. 721-724
4 p.
|
artikel
|
| 92 |
A general method for turning a coherent system's structure function to SLE
|
Lu, Pei-En
|
|
1985
|
100-101 |
5 |
p. 833-835
3 p.
|
artikel
|
| 93 |
A general replacement of a system subject to shocks
|
Sheu, Shey-Huei
|
|
1992
|
100-101 |
5 |
p. 657-662
6 p.
|
artikel
|
| 94 |
A general software reliability model for performance prediction
|
Shanthikumar, J.G.
|
|
1981
|
100-101 |
5 |
p. 671-682
12 p.
|
artikel
|
| 95 |
A geometric programming approach for optimum tolerance assignment in circuits
|
Pillai, K.R.
|
|
1981
|
100-101 |
5 |
p. 731-735
5 p.
|
artikel
|
| 96 |
A glow discharge ion gun for etching
|
|
|
1973
|
100-101 |
5 |
p. 418-
1 p.
|
artikel
|
| 97 |
A Heuristic approach to the generation of tests for faults on the intermediate lines
|
|
|
1983
|
100-101 |
5 |
p. 995-
1 p.
|
artikel
|
| 98 |
A high energy ion scattering/channeling and low energy ion scattering apparatus for surface analysis
|
|
|
1991
|
100-101 |
5 |
p. 1056-
1 p.
|
artikel
|
| 99 |
A high performance thick film capacitor system
|
|
|
1978
|
100-101 |
5 |
p. 413-
1 p.
|
artikel
|
| 100 |
A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
|
Marks, M.R.
|
|
1995
|
100-101 |
5 |
p. 807-815
9 p.
|
artikel
|
| 101 |
A high speed ECL multiplexer in beam lead, hybrid technology
|
|
|
1978
|
100-101 |
5 |
p. 487-488
2 p.
|
artikel
|
| 102 |
A high stability RC circuit using high nitrogen doped tantalum
|
|
|
1978
|
100-101 |
5 |
p. 414-
1 p.
|
artikel
|
| 103 |
A history of value engineering
|
|
|
1970
|
100-101 |
5 |
p. 380-
1 p.
|
artikel
|
| 104 |
A hybrid fuzzy neural network-expert system for a short term unit commitment problem
|
Padhy, Narayana Prasad
|
|
1997
|
100-101 |
5 |
p. 733-737
5 p.
|
artikel
|
| 105 |
A hybrid repeater using integrated circuits
|
|
|
1971
|
100-101 |
5 |
p. 309-
1 p.
|
artikel
|
| 106 |
A hydrogen sensor based on a metamorphic high electron mobility transistor (MHEMT)
|
Tsai, Tsung-Han
|
|
2010
|
100-101 |
5 |
p. 734-737
4 p.
|
artikel
|
| 107 |
Air force systems command approach to R&M
|
|
|
1988
|
100-101 |
5 |
p. 830-
1 p.
|
artikel
|
| 108 |
A Kolmogorov-Smirnov goodness-of-fit test for the two-parameter Weibull distribution when the parameters are estimated from the data
|
|
|
1983
|
100-101 |
5 |
p. 996-
1 p.
|
artikel
|
| 109 |
A k-out-of-n three-state devices system with common-cause failures
|
Dhillon, Balbir S.
|
|
1978
|
100-101 |
5 |
p. 447-448
2 p.
|
artikel
|
| 110 |
Alcohol modified RTV silicone encapsulation for integrated circuit device packaging
|
|
|
1984
|
100-101 |
5 |
p. 998-
1 p.
|
artikel
|
| 111 |
Algebraical algorithm for computing complex systems reliability
|
Luis Roca, J.
|
|
1984
|
100-101 |
5 |
p. 901-903
3 p.
|
artikel
|
| 112 |
Algorithm transformation methods to reduce the overhead of software-based fault tolerance techniques
|
Azambuja, José Rodrigo
|
|
2014
|
100-101 |
5 |
p. 1050-1055
6 p.
|
artikel
|
| 113 |
A linear-time algorithm to compute the reliability of planar cube-free networks
|
|
|
1991
|
100-101 |
5 |
p. 1046-
1 p.
|
artikel
|
| 114 |
A literature survey of the human reliability component in a man-machine system
|
|
|
1989
|
100-101 |
5 |
p. 885-
1 p.
|
artikel
|
| 115 |
Alloy element additions to gold thick film conductors: Effects on indium/lead soldering and ultrasonic aluminum wire bonding
|
|
|
1978
|
100-101 |
5 |
p. 493-
1 p.
|
artikel
|
| 116 |
Alloy scattering and high field transport in ternary and quaternary III–V semiconductors
|
|
|
1978
|
100-101 |
5 |
p. 491-
1 p.
|
artikel
|
| 117 |
A low cost thick-film active filter for consumer application
|
|
|
1978
|
100-101 |
5 |
p. 414-
1 p.
|
artikel
|
| 118 |
A low-leakage-current CdSe thin film transistor
|
|
|
1981
|
100-101 |
5 |
p. 764-
1 p.
|
artikel
|
| 119 |
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A new bond failure wire crater in surface mount device
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A new class of bathtub-shaped hazard rates and its application in a comparison of two test-statistics
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A new concept in calculation of thick film resistors
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A new EPR center due to dislocations in phosphorous doped silicon
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A new failure mode of very thin (< 50 Å) thermal SiO2 films
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A new gold-tin alloy composition for hermetic package sealing and attachment of hybrid parts
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A new high power semiconductor laser array of phase-locking free structure
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A new high temperature multilayer capacitor with acrylate dielectrics
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A new laser hermetic sealing technique for aluminum package
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A new low temperature polysilicon CVD process
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A new method for system reliability evaluation
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6 p.
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A new method for the determination of channel depth and doping profile in buried-channel MOS transistors
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A new method to determine the failure frequency of a complex system
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7 p.
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A new model for a lifetime distribution with bathtub shaped failure rate
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A new Monte Carlo method for evaluating system-failure probability
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A new multi-layer ion implantation model for process simulation
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A new power cycling technique for accelerated reliability evaluation of plated through holes and interconnects in PCBs
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A new production technique: ion milling. Part II—Applications
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A new soft-error phenomenon in VLSIs The alpha-particle-induced source/drain penetration (ALPEN) effect
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A new technique for active minimal cut set selection used in substation reliability evaluation
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A new technique for depot and sub-depot spares
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A new technique for testing TAB bonded LSIs in the Gigahertz frequency range
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A new technique for the determination of the charge centroid in MNOS structures
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A new technique to optimize system reliability
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A new type of charge trapping in MOS systems
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A new VLSI diagnosis technique: focused ion beam assisted multi-level circuit probing
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An example of fault site localization on a 0.18 μm CMOS device with combination of front and backside techniques
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8 p.
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An experimental application of microprocessors to railway signalling
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An experimental comparison of the heuristic methods for solving reliability optimization problems
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An experimental investigation of the dielectric properties of thermally evaporated rare earth oxides for use in thin-film capacitors
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An extension of the block preventive maintenance policy for stochastically failing items
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An improved algorithm for cutset evaluation from paths
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An improved method for symbolic reliability analysis
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An improved method of enumerating all trees and minimal paths in a graph using Petri nets
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An improved method of estimating Bayes posterior probability density function in reliability data analysis
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An improved silicon p-channel MESFET with a BF2 implanted thin channel and ErSi2 gate
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An improvement on noise criterion used as a reliability screening parameter for BJTS and experimental results
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An improvement on structure of charge coupled devices
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An integrated analytic approach for reliability improvement
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An integrated channel selector for VHF/UHF
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An integrated LSI design aids system
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An investigation of carrier transport in thin silicon-on-sapphire films using MIS deep depletion Hall effect structures
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An investigation of drain pulse induced hot carrier degradation in n-type low temperature polycrystalline silicon thin film transistors
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An investigation of integrated circuit destruction by noise pulses
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An investigation of microplasma noise in zener diodes with the SEM
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An investigation of reliability of solder joints in microelectronic packages by high temperature moiré method
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An investigation of soldered copper-tin bond brittleness by electron microscopy
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An ion implanted bipolar silicon integrated circuit process
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Anisotropic boron diffusion in silicon under oxidizing atmospheres
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Anisotropic etching in chlorine-containing plasmas
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An iterative Bayes procedure for reliability assessment
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An M/G/1-type queueing system with non-perfect servers and no waiting capacity
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Anomalous thermoelastic effect in silicon
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An optimal annealing technique for OHMIC contacts to ion-implanted n-layers in semi-insulating indium phosphide
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A notation for designing restoring logic circuitry in CMOS
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A note on a four-state system
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A note on distributed lumped active all-pass network configuration
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A note on sequential point estimation of the mean of a gamma population
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A novel fault tolerant token ring network
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A novel hetero-junction Tunnel-FET using Semiconducting silicide–Silicon contact and its scalability
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A novel thermal expansion matched heatspreader for plastic encapsulation of silicon chips
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An X-ray fluorescence technique for the rapid determination of phosphorous in PSG film
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A 1-out-of-N: G system with common-cause failures and critical human errors
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A perspective on CMOS technology trends
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A petri net approach for the enumeration of all K-trees and K-cutsets and its application on K-terminal network reliability evaluation
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4336438 Apparatus for automatic semi-batch sheet treatment of semiconductor wafers by plasma reaction
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4851097 Apparatus for repairing a pattern film
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Application of copper conductor and ruthenium containing oxides-glass resistor to high-frequency hybrid ICs for a protable cellular radio
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A proposal for a standard procedure for moderately accelerated electromigration tests on metal lines
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A relational database for semiconductor device parametric data
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A reliability cost-benefit analysis study
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A reliability incentive based bid decision
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A reliability model for error correcting memory systems
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A reliability physics model for parallel system
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Army operational test and evaluation of TMDE+
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ASIC photolithography: characterization challenges
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A SIMNET simulation model for estimating system reliability
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Assessment of long term reliability of photovoltaic glass–glass modules vs. glass-back sheet modules subjected to temperature cycles by FE-analysis
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Bayesian decomposition method for computing the reliability of an oriented network
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Bayesian prediction for the range based on a two-parameter exponential distribution with a random sample size
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Bayesian 1-sample prediction for the 2-parameter Weibull distribution
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Bayesian shrinkage estimation of reliability in parallel system with exponential failure of the components
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Bayes weighted availability for a digital radio transmission system
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Beam-induced broadening effects in sputter depth profiling
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Behavioural analysis of shell gasification and carbon recovery process in a urea fertilizer plant
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Behaviour analysis of a urea decomposition system in the fertilizer industry under general repair policy
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Benefits of real-time, in situ particle monitoring in production medium current implantation
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Better graphs for dependability modeling
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Bias humidity performance and failure mechanisms of nonhermetic aluminium SIC's in an environment contaminated with SO2
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Biomedical applications of microprocessors
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Biphase data transmission system uses IC one-shot as converter doubler
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Bipolar bit slices advance fast
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Bipolar trends
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BIST architecture for oscillation test of analog ICs and investigation of test hardware influence
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BIT detectability/reliability in expendable weapons
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1024-Bit, N-Channel, MOS high-speed read/write memory
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4096-Bit RAMs are on the doorstep
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16-bit wave gathering speed
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Blend ECL and TTL ICs to obtain high frequency counter circuits. Counters up to 500 MHz can be built for systems or beach use
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Board level reliability of PBGA using flex substrate
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Boron implantation influence on the backgating effect in GaAs MESFETs
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Breakdown in ceramic capacitors under pulsed high voltage stress
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Breakdown properties of thin oxides in irradiated MOS capacitors
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BS 9000 components and reliability quality factors: Suggested use of MIL-HDBK-217C factors based on a comparative product assurance analysis
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Bubble memory family extends to megabit size
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Bulk built in current sensors for single event transient detection in deep-submicron technologies
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CAD station aims at VLSI design
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Calculate coherent system's reliability by using SLE
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Calculation of avalanche breakdown voltage and depletion layer thickness in a p-n junction with a double error function doping profile
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Capacitance voltage measurements on N-type InAs MOS diodes
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Case study: reliability of the INEL-site power system
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Consonance sets for 2-parameter Weibull and exponential distributions
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|
|
1980
|
100-101 |
5 |
p. 754-
1 p.
|
artikel
|
| 714 |
4812756 Contactless technique for semicondutor wafer testing
|
Curtis, Huntington
|
|
1989
|
100-101 |
5 |
p. iii-
1 p.
|
artikel
|
| 715 |
Contact resistance in metal-semiconductor systems
|
|
|
1980
|
100-101 |
5 |
p. 762-
1 p.
|
artikel
|
| 716 |
Contaminant induced aging in integrated circuit packages
|
|
|
1978
|
100-101 |
5 |
p. 401-
1 p.
|
artikel
|
| 717 |
Contamination in solder baths
|
|
|
1977
|
100-101 |
5 |
p. 546-
1 p.
|
artikel
|
| 718 |
Contour maps reveal non-uniformity in semiconductor processing
|
|
|
1977
|
100-101 |
5 |
p. 553-
1 p.
|
artikel
|
| 719 |
Contracting for liability relief
|
|
|
1984
|
100-101 |
5 |
p. 987-
1 p.
|
artikel
|
| 720 |
Contractor experience using RADC ORACLE
|
|
|
1984
|
100-101 |
5 |
p. 994-
1 p.
|
artikel
|
| 721 |
Contractor initiatives for R&M/cost improvement
|
|
|
1978
|
100-101 |
5 |
p. 403-
1 p.
|
artikel
|
| 722 |
Contractor risk associated with reliability improvement warranty
|
|
|
1978
|
100-101 |
5 |
p. 399-
1 p.
|
artikel
|
| 723 |
Contribution to range statistics of Boron implanted into Silicon at high energies
|
|
|
1981
|
100-101 |
5 |
p. 765-
1 p.
|
artikel
|
| 724 |
Control charts for Weibull processes with standards given
|
|
|
1980
|
100-101 |
5 |
p. 754-
1 p.
|
artikel
|
| 725 |
Control chip and driver program unlock magnetic-bubble potential
|
|
|
1981
|
100-101 |
5 |
p. 758-
1 p.
|
artikel
|
| 726 |
Controlled electromigration for field failure acceleration
|
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|
1988
|
100-101 |
5 |
p. 828-
1 p.
|
artikel
|
| 727 |
Controlling semiconductor processes
|
|
|
1983
|
100-101 |
5 |
p. 998-
1 p.
|
artikel
|
| 728 |
Controlling switching supplies with LSI circuits
|
|
|
1977
|
100-101 |
5 |
p. 555-
1 p.
|
artikel
|
| 729 |
Control of the transistor base sheet resistance in constructing a monolithic analog integrated circuit with symmetric I–V characteristics
|
Srivastava, A.
|
|
1981
|
100-101 |
5 |
p. 743-744
2 p.
|
artikel
|
| 730 |
Conversion of the under bump metallurgy into intermetallics: the impact on flip chip reliability
|
Stepniak, Frank
|
|
2001
|
100-101 |
5 |
p. 735-744
10 p.
|
artikel
|
| 731 |
Convexity results for some approximations of M[X]/G/1 and M[X]/D/1 queueing systems
|
Moustafa, Magdi Sami
|
|
1994
|
100-101 |
5 |
p. 905-908
4 p.
|
artikel
|
| 732 |
Coplamos keeps n-channels in line
|
|
|
1972
|
100-101 |
5 |
p. 417-
1 p.
|
artikel
|
| 733 |
Copperhead design to unit production cost
|
|
|
1977
|
100-101 |
5 |
p. 552-
1 p.
|
artikel
|
| 734 |
Copper impurity levels in silicon
|
|
|
1983
|
100-101 |
5 |
p. 1001-
1 p.
|
artikel
|
| 735 |
Copper tape set to carry IC chips
|
|
|
1976
|
100-101 |
5 |
p. 377-378
2 p.
|
artikel
|
| 736 |
Copy Japanese, U.S. managers urged
|
|
|
1981
|
100-101 |
5 |
p. 755-
1 p.
|
artikel
|
| 737 |
CORDIS—an improved high-current ion source for gases
|
|
|
1984
|
100-101 |
5 |
p. 1004-
1 p.
|
artikel
|
| 738 |
Correlation between electrical resistance and microstructure in gold wirebonds on aluminum films
|
|
|
1991
|
100-101 |
5 |
p. 1049-
1 p.
|
artikel
|
| 739 |
Correlation of thin film adhesion with current noise measurements of Ta2N-Cr-Au resistors on sapphire and alumina substrates
|
|
|
1978
|
100-101 |
5 |
p. 412-
1 p.
|
artikel
|
| 740 |
Corrosive effects of solder flux on printed-circuit boards
|
|
|
1972
|
100-101 |
5 |
p. 412-
1 p.
|
artikel
|
| 741 |
Cost analysis of a multi-component parallel redundant complex system with overloading effect and waiting under critical human error
|
Gupta, P.P.
|
|
1991
|
100-101 |
5 |
p. 865-868
4 p.
|
artikel
|
| 742 |
Cost analysis of a two unit cold standby system with preparation time for repair
|
Singh, H.R.
|
|
1989
|
100-101 |
5 |
p. 729-732
4 p.
|
artikel
|
| 743 |
Cost analysis of a two-unit electronic parallel redundant system with overloading effect
|
Gupta, P.P.
|
|
1985
|
100-101 |
5 |
p. 847-851
5 p.
|
artikel
|
| 744 |
Cost analysis of a two-unit standby system with two types of repairmen
|
Goyal, Vibha
|
|
1984
|
100-101 |
5 |
p. 849-855
7 p.
|
artikel
|
| 745 |
Cost analysis of a 2-unit standby redundant electronic system with critical human errors
|
Gupta, P.P.
|
|
1986
|
100-101 |
5 |
p. 841-846
6 p.
|
artikel
|
| 746 |
Cost based reliability growth apportionment
|
Govil, K.K.
|
|
1983
|
100-101 |
5 |
p. 789-792
4 p.
|
artikel
|
| 747 |
Cost-benefit analysis of a multi-component standby system with inspection and slow switch
|
Gupta, Rakesh
|
|
1986
|
100-101 |
5 |
p. 879-882
4 p.
|
artikel
|
| 748 |
Cost-benefit analysis of a multi-unit parallel trichotomous system with random shocks
|
Gupta, Rakesh
|
|
1996
|
100-101 |
5 |
p. 701-706
6 p.
|
artikel
|
| 749 |
Cost-benefit analysis of a one-server two-nonidentical-unit cold standby system with repair and preventive maitenance
|
Gopalan, M.N.
|
|
1985
|
100-101 |
5 |
p. 991-1000
10 p.
|
artikel
|
| 750 |
Cost-benefit analysis of a one-server two-unit cold standby system with repair and age replacement
|
Gopalan, M.N.
|
|
1985
|
100-101 |
5 |
p. 977-990
14 p.
|
artikel
|
| 751 |
Cost-benefit analysis of a one-server two-unit imperfect switch system with delayed repair
|
Gopalan, M.N.
|
|
1985
|
100-101 |
5 |
p. 865-867
3 p.
|
artikel
|
| 752 |
Cost-benefit analysis of a two-unit adaptive system subject to slow switch with random service
|
Radhakrishnan, R.
|
|
1985
|
100-101 |
5 |
p. 869-875
7 p.
|
artikel
|
| 753 |
Cost-benefit analysis of a two unit cold standby system with random switchover and service time
|
Singh, H.R.
|
|
1989
|
100-101 |
5 |
p. 711-716
6 p.
|
artikel
|
| 754 |
Cost-benefit analysis of a two-unit deteriorating standby system with detector
|
Goel, L.R.
|
|
1986
|
100-101 |
5 |
p. 863-866
4 p.
|
artikel
|
| 755 |
Cost-benefit analysis of one-server two-unit imperfect switch system with degradation
|
Gopalan, M.N.
|
|
1985
|
100-101 |
5 |
p. 949-958
10 p.
|
artikel
|
| 756 |
Cost-benefit analysis of one-server two-unit parallel system subject to random service
|
Gopalan, M.N.
|
|
1985
|
100-101 |
5 |
p. 959-975
17 p.
|
artikel
|
| 757 |
Cost-benefit analysis of one-server two-unit replacement system with imperfect switch
|
Gopalan, M.N.
|
|
1985
|
100-101 |
5 |
p. 877-879
3 p.
|
artikel
|
| 758 |
Cost-density analysis of interconnections
|
|
|
1988
|
100-101 |
5 |
p. 827-
1 p.
|
artikel
|
| 759 |
Cost-effective reliability testing
|
|
|
1978
|
100-101 |
5 |
p. 403-
1 p.
|
artikel
|
| 760 |
Cost function analysis of a standby redundant non-repairable system subjected to different types of failures
|
Gupta, P.P.
|
|
1986
|
100-101 |
5 |
p. 835-839
5 p.
|
artikel
|
| 761 |
Cost limit replacement policy under minimal repair
|
|
|
1984
|
100-101 |
5 |
p. 992-
1 p.
|
artikel
|
| 762 |
Cost reliability trade off in an electronic module
|
Surendran, K.
|
|
1976
|
100-101 |
5 |
p. 493-496
4 p.
|
artikel
|
| 763 |
Cost savings by establishing life limits
|
|
|
1984
|
100-101 |
5 |
p. 996-
1 p.
|
artikel
|
| 764 |
Coupling capacitances in the planar conductive path system of the hybrid circuit with dielectric layer
|
Wisz, Bogusław
|
|
2008
|
100-101 |
5 |
p. 724-733
10 p.
|
artikel
|
| 765 |
Courses
|
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|
1974
|
100-101 |
5 |
p. 314-
1 p.
|
artikel
|
| 766 |
Courses
|
|
|
1972
|
100-101 |
5 |
p. 403-404
2 p.
|
artikel
|
| 767 |
Courses
|
|
|
1978
|
100-101 |
5 |
p. 389-391
3 p.
|
artikel
|
| 768 |
Courses in microelectronics and reliability
|
|
|
1971
|
100-101 |
5 |
p. 293-295
3 p.
|
artikel
|
| 769 |
Courses International Society for Hybrid Microelectronics
|
|
|
1978
|
100-101 |
5 |
p. 477-
1 p.
|
artikel
|
| 770 |
Cracking of solder connections on paper-base-phenolic printed wiring board
|
|
|
1990
|
100-101 |
5 |
p. 1007-1008
2 p.
|
artikel
|
| 771 |
Creating the integrated engineering design office
|
|
|
1983
|
100-101 |
5 |
p. 999-
1 p.
|
artikel
|
| 772 |
Credible and HPD intervals of the parameter and reliability of Rayleigh distribution
|
|
|
1984
|
100-101 |
5 |
p. 991-
1 p.
|
artikel
|
| 773 |
Creep behaviour of Sn–3.8Ag–0.7Cu under the effect of electromigration: Experiments and modelling
|
Su, Fei
|
|
2011
|
100-101 |
5 |
p. 1020-1024
5 p.
|
artikel
|
| 774 |
Creep fatigue modeling for solder joint reliability predictions including the microstructural evolution of the solder
|
|
|
1991
|
100-101 |
5 |
p. 1039-
1 p.
|
artikel
|
| 775 |
Creep of thin metallic films
|
|
|
1991
|
100-101 |
5 |
p. 1054-
1 p.
|
artikel
|
| 776 |
Critical component requirements for vapor phase soldering leadless components on circuit board assemblies for military electronics
|
|
|
1984
|
100-101 |
5 |
p. 1001-
1 p.
|
artikel
|
| 777 |
Cross-cell interference variability aware model of fully planar NAND Flash memory including line edge roughness
|
Poliakov, Pavel
|
|
2011
|
100-101 |
5 |
p. 919-924
6 p.
|
artikel
|
| 778 |
Cumulative reference list of published books on microelectronics and reliability
|
|
|
1970
|
100-101 |
5 |
p. 359-372
14 p.
|
artikel
|
| 779 |
Cumulative sum control charts for the mean of an exponential distribution using extremes
|
|
|
1984
|
100-101 |
5 |
p. 989-
1 p.
|
artikel
|
| 780 |
Current density distribution across the pn junction of a partially contacted diode at high forward bias
|
|
|
1971
|
100-101 |
5 |
p. 310-311
2 p.
|
artikel
|
| 781 |
Current developments in product liability affecting international commerce
|
|
|
1982
|
100-101 |
5 |
p. 1039-
1 p.
|
artikel
|
| 782 |
Current emission from sandwich metal layers Al-Al2O3-Au
|
|
|
1976
|
100-101 |
5 |
p. 380-
1 p.
|
artikel
|
| 783 |
Current transport mechanisms of electrochemically deposited CdS/CdTe heterojunction
|
|
|
1984
|
100-101 |
5 |
p. 1000-
1 p.
|
artikel
|
| 784 |
Custom designed integrated circuits
|
|
|
1970
|
100-101 |
5 |
p. 388-
1 p.
|
artikel
|
| 785 |
Custom designed LSI for intrumentation
|
|
|
1980
|
100-101 |
5 |
p. 760-
1 p.
|
artikel
|
| 786 |
CVD Tungsten interconnect and contact barrier technology for VLSI
|
|
|
1983
|
100-101 |
5 |
p. 999-
1 p.
|
artikel
|
| 787 |
CW laser annealing of boron and arsenic-implanted silicon; electrical properties, crystalline structure and limitations
|
|
|
1980
|
100-101 |
5 |
p. 765-
1 p.
|
artikel
|
| 788 |
D—a converter has versatile on-chip up-down counter
|
|
|
1982
|
100-101 |
5 |
p. 1043-
1 p.
|
artikel
|
| 789 |
Damage effects in silicon and MNOS structures caused by beams of ionized and neutral argon atoms with energies below 5 keV
|
|
|
1984
|
100-101 |
5 |
p. 1004-
1 p.
|
artikel
|
| 790 |
Damage in silicon caused by magnetron ion etching and its recovery effect
|
|
|
1991
|
100-101 |
5 |
p. 1056-
1 p.
|
artikel
|
| 791 |
Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter
|
Tan, Cher Ming
|
|
2014
|
100-101 |
5 |
p. 960-964
5 p.
|
artikel
|
| 792 |
Data bank for probabilistic risk-assessment of nuclear-fuel reprocessing plants
|
|
|
1989
|
100-101 |
5 |
p. 892-
1 p.
|
artikel
|
| 793 |
Data collection techniques
|
|
|
1972
|
100-101 |
5 |
p. 410-
1 p.
|
artikel
|
| 794 |
Data communications and the minicomputer
|
|
|
1973
|
100-101 |
5 |
p. 414-
1 p.
|
artikel
|
| 795 |
Data sources for microcomputer component selection
|
|
|
1989
|
100-101 |
5 |
p. 893-
1 p.
|
artikel
|
| 796 |
DC conduction mechanisms in thin polyimide films
|
Nevin, Joseph H.
|
|
1981
|
100-101 |
5 |
p. 699-705
7 p.
|
artikel
|
| 797 |
DC leakage currents in trichloroethylene oxides
|
|
|
1983
|
100-101 |
5 |
p. 1001-
1 p.
|
artikel
|
| 798 |
3D CMOS devices in recrystallized silicon
|
|
|
1991
|
100-101 |
5 |
p. 1039-
1 p.
|
artikel
|
| 799 |
dc voltage effects on saw device interdigital electrodes
|
|
|
1978
|
100-101 |
5 |
p. 484-
1 p.
|
artikel
|
| 800 |
Debunking the learning curve
|
|
|
1983
|
100-101 |
5 |
p. 991-
1 p.
|
artikel
|
| 801 |
Decision tools for use by management
|
Ryerson, C.M.
|
|
1978
|
100-101 |
5 |
p. 527-542
16 p.
|
artikel
|
| 802 |
Decomposition method for computing the reliability of complex networks
|
|
|
1982
|
100-101 |
5 |
p. 1040-
1 p.
|
artikel
|
| 803 |
Dedicated LSI chips aim at communications
|
|
|
1978
|
100-101 |
5 |
p. 489-
1 p.
|
artikel
|
| 804 |
Defect cluster analysis for wafer-scale integration
|
|
|
1991
|
100-101 |
5 |
p. 1046-
1 p.
|
artikel
|
| 805 |
Defect levels in chromium-doped silicon
|
|
|
1983
|
100-101 |
5 |
p. 1001-1002
2 p.
|
artikel
|
| 806 |
Defects in high-dose oxygen implanted silicon: a TEM study
|
|
|
1991
|
100-101 |
5 |
p. 1056-
1 p.
|
artikel
|
| 807 |
Deferred state sampling procedures
|
|
|
1971
|
100-101 |
5 |
p. 301-
1 p.
|
artikel
|
| 808 |
Defining the issues in wafer fab
|
|
|
1984
|
100-101 |
5 |
p. 999-
1 p.
|
artikel
|
| 809 |
Degradation and passivation of light emitting diodes
|
|
|
1971
|
100-101 |
5 |
p. 304-
1 p.
|
artikel
|
| 810 |
Degradation of silicone in white LEDs during device operation: a finite element approach to product reliability prediction
|
Watzke, S.
|
|
2015
|
100-101 |
5 |
p. 733-737
5 p.
|
artikel
|
| 811 |
Delay times in fault tree analysis
|
|
|
1983
|
100-101 |
5 |
p. 994-
1 p.
|
artikel
|
| 812 |
Demonstrating reliability and reliability growth with environmental stress screening data
|
|
|
1991
|
100-101 |
5 |
p. 1044-
1 p.
|
artikel
|
| 813 |
Density of states modifications in amorphous and hydrogenated amorphous germanium and their effect on 3d core levels binding energy
|
|
|
1984
|
100-101 |
5 |
p. 1000-
1 p.
|
artikel
|
| 814 |
Density of states of superconductors with overlapping bands
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|
1972
|
100-101 |
5 |
p. 420-
1 p.
|
artikel
|
| 815 |
Density variation in the strain-confined electron-hole liquid in Ge
|
|
|
1978
|
100-101 |
5 |
p. 492-493
2 p.
|
artikel
|
| 816 |
Dependability modeling of safety systems
|
Laprie, J.C.
|
|
1982
|
100-101 |
5 |
p. 997-1026
30 p.
|
artikel
|
| 817 |
Dependency of thermal spreading resistance on convective heat transfer coefficient
|
Vermeersch, B.
|
|
2008
|
100-101 |
5 |
p. 734-738
5 p.
|
artikel
|
| 818 |
Dependent components with increasing failure rates and failure rate averages
|
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|
1978
|
100-101 |
5 |
p. 400-
1 p.
|
artikel
|
| 819 |
Depletion layer formation, space-charge injection and current-voltage characteristics for the silicon p-n-p (n-p-n) structure
|
|
|
1972
|
100-101 |
5 |
p. 419-
1 p.
|
artikel
|
| 820 |
Deposition and properties of RF reactively sputtered SiO2 layers
|
|
|
1983
|
100-101 |
5 |
p. 1000-
1 p.
|
artikel
|
| 821 |
Derivation of an exact expression for mean time to repair
|
|
|
1987
|
100-101 |
5 |
p. 937-
1 p.
|
artikel
|
| 822 |
Derivation of fault-detection tests using Boolean matrices
|
|
|
1978
|
100-101 |
5 |
p. 485-
1 p.
|
artikel
|
| 823 |
Design and evaluation of RC active filters for hybrid thick film implementation
|
|
|
1982
|
100-101 |
5 |
p. 1045-
1 p.
|
artikel
|
| 824 |
Design evaluation of distributed saturation characteristics in integrated devices
|
|
|
1971
|
100-101 |
5 |
p. 310-
1 p.
|
artikel
|
| 825 |
Design for reliability
|
Dryden, M.H.
|
|
1976
|
100-101 |
5 |
p. 399-436
38 p.
|
artikel
|
| 826 |
Designing electronics for automated inspection
|
|
|
1989
|
100-101 |
5 |
p. 895-896
2 p.
|
artikel
|
| 827 |
Designing-in reliability—A new approach
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|
1978
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100-101 |
5 |
p. 405-
1 p.
|
artikel
|
| 828 |
Designing reliable communication networks in a planned failure environment
|
|
|
1983
|
100-101 |
5 |
p. 997-
1 p.
|
artikel
|
| 829 |
Designing the CF-18 to be operationally ready
|
|
|
1983
|
100-101 |
5 |
p. 994-
1 p.
|
artikel
|
| 830 |
Design of a comprehensive process evaluation vehicle for development of small geometry CMOS process
|
Bandyopadhyay, A.
|
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1984
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100-101 |
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p. 905-909
5 p.
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artikel
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| 831 |
Design of a pattern on a photomask-like physical standard for evaluation and calibration of linewidth-measuring systems
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1978
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100-101 |
5 |
p. 487-
1 p.
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artikel
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| 832 |
Design of a reliable multiple contact for the coin telephone totalizer
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1970
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100-101 |
5 |
p. 382-
1 p.
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artikel
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| 833 |
Design of fault-tolerant computing systems using real-time performance monitors
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Heaney, Albert A.
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1989
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100-101 |
5 |
p. 783-800
18 p.
|
artikel
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| 834 |
Design parameters of four-terminal distributed thin film integrated band-reject filter
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Singh, H.R.
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1983
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100-101 |
5 |
p. 795-797
3 p.
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artikel
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Design-safety enhancement through the use of hazard and risk analysis
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1989
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100-101 |
5 |
p. 885-
1 p.
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artikel
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| 836 |
Design to suppress return-back leakage current of charge pump circuit in low-voltage CMOS process
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Weng, Yi-Hsin
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2011
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100-101 |
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p. 871-878
8 p.
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artikel
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Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafers
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1990
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100-101 |
5 |
p. 1013-
1 p.
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artikel
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| 838 |
4567428 Detection of catastrophic failure of dielectric improper connection, and temperature of a printed circuit assembly via one wire
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Zbinden, TerryB
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1986
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100-101 |
5 |
p. 999-
1 p.
|
artikel
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| 839 |
Detection of conductive condensates resulting from adhesive outgassing in hybrid microcircuits
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1978
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100-101 |
5 |
p. 414-
1 p.
|
artikel
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| 840 |
Detection of cracking during rotational soldering of a high reliability and voltage ceramic capacitor
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1978
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5 |
p. 401-
1 p.
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artikel
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| 841 |
Detection of junction spiking and its induced latch-up by emission microscopy
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1989
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100-101 |
5 |
p. 886-
1 p.
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artikel
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| 842 |
Detection of loose particles within electronic component cavities
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1971
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100-101 |
5 |
p. 303-
1 p.
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artikel
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| 843 |
Determination of local stress in PECVD nitride films
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Gspan, G.
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1990
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100-101 |
5 |
p. 911-913
3 p.
|
artikel
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| 844 |
Determination of low energy barriers in metal-insulator-metal tunneling junctions
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1972
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100-101 |
5 |
p. 420-
1 p.
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artikel
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| 845 |
Determination of temperature of integrated-circuit chips in hybrid packaging
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1976
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5 |
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1 p.
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artikel
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| 846 |
4726023 Determination of testability of combined logic end memory by ignoring memory
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Carter, JohnL
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1988
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p. 838-
1 p.
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artikel
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| 847 |
Determination of the doping structure of integrated bipolar transistorized circuits, evaluating electric data by means of a computer
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1972
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100-101 |
5 |
p. 419-
1 p.
|
artikel
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| 848 |
Determination of the oxygen precipitate-free zone width in silicon wafers from surface photovoltage measurements
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1983
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100-101 |
5 |
p. 1001-
1 p.
|
artikel
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| 849 |
Determination of the thickness and refractive index of films on silicon using split-beam ellipsometry
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1970
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100-101 |
5 |
p. 389-
1 p.
|
artikel
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| 850 |
Determining DC/RF survivability limits of GaAs semiconductor circuits
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Gil, C.
|
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2009
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100-101 |
5 |
p. 484-487
4 p.
|
artikel
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| 851 |
Determining maximum reliable load lines for power transistors
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1970
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100-101 |
5 |
p. 382-
1 p.
|
artikel
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| 852 |
Determining operating and support costs with USAF D056 maintenance data collection system
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1984
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100-101 |
5 |
p. 993-
1 p.
|
artikel
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| 853 |
Determining shelf life of epoxy molding compounds
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1989
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5 |
p. 894-
1 p.
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artikel
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| 854 |
Deterrence and strict liability for defective products in the United Kingdom
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1980
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5 |
p. 753-
1 p.
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artikel
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| 855 |
Detour ahead for IC equipment makers?
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1981
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5 |
p. 755-
1 p.
|
artikel
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| 856 |
Developing criteria for determining corrective action thresholds during reliability verification testing (RVT)
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1991
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5 |
p. 1042-
1 p.
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artikel
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| 857 |
Development of adhesive die attach technology in cerdip packages; material issues
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1984
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5 |
p. 999-
1 p.
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artikel
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| 858 |
Development of a life cycle management cost model
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1978
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100-101 |
5 |
p. 403-
1 p.
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artikel
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| 859 |
Development of a methodology for evaluating computer integrated manufacturing (CIM) implementation performance
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1991
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5 |
p. 1051-
1 p.
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artikel
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| 860 |
Development of a model for distributed saturation characteristics in integrated devices
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1971
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5 |
p. 310-
1 p.
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artikel
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| 861 |
Development of a new low-stress hyperred LED encapsulant
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1990
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1 p.
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artikel
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| 862 |
Development of a thermal resistance model for chip-on-board packaging of high power LED arrays
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Ha, Minseok
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2012
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p. 836-844
9 p.
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Development of bubble memory chip test system
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1976
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1 p.
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artikel
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| 864 |
Development of copper wire bonding application technology
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1991
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p. 1049-
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artikel
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Development of in-flight steady-state failure rates
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1980
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5 |
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1 p.
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artikel
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| 866 |
Development of nondestructive pull test requirements for gold wires on multilayer thick-film hybrid microcircuits
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1984
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5 |
p. 1002-
1 p.
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artikel
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| 867 |
Development of the green plastic encapsulation for high density wirebonded leaded packages
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Lin, T.Y.
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2003
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p. 811-817
7 p.
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Development of the tab-process at SAAB-SCANIA
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1978
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5 |
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1 p.
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artikel
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| 869 |
Developments in printed circuits—II. Packaged circuits
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1970
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p. 386-
1 p.
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artikel
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| 870 |
Device and circuit level suppression techniques for random-dopant-induced static noise margin fluctuation in 16-nm-gate SRAM cell
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Lee, Kuo-Fu
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2010
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5 |
p. 647-651
5 p.
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| 871 |
Device design of E/D gate MOSFET
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1973
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5 |
p. 411-
1 p.
|
artikel
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| 872 |
4724965 Device for conveying components, particularly integrated chips, from an input magazine to an output magazine
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Willberg, Hans-Heinrich
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1988
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p. 837-
1 p.
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artikel
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| 873 |
4811344 Device for the testing and checking of the operation of blocks within an integrated circuit
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Chauvel, Gerard
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1989
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1 p.
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artikel
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| 874 |
4727317 Device orientation test method suitable for automatic test equipment
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Oliver, MartinJ
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1988
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1 p.
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| 875 |
Devices and circuits for bipolar (V) LSI
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1982
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1 p.
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| 876 |
Devices meeting probes the limits of semiconductors and circuitry
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1983
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1 p.
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artikel
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| 877 |
4963824 Diagnostics of a board containing a plurality of hybrid electronic components
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Hsieh, EdwardP
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1991
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1 p.
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artikel
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Diamond layout style impact on SOI MOSFET in high temperature environment
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Gimenez, Salvador Pinillos
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2015
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6 p.
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Diaphragm connection—a new package for complex ICs
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1971
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1 p.
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artikel
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| 880 |
Die and wire bonding capabilities of thick-film conductors
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1970
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5 |
p. 394-
1 p.
|
artikel
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| 881 |
Dielectric breakdown properties in silicon dioxide films
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1976
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5 |
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artikel
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| 882 |
Dielectric isolation techniques for integrated circuits
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1976
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5 |
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1 p.
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artikel
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| 883 |
Dielectric spectroscopy of silicon barrier devices
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1989
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5 |
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1 p.
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artikel
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| 884 |
Die stress drift measurement in IC plastic packages using the piezo-Hall effect
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Manic, D
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2001
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5 p.
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artikel
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| 885 |
Diffusion length and surface recombination velocity measurements with the scanning electron microscope: the highly-doped emitter of a p-n junction
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1984
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p. 1000-
1 p.
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artikel
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Diffusion theory of the steady-state flow of minority-carrier current through the Schottky barrier
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1981
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1 p.
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artikel
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Diffusivity and growth rate of silicon in solid-phase epitaxy with an aluminium medium
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1983
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p. 1001-
1 p.
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Diffusivity of charged carriers in semiconductors in strong electric fields
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1977
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1 p.
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artikel
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| 889 |
Digital GaAs ICs hit gigahertz speed mark
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1984
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1 p.
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artikel
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| 890 |
Digital IC applications—Hybrid interconnection of digital circuits
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Naylor, R.
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1974
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p. 411-412
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artikel
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Digital ICs offer new solutions for rough industrial problems
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1972
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1 p.
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artikel
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Digitally programmable CMOS transconductor for very high frequency
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Otı́n, Aránzazu
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2004
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7 p.
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artikel
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| 893 |
Digital panel meter. Design, operation and construction of an instrument with a salid-state display and based on an MOS, LSI chip
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1973
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5 |
p. 412-
1 p.
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artikel
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Digital signal processing in the U.K.
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1987
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Digital systems with algorithm implementation
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G.W.A.D.,
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1983
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Digital testing costs can be cut
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1972
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1 p.
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Digital testing oscilloscope cushions against mounting costs of troubleshooting
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1978
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5 |
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1 p.
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Discharge of MNOS structures
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1973
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5 |
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1 p.
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artikel
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| 899 |
Discontinuities in homogeneous markov processes and their use in modelling technical systems under inspection
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Becker, G.
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1994
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18 p.
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Discounting utilization in order to optimise reliability choices on an economic level
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1973
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5 |
p. 406-
1 p.
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artikel
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| 901 |
Discrete wire bonding using laser energy
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1989
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1 p.
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| 902 |
Distributional errors in reliability
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Livson, B.U.
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1978
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5 |
p. 449-
1 p.
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artikel
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| 903 |
Distribution of a random variable defined through a constitutive equation
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1976
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5 |
p. 376-
1 p.
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artikel
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Distribution of failures in an array of cells
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1987
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1 p.
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| 905 |
Distribution of order statistics with varying number of components in reliability systems
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Singh, N.
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1996
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7 p.
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Distribution profiles of boron-implanted layers in silicon using a high resolution anodic oxidation cell
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1976
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p. 383-
1 p.
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artikel
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3−d MOS FETs shrink static RAM cells and analog circuit blocks
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1981
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p. 759-
1 p.
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DoD/industry—R & M case study analysis
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1984
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DoD/industry studies related to CALS R&M
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1990
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5 |
p. 1006-
1 p.
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| 910 |
Do flame retardants affect the reliability of molded plastic packages
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1982
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5 |
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1 p.
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Do not be confused by IC switching time specifications
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1972
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1 p.
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Doped silicon oxide as diffusion source
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1976
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1 p.
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Doping profile measurements on silicon epitaxial layers with field controlled planar diodes
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1970
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5 |
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1 p.
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Doping uniformity and reproducibility of ion implanted wafers
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1 p.
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Dormancy effects on nonelectronics
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1 p.
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Dose accuracy and doping uniformity of ion implantation equipment
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1981
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Double-diffused MOS transistor achieves microwave gain
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1971
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1 p.
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Double implant low dose technique in analog IC fabrication
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1990
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1 p.
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‘Double-R/half-M’, a reasonable design objective?
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1988
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Drawing the lines for v.l.s.i.
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1980
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1 p.
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Dry etching of III–V semiconductors: influence of substrate temperature on the anisotropy and induced damage
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1991
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Dry processing in microelectronics: towards low pressure plasma technology
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1991
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Dual-port RAM hikes throughput in input/output controller board
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1978
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1 p.
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Duane growth model: estimation of final MTBF with confidence limits using a hand calculator
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1977
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Duration of hidden faults in randomly checked systems
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1978
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Dynamic decision elements for 3-unit systems
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1978
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Dynamic inspection of large scale integrated circuits
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Dynamic models for statistical inference from accelerated life tests
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1991
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Dynamic reconfiguration schemes for megabit BiCMOS SRAMs and performance evaluation
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1997
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4812678 Easily testable semiconductor LSI device
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1989
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E-beam lithography: a story of dual identities
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1984
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EBS amplifiers debut
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1971
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ECC tackles fiber optics, bonding, hybrid technology
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1981
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ECL memories speeding to market
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1978
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Economically based acceptance sampling plans
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1990
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Economic formulation of reliability objectives
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1971
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5 |
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2 p.
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Economic inventory and replacement management of a system in which components are subject to failure
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Sivazlian, B.D.
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1989
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21 p.
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Economic models for statellite system effectiveness
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1973
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1 p.
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Economics influence the design of consumer microcircuits
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1973
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5 |
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1 p.
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Economics of reliability for spacecraft computers
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1972
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5 |
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1 p.
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Economics of thick and thin film hybrid production in Europe
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1978
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5 |
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Edge passivation and related electrical stability in silicon power devices
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1990
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Editorial
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2009
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Editorial
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2 p.
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Editorial
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Effective masses in (100) silicon inversion layers
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1 p.
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Effectiveness of reliability system testing on quality and reliability
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1977
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5 |
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1 p.
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Effective testing of digital integrated circuits
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5 |
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1 p.
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Effect of a trace of water vapor on Ohmic contact formation for AlGaN/GaN epitaxial wafers
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2008
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Effect of BIT on expendable weapon test results
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Effect of bump size on current density and temperature distributions in flip-chip solder joints
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Kuan, Wei-Chih
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2009
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7 p.
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Effect of device reliability on memory reliability
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5 |
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Effect of electric field polarity on inter-poly dielectric during cell operation for the retention characteristics
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Moon, Pyung
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2015
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Effect of gate barrier and channel buffer layer on electric properties and transparence of the a-IGZO thin film transistor
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Lin, Cheng-I
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2014
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Effect of heat treatment on chemical and electronic structure of solid SiO; an electron spectroscopy study
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Effect of metal line geometry on electromigration lifetime in Al-Cu submicron interconnects
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1989
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5 |
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Effect of microwave preheating on the bonding performance of flip chip on flex joint
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Islam, R.A.
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2004
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5 |
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Effect of oxidation on orientation-dependent boron diffusion in silicon
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5 |
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Effect of oxide glass on the sintering behaviour and electrical properties in Ag thick films
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1989
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5 |
p. 897-
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Effect of reactor geometry on growth rate of epitaxial silicon
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5 |
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Effect of RuO2 on the behaviour of silver at thick-film terminations
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1989
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100-101 |
5 |
p. 897-
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artikel
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Effect of standby redundancy on system reliability
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1976
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100-101 |
5 |
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Effect of temperature on the electrophysical properties of Si–polymer composite varistors
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Ghafouri, M.
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2014
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100-101 |
5 |
p. 965-971
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Effect of thermal instability on ultra-high frequency performance of insulated-gate field-effect transistors
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1970
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5 |
p. 389-390
2 p.
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artikel
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| 965 |
Effect of trench edge on pMOSFET reliability
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Lee, Yung-Huei
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2001
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5 |
p. 689-696
8 p.
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artikel
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| 966 |
Effects of accelerated temperature testing on the low-frequency noise of planar NPN transistors
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Stojadinović, N.D.
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1983
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5 |
p. 899-901
3 p.
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Effects of annealing temperature on electromigration performance of multilayer metallisation systems
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1989
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100-101 |
5 |
p. 893-
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Effects of base doping and width on the J-V characteristics of the n+-n-p+ structure
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1972
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5 |
p. 421-
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artikel
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Effects of contamination on aluminum films. Part 1: room temperature deposition
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1989
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5 |
p. 894-
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| 970 |
Effects of device passivation materials on solderable metallization of IGBTs
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Haque, Shatil
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2001
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5 |
p. 639-647
9 p.
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Effects of “on-off” cycling on equipment reliability
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1978
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5 |
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Effects of periphery encapsulation material on the characteristics of micro vacuum dielectric capacitor
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Wong, Oi Ying
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2009
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5 |
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4 p.
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artikel
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Effects of polymer/metal interaction in thin-film multichip module applications
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1991
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5 |
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artikel
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| 974 |
Effects of RF power on the structural, optical and electrical properties of Al-doped zinc oxide films
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Kuo, Shou-Yi
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2010
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5 |
p. 730-733
4 p.
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artikel
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| 975 |
Effects of soft segment mixtures with different molecular weight on the properties and reliability of UV curable adhesives for electrodes protection of plasma display panel (PDP)
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Hwang, Jin-Sang
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2009
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5 |
p. 517-522
6 p.
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artikel
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Effects of temperature on avionics reliability
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1977
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5 |
p. 552-
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Effects of the atmosphere on the resistance of ITO thin films
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1988
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5 |
p. 834-
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artikel
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Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates
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An, Tong
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2014
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5 |
p. 932-938
7 p.
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| 979 |
Effects of the sputtering deposition process of metal gate electrode on the gate dielectric characteristics
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Yamada, Takayuki
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2001
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5 |
p. 697-704
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Efficient algorithms for reliability analysis of planar networks—a survey
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1987
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Efficient evaluation of system reliability by Monte Carlo method
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1978
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5 |
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Eigenvalue-eigenvector solutions for two general markov models in reliability
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Johnson, L.Ensign
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1986
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5 |
p. 917-933
17 p.
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artikel
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| 983 |
Eight-bit microprocessor aims at control applications
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1976
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5 |
p. 379-
1 p.
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artikel
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| 984 |
Elastoplastic analysis of surface-mount solder joints
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1988
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5 |
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1 p.
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artikel
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| 985 |
Electrical and reliability characteristics of GaAs MOSHEMTs utilizing high-k IIIB and IVB oxide layers
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Chiu, Hsien-Chin
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2010
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5 |
p. 631-634
4 p.
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| 986 |
Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors
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Dziedzic, Andrzej
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2001
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5 |
p. 669-676
8 p.
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artikel
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| 987 |
Electrical characteristics and reliability properties of metal–oxide–semiconductor capacitors with HfZrLaO gate dielectrics
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Liu, C.H.
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2010
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5 |
p. 599-602
4 p.
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artikel
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| 988 |
Electrical characteristics of nMOSFETs fabricated on hybrid orientation substrate with amorphization/templated recrystallization method
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Huang, Po Chin
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2010
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5 |
p. 662-665
4 p.
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| 989 |
Electrical characteristics of polymer thick film resistors, Part I: experimental results
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1982
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5 |
p. 1045-
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Electrical characteristics of sputtering-induced defects in n-type silicon
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1978
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5 |
p. 490-
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artikel
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| 991 |
Electrical conduction mechanisms of barium-titanate-based thick-film capacitors
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1988
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5 |
p. 827-828
2 p.
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| 992 |
Electrical instability of sintered Ta films on (vacuum evaporated) polysilicon structures
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Eranna, G.
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1994
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5 |
p. 943-945
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Electrical junction delineation by scanning electron beam technique
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1971
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p. 313-
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Electrical modeling of interconnections in multilayer packaging structures
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1988
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5 |
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| 995 |
Electrical performances of devices made in SiO films obtained by lamp ZMR
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1988
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5 |
p. 832-
1 p.
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artikel
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| 996 |
Electrical properties of anodic aluminium oxide films
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1980
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5 |
p. 763-
1 p.
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artikel
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| 997 |
Electrical properties of Cd x Hg 1−x Te thin films for hall effect device applications
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1977
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5 |
p. 557-
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artikel
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| 998 |
Electrical properties of thin Ta2O5 films obtained by thermal oxidation of Ta on Si
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Atanassova, E.
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1998
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5 |
p. 827-832
6 p.
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artikel
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| 999 |
Electrical reliability of highly reliable 256M-bit mobile DRAM with top-edge round STI and dual gate oxide
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Lee, Chihoon
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2003
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5 |
p. 735-739
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Electric equivalent models of glass thick films
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1980
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artikel
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