Digitale Bibliotheek
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                             4365 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayes explanation of an apparent failure rate paradox 1986
100-101 4 p. 789-
1 p.
artikel
2 A bayesian approach to test modelling 1981
100-101 4 p. 620-
1 p.
artikel
3 A Bayesian estimate of availability 1981
100-101 4 p. 618-
1 p.
artikel
4 A bayesian modelling of failure rate 1981
100-101 4 p. 619-
1 p.
artikel
5 A Bayes reliability growth model for a development testing program 1989
100-101 4 p. 650-651
2 p.
artikel
6 A beam-lead substrate package for a six-stage TTL shift register Bachner, F.
1969
100-101 4 p. 307-308
2 p.
artikel
7 A biased percolation model for the analysis of electronic-device degradation Gingl, Z.
1998
100-101 4 p. 515-521
7 p.
artikel
8 A bibliography on silicon nitride films 1981
100-101 4 p. 622-
1 p.
artikel
9 A birth and death model for computing the reliability of a transmission network Alidrisi, Mustafa M.
1987
100-101 4 p. 653-659
7 p.
artikel
10 A Boolean algebra method for reliability calculations 1984
100-101 4 p. 809-
1 p.
artikel
11 About use of ICS for submerged cables: can we reject all infant failures? 1981
100-101 4 p. 611-612
2 p.
artikel
12 Abrupt p-n junctions at arbitrary levels 1969
100-101 4 p. 298-
1 p.
artikel
13 A buffer distribution algorithm for high-performance clock net optimization 1996
100-101 4 p. 556-557
2 p.
artikel
14 AC analysis of an inverter amplifier using minimum-length trapezoidal association of transistors Girardi, Alessandro
2004
100-101 4 p. 665-671
7 p.
artikel
15 A case history of converting a digital voltmeter to integrated circuitry 1968
100-101 4 p. 346-
1 p.
artikel
16 A case study of C.mmp, Cm∗, and C.vmp: Part II—Predicting and calibrating reliability of multiprocessor systems 1979
100-101 4 p. 307-308
2 p.
artikel
17 Accelerated ageing and solderability testing of printed wiring boards 1988
100-101 4 p. 654-
1 p.
artikel
18 Accelerated lifetesting and failure modes of thin film W contacts on SiGe Thermoelectric alloys 1975
100-101 4 p. 337-
1 p.
artikel
19 Accelerated life testing for products without sequence effect 1997
100-101 4 p. 693-
1 p.
artikel
20 Accelerated popcorn testing of high solder-reflow crack resistant molding compounds Tubbs, T.R.
1998
100-101 4 p. 665-669
5 p.
artikel
21 Accelerated testing for cosmic soft-error rate 1997
100-101 4 p. 702-
1 p.
artikel
22 Accelerated testing of time related parameters in MNOS memories 1982
100-101 4 p. 899-
1 p.
artikel
23 Accelerated thermal fatigue cycling of surface mounted PWB assemblies in Telecom equipment 1989
100-101 4 p. 646-
1 p.
artikel
24 Acceleration factor and constant for accelerated testing of reliability Tomášek, K.F.
1972
100-101 4 p. 395-397
3 p.
artikel
25 Acceleration factors for thin gate oxide stressing 1986
100-101 4 p. 796-
1 p.
artikel
26 Accurate LCC estimating early in program development 1974
100-101 4 p. 243-244
2 p.
artikel
27 Accurate two-port model of the metal-oxide semiconductor transistor 1979
100-101 4 p. 305-
1 p.
artikel
28 ACD grows up—fast 1971
100-101 4 p. 250-
1 p.
artikel
29 A certain model of reliability diagnostic of renewal objects Czaplicki, Jacek M.
1985
100-101 4 p. 695-698
4 p.
artikel
30 ACF-COG interconnection conductivity inspection system using conductive area Sheng, Xinjun
2013
100-101 4 p. 622-628
7 p.
artikel
31 A challenge—the need for central assessment of reliability 1965
100-101 4 p. 371-
1 p.
artikel
32 A challenge: to integrate and isolate 1967
100-101 4 p. 332-
1 p.
artikel
33 A 28,000 channel frequency synthesizer in 10 cubic inches 1966
100-101 4 p. 360-
1 p.
artikel
34 Achieving accurate thermal characterization using a CFD code—a case study of plastic packages 1997
100-101 4 p. 700-701
2 p.
artikel
35 Achieving future requirements in ULSI gases 1987
100-101 4 p. 787-
1 p.
artikel
36 Achieving reliability in large scale software systems 1974
100-101 4 p. 242-
1 p.
artikel
37 A class of ratio, product and difference (R.P.D.) estimators in systematic sampling Banarasi,
1993
100-101 4 p. 455-457
3 p.
artikel
38 A class of tests for testing an increasing failure-rate-average distribution with randomly right-censored data 1992
100-101 4 p. 589-
1 p.
artikel
39 A CMOS/buried-n-channel CCD compatible process for analog signal processing applications 1978
100-101 4 p. 422-
1 p.
artikel
40 A CMOS IC for Gb/s Viterbi decoding: system design and VLSI implementation 1997
100-101 4 p. 702-703
2 p.
artikel
41 A cold standby system with arrival time of server and correlated failures and repairs Goel, L.R.
1995
100-101 4 p. 739-742
4 p.
artikel
42 A combined analysis approach to assessing requirements for safety critical real-time control systems 1997
100-101 4 p. 692-
1 p.
artikel
43 A comparative study of anodized, evaporated and sputtered aluminium oxide thin films 1970
100-101 4 p. 327-
1 p.
artikel
44 A comparative study of charge pumping circuits for flash memory applications Wong, O.Y.
2012
100-101 4 p. 670-687
18 p.
artikel
45 A comparison of classical and Bayes risks when the quality varies randomly Sharma, K.K.
1992
100-101 4 p. 493-495
3 p.
artikel
46 A comparison of fault-tolerant state machine architectures for space-borne electronics 1997
100-101 4 p. 697-
1 p.
artikel
47 A comparison of manufacturing techniques for hybrid microwave circuits 1972
100-101 4 p. 323-
1 p.
artikel
48 A comparison of metal-in-elastomer connectors: the influence of structure on mechanical and electrical performance 1992
100-101 4 p. 583-
1 p.
artikel
49 A comparison of resistivity measurement techniques on epitaxial silicon 1964
100-101 4 p. 312-
1 p.
artikel
50 A comparison of several component-testing plans for a parallel system 1989
100-101 4 p. 649-
1 p.
artikel
51 A comparison of several component-testing plans for a series system 1987
100-101 4 p. 782-
1 p.
artikel
52 A comparison of simple and numerical two-dimensional modesla for the threshold voltage of short channel MOSTS 1978
100-101 4 p. 423-424
2 p.
artikel
53 A comparison of the prediction of future order statistics for the 2-parameter gamma distribution 1989
100-101 4 p. 650-
1 p.
artikel
54 A comparison of the reliability of copper and palladium-silver thick-film crossovers 1989
100-101 4 p. 660-
1 p.
artikel
55 A comparison of three methods for calculating lower confidence limits on system reliability using Binomial component data 1986
100-101 4 p. 788-
1 p.
artikel
56 A comparison or reliability growth models 1976
100-101 4 p. 266-
1 p.
artikel
57 A complete microcomputer on a chip Pittman, P.
1977
100-101 4 p. 413-417
5 p.
artikel
58 A complete microcomputer on a chip 1978
100-101 4 p. 423-
1 p.
artikel
59 A complex three-unit system Sarma, Y.V.S.
1984
100-101 4 p. 661-662
2 p.
artikel
60 A computer-aided design system services operation 1973
100-101 4 p. 276-
1 p.
artikel
61 A computerised system for deriving symbolic unreliability expression Jamil, A.T.M.
1986
100-101 4 p. 753-762
10 p.
artikel
62 A computerized LCC/ORLA methodology 1980
100-101 4 p. 539-
1 p.
artikel
63 A computer method for fault detection in combinational circuits 1980
100-101 4 p. 543-
1 p.
artikel
64 A conditional probability approach to reliability with common-cause failures 1986
100-101 4 p. 785-
1 p.
artikel
65 A conditional probability treatment of strict consecutive-k-out-of-n:F systems Rushdi, Ali M.
1989
100-101 4 p. 581-586
6 p.
artikel
66 A consideration on spare allocation for a multi-echelon repair system 1989
100-101 4 p. 649-
1 p.
artikel
67 A CORDIC-based digital protective relay and its architecture Park, Jong Kang
2009
100-101 4 p. 438-447
10 p.
artikel
68 A cost comparison of new MCM technologies 1997
100-101 4 p. 698-
1 p.
artikel
69 A coverage analysis tool for the effective of software testing 1996
100-101 4 p. 543-
1 p.
artikel
70 A critical review of VLSI die-attachment in high reliability applications 1986
100-101 4 p. 783-
1 p.
artikel
71 Active components: more breakthroughs on the way 1963
100-101 4 p. 256-
1 p.
artikel
72 4551672 Active probe Hadley, Russell
1986
100-101 4 p. 799-
1 p.
artikel
73 Active trimming of microchip resistors to 0.002% 1978
100-101 4 p. 320-
1 p.
artikel
74 A CW keyer using digital ICs 1970
100-101 4 p. 320-
1 p.
artikel
75 Adaptive decision elements to improve the reliability of redundant systems 1963
100-101 4 p. 266-
1 p.
artikel
76 A data-base for IC mask making 1984
100-101 4 p. 814-
1 p.
artikel
77 A data modem—an application of l.s.i. 1974
100-101 4 p. 246-
1 p.
artikel
78 A-d converter chip resolves 10 bits 1978
100-101 4 p. 421-
1 p.
artikel
79 Additional microstructural analysis on the samples examined in the paper ‘Are high resolution resistometric methods really useful for the early detection of electromigration damage?’ Balboni, R.
1999
100-101 4 p. 537-540
4 p.
artikel
80 Addressable inverter matrix for process and device characterization 1986
100-101 4 p. 784-
1 p.
artikel
81 4719411 Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation Buehler, MartinG
1988
100-101 4 p. 667-668
2 p.
artikel
82 A decomposition method for computing system reliability by a Boolean expression 1978
100-101 4 p. 418-
1 p.
artikel
83 A degradation reliability model 1978
100-101 4 p. 310-
1 p.
artikel
84 A device analysis system based on laser scanning techniques 1981
100-101 4 p. 622-
1 p.
artikel
85 Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol–gel derived hybrid layers Kim, Sanwi
2014
100-101 4 p. 833-839
7 p.
artikel
86 Adhesion measurements of metallizations for hybrid microcircuits 1978
100-101 4 p. 427-
1 p.
artikel
87 A digital I.F. system for use in a thin-film radar receiver 1966
100-101 4 p. 359-
1 p.
artikel
88 A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycles Huang, J.H.
1993
100-101 4 p. 535-542
8 p.
artikel
89 A distributed RC Network Broadband FM Discriminator in thin-film technique 1968
100-101 4 p. 342-
1 p.
artikel
90 A distribution-free upper confidence bound for PR (Y < X): an application to stress-strength models 1984
100-101 4 p. 810-811
2 p.
artikel
91 A doped oxide diffusion source 1975
100-101 4 p. 346-
1 p.
artikel
92 Advanced linear circuits Henderson, R.S.
1975
100-101 4 p. 353-
1 p.
artikel
93 Advanced methods of ion implant monitoring using optical dosimetry 1986
100-101 4 p. 798-
1 p.
artikel
94 Advanced missile models and methods for availability prediction 1969
100-101 4 p. 291-
1 p.
artikel
95 Advanced step and repeat aligner for VLSI 1986
100-101 4 p. 793-
1 p.
artikel
96 Advances in data management for implantation process control 1986
100-101 4 p. 797-
1 p.
artikel
97 Advances in diffusion furnace technology 1986
100-101 4 p. 791-
1 p.
artikel
98 Advances in hybrid chip placement 1988
100-101 4 p. 662-
1 p.
artikel
99 Advances in ion beam milling 1979
100-101 4 p. 318-
1 p.
artikel
100 Advances in linear monolithic circuit technology 1968
100-101 4 p. 332-
1 p.
artikel
101 Advances in monolithic integrated circuits 1967
100-101 4 p. 328-
1 p.
artikel
102 Advances in non-volatile memory technology Wong, Hei
2012
100-101 4 p. 611-612
2 p.
artikel
103 Advances in projection microlithography 1980
100-101 4 p. 546-
1 p.
artikel
104 Advances in reliability prediction 1963
100-101 4 p. 253-
1 p.
artikel
105 Advances in sheet resistance measurements for ion implant monitoring 1986
100-101 4 p. 798-
1 p.
artikel
106 Advances in solid planar dopant sources for silicon 1975
100-101 4 p. 346-
1 p.
artikel
107 Advances in the state-of-the-art of MOS device technology 1967
100-101 4 p. 327-
1 p.
artikel
108 Advances in Wafer Level Packaging (WLP) Tee, Tong Yan
2010
100-101 4 p. 479-480
2 p.
artikel
109 Advantages of magnetron etching 1986
100-101 4 p. 793-
1 p.
artikel
110 AESOP: a simulation-based knowledge system for CMOS process diagnosis 1990
100-101 4 p. 829-
1 p.
artikel
111 A fail-safe realization of alternating logic 1972
100-101 4 p. 321-
1 p.
artikel
112 A failure analysis technique for locating the fail site in MOSFET (LSI) logic chips with sputtered SIO2 passivation 1975
100-101 4 p. 340-
1 p.
artikel
113 A fast algorithm for reliability evaluation 1975
100-101 4 p. 335-
1 p.
artikel
114 A fast algorithm for the calculation of junction capacitance and its application for impurity profile determination 1972
100-101 4 p. 328-
1 p.
artikel
115 A fast and reliable industrial cyclical remote control system 1965
100-101 4 p. 373-
1 p.
artikel
116 A fast method for redundancy allocation Misra, K.B.
1973
100-101 4 p. 385-387
3 p.
artikel
117 A fault tolerant memory for duplex systems 1978
100-101 4 p. 314-315
2 p.
artikel
118 A fault tree approach to quality control by variables 1980
100-101 4 p. 544-
1 p.
artikel
119 AFDT1, maintenance software 1981
100-101 4 p. 619-
1 p.
artikel
120 A figure of merit for digital systems Josephs, H.C.
1965
100-101 4 p. 345-350
6 p.
artikel
121 A first study on reliability of high radiance burrus diodes 1981
100-101 4 p. 610-
1 p.
artikel
122 A four ASIC MCM-C, design for manufacturability and the next generation silicon 1996
100-101 4 p. 552-553
2 p.
artikel
123 A frequency-domain approach to interconnect crosstalk simulation and minimization Ernesto Rayas-Sánchez, José
2004
100-101 4 p. 673-681
9 p.
artikel
124 A fritless copper conductor system for power electronic applications Reicher, Roland
2001
100-101 4 p. 491-498
8 p.
artikel
125 A full-scaled NMOS technology for VLSI circuits 1986
100-101 4 p. 793-
1 p.
artikel
126 A full wafer Static RAM designed and manufactured within the ESPRIT project 824 “Wafer Scale Integration” 1990
100-101 4 p. 828-
1 p.
artikel
127 Ageing tests on microwave integrated circuits 1978
100-101 4 p. 414-
1 p.
artikel
128 A generalization of Freund's model for a repairable paired component based on a bivariate Geiger Muller (G.M.) counter Biswas, Suddhendu
1984
100-101 4 p. 671-675
5 p.
artikel
129 A generalization of the concept of the integrated circuits Tarui, Yasuo
1971
100-101 4 p. 227-228
2 p.
artikel
130 A generalized geometric de-eutrophication software-reliability model 1996
100-101 4 p. 536-
1 p.
artikel
131 A generalized limit theorem for reliability 1970
100-101 4 p. 313-
1 p.
artikel
132 A generalized reduction method for the connectedness probability of stochastic networks 1992
100-101 4 p. 589-
1 p.
artikel
133 A generalized reliability function for systems of parallel components 1969
100-101 4 p. 288-
1 p.
artikel
134 Age replacement in simple systems with increasing loss functions 1976
100-101 4 p. 265-266
2 p.
artikel
135 A graphical method for optimal reliability allocation 1984
100-101 4 p. 810-
1 p.
artikel
136 AGREE-able experience 1963
100-101 4 p. 264-
1 p.
artikel
137 A guide to hybrid-circuit component compatibility 1973
100-101 4 p. 281-
1 p.
artikel
138 A heuristic method of link reliability assignment for maximal reliability Jain, S.P.
1990
100-101 4 p. 673-679
7 p.
artikel
139 A hi-density C4/CBGA interconnect technology for a CMOS microprocessor 1997
100-101 4 p. 703-
1 p.
artikel
140 A high density thick film multilayer process for LSI circuits 1975
100-101 4 p. 341-
1 p.
artikel
141 A highly desensitized, wide-band monolithic amplifier 1967
100-101 4 p. 337-
1 p.
artikel
142 A highly reliable memory subsystem design employing SECDED, column sparing, and paging 1987
100-101 4 p. 786-
1 p.
artikel
143 A highly reliable NBTI Resilient 6T SRAM cell Singh, Jawar
2013
100-101 4 p. 565-572
8 p.
artikel
144 A high Q temperature insensitive inductive transistor circuit 1968
100-101 4 p. 334-335
2 p.
artikel
145 A high resolution study of the excitation spectrum of phosphorus donors introduced in silicon by neutron transmutation 1979
100-101 4 p. 316-
1 p.
artikel
146 A high voltage thin-film transistor 1969
100-101 4 p. 302-
1 p.
artikel
147 A hybrid model for weekday replacements with infant mortality failures Smotherman, Mark
1998
100-101 4 p. 685-688
4 p.
artikel
148 A k-out-of-N:G redundant system with cold standby units and common-cause failures Chung, Who Kee
1984
100-101 4 p. 691-695
5 p.
artikel
149 A k-out-of-n:G redundant vehicle transit system Chung, Who Kee
1989
100-101 4 p. 555-558
4 p.
artikel
150 A k-out-of-N:G three-state unit redundant system with common-cause failures and replacements Chung, Who Kee
1981
100-101 4 p. 589-591
3 p.
artikel
151 Algebraic properties of faults in logic networks 1971
100-101 4 p. 250-
1 p.
artikel
152 Algorithms for coupled transient simulation of circuits and complicated 3D packaging 1996
100-101 4 p. 555-
1 p.
artikel
153 A life cycle cost computation program 1981
100-101 4 p. 618-619
2 p.
artikel
154 A lifetime-cost ratio analysis for determining optimal complete repair strategy Alidrisi, Mustafa M.
1987
100-101 4 p. 647-648
2 p.
artikel
155 A liftoff process using edge detection (LOPED) 1989
100-101 4 p. 656-
1 p.
artikel
156 A linear analytical model for cost vs. repair time Govil, K.K.
1988
100-101 4 p. 649-
1 p.
artikel
157 A line regulator with capacitor -MOSFET-memory for level control on wideband carrier systems over coaxial cables 1974
100-101 4 p. 246-
1 p.
artikel
158 Allocation of test effort for minimum variance of reliability 1978
100-101 4 p. 417-
1 p.
artikel
159 Alloy element additions to gold thick film conductors: effects on indium/lead soldering and ultrasonic aluminum wire bonding 1978
100-101 4 p. 426-427
2 p.
artikel
160 Alloys for GaAs devices 1964
100-101 4 p. 314-
1 p.
artikel
161 All-tantalum wet-slug capacitor overcomes catastrophic failure 1978
100-101 4 p. 413-
1 p.
artikel
162 A low cost master pattern and screen making technique 1969
100-101 4 p. 296-
1 p.
artikel
163 A low damage, low contaminant plasma processing system utilizing energy clean technology 1992
100-101 4 p. 594-595
2 p.
artikel
164 A low-leakage VLSI CMOS/SOS process with thin epilayers 1984
100-101 4 p. 816-
1 p.
artikel
165 A low-noise, process-variation-tolerant double-gate FinFET based sense amplifier Rathod, S.S.
2011
100-101 4 p. 773-780
8 p.
artikel
166 A low temperature co-fired ceramic land grid array for high speed digital applications 1996
100-101 4 p. 546-
1 p.
artikel
167 Aluminium alloy as an interconnecting material in the fabrication of integrated circuits Gupta, Tapan Kumar
1979
100-101 4 p. 337-343
7 p.
artikel
168 Aluminum and aluminum alloy sputter deposition for VLSI 1980
100-101 4 p. 546-
1 p.
artikel
169 Aluminum nitride substates having high thermal conductivity 1987
100-101 4 p. 790-
1 p.
artikel
170 Aluminum wire for thermosonic ball bonding in semiconductor devices 1984
100-101 4 p. 813-
1 p.
artikel
171 A machine service model with a service station consisting of r unreliable units Liu, Bin
1995
100-101 4 p. 683-690
8 p.
artikel
172 A maintenance policy for repairable systems based on opportunistic failure-rate tolerance 1992
100-101 4 p. 587-
1 p.
artikel
173 A masking jig for multiple film deposition 1963
100-101 4 p. 270-271
2 p.
artikel
174 A mass spectrometry study of the evaporation and pyrolysis of polytetrafluorethylene 1969
100-101 4 p. 300-
1 p.
artikel
175 A mathematical approach to reliability evaluation for static generating capacity 1978
100-101 4 p. 314-
1 p.
artikel
176 A matrix approach to calculate the failure frequency and related indices Singh, C.
1979
100-101 4 p. 395-398
4 p.
artikel
177 A mechanism for two-electron capture at deep level defects in semiconductors 1989
100-101 4 p. 663-
1 p.
artikel
178 A metallurgical analysis of stress-corrosion cracking of Kovar package lead 1975
100-101 4 p. 337-
1 p.
artikel
179 A metallurgical basis for the non-destructive wire-bond pull-test 1975
100-101 4 p. 342-
1 p.
artikel
180 A method for comparison of pseudo-random number generators Brkić, D.M.
1992
100-101 4 p. 453-455
3 p.
artikel
181 A method for evaluating all the minimal cuts of a graph 1989
100-101 4 p. 648-
1 p.
artikel
182 A method for fixing criteria of accepting continuous runs 1976
100-101 4 p. 266-
1 p.
artikel
183 A method for predicting VLSI-device reliability using series models for failure mechanisms 1988
100-101 4 p. 654-655
2 p.
artikel
184 A method for the continuous measurement of thickness and deposition rate of conducting films during a vacuum evaporation 1964
100-101 4 p. 316-
1 p.
artikel
185 A method for the determination of the stress in, and Young's modulus of silicon nitride passivation layers 1980
100-101 4 p. 549-
1 p.
artikel
186 A method of redundancy allocation Misra, K.B.
1973
100-101 4 p. 389-393
5 p.
artikel
187 A method of solving redundancy optimization problems 1972
100-101 4 p. 321-
1 p.
artikel
188 A methodology for laser-based thermal diffusivity measurement of advanced multichip module ceramic materials 1997
100-101 4 p. 709-
1 p.
artikel
189 A method to evaluate the electrical stability of TTL gates 1973
100-101 4 p. 276-
1 p.
artikel
190 A microelectronics technical dictionary Anjard, Ronald P
1981
100-101 4 p. 601-604
4 p.
artikel
191 A microelectronics technical dictionary 1982
100-101 4 p. 902-
1 p.
artikel
192 A micromachined array probe card—characterization 1996
100-101 4 p. 549-
1 p.
artikel
193 A micromachined array probe card-fabrication process 1996
100-101 4 p. 545-
1 p.
artikel
194 A micropower complementary-MOS d.c. amplifier 1976
100-101 4 p. 268-
1 p.
artikel
195 A minimizing algorithm for sum of disjoint products 1989
100-101 4 p. 650-
1 p.
artikel
196 A model for IC yield analysis and process control 1987
100-101 4 p. 782-
1 p.
artikel
197 A model for sheet resistivity of RuO2 thick film resistors 1992
100-101 4 p. 597-
1 p.
artikel
198 A model of 1/f noise spectrum generation in granular structures Takagi, Keiji
1999
100-101 4 p. 541-544
4 p.
artikel
199 A model of the p-n junction with exponential doping profile 1973
100-101 4 p. 280-
1 p.
artikel
200 A modern maintainability prediction technique 1982
100-101 4 p. 900-
1 p.
artikel
201 A modified bathtub curve with latent failures 1996
100-101 4 p. 534-
1 p.
artikel
202 A modified Kolmogorov-Smirnov test for Weibull distributions with unknown location and scale parameters 1984
100-101 4 p. 809-
1 p.
artikel
203 A modified reliability expression for the electromigration time-to-failure 1976
100-101 4 p. 265-
1 p.
artikel
204 A modular method for LSI circuits testing 1981
100-101 4 p. 621-
1 p.
artikel
205 A modular neural network approach to microelectronic circuit yield optimization Ilumoka, A.A.
1998
100-101 4 p. 571-580
10 p.
artikel
206 A monolithic integrated circuit processing laboratory for the electronics industry 1968
100-101 4 p. 332-
1 p.
artikel
207 Amorphous BN films produced in a double-plasma reactor for semiconductor applications 1984
100-101 4 p. 820-
1 p.
artikel
208 Amorphous-crystalline silicon beterojunction: theoretical evaluation of the current terms 1990
100-101 4 p. 830-831
2 p.
artikel
209 Amorphous-crystalline silicon isotype heterojunction: electrostatic potential distribution and C(V) curves 1986
100-101 4 p. 796-
1 p.
artikel
210 Amorphous metallic alloys in semiconductor contact metallizations 1984
100-101 4 p. 817-
1 p.
artikel
211 A multichip package utilizing In-Cu flip-chip bonding 1970
100-101 4 p. 320-
1 p.
artikel
212 A multicomponent two-unit cold standby system with three modes 1984
100-101 4 p. 808-
1 p.
artikel
213 A multilayered tantalum thin film structure for R-C circuitry 1968
100-101 4 p. 335-
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214 A multilayer interconnexion system with gold beam leads Gelsing, R.J.
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215 A multiple-disk system for both fault tolerance and improved performance 1988
100-101 4 p. 656-
1 p.
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216 A multi-standby multi-failure mode system with repair and replacement policy 1984
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217 A multistate system under an inspection and repair policy 1987
100-101 4 p. 786-
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218 A multistate system with several failure modes and cold standby units 1981
100-101 4 p. 613-
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219 A multistate system with two repair distributions 1984
100-101 4 p. 810-
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220 A multi-step stress-strength model of a parallel system 1987
100-101 4 p. 783-
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221 An additional space special service facility heterogeneous queue Bansal, K.K.
1995
100-101 4 p. 725-730
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222 An advanced monolithic fm IC for high quality broadcast receivers Avery, L.R.
1977
100-101 4 p. 345-366
22 p.
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223 An AES, SAM and RHEED study of InP (110) subjected to ion bombardment and annealing treatments 1984
100-101 4 p. 823-
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224 An age-wear dependant model of failure 1989
100-101 4 p. 650-
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225 An air-firing base metal resistor and conductor system for low cost thick film circuit manufacture 1982
100-101 4 p. 907-908
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226 An algorithm for enumerating all simple paths in a communication network Misra, R.B.
1979
100-101 4 p. 363-366
4 p.
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227 An algorithm for minimum length fault tests for combinational circuits 1979
100-101 4 p. 306-
1 p.
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228 An algorithm for multiple fault detection in combinational logic networks 1978
100-101 4 p. 315-
1 p.
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229 An algorithm for preventive maintenance policy 1987
100-101 4 p. 786-787
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230 An algorithm to determine wafer flatness 1986
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231 An all-silicon timing circuit for automatic cameras Hart, C.M.
1970
100-101 4 p. 335-340
6 p.
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232 Analog 1/0 hybrids simplify microprocessor interlaces 1978
100-101 4 p. 426-
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233 An alternative approach to a reliability problem Singh, N.
1974
100-101 4 p. 277-279
3 p.
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234 An alternative derivation of the hazard rate 1988
100-101 4 p. 656-
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235 An alternative integrated-circuit yield model 1987
100-101 4 p. 782-
1 p.
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236 Analysis and design of amplifiers and comparators in CMOS 0.35 μm technology Cortes, Fernando Paixão
2004
100-101 4 p. 657-664
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237 Analysis and optimization of recovery procedures in a distributed data base 1981
100-101 4 p. 615-
1 p.
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238 Analysis for mission reliability of a combat tank 1990
100-101 4 p. 826-
1 p.
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239 Analysis of a degraded multistate system with general repair-time distributions 1981
100-101 4 p. 615-
1 p.
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240 Analysis of a digital PSK modulator Bozic, S.M
1980
100-101 4 p. 509-512
4 p.
artikel
241 Analysis of a dynamic redundant system 1978
100-101 4 p. 309-
1 p.
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242 Analysis of a two-engine aeroplane model with two types of failure and preventive maintenance Goel, L.R.
1984
100-101 4 p. 663-666
4 p.
artikel
243 Analysis of a two server-two unit cold standby system with correlated failures and repairs Goel, L.R.
1994
100-101 4 p. 731-734
4 p.
artikel
244 Analysis of a two-unit cold standby system with imperfect assistant repairman and perfect master repairman Rander, M.C.
1992
100-101 4 p. 497-501
5 p.
artikel
245 Analysis of a two-unit maintained series system with imperfect detection of failures Kumar, Ashok
1979
100-101 4 p. 329-331
3 p.
artikel
246 Analysis of a two-unit parallel redundancy with an imperfect switch 1984
100-101 4 p. 809-
1 p.
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247 Analysis of a two-unit parallel redundant system with phase type failure and general repair Ravichandran, N
1981
100-101 4 p. 569-572
4 p.
artikel
248 Analysis of a two unit redundant system with optimum interchangement time Agnihotri, R.K.
1995
100-101 4 p. 749-750
2 p.
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249 Analysis of a two-unit system subject to repair and preventive maintenance with non-linear revenue and costs Gopalan, M.N.
1985
100-101 4 p. 621-623
3 p.
artikel
250 Analysis of a two-unit warm standby system subject to degradation Mokaddis, G.S.
1997
100-101 4 p. 641-647
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251 Analysis of a 2-unit standby redundant system with two types of failures 1979
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252 Analysis of consecutive k-out-of-n: F systems with single repair facility Dinesh Kumar, U.
1997
100-101 4 p. 587-590
4 p.
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253 Analysis of contaminated field failure data for repairable systems 1992
100-101 4 p. 590-
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254 Analysis of digital integrated circuits using charge conservation principle 1988
100-101 4 p. 660-
1 p.
artikel
255 Analysis of epitaxial layer thickness variability in the fabrication of high performance bipolar transistors 1972
100-101 4 p. 326-
1 p.
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256 Analysis of field effect transistors with arbitrary change distribution 1963
100-101 4 p. 257-
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257 Analysis of human contaminants pinpoint sources of IC defects 1988
100-101 4 p. 654-
1 p.
artikel
258 Analysis of leakage currents in CMOS/SOS devices 1984
100-101 4 p. 814-
1 p.
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259 Analysis of long term reliability of plated-through holes in multilayer interconnection boards Part A: Stress analyses and material characterization Vecchio, K.S.
1986
100-101 4 p. 715-732
18 p.
artikel
260 Analysis of long term reliability of plated-through holes in multilayer interconnection boards Part B: Fatigue results and fracture mechanisms Vecchio, K.S.
1986
100-101 4 p. 733-751
19 p.
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261 Analysis of non-catastrophic failures in electronic devices due to random noise 1978
100-101 4 p. 418-
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262 Analysis of one-server n-unit parallel system subject to random service Gopalan, M.N.
1986
100-101 4 p. 651-655
5 p.
artikel
263 Analysis of one-server two-unit parallel system subject to degradation Gopalan, M.N.
1986
100-101 4 p. 657-664
8 p.
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264 Analysis of reliability data for mechanical systems 1992
100-101 4 p. 589-
1 p.
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265 Analysis of space-charge induced negative resistance in linearly graded avalancing silicon p-n junctions 1972
100-101 4 p. 327-
1 p.
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266 Analysis of step-stress accelerated-life-test data: a new approach 1997
100-101 4 p. 696-
1 p.
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267 Analysis of superposition errors in wafer fabrication 1978
100-101 4 p. 422-
1 p.
artikel
268 Analysis of surface mount thermal and thermal stress performance 1984
100-101 4 p. 806-
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269 Analysis of TAB inner lead fatigue in thermal cycle environments 1996
100-101 4 p. 537-
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270 Analysis of the determination of the dimensional offset of conducting layers and MOS transistors 1992
100-101 4 p. 596-
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271 Analysis of thermal characteristics and mechanism of degradation of flip-chip high power LEDs Wang, Chien-Ping
2012
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272 Analysis of two-stage transfer-line production system subject to inter-stage inspection and arbitrary arrival and processing time distributions Gopalan, M.N.
1992
100-101 4 p. 479-482
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273 Analysis of typical fault-tolerant architectures using HARP 1988
100-101 4 p. 657-
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274 Analysis of volatile contaminants in microcircuits 1978
100-101 4 p. 317-
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275 Analysis on a cause of rare contact failure in sealed contacts 1987
100-101 4 p. 783-
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276 Analysis technique for real-time, fault-tolerant, VLSI processing arrays 1996
100-101 4 p. 542-
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277 Analysis tools for microminiaturized circuits 1969
100-101 4 p. 293-
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278 Analytical analysis of nanoscale multiple gate MOSFETs including effects of hot-carrier induced interface charges Djeffal, F.
2009
100-101 4 p. 377-381
5 p.
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279 Analytical solutions for high-dose shallow arsenic profiles in silicon 1986
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280 Analytical techniques for the evaluation of co-precipitated materials Anjard, Ronald P.
1990
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281 Analytic study of a stand-by redundant equipment with switching and shelf life failures Prakash, S.
1973
100-101 4 p. 329-335
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282 Analyzing parametric test structures 1988
100-101 4 p. 659-
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283 An analysis of diffusion process control 1978
100-101 4 p. 420-
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284 An analysis of hardware and software availability exemplified on the IBM 3725 communication controller 1989
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285 An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors Ghadiry, M.
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286 An analytical method for determining intrinsic drain/source resistance of lightly doped drain (LDD) devices 1984
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287 An analytical two dimensional subthreshold behavior model to study the nanoscale GCGS DG Si MOSFET including interfacial trap effects Bentrcia, T.
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288 An anomalous feature on the DLTS spectrum of silicon 1988
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289 An application of an artificial neural network to reliability screen classification from noise measurement Dai, Yisong
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100-101 4 p. 451-453
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290 An application of Kalman techniques to estimating availability 1978
100-101 4 p. 314-
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291 An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact Mattila, T.T.
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100-101 4 p. 785-795
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292 An approach to computer aided design of multilayer hybrids Part I 1980
100-101 4 p. 550-
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293 An approach to optimization of spare parts cost in a multilevel maintenance system by introducing repairable modules into maintenance policy 1981
100-101 4 p. 615-
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294 An approach to quantifying reliability-growth effectiveness 1996
100-101 4 p. 542-
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295 An approximation formula for a class of fault-tolerant computers 1987
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296 An assessment of the thermal performance of the PBGA family 1997
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297 An availability calculation for k-out-of-N redundant system with common-cause failures and replacement 1981
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298 An availability calculation for k-out-of-N redundant system with common-cause failures and replacement Chung, Who Kee
1980
100-101 4 p. 517-519
3 p.
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299 An availability evaluation for computer communication networks 1981
100-101 4 p. 616-
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300 An efficient bottom-up algorithm for enumerating minimal cut sets of fault trees 1980
100-101 4 p. 543-
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301 An efficient multi-layer diagonal router for multi-terminal printed circuit boards 1996
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302 An electronic digital clock using integrated circuits for the data logger scanner and recording annunciator system of a nuclear power reactor 1975
100-101 4 p. 343-344
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303 An electronic ear for certifying reliability 1964
100-101 4 p. 308-
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304 An electron imaging system for the fabrication of integrated circuits 1970
100-101 4 p. 322-
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305 An elementary guide to reliability A.G.O.,
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100-101 4 p. 351-
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306 An empirical procedure for estimating the parameters of a mixed exponential life testing model 1986
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1 p.
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307 An engineer looks at product liability cases 1974
100-101 4 p. 239-
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308 An enhanced integer simplical optimization method for minimum cost spares for k-out-of-n systems 1992
100-101 4 p. 591-
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309 An evaluation of energy transport models for silicon device simulation 1992
100-101 4 p. 596-597
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310 An evaluation of plastic coatings for high reliability microcircuits 1982
100-101 4 p. 895-
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311 An evaluation of techniques for bonding beam-lead devices to gold thick films 1976
100-101 4 p. 268-
1 p.
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312 An evaluation of two model specification techniques for a lognormal distribution 1978
100-101 4 p. 312-
1 p.
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313 An evaluation of weapon system life cycle analysis models 1974
100-101 4 p. 243-
1 p.
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314 An evaluation of Zener diodes to develop screening information 1965
100-101 4 p. 372-
1 p.
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315 A new algorithm for symbolic system reliability analysis 1976
100-101 4 p. 266-
1 p.
artikel
316 A new approach to fault locating T1 repeatered lines 1975
100-101 4 p. 340-
1 p.
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317 A new approach to high volume hermetic hybrid packaging 1980
100-101 4 p. 551-
1 p.
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318 A new approach to machine generation of random variables with any distribution 1978
100-101 4 p. 313-
1 p.
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319 A new approach to memory testing Morgan, M.K.M.
1976
100-101 4 p. 351-353
3 p.
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320 A new approach to optimal redundancy allocation for complex networks Gopal, Krishna
1979
100-101 4 p. 387-390
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321 A new approach to reliability optimization in general modular redundant systems 1979
100-101 4 p. 306-
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322 A new aspect of large-scale integration 1967
100-101 4 p. 327-
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323 A new bonding technique for microwave devices 1997
100-101 4 p. 699-700
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324 A new boron implantation model suitable for analytical modeling of threshold voltage of MOSFETS 1989
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325 A new chip carrier for high performance applications: integrated decoupling capacitor chip carrier (IDCCC) 1984
100-101 4 p. 812-
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326 A new dielectric isolation method using porous silicon 1981
100-101 4 p. 621-
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327 A new electroless method for low-loss microwave integrated circuits 1979
100-101 4 p. 309-
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328 A new etchant for thin films of tantalum and tantalum compounds 1970
100-101 4 p. 325-
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329 A new failure mechanism related to grain growth in drams 1992
100-101 4 p. 589-
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330 A new family of microelectronic packages for avionics 1978
100-101 4 p. 317-
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331 A new family of monolithic A/D converter circuits and their applications Fullagar, David
1976
100-101 4 p. 339-342
4 p.
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332 A new frequency independent attenuator in distributed multilayer thin film microsystem 1984
100-101 4 p. 820-
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333 A new functional device performing a flip-flop circuit function Ambroziak, A.
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100-101 4 p. 343-344
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334 A new generalization of the class of NBU distributions 1986
100-101 4 p. 787-788
2 p.
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335 A new heuristic algorithm for constrained redundancy-optimization in complex systems 1989
100-101 4 p. 651-
1 p.
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336 A new ion dose uniformity measurement technique 1984
100-101 4 p. 825-
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337 A new MagFET-based integrated current sensor highly immune to EMI Aiello, Orazio
2013
100-101 4 p. 573-581
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338 A new measure for time-dependent queueing systems with statistically dependent arrivals Sharda,
1985
100-101 4 p. 651-653
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339 A new method for system reliability bounds Gopal, Krishna
1985
100-101 4 p. 703-708
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340 A new method in the theory of indirect excitons in semiconductors 1976
100-101 4 p. 269-
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341 A new method of the reliability analysis for semiconductor devices 1976
100-101 4 p. 264-
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342 A new method to determine the failure frequency of a complex system 1975
100-101 4 p. 338-
1 p.
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343 A new nonparametric growth model 1989
100-101 4 p. 650-
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344 A new 96 percent improved alumina substrate 1978
100-101 4 p. 426-
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345 A new procedure for eliminating the geometric component from charge pumping: Application for NBTI and radiation issues Tahi, Hakim
2013
100-101 4 p. 513-519
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346 A new production process for thin metal films: High frequency inductive sputtering 1970
100-101 4 p. 325-
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347 A new receiving principle for FM receivers with integrated circuits 1967
100-101 4 p. 336-
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348 A new set of semiconductor equations for computer simulation of submicron devices 1986
100-101 4 p. 792-
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349 A new switching effect in M-I-M thin-film structures at atmospheric pressure 1978
100-101 4 p. 319-
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350 A new technique in minimal path and cut-set evaluation 1986
100-101 4 p. 789-
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351 A new type of diffusion pump boiler for ultrahigh vacuum use 1967
100-101 4 p. 333-
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352 An exact recursion relation solution for the steady-state surface temperature of a general multilayer structure 1996
100-101 4 p. 538-
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353 An experimental and theoretical study of polycrystalline thin film transistor 1982
100-101 4 p. 909-
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354 An experimental computer controlled trunk exchange 1966
100-101 4 p. 359-
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355 An experimental determination of the carrier lifetime near the Si-SiO2 interface 1973
100-101 4 p. 279-
1 p.
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356 An IC medium-power voltage regulator 1969
100-101 4 p. 297-
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357 An improved algorithm for multibridge network reduction 1988
100-101 4 p. 657-
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358 An improved algorithm for symbolic reliability analysis 1992
100-101 4 p. 592-593
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359 An improved interconnection technique Singh, Awater
1980
100-101 4 p. 447-448
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360 An improved minimizing algorithm for the summation of disjoint products by Shannon's expansion Liu, H.H.
1993
100-101 4 p. 599-613
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361 An improved self-aligned silicide process for VLSI 1990
100-101 4 p. 827-
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362 An improved technique for the preparation of thin films of compound semiconductors Arora, R.K.
1986
100-101 4 p. 625-626
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363 An indirect measurement of energy gap for silicon and germanium 1987
100-101 4 p. 790-791
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364 An input-domain based method to estimate software reliability 1997
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365 An inside view of Air Force ground electronic equipment maintenance 1989
100-101 4 p. 651-
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366 An integrated thin-film magnetoresistive device with a hall InSb probe 1974
100-101 4 p. 250-
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367 An interconnect scheme for reducing the number of contact pads on process control chips 1992
100-101 4 p. 596-
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368 An interview with Klaus D. Bowers: very-large-scale integration; very-large-scale benefits 1981
100-101 4 p. 620-
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369 An introduction to generalized stochastic Petri nets Marsan, M.Ajmone
1991
100-101 4 p. 699-725
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370 An introduction to IC testing 1972
100-101 4 p. 323-
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371 An investigation of instability and charge motion in metal-silicon oxide-silicon structures 1966
100-101 4 p. 353-354
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372 An investigation of RF sputter etched silicon surfaces using helium ion backscatter 1975
100-101 4 p. 345-
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373 An investigation of solder joint fatigue using electrical resistance spectroscopy 1996
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374 An investigation of surface at a silicon/silicon oxide interface employing metal-oxide-silicon diodes 1963
100-101 4 p. 257-
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375 An ion implanted bipolar silicon integrated circuit process 1978
100-101 4 p. 428-
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376 An ion milled coplanar SOS technology 1984
100-101 4 p. 813-
1 p.
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377 Anisotropy control in dry etching 1982
100-101 4 p. 902-
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378 Annealing effect of vacuum evaporated InSb thin films 1997
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379 Announcement 1969
100-101 4 p. 277-
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380 Announcement 1973
100-101 4 p. i-
1 p.
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381 Anodic oxidation analysis of thin metallic films and thin-film epitaxy on GaAs 1978
100-101 4 p. 320-
1 p.
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382 Anodic oxides on GaAs II. Anodic Al2O3 and composite oxides on GaAs 1979
100-101 4 p. 311-
1 p.
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383 Anodic tantalum oxide dielectrics prepared from body-centred-cubic tantalum and beta-tantalum films 1968
100-101 4 p. 340-
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384 An O(k3·log( n k )) algorithm for the consecutive-k-out-of-n:F system 1996
100-101 4 p. 538-
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385 Anomalous hall effect and carrier transport in bandtails at the Si-SiO2 interface 1976
100-101 4 p. 270-
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386 A non-aging screen to prevent wearout of ultra-thin dielectrics 1986
100-101 4 p. 782-
1 p.
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387 An O(n·(log 2(n))2) algorithm for computing the reliability of k-out-of-n:G k-to-l-out-of-n:G systems 1996
100-101 4 p. 537-538
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388 A nonparametric approach to progressive stress accelerated life testing 1992
100-101 4 p. 588-
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389 A nonparametric software-reliability growth model 1992
100-101 4 p. 593-
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390 A non-polar thin-film titanium oxide capacitor Lloyd, P.
1968
100-101 4 p. 329-330
2 p.
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391 An optical pattern generator for large area devices and direct wafer stepping 1980
100-101 4 p. 546-
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392 An optimal decision rule for repair vs replacement 1978
100-101 4 p. 417-
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393 An optimal maintenance model using a number of different actions Lam, Yeh
1997
100-101 4 p. 615-622
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394 A normal approximation to distributions of likelihood ratio statistics in life testing, reliability and multivariate analysis of variance Singh, N.
1984
100-101 4 p. 697-706
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395 A normalized analytical solution for the capacitance associated with uniformly doped semiconductors at equilibrium 1984
100-101 4 p. 818-
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396 A note on a lifetime model 1982
100-101 4 p. 900-
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397 A note on determining optimum shape parameter for gamma distribution based on the number of system shocks Ntuen, Celestine A.
1992
100-101 4 p. 577-579
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398 A note on IC-yield statistics 1982
100-101 4 p. 895-
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399 A note on silicon oxide film thickness 1963
100-101 4 p. 258-
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400 A novel active area bumped flip chip technology for convergent heat transfer from gallium arsenide power devices 1996
100-101 4 p. 546-547
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401 A novel decapsulation technique for failure analysis of epoxy molded IC packages with Cu wire bonds Liu, Chien-Pan
2012
100-101 4 p. 725-734
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402 A novel electroless technique for copper metallization of alumina substrates 1984
100-101 4 p. 821-
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403 A novel technique for detecting lithographic defects 1989
100-101 4 p. 657-
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404 A novel thick film resistor system 1972
100-101 4 p. 332-
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405 A novel two-step etching process for reducing plasma-induced oxide damage 1997
100-101 4 p. 704-
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406 An overview of electronic part failure analysis experience 1969
100-101 4 p. 287-
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407 An overview of environmental reliability testing 1997
100-101 4 p. 688-
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408 An overview of IC failure analysis 1989
100-101 4 p. 648-
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409 An overview of silicon growing processes 1974
100-101 4 p. 248-
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410 An overview of today's thick-film technology 1972
100-101 4 p. 329-
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411 An oxide masking technique for use in the fabrication of micro-circuits and allied devices Murphy, C.S.
1963
100-101 4 p. 235-240
6 p.
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412 An uhv system for in situ preparation and analysis of thin films and surfaces 1979
100-101 4 p. 317-
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413 A n-unit redundant system with common-cause failures Chung, Who Kee
1979
100-101 4 p. 377-378
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414 An up-to-date look at thick films 1970
100-101 4 p. 327-
1 p.
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415 AN/UYK-20 computer production reliability test 1980
100-101 4 p. 539-
1 p.
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416 A parallel algorithm for allocation of spare cells on memory chips 1992
100-101 4 p. 593-
1 p.
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417 A perspective on integrated electronics 1970
100-101 4 p. 317-
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418 A philosophy for allocating component reliabilities in a network 1986
100-101 4 p. 781-
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419 A polysilicon-on-oxide (POSOX) isolation structure for bipolar integrated circuits 1988
100-101 4 p. 661-
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420 4720034 Apparatus and method of solder coating integrated circuit leads Lee, JongS
1988
100-101 4 p. 668-
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421 Application and reliability of copper plated through hole printed wiring boards 1980
100-101 4 p. 537-
1 p.
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422 Application boundary-tracking gradient-method for optimizing spares cost for k-out-of-n: G systems 1996
100-101 4 p. 542-
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423 Application of controlled atmosphere IR furnaces to Cerdip sealing 1988
100-101 4 p. 659-660
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424 Application of digital integrated circuits to linear phase detection 1968
100-101 4 p. 347-
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425 Application of engineering in micro-electronic industries G.W.A.D.,
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100-101 4 p. 351-
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426 Application of error-correcting codes in computer reliability studies 1970
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427 Application of flexible printed circuit board (FPCB) in personal computer motherboards: Focusing on mechanical performance Leong, W.C.
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428 Application of fuzzy theory to reliability prediction 1996
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429 Application of hybrid IC's to the automotive electronics market in Europe 1982
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430 Application of integrated circuits to industrial control systems with high-noise environments 1970
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1 p.
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431 Application of ion beam techniques for amorphization and analysis of thin films 1987
100-101 4 p. 795-
1 p.
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432 Application of Kikuchi maps for the indexing of electron diffraction patterns from silicon 1989
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433 Application of Markov chains to the model—building and evaluation of complex satellite telecommunications systems 1981
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434 Application of Markov models for RMA assessment 1987
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435 Application of program graphs and complexity analysis to software development and testing 1980
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436 Application of step stress to time dependent breakdown 1982
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437 Application of the atomic force microscope to integrated circuit reliability and failure analysis 1992
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438 Application of the graphic COM recorder to creation of LSI mask pattern drawings for checking 1974
100-101 4 p. 245-
1 p.
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439 Application of the theory of sets to the problem of the localisation of faults in electronic circuits 1980
100-101 4 p. 542-543
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440 Applications of auger and photoelectron spectroscopy in characterizing IC materials 1980
100-101 4 p. 545-
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441 Applications of excimer lasers in microelectronics 1984
100-101 4 p. 825-
1 p.
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442 Applications of microfocussed ion beams in surface and thin film analysis 1988
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443 Applications of MOS Fet's in microelectronics 1966
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1 p.
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444 Applications of MOS microprogrammable products Shenton, G.D.
1975
100-101 4 p. 361-
1 p.
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445 Applications of photo-etching in the manufacture, interconnection and packaging of microcircuits 1966
100-101 4 p. 358-
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446 Applications of plasma enhanced chemical vapor deposition in VLSI 1986
100-101 4 p. 790-
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447 Applications of scanning electron microscopy to thin film studies on semiconductor devices 1972
100-101 4 p. 334-
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448 Applications of the scanning electron microscope EBIC mode to semiconductor device evaluation and failure analysis 1980
100-101 4 p. 538-
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449 Applications of the scanning electron microscope to solid-state devices 1965
100-101 4 p. 385-
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450 Applied semiconductor integrated circuits 1965
100-101 4 p. 376-
1 p.
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451 Applying new technology in a traditional industry—coal mining 1981
100-101 4 p. 620-
1 p.
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452 Applying photoresist for optimal coatings 1989
100-101 4 p. 656-
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453 Apportionment of overall system reliability among subsystems 1980
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454 Approximate analysis of n-unit cold-standby systems Gopalan, M.N.
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455 Approximate calculation of block replacement with Weibull failure times 1979
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456 Approximate calculation of inspection policy with weibull failure times 1980
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457 Approximate fault-tree analysis with prescribed accuracy 1988
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458 Approximate lower confidence limits for the Weibull reliability function 1978
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459 Approximately optimum confidence bounds on series- and parallel-system reliability for systems with binomial subsystem data 1975
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460 Approximate MLEs for the location and scale parameters of the extreme value distribution with censoring 1992
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461 Approximate MLEs for the location and scale parameters of the half-logistic distribution with type-II right-censoring 1992
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462 A practical approach to thin-film circuits, Part 1 1964
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463 A practical methodology for the statistical design of complex logic producfs for performance 1996
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464 A precise scaling length for depleted regions 1986
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465 A preliminary test estimator of reliability in a life-testing model 1989
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466 A process-compatible electron beam direct write system 1984
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467 A process for ceramic dielectric isolation for integrated circuits 1967
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468 A process for two-layer gold IC metallization 1984
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469 A proposed numerical solution for the diffusion equation 1975
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470 A pruned tree approach to reliability computation 1984
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471 A quantitative physical model for time-dependent breakdown in SiO2 1986
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472 A queueing problem with random memory arrivals and heterogeneous servers Sharda,
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473 A quick method for calculating temperatures arising from the rear cooled heat source geometries found in micro-electronics 1980
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474 A radio frequency sputtering system with non-grounded electrodes for the deposition of metals 1969
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475 A rapid algorithm for reliability optimization of parallel redundant systems 1979
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476 A rational approach to integrated circuit process control 1970
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477 Architectural design of a programmable cell for the implementation of a filter bank on FPGA Louzao, J
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478 Architectures for fault-tolerant spacecraft computers 1979
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479 A realistic project planning prediction technique 1974
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480 A recurrence relation for calculating a reliability increment in a series-parallel system 1992
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481 A recursive algorithm for computing exact reliability measures 1987
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482 A recursive variance-reduction algorithm for estimating communication-network reliability 1997
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483 A reduction technique for obtaining a simplified reliability expression 1978
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484 A redundant system with non-instantaneous switchover and “preparation time” for the repair facility Subramanian, R
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485 A redundant system with non-instantaneous switchover over “preparation time” for the repair facility 1982
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486 A re-examination of practical performance limits of scaled n-channel and p-channel MOS devices for VLSI 1984
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487 A reliability algebra of four-state safety devices Wiggins, Alvin D.
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488 A reliability growth management approach 1980
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489 A reliability model for a k-out-of-N:G redundant system with multiple failure modes and common cause failures Chung, Who Kee
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490 A reliability model for interlayer dielectric cracking during temperature cycling 1992
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491 A reliability problem treated by the additional event method 1975
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492 A reliability simulation approach for use in the design process 1992
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493 A reliability study of a small vehicle Reiche, H.
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494 A reliability study of fuzz button interconnects 1996
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495 A reliable procedure for testing linear regulators with one-sided specification limits based on multiple samples Pearn, W.L
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496 A replacement policy maximizing MTTF of a system with several spare units 1990
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497 A Review of electronics reliability engineering practice 1979
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498 A review of high vacuum deposition apparatus and techniques 1968
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499 A review of integrated circuits in thin-film hybrid technique for digital applications 1969
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500 A review of new methods and attitudes in reliability engineering Blanks, H.S.
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501 A review of 100 per cent X-ray inspection of semiconductors 1965
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502 A review of plasma processing fundamentals 1986
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503 A review of the theory and technology for OHMIC contacts to Group III–V compound semiconductors 1975
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504 A review of two dimensional long channel MOSFET modeling 1981
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505 A revolving multiple electron gun for use in the deposition of thin polymer films 1966
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506 Argon plasma treatment effects on SiSiO2 structures 1989
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507 A rigorous method to evaluate the electrical performance of MCM interconnections in frequency and time domains 1997
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508 Army reliability and maintainability training initiatives 1987
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509 4722084 Array reconfiguration apparatus and methods particularly adapted for use with very large scale integrated circuits Morton, StevenG
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510 Arsenic spin-on source for deep junction formation 1982
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511 Artifical neural network techniques for the estimation of thick-film resistance 1996
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512 A saddle field ion source of spherical configuration for etching and thinning applications 1975
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513 A safety licensable computing architecture G.W.A.D.,
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514 A satellite failure database system 1989
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515 A scientific guide to surface mount technology G.W.A.D.,
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516 A sealed two-level metal system using tungsten 1975
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517 A selection of papers to be published in future issues 1962
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518 A sequential testing procedure for a system's state identification 1975
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519 A shock model for software failures Xie, Min
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520 A simple, analytical model for hot-carrier induced degradation in n-channel MOSFETs Giebel, T.
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521 A simple event-definition notation and associated computer programs 1980
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522 A simple expert system for a mask shop 1988
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523 A simple four-terminal small-signal model of RF MOSFETs and its parameter extraction Je, Minkyu
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524 A simple inexpensive method for thickness measurement of thin films 1989
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525 A simple lower bound for reliability of k-out-of-n:G systems 1996
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526 A simple method for the single or repeated replication of selected areas of surfaces in electron microscopy 1964
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527 A simple method of photomask yield optimization by defect inspection Gupta, S.N.
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528 A simulation-based semiconductor chip yield model incorporating a new defect cluster index Jun, Chi-Hyuck
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529 A single chip 16-bit microprocessor for general application Fox, W.A.
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530 A single-chip 16-bit microprocessor for general application 1976
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531 A single unit multicomponent system subject to various types of failures 1984
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532 A sinusoidal voltage-controlled oscillator for integrated circuits 1969
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533 A small scale silicon epitaxial film deposition system 1979
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534 A solid state store 1966
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535 A solution for melt-level control when growing Czochralski silicon crystals in hemispherical quartz crucibles 1975
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536 Aspects of European and Japanese quality management 1984
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537 Assembly-level reliability: a methodology for effective manufacturing of IC packages 1996
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538 Assembly process automation. Part 2. VLSI design rules 1987
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539 Assessing component reliability and maintenance schedules for attaining tolerable risks of system-malfunction 1981
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540 Assessing the risk of “Kirkendall voiding” in Cu3Sn Borgesen, Peter
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541 Assured reliability in soldered connections 1963
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542 A 180-stage integrated thin-film scan generator 1966
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543 A static RAM with normally-off-type schottky barrier FET's 1974
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544 A statistical model for early detection of increasing failure rates 1978
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545 A strategy for rule verification shrinks LSI layouts 1984
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546 A structured methodology for IC photolithography synthesis in semiconductor manufacturing 1989
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547 A study and implementation of a semiconductor memory board 1976
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548 A study of accelerated life evaluation method 1987
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549 A study of beryllium-hydrogen complexes in silicon 1974
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550 A study of composite Bi2O3, In2O3 and RuO2 planar thick film piezoresistive gauges 1997
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551 A study of grown-in impurities in silicon by deep-level transient spectroscopy 1984
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552 A study of masking properties of SiO2 and photoresists with boron ion implantation 1982
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553 A study of optical noise measurement as a reliability estimation for laser diodes Dai, Yisong
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554 A study of protean systems—Redundancy optimization in consecutive-k-out-of-n:F systems Kalyan, Radha
1990
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555 A study of the imidization kinetics of polyimide resin curing Osredkar, Radko
1988
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556 A study of the linearity between I on and log I off of modern MOS transistors and its application to stress engineering Lau, W.S.
2008
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557 A study of the reliability of microwave transistors 1978
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558 A study of the transport properties of InP/Ga0.47In0.53As modulation doped heterojunctions 1990
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559 A study on failure probability of a system including a protecting device Takagi, Keiji
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560 A successful program for missile reliability 1992
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561 A suggestion of a new measure of system components importance by means of a Boolean difference Ryabinin, I.A.
1994
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562 A summary of optimum replacement policies for a parallel redundant system Yasui, K.
1988
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563 A summary of thin film deposition techniques 1967
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564 A survey of chip joining techniques 1970
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565 A survey of field effect structures 1968
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566 A survey of methods of measuring thin film thicknesses and surface irregularities 1964
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567 A survey of optimization techniques for integrated-circuit design 1982
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568 Asymptotic distribution of a standby system with delayed repair 1980
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569 Asymptotic thermal analysis of electronic packages and printed-circuit boards 1997
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570 A synthesis methodology for AMS/RF circuit reliability: Application to a DCO design Ferreira, Pietro Maris
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571 A system reliability model with classes of failures 1986
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572 A technique for determining the life capability of individual semiconductors 1969
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573 A technique for optimal sequential maintenance scheduling 1982
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574 A test approach for commercial communication satellites 1978
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575 A theoretical analysis of system quality 1972
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576 A theoretical and experimental study of recombination in silicon p-n Junctions 1975
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577 A thick film conductive microline fabrication technique 1986
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578 A thick-film coplanar probe for time domain measurements 1990
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579 A thick-film digital potentiometer 1978
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580 A thin-film transistor with polytetrafluoroethylene as insulator 1980
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581 A thomas-fermi description of the screening around the vacancy in silicon: charge state dependence 1980
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582 A Ti getter pump with evaporation source of TiC on the optimum evaporation condition of titanium 1964
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583 A time error model for time-based PWM pixel with correlated double sample in the circumstance of nonlinear response Xu, Jiangtao
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584 Atomic force microscopy studies of SiGe films and Si/SiGe heterostructures 1997
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585 A tool for aggregate production planning 1987
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586 A truncated sequential test for constant failure rate 1975
100-101 4 p. 340-
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587 A tunable solid-circuit filter suitable for an i.f. amplifier 1964
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588 A two-dimensional placement algorithm for the layout of electronic circuits 1981
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589 A two-dissimilar-unit cold standby system with allowed down time Ramamurthy, K.G.
1982
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590 A two-unit cold standby system with allowed down-time and correlated failures and repairs Goel, L.R.
1992
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591 A two-unit cold standby system with imperfect repair and excessive availability period Shankar Bhat, K.
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592 A two-unit duplicating standby system with correlated failure-repair/vbreplacement times Goel, L.R.
1996
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593 A two-unit parallel redundant system with bivariate exponential lifetimes 1981
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594 A two-unit parallel redundant system with bivariate exponential lifetimes Osaki, Shunji
1980
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595 A two-unit redundant system with different types of failure and “imperfect” repair Subramanian, R.
1990
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596 Audio IC circuits manual G.W.A.D.,
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597 A unification of interface-state generation and hole-injection for hot-carrier-injection stress in low and high-voltage NMOSFET Dai, M.Z.
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598 A unified approach for on-line performance evaluation of CCNs Soi, Inder M.
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599 A unified design methodology for CMOS tapered buffers 1996
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600 A unified domination approach for reliability analysis of networks with arbitrary logic in vertices 1997
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601 A unified treatment of semiconductor boundary value problems 1963
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602 A universal DTL series of medium switching speed in thin-film hybrid technique 1969
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603 A universal series of construction units for digital instruments in thin-film hybrid technique 1968
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604 A universal series of high switching speed in thin-film hybrid technique 1969
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605 Autodoping and particulate contaminations during prediffusion chemical cleaning of silicon wafers 1987
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606 Automated defect detection on patterned wafers 1988
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607 Automated equipment for 100% inspection of photomasks 1978
100-101 4 p. 316-
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608 Automated in-line puddle development of positive photoresists 1982
100-101 4 p. 903-
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609 Automated measurement system for the investigation of surface state distribution 1984
100-101 4 p. 815-
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610 Automated parametric testing of ECL and CML devices 1980
100-101 4 p. 544-
1 p.
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611 Automated photomask inspection 1978
100-101 4 p. 316-317
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612 Automated photomask inspection 1978
100-101 4 p. 316-
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613 Automatic back-end enhances ceramic quad assembly 1988
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614 Automatic control and monitoring system for thin-film deposition 1966
100-101 4 p. 358-
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615 Automatic design of masks: The DESMAG programme 1969
100-101 4 p. 293-
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616 Automatic IC dynamic testers 1969
100-101 4 p. 297-298
2 p.
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617 Automatic IC tester ICMA checks printed circuits 1970
100-101 4 p. 315-
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artikel
618 Automatic mask alignment in MOS/LSI processing 1971
100-101 4 p. 250-251
2 p.
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619 Automatic plotting of masks for hybrid integrated circuits 1969
100-101 4 p. 294-
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620 Automatic process control for VLSI linewidth 1986
100-101 4 p. 792-793
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621 Automatic production system for circuit boards with universal hybrid integrated circuits 1982
100-101 4 p. 909-
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622 Automatic registration in an electron-beam lithographic system 1978
100-101 4 p. 429-
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623 4763066 Automatic test equipment for integrated circuits Yeung, PaulK.K.
1989
100-101 4 p. 666-
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624 Automatic testing of electronic equipment 1969
100-101 4 p. 292-
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625 4500836 Automatic wafer prober with programmable tester interface Staudacher, George
1985
100-101 4 p. 810-
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626 Automatic x-ray alignment system for submicron VLSI lithography 1986
100-101 4 p. 793-
1 p.
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627 Automating inter-equipment transport 1986
100-101 4 p. 793-
1 p.
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628 Automating test generation closes the design loop 1982
100-101 4 p. 903-
1 p.
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629 Automation in CVD wafer processing 1975
100-101 4 p. 342-
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630 Availability analysis for RP-10 nuclear reactor trip module Roca, JoséLuis
1986
100-101 4 p. 611-617
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631 Availability analysis of a N modules parallel system with common memory, central controller and distributed software Lombardi, Fabrizio
1982
100-101 4 p. 887-894
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632 Availability analysis of a repairable system with common-cause failure and one standby unit Mahmoud, M.
1987
100-101 4 p. 741-754
14 p.
artikel
633 Availability analysis of 3-state systems 1986
100-101 4 p. 785-
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634 Availability analysis of systems with two types of repair facilities 1981
100-101 4 p. 613-
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635 Availability analysis of transit systems Dhillon, Balbir S.
1984
100-101 4 p. 761-768
8 p.
artikel
636 Availability analysis of two-unit warm standby system with inspection time 1981
100-101 4 p. 615-
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637 Availability analysis of two-unit warm standby system with inspection time Adachi, Kouichi
1980
100-101 4 p. 449-455
7 p.
artikel
638 Availability models of maintained systems 1975
100-101 4 p. 340-
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artikel
639 Availability of a certain item within a system 1978
100-101 4 p. 418-419
2 p.
artikel
640 Availability of a complex system having shelf-life of the components and common-cause failures Govil, A.K.
1982
100-101 4 p. 685-688
4 p.
artikel
641 Availability of a redundant system with replacement and repair 1980
100-101 4 p. 540-
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artikel
642 Availability of a renewable, checked system 1976
100-101 4 p. 266-
1 p.
artikel
643 Availability of a special 2-unit series system 1979
100-101 4 p. 307-
1 p.
artikel
644 Availability of networks subject to scheduled-maintenance 1980
100-101 4 p. 540-
1 p.
artikel
645 Availability of 2-unit system with preventive maintenance and one repair facility 1978
100-101 4 p. 315-
1 p.
artikel
646 Availability prediction by using a method of simulation 1978
100-101 4 p. 419-
1 p.
artikel
647 Avalanche breakdown of high-voltage p-n junctions of SiC 1997
100-101 4 p. 691-
1 p.
artikel
648 Avalanche breakdown voltage of multiple epitaxial pn junctions 1973
100-101 4 p. 274-
1 p.
artikel
649 Avalanche injection into the oxide in silicon gatecontrolled devices—II. Experimental results 1975
100-101 4 p. 348-
1 p.
artikel
650 Avalanche injection into the oxide in silicon gatecontrolled devices—I. Theory 1975
100-101 4 p. 346-
1 p.
artikel
651 A vapour etching technique for the photolithography of silicon dioxide Holmes, P.J.
1966
100-101 4 p. 337-341
5 p.
artikel
652 A variance minimization method of reliability design 1978
100-101 4 p. 417-
1 p.
artikel
653 A wideband amplitude modulator as a special silicon integrated circuit 1970
100-101 4 p. 321-
1 p.
artikel
654 Band structure, impurity levels and Stark effects in superlattices 1984
100-101 4 p. 818-
1 p.
artikel
655 Base retardation in implanted-diffused transistors 1975
100-101 4 p. 349-
1 p.
artikel
656 Basic requirements of equipments for manufacturing thin-film elements by sputtering 1972
100-101 4 p. 330-
1 p.
artikel
657 Batch fabrication of thin film resistors for hybrid circuitry by electroless deposition of nickel phosphide 1968
100-101 4 p. 336-
1 p.
artikel
658 Bayes estimation in life testing and reliability: A multivariate case Lwin, Thaung
1974
100-101 4 p. 267-276
10 p.
artikel
659 Bayes estimation of reliability under a random environment governed by a Dirichlet prior 1990
100-101 4 p. 825-
1 p.
artikel
660 Bayesian approach to prediction with outliers from the Burr type X model Jaheen, Zeinhum F.
1995
100-101 4 p. 703-705
3 p.
artikel
661 Bayesian confidence bounds for the Weibull failure model 1975
100-101 4 p. 335-
1 p.
artikel
662 Bayesian estimators of exponential parameters utilizing a guessed estimate of location Singh, Rajesh
1993
100-101 4 p. 521-527
7 p.
artikel
663 Bayesian inference on parameter of exponential distribution and its characteristics 1989
100-101 4 p. 648-
1 p.
artikel
664 Bayesian lower bounds on reliability for the lognormal model 1978
100-101 4 p. 314-
1 p.
artikel
665 Bayesian reliability analysis of a series system Sharma, K.K.
1994
100-101 4 p. 761-763
3 p.
artikel
666 Bayesian reliability evaluation of computer systems 1986
100-101 4 p. 787-
1 p.
artikel
667 Bayesian sequential reliability test plans for a series system Sharma, K.K.
1993
100-101 4 p. 463-465
3 p.
artikel
668 Bayesian shrinkage estimation of system reliability with Weibull distribution of components Pandey, M.
1987
100-101 4 p. 625-628
4 p.
artikel
669 Bayes nonparametric estimation of time-dependent failure rate 1986
100-101 4 p. 784-
1 p.
artikel
670 Bayes prediction in exponential life-testing when sample size is a random variable 1987
100-101 4 p. 785-
1 p.
artikel
671 Beam lead mixer and detector diodes for microwave integrated circuit applications 1972
100-101 4 p. 325-
1 p.
artikel
672 Beam-lead sealed-junction ICs: handling and bonding 1970
100-101 4 p. 320-
1 p.
artikel
673 Beam-recrystallized silicon-on-insulator films: can devices live with grain boundaries? 1984
100-101 4 p. 824-
1 p.
artikel
674 Behavioural analysis of a shell gasification and carbon recovery process in a urea fertilizer plant Kumar, S.
1996
100-101 4 p. 477-480
4 p.
artikel
675 Behaviour of CdS thin-film transistors 1964
100-101 4 p. 318-
1 p.
artikel
676 Behaviour of lattice defects in GaAs 1964
100-101 4 p. 314-
1 p.
artikel
677 Behaviour of selenium in gallium arsenide 1964
100-101 4 p. 309-
1 p.
artikel
678 Behaviour of various silicon Schottky barrier diodes under heat treatment 1976
100-101 4 p. 265-
1 p.
artikel
679 Behind the “bathtub”-curve a new model and its consequences 1984
100-101 4 p. 810-
1 p.
artikel
680 Bell jar protection in vacuum metallizing 1968
100-101 4 p. 339-
1 p.
artikel
681 Better bonding methods improve hybrid circuits 1965
100-101 4 p. 381-
1 p.
artikel
682 Better quality, lower costs, through designer-fabricator communication 1966
100-101 4 p. 350-351
2 p.
artikel
683 Bias: a network analysis computer program useful to the reliability engineer 1972
100-101 4 p. 322-
1 p.
artikel
684 Bias-HAST on tape ball grid array (TBGA) test pattern Yeung, N.H.
2004
100-101 4 p. 595-602
8 p.
artikel
685 Bias sputtering: its techniques and applications 1967
100-101 4 p. 336-
1 p.
artikel
686 Bibliography of literature on failure data Dhillon, B.S.
1990
100-101 4 p. 723-750
28 p.
artikel
687 Bibliography of literature on medical equipment reliability 1981
100-101 4 p. 615-
1 p.
artikel
688 Bibliography of literature on telecommunication systems reliability Dhillon, Balbir S.
1985
100-101 4 p. 715-727
13 p.
artikel
689 Bibliography on redundancy techniques 1963
100-101 4 p. 247-251
5 p.
artikel
690 Bi-CMOS: combination circuit offers economy and power 1989
100-101 4 p. 658-
1 p.
artikel
691 Bidirectional blocking junctions in SOI 1989
100-101 4 p. 658-
1 p.
artikel
692 Bidirectional electrochemical trimming of thick film resistors 1968
100-101 4 p. 336-337
2 p.
artikel
693 Bipolar PROM reliability Hnatek, Eugene R.
1978
100-101 4 p. 325-332
8 p.
artikel
694 Bipolar silicon power is crucial to communications systems 1984
100-101 4 p. 816-
1 p.
artikel
695 14-bit s-d converter gets smaller 1980
100-101 4 p. 548-
1 p.
artikel
696 Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP) Zhang, Xiaowu
2008
100-101 4 p. 602-610
9 p.
artikel
697 Board testing meets the challenges of ECL 1982
100-101 4 p. 902-
1 p.
artikel
698 Bonding techniques for microelectronics 1968
100-101 4 p. 345-
1 p.
artikel
699 Book review 1999
100-101 4 p. 545-546
2 p.
artikel
700 Book review 1999
100-101 4 p. 547-
1 p.
artikel
701 Book review: Intellectual property protection in VLSI designs: Theory and practice, Hardcover, pp. 183, plus XIX, 106 euro, Kluwer Academic Publishers, Boston, 2003, ISBN 1-4020-7320-8 Qu, Gang
2004
100-101 4 p. 705-706
2 p.
artikel
702 Boolean difference techniques for time-sequence and common-cause analysis of fault-trees 1986
100-101 4 p. 786-
1 p.
artikel
703 Boron diffusion in polycrystalline silicon layers 1975
100-101 4 p. 347-
1 p.
artikel
704 Boron tribromide as a diffusion source 1975
100-101 4 p. 345-
1 p.
artikel
705 Borophosphosilicate glasses for integrated circuits 1986
100-101 4 p. 792-
1 p.
artikel
706 Boundary conditions for the space-charge region of a p-n junction 1969
100-101 4 p. 298-
1 p.
artikel
707 Breakdown in ceramic capacitors under pulsed high-voltage stress 1979
100-101 4 p. 305-
1 p.
artikel
708 Breakdown in SiO2 films in VLSI MOS structures 1990
100-101 4 p. 830-
1 p.
artikel
709 Breakdown phenomena in silicon semiconductor devices 1965
100-101 4 p. 376-
1 p.
artikel
710 Breakdown voltages of germanium plane-cylindrical junctions 1965
100-101 4 p. 379-
1 p.
artikel
711 British standard BS 5760 G.W.A.D.,
1986
100-101 4 p. 780-
1 p.
artikel
712 Broadening of the Si doping layer in planar-doped GaAs in the limit of high concentrations 1992
100-101 4 p. 597-
1 p.
artikel
713 BS9000 components and reliability quality factors: suggested use of MIL-HDBK-217C factors based on a comparative product assurance analysis 1982
100-101 4 p. 895-
1 p.
artikel
714 B-test of homogeneity Brkich, D.M.
1987
100-101 4 p. 639-641
3 p.
artikel
715 Bubble memory as small mass storage 1978
100-101 4 p. 422-423
2 p.
artikel
716 Bubble memory as small mass storage Juliussen, J.Egil
1977
100-101 4 p. 427-430
4 p.
artikel
717 Building-in reliability: making it work 1992
100-101 4 p. 589-
1 p.
artikel
718 Bulk charge effects in VLSI MOSFETs 1982
100-101 4 p. 902-
1 p.
artikel
719 Bulk charge effects in VLSI MOSFETs 1982
100-101 4 p. 902-
1 p.
artikel
720 Bulk electromigration reliability tests of large-grained aluminum lines with regard to semiconductor contacts 1987
100-101 4 p. 781-
1 p.
artikel
721 Buried injector logic, a vertical IIL using deep ion implantation 1989
100-101 4 p. 659-
1 p.
artikel
722 Burn-in effectiveness—theory and measurement 1992
100-101 4 p. 590-
1 p.
artikel
723 Burn-in of incandescent sign lamps 1987
100-101 4 p. 782-
1 p.
artikel
724 Burn-in optimization under reliability and capacity restrictions 1990
100-101 4 p. 826-
1 p.
artikel
725 Bus-invert coding low-power I/O 1996
100-101 4 p. 556-
1 p.
artikel
726 Busy period analysis of a two-unit warm standby system with imperfect switch Garg, Rajiv
1985
100-101 4 p. 675-679
5 p.
artikel
727 CAD/CAM for microwave assemblies 1987
100-101 4 p. 790-
1 p.
artikel
728 CAD tools must change to meet the needs of VLSI 1982
100-101 4 p. 902-
1 p.
artikel
729 Calculating the cost of testing LSI chips 1978
100-101 4 p. 419-420
2 p.
artikel
730 Calculation of avalanche breakdown voltages of silicon p-n junctions 1967
100-101 4 p. 324-
1 p.
artikel
731 Calculation of confidence limits for MTBF and λ 1971
100-101 4 p. 287-290
4 p.
artikel
732 Calculation of coverage parameter 1988
100-101 4 p. 656-
1 p.
artikel
733 Calculation of electrical parameters of a thin-film multichip package 1990
100-101 4 p. 831-
1 p.
artikel
734 Calculation of system reliability by algebraic manipulation of probability expressions 1980
100-101 4 p. 543-
1 p.
artikel
735 Calculation of the attenuation error of a ladder network with respect to the adjustment tolerances of tantalum nitride resistors Grange, J.M.
1968
100-101 4 p. 321-327
7 p.
artikel
736 Calculations of systems unreliability by algebraic manipulation of failure event Hasanuddin Ahmad, S.
1984
100-101 4 p. 793-799
7 p.
artikel
737 Calendar 2009
100-101 4 p. I-III
nvt p.
artikel
738 Calendar 2010
100-101 4 p. I-III
nvt p.
artikel
739 Calendar of forthcoming events 2003
100-101 4 p. I-IX
nvt p.
artikel
740 Calendar of international conferences, symposia, lectures and meetings of interest 1995
100-101 4 p. 773-776
4 p.
artikel
741 Calendar of international conferences, symposia, lectures and meetings of interest 1991
100-101 4 p. 813-815
3 p.
artikel
742 Calendar of international conferences, symposia, lectures and meetings of interest 1990
100-101 4 p. 813-816
4 p.
artikel
743 Calendar of international conferences, symposia, lectures and meetings of interest 1989
100-101 4 p. 461-465
5 p.
artikel
744 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1986
100-101 4 p. 605-607
3 p.
artikel
745 Calendar of international conferences, symposia, lectures and meetings of interest 1984
100-101 4 p. 599-603
5 p.
artikel
746 Calendar of international conferences, symposia, lectures and meetings of interest 1985
100-101 4 p. 607-610
4 p.
artikel
747 Calendar of international conferences, symposia, lectures and meetings of interest 1981
100-101 4 p. 479-481
3 p.
artikel
748 Calendar of international conferences, symposia, lectures and meetings of interest 1978
100-101 4 p. 293-295
3 p.
artikel
749 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1971
100-101 4 p. 231-233
3 p.
artikel
750 Calendar of international conferences, symposia, lectures and meetings of interest 1969
100-101 4 p. 279-280
2 p.
artikel
751 Calendar of international conferences, symposia, lectures and meetings of interest 1980
100-101 4 p. 393-395
3 p.
artikel
752 Calendar of international conferences, symposia, lectures and meetings of interest 1972
100-101 4 p. 307-309
3 p.
artikel
753 Calendar of international conferences, symposia, lectures and meetings of interest 1976
100-101 4 p. 251-253
3 p.
artikel
754 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1973
100-101 4 p. 255-256
2 p.
artikel
755 Calendar of international conferences, symposia, lectures and meetings of interest 1978
100-101 4 p. 405-407
3 p.
artikel
756 Calendar of international conferences, symposia, lectures and meetings of interest 1975
100-101 4 p. 325-326
2 p.
artikel
757 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1970
100-101 4 p. 301-303
3 p.
artikel
758 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1974
100-101 4 p. 233-234
2 p.
artikel
759 Calendar of international conferences, symposia, lectures and meetings of interest 1979
100-101 4 p. 287-289
3 p.
artikel
760 Calendar of international conference, symposia, lectures and meetings of interest 1996
100-101 4 p. 577-579
3 p.
artikel
761 Calender 2001
100-101 4 p. I-VI
nvt p.
artikel
762 CALHYM: A computer program for the automatic layout of large digital hybrid microcircuits 1978
100-101 4 p. 422-
1 p.
artikel
763 Call for papers 1995
100-101 4 p. 763-772
10 p.
artikel
764 Call for papers 1970
100-101 4 p. 305-
1 p.
artikel
765 Call for papers 1969
100-101 4 p. 278-
1 p.
artikel
766 Calls for papers 1972
100-101 4 p. 317-
1 p.
artikel
767 Calls for papers 1971
100-101 4 p. 245-246
2 p.
artikel
768 Can burn-in screen wear out mechanisms?: Reliability modelling of defective subpopulations—a case study 1992
100-101 4 p. 591-
1 p.
artikel
769 Can plastic semiconductor devices and microcircuits be used in military equipment 1974
100-101 4 p. 240-241
2 p.
artikel
770 Capacitance between thin film conductors deposited on a high dielectric constant substrate 1963
100-101 4 p. 259-
1 p.
artikel
771 Capacitance of MOS diodes on substrates doped non-uniformly near the surface 1976
100-101 4 p. 270-
1 p.
artikel
772 Capacitive keys, simpler circuits add up to reliable keyboard 1971
100-101 4 p. 252-
1 p.
artikel
773 Capacitors of thin insulating films of photoresist materials Singh, Awatar
1978
100-101 4 p. 441-444
4 p.
artikel
774 Capacitors with thin oxide film dielectrics 1965
100-101 4 p. 384-385
2 p.
artikel
775 Capture cross-section of excitons on neutral indium impurities in silicon 1978
100-101 4 p. 425-
1 p.
artikel
776 Carbon contamination of ion implanted layers 1987
100-101 4 p. 794-795
2 p.
artikel
777 Carrier and socket technology for high pin count WEP packages 1996
100-101 4 p. 552-
1 p.
artikel
778 Carrier density dependence of Auger recombination 1979
100-101 4 p. 312-
1 p.
artikel
779 Carrier lifetime in (Al, Ga)As epilayers and double heterostructure lasers grown with metal-organic vapour-phase epitaxy and liquid-phase epitaxy 1984
100-101 4 p. 817-
1 p.
artikel
780 Carrier mobility and current saturation in the MOS transistor 1965
100-101 4 p. 377-
1 p.
artikel
781 Carrier mobility in silicon MOSTs 1970
100-101 4 p. 323-
1 p.
artikel
782 Case histories in the field of microelectronic packaging 1964
100-101 4 p. 309-
1 p.
artikel
783 Case study: the design of a mixed-signal global positioning system receiver using multichip module packaging 1997
100-101 4 p. 703-
1 p.
artikel
784 C-4/CBGA comparison with other MLC single chip package alternates 1996
100-101 4 p. 557-
1 p.
artikel
785 CCD — A replacement for drum stores Kornstein, Howard
1976
100-101 4 p. 343-345
3 p.
artikel
786 CCD memory circuits of highest packing density—Technological and electrical improvements Doering, E.
1977
100-101 4 p. 419-425
7 p.
artikel
787 CDI—its capability and application 1975
100-101 4 p. 343-
1 p.
artikel
788 CDI, the bipolar LSI technology with total systems integration capability 1976
100-101 4 p. 269-
1 p.
artikel
789 CDI, the bipolar LSI technology with total systems integration capability Krebs, P.
1975
100-101 4 p. 385-386
2 p.
artikel
790 CDMA bus-based on-chip interconnect infrastructure Nikolic, Tatjana
2009
100-101 4 p. 448-459
12 p.
artikel
791 Centralized supervisory and control equipment using multimicroprocessor 1978
100-101 4 p. 315-
1 p.
artikel
792 Ceramic capacitors for hybrid integrated circuits 1969
100-101 4 p. 296-
1 p.
artikel
793 4552267 Ceramic semiconductor package chip prevention structure and method Layher, FrancisW
1986
100-101 4 p. 800-
1 p.
artikel
794 Ceramics for packaging 1971
100-101 4 p. 251-
1 p.
artikel
795 Certain mathematical methods of investigating the reliability and stability of thermionic tube parameters 1972
100-101 4 p. 321-
1 p.
artikel
796 CF4/O2 plasma accelerated aluminum metallization corrosion in plastic encapsulated ICs in the presence of contaminated die attach epoxies 1982
100-101 4 p. 897-
1 p.
artikel
797 Chalcogenide glass threshold switch 1973
100-101 4 p. 277-
1 p.
artikel
798 Changes in thick-film resistor values due to substrate flexure Holmes, P.J.
1973
100-101 4 p. 395-396
2 p.
artikel
799 Changes of mobility along a depletion type MOS transistor channel 1971
100-101 4 p. 254-
1 p.
artikel
800 Changing market realities enhance the appeal of ASICs 1987
100-101 4 p. 787-
1 p.
artikel
801 Characterisation of series resistance degradation through charge pumping technique Manhas, S.K
2003
100-101 4 p. 617-624
8 p.
artikel
802 Characteristics and analysis of instability induced by secondary slow trapping in scaled CMOS devices 1984
100-101 4 p. 817-
1 p.
artikel
803 Characteristics and applications of bias sputtering 1971
100-101 4 p. 256-
1 p.
artikel
804 Characteristics of insulator diodes determined by space-charge and diffusion 1964
100-101 4 p. 311-
1 p.
artikel
805 Characteristics of metal-oxide-semiconductor (MOS) device with Er metal gate on SiO2 film Choi, Chel-Jong
2009
100-101 4 p. 463-465
3 p.
artikel
806 Characteristics of PIN junctions produced by ion-drift techniques in silicon 1963
100-101 4 p. 257-
1 p.
artikel
807 Characteristics of r.f. sputtered barium titanate thin films 1972
100-101 4 p. 333-
1 p.
artikel
808 Characteristics of silicon p-n junctions formed by sodium and cesium ion bombardment 1965
100-101 4 p. 375-
1 p.
artikel
809 Characteristics of Sn8Zn3Bi solder joints and crack resistance with various PCB and lead coatings Lee, Young Woo
2008
100-101 4 p. 631-637
7 p.
artikel
810 Characteristics of the dielectric diode and triode at very high frequencies 1964
100-101 4 p. 319-
1 p.
artikel
811 Characterization and evaluation of the underfill encapsulants for flip chip assembly 1996
100-101 4 p. 551-
1 p.
artikel
812 Characterization and morphology of chemical vapour deposition of silicon 1979
100-101 4 p. 315-
1 p.
artikel
813 Characterization of beta, binomial, and Poisson distributions 1992
100-101 4 p. 592-
1 p.
artikel
814 Characterization of distributions by relationships between failure rate and mean residual life 1996
100-101 4 p. 537-
1 p.
artikel
815 Characterization of electron traps in aluminium-implanted SiO2 1978
100-101 4 p. 321-
1 p.
artikel
816 Characterization of fatigued Al lines by means of SThM and XRD: Analysis using fast Fourier transform Szeloch, R.F.
2012
100-101 4 p. 711-717
7 p.
artikel
817 Characterization of fault recovery through fault injection on FTMP 1988
100-101 4 p. 657-
1 p.
artikel
818 Characterization of heteroepitaxial silicon on sapphire by UV reffectometry 1986
100-101 4 p. 795-
1 p.
artikel
819 Characterization of high-dose implants of Co and Cr in Si by RBS 1992
100-101 4 p. 598-
1 p.
artikel
820 Characterization of interface state density of three-dimensional Si nanostructure by charge pumping measurement Dou, Chunmeng
2014
100-101 4 p. 725-729
5 p.
artikel
821 Characterization of inverse gaussian and inverted gamma distributions Jaisingh, Lloyd R.
1990
100-101 4 p. 775-780
6 p.
artikel
822 Characterization of ion implanted silicon—applications for IC process control 1984
100-101 4 p. 823-
1 p.
artikel
823 Characterization of localized defects in dielectric films for electron devices 1974
100-101 4 p. 241-
1 p.
artikel
824 Characterization of properties of nickel in silicon using thermally stimulated capacitance method 1978
100-101 4 p. 425-
1 p.
artikel
825 Characterization of Se implanted layers for GaAs FETS 1984
100-101 4 p. 824-
1 p.
artikel
826 Characterization of silicon wafers by transient microwave photo-conductivity measurements 1992
100-101 4 p. 594-
1 p.
artikel
827 Characterization of the thermal behaviour in ICs 1992
100-101 4 p. 583-
1 p.
artikel
828 Characterization of thick-film compositions on RCA porcelain-coated steel substrates 1982
100-101 4 p. 908-
1 p.
artikel
829 Characterization on phosphorus implanted low pressure chemical vapor deposited polycrystalline silicon 1980
100-101 4 p. 550-
1 p.
artikel
830 Characterizations of the Markov-Bernoulli geometric distribution Yehia, A.Y.
1993
100-101 4 p. 497-499
3 p.
artikel
831 Charge build-up in MOS system under ionizing radiation 1981
100-101 4 p. 621-
1 p.
artikel
832 Charge build-up in mos system under ionizing radiation Srivastava, Swaraj
1980
100-101 4 p. 529-531
3 p.
artikel
833 Charge coupled devices and analogue signal processing Vanstone, G.F.
1975
100-101 4 p. 367-
1 p.
artikel
834 Charge coupled devices, today and for the future Burt, D.J.
1975
100-101 4 p. 379-381
3 p.
artikel
835 Charge generation in thin SiO2 polysilicon-gate MOS capacitors 1988
100-101 4 p. 661-
1 p.
artikel
836 Charge neutrality and the internal electric field produced by impurity diffusion 1980
100-101 4 p. 549-
1 p.
artikel
837 Charge storage effects in silicon dioxide films 1965
100-101 4 p. 376-
1 p.
artikel
838 Charge trapping and dielectric breakdown in MOS devices in 77–400 K temperature range 1990
100-101 4 p. 830-
1 p.
artikel
839 Check sum computer memory fault detection 1981
100-101 4 p. 618-
1 p.
artikel
840 Check your logic behaviour with automatic test generation 1973
100-101 4 p. 275-
1 p.
artikel
841 Chemical analysis of electronic gases and volatile reagents for device processing 1986
100-101 4 p. 791-
1 p.
artikel
842 Chemically vapor deposited polycrystalline-silicon films 1975
100-101 4 p. 344-345
2 p.
artikel
843 Chemical potential shift in Si(100) MOS structure induced by submillimeter radiation 1990
100-101 4 p. 830-
1 p.
artikel
844 Chemical-reaction engineering in the semiconductor industry 1974
100-101 4 p. 249-
1 p.
artikel
845 Chemical shift parameters for shallow donors in semiconductors 1973
100-101 4 p. 280-
1 p.
artikel
846 Chemical vapour deposition of indium phosphide 1979
100-101 4 p. 315-
1 p.
artikel
847 Chemical vapour deposition of silicon dioxide films 1970
100-101 4 p. 324-
1 p.
artikel
848 Chemisorption and resistance changes in zirconium films formed by vapour condensation 1963
100-101 4 p. 260-
1 p.
artikel
849 Chip carriers are making inroads 1978
100-101 4 p. 420-
1 p.
artikel
850 Chip corrosion in plastic packages 1981
100-101 4 p. 611-
1 p.
artikel
851 Chip market overestimated, says ITT 1980
100-101 4 p. 545-
1 p.
artikel
852 4503386 Chip partitioning aid (CPA)—A structure for test pattern generation for large logic networks DasGupta, Sumit
1985
100-101 4 p. 812-
1 p.
artikel
853 Chip resistors gain support 1982
100-101 4 p. 910-
1 p.
artikel
854 Chip Scale Package (CSP) solder joint reliability and modeling Amagai, M.
1999
100-101 4 p. 463-477
15 p.
artikel
855 Chip technology for crystal units and oscillators 1988
100-101 4 p. 661-
1 p.
artikel
856 4768195 Chip tester Stoner, DonaldW
1989
100-101 4 p. 669-
1 p.
artikel
857 Chip trimmer capacitors: the latest technology and product trends 1988
100-101 4 p. 660-
1 p.
artikel
858 Chip trimmer potentiometer for flow/reflow soldering 1988
100-101 4 p. 660-
1 p.
artikel
859 Chip trio simplifies precise position control 1982
100-101 4 p. 905-
1 p.
artikel
860 Chip warpage model for reliability prediction of delamination failures Yang, Se Young
2012
100-101 4 p. 718-724
7 p.
artikel
861 CHMOS improves system efficiency 1984
100-101 4 p. 814-
1 p.
artikel
862 Choosing between parametric test instruments and systems 1989
100-101 4 p. 653-
1 p.
artikel
863 Chromatography as a tool in the characterization and quality control of resist materials 1986
100-101 4 p. 793-
1 p.
artikel
864 Circuit redundancy as an aid to making functioning cryotron circuits Longden, Maureen
1964
100-101 4 p. 239-251
13 p.
artikel
865 Circuit simulation by computer 1973
100-101 4 p. 276-
1 p.
artikel
866 Classification of reliability tests Tomášek, Karel F.
1972
100-101 4 p. 361-367
7 p.
artikel
867 Class 10 robots in PECVD processing 1989
100-101 4 p. 654-
1 p.
artikel
868 Cleaning techniques for wafer surfaces 1988
100-101 4 p. 659-
1 p.
artikel
869 Clean rooms for VLSI fabrication 1986
100-101 4 p. 791-
1 p.
artikel
870 Clock distribution in application specific integrated circuits 1988
100-101 4 p. 660-
1 p.
artikel
871 Closed-form solution for lifetime distribution of single-component failure delay systems Limnios, N.
1990
100-101 4 p. 781-784
4 p.
artikel
872 Closed-form solution for system availability distribution 1988
100-101 4 p. 655-656
2 p.
artikel
873 Closed-loop job release control for VLSI circuit manufacturing 1989
100-101 4 p. 656-
1 p.
artikel
874 Closely packed microstrip lines as very high-speed chip-to-chip interconnects 1989
100-101 4 p. 656-
1 p.
artikel
875 Clustering VAX superminicomputers into large multiprocessor systems 1984
100-101 4 p. 815-
1 p.
artikel
876 CMOS active and field device fabrication 1989
100-101 4 p. 656-
1 p.
artikel
877 CMOS an alternative to TTL? Compton, J.
1975
100-101 4 p. 357-
1 p.
artikel
878 CMOS comes of age 1981
100-101 4 p. 621-
1 p.
artikel
879 CMOS contacts and interconnects 1989
100-101 4 p. 653-
1 p.
artikel
880 CMOS hot carrier protection with LDD 1989
100-101 4 p. 663-
1 p.
artikel
881 CMOS in today's economic climate Henderson, R.S.
1975
100-101 4 p. 355-
1 p.
artikel
882 CMOS multiplex data communication offers advantages in different applications 1975
100-101 4 p. 343-
1 p.
artikel
883 C-MOS on sapphire sparks small computer's performance 1979
100-101 4 p. 309-
1 p.
artikel
884 C-MOS op amp offsets errors with continuous sampling technique 1979
100-101 4 p. 309-
1 p.
artikel
885 CMOS, present and future 1980
100-101 4 p. 545-
1 p.
artikel
886 C-MOS process reduces chip size as much as a third 1984
100-101 4 p. 814-
1 p.
artikel
887 C-MOS PROM density hits 16-K 1982
100-101 4 p. 905-
1 p.
artikel
888 CMOS regenerative logic circuits 1984
100-101 4 p. 815-
1 p.
artikel
889 CMOS scaling into the 21st century: 0.1 μm and beyond 1996
100-101 4 p. 543-
1 p.
artikel
890 CMOS uncommitted logic arrays are part-digital, part-analog 1981
100-101 4 p. 621-
1 p.
artikel
891 Cohesive fracture mechanics based numerical analysis to BGA packaging and lead free solders under drop impact Yao, Yao
2013
100-101 4 p. 629-637
9 p.
artikel
892 Collector diffusion isolated integrated circuits 1970
100-101 4 p. 324-
1 p.
artikel
893 Color television swinging to in-line tubes as complex ICs widen consumer market 1973
100-101 4 p. 277-
1 p.
artikel
894 Combined environment reliability test (CERT) 1978
100-101 4 p. 417-
1 p.
artikel
895 Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components Chen, Y.S.
2008
100-101 4 p. 638-644
7 p.
artikel
896 Comment on: reliability modelling and performance of variable link-capacity networks 1997
100-101 4 p. 695-
1 p.
artikel
897 Comment on “study of acceleration factor on moisture resistance test of plastic encapsulated semiconductor devices” Fokkens, K.
1989
100-101 4 p. 481-
1 p.
artikel
898 Comment on “The nonhomogeneous Poisson process—a model for the reliability of complex repairable systems” Ascher, H.
1990
100-101 4 p. 807-808
2 p.
artikel
899 Comments on “Some considerations in the formulation of IC yield statistics” 1981
100-101 4 p. 610-
1 p.
artikel
900 Comments on the Lapp-Powers “computer-aided synthesis of fault trees” 1980
100-101 4 p. 540-
1 p.
artikel
901 Comments on ‘Thin film metallization studies and device lifetime prediction using Al-Si and Al-Cu-Si conductor test bars’ Danso, K.A.
1982
100-101 4 p. 837-840
4 p.
artikel
902 Commercial product software reliability assessment 1987
100-101 4 p. 785-
1 p.
artikel
903 Common-cause failure analysis of a three-state device system Dhillon, Balbir S.
1979
100-101 4 p. 345-348
4 p.
artikel
904 Common-cause failures in repairable systems 1989
100-101 4 p. 651-
1 p.
artikel
905 Common-cause outages in multiple circuit transmission lines 1978
100-101 4 p. 314-
1 p.
artikel
906 Compact non-local modelling of impact ionization in SOI MOSFETs for optimal CMOS device/circuit design 1997
100-101 4 p. 704-
1 p.
artikel
907 Comparative redundancy, an alternative to triple modular redundant system design Philp, Kenneth W.
1997
100-101 4 p. 581-585
5 p.
artikel
908 Comparative studies of vibrational reliability of electron-conductive adhesive and soldered microjoints 1989
100-101 4 p. 656-
1 p.
artikel
909 Comparing the importance of system components by some structural characteristics 1997
100-101 4 p. 691-
1 p.
artikel
910 Comparison between state probabilities and availabilities of four-state and five-state models using Laplace transform and matrix multiplication methods Qamber, Isa
1994
100-101 4 p. 669-688
20 p.
artikel
911 Comparison of age, block, and failure replacement policies 1978
100-101 4 p. 313-
1 p.
artikel
912 Comparison of arc erosive and laser beam trimming of thin film resistors 1978
100-101 4 p. 426-
1 p.
artikel
913 Comparison of confidence intervals for the parameters of the Weibull and extreme value distributions 1987
100-101 4 p. 786-
1 p.
artikel
914 Comparison of dry film and liquid photo-imageable solder masks for surface-mount assemblies 1988
100-101 4 p. 659-
1 p.
artikel
915 Comparison of MTBF in the parallel string configuration and the quad configuration systems Yamashiro, Mitsuo
1992
100-101 4 p. 557-559
3 p.
artikel
916 Comparison of new technologies for VLSI: possibilities and limitations 1982
100-101 4 p. 902-
1 p.
artikel
917 Comparison of the conventional and extended WKB approximations for tunneling in semiconductors 1990
100-101 4 p. 831-
1 p.
artikel
918 Comparison of the McClure and Mcllraith type ion sources 1979
100-101 4 p. 318-
1 p.
artikel
919 Comparison of two stochastic alternative phase models Moafi B., S.E.
1993
100-101 4 p. 501-507
7 p.
artikel
920 Comparison of two wafer inspection methods for particle monitoring in semiconductor manufacturing 1989
100-101 4 p. 657-
1 p.
artikel
921 Comparisons and applications of various types of hybrid circuits 1965
100-101 4 p. 374-
1 p.
artikel
922 Compatibility between thin and thick film techniques 1971
100-101 4 p. 256-
1 p.
artikel
923 Compatibility in monolithic integrated circuits 1967
100-101 4 p. 327-
1 p.
artikel
924 Compatible techniques for integrated circuits 1963
100-101 4 p. 258-
1 p.
artikel
925 Compensating for built-in test failures 1987
100-101 4 p. 786-
1 p.
artikel
926 Complementary-MOS low-power, low-voltage integrated binary counter 1970
100-101 4 p. 321-
1 p.
artikel
927 Complete exploration of the silicon gap at the Si-SiO2 interface of MIS tunnel diodes using the conductance technique at various temperatures and illumination levels 1986
100-101 4 p. 795-
1 p.
artikel
928 Complex hybrid integrated circuits 1968
100-101 4 p. 346-
1 p.
artikel
929 Complex system reliability with general repair time distributions under preemptive resume repair discipline Gupta, P.P.
1973
100-101 4 p. 351-356
6 p.
artikel
930 Complex system reliability with imperfect switching under preemptive-resume repair 1978
100-101 4 p. 309-
1 p.
artikel
931 Complex two-unit system with preventive maintenance Subramanian, R
1981
100-101 4 p. 559-567
9 p.
artikel
932 Component failure cost 1980
100-101 4 p. 537-
1 p.
artikel
933 Component failure rates from field studies 1974
100-101 4 p. 241-
1 p.
artikel
934 Component failures predicted by infra-red 1963
100-101 4 p. 255-
1 p.
artikel
935 Component-placement optimization for convectively cooled electronics 1990
100-101 4 p. 825-
1 p.
artikel
936 Component redundancy vs system redundancy in the hazard rate ordering 1997
100-101 4 p. 695-
1 p.
artikel
937 Component relevancy in multistate reliability models 1992
100-101 4 p. 592-
1 p.
artikel
938 Component reliability—a survey 1963
100-101 4 p. 254-
1 p.
artikel
939 Component reliability exposed to thermal neutron environment—I 1978
100-101 4 p. 415-
1 p.
artikel
940 Component reliability exposed to thermal neutron environment—II 1978
100-101 4 p. 415-
1 p.
artikel
941 Component reliability exposed to thermal neutron environment—III 1978
100-101 4 p. 415-
1 p.
artikel
942 Component reliability under nuclear radiation environment Sahiar, S.K.
1974
100-101 4 p. 291-294
4 p.
artikel
943 Components screening: is it useful? Evaluation of a manufacturing experience 1981
100-101 4 p. 611-
1 p.
artikel
944 Components that learn and how to use them 1963
100-101 4 p. 263-
1 p.
artikel
945 Component testing—fresh look 1969
100-101 4 p. 286-287
2 p.
artikel
946 Component vs system burn-in techniques for electronic equipment 1990
100-101 4 p. 824-
1 p.
artikel
947 Comprehensive test patterns with modular test structures: The 2 by N probe-pad array approach 1980
100-101 4 p. 546-
1 p.
artikel
948 Computational method for reliability data analysis 1997
100-101 4 p. 692-
1 p.
artikel
949 Computational time and absolute error comparison for reliability expression derived by various methods 1976
100-101 4 p. 267-
1 p.
artikel
950 Computation of optical image profile for lithography and linewidth measurement 1987
100-101 4 p. 796-
1 p.
artikel
951 Computer aided circuit reliability analysis 1965
100-101 4 p. 373-
1 p.
artikel
952 Computer-aided design—II. Short cuts to ICs and p-c boards 1968
100-101 4 p. 345-
1 p.
artikel
953 Computer-aided design of VLSI circuits 1982
100-101 4 p. 904-
1 p.
artikel
954 Computer-aided failure mode and effect analysis of electronic circuits Lehtelä, M.
1990
100-101 4 p. 761-773
13 p.
artikel
955 Computer aided fault tree synthesis Bossche, A.
1985
100-101 4 p. 773-788
16 p.
artikel
956 Computer aided layout of microcircuits 1968
100-101 4 p. 333-
1 p.
artikel
957 Computer aided stress modeling for optimizing plastic package reliability 1986
100-101 4 p. 782-
1 p.
artikel
958 Computer aids for IC design, artwork, and mask generation 1972
100-101 4 p. 325-
1 p.
artikel
959 4709366 Computer assisted fault isolation in circuit board testing Scott, Marshall
1988
100-101 4 p. 665-
1 p.
artikel
960 Computer-assisted Markov failure modeling of process control systems 1988
100-101 4 p. 656-
1 p.
artikel
961 Computer assisted mask production 1970
100-101 4 p. 319-
1 p.
artikel
962 Computer-automated isothermal contouring 1968
100-101 4 p. 333-
1 p.
artikel
963 Computer control of diffusion systems 1973
100-101 4 p. 280-
1 p.
artikel
964 Computer controls IC ‘wet cycles’ 1976
100-101 4 p. 268-
1 p.
artikel
965 Computer-graphic design for human performance 1978
100-101 4 p. 307-
1 p.
artikel
966 Computerized approach for matrix-form FMEA 1979
100-101 4 p. 308-
1 p.
artikel
967 Computer redundancy: Design, performance and future 1969
100-101 4 p. 292-
1 p.
artikel
968 Computer reliability optimization system 1972
100-101 4 p. 321-322
2 p.
artikel
969 Computer simulation of system testing strategies for fault elimination 1980
100-101 4 p. 543-
1 p.
artikel
970 Computers in the front lines: micromodules make it possible 1963
100-101 4 p. 267-
1 p.
artikel
971 Computer support in Air Force Maintenance 1978
100-101 4 p. 311-312
2 p.
artikel
972 Computing values for resistors in semiconductors from diffusion parameters and vice versa Busen, Karl M.
1965
100-101 4 p. 359-363
5 p.
artikel
973 Concurrent packaging architecture design 1996
100-101 4 p. 546-
1 p.
artikel
974 Condensation thermography—a novel approach for locating short circuits and determining surface temperatures in semi-conductor die 1982
100-101 4 p. 897-
1 p.
artikel
975 Conduction of beam deposited electrons through thin SiO2 films 1970
100-101 4 p. 329-
1 p.
artikel
976 Conductive adhesives for SMT and potential applications 1996
100-101 4 p. 554-555
2 p.
artikel
977 Conference Report The IEEE reliability and maintainability symposium 1984 Jacobs, Richard M.
1984
100-101 4 p. 613-616
4 p.
artikel
978 Conference report The 34th reliability and maintainability symposium Jacobs, R.M.
1988
100-101 4 p. 507-509
3 p.
artikel
979 Confidence and “A” and “B” allowable factors for the Weibull Distribution 1976
100-101 4 p. 267-
1 p.
artikel
980 Confidence intervals for system failure rates; a literature review 1986
100-101 4 p. 785-
1 p.
artikel
981 Consecutive- k-out-of-n:F system with sequential failures 1986
100-101 4 p. 787-
1 p.
artikel
982 Consecutive-k, r-out-of-n:DFM systems Koutras, M.V.
1997
100-101 4 p. 597-603
7 p.
artikel
983 Consideration of component failure mechanisms in the reliability assessment of electronic equipment— Addressing the constant failure rate assumption 1996
100-101 4 p. 534-
1 p.
artikel
984 Consideration of node failures in network-reliability calculation 1997
100-101 4 p. 693-
1 p.
artikel
985 Considerations for the design of an SRAM with SOI technology 1989
100-101 4 p. 653-
1 p.
artikel
986 Considerations in R & M program optimization 1980
100-101 4 p. 539-
1 p.
artikel
987 Considerations in the utilization of semiconductor devices and integrated circuits 1967
100-101 4 p. 327-
1 p.
artikel
988 Contactless probing 1988
100-101 4 p. 653-
1 p.
artikel
989 Contamination of aluminium bonds in integrated circuits 1967
100-101 4 p. 337-
1 p.
artikel
990 Contamination problems within SMT 1988
100-101 4 p. 653-
1 p.
artikel
991 Contamination study of plasma etching 1986
100-101 4 p. 791-
1 p.
artikel
992 Continuous electron beam processing plant for plane thin-film resistors von Ardenne, M.
1966
100-101 4 p. 255-256
2 p.
artikel
993 Continuous vacuum sublimation of silica 1970
100-101 4 p. 328-
1 p.
artikel
994 Contrast enhanced lithography 1986
100-101 4 p. 794-
1 p.
artikel
995 Contributions to the design of highly integrated MOS circuits 1979
100-101 4 p. 309-
1 p.
artikel
996 Controlled growth of conducting thin films using an electron beam 1968
100-101 4 p. 343-
1 p.
artikel
997 Controlled oxidation of tantalum and aluminium in a radio-frequency-excited glow discharge 1968
100-101 4 p. 340-
1 p.
artikel
998 4495468 Controlled phase off-set digital test system Richards, EdwardW
1985
100-101 4 p. 810-
1 p.
artikel
999 Controlled processing for precision thick film resistors 1968
100-101 4 p. 335-
1 p.
artikel
1000 Controller chip handles voice and data switching 1982
100-101 4 p. 903-
1 p.
artikel
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