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                             71 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 Accurate reliability analysis of concurrent checking circuits employing an efficient analytical method An, T.
2015
100-101 3-4 p. 696-703
8 p.
artikel
2 A dual-rail compact defect-tolerant multiplexer Ben Dhia, A.
2015
100-101 3-4 p. 662-670
9 p.
artikel
3 Ageing and thermal recovery of advanced SiGe heterojunction bipolar transistors under long-term mixed-mode and reverse stress conditions Fischer, G.G.
2015
100-101 3-4 p. 498-507
10 p.
artikel
4 A mid-value select voter Krstic, M.D.
2005
100-101 3-4 p. 733-738
6 p.
artikel
5 An accurate closed-expression model for FinFETs parasitic resistance Pereira, A.S.N.
2015
100-101 3-4 p. 470-480
11 p.
artikel
6 Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile Cortés, I.
2005
100-101 3-4 p. 493-498
6 p.
artikel
7 An efficient BTX sensor based on p-type nanoporous titania thin films Dutta, K.
2015
100-101 3-4 p. 558-564
7 p.
artikel
8 An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model George, Elviz
2015
100-101 3-4 p. 582-587
6 p.
artikel
9 A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure Vanstreels, K.
2005
100-101 3-4 p. 753-759
7 p.
artikel
10 A return on investment analysis of applying health monitoring to LED lighting systems Chang, Moon-Hwan
2015
100-101 3-4 p. 527-537
11 p.
artikel
11 A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II—Latchup Voldman, Steven H.
2005
100-101 3-4 p. 437-455
19 p.
artikel
12 A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections Tsang, C.F.
2005
100-101 3-4 p. 517-525
9 p.
artikel
13 Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications Radovanović, Saša
2005
100-101 3-4 p. 705-710
6 p.
artikel
14 Bipolar SCR ESD devices Vashchenko, V.A.
2005
100-101 3-4 p. 457-471
15 p.
artikel
15 Burnout properties of microwave pulse injected on GaAs PHEMT Zhang, Cunbo
2015
100-101 3-4 p. 508-513
6 p.
artikel
16 Characterization and modeling of power MOSFET switching times variations under constant electrical stress Sezgin, Hatice Gül
2015
100-101 3-4 p. 492-497
6 p.
artikel
17 Characterization of bump arrays at RF/microwave frequencies Ndip, Ivan N.
2005
100-101 3-4 p. 551-558
8 p.
artikel
18 Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry Joo, Jinwon
2005
100-101 3-4 p. 637-646
10 p.
artikel
19 Chemical and diffusion-controlled curing kinetics of an underfill material He, Yi
2005
100-101 3-4 p. 689-695
7 p.
artikel
20 Cross-layer investigation of continuous-time sigma–delta modulator under aging effects Cai, Hao
2015
100-101 3-4 p. 645-653
9 p.
artikel
21 Degradation behavior by DC-accelerated and pulse-current stress in Co/Cr/Y/Al/Ni co-doped ZnO–PrO1.83-based varistors Nahm, Choon-W.
2015
100-101 3-4 p. 565-571
7 p.
artikel
22 Design and analyze of transient-induced latch-up in RS485 transceiver with on-chip TVS Jiang, Qi
2015
100-101 3-4 p. 637-644
8 p.
artikel
23 Design of a folded cascode opamp with increased immunity to conducted electromagnetic interference in 0.18μm CMOS Richelli, Anna
2015
100-101 3-4 p. 654-661
8 p.
artikel
24 Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides Suehle, J.S.
2005
100-101 3-4 p. 419-426
8 p.
artikel
25 Development of a fast method for optimization of Au ball bond process Gomes, J.
2015
100-101 3-4 p. 602-607
6 p.
artikel
26 Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy Yang, Li
2015
100-101 3-4 p. 596-601
6 p.
artikel
27 Electrothermal characterization of silicon-on-glass VDMOSFETs Nenadović, N.
2005
100-101 3-4 p. 541-550
10 p.
artikel
28 Elimination of stress induced dislocation in deep Poly Sinker LDMOS technology Xu, Xiangming
2015
100-101 3-4 p. 486-491
6 p.
artikel
29 Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate Waris, Tuomas F.
2005
100-101 3-4 p. 665-673
9 p.
artikel
30 Evaluation of parasitic capacitances for interconnection buses crossing in different layers Jarosz, A.
2005
100-101 3-4 p. 761-765
5 p.
artikel
31 Extended Sensor Reliability Evaluation Method in multi-sensor control systems Łęczycki, Paweł
2015
100-101 3-4 p. 671-678
8 p.
artikel
32 Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation Lim, Ji-hyuk
2005
100-101 3-4 p. 473-478
6 p.
artikel
33 Fatigue life and resistance analysis of COG assemblies under hygrothermal aging Zhang, Wenguo
2015
100-101 3-4 p. 623-629
7 p.
artikel
34 Flip chip attachment on flexible LCP substrate using an ACF Frisk, L.
2005
100-101 3-4 p. 583-588
6 p.
artikel
35 Gate dielectric breakdown in the time-scale of ESD events Weir, Bonnie E.
2005
100-101 3-4 p. 427-436
10 p.
artikel
36 Hot carrier effect on the bipolar transistors’ response to electromagnetic interference Xiong, Cen
2015
100-101 3-4 p. 514-519
6 p.
artikel
37 Hybrid reliability assessment for packaging prototyping Lu, Hua
2005
100-101 3-4 p. 597-609
13 p.
artikel
38 Impact of gate-leakage currents on CMOS circuit performance Marras, Alessandro
2005
100-101 3-4 p. 499-506
8 p.
artikel
39 Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies Goguenheim, D.
2005
100-101 3-4 p. 487-492
6 p.
artikel
40 Improving reliability of beveled power semiconductor devices passivated by SIPOS Wang, Ying
2005
100-101 3-4 p. 535-539
5 p.
artikel
41 Improving the power cycling performance of IGBT modules by plating the emitter contact Özkol, Emre
2015
100-101 3-4 p. 552-557
6 p.
artikel
42 Improving the reliability of the Benes network for use in large-scale systems Jahanshahi, Mohsen
2015
100-101 3-4 p. 679-695
17 p.
artikel
43 Inside front cover - Editorial board 2015
100-101 3-4 p. IFC-
1 p.
artikel
44 Intermediate wafer level bonding and interface behavior Pan, C.T.
2005
100-101 3-4 p. 657-663
7 p.
artikel
45 Leakage current study and relevant defect localization in integrated circuit failure analysis Wu, Chunlei
2015
100-101 3-4 p. 463-469
7 p.
artikel
46 Low voltage SILC and P- and N-MOSFET gate oxide reliability Petit, C.
2005
100-101 3-4 p. 479-485
7 p.
artikel
47 Maximum pulse current estimation for high accuracy power capability prediction of a Li-Ion battery Lee, Seongjun
2015
100-101 3-4 p. 572-581
10 p.
artikel
48 Measuring process capability based on C PK with gauge measurement errors Pearn, W.L.
2005
100-101 3-4 p. 739-751
13 p.
artikel
49 Microstructure, tensile and electrical properties of gold-coated silver bonding wire Tseng, Yi-Wei
2015
100-101 3-4 p. 608-612
5 p.
artikel
50 Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique Islam, T.
2005
100-101 3-4 p. 697-703
7 p.
artikel
51 MOS current divider based PGA Sanz, M. Teresa
2005
100-101 3-4 p. 727-732
6 p.
artikel
52 MOSFET channel resistance characterization from the triode region to impact ionization region with the inductive breakdown network Lee, Chie-In
2015
100-101 3-4 p. 481-485
5 p.
artikel
53 100 μm Pitch flip chip on foil assemblies with adhesive interconnections de Vries, J.
2005
100-101 3-4 p. 527-534
8 p.
artikel
54 Novel concepts for reliability technology Ryu, Dongsu
2005
100-101 3-4 p. 611-622
12 p.
artikel
55 Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards Siau, Sam
2005
100-101 3-4 p. 675-687
13 p.
artikel
56 Real-time fault-tolerance with hot-standby topology for conditional sum adder Mukherjee, Atin
2015
100-101 3-4 p. 704-712
9 p.
artikel
57 Reliability of thin films: Experimental study on mechanical and thermal behavior of indium tin oxide and poly(3,4-ethylenedioxythiophene) Alkhazaili, Atif
2015
100-101 3-4 p. 538-546
9 p.
artikel
58 Response surface models for efficient, modular estimation of solder joint reliability in area array packages Zhang, L.
2005
100-101 3-4 p. 623-635
13 p.
artikel
59 Review of add-on process modules for high-frequency silicon technology Burghartz, J.N.
2005
100-101 3-4 p. 409-418
10 p.
artikel
60 Robust dual-direction SCR with low trigger voltage, tunable holding voltage for high-voltage ESD protection Wang, Yang
2015
100-101 3-4 p. 520-526
7 p.
artikel
61 SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects Murthy, Ramana
2005
100-101 3-4 p. 507-516
10 p.
artikel
62 Study of anisotropic conductive adhesive joint behavior under 3-point bending Rizvi, M.J.
2005
100-101 3-4 p. 589-596
8 p.
artikel
63 Systematic evaluation of thermal interface materials—a case study in high power amplifier design Maguire, Luke
2005
100-101 3-4 p. 711-725
15 p.
artikel
64 Temperature mapping by μ-Raman spectroscopy over cross-section area of power diode in forward biased conditions Kociniewski, T.
2015
100-101 3-4 p. 547-551
5 p.
artikel
65 The effect of the echo-time of a bipolar pulse waveform on molten metallic droplet formation by squeeze mode piezoelectric inkjet printing Wu, Cheng-Han
2015
100-101 3-4 p. 630-636
7 p.
artikel
66 The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces Kim, K.S.
2005
100-101 3-4 p. 647-655
9 p.
artikel
67 The fundamentals of thermal-mass diffusion analogy Wong, E.H.
2015
100-101 3-4 p. 588-595
8 p.
artikel
68 Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E Tao, Yi
2005
100-101 3-4 p. 559-566
8 p.
artikel
69 Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs Shimoto, Tadanori
2005
100-101 3-4 p. 567-574
8 p.
artikel
70 Vacuum effect on the void formation of the molded underfill process in flip chip packaging Guo, Xue-Ru
2015
100-101 3-4 p. 613-622
10 p.
artikel
71 Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly Lai, Yi-Shao
2005
100-101 3-4 p. 575-582
8 p.
artikel
                             71 gevonden resultaten
 
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