Digitale Bibliotheek
Sluiten Bladeren door artikelen uit een tijdschrift
 
   volgende >>
     Tijdschrift beschrijving
       Alle jaargangen van het bijbehorende tijdschrift
         Alle afleveringen van het bijbehorende jaargang
                                       Alle artikelen van de bijbehorende aflevering
 
                             3981 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A basic distributed microcomputer control system 1978
100-101 3 p. 357-
1 p.
artikel
2 A Bayesian reliability growth model 1969
100-101 3 p. 253-
1 p.
artikel
3 A bibliography of metal-insulator-semiconductor studies 1968
100-101 3 p. 274-
1 p.
artikel
4 A bibliography on semiconductor wafer preparation 1974
100-101 3 p. 163-
1 p.
artikel
5 A bibliography on silicon nitride films Morosanu, C.-E.
1980
100-101 3 p. 357-370
14 p.
artikel
6 A 6-bit monolithic video flash converter 1983
100-101 3 p. 599-
1 p.
artikel
7 A 2048-bit n-channel fully decoded electrically writable/erasable nonvolatile read only memory 1976
100-101 3 p. 183-
1 p.
artikel
8 A bond failure mechanism 1987
100-101 3 p. 591-592
2 p.
artikel
9 A bound heuristic algorithm for solving reliability redundancy optimization Li Jianping,
1996
100-101 3 p. 335-339
5 p.
artikel
10 Absolute dosimetry of ion implanted impurities using a calorimetric method 1978
100-101 3 p. 364-
1 p.
artikel
11 A Built-In Self-Test (BIST) system with non-intrusive TPG and ORA for FPGA test and diagnosis Ruan, Aiwu
2013
100-101 3 p. 488-498
11 p.
artikel
12 A burn-in program for wearout unaffected equipments Gironi, G.
1976
100-101 3 p. 227-232
6 p.
artikel
13 A case history: procurement of quality plastic encapsulated semiconductors 1978
100-101 3 p. 351-
1 p.
artikel
14 A case history—the Telstar satellite programme 1964
100-101 3 p. 197-
1 p.
artikel
15 A case study of C mmp, Cm∗, and C vmp: part I—Experiences with fault tolerance in multiprocessor systems 1979
100-101 3 p. 190-
1 p.
artikel
16 A.C. behaviour of damaged surface layers on CdS crystals 1965
100-101 3 p. 304-
1 p.
artikel
17 Accelerated life testing and over-stress testing of transistors Groocock, J.M.
1963
100-101 3 p. 191-204
14 p.
artikel
18 Accelerated life testing and reliability of high K multilayer ceramic capacitors 1983
100-101 3 p. 589-590
2 p.
artikel
19 Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages 1980
100-101 3 p. 375-
1 p.
artikel
20 Accelerated stress testing of terrestrial solar cells 1983
100-101 3 p. 588-
1 p.
artikel
21 Accelerated temperature testing of transistors does not cause excess flicker noise Khobare, S.K.
1982
100-101 3 p. 423-425
3 p.
artikel
22 Accelerated vibration fatigue life testing of leads and soldered joints Blanks, H.S.
1976
100-101 3 p. 213-219
7 p.
artikel
23 Accurate estimation of statistical parametric variation in microelectronic test structures Kumar, Mahesh
1987
100-101 3 p. 575-577
3 p.
artikel
24 Accurately trimming closed resistor loops 1974
100-101 3 p. 170-
1 p.
artikel
25 Accurate modeling of the influence of back gate bias and interface roughness on the threshold voltage of nanoscale DG MOSFETs Biswas, Abhijit
2013
100-101 3 p. 363-370
8 p.
artikel
26 Accurate two-port models for distributed-RC notch filters 1978
100-101 3 p. 227-
1 p.
artikel
27 Accurate two-port models for distributed-RC notch filters Kumar, Umesh
1978
100-101 3 p. 393-397
5 p.
artikel
28 A centralized temperature control system for diffusion furnaces 1973
100-101 3 p. 208-
1 p.
artikel
29 A ceramic based thin film system for low cost production of modules 1969
100-101 3 p. 261-
1 p.
artikel
30 A certain problem related to reliability of electronic apparatus 1964
100-101 3 p. 198-
1 p.
artikel
31 ACF particle distribution in COG process Yen, Yee-Wen
2011
100-101 3 p. 676-684
9 p.
artikel
32 A changing paradigm in quality 1997
100-101 3 p. 529-
1 p.
artikel
33 A channel conductance measuring technique for determining the interface properties of a SiO-InSb thin film transistor 1978
100-101 3 p. 234-
1 p.
artikel
34 Achieving consistent results with thick-film 1972
100-101 3 p. 246-
1 p.
artikel
35 A class of fault-tolerant multiprocessor networks 1990
100-101 3 p. 622
artikel
36 A cluster plus effective medium tight-binding study of SiOx systems 1979
100-101 3 p. 199-
1 p.
artikel
37 A cold standby redundant system with delayed switchover and preventive maintenance 1978
100-101 3 p. 352-
1 p.
artikel
38 A combined digital and linear custom designed array optimised for large volume consumer applications 1983
100-101 3 p. 599-
1 p.
artikel
39 A combined fuzzy-logic and physics-of-failure approach to reliability prediction 1997
100-101 3 p. 529-
1 p.
artikel
40 A common cause-failure availability model 1979
100-101 3 p. 188-
1 p.
artikel
41 A compact high power semiconductor laser array 1979
100-101 3 p. 202-
1 p.
artikel
42 A comparison of MOS processes for VLSI. Part II 1985
100-101 3 p. 588-589
2 p.
artikel
43 A comparison of the performance of plastic and ceramic encapsulations based on evaluation of CMOS integrated circuits Fox, M.J.
1977
100-101 3 p. 251-254
4 p.
artikel
44 A comparison of the thermal and electrical characteristics of a beam lead chip 1973
100-101 3 p. 209-
1 p.
artikel
45 A compatible patterning technique for custom built thin and thick film circuits 1968
100-101 3 p. 281-
1 p.
artikel
46 A complementary MOS 1.2 V watch circuit using ion implantation 1972
100-101 3 p. 248-
1 p.
artikel
47 A complex priority redundant system with phase type distribution Gururajan, M.
1990
100-101 3 p. 453-455
artikel
48 A complex two unit system with stochastic demand Sharafali, M.
1988
100-101 3 p. 359-361
3 p.
artikel
49 A comprehensive modeling framework for gate stack process dependence of DC and AC NBTI in SiON and HKMG p-MOSFETs Goel, N.
2014
100-101 3 p. 491-519
29 p.
artikel
50 A comprehensive review of the lognormal failure distribution with application to LED reliability Jordan, A.S.
1978
100-101 3 p. 267-279
13 p.
artikel
51 A comprehensive review of the lognormal failure distribution with application to led reliability 1979
100-101 3 p. 187-
1 p.
artikel
52 A computational algorithm for reliability bounds in probabilistic design 1987
100-101 3 p. 588-
1 p.
artikel
53 A computer-aided simulation model for the I–V characteristic of M-n-p silicon Schottky-barrier diodes produced by use of low-energy arsenic-ion implantation 1984
100-101 3 p. 596-597
2 p.
artikel
54 A computerized algorithm for determining the reliability of redundant configurations 1972
100-101 3 p. 239-
1 p.
artikel
55 A contribution to the design of plastic packages for high voltage power integrated circuits 1996
100-101 3 p. 448-449
2 p.
artikel
56 A corollary to: Duane's postulate on reliability growth 1990
100-101 3 p. 619
artikel
57 A correlation study between different types of CDM testers and ‘real’ manufacturing in-line leakage failure 1997
100-101 3 p. 532-
1 p.
artikel
58 A cost-based availability allocation algorithm 1972
100-101 3 p. 238-
1 p.
artikel
59 Acoustic emission for detecting deterioration of capacitors under aging Smulko, Janusz
2011
100-101 3 p. 621-627
7 p.
artikel
60 Acoustic microscopy of ceramic capacitors 1979
100-101 3 p. 187-
1 p.
artikel
61 Activation and process characteristics of infrared rapid isothermal and furnace annealing techniques 1983
100-101 3 p. 597-
1 p.
artikel
62 Activation and redistribution of implants in Polysi by RTP 1986
100-101 3 p. 589-
1 p.
artikel
63 Active device prescreening for hybrids 1980
100-101 3 p. 388-
1 p.
artikel
64 Active distributed RC low-pass filters Dutta Roy, S.C.
1972
100-101 3 p. 293-295
3 p.
artikel
65 Active doping instability in n+−p silicon surface avalanche diodes 1996
100-101 3 p. 452-
1 p.
artikel
66 Active R-C filters for tantalum thin film circuitry 1965
100-101 3 p. 311-
1 p.
artikel
67 Active thin-film devices, Part 1 1967
100-101 3 p. 257-258
2 p.
artikel
68 Active thin-film devices, Part 2 1967
100-101 3 p. 258-
1 p.
artikel
69 A Cu-Al2O3-Al moisture sensor for high humidities Nahar, R.K.
1987
100-101 3 p. 451-456
6 p.
artikel
70 A current pulse screening test for metal step coverage—final report 1975
100-101 3 p. 263-
1 p.
artikel
71 Adaptive error correction in Orthogonal Latin Square Codes for low-power, resilient on-chip interconnection network Lee, Seung Eun
2013
100-101 3 p. 509-511
3 p.
artikel
72 Adaptive robust estimation based on a family of generalized exponential power distributions 1985
100-101 3 p. 583-
1 p.
artikel
73 A DDA in MTOS 1970
100-101 3 p. 225-
1 p.
artikel
74 Addendum to: computing failure frequency via mixed products of availabilities and unavailabilities 1985
100-101 3 p. 585-
1 p.
artikel
75 Additive X-ray mask patterning 1987
100-101 3 p. 590-
1 p.
artikel
76 A design approach for LSI using chip selection and circuits modification techniques 1973
100-101 3 p. 207-
1 p.
artikel
77 A designer’s guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 319, plus XVI, $ 125, ISBN 1-4020-7050-0 Stojcev, Mile
2003
100-101 3 p. 514-515
2 p.
artikel
78 A design of experiment analysis of serial EEPROM endurance Wilkie, D.
1997
100-101 3 p. 487-491
5 p.
artikel
79 A detailed analysis of three-level electron transfer 1971
100-101 3 p. 149-
1 p.
artikel
80 A device for the stabilization of pressures in the region of 1 torr 1964
100-101 3 p. 202-
1 p.
artikel
81 A device life cycle analysis of the WSI associative string processor 1997
100-101 3 p. 533-
1 p.
artikel
82 Adhesion mechanism of gold-underlayer film combinations to oxide substrates 1970
100-101 3 p. 227-228
2 p.
artikel
83 Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film Uddin, M.A.
2004
100-101 3 p. 505-514
10 p.
artikel
84 Adhesives for microelectronics 1973
100-101 3 p. 206-
1 p.
artikel
85 Adhesive strength of evaporated gold films on glass substrate 1969
100-101 3 p. 262-
1 p.
artikel
86 A discrete time queueing problem with S heterogeneous groups of channels Sharda,
1985
100-101 3 p. 455-459
5 p.
artikel
87 A downstream look at IC testing 1967
100-101 3 p. 246-
1 p.
artikel
88 Adsorption of H2S, H2O and O2 on Si(111) surfaces 1977
100-101 3 p. 217-
1 p.
artikel
89 A dual burn-in policy for defect-tolerant memory products using the number of repairs as a quality indicator Tong, Seung-Hoon
2008
100-101 3 p. 471-480
10 p.
artikel
90 Advanced CMOS epitaxial processing for latch-up hardening and improved epilayer quality 1985
100-101 3 p. 587-
1 p.
artikel
91 Advanced developments in sub-nanosecond integrated logic circuits 1970
100-101 3 p. 225-
1 p.
artikel
92 Advanced hand calculations for fault tree analysis and synthesis Schneeweiss, Winfrid G.
1997
100-101 3 p. 403-415
13 p.
artikel
93 Advanced low-cost bare-DIE packaging technology for liquid crystal displays 1997
100-101 3 p. 540-
1 p.
artikel
94 Advanced operations and maintenance facilities for telephone networks 1978
100-101 3 p. 228-229
2 p.
artikel
95 Advanced packaging for VLSI 1987
100-101 3 p. 590-
1 p.
artikel
96 Advanced submicron research and technology development at the national submicron facility 1984
100-101 3 p. 589-
1 p.
artikel
97 Advanced technologies extend LSI capability 1971
100-101 3 p. 145-146
2 p.
artikel
98 Advances in automatic die bonding 1984
100-101 3 p. 590-
1 p.
artikel
99 Advances in cassette-to-cassette sputtercoating systems 1984
100-101 3 p. 589-
1 p.
artikel
100 Advances in computer generation of master artwork for micro-miniature circuits 1968
100-101 3 p. 284-
1 p.
artikel
101 Advances in contamination control of processing chemicals in VLSI 1983
100-101 3 p. 601-
1 p.
artikel
102 Advances in dry etching processes—a review 1986
100-101 3 p. 585-
1 p.
artikel
103 Advances in low temperature die bonding techniques 1975
100-101 3 p. 272-
1 p.
artikel
104 Advances in silicon technology for the semiconductor industry. Part II 1984
100-101 3 p. 593-
1 p.
artikel
105 Advances in testing LSI populated boards 1980
100-101 3 p. 383-
1 p.
artikel
106 Advances in VLSI circuit technology require new equipment for microlithography 1983
100-101 3 p. 597-
1 p.
artikel
107 Advances in X-ray mask technology 1985
100-101 3 p. 588-
1 p.
artikel
108 Advances in zone refining 1968
100-101 3 p. 277-
1 p.
artikel
109 Advantages and limitations of AOQL and AQL sampling schemes 1967
100-101 3 p. 241-
1 p.
artikel
110 Advantages and new development of direct bonded copper substrates Schulz-Harder, Jürgen
2003
100-101 3 p. 359-365
7 p.
artikel
111 Advantages of IGFETS in integrated circuits 1971
100-101 3 p. 146-
1 p.
artikel
112 A fast algorithm for a redundancy optimization problem Murty, V.Dakshina
1985
100-101 3 p. 511-523
13 p.
artikel
113 A fast algorithm to formulate Markov system equations 1986
100-101 3 p. 577-
1 p.
artikel
114 A fast thick-film amplifier 1976
100-101 3 p. 186-
1 p.
artikel
115 A fault-tolerant permutation network modulo arithmetic processor 1996
100-101 3 p. 443-
1 p.
artikel
116 A few examples of applying laser microspectral analysis in semiconductor engineering 1975
100-101 3 p. 285-
1 p.
artikel
117 A field study of the electrical performance of separable connectors 1979
100-101 3 p. 186-187
2 p.
artikel
118 A finite state machine based fault tolerance technique for sequential circuits El-Maleh, Aiman H.
2014
100-101 3 p. 654-661
8 p.
artikel
119 A flexible approach for generation of arbitrary etch profiles in multilayer films 1986
100-101 3 p. 588-
1 p.
artikel
120 A fluxless and oxygen-free soldering technique for thick-film circuits 1973
100-101 3 p. 211-
1 p.
artikel
121 A framework for knowledge-based computer-integrated manufacturing 1990
100-101 3 p. 623
artikel
122 A fully ion-implanted integrated circuit process 1976
100-101 3 p. 189-
1 p.
artikel
123 Ageing acceleration under multiple stresses 1986
100-101 3 p. 581-
1 p.
artikel
124 Ageing effects in GaAs Schottky barrier diodes 1990
100-101 3 p. 616-617
artikel
125 A general approach to optimal process control Collani, E.v.
1989
100-101 3 p. 393-397
5 p.
artikel
126 A general isodegrading model for predicting mechanical equipment reliability and performance degradation Zhao, Yongxiang
1998
100-101 3 p. 427-434
8 p.
artikel
127 A generalization of Freund's model for a repairable paired component based on a bivariate Geiger Muller (G.M.) counter 1986
100-101 3 p. 577-
1 p.
artikel
128 Aging characteristics of tantalum nitride thin film resistors 1969
100-101 3 p. 251-
1 p.
artikel
129 Aging mechanisms in thin resistor films 1967
100-101 3 p. 253-254
2 p.
artikel
130 Aging of solder connection to Ti-Pd-Au films 1980
100-101 3 p. 377-
1 p.
artikel
131 Aging studies on transformer insulating materials (Class A) by means of infra-red spectroscopy Lengyel, G
1962
100-101 3 p. 227-232
6 p.
artikel
132 A heuristic method for determining optimal reliability allocation 1978
100-101 3 p. 353-
1 p.
artikel
133 A heuristic method for optimum redundancy allocation in non-coherent systems Gopal, Krishna
1984
100-101 3 p. 401-405
5 p.
artikel
134 A high accuracy automated microflash camera 1968
100-101 3 p. 283-284
2 p.
artikel
135 A high accuracy differentiator using integrated circuits 1976
100-101 3 p. 184-
1 p.
artikel
136 A high density static master slave shiftregister in I2L 1976
100-101 3 p. 184-
1 p.
artikel
137 A high level fast limiting switch as a hybrid module 1974
100-101 3 p. 166-
1 p.
artikel
138 A high level synthesis design flow with a novel approach for efficient design space exploration in case of multi-parametric optimization objective Sengupta, Anirban
2010
100-101 3 p. 424-437
14 p.
artikel
139 A high-performance 16-bit bipolar microprocessor—The Am 29116 1983
100-101 3 p. 600-
1 p.
artikel
140 A high precision alignment device 1969
100-101 3 p. 256-
1 p.
artikel
141 A high-stability RC circuit using high nitrogen doped tantalum 1980
100-101 3 p. 388-
1 p.
artikel
142 A hybrid module for the computerised monitering of electronic equipment 1974
100-101 3 p. 166-
1 p.
artikel
143 A hybrid thick-film chroma demodulator and color-difference amplifier 1970
100-101 3 p. 224-225
2 p.
artikel
144 A hybrid thin-film logic circuit using gallium arsenide field effect transistors 1978
100-101 3 p. 234-
1 p.
artikel
145 A hybrid thin-film multichannel biotelemetry transmitter 1976
100-101 3 p. 186-
1 p.
artikel
146 Air film system for handling semiconductor wafers 1980
100-101 3 p. 382-
1 p.
artikel
147 A journey towards reliability improvement of TiO2 based Resistive Random Access Memory: A review Acharyya, D.
2014
100-101 3 p. 541-560
20 p.
artikel
148 A junction characterization for microelectronic devices quality and reliability Tazibt, W.
2008
100-101 3 p. 348-353
6 p.
artikel
149 Ake 13—Software reliability aspects 1975
100-101 3 p. 270-
1 p.
artikel
150 A kinetic study of the incorporation of impurities during the epitaxial growth of silicon 1978
100-101 3 p. 358-
1 p.
artikel
151 A laboratory model for system reliability analyzer Misra, K.B.
1979
100-101 3 p. 259-264
6 p.
artikel
152 A large-scale integrated circuit for low power communication receivers 1976
100-101 3 p. 183-
1 p.
artikel
153 A laser maching system for making integrated circuit masks 1971
100-101 3 p. 152-153
2 p.
artikel
154 A layer damage model for calculating thermal fatigue lifetime of power devices 1987
100-101 3 p. 584-
1 p.
artikel
155 A least square estimation of three parameters of a Weibull distribution Soman, K.P.
1992
100-101 3 p. 303-305
3 p.
artikel
156 Algebraical algorithm for computing complex systems reliability 1986
100-101 3 p. 577-
1 p.
artikel
157 Algebraic approximation of event tree sequences 1984
100-101 3 p. 586-
1 p.
artikel
158 A life-test study of electromigration in microwave power transistors 1975
100-101 3 p. 265-
1 p.
artikel
159 All-IC hybrid computer eliminates the patchwork from programming 1969
100-101 3 p. 258-
1 p.
artikel
160 Allocation of dependability to the telecommunication network Dirke, Peter
1989
100-101 3 p. 419-424
6 p.
artikel
161 Alloying modification of Sn–Ag–Cu solders by manganese and titanium Lin, Li-Wei
2009
100-101 3 p. 235-241
7 p.
artikel
162 Al2O3 as a radiation-tolerant CMOS dielectric 1977
100-101 3 p. 213-
1 p.
artikel
163 A local approach to testing IC's 1970
100-101 3 p. 217-
1 p.
artikel
164 A logarithmic reliability-growth model for single-mission systems 1985
100-101 3 p. 583-
1 p.
artikel
165 A look at reliability: tubes and solid state 1973
100-101 3 p. 203-
1 p.
artikel
166 A look at semiconductor reliability 1970
100-101 3 p. 218-
1 p.
artikel
167 A low-cost concept for the testing of microprocessor-controlled assemblies 1986
100-101 3 p. 576-
1 p.
artikel
168 A low cost, thick film multilayer hybrid system 1986
100-101 3 p. 588-
1 p.
artikel
169 A low-cost thin-film microcircuit process 1980
100-101 3 p. 388-389
2 p.
artikel
170 A low power RC-coupled VHF amplifier designed for fabrication by hybrid microcircuit techniques. Technical memo 1975
100-101 3 p. 284-
1 p.
artikel
171 A “low-risk” design approach to silicon integrated circuits 1984
100-101 3 p. 590-
1 p.
artikel
172 Alteration of diffusion profiles in semiconductors due to p-n junctions 1983
100-101 3 p. 600-
1 p.
artikel
173 Alternatives to furnace annealing 1986
100-101 3 p. 583-
1 p.
artikel
174 Aluminium wire bonding of silicon transistors 1964
100-101 3 p. 199-
1 p.
artikel
175 Aluminum-silicon metallization by rate controlled dual EB-gun evaporation 1979
100-101 3 p. 193-
1 p.
artikel
176 Aluminum wire as a viable alternative to gold for ball bonding 1984
100-101 3 p. 589-
1 p.
artikel
177 Aluminum wire to thick-film connections for high-temperature operation 1979
100-101 3 p. 186-
1 p.
artikel
178 A magnetic bubble condensed time-slot interchanging gate 1978
100-101 3 p. 357-
1 p.
artikel
179 A maintenance inspection model for a single machine with general failure distribution Hariga, M.A.
1996
100-101 3 p. 353-358
6 p.
artikel
180 A maintenance model for two-unit redundant system Lam, Yeh
1997
100-101 3 p. 497-504
8 p.
artikel
181 A maintenance strategy for systems subjected to deterioration governed by random shocks 1996
100-101 3 p. 444-
1 p.
artikel
182 A manufacturer's approach to high reliability 1965
100-101 3 p. 301-302
2 p.
artikel
183 A manufacturing reliability program for xerographic copying machines 1977
100-101 3 p. 211-
1 p.
artikel
184 A measurement technique of time-dependent dielectric breakdown in MOS capacitors Li, Seung P.
1974
100-101 3 p. 209-214
6 p.
artikel
185 American Society for Quality Control 33rd Annual Technical Conference Transactions G.W.A.D.,
1980
100-101 3 p. 185-187
3 p.
artikel
186 A method for determining the fast neutral portion of ion beams 1997
100-101 3 p. 544-
1 p.
artikel
187 A method for estimated errors in system reliability prediction 1969
100-101 3 p. 253-
1 p.
artikel
188 A method for generating weighted random test patterns 1990
100-101 3 p. 621
artikel
189 A method for the automatic translation of algorithms from a high-level language into self-timed integrated circuits 1986
100-101 3 p. 585-
1 p.
artikel
190 A method for the measurement of the turn-on condition in MOS transistors 1972
100-101 3 p. 244-
1 p.
artikel
191 A method for the statistical evaluation of small subsystem performance 1964
100-101 3 p. 195-
1 p.
artikel
192 A method for transformation of the system fault tree and repair policies into equivalent state-space diagram Rakić, Predrag
1989
100-101 3 p. 337-342
6 p.
artikel
193 A method of computer-aided test generation 1983
100-101 3 p. 593-
1 p.
artikel
194 A method of symbolic steady-state availability evaluation of k∣ out-of-n:G system 1980
100-101 3 p. 380-
1 p.
artikel
195 A methodology and design tools to support system-level VLSI design 1997
100-101 3 p. 535-
1 p.
artikel
196 A methodology for photovoltaic system reliability and economic analysis 1983
100-101 3 p. 592-
1 p.
artikel
197 A method to evaluate reliability of systems with critical and non-critical human errors Dhillon, Balbir S.
1987
100-101 3 p. 531-547
17 p.
artikel
198 A method to evaluate reliability of three-state device networks Dhillon, Balbir S.
1986
100-101 3 p. 535-554
20 p.
artikel
199 A 70 MHz static shift register with high integration density 1973
100-101 3 p. 209-
1 p.
artikel
200 A microelectronic active band-pass filter 1978
100-101 3 p. 357-
1 p.
artikel
201 A microelectronic test pattern for analyzing automated wafer probing and probe card problems 1979
100-101 3 p. 193-
1 p.
artikel
202 A microprocessor-controlled phase-locked signal source 1979
100-101 3 p. 196-
1 p.
artikel
203 A microwave integrated transistor amplifier and the high-frequency limit of transistors 1969
100-101 3 p. 258-
1 p.
artikel
204 A model for the failure of bipolar silicon integrated circuits subjected to electrostatic discharge 1975
100-101 3 p. 264-
1 p.
artikel
205 A model of charge injection at metal-insulator contacts 1978
100-101 3 p. 231-
1 p.
artikel
206 A modification to fault tree “AND” gate 1977
100-101 3 p. 211-
1 p.
artikel
207 A monolithic digital frequency synthesizer for PLL systems 1976
100-101 3 p. 184-
1 p.
artikel
208 Amorphous silicon prepared by thermal decomposition of silane: properties and applications 1984
100-101 3 p. 593-
1 p.
artikel
209 A multichannel high-speed data acquisition and processing system 1972
100-101 3 p. 238-
1 p.
artikel
210 A multiple attribute evaluation of Bayesian availability estimators 1985
100-101 3 p. 585-
1 p.
artikel
211 A multiprocessor concept for the parallel calculation of FFT 1979
100-101 3 p. 196-
1 p.
artikel
212 An accurate computer analysis of relaxation effects in MOS capacitors 1975
100-101 3 p. 274-
1 p.
artikel
213 An accurate probability-of-failure calculation method 1985
100-101 3 p. 583-584
2 p.
artikel
214 An algorithm for calculating the lower confidence bounds of C PU and C PL with application to low-drop-out linear regulators Pearn, W.L.
2003
100-101 3 p. 495-502
8 p.
artikel
215 An algorithm for fault-tree construction 1983
100-101 3 p. 590-
1 p.
artikel
216 An all thick-film stripline construction 1983
100-101 3 p. 602-
1 p.
artikel
217 An altered layer model for ion assisted deposition under net growth conditions 1990
100-101 3 p. 627
artikel
218 An alternate approach to syndrome algebra for diagnostics Schneeweiss, Winfrid
1982
100-101 3 p. 569-575
7 p.
artikel
219 An alternate method of fabricating multilayer-multichip ceramic substrates 1984
100-101 3 p. 589-
1 p.
artikel
220 An alternative approach to a reliability problem 1975
100-101 3 p. 268-
1 p.
artikel
221 An alternative index for the reliability of telecommunication networks 1986
100-101 3 p. 581-
1 p.
artikel
222 Analyses of dielectric breakdown in samples and components 1968
100-101 3 p. 268-
1 p.
artikel
223 Analyses of electromagnetic vibration-based generators fabricated with LTCC multilayer and silver spring-inducer Lu, W.L.
2011
100-101 3 p. 610-620
11 p.
artikel
224 Analysis and development of a thermocompression bond schedule for beam lead devices 1973
100-101 3 p. 208-
1 p.
artikel
225 Analysis and improvement of a static shift register 1975
100-101 3 p. 275-
1 p.
artikel
226 Analysis and optimization of lateral thin-film Silicon-on-insulator (SOI) MOSFET transistors Cortés, I.
2012
100-101 3 p. 503-508
6 p.
artikel
227 Analysis and testing in production of circuit boards and plated plastics G.W.A.D.,
1986
100-101 3 p. 570-
1 p.
artikel
228 Analysis and validation of neural network approach for extraction of small-signal model parameters of microwave transistors Marinković, Zlatica
2013
100-101 3 p. 414-419
6 p.
artikel
229 Analysis of a composite performance reliability evaluation for Markovian queueing systems Singh, S.K.
1992
100-101 3 p. 319-321
3 p.
artikel
230 Analysis of aluminum gallium arsenide laser diodes failing due to nonradiative regions behind the facets 1990
100-101 3 p. 616
artikel
231 Analysis of an important class of non-Markov systems 1983
100-101 3 p. 593-
1 p.
artikel
232 Analysis of a protective system having two types of failure Singh, S.K.
1990
100-101 3 p. 473-480
artikel
233 Analysis of a repairable two-unit parallel redundant system with failure and repair times arbitrarily distributed Ksir, B.
1993
100-101 3 p. 307-312
6 p.
artikel
234 Analysis of a single unit system with helping unit Goel, L.R.
1993
100-101 3 p. 297-301
5 p.
artikel
235 Analysis of a three-state system with two types of components Dhillon, Balbir S.
1976
100-101 3 p. 245-246
2 p.
artikel
236 Analysis of a two-unit repairable system with random inspection subject to two types of failure Subramanyam Naidu, R.
1983
100-101 3 p. 449-451
3 p.
artikel
237 Analysis of a two unit standby redundant fail-safe system Zhibang, Zhou
1987
100-101 3 p. 469-474
6 p.
artikel
238 Analysis of a two-unit standby system with three modes and imperfect switching device Goel, L.R.
1984
100-101 3 p. 425-429
5 p.
artikel
239 Analysis of computer system reliability and maintainability 1973
100-101 3 p. 205-
1 p.
artikel
240 Analysis of conditional MTTF of fault-tolerant systems Choi, Hoon
1998
100-101 3 p. 393-401
9 p.
artikel
241 Analysis of dependence of short-channel effects in double-gate MOSFETs on channel thickness Kobayashi, Yusuke
2010
100-101 3 p. 332-337
6 p.
artikel
242 Analysis of double-gate thin-film transistor 1968
100-101 3 p. 280-281
2 p.
artikel
243 Analysis of gamma-irradiation induced degradation mechanisms in power VDMOSFETS Stojadinović, N.
1995
100-101 3 p. 587-602
16 p.
artikel
244 Analysis of incomplete data in competing risks model 1986
100-101 3 p. 579-
1 p.
artikel
245 Analysis of intermittently used 2-unit redundant systems with a single repair facility Srinivasan, S.K.
1979
100-101 3 p. 247-252
6 p.
artikel
246 Analysis of low energy boron implants in silicon through SiO2 films: implantation damage and anomalous diffusion 1996
100-101 3 p. 455-456
2 p.
artikel
247 Analysis of maintenance man loading via simulation 1972
100-101 3 p. 239-
1 p.
artikel
248 Analysis of microprocessors test generation—its meaning and use 1980
100-101 3 p. 384-
1 p.
artikel
249 Analysis of one-server two-unit system subject to stage-wise installation and repair Gopalan, M.N.
1985
100-101 3 p. 549-560
12 p.
artikel
250 Analysis of 1-out-of-n: G adjustable operating system Sarmah, P.
1983
100-101 3 p. 477-480
4 p.
artikel
251 Analysis of redundant systems with human errors 1986
100-101 3 p. 580-
1 p.
artikel
252 Analysis of reliability block diagrams by Boolean techniques 1983
100-101 3 p. 592-
1 p.
artikel
253 Analysis of screening data by using Weibull distribution 1997
100-101 3 p. 535-
1 p.
artikel
254 Analysis of silicon nitride layers deposited from SiH4 and N2 on silicon 1972
100-101 3 p. 243-
1 p.
artikel
255 Analysis of single crystal silicon slices by neutron activation 1968
100-101 3 p. 277-
1 p.
artikel
256 Analysis of static and dynamic characteristics in v.i.l. 1978
100-101 3 p. 231-
1 p.
artikel
257 Analysis of the deep depletion MOSFET and the use of the d.c. characteristics for determining bulk-channel chargecoupled device parameters 1978
100-101 3 p. 232-
1 p.
artikel
258 Analysis of the effects of mechanical stress on the properties of p-channel MOS structures. Part I. Choice of the theoretical model. The effect of stress on the valence band structure in silicon 1980
100-101 3 p. 377-
1 p.
artikel
259 Analysis of the merged charge memory (MCM) cell 1978
100-101 3 p. 355-
1 p.
artikel
260 Analysis of transistor second breakdown 1970
100-101 3 p. 218-
1 p.
artikel
261 Analysis of variance of reliabilities 1984
100-101 3 p. 587-
1 p.
artikel
262 Analytical solutions for threshold voltage calculations in ion-implanted IGFETS 1984
100-101 3 p. 597-
1 p.
artikel
263 Analytical study of the pointwise availability of a parallel redundant 2-out-of-N :F system under head-of-line repair echelon 1985
100-101 3 p. 583-
1 p.
artikel
264 Analyzing the interface of reliability and economics of unmanned satellites 1975
100-101 3 p. 267-268
2 p.
artikel
265 An analysis of deep depletion thin-film MOS transistors 1967
100-101 3 p. 252-
1 p.
artikel
266 An analysis of interconnect line capacitance and coupling for VLSI circuits 1985
100-101 3 p. 589-
1 p.
artikel
267 An analysis of LPCVD system parameters for polysilicon, silicon nitride and silicon dioxide deposition 1980
100-101 3 p. 385-
1 p.
artikel
268 An analysis of physical adsorption isotherms in ultra-high-vacuum range 1965
100-101 3 p. 313-314
2 p.
artikel
269 An analysis of the CdSe thin-film triode as a current limiter 1965
100-101 3 p. 311-
1 p.
artikel
270 An analytical comparison of the thermal performance of various ball grid array packaging technologies Harvey, P.M.
2000
100-101 3 p. 485-495
11 p.
artikel
271 An analytical model for the low-emitter-impurity-concentration transistor 1978
100-101 3 p. 233-
1 p.
artikel
272 An analytical model for the narrow-width effect in ion-implanted MOSFETs 1985
100-101 3 p. 595-
1 p.
artikel
273 An analytic method to compute the stress dependence on the dimensions and its influence in the characteristics of triple gate devices Trevisoli, Renan Doria
2012
100-101 3 p. 519-524
6 p.
artikel
274 An anti-snapback circuit technique for inhibiting parasitic bipolar conduction during EOS/ESD events Smith, Jeremy C.
2001
100-101 3 p. 349-357
9 p.
artikel
275 An application of Markov chains for the evaluation of the operating characteristics of chain sampling inspection plans 1975
100-101 3 p. 262-
1 p.
artikel
276 An application of optimal control theory to repairman problem with machine interference 1978
100-101 3 p. 354-
1 p.
artikel
277 An application of time-dependent ARMA models to reliability-decay processes Singh, N.
1993
100-101 3 p. 327-330
4 p.
artikel
278 An approach for evaluating Polymer materials as protective coatings on hybrid microcircuits 1975
100-101 3 p. 284-285
2 p.
artikel
279 An approach to analysis reliability of switching circuits reliability 1967
100-101 3 p. 244-
1 p.
artikel
280 An approach to fault-tolerant system reliability modelling Pavlović, Zoran
1989
100-101 3 p. 343-348
6 p.
artikel
281 An automated, low power, high speed complementary PLA design system for VLSI applications 1985
100-101 3 p. 590-
1 p.
artikel
282 An automatic concurrent error detecting tool for PLA generation Guy, C.G.
1988
100-101 3 p. 395-405
11 p.
artikel
283 An automatic design system of IC logic package 1970
100-101 3 p. 222-
1 p.
artikel
284 An availability analysis of a k-out-of-N:G redundant system with dependant failure rates and common-cause failures Chung, Who Kee
1988
100-101 3 p. 391-393
3 p.
artikel
285 An availability evaluation for computer communication networks Corsi, F.
1980
100-101 3 p. 309-313
5 p.
artikel
286 A necessary condition for optimal consecutive-k-out-of-n:G system design Shen, Jiankai
1994
100-101 3 p. 485-493
9 p.
artikel
287 An efficient algorithm for optimal design of diagnostics 1985
100-101 3 p. 584-
1 p.
artikel
288 An efficient algorithm for simultaneously deducing minimal paths as well as cuts of a communication network Samad, M.A.
1987
100-101 3 p. 437-441
5 p.
artikel
289 An efficient method for terminal and multiterminal pathset enumeration Samad, M.A.
1987
100-101 3 p. 443-446
4 p.
artikel
290 An electrometer MOST 1971
100-101 3 p. 148-
1 p.
artikel
291 An electron beam gun with a multi-crucible for evaporation in UHV and its characteristics 1978
100-101 3 p. 364-
1 p.
artikel
292 An empirical model for early resistance changes due to electromigration 1997
100-101 3 p. 543-
1 p.
artikel
293 An empirical study on the complexity metrics of Petri nets Soo, Lee Gang
1992
100-101 3 p. 323-329
7 p.
artikel
294 An equipment manufacturer's problems in the application of microelectronics Lawton, A.T.
1965
100-101 3 p. 275-278
4 p.
artikel
295 An evaluation of the voltage-current rating characteristics of miniature monolithic RF ceramic capacitors 1979
100-101 3 p. 200-
1 p.
artikel
296 An evaporated film 135-cryotron memory plane Kraus, C.J
1962
100-101 3 p. 245-246
2 p.
artikel
297 A new accelerated test method for moisture resistance of plastic encapsulated LSIs 1983
100-101 3 p. 589-
1 p.
artikel
298 A new algorithm for transforming exponential current ramp breakdown distributions into constant current TDDB space, and the implications for gate oxide Q BD measurement methods Dumin, N.A
1999
100-101 3 p. 373-381
9 p.
artikel
299 A new application of acoustic micro imaging: screening MCM-C multilayer defects Harsányi, G.
2000
100-101 3 p. 477-484
8 p.
artikel
300 A new approach to reliability prediction 1975
100-101 3 p. 262-
1 p.
artikel
301 A new concept for microminiature interconnections 1965
100-101 3 p. 302-
1 p.
artikel
302 A new concept in reliability modelling 1990
100-101 3 p. 615
artikel
303 A new contactless S-polarized reflectance technique for determining the Si film and buried oxide thickness in silicon-on-insulator materials 1996
100-101 3 p. 452-
1 p.
artikel
304 A new degradation model and lifetime extrapolation technique for lightly doped drain nMOSFETs under hot-carrier degradation Dreesen, R.
2001
100-101 3 p. 437-443
7 p.
artikel
305 A new discrete Weibull distribution 1986
100-101 3 p. 581-
1 p.
artikel
306 A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride–oxide dielectrics Chen, Fen
2002
100-101 3 p. 335-341
7 p.
artikel
307 A new failure mechanism in thin gold films at elevated temperatures 1983
100-101 3 p. 603-
1 p.
artikel
308 A new failure mechanism related to the formation of dark defects in GaAlAs visible lasers 1984
100-101 3 p. 584-
1 p.
artikel
309 A new formula and an algorithm for reliability analysis of networks Zhao, Lian-Chang
1997
100-101 3 p. 511-518
8 p.
artikel
310 A new gate current measurement technique for the characterization of hot-carrier induced degradation in MOSFETs 1997
100-101 3 p. 544-
1 p.
artikel
311 A new generation of large hybrid modules—SLM 1978
100-101 3 p. 362-
1 p.
artikel
312 A new gold metallization system 1974
100-101 3 p. 169-
1 p.
artikel
313 A new method for impurity states in semiconductors 1985
100-101 3 p. 591-
1 p.
artikel
314 A new method for recognition of defects in electronic devices 1978
100-101 3 p. 354-
1 p.
artikel
315 A new method for reliability optimization 1979
100-101 3 p. 189-
1 p.
artikel
316 A new method for system reliability evaluation 1974
100-101 3 p. 163-
1 p.
artikel
317 A new method to determine the failure frequency of a complex system 1974
100-101 3 p. 163-
1 p.
artikel
318 A new model for bound multiexciton complexes 1977
100-101 3 p. 216-
1 p.
artikel
319 A new model of subthreshold swing for sub-100nm MOSFETs Yang, Lin-An
2008
100-101 3 p. 342-347
6 p.
artikel
320 A new on-chip digital BIST for analog-to-digital converters Ehsanian, Mehdi
1998
100-101 3 p. 409-420
12 p.
artikel
321 A new process of grid structure formation for end point detection during substrate thinning of transit time devices Ahmad, S.
1985
100-101 3 p. 447-450
4 p.
artikel
322 A new reliability growth model: its mathematical comparison to the Duane model Donovan, John
2000
100-101 3 p. 533-539
7 p.
artikel
323 A new reliability prediction method for hybrid circuits 1973
100-101 3 p. 205-
1 p.
artikel
324 A new reliability problem associated with Ar ion sputter cleaning of interconnect vias 1990
100-101 3 p. 627
artikel
325 A new reliability test for multilayer ceramic capacitors 1996
100-101 3 p. 442-
1 p.
artikel
326 A new resistor system for high reliability applications 1980
100-101 3 p. 389-
1 p.
artikel
327 A new short channel MOSFET structure (UMOST) 1978
100-101 3 p. 356-
1 p.
artikel
328 A new thick-film ruthenium-niobium resistor system 1973
100-101 3 p. 211-212
2 p.
artikel
329 A new type of galvanomagnetic effect for hot electrons in many-valley semiconductors 1977
100-101 3 p. 216-
1 p.
artikel
330 An exact analysis of the Method-One maintainability demonstration plan in MIL-STD-471 1973
100-101 3 p. 204-
1 p.
artikel
331 An exact derivation of contact resistance to planar devices 1978
100-101 3 p. 232-
1 p.
artikel
332 An experimental study of 1.5 keV X-ray radiation effects on CMOS devices Srivastava, A.
1996
100-101 3 p. 323-333
11 p.
artikel
333 An experimental study of the indium antimonide thin film transistor 1979
100-101 3 p. 201-
1 p.
artikel
334 An expert system to facilitate fault isolation 1990
100-101 3 p. 621
artikel
335 An improved approach to locating pinhole defects in MOS and bipolar integrated circuits using liquid crystals 1977
100-101 3 p. 208-209
2 p.
artikel
336 An improved architecture for advanced universal microprocessor development systems Maton, Roger
1981
100-101 3 p. 315-322
8 p.
artikel
337 An improved moment-matching algorithm for evaluating topevent probability bounds 1983
100-101 3 p. 595-
1 p.
artikel
338 An improved neural network realization for reliability analysis Cheng, C.-S.
1998
100-101 3 p. 345-352
8 p.
artikel
339 An initial planning model of computer networks using availability criteria Drinkwater, Robert
1983
100-101 3 p. 415-419
5 p.
artikel
340 An in-line process monitoring method using electron beam induced substrate current Yamada, Keizo
2001
100-101 3 p. 455-459
5 p.
artikel
341 An innovation in gold paste 1973
100-101 3 p. 214-
1 p.
artikel
342 An inspection model with generally distributed restoration and repair times Fung, James
1997
100-101 3 p. 381-389
9 p.
artikel
343 An integrated bandgap-reference 1976
100-101 3 p. 181-
1 p.
artikel
344 An integrated circuit two-tone generator 1975
100-101 3 p. 274-275
2 p.
artikel
345 An integrated injection logic (IIL) realization of phase locked loop 1976
100-101 3 p. 184-
1 p.
artikel
346 An integrated wide-tunable sine oscillator 1976
100-101 3 p. 184-
1 p.
artikel
347 An interactive system for VLSI chip physical design 1985
100-101 3 p. 589-
1 p.
artikel
348 An intermittently used n-unit complex system Sarma, Y.V.S.
1982
100-101 3 p. 441-444
4 p.
artikel
349 An introduction to assemblers and loaders for microprocessor systems 1979
100-101 3 p. 194-
1 p.
artikel
350 An introduction to operating systems G.W.A.D.,
1984
100-101 3 p. 580-
1 p.
artikel
351 An introduction to plasma processing 1978
100-101 3 p. 235-
1 p.
artikel
352 An introduction to value management 1970
100-101 3 p. 215-
1 p.
artikel
353 An inventory model with product obsolescence and its implications for high technology industry 1987
100-101 3 p. 581-
1 p.
artikel
354 An investigation into marine radar reliability 1967
100-101 3 p. 244-
1 p.
artikel
355 An investigation into the reliability of planar transistors Young, M.R.P.
1965
100-101 3 p. 245-266
22 p.
artikel
356 An investigation into the termination resistance of thin film resistors van Nie, A.G.
1987
100-101 3 p. 423-428
6 p.
artikel
357 An investigation into the use of computer aided design in thick film circuits 1975
100-101 3 p. 283-
1 p.
artikel
358 An investigation of software reliability models 1978
100-101 3 p. 354-
1 p.
artikel
359 An investigation of the factors that influence the deposit/etch balance in a radiant-heated silicon epitaxial reactor 1984
100-101 3 p. 591-
1 p.
artikel
360 An investigation of the time dependence of current degradation in MOS devices 1990
100-101 3 p. 615-616
artikel
361 An investigation of the voltage sustained by epitaxial bipolar transistors in current mode second breakdown 1979
100-101 3 p. 198-
1 p.
artikel
362 An ion implant induced instability mechanism in CMOS/SOS device 1985
100-101 3 p. 595-
1 p.
artikel
363 Anisotropic phonon generation in GaAs epilayers and pn junctions 1979
100-101 3 p. 199-
1 p.
artikel
364 Anisotropy of critical field in low-temperature electrical breakdown in n-type silicon 1967
100-101 3 p. 248-
1 p.
artikel
365 An M/G/1 queueing system with additional optional service and no waiting capacity Madan, K.C.
1994
100-101 3 p. 521-527
7 p.
artikel
366 Annealing and diffusion of fine geometry CMOS technologies 1986
100-101 3 p. 583-
1 p.
artikel
367 Annealing of ion implanted layers by laser beam 1980
100-101 3 p. 391-
1 p.
artikel
368 Announcement 1973
100-101 3 p. i-
1 p.
artikel
369 Announcement and call for papers 2012
100-101 3 p. iii-
1 p.
artikel
370 An n-unit standby redundant system with r repair facilities and preventive maintenance Subramanian, R.
1982
100-101 3 p. 367-377
11 p.
artikel
371 Anodic gold corrosion in plastic encapsulated devices Brambilla, E.
1983
100-101 3 p. 577-585
9 p.
artikel
372 Anodic gold corrosion in plastic encapsulated devices 1984
100-101 3 p. 585-
1 p.
artikel
373 Anodic growth, dielectric breakdown and carrier transport in amorphous SiO2 films 1970
100-101 3 p. 227-
1 p.
artikel
374 Anodic native oxides on GaAs 1979
100-101 3 p. 196-
1 p.
artikel
375 Anodic tantalum oxide capacitors prepared from reactively sputtered tantalum 1968
100-101 3 p. 277-278
2 p.
artikel
376 Anodic transformation of silicon nitride obtained by reactive cathode sputtering 1971
100-101 3 p. 152-
1 p.
artikel
377 Anodizing silicon is economical way to isolate IC elements 1976
100-101 3 p. 182-
1 p.
artikel
378 Anomalous behaviour of MIPS thin-film transducers 1973
100-101 3 p. 211-
1 p.
artikel
379 Anomalous I–V and pulse noise in reverse biased p–n junctions Jevtić, M.M
1998
100-101 3 p. 337-343
7 p.
artikel
380 Anomalous residual currents in the ultra-high vacuum use of Bayard-Alpert Ionization gauges 1964
100-101 3 p. 203-
1 p.
artikel
381 An optical scanning system for semiconductor junction examination 1978
100-101 3 p. 228-
1 p.
artikel
382 An optical scanning system for semiconductor junction examination Singmin, A.
1978
100-101 3 p. 399-402
4 p.
artikel
383 An optimal imperfect maintenance policy over a warranty period Jack, N.
1994
100-101 3 p. 529-534
6 p.
artikel
384 An optimal inspection and replacement policy 1976
100-101 3 p. 179-
1 p.
artikel
385 A normal approximation to distributions of likelihood ratio statistics in life testing, reliability and multivariate analysis of variance 1986
100-101 3 p. 575-
1 p.
artikel
386 A note on experiment design for accelerated life tests Luvalle, M.J.
1990
100-101 3 p. 591-603
artikel
387 A note on optimum checkpointing policies Kaio, Naoto
1985
100-101 3 p. 451-453
3 p.
artikel
388 A note on reliability prediction of electronic equipment (MIL-HDBK-217B) Reiche, H.
1975
100-101 3 p. 252-
1 p.
artikel
389 A note on the confidence interval for the availability ratio Masters, B.N.
1987
100-101 3 p. 487-492
6 p.
artikel
390 A note on the design of k-out-of-n systems Kouikoglou, Vassilis S.
1993
100-101 3 p. 445-
1 p.
artikel
391 A note on the Venn and Ben diagrams Pham, Hoang
1992
100-101 3 p. 433-437
5 p.
artikel
392 A novel approach to silicon gate CMOS device scaling 1984
100-101 3 p. 591-
1 p.
artikel
393 A novel FET frequency discriminator 1978
100-101 3 p. 357-
1 p.
artikel
394 A novel hot carrier reliability monitor for LDD p-MOSFETs 1996
100-101 3 p. 453-
1 p.
artikel
395 A novel method for extraction of VDMOSFET model parameters using neural networks Trajković, T.
1998
100-101 3 p. 331-335
5 p.
artikel
396 A novel method for measuring nonuniformities in metallization temperatures of an operating integrated circuit 1987
100-101 3 p. 591-
1 p.
artikel
397 A novel partial-SOI LDMOSFET (>800V) with n-type floating buried layer in substrate Xia, Chao
2014
100-101 3 p. 582-586
5 p.
artikel
398 A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panels Cottet, Didier
2002
100-101 3 p. 417-426
10 p.
artikel
399 An overview of E-beam mask-making 1980
100-101 3 p. 390-391
2 p.
artikel
400 An overview to integrated power module design for high power electronics packaging Lostetter, A.B.
2000
100-101 3 p. 365-379
15 p.
artikel
401 Antiphase boundaries in semiconducting compounds 1970
100-101 3 p. 229-
1 p.
artikel
402 An update: CCD and bubble memories 1978
100-101 3 p. 229-
1 p.
artikel
403 An X-Ray technique for evaluating the structure of films for device applications 1978
100-101 3 p. 234-
1 p.
artikel
404 A pabx model using the 6800 MPU 1979
100-101 3 p. 194-
1 p.
artikel
405 A parallel redundant complex system with two types of failure under preemptive-repeat repair discipline Gupta, P.P.
1984
100-101 3 p. 395-399
5 p.
artikel
406 A paramagnetic species in irradiated (NH4)2HPO4 1964
100-101 3 p. 200-
1 p.
artikel
407 A paste manufacturer's view of the hybrid industry 1983
100-101 3 p. 603-
1 p.
artikel
408 A pattern recognition technique for system error analysis 1972
100-101 3 p. 238-
1 p.
artikel
409 A performance measure for a VHSIC avionic system: mission dependent availability 1990
100-101 3 p. 613
artikel
410 A performance survey of production ion implanters 1986
100-101 3 p. 590-
1 p.
artikel
411 A personal view of some reliability activities in the United Kingdom 1975
100-101 3 p. 261-
1 p.
artikel
412 A personal view of the Bayesian controversy in reliability and statistics 1973
100-101 3 p. 199-
1 p.
artikel
413 A petri net approach to enumerate all system success paths for reliability evaluation of a complex system Hura, G.S.
1982
100-101 3 p. 427-428
2 p.
artikel
414 A Petri net approach to enumerating all circuits of a graph Hura, G.S
1984
100-101 3 p. 387-389
3 p.
artikel
415 A phenomenological study of a.c. gas panels fabricated with vacuum-deposited dielectric layers 1979
100-101 3 p. 201-
1 p.
artikel
416 A physical analysis of the operating temperature limits of complementary MOS transistor integrated circuits 1976
100-101 3 p. 183-
1 p.
artikel
417 A physical model for degradation of drams during accelerated stress ageing 1984
100-101 3 p. 585-
1 p.
artikel
418 4483388 Apparatus and method for providing failsafe supplemental heat regulation in an air conditioning control Briccetti, MarioF
1985
100-101 3 p. 601-
1 p.
artikel
419 4703858 Apparatus for testing and sorting oblong, electronic components, more particularly integrated chips Ueberreiter, Ekkehar
1988
100-101 3 p. 498-
1 p.
artikel
420 4544882 Apparatus for testing an integrated circuit chip without concern as to which of the chip's terminals are inputs or outputs Flora, Laurence
1986
100-101 3 p. 598-
1 p.
artikel
421 Applicabilities of one-chip microcomputers in electronic measuring and test devices 1983
100-101 3 p. 599-
1 p.
artikel
422 Application and use of acceleration factors in microelectronics testing 1983
100-101 3 p. 592-
1 p.
artikel
423 Application de la gravure ionique a la microelectronique 1975
100-101 3 p. 286-
1 p.
artikel
424 Application of aluminium oxide to integrated circuits fabrication 1977
100-101 3 p. 213-
1 p.
artikel
425 Application of lead-free eutectic SnAg solder in no-clean thick film electronic modules 1996
100-101 3 p. 453-
1 p.
artikel
426 Application of low energy sputtering for thin film deposition 1965
100-101 3 p. 311-312
2 p.
artikel
427 Application of maximum entropy principle in paralleled repairable systems Gupta, Yash P.
1987
100-101 3 p. 429-436
8 p.
artikel
428 Application of microelectronics in textile engineering 1983
100-101 3 p. 595-
1 p.
artikel
429 Application of microelectronics in the fields of preparation of production 1983
100-101 3 p. 596-
1 p.
artikel
430 Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials Wymysłowski, Artur
2013
100-101 3 p. 443-451
9 p.
artikel
431 Application of new methods and techniques for failure analysis 1974
100-101 3 p. 162-
1 p.
artikel
432 Application of the approximate solution of Poisson's equation to derive new formulae for impurity profile determination by the C-V method 1986
100-101 3 p. 578-
1 p.
artikel
433 Application of the ZBA-10 electron-beam exposure system in the production of precision photomasks with pattern element dimensions in the submicron range 1980
100-101 3 p. 391-
1 p.
artikel
434 Applications of interested circuit technology to microwave frequencies 1972
100-101 3 p. 241-242
2 p.
artikel
435 Applications of reactive plasma practical microelectronic processing systems 1978
100-101 3 p. 234-
1 p.
artikel
436 Applications of the scanning low energy electron (SLEEP) for MOS device evaluation 1972
100-101 3 p. 248-
1 p.
artikel
437 Applications of the sojourn-time problem to reliability 1976
100-101 3 p. 179-
1 p.
artikel
438 Application specific integrated circuit (ASIC) technology G.W.A.D.,
1992
100-101 3 p. 447-448
2 p.
artikel
439 Application-specific integrated circuits (ASICs)—a main-stream line of VLSI device fabrication 1990
100-101 3 p. 624
artikel
440 Applied electromagnetics in materials G.W.A.D.,
1990
100-101 3 p. 609-610
artikel
441 Applied maintainability engineering Reiche, Hans
1973
100-101 3 p. 219-
1 p.
artikel
442 Applying integrated circuits to transmission systems 1971
100-101 3 p. 148-
1 p.
artikel
443 Approaches to comparing cut-set enumeration algorithms 1980
100-101 3 p. 379-
1 p.
artikel
444 Approaches to electronic miniaturization 1997
100-101 3 p. 540-
1 p.
artikel
445 Approximate availability analysis of VAXcluster systems 1990
100-101 3 p. 619
artikel
446 Approximation of distribution density functions 1980
100-101 3 p. 379-
1 p.
artikel
447 Approximations to moments of parallel-system lifetime based on sampling from a finite population 1980
100-101 3 p. 378-
1 p.
artikel
448 A practical approach to reliability G.W.A.D.,
1972
100-101 3 p. 254-
1 p.
artikel
449 A practical lifetime prediction method for inter-poly oxides 1996
100-101 3 p. 442-
1 p.
artikel
450 A practical VLSI characterization and failure analysis system for the IC user 1987
100-101 3 p. 583-
1 p.
artikel
451 A problem with computerized systems 1986
100-101 3 p. 582-
1 p.
artikel
452 A procedure for generating test sequences to detect sequential circuit failures 1969
100-101 3 p. 252-
1 p.
artikel
453 A process control specification for integrated circuits 1969
100-101 3 p. 249-
1 p.
artikel
454 A process for the determination of the thickness of coating layers 1967
100-101 3 p. 254-
1 p.
artikel
455 A production-compatible microelectronic test pattern for evaluating photomask misalignment 1980
100-101 3 p. 187-
1 p.
artikel
456 A prognosis of the impending intercontinental LSI battle 1979
100-101 3 p. 191-
1 p.
artikel
457 A prognostic approach for non-punch through and field stop IGBTs Patil, Nishad
2012
100-101 3 p. 482-488
7 p.
artikel
458 A prognostics and health management roadmap for information and electronics-rich systems Pecht, Michael
2010
100-101 3 p. 317-323
7 p.
artikel
459 A program for reliability evaluation of undirected networks via polygon-to-chain reductions 1987
100-101 3 p. 585-
1 p.
artikel
460 A program system for safeguarding the availability of the Siemens system EDS 1975
100-101 3 p. 269-
1 p.
artikel
461 A program to predict the resistance of trimmed film resistors 1977
100-101 3 p. 218-
1 p.
artikel
462 A pulse generator using R.T.L. integrated circuits 1970
100-101 3 p. 224-
1 p.
artikel
463 A range of automatic finishing machines for thin-film hybrid circuits 1976
100-101 3 p. 187-
1 p.
artikel
464 A 10−8 rate of failure in a germanium transistor type of computer 1964
100-101 3 p. 197-
1 p.
artikel
465 A realistic approach to thick film resistor design 1979
100-101 3 p. 200-
1 p.
artikel
466 A recursive approach for enumerating minimal cutsets in a network 1996
100-101 3 p. 445-446
2 p.
artikel
467 A recursive method for network reliability measures evaluation Zabludowski, Antoni
1984
100-101 3 p. 445-451
7 p.
artikel
468 A relation model of gate oxide yield and reliability Kim, Kyungmee O.
2004
100-101 3 p. 425-434
10 p.
artikel
469 A reliability algebra of four-state safety devices 1973
100-101 3 p. 204-205
2 p.
artikel
470 A reliability model for total field incidents 1990
100-101 3 p. 618
artikel
471 A reliability study of insulated gate field effect transistors with an Al2O3-SiO2 gate structure 1973
100-101 3 p. 202-
1 p.
artikel
472 Are MMICs a fad or fact? 1984
100-101 3 p. 589-
1 p.
artikel
473 A renewable single-server queueing system with priorities Mokaddis, G.S.
1993
100-101 3 p. 349-357
9 p.
artikel
474 A repairable multistate system with several degraded states and common-cause failures Yamashiro, Mitsuo
1982
100-101 3 p. 615-618
4 p.
artikel
475 A reparable multistate device 1980
100-101 3 p. 380-
1 p.
artikel
476 A research study of environmental factors for the gamma distribution Wang, Hong-Zhou
1992
100-101 3 p. 331-335
5 p.
artikel
477 A resonant gate transistor, a frequency selective component for integrated circuits 1968
100-101 3 p. 275-
1 p.
artikel
478 A reversible first-order dispersive model of parametric instability Alagi, Filippo
2014
100-101 3 p. 561-569
9 p.
artikel
479 A review of error propagation analysis in systems 1984
100-101 3 p. 588-
1 p.
artikel
480 A review of fault-tolerant techniques for the enhancement of integrated circuit yield 1987
100-101 3 p. 585-
1 p.
artikel
481 A review of LPCVD metallization for semiconductor devices 1986
100-101 3 p. 584-
1 p.
artikel
482 A review of nitrogen trifluoride for dry etching in microelectronics processing 1986
100-101 3 p. 582-583
2 p.
artikel
483 A review of present practice in reliability engineering Butler, B.E.
1971
100-101 3 p. 195-208
14 p.
artikel
484 A review of process equipment for an integrated circuit facility 1968
100-101 3 p. 284-
1 p.
artikel
485 A review of random access MOS memories 1976
100-101 3 p. 183-
1 p.
artikel
486 A review of specifications MIL-M-38510E, appendix G, MIL-STD-883B, MIL-STD-883C and MIL-STS-1772 1984
100-101 3 p. 583-
1 p.
artikel
487 A review of step-stress testing 1965
100-101 3 p. 302-
1 p.
artikel
488 A review of the electrical and optical properties of III–V compound semiconductor films 1972
100-101 3 p. 244-
1 p.
artikel
489 A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation Chen, Dao-Long
2012
100-101 3 p. 541-558
18 p.
artikel
490 A review of ULSI failure analysis techniques for DRAMs 1. Defect localization and verification Benstetter, Guenther
2002
100-101 3 p. 307-316
10 p.
artikel
491 Arinc research corporation five-day courses reliability and maintainability techniques 1975
100-101 3 p. 259-
1 p.
artikel
492 Ar-ion implant damage gettering of generation impurities in silicon employing voltage ramping and nitrogen back-scattering 1980
100-101 3 p. 391-
1 p.
artikel
493 Army reliability growth management policy 1987
100-101 3 p. 589-
1 p.
artikel
494 Arsenic determination in silicon by X-ray fluorescence 1974
100-101 3 p. 168-
1 p.
artikel
495 Arsenic-doped polycrystalline silicon film for bipolar integrated circuits 1978
100-101 3 p. 358-
1 p.
artikel
496 Arsenosilicate glass as an interlayer dielectric 1986
100-101 3 p. 584-
1 p.
artikel
497 As clipper, IC comparator is improved by feedback 1975
100-101 3 p. 274-
1 p.
artikel
498 A screening technique for establishing the stability of metal film resistors 1978
100-101 3 p. 234-
1 p.
artikel
499 A selected bibliography on ion implantation in solid state technology 1976
100-101 3 p. 189-
1 p.
artikel
500 A self-consistent calculation of effective intrinsic concentration in heavily-doped silicon 1975
100-101 3 p. 280-
1 p.
artikel
501 A self optimising central heating control System 1979
100-101 3 p. 193-194
2 p.
artikel
502 A self-test and dynamics characterization circuit for MEMS electrostatic actuators Fernández, Daniel
2011
100-101 3 p. 602-609
8 p.
artikel
503 A semi-regenerative process of two-unit warm standby system Uematsu, Kohyu
1982
100-101 3 p. 483-489
7 p.
artikel
504 A shear-based optimization of adhesive thickness for die bonding 1997
100-101 3 p. 539-
1 p.
artikel
505 ASIC Q&R, plans & experiences Jääskeläinen, Pentti
1989
100-101 3 p. 317-318
2 p.
artikel
506 A simple analysis of CCDs driven by pn junctions 1979
100-101 3 p. 192-
1 p.
artikel
507 A simple and asymptotically optimal test for equality of q(≥ 2) multivariate normal distributions: A pragmatic approach to multivatiate one-way classification Singh, N.
1987
100-101 3 p. 567-573
7 p.
artikel
508 A simple and fundamental design rule for resisting delamination in bimaterial structures Moore, Thomas D.
2003
100-101 3 p. 487-494
8 p.
artikel
509 A simple estimation of failure rate Temler, J
1967
100-101 3 p. 239-240
2 p.
artikel
510 A simple guide to the general assessment of MTBF Deakin, C.G.
1969
100-101 3 p. 189-203
15 p.
artikel
511 A simple hybrid thick-film band pass filter 1976
100-101 3 p. 186-
1 p.
artikel
512 A simple Markovian method for MTTF calculation Dubi, A.
1987
100-101 3 p. 459-462
4 p.
artikel
513 A simple non-destructive method of measuring the thickness of transparent thin films between 10 and 600 nm 1968
100-101 3 p. 282-
1 p.
artikel
514 A simple optimisation procedure for bipolar subnanosecond ICs with low power dissipation 1983
100-101 3 p. 599-
1 p.
artikel
515 A simple technique for analysis of ESD failures of dynamic RAMs using liquid crystals 1983
100-101 3 p. 593-594
2 p.
artikel
516 A simple technique for computing network reliability 1983
100-101 3 p. 592-593
2 p.
artikel
517 A simple technique for obtaining the MTBF of complex systems through numerical integration of the reliability function Burns, R.J.
1997
100-101 3 p. 397-401
5 p.
artikel
518 A simple test chip to assess chip and package design in the case of plastic assembling 1996
100-101 3 p. 449-
1 p.
artikel
519 A simplified method for evaluating time dependent fault-trees, using Weibull distribution Dubuisson, B.
1980
100-101 3 p. 347-350
4 p.
artikel
520 A simplified model for the static characteristics of amorphous silicon thin-film transistors 1987
100-101 3 p. 594-
1 p.
artikel
521 A simulation approach for computing systems reliability Alidrisi, Mustafa M.
1987
100-101 3 p. 463-467
5 p.
artikel
522 A single channel codec using an intermediate code converter White, G.F.
1981
100-101 3 p. 355-371
17 p.
artikel
523 A single-chip CMOS analog front-end for high-speed modems 1985
100-101 3 p. 590-
1 p.
artikel
524 A single substrate thin-film active telephone network using TMM capacitors and tantalum nitride resistors 1971
100-101 3 p. 147-
1 p.
artikel
525 A single unit man-machine system with varying physical conditions of the repairman Goel, L.R.
1992
100-101 3 p. 313-317
5 p.
artikel
526 A small experimental robotic PCB assembly system 1985
100-101 3 p. 590-
1 p.
artikel
527 A software technique for diagnosing and correcting memory errors 1987
100-101 3 p. 587-
1 p.
artikel
528 A source of degradation of plastic encapsulated devices 1984
100-101 3 p. 585-
1 p.
artikel
529 A special type of reliable circuit 1975
100-101 3 p. 267-
1 p.
artikel
530 Assay of mixed acid etchants by ion chromatography 1987
100-101 3 p. 594-
1 p.
artikel
531 Assembly process automation. Part 1: PLCC problems and solutions 1987
100-101 3 p. 590-
1 p.
artikel
532 Assessing the joints in surface-mounted assemblies 1987
100-101 3 p. 581-
1 p.
artikel
533 Assessment of silicone encapsulants for hybrid integrated circuits (HIC) 1978
100-101 3 p. 362-
1 p.
artikel
534 Assessment of temperature and voltage accelerating factors for 2.3–3.2nm SiO2 thin oxides stressed to hard breakdown Pic, D.
2008
100-101 3 p. 335-341
7 p.
artikel
535 Assessment of the oxide-semiconductor interface in CCDs 1977
100-101 3 p. 216-
1 p.
artikel
536 Assuring age requirements of a complex system 1984
100-101 3 p. 587-
1 p.
artikel
537 Assuring integrated circuit reliability during production 1969
100-101 3 p. 249-
1 p.
artikel
538 Assuring PCB shelf life solderability by air levelling 1979
100-101 3 p. 192-
1 p.
artikel
539 A stable delay multivibrator using a linear IC chip 1975
100-101 3 p. 274-
1 p.
artikel
540 A static capacitor method for the measurement of the surface potential of gases on evaporated metal films 1964
100-101 3 p. 201-
1 p.
artikel
541 A strategy for characterization and evaluation of ESD robustness of CMOS semiconductor technologies Voldman, S
2001
100-101 3 p. 335-348
14 p.
artikel
542 A structured approach to the design of microprocessor applications software 1983
100-101 3 p. 600-
1 p.
artikel
543 A structured testability approach for multi-chip modules based on BIST and boundary-scan 1996
100-101 3 p. 443-
1 p.
artikel
544 A study of a 2-unit system with ‘random breakdown’ of the repair facility Shankar Bhat, K.
1988
100-101 3 p. 369-371
3 p.
artikel
545 A study of factors affecting silicon growth on amorphous SiO2 surfaces 1967
100-101 3 p. 248-
1 p.
artikel
546 A study of gold ball bond intermetallic formation in PEDs using infra-red microscopy 1987
100-101 3 p. 592-
1 p.
artikel
547 A study of parasitic MOS formation mechanism in plastic encapsulated MOS devices 1977
100-101 3 p. 209-
1 p.
artikel
548 A study of Pd2Si films on silicon using Auger electron spectroscopy 1976
100-101 3 p. 188-
1 p.
artikel
549 A study of polyimide adhesion to epoxy resin in PFP using multivariate analysis of XPS spectra 1997
100-101 3 p. 539-
1 p.
artikel
550 A study of technical terms of failure and fuzzy set theory 1997
100-101 3 p. 535-
1 p.
artikel
551 A study of the breakdown testing of thermal silicon oxides and the effects of preoxidation surface treatment 1990
100-101 3 p. 625
artikel
552 A study of the layer and junction properties of boron implantation in silicon 1976
100-101 3 p. 189-
1 p.
artikel
553 A study of the majority carrier mobility in hydrogenated boron-doped silicon 1990
100-101 3 p. 625
artikel
554 A study of transistor reliability by physical analysis 1964
100-101 3 p. 197-
1 p.
artikel
555 A study of “tunnel” conduction between two metallic layers separated by a thin oxide layer 1965
100-101 3 p. 312-
1 p.
artikel
556 A study on a method of testing ion migration 1997
100-101 3 p. 545-
1 p.
artikel
557 A suggested photographic method for the direct fabrication of microelectronic circuits 1964
100-101 3 p. 199-
1 p.
artikel
558 A survey of diffusion processes for fabricating integrated circuits 1967
100-101 3 p. 248-249
2 p.
artikel
559 A survey of methods of measuring thin film thicknesses and surface irregularities Wright, P.
1963
100-101 3 p. 227-233
7 p.
artikel
560 A survey of second breakdown 1967
100-101 3 p. 242-
1 p.
artikel
561 A symbolic reliability of multiple path required system with three states In-Kyeong Choi,
1997
100-101 3 p. 429-435
7 p.
artikel
562 A system approach to reliability and life-cycle cost of process safety-systems 1997
100-101 3 p. 533-
1 p.
artikel
563 A system for an automatic detection of defects of semiconductor masks and printed circuit boards 1978
100-101 3 p. 352-
1 p.
artikel
564 A systems approach to semiconductor slicing to improve wafer quality and productivity 1973
100-101 3 p. 208-
1 p.
artikel
565 A systems approach to the design of MOS memory components 1975
100-101 3 p. 275-
1 p.
artikel
566 A system where the number of servers changes depending on the queue length Yamashiro, Mitsuo
1996
100-101 3 p. 389-391
3 p.
artikel
567 A system with two subsystems working in alternating periods Murari, K.
1982
100-101 3 p. 405-412
8 p.
artikel
568 A technique for measuring the temperature of nickel-chromium films in thin film circuits Parmee, J.L.
1965
100-101 3 p. 295-296
2 p.
artikel
569 A technique for the testing of unassembled multilayer hybrid substrates 1976
100-101 3 p. 188-
1 p.
artikel
570 A technique of realization for one class of two-testable k-valued logic elements Timoshkin, A.I.
1994
100-101 3 p. 555-558
4 p.
artikel
571 A technology for high speed computer systems 1976
100-101 3 p. 187-188
2 p.
artikel
572 A test chip design for detecting thin-film cracking in integrated circuits 1997
100-101 3 p. 531-
1 p.
artikel
573 A test for the BMRL-t 0 class Lee, Seung Min
1997
100-101 3 p. 457-459
3 p.
artikel
574 A testing-effort dependent software reliability model and its application Yamada, Shigeru
1987
100-101 3 p. 507-522
16 p.
artikel
575 A theoretical derivation of the log-normal distribution of time-dependent dielectric breakdown in thin oxides 1990
100-101 3 p. 625
artikel
576 A thermoelectric servo control for ultra-high-vacuum applications 1968
100-101 3 p. 282-
1 p.
artikel
577 A thermo-mechanical study on the electrical resistance of aluminum wire conductors Liu, De-Shin
2002
100-101 3 p. 367-374
8 p.
artikel
578 A thick film capacitive temperature sensor using barium strontium titanate glass formulations 1980
100-101 3 p. 389-
1 p.
artikel
579 A thick film guidance unit for the rapier missile 1974
100-101 3 p. 166-
1 p.
artikel
580 A thick-film humidity sensor 1976
100-101 3 p. 187-
1 p.
artikel
581 A thick-film wide band amplifier 1976
100-101 3 p. 186-
1 p.
artikel
582 A thin-film/semiconductor thermocouple for microwave power measurements 1975
100-101 3 p. 282-
1 p.
artikel
583 A three-parameter Weibull-like fitting function for flip-chip die strength data Zhao, Jie-Hua
2004
100-101 3 p. 459-470
12 p.
artikel
584 A total framework for semiconductor production planning and scheduling 1987
100-101 3 p. 591-
1 p.
artikel
585 A treatment of impurity diffusion in oxidizing ambients 1975
100-101 3 p. 280-281
2 p.
artikel
586 A tuned microelectronic amplifier using thin films Windle, D.J.
1965
100-101 3 p. 241-242
2 p.
artikel
587 A two-dimensional placement algorithm for the layout of electronic circuits Gupta, Hariom
1980
100-101 3 p. 323-328
6 p.
artikel
588 A two failure modes system with cold stand-by units Dhillon, Balbir S.
1978
100-101 3 p. 251-252
2 p.
artikel
589 A two failure modes system with cold stand-by units 1979
100-101 3 p. 189-
1 p.
artikel
590 A two micron metal interconnect process over severe topography 1986
100-101 3 p. 582-
1 p.
artikel
591 A two (multicomponent) unit parallel system with standby and common cause failure Goel, L.R.
1984
100-101 3 p. 415-418
4 p.
artikel
592 A two-unit deteriorating standby system with inspection Goel, L.R.
1984
100-101 3 p. 435-438
4 p.
artikel
593 A two-unit redundant system Subramanian, R.
1979
100-101 3 p. 277-278
2 p.
artikel
594 Auger and radiative recombination of acceptor bound excitons in semiconductors 1979
100-101 3 p. 199-
1 p.
artikel
595 A UHF thick film tuner 1975
100-101 3 p. 283-
1 p.
artikel
596 A unified algorithm of reliability estimation of k-out-of-n systems implied by the structure function Biernat, Janusz
1993
100-101 3 p. 395-401
7 p.
artikel
597 A unified formula for analysis of some network reliability problems 1983
100-101 3 p. 593-
1 p.
artikel
598 A user's performance profile of a thick-film resistor system 1980
100-101 3 p. 387-
1 p.
artikel
599 Australia builds VLSI skills 1983
100-101 3 p. 595-
1 p.
artikel
600 Automated board testing: coping with complex circuits 1984
100-101 3 p. 583-
1 p.
artikel
601 Automated contactless SEM testing for VLSI development and failure analysis 1983
100-101 3 p. 594-
1 p.
artikel
602 Automated mask production for semiconductor technology 1968
100-101 3 p. 284-
1 p.
artikel
603 Automated measurement system for the investigation of surface state distribution Price, T.E.
1983
100-101 3 p. 555-563
9 p.
artikel
604 Automated synthesis of pseudo-exhaustive test generator in VLSI BIST design 1996
100-101 3 p. 447-
1 p.
artikel
605 Automated tape carrier bonding for hybrids 1978
100-101 3 p. 230-
1 p.
artikel
606 Automated wafer processing using robots 1985
100-101 3 p. 586-
1 p.
artikel
607 Automatic alignment for direct step and repeat printing on silicon 1979
100-101 3 p. 193-
1 p.
artikel
608 Automatic cleaning technique for pellicles 1987
100-101 3 p. 590-
1 p.
artikel
609 Automatic control and monitoring system for thin-film deposition 1967
100-101 3 p. 257-
1 p.
artikel
610 Automatic detection of semiconductor mask defects 1977
100-101 3 p. 213-
1 p.
artikel
611 Automatic electronic component failure-rate prediction with MIL-HDBK-217B 1978
100-101 3 p. 351-
1 p.
artikel
612 4713815 Automatic fault location system for electronic devices Bryan, Dennis P
1988
100-101 3 p. 500-
1 p.
artikel
613 Automatic in-circuit inspection of printed circuit board assemblies 1980
100-101 3 p. 376-
1 p.
artikel
614 Automatic laser resistor trimming 1973
100-101 3 p. 216-
1 p.
artikel
615 Automatic manufacture of custom hybrid microelectronic circuits 1976
100-101 3 p. 187-
1 p.
artikel
616 Automatic test equipment 1969
100-101 3 p. 247-
1 p.
artikel
617 Automatic wire bonder for external connectors for thin film circuits 1972
100-101 3 p. 245-246
2 p.
artikel
618 Automating PCB production 1984
100-101 3 p. 590-
1 p.
artikel
619 Automating the epitaxial process 1975
100-101 3 p. 271-
1 p.
artikel
620 Automation applied to repair and maintenance of electronic systems 1975
100-101 3 p. 269-
1 p.
artikel
621 Automation of IC manufacturing: control problems 1987
100-101 3 p. 591-
1 p.
artikel
622 Automation of implanter equipment 1986
100-101 3 p. 589-
1 p.
artikel
623 Availability allocation using a family of hyperbolic cost functions 1976
100-101 3 p. 180-
1 p.
artikel
624 Availability analysis of a repairable system with non-repairable standby units 1977
100-101 3 p. 210-
1 p.
artikel
625 Availability analysis of a two-unit cold standby system with two switching failure modes Goel, L.R.
1984
100-101 3 p. 419-423
5 p.
artikel
626 Availability measures of human-equipment standby redundant data-flow system with application to NASA deep space station Issa, Tareq N.
1990
100-101 3 p. 573-583
artikel
627 Availability of an (m, N) system with repair 1979
100-101 3 p. 188-189
2 p.
artikel
628 Availability of K-out-of-N:G systems with M failure modes Moustafa, Magdi S.
1996
100-101 3 p. 385-388
4 p.
artikel
629 Availability study of ETRR-1 primary cooling system El Messiry, A.M.
1994
100-101 3 p. 545-553
9 p.
artikel
630 Availibility as a criterion of system performance 1975
100-101 3 p. 269-270
2 p.
artikel
631 Avalanche breakdown calculations for a planar p-n junction 1967
100-101 3 p. 243-
1 p.
artikel
632 Avalanche breakdown in narrow gap semiconductors in crossed fields 1986
100-101 3 p. 586-
1 p.
artikel
633 Avalanche breakdown of diffused silicon p-n junctions 1967
100-101 3 p. 253-
1 p.
artikel
634 Avalanche-injected electron currents in SiO2 at high injection densities 1975
100-101 3 p. 279-
1 p.
artikel
635 A valence bond theory of off-center impurities in silicon 1985
100-101 3 p. 590-591
2 p.
artikel
636 A van der Pauw resistor structure for determining mask superposition errors on semiconductor slices 1979
100-101 3 p. 191-192
2 p.
artikel
637 AV-8B design for maintainability 1986
100-101 3 p. 576-
1 p.
artikel
638 Average mobilities of carriers in subdoped silicon layers 1983
100-101 3 p. 601-
1 p.
artikel
639 A versatile design giving both N-type and S-type of negative-resistances 1973
100-101 3 p. 207-
1 p.
artikel
640 A versatile integrated logarithmic video amplifier 1968
100-101 3 p. 283-
1 p.
artikel
641 A versatile manufacturing method for the production of complex hybrid microelectronics assemblies 1969
100-101 3 p. 256-257
2 p.
artikel
642 A versatile packaging system for hybrids 1972
100-101 3 p. 246-
1 p.
artikel
643 A vertical submicron SiC thin film transistor 1996
100-101 3 p. 453-454
2 p.
artikel
644 A viscosity gauge for pressure measurement in the range 10−6 to 10−4 torr 1967
100-101 3 p. 256-
1 p.
artikel
645 A VLSI-ATE selection matrix 1983
100-101 3 p. 591-
1 p.
artikel
646 A VLSI bipolar metallization design with three-level wiring and area array solder connections 1983
100-101 3 p. 597-
1 p.
artikel
647 A VLSI priority packet queue with inheritance and overwrite 1997
100-101 3 p. 542-
1 p.
artikel
648 A 28 volt logic microcircuit 1968
100-101 3 p. 283-
1 p.
artikel
649 A wafer level testability approach based on an improved scan insertion technique 1997
100-101 3 p. 542-
1 p.
artikel
650 A yield analysis model for hybrid microelectronic circuits 1973
100-101 3 p. 214-
1 p.
artikel
651 Bake effects in positive photoresist 1984
100-101 3 p. 591-
1 p.
artikel
652 Barrier energies in metal-silicon dioxide-silicon structures 1967
100-101 3 p. 250-
1 p.
artikel
653 Basic considerations in integrated circuit design 1965
100-101 3 p. 306-
1 p.
artikel
654 Basic problems for electromigration in VLSI applications 1983
100-101 3 p. 593-
1 p.
artikel
655 Basis sets for the study of point defects in solids using Green's-function methods 1980
100-101 3 p. 386-
1 p.
artikel
656 Batch acceptance sampling by attributes to reduce overall costs 1970
100-101 3 p. 217-
1 p.
artikel
657 Bathtub failure rate and upside-down bathtub mean residual life 1997
100-101 3 p. 536-
1 p.
artikel
658 Bayes analysis for fault location in distributed systems 1996
100-101 3 p. 445-
1 p.
artikel
659 Bayes estimation in life testing and reliability: a multivariate case 1975
100-101 3 p. 267-
1 p.
artikel
660 Bayesian acceptance sampling 1973
100-101 3 p. 199-
1 p.
artikel
661 Bayesian estimation of constant failure rate and unavailability 1983
100-101 3 p. 594-
1 p.
artikel
662 Bayesian sequential estimation of two parameters of a Weibull distribution Soman, K.P.
1994
100-101 3 p. 509-519
11 p.
artikel
663 Beam-lead devices for hybrid integrated circuits 1972
100-101 3 p. 247-
1 p.
artikel
664 Beam lead technology 1972
100-101 3 p. 240-241
2 p.
artikel
665 Beam tape plus automated handling cuts IC manufacturing costs 1978
100-101 3 p. 230-
1 p.
artikel
666 4701703 Bed-of-pins test fixture Malloy, James T
1988
100-101 3 p. 497-
1 p.
artikel
667 Be effective—Not down Reiche, Hans
1973
100-101 3 p. 181-182
2 p.
artikel
668 Behaviour of anisotropic conductive joints under mechanical loading Tan, C.W.
2003
100-101 3 p. 481-486
6 p.
artikel
669 Behaviour of a two-unit standby redundant system with imperfect switching and delayed repair Kumar, Ashok
1980
100-101 3 p. 315-321
7 p.
artikel
670 Behaviour of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption and wave soldering 1997
100-101 3 p. 541-542
2 p.
artikel
671 Behaviour of film conductance during vacuum deposition 1964
100-101 3 p. 203-
1 p.
artikel
672 Behind the “bathtub”-curve A new model and its consequences Møltoft, Jørgen
1983
100-101 3 p. 489-500
12 p.
artikel
673 Bellcore system hardware reliability prediction 1990
100-101 3 p. 617
artikel
674 Benefit analysis of a two-unit standby system subject to jerks with installation time Saini, Ashok
1996
100-101 3 p. 429-434
6 p.
artikel
675 Benefits of integrated-circuit burn-in to obtain high reliability parts 1987
100-101 3 p. 582-
1 p.
artikel
676 Best linear unbiased estimator of the Rayleigh scale parameter based on fairly large censored samples 1997
100-101 3 p. 535-
1 p.
artikel
677 Better Bipolar-MOS process yields linear ICs with good ac and dc specs 1975
100-101 3 p. 271-
1 p.
artikel
678 Better understanding of FET operation yields viable monolithic J-FET op. amp. 1973
100-101 3 p. 208-
1 p.
artikel
679 Beware of the general-purpose microprocessor 1977
100-101 3 p. 207-
1 p.
artikel
680 Bias humidity performance and failure mechanisms of nonhermetic aluminum SIC's in an environment contaminated with Cl2 1984
100-101 3 p. 585-
1 p.
artikel
681 Bias humidity performance and failure mechanisms of non-hermetic aluminum SICs in an environment contaminated with Cl2 1983
100-101 3 p. 588-
1 p.
artikel
682 Bias influence on corrosion of plastic encapsulated device metal systems 1977
100-101 3 p. 208-
1 p.
artikel
683 Bibliography and chapter headings of some useful books on reliability and microminiaturization 1962
100-101 3 p. 271-274
4 p.
artikel
684 Bibliography of literature on chemical systems reliability 1986
100-101 3 p. 575-
1 p.
artikel
685 Bibliography of literature on transit system reliability Dhillon, Balbir S.
1982
100-101 3 p. 641-651
11 p.
artikel
686 BiCMOS circuitry: the best of both worlds 1990
100-101 3 p. 623
artikel
687 Big bubble chips point the way to low-cost memories 1978
100-101 3 p. 356-
1 p.
artikel
688 Binary transversal filter Bozic, S.M.
1979
100-101 3 p. 219-222
4 p.
artikel
689 Bipolar chip design for a VLSI microprocessor 1983
100-101 3 p. 596-
1 p.
artikel
690 Bipolar LSI computing elements usher in new era of digital design 1975
100-101 3 p. 274-
1 p.
artikel
691 Bipolar memories 1975
100-101 3 p. 276-
1 p.
artikel
692 Bi-polar technology. A re-evaluation 1975
100-101 3 p. 277-
1 p.
artikel
693 Bi-polar technology. Integrated injection logic—present and future 1975
100-101 3 p. 276-
1 p.
artikel
694 Birefringent tape—a new, easier technique for separating thin film and printed circuit master drawings with perfect registration 1967
100-101 3 p. 257-
1 p.
artikel
695 Bit-slice parts approach ECL speeds with TTL power levels 1979
100-101 3 p. 195-
1 p.
artikel
696 Blowholes and Voids: causes and cures 1977
100-101 3 p. 210-
1 p.
artikel
697 BLUEs of location and scale parameters of laplace distribution based on type-II censored samples and associated inference Balakrishnan, N.
1996
100-101 3 p. 371-374
4 p.
artikel
698 Board inventories mount 1978
100-101 3 p. 229-
1 p.
artikel
699 Board level reliability of a stacked CSP subjected to cyclic bending Wu, J.D
2002
100-101 3 p. 407-416
10 p.
artikel
700 Boat heat-up in diffusion furnaces 1967
100-101 3 p. 250-
1 p.
artikel
701 Bonding of fluorine-implanted and annealed silicon 1986
100-101 3 p. 589-
1 p.
artikel
702 Bonding systems for microinterconnect tape technology 1978
100-101 3 p. 229-
1 p.
artikel
703 Bond-integrity testing of sapphire chips mounted with eutectic preforms 1985
100-101 3 p. 583-
1 p.
artikel
704 Bond strength of metal layers on strip line substrates 1976
100-101 3 p. 182-
1 p.
artikel
705 Book Review 1998
100-101 3 p. 472-
1 p.
artikel
706 Book Review 1998
100-101 3 p. 471-
1 p.
artikel
707 Book Review 1998
100-101 3 p. 473-
1 p.
artikel
708 Book Review 1998
100-101 3 p. 475-
1 p.
artikel
709 Book Review 1998
100-101 3 p. 477-
1 p.
artikel
710 Book Review 1998
100-101 3 p. 474-
1 p.
artikel
711 Book Review 1998
100-101 3 p. 478-
1 p.
artikel
712 Book review 1999
100-101 3 p. 425-
1 p.
artikel
713 Book review 1999
100-101 3 p. 427-
1 p.
artikel
714 Book review 1999
100-101 3 p. 429-
1 p.
artikel
715 Book Review 1998
100-101 3 p. 476-
1 p.
artikel
716 Boolean neural network realization of an adder-subtractor cell Singh, H.
1996
100-101 3 p. 367-369
3 p.
artikel
717 Boosting reliability of disk memories 1970
100-101 3 p. 219-
1 p.
artikel
718 Border traps: Issues for MOS radiation response and long-term reliability Fleetwood, D.M.
1995
100-101 3 p. 403-428
26 p.
artikel
719 Bounds for reliability of k-within two-dimensional consecutive-r-out-of-n failure systems Makri, F.S.
1996
100-101 3 p. 341-345
5 p.
artikel
720 Bounds of age replacement time Nakagawa, T.
1982
100-101 3 p. 603-609
7 p.
artikel
721 Bounds on system reliability when components are dependent Lai, C.D.
1986
100-101 3 p. 455-459
5 p.
artikel
722 Breakdown voitage of planar silicon junctions 1967
100-101 3 p. 246-
1 p.
artikel
723 Breakdown walkout in planar p-n junctions 1978
100-101 3 p. 227-
1 p.
artikel
724 Bridging the gap between design and test Kuzel, Gerald L.
1989
100-101 3 p. 365-370
6 p.
artikel
725 Bright future for laser trimming 1976
100-101 3 p. 183-
1 p.
artikel
726 Build a sawtooth generator with three ICs 1971
100-101 3 p. 148-
1 p.
artikel
727 Build gated video amplifiers 1972
100-101 3 p. 241-
1 p.
artikel
728 Building-in reliability for silver die attached light emitting diodes Chim, W.K.
1994
100-101 3 p. 495-507
13 p.
artikel
729 Built-in reliability 1965
100-101 3 p. 301-
1 p.
artikel
730 Built-in test strategies for military systems 1990
100-101 3 p. 621
artikel
731 Bulk micromachining of Si by lithography and reactive ion etching (LIRIE) 1997
100-101 3 p. 543-
1 p.
artikel
732 Bulk negative resistance device operated in a relaxation mode 1970
100-101 3 p. 227-
1 p.
artikel
733 Bump formation for flip chip and CSP by solder paste printing Kloeser, Joachim
2002
100-101 3 p. 391-398
8 p.
artikel
734 4713611 Burn-in apparatus for integrated circuits mounted on a carrier tape Solstad, Russell V
1988
100-101 3 p. 499-500
2 p.
artikel
735 Burn-in effectiveness evaluation a lotus 1-2-3™ application 1987
100-101 3 p. 586-
1 p.
artikel
736 Burn-in: what's in a name? 1985
100-101 3 p. 581-
1 p.
artikel
737 Bus-connectable TTL adds a new state to binary logic 1972
100-101 3 p. 243-
1 p.
artikel
738 Busy-period analysis of a one-server two-unit system subject to non-negligible inspection time Gopalan, M.N.
1983
100-101 3 p. 453-465
13 p.
artikel
739 CAD program evaluates circuits, generates tests automatically 1983
100-101 3 p. 591-
1 p.
artikel
740 CAD systems: mapping out tomorrow's ICs 1985
100-101 3 p. 586-
1 p.
artikel
741 Calculating the speed of pumping systems 1967
100-101 3 p. 256-257
2 p.
artikel
742 Calculating the time-specific frequency of system failure 1980
100-101 3 p. 379-
1 p.
artikel
743 Calculation of node-pair reliability in large networks with unreliable nodes 1996
100-101 3 p. 446-
1 p.
artikel
744 Calculation of the capacitance of a semiconductor surface, with application to silicon 1965
100-101 3 p. 309-
1 p.
artikel
745 Calculation of thermoelastic stresses in microelectronics Matthys, Lieven
1998
100-101 3 p. 443-448
6 p.
artikel
746 Calculations of cutoff frequency, breakdown voltage and capacitance for diffused junctions in thin epitaxial silicon layers 1967
100-101 3 p. 252-253
2 p.
artikel
747 Calendar 2010
100-101 3 p. I-III
nvt p.
artikel
748 Calendar of forthcoming events 2002
100-101 3 p. I-VIII
nvt p.
artikel
749 Calendar of forthcoming events 2003
100-101 3 p. I-IX
nvt p.
artikel
750 Calendar of international conferences, symposia, lectures and meetings of interest 1994
100-101 3 p. 577-579
3 p.
artikel
751 Calendar of international conferences, symposia, lectures and meetings of interest 1982
100-101 3 p. 323-325
3 p.
artikel
752 Calendar of international conferences, symposia, lectures and meetings of interest 1984
100-101 3 p. 367-369
3 p.
artikel
753 Calendar of international conferences, symposia, lectures and meetings of interest 1986
100-101 3 p. 405-407
3 p.
artikel
754 Calendar of international conferences, symposia, lectures and meetings of interest 1987
100-101 3 p. 399-403
5 p.
artikel
755 Calendar of international conferences, symposia, lectures and meetings of interest 1983
100-101 3 p. 407-410
4 p.
artikel
756 Calendar of international conferences, symposia, lectures and meetings of interest 1988
100-101 3 p. 335-339
5 p.
artikel
757 Calendar of international conferences, symposia, lectures and meetings of interest 1973
100-101 3 p. 183-184
2 p.
artikel
758 Calendar of international conferences, symposia, lectures and meetings of interest 1978
100-101 3 p. 333-335
3 p.
artikel
759 Calendar of international conferences, symposia, lectures and meetings of interest 1978
100-101 3 p. 205-209
5 p.
artikel
760 Calendar of international conferences, symposia, lectures and meetings of interest 1974
100-101 3 p. 151-152
2 p.
artikel
761 Calendar of international conferences, symposia, lectures and meetings of interest 1975
100-101 3 p. 251-252
2 p.
artikel
762 Calendar of international conferences, symposia, lectures and meetings of interest 1972
100-101 3 p. 229-230
2 p.
artikel
763 Calendar of international conferences, symposia, lectures and meetings of interest 1977
100-101 3 p. 183-184
2 p.
artikel
764 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1970
100-101 3 p. 203-205
3 p.
artikel
765 Calendar of international conferences, symposia, lectures and meetings of interest 1976
100-101 3 p. 171-172
2 p.
artikel
766 Calendar of international conferences, symposia, lectures and meetings of interest 1980
100-101 3 p. 173-175
3 p.
artikel
767 Calendar of international conferences, symposia, lectures and meetings of interest 1969
100-101 3 p. 263-265
3 p.
artikel
768 Calendar of international conferences, symposia, lectures and meetings of interest 1979
100-101 3 p. 169-171
3 p.
artikel
769 Calibrating microscopic linewidth measurement systems 1987
100-101 3 p. 590-
1 p.
artikel
770 Calibration of ion implantation systems 1979
100-101 3 p. 203-
1 p.
artikel
771 Call for papers 1972
100-101 3 p. 233-
1 p.
artikel
772 Call for papers 1970
100-101 3 p. 209-
1 p.
artikel
773 Call setup time standards Sultan, Torky I.
1987
100-101 3 p. 523-530
8 p.
artikel
774 CAM system requirements for ASIC manufacturing 1987
100-101 3 p. 590-591
2 p.
artikel
775 Can additional electron scattering decrease resistance? 1964
100-101 3 p. 205-
1 p.
artikel
776 Capacitance and doping profiles of ion-implanted, buried-channel MOSFETS 1979
100-101 3 p. 202-203
2 p.
artikel
777 Capacitance behavior of composites for supercapacitor applications prepared with different durations of graphene/nanoneedle MnO2 reduction Kim, Myeongjin
2014
100-101 3 p. 587-594
8 p.
artikel
778 Capacitance extraction of integrated-circuit interconnects by matrix decomposition based on MEI concept Liu, Y.W.
2000
100-101 3 p. 451-454
4 p.
artikel
779 Capacitance-voltage dependence on zinc-diffused GaAs p-n junctions 1965
100-101 3 p. 309-
1 p.
artikel
780 Capacitives methods of determination of the energy distribution of electron traps in semiconductors 1972
100-101 3 p. 244-
1 p.
artikel
781 Capacitor designs aim for IC compatibility 1970
100-101 3 p. 225-
1 p.
artikel
782 Capacity consideration in reliability analysis of communication systems 1983
100-101 3 p. 590-
1 p.
artikel
783 Care in packaging off-the-shelf LSI keeps 32-bit mini-computer compact 1983
100-101 3 p. 599-
1 p.
artikel
784 Carrier accumulation and space-charge-limited current flow in fleld-effect transistors 1971
100-101 3 p. 148-
1 p.
artikel
785 Carrier collection in a semiconductor quantum well 1979
100-101 3 p. 197-
1 p.
artikel
786 Carrier fluctuation noise in a MOSFET channel due to traps in the oxide 1978
100-101 3 p. 233-
1 p.
artikel
787 Carrier surface scattering in silicon inversion layers 1965
100-101 3 p. 307-
1 p.
artikel
788 Carrier transport and storage effects in Au ion implanted SiO2 structures 1973
100-101 3 p. 216-
1 p.
artikel
789 Cast: An electrical stress test to monitor single bit failures in flash-EEPROM structures Cappelletti, P.
1997
100-101 3 p. 473-481
9 p.
artikel
790 Catastrophic burn out in power VDMOS field-effect transistors 1984
100-101 3 p. 583-
1 p.
artikel
791 Cathodic pulverization, its mechanisms, its means of operation, its original applications in the field of thin layers 1965
100-101 3 p. 312-
1 p.
artikel
792 CCD and bubble memories: System implications 1978
100-101 3 p. 229-
1 p.
artikel
793 CCDs bring solid-state benefits to bulk storage for computers 1978
100-101 3 p. 230-
1 p.
artikel
794 Ceramic multicomponent modules: a new approach to miniaturization 1996
100-101 3 p. 451-
1 p.
artikel
795 4489397 Chain configurable polycellular wafer scale integrated circuit Lee, KinH
1985
100-101 3 p. 605-
1 p.
artikel
796 CHAMP: The Cranfield Hybrid Automatic Maintenance Program 1972
100-101 3 p. 238-
1 p.
artikel
797 Changes in oxygen precipitation density during wafer processing 1986
100-101 3 p. 584-
1 p.
artikel
798 Channel-carrier mobility parameters for 4H SiC MOSFETs Linewih, Handoko
2003
100-101 3 p. 405-411
7 p.
artikel
799 Characterisation of I2L gates 1979
100-101 3 p. 193-
1 p.
artikel
800 Characterisation of I2L gates 1979
100-101 3 p. 193-
1 p.
artikel
801 Characterisation of silicon metallization systems using energetic ion backscattering 1975
100-101 3 p. 278-
1 p.
artikel
802 Characteristics and failure analysis of solid tantalum capacitors 1979
100-101 3 p. 186-
1 p.
artikel
803 Characteristics and reliability of 100 Å oxides 1985
100-101 3 p. 592-
1 p.
artikel
804 Characteristics of an indium-tin oxide transparent conductor deposited from organometallic compositions 1979
100-101 3 p. 200-
1 p.
artikel
805 Characteristics of parallel-plate transmission lines on silicon-siliconoxide system 1971
100-101 3 p. 145-
1 p.
artikel
806 Characteristics of random telegraph signal noise in time delay integration CMOS image sensor Han, Liqiang
2013
100-101 3 p. 400-404
5 p.
artikel
807 Characteristics of the diamond cut-off wheel for germanium 1964
100-101 3 p. 199-
1 p.
artikel
808 Characteristics of the intrinsic defects in unintentionally doped 4H–SiC after thermal annealing Cheng, Ping
2011
100-101 3 p. 572-575
4 p.
artikel
809 Characteristics of the junction-gate field effect transistor with short channel length 1972
100-101 3 p. 244-
1 p.
artikel
810 Characteristics of three-terminal metal-tunnel Oxide-n/p+ devices 1980
100-101 3 p. 385-
1 p.
artikel
811 Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering Yang, Ping-Feng
2008
100-101 3 p. 389-394
6 p.
artikel
812 Characterization and screening of SiO2 defects in EEPROM structures 1984
100-101 3 p. 588-
1 p.
artikel
813 Characterization control, and use of dielectric charge effects in silicon technology 1970
100-101 3 p. 227-
1 p.
artikel
814 Characterization of a chromium-gold deposition process for the production of thin film hybrid microcircuits 1975
100-101 3 p. 284-
1 p.
artikel
815 Characterization of a thick-film resistor conduction mechanism 1973
100-101 3 p. 214-
1 p.
artikel
816 Characterization of bias sputtered metallization for IC technology 1985
100-101 3 p. 589-
1 p.
artikel
817 Characterization of CCD technology on 64 × 128 element photosensor 1976
100-101 3 p. 183-
1 p.
artikel
818 Characterization of die attach failure modes in leadless chip carrier (LCC) packages by auger electron spectroscopy 1985
100-101 3 p. 582-
1 p.
artikel
819 Characterization of functional relationship between temperature and microelectronic reliability Lall, Pradeep
1995
100-101 3 p. 377-402
26 p.
artikel
820 Characterization of horizontal Bridgman-grown semi-insulating GaAs for ion implantation 1983
100-101 3 p. 604-
1 p.
artikel
821 Characterization of interface states in thin films of thermally grown SiO2 1985
100-101 3 p. 591-
1 p.
artikel
822 Characterization of interfacial thermal resistance by acoustic micrography imaging Haque, Shatil
2000
100-101 3 p. 465-476
12 p.
artikel
823 Characterization of multiple deep level systems in semiconductor junctions by admittance measurements 1974
100-101 3 p. 167-
1 p.
artikel
824 Characterization of semiconductor interfaces using a modified mixed mode bending apparatus Thijsse, J.
2008
100-101 3 p. 401-407
7 p.
artikel
825 Characterization of thick-film resistives for maximum production yields 1971
100-101 3 p. 152-
1 p.
artikel
826 Characterizations of the exponential distribution via mixing distributions Gharib, M.
1996
100-101 3 p. 293-305
13 p.
artikel
827 Characterizing plasma phosphorus-doped oxides 1986
100-101 3 p. 586-
1 p.
artikel
828 Charge coupled devices—basic operation and principles 1977
100-101 3 p. 212-
1 p.
artikel
829 Charge transfer controlled surface interactions between oxygen and CdSe films 1964
100-101 3 p. 204-
1 p.
artikel
830 Charge-transfer devices filter complex communications signals 1975
100-101 3 p. 274-
1 p.
artikel
831 Chemical and ambient effects on surface conduction is passivated silicon semiconductor 1965
100-101 3 p. 308-
1 p.
artikel
832 Chemically selective, anisotropic plasma etching 1978
100-101 3 p. 235-
1 p.
artikel
833 CHIL and I2L with passive isolation 1976
100-101 3 p. 181-
1 p.
artikel
834 Chip checks and compares characters 1979
100-101 3 p. 196-
1 p.
artikel
835 Chip corrosion in plastic packages Berg, Howard M.
1980
100-101 3 p. 247-263
17 p.
artikel
836 Chip cuts parts count in error correction networks 1979
100-101 3 p. 195-
1 p.
artikel
837 Chip formats hard-sectored floppies 1979
100-101 3 p. 196-
1 p.
artikel
838 Chip implantation—alternative in the group technology 1983
100-101 3 p. 595-
1 p.
artikel
839 Chip makers ride CRT controller wave 1980
100-101 3 p. 383-
1 p.
artikel
840 Chip manufacturing: matching production plan with customer requirements 1996
100-101 3 p. 450-
1 p.
artikel
841 Chip-module package interfaces 1979
100-101 3 p. 192-
1 p.
artikel
842 4703483 Chip on chip type integrated circuit device Enomoto, Yoshinori
1988
100-101 3 p. 498-
1 p.
artikel
843 Chip scale package: ‘a lightly dressed LSI chip’ 1997
100-101 3 p. 538-
1 p.
artikel
844 Chip type aluminum electrolytic capacitors feature SMT-compatibility, low profiles 1990
100-101 3 p. 617
artikel
845 Choice of a process inspection scheme for attribute data 1971
100-101 3 p. 143-
1 p.
artikel
846 Chromium/cobalt—an extremely versatile thin-film technology 1971
100-101 3 p. 152-
1 p.
artikel
847 Chromium masks 1970
100-101 3 p. 222-
1 p.
artikel
848 Circuit cost reduction 1973
100-101 3 p. 206-
1 p.
artikel
849 4549101 Circuit for generating test equalization pulse Sood, LalC
1986
100-101 3 p. 600-
1 p.
artikel
850 4714876 Circuit for initiating test modes Gay, Richard
1988
100-101 3 p. 500-
1 p.
artikel
851 4847838 Circuit for testing the bus structure of a printed wiring card Kralik, Ivan
1990
100-101 3 p. ii
artikel
852 Circuit level interconnect reliability study using 3D circuit model He, Feifei
2010
100-101 3 p. 376-390
15 p.
artikel
853 4540857 Circuit testing of telephone grids or the like Parsons, DonaldF
1986
100-101 3 p. 597-
1 p.
artikel
854 Cleaning processes for HIC's with solder paste 1985
100-101 3 p. 593-594
2 p.
artikel
855 Cleanliness and the cleaning of silicon wafers 1977
100-101 3 p. 213-
1 p.
artikel
856 Clip-and-read comparator finds IC failures 1972
100-101 3 p. 236-
1 p.
artikel
857 C-MOS—a status report 1975
100-101 3 p. 276-
1 p.
artikel
858 C-MOS chip set gives new life to twisted pairs for local networks 1983
100-101 3 p. 599-
1 p.
artikel
859 C-MOS codec splits transmitting, receiving sections 1979
100-101 3 p. 195-
1 p.
artikel
860 C-MOS converters resolve 12 bits 1978
100-101 3 p. 356-
1 p.
artikel
861 CMOS for high-density gate arrays 1985
100-101 3 p. 590-
1 p.
artikel
862 C-MOS gets a rise out of LSI 1978
100-101 3 p. 358-
1 p.
artikel
863 C-MOS LSI: comparing second-generation approaches 1980
100-101 3 p. 381-
1 p.
artikel
864 CMOS single-chip digital signal processor 1985
100-101 3 p. 590-
1 p.
artikel
865 8504966 CMOS spare circuit Clemons, DonaldGordon
1986
100-101 3 p. 601-
1 p.
artikel
866 C-MOS specifications: Don't take them for granted 1975
100-101 3 p. 270-
1 p.
artikel
867 CMOS test chip design for process problem debugging and yield prediction experiments 1987
100-101 3 p. 582-
1 p.
artikel
868 C/MOS watch kit aims at potential $50 million market 1972
100-101 3 p. 242-
1 p.
artikel
869 Codeposition vs layering of sputtered silicide films 1986
100-101 3 p. 587-
1 p.
artikel
870 Coding and decoding of Wafers 1980
100-101 3 p. 381-
1 p.
artikel
871 Colloquium on Microbonding 1966
100-101 3 p. ii-
1 p.
artikel
872 Combined hardware/software reliability predictions 1986
100-101 3 p. 578-
1 p.
artikel
873 Combining diagnosis and emulation yields fast fault-finding 1978
100-101 3 p. 352-
1 p.
artikel
874 Combining functional and structural approaches in test generation for digital systems Ubar, Raimund
1998
100-101 3 p. 317-329
13 p.
artikel
875 Common-cause failure analysis of a k-out-of-n:G system with repairable units Dhillon, B.S.
1994
100-101 3 p. 429-442
14 p.
artikel
876 Common-chip for use in disk and diskette controllers 1983
100-101 3 p. 599-
1 p.
artikel
877 Common market eyes VLSI effort 1979
100-101 3 p. 191-
1 p.
artikel
878 Compact modeling of short-channel effects in symmetric and asymmetric 3-T/4-T double gate MOSFETs Mohammadi, Saeed
2011
100-101 3 p. 543-549
7 p.
artikel
879 Companding D/A and A/D converters Nimmo, R.
1981
100-101 3 p. 343-353
11 p.
artikel
880 Comparative advantages of in-house custom design of MOS LSI 1975
100-101 3 p. 271-
1 p.
artikel
881 Comparative analysis of network reliability algorithms Holovac, Srdjan
1989
100-101 3 p. 425-432
8 p.
artikel
882 Comparative investigation of thick-film and thin-film components and MIC's up to 16 GHz 1976
100-101 3 p. 187-
1 p.
artikel
883 Comparative studies of photoresist processing of microelectronics regarding chemical pollution, shortage and cost 1976
100-101 3 p. 182-
1 p.
artikel
884 Compare reliability at a glance 1971
100-101 3 p. 144-
1 p.
artikel
885 Comparison between trap and self-heating induced mobility degradation in AlGaN/GaN HEMTs Kalavagunta, Aditya
2014
100-101 3 p. 570-574
5 p.
artikel
886 Comparison of attribute reliability growth models 1984
100-101 3 p. 586-
1 p.
artikel
887 Comparison of bipolar and MOS integrated circuits 1969
100-101 3 p. 255-
1 p.
artikel
888 Comparison of different flex materials in high density flip chip on flex applications Palm, Petteri
2003
100-101 3 p. 445-451
7 p.
artikel
889 Comparison of different SOI technologies: assets and liabilities 1984
100-101 3 p. 592-
1 p.
artikel
890 Comparison of modulation doped effect in negative differential resistance field effect transistors (NDRFETs) Liu, Rong-Chau
1998
100-101 3 p. 367-372
6 p.
artikel
891 Comparison of predicted and demonstrated reliability and maintainability figures 1969
100-101 3 p. 252-
1 p.
artikel
892 Comparison of surface recombination effect in GaAs-based heterostructure-emitter and heterostructure-base transistors (HEHBTs) Liu, Rong-Chau
1998
100-101 3 p. 361-365
5 p.
artikel
893 Comparison of theoretical and empirical lifetimes for minority carriers in heavily doped silicon 1985
100-101 3 p. 591-
1 p.
artikel
894 Comparison of the structure of amorphous Ge and GaAs 1975
100-101 3 p. 280-
1 p.
artikel
895 Comparison of three-state probabilities under steady-state and transient conditions using both Laplace Transforms and Flow-Graph Methods, when applied to four TVA models Qamber, Isa S.
1994
100-101 3 p. 463-473
11 p.
artikel
896 Comparison of type-I and type-II accelerated life tests for selecting the most reliable product 1996
100-101 3 p. 445-
1 p.
artikel
897 Comparisons of block diagram and Markov method system reliability and mean time to failure results for constant and non-constant unit failure rates Dhillon, B.S.
1997
100-101 3 p. 505-509
5 p.
artikel
898 Competing risks in parallel and series systems Jaisingh, Lloyd R.
1988
100-101 3 p. 469-485
17 p.
artikel
899 Complementary MOS offers many advantages to the digital-systems designer 1973
100-101 3 p. 208-209
2 p.
artikel
900 Complex system reliability with general repair time distributions under head-of-line-repair-discipline 1974
100-101 3 p. 163-
1 p.
artikel
901 Complex system RMA and T, using Markov models 1986
100-101 3 p. 579-
1 p.
artikel
902 Compliant beam lead bonding 1975
100-101 3 p. 271-272
2 p.
artikel
903 Component availability 1983
100-101 3 p. 588-
1 p.
artikel
904 Component failures based on flow distributions 1990
100-101 3 p. 616
artikel
905 Component reliability under environmental stress 1975
100-101 3 p. 266-
1 p.
artikel
906 Component reliability under nuclear radiation environment 1975
100-101 3 p. 263-
1 p.
artikel
907 Component value spread and network function tolerances: an optimal design procedure 1972
100-101 3 p. 237-
1 p.
artikel
908 Compound availability measures for a two-unit standby system Kapur, P.K.
1990
100-101 3 p. 425-429
artikel
909 Compound Poisson approximation in reliability theory 1997
100-101 3 p. 535-
1 p.
artikel
910 Comprehensive model for humidity testing correlation 1987
100-101 3 p. 583-
1 p.
artikel
911 Compressing test patterns to fit into LSI testers 1979
100-101 3 p. 189-
1 p.
artikel
912 Computer-aided design of an n-MOS custom IC-“Subscriber Chip” of the 32-lines microprocessor based PAX (private automatic exchange) system Srivastava, Ashok
1985
100-101 3 p. 425-436
12 p.
artikel
913 Computer aided design of IC and LSI devices 1971
100-101 3 p. 146-
1 p.
artikel
914 Computer aided integrated circuit design 1969
100-101 3 p. 257-
1 p.
artikel
915 Computer aided layout of microcircuits 1969
100-101 3 p. 255-
1 p.
artikel
916 Computer-aided prediction of failure rates for complex electronic telecommunication systems Nitsch, R.
1989
100-101 3 p. 331-336
6 p.
artikel
917 Computer-aided sequential testing for equipment reliability 1975
100-101 3 p. 268-
1 p.
artikel
918 Computer aided stress analysis of digital circuits 1986
100-101 3 p. 578-
1 p.
artikel
919 Computer-aided thermal analysis of a hybrid multistage active bandpass filter/amplifier 1977
100-101 3 p. 219-
1 p.
artikel
920 Computer aids for reliability prediction and spares provisioning 1980
100-101 3 p. 379-
1 p.
artikel
921 Computer analysis of punch-through in MOSFETs 1979
100-101 3 p. 199-
1 p.
artikel
922 Computer analysis of wire bond pull test data 1986
100-101 3 p. 575-
1 p.
artikel
923 Computer applications to the hybrid microelectronic circuit design 1973
100-101 3 p. 214-
1 p.
artikel
924 Computer-assisted testing system for power supply units—reduce quality assurance costs 1986
100-101 3 p. 580-
1 p.
artikel
925 Computer controlled electron-beam projection mask aligner 1975
100-101 3 p. 285-
1 p.
artikel
926 Computer controlled optical microprojection system for one micron structures 1980
100-101 3 p. 381-
1 p.
artikel
927 Computer controlled test systems—can hybrid circuit manufacturers employ them successfully? 1973
100-101 3 p. 213-214
2 p.
artikel
928 Computerized fault tree analyses at Duke Power Company 1978
100-101 3 p. 229-
1 p.
artikel
929 Computerized mask-making for complex memory chips 1971
100-101 3 p. 146-147
2 p.
artikel
930 Computerized Testing of thin-film circuit conductors 1972
100-101 3 p. 246-
1 p.
artikel
931 4488299 Computerized versatile and modular test system for electrical circuits Fellhauer, Michae
1985
100-101 3 p. 603-
1 p.
artikel
932 Computer networks and distributed systems Sherif, Yosef S.
1988
100-101 3 p. 419-467
49 p.
artikel
933 Computer partitioning improves long-term reliability in space 1968
100-101 3 p. 271-
1 p.
artikel
934 Computer's aid for integrated circuit mask production 1969
100-101 3 p. 256-
1 p.
artikel
935 Computers that are “never” down 1986
100-101 3 p. 575-
1 p.
artikel
936 Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D) 1996
100-101 3 p. 441-
1 p.
artikel
937 Conduction mechanisms in thick film microcircuits. Semiannual technical report 1975
100-101 3 p. 285-
1 p.
artikel
938 Conduction mechanisms of silicon oxide/titanium oxide MOS stack structures Tinoco, J.C.
2008
100-101 3 p. 370-381
12 p.
artikel
939 Conduction phenomena in Nb-Nb2O5-Au thin film structures fabricated by various techniques 1978
100-101 3 p. 363-
1 p.
artikel
940 Conduction Processes in thick film resistors. Part I 1977
100-101 3 p. 218-
1 p.
artikel
941 Conduction processes in thick film resistors. Part II 1977
100-101 3 p. 218-
1 p.
artikel
942 Conduction properties of lightly doped, polycrystalline silicon 1979
100-101 3 p. 197-
1 p.
artikel
943 Conduction studies in silicon nitride; dark currents and photocurrents 1978
100-101 3 p. 361-
1 p.
artikel
944 Conduction theory applied to thick-film resistors 1976
100-101 3 p. 187-
1 p.
artikel
945 Conduction through TiO2 thin films with large ionic space charge 1968
100-101 3 p. 279-
1 p.
artikel
946 Conductivity increase of amorphous Si and Ge by Mn 1978
100-101 3 p. 231-
1 p.
artikel
947 Conference report Jacobs, Richard M.
1971
100-101 3 p. 137-140
4 p.
artikel
948 Conference report Thomas, J.W.
1970
100-101 3 p. 207-208
2 p.
artikel
949 Conference report Jacobs, Richard M
1978
100-101 3 p. 343-350
8 p.
artikel
950 Conference report 20th Annual Reliability and Maintainability Symposium Jacobs, R.M.
1974
100-101 3 p. 157-159
3 p.
artikel
951 Conference report 19th Annual Reliability and Maintainability Symposium, U.S.A. Jacobs, Richard M.
1973
100-101 3 p. 191-197
7 p.
artikel
952 Conference report 18th Annual Reliability Symposium, U.S.A. Jacobs, Richard M.
1972
100-101 3 p. 257-261
5 p.
artikel
953 Conference report 6th International Conference on Pattern Recognition Lang, Manfred
1983
100-101 3 p. 413-414
2 p.
artikel
954 Confidence bounds on reliability for the inverse Gaussian model 1980
100-101 3 p. 379-
1 p.
artikel
955 Considerations in the hermetic packaging of hybrid microcircuits 1985
100-101 3 p. 594-
1 p.
artikel
956 Constraint solver for generalized IC layout 1985
100-101 3 p. 586-587
2 p.
artikel
957 Consumer electronics heading for a year of improvements, paced by monolithic ICs 1974
100-101 3 p. 166-
1 p.
artikel
958 Contact and relaxation behaviour of aluminium conductor materials in the solderless wire-wrap technique, Part 1 1980
100-101 3 p. 376-
1 p.
artikel
959 Contact injection into dielectric films in microelectronic structures Pitt, C.W.
1970
100-101 3 p. 239-266
28 p.
artikel
960 Contact noise in thick film resistors 1979
100-101 3 p. 200-
1 p.
artikel
961 Contact stress and wear study for type characters 1979
100-101 3 p. 188-
1 p.
artikel
962 Contribution to the study of the vicinal surfaces of GaAs application to homoepitaxy 1977
100-101 3 p. 217-
1 p.
artikel
963 4714839 Control circuit for disabling or enabling the provision of redundancy Chung, Shine C
1988
100-101 3 p. 500-
1 p.
artikel
964 Controlled anisotropic etching of polysilicon 1983
100-101 3 p. 601-
1 p.
artikel
965 Controlled diffraction as the basis of an out-of-contact masking system 1973
100-101 3 p. 208-
1 p.
artikel
966 Control of diffusion induced dislocations in phosphorus diffused silicon 1967
100-101 3 p. 247-
1 p.
artikel
967 Control of electrostatic discharge damage to semiconductors 1975
100-101 3 p. 265-
1 p.
artikel
968 Control of pre-trim variables in thick film resistor processing 1979
100-101 3 p. 200-
1 p.
artikel
969 Control of the encapsulation material as an aid to long term reliability in plastic encapsulated semiconductor components (PEDs) Harrison, JC
1977
100-101 3 p. 233-244
12 p.
artikel
970 Correction for BIT detectability measurement error 1987
100-101 3 p. 586-
1 p.
artikel
971 Correct the process, not the product 1986
100-101 3 p. 576-
1 p.
artikel
972 Correlating tropical exposure of plastic encapsulated devices with laboratory tests 1980
100-101 3 p. 376-
1 p.
artikel
973 Correlation between cyclic strain range and low-cycle fatigue life of metals 1965
100-101 3 p. 303-
1 p.
artikel
974 Correlation between the presence of dislocations and vacancies in N-Type gallium arsenide 1972
100-101 3 p. 236-
1 p.
artikel
975 Corrigendum to “An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors” [Microelectron. Reliab. 53 (4) (2013) 540–543] Ghadiry, M.
2014
100-101 3 p. 662-
1 p.
artikel
976 Corrosion failure of Al-Mg alloy bonding wires in plastic packages 1987
100-101 3 p. 582-
1 p.
artikel
977 Cosmic ray induced failures in high power semiconductor devices 1997
100-101 3 p. 534-
1 p.
artikel
978 Co-sputtered cermet films 1968
100-101 3 p. 282-
1 p.
artikel
979 Cost analysis in a two-unit standby system with a regular repairman and patience time Goyal, Vibha
1984
100-101 3 p. 453-459
7 p.
artikel
980 Cost analysis in two-unit warm standby models with a regular repairman and patience time Murari, K.
1985
100-101 3 p. 473-483
11 p.
artikel
981 Cost analysis of a multi-component screening system in the paper industry Kumar, Dinesh
1990
100-101 3 p. 457-461
artikel
982 Cost analysis of an electronic repairable redundant system with critical human errors Gupta, P.P.
1986
100-101 3 p. 417-421
5 p.
artikel
983 Cost analysis of a system with partial failure mode and abnormal weather conditions Goel, L.R.
1985
100-101 3 p. 461-466
6 p.
artikel
984 Cost: a reliability factor 1965
100-101 3 p. 301-
1 p.
artikel
985 Cost-benefit analysis and joint availability measures Gopalan, M.N.
1986
100-101 3 p. 483-489
7 p.
artikel
986 Cost-benefit analysis of a one out of n : G system with repair and preventive maintenance Gopalan, M.N.
1986
100-101 3 p. 519-534
16 p.
artikel
987 Cost-benefit analysis of a one-server two-unit system subject to shock and degradation Gopalan, M.N.
1986
100-101 3 p. 499-518
20 p.
artikel
988 Cost-benefit analysis of a one-server two-unit system subject to two types of failure Subramanyam Naidu, R.
1983
100-101 3 p. 441-443
3 p.
artikel
989 Cost-benefit analysis of A 1-server n-unit system subject to general repair and inspection Subramanyam Naidu, R.
1983
100-101 3 p. 531-540
10 p.
artikel
990 Cost-benefit analysis of a 1-server 2-unit system subject to different repair strategies Gopalan, M.N.
1982
100-101 3 p. 393-397
5 p.
artikel
991 Cost-benefit analysis of a system with inspection, replacement and two types of repair Singh, S.K.
1988
100-101 3 p. 383-389
7 p.
artikel
992 Cost-benefit analysis of a two-unit cold standby system subject to slow switch 1986
100-101 3 p. 579-580
2 p.
artikel
993 Cost-benefit analysis of a two-unit warm standby reliability system with two types of repair facilities Mokaddis, G.S.
1993
100-101 3 p. 335-348
14 p.
artikel
994 Cost-benefit analysis of one-server two-unit hot standby system with imperfect switch subject to adjustable repair Gopalan, M.N.
1986
100-101 3 p. 453-454
2 p.
artikel
995 Cost-benefit analysis of one-server two-unit imperfect switch system subject to multistage repairs Gopalan, M.N.
1985
100-101 3 p. 541-548
8 p.
artikel
996 Cost effective accelerated testing and analysis 1986
100-101 3 p. 579-
1 p.
artikel
997 Cost effectiveness of burn-in procedures of semiconductor devices and integrated circuits Vassilev, V.Z.
1989
100-101 3 p. 453-458
6 p.
artikel
998 Cost-effective software safety analysis 1990
100-101 3 p. 618
artikel
999 Cost effective testing techniques for LSI components 1977
100-101 3 p. 209-
1 p.
artikel
1000 Cost optimal, parallel reliability systems with fixed repair sanction Venugopal, N.
1987
100-101 3 p. 419-422
4 p.
artikel
                             3981 gevonden resultaten
 
   volgende >>
 
 Koninklijke Bibliotheek - Nationale Bibliotheek van Nederland