| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A basic distributed microcomputer control system
|
|
|
1978
|
100-101 |
3 |
p. 357-
1 p.
|
artikel
|
| 2 |
A Bayesian reliability growth model
|
|
|
1969
|
100-101 |
3 |
p. 253-
1 p.
|
artikel
|
| 3 |
A bibliography of metal-insulator-semiconductor studies
|
|
|
1968
|
100-101 |
3 |
p. 274-
1 p.
|
artikel
|
| 4 |
A bibliography on semiconductor wafer preparation
|
|
|
1974
|
100-101 |
3 |
p. 163-
1 p.
|
artikel
|
| 5 |
A bibliography on silicon nitride films
|
Morosanu, C.-E.
|
|
1980
|
100-101 |
3 |
p. 357-370
14 p.
|
artikel
|
| 6 |
A 6-bit monolithic video flash converter
|
|
|
1983
|
100-101 |
3 |
p. 599-
1 p.
|
artikel
|
| 7 |
A 2048-bit n-channel fully decoded electrically writable/erasable nonvolatile read only memory
|
|
|
1976
|
100-101 |
3 |
p. 183-
1 p.
|
artikel
|
| 8 |
A bond failure mechanism
|
|
|
1987
|
100-101 |
3 |
p. 591-592
2 p.
|
artikel
|
| 9 |
A bound heuristic algorithm for solving reliability redundancy optimization
|
Li Jianping,
|
|
1996
|
100-101 |
3 |
p. 335-339
5 p.
|
artikel
|
| 10 |
Absolute dosimetry of ion implanted impurities using a calorimetric method
|
|
|
1978
|
100-101 |
3 |
p. 364-
1 p.
|
artikel
|
| 11 |
A Built-In Self-Test (BIST) system with non-intrusive TPG and ORA for FPGA test and diagnosis
|
Ruan, Aiwu
|
|
2013
|
100-101 |
3 |
p. 488-498
11 p.
|
artikel
|
| 12 |
A burn-in program for wearout unaffected equipments
|
Gironi, G.
|
|
1976
|
100-101 |
3 |
p. 227-232
6 p.
|
artikel
|
| 13 |
A case history: procurement of quality plastic encapsulated semiconductors
|
|
|
1978
|
100-101 |
3 |
p. 351-
1 p.
|
artikel
|
| 14 |
A case history—the Telstar satellite programme
|
|
|
1964
|
100-101 |
3 |
p. 197-
1 p.
|
artikel
|
| 15 |
A case study of C mmp, Cm∗, and C vmp: part I—Experiences with fault tolerance in multiprocessor systems
|
|
|
1979
|
100-101 |
3 |
p. 190-
1 p.
|
artikel
|
| 16 |
A.C. behaviour of damaged surface layers on CdS crystals
|
|
|
1965
|
100-101 |
3 |
p. 304-
1 p.
|
artikel
|
| 17 |
Accelerated life testing and over-stress testing of transistors
|
Groocock, J.M.
|
|
1963
|
100-101 |
3 |
p. 191-204
14 p.
|
artikel
|
| 18 |
Accelerated life testing and reliability of high K multilayer ceramic capacitors
|
|
|
1983
|
100-101 |
3 |
p. 589-590
2 p.
|
artikel
|
| 19 |
Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages
|
|
|
1980
|
100-101 |
3 |
p. 375-
1 p.
|
artikel
|
| 20 |
Accelerated stress testing of terrestrial solar cells
|
|
|
1983
|
100-101 |
3 |
p. 588-
1 p.
|
artikel
|
| 21 |
Accelerated temperature testing of transistors does not cause excess flicker noise
|
Khobare, S.K.
|
|
1982
|
100-101 |
3 |
p. 423-425
3 p.
|
artikel
|
| 22 |
Accelerated vibration fatigue life testing of leads and soldered joints
|
Blanks, H.S.
|
|
1976
|
100-101 |
3 |
p. 213-219
7 p.
|
artikel
|
| 23 |
Accurate estimation of statistical parametric variation in microelectronic test structures
|
Kumar, Mahesh
|
|
1987
|
100-101 |
3 |
p. 575-577
3 p.
|
artikel
|
| 24 |
Accurately trimming closed resistor loops
|
|
|
1974
|
100-101 |
3 |
p. 170-
1 p.
|
artikel
|
| 25 |
Accurate modeling of the influence of back gate bias and interface roughness on the threshold voltage of nanoscale DG MOSFETs
|
Biswas, Abhijit
|
|
2013
|
100-101 |
3 |
p. 363-370
8 p.
|
artikel
|
| 26 |
Accurate two-port models for distributed-RC notch filters
|
|
|
1978
|
100-101 |
3 |
p. 227-
1 p.
|
artikel
|
| 27 |
Accurate two-port models for distributed-RC notch filters
|
Kumar, Umesh
|
|
1978
|
100-101 |
3 |
p. 393-397
5 p.
|
artikel
|
| 28 |
A centralized temperature control system for diffusion furnaces
|
|
|
1973
|
100-101 |
3 |
p. 208-
1 p.
|
artikel
|
| 29 |
A ceramic based thin film system for low cost production of modules
|
|
|
1969
|
100-101 |
3 |
p. 261-
1 p.
|
artikel
|
| 30 |
A certain problem related to reliability of electronic apparatus
|
|
|
1964
|
100-101 |
3 |
p. 198-
1 p.
|
artikel
|
| 31 |
ACF particle distribution in COG process
|
Yen, Yee-Wen
|
|
2011
|
100-101 |
3 |
p. 676-684
9 p.
|
artikel
|
| 32 |
A changing paradigm in quality
|
|
|
1997
|
100-101 |
3 |
p. 529-
1 p.
|
artikel
|
| 33 |
A channel conductance measuring technique for determining the interface properties of a SiO-InSb thin film transistor
|
|
|
1978
|
100-101 |
3 |
p. 234-
1 p.
|
artikel
|
| 34 |
Achieving consistent results with thick-film
|
|
|
1972
|
100-101 |
3 |
p. 246-
1 p.
|
artikel
|
| 35 |
A class of fault-tolerant multiprocessor networks
|
|
|
1990
|
100-101 |
3 |
p. 622
|
artikel
|
| 36 |
A cluster plus effective medium tight-binding study of SiOx systems
|
|
|
1979
|
100-101 |
3 |
p. 199-
1 p.
|
artikel
|
| 37 |
A cold standby redundant system with delayed switchover and preventive maintenance
|
|
|
1978
|
100-101 |
3 |
p. 352-
1 p.
|
artikel
|
| 38 |
A combined digital and linear custom designed array optimised for large volume consumer applications
|
|
|
1983
|
100-101 |
3 |
p. 599-
1 p.
|
artikel
|
| 39 |
A combined fuzzy-logic and physics-of-failure approach to reliability prediction
|
|
|
1997
|
100-101 |
3 |
p. 529-
1 p.
|
artikel
|
| 40 |
A common cause-failure availability model
|
|
|
1979
|
100-101 |
3 |
p. 188-
1 p.
|
artikel
|
| 41 |
A compact high power semiconductor laser array
|
|
|
1979
|
100-101 |
3 |
p. 202-
1 p.
|
artikel
|
| 42 |
A comparison of MOS processes for VLSI. Part II
|
|
|
1985
|
100-101 |
3 |
p. 588-589
2 p.
|
artikel
|
| 43 |
A comparison of the performance of plastic and ceramic encapsulations based on evaluation of CMOS integrated circuits
|
Fox, M.J.
|
|
1977
|
100-101 |
3 |
p. 251-254
4 p.
|
artikel
|
| 44 |
A comparison of the thermal and electrical characteristics of a beam lead chip
|
|
|
1973
|
100-101 |
3 |
p. 209-
1 p.
|
artikel
|
| 45 |
A compatible patterning technique for custom built thin and thick film circuits
|
|
|
1968
|
100-101 |
3 |
p. 281-
1 p.
|
artikel
|
| 46 |
A complementary MOS 1.2 V watch circuit using ion implantation
|
|
|
1972
|
100-101 |
3 |
p. 248-
1 p.
|
artikel
|
| 47 |
A complex priority redundant system with phase type distribution
|
Gururajan, M.
|
|
1990
|
100-101 |
3 |
p. 453-455
|
artikel
|
| 48 |
A complex two unit system with stochastic demand
|
Sharafali, M.
|
|
1988
|
100-101 |
3 |
p. 359-361
3 p.
|
artikel
|
| 49 |
A comprehensive modeling framework for gate stack process dependence of DC and AC NBTI in SiON and HKMG p-MOSFETs
|
Goel, N.
|
|
2014
|
100-101 |
3 |
p. 491-519
29 p.
|
artikel
|
| 50 |
A comprehensive review of the lognormal failure distribution with application to LED reliability
|
Jordan, A.S.
|
|
1978
|
100-101 |
3 |
p. 267-279
13 p.
|
artikel
|
| 51 |
A comprehensive review of the lognormal failure distribution with application to led reliability
|
|
|
1979
|
100-101 |
3 |
p. 187-
1 p.
|
artikel
|
| 52 |
A computational algorithm for reliability bounds in probabilistic design
|
|
|
1987
|
100-101 |
3 |
p. 588-
1 p.
|
artikel
|
| 53 |
A computer-aided simulation model for the I–V characteristic of M-n-p silicon Schottky-barrier diodes produced by use of low-energy arsenic-ion implantation
|
|
|
1984
|
100-101 |
3 |
p. 596-597
2 p.
|
artikel
|
| 54 |
A computerized algorithm for determining the reliability of redundant configurations
|
|
|
1972
|
100-101 |
3 |
p. 239-
1 p.
|
artikel
|
| 55 |
A contribution to the design of plastic packages for high voltage power integrated circuits
|
|
|
1996
|
100-101 |
3 |
p. 448-449
2 p.
|
artikel
|
| 56 |
A corollary to: Duane's postulate on reliability growth
|
|
|
1990
|
100-101 |
3 |
p. 619
|
artikel
|
| 57 |
A correlation study between different types of CDM testers and ‘real’ manufacturing in-line leakage failure
|
|
|
1997
|
100-101 |
3 |
p. 532-
1 p.
|
artikel
|
| 58 |
A cost-based availability allocation algorithm
|
|
|
1972
|
100-101 |
3 |
p. 238-
1 p.
|
artikel
|
| 59 |
Acoustic emission for detecting deterioration of capacitors under aging
|
Smulko, Janusz
|
|
2011
|
100-101 |
3 |
p. 621-627
7 p.
|
artikel
|
| 60 |
Acoustic microscopy of ceramic capacitors
|
|
|
1979
|
100-101 |
3 |
p. 187-
1 p.
|
artikel
|
| 61 |
Activation and process characteristics of infrared rapid isothermal and furnace annealing techniques
|
|
|
1983
|
100-101 |
3 |
p. 597-
1 p.
|
artikel
|
| 62 |
Activation and redistribution of implants in Polysi by RTP
|
|
|
1986
|
100-101 |
3 |
p. 589-
1 p.
|
artikel
|
| 63 |
Active device prescreening for hybrids
|
|
|
1980
|
100-101 |
3 |
p. 388-
1 p.
|
artikel
|
| 64 |
Active distributed RC low-pass filters
|
Dutta Roy, S.C.
|
|
1972
|
100-101 |
3 |
p. 293-295
3 p.
|
artikel
|
| 65 |
Active doping instability in n+−p silicon surface avalanche diodes
|
|
|
1996
|
100-101 |
3 |
p. 452-
1 p.
|
artikel
|
| 66 |
Active R-C filters for tantalum thin film circuitry
|
|
|
1965
|
100-101 |
3 |
p. 311-
1 p.
|
artikel
|
| 67 |
Active thin-film devices, Part 1
|
|
|
1967
|
100-101 |
3 |
p. 257-258
2 p.
|
artikel
|
| 68 |
Active thin-film devices, Part 2
|
|
|
1967
|
100-101 |
3 |
p. 258-
1 p.
|
artikel
|
| 69 |
A Cu-Al2O3-Al moisture sensor for high humidities
|
Nahar, R.K.
|
|
1987
|
100-101 |
3 |
p. 451-456
6 p.
|
artikel
|
| 70 |
A current pulse screening test for metal step coverage—final report
|
|
|
1975
|
100-101 |
3 |
p. 263-
1 p.
|
artikel
|
| 71 |
Adaptive error correction in Orthogonal Latin Square Codes for low-power, resilient on-chip interconnection network
|
Lee, Seung Eun
|
|
2013
|
100-101 |
3 |
p. 509-511
3 p.
|
artikel
|
| 72 |
Adaptive robust estimation based on a family of generalized exponential power distributions
|
|
|
1985
|
100-101 |
3 |
p. 583-
1 p.
|
artikel
|
| 73 |
A DDA in MTOS
|
|
|
1970
|
100-101 |
3 |
p. 225-
1 p.
|
artikel
|
| 74 |
Addendum to: computing failure frequency via mixed products of availabilities and unavailabilities
|
|
|
1985
|
100-101 |
3 |
p. 585-
1 p.
|
artikel
|
| 75 |
Additive X-ray mask patterning
|
|
|
1987
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 76 |
A design approach for LSI using chip selection and circuits modification techniques
|
|
|
1973
|
100-101 |
3 |
p. 207-
1 p.
|
artikel
|
| 77 |
A designer’s guide to built-in self-test; Charles E. Stround. Kluwer Academic Publishers, Boston, 2002. Hardcover, pp. 319, plus XVI, $ 125, ISBN 1-4020-7050-0
|
Stojcev, Mile
|
|
2003
|
100-101 |
3 |
p. 514-515
2 p.
|
artikel
|
| 78 |
A design of experiment analysis of serial EEPROM endurance
|
Wilkie, D.
|
|
1997
|
100-101 |
3 |
p. 487-491
5 p.
|
artikel
|
| 79 |
A detailed analysis of three-level electron transfer
|
|
|
1971
|
100-101 |
3 |
p. 149-
1 p.
|
artikel
|
| 80 |
A device for the stabilization of pressures in the region of 1 torr
|
|
|
1964
|
100-101 |
3 |
p. 202-
1 p.
|
artikel
|
| 81 |
A device life cycle analysis of the WSI associative string processor
|
|
|
1997
|
100-101 |
3 |
p. 533-
1 p.
|
artikel
|
| 82 |
Adhesion mechanism of gold-underlayer film combinations to oxide substrates
|
|
|
1970
|
100-101 |
3 |
p. 227-228
2 p.
|
artikel
|
| 83 |
Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film
|
Uddin, M.A.
|
|
2004
|
100-101 |
3 |
p. 505-514
10 p.
|
artikel
|
| 84 |
Adhesives for microelectronics
|
|
|
1973
|
100-101 |
3 |
p. 206-
1 p.
|
artikel
|
| 85 |
Adhesive strength of evaporated gold films on glass substrate
|
|
|
1969
|
100-101 |
3 |
p. 262-
1 p.
|
artikel
|
| 86 |
A discrete time queueing problem with S heterogeneous groups of channels
|
Sharda,
|
|
1985
|
100-101 |
3 |
p. 455-459
5 p.
|
artikel
|
| 87 |
A downstream look at IC testing
|
|
|
1967
|
100-101 |
3 |
p. 246-
1 p.
|
artikel
|
| 88 |
Adsorption of H2S, H2O and O2 on Si(111) surfaces
|
|
|
1977
|
100-101 |
3 |
p. 217-
1 p.
|
artikel
|
| 89 |
A dual burn-in policy for defect-tolerant memory products using the number of repairs as a quality indicator
|
Tong, Seung-Hoon
|
|
2008
|
100-101 |
3 |
p. 471-480
10 p.
|
artikel
|
| 90 |
Advanced CMOS epitaxial processing for latch-up hardening and improved epilayer quality
|
|
|
1985
|
100-101 |
3 |
p. 587-
1 p.
|
artikel
|
| 91 |
Advanced developments in sub-nanosecond integrated logic circuits
|
|
|
1970
|
100-101 |
3 |
p. 225-
1 p.
|
artikel
|
| 92 |
Advanced hand calculations for fault tree analysis and synthesis
|
Schneeweiss, Winfrid G.
|
|
1997
|
100-101 |
3 |
p. 403-415
13 p.
|
artikel
|
| 93 |
Advanced low-cost bare-DIE packaging technology for liquid crystal displays
|
|
|
1997
|
100-101 |
3 |
p. 540-
1 p.
|
artikel
|
| 94 |
Advanced operations and maintenance facilities for telephone networks
|
|
|
1978
|
100-101 |
3 |
p. 228-229
2 p.
|
artikel
|
| 95 |
Advanced packaging for VLSI
|
|
|
1987
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 96 |
Advanced submicron research and technology development at the national submicron facility
|
|
|
1984
|
100-101 |
3 |
p. 589-
1 p.
|
artikel
|
| 97 |
Advanced technologies extend LSI capability
|
|
|
1971
|
100-101 |
3 |
p. 145-146
2 p.
|
artikel
|
| 98 |
Advances in automatic die bonding
|
|
|
1984
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 99 |
Advances in cassette-to-cassette sputtercoating systems
|
|
|
1984
|
100-101 |
3 |
p. 589-
1 p.
|
artikel
|
| 100 |
Advances in computer generation of master artwork for micro-miniature circuits
|
|
|
1968
|
100-101 |
3 |
p. 284-
1 p.
|
artikel
|
| 101 |
Advances in contamination control of processing chemicals in VLSI
|
|
|
1983
|
100-101 |
3 |
p. 601-
1 p.
|
artikel
|
| 102 |
Advances in dry etching processes—a review
|
|
|
1986
|
100-101 |
3 |
p. 585-
1 p.
|
artikel
|
| 103 |
Advances in low temperature die bonding techniques
|
|
|
1975
|
100-101 |
3 |
p. 272-
1 p.
|
artikel
|
| 104 |
Advances in silicon technology for the semiconductor industry. Part II
|
|
|
1984
|
100-101 |
3 |
p. 593-
1 p.
|
artikel
|
| 105 |
Advances in testing LSI populated boards
|
|
|
1980
|
100-101 |
3 |
p. 383-
1 p.
|
artikel
|
| 106 |
Advances in VLSI circuit technology require new equipment for microlithography
|
|
|
1983
|
100-101 |
3 |
p. 597-
1 p.
|
artikel
|
| 107 |
Advances in X-ray mask technology
|
|
|
1985
|
100-101 |
3 |
p. 588-
1 p.
|
artikel
|
| 108 |
Advances in zone refining
|
|
|
1968
|
100-101 |
3 |
p. 277-
1 p.
|
artikel
|
| 109 |
Advantages and limitations of AOQL and AQL sampling schemes
|
|
|
1967
|
100-101 |
3 |
p. 241-
1 p.
|
artikel
|
| 110 |
Advantages and new development of direct bonded copper substrates
|
Schulz-Harder, Jürgen
|
|
2003
|
100-101 |
3 |
p. 359-365
7 p.
|
artikel
|
| 111 |
Advantages of IGFETS in integrated circuits
|
|
|
1971
|
100-101 |
3 |
p. 146-
1 p.
|
artikel
|
| 112 |
A fast algorithm for a redundancy optimization problem
|
Murty, V.Dakshina
|
|
1985
|
100-101 |
3 |
p. 511-523
13 p.
|
artikel
|
| 113 |
A fast algorithm to formulate Markov system equations
|
|
|
1986
|
100-101 |
3 |
p. 577-
1 p.
|
artikel
|
| 114 |
A fast thick-film amplifier
|
|
|
1976
|
100-101 |
3 |
p. 186-
1 p.
|
artikel
|
| 115 |
A fault-tolerant permutation network modulo arithmetic processor
|
|
|
1996
|
100-101 |
3 |
p. 443-
1 p.
|
artikel
|
| 116 |
A few examples of applying laser microspectral analysis in semiconductor engineering
|
|
|
1975
|
100-101 |
3 |
p. 285-
1 p.
|
artikel
|
| 117 |
A field study of the electrical performance of separable connectors
|
|
|
1979
|
100-101 |
3 |
p. 186-187
2 p.
|
artikel
|
| 118 |
A finite state machine based fault tolerance technique for sequential circuits
|
El-Maleh, Aiman H.
|
|
2014
|
100-101 |
3 |
p. 654-661
8 p.
|
artikel
|
| 119 |
A flexible approach for generation of arbitrary etch profiles in multilayer films
|
|
|
1986
|
100-101 |
3 |
p. 588-
1 p.
|
artikel
|
| 120 |
A fluxless and oxygen-free soldering technique for thick-film circuits
|
|
|
1973
|
100-101 |
3 |
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Analysis of gamma-irradiation induced degradation mechanisms in power VDMOSFETS
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Analysis of incomplete data in competing risks model
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Analysis of intermittently used 2-unit redundant systems with a single repair facility
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Srinivasan, S.K.
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6 p.
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Analysis of low energy boron implants in silicon through SiO2 films: implantation damage and anomalous diffusion
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Analysis of maintenance man loading via simulation
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Analysis of microprocessors test generation—its meaning and use
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Analysis of one-server two-unit system subject to stage-wise installation and repair
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12 p.
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Analysis of 1-out-of-n: G adjustable operating system
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Analysis of redundant systems with human errors
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Analysis of reliability block diagrams by Boolean techniques
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Analysis of screening data by using Weibull distribution
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Analysis of silicon nitride layers deposited from SiH4 and N2 on silicon
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Analysis of single crystal silicon slices by neutron activation
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Analysis of static and dynamic characteristics in v.i.l.
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Analysis of the deep depletion MOSFET and the use of the d.c. characteristics for determining bulk-channel chargecoupled device parameters
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Analysis of the effects of mechanical stress on the properties of p-channel MOS structures. Part I. Choice of the theoretical model. The effect of stress on the valence band structure in silicon
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Analysis of the merged charge memory (MCM) cell
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Analysis of transistor second breakdown
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Analysis of variance of reliabilities
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Analytical solutions for threshold voltage calculations in ion-implanted IGFETS
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Analytical study of the pointwise availability of a parallel redundant 2-out-of-N :F system under head-of-line repair echelon
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Analyzing the interface of reliability and economics of unmanned satellites
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An analysis of deep depletion thin-film MOS transistors
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An analysis of interconnect line capacitance and coupling for VLSI circuits
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An analysis of LPCVD system parameters for polysilicon, silicon nitride and silicon dioxide deposition
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An analysis of physical adsorption isotherms in ultra-high-vacuum range
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An analysis of the CdSe thin-film triode as a current limiter
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An analytical comparison of the thermal performance of various ball grid array packaging technologies
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An analytical model for the low-emitter-impurity-concentration transistor
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An analytical model for the narrow-width effect in ion-implanted MOSFETs
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An analytic method to compute the stress dependence on the dimensions and its influence in the characteristics of triple gate devices
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An anti-snapback circuit technique for inhibiting parasitic bipolar conduction during EOS/ESD events
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An application of Markov chains for the evaluation of the operating characteristics of chain sampling inspection plans
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An application of optimal control theory to repairman problem with machine interference
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An application of time-dependent ARMA models to reliability-decay processes
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An approach for evaluating Polymer materials as protective coatings on hybrid microcircuits
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An approach to analysis reliability of switching circuits reliability
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An approach to fault-tolerant system reliability modelling
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An automated, low power, high speed complementary PLA design system for VLSI applications
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An automatic concurrent error detecting tool for PLA generation
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An availability analysis of a k-out-of-N:G redundant system with dependant failure rates and common-cause failures
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An availability evaluation for computer communication networks
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A necessary condition for optimal consecutive-k-out-of-n:G system design
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An efficient algorithm for optimal design of diagnostics
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An efficient algorithm for simultaneously deducing minimal paths as well as cuts of a communication network
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An efficient method for terminal and multiterminal pathset enumeration
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An electron beam gun with a multi-crucible for evaporation in UHV and its characteristics
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An empirical study on the complexity metrics of Petri nets
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An evaluation of the voltage-current rating characteristics of miniature monolithic RF ceramic capacitors
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An evaporated film 135-cryotron memory plane
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A new algorithm for transforming exponential current ramp breakdown distributions into constant current TDDB space, and the implications for gate oxide Q BD measurement methods
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A new concept for microminiature interconnections
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A new concept in reliability modelling
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A new contactless S-polarized reflectance technique for determining the Si film and buried oxide thickness in silicon-on-insulator materials
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A new degradation model and lifetime extrapolation technique for lightly doped drain nMOSFETs under hot-carrier degradation
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A new discrete Weibull distribution
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A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride–oxide dielectrics
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A new failure mechanism in thin gold films at elevated temperatures
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A new failure mechanism related to the formation of dark defects in GaAlAs visible lasers
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A new formula and an algorithm for reliability analysis of networks
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A new gate current measurement technique for the characterization of hot-carrier induced degradation in MOSFETs
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A new generation of large hybrid modules—SLM
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A new gold metallization system
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A new method for impurity states in semiconductors
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A new method for recognition of defects in electronic devices
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A new method for reliability optimization
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A new method for system reliability evaluation
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A new method to determine the failure frequency of a complex system
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A new model for bound multiexciton complexes
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A new model of subthreshold swing for sub-100nm MOSFETs
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A new on-chip digital BIST for analog-to-digital converters
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A new process of grid structure formation for end point detection during substrate thinning of transit time devices
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A new reliability growth model: its mathematical comparison to the Duane model
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A new reliability prediction method for hybrid circuits
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A new reliability problem associated with Ar ion sputter cleaning of interconnect vias
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A new reliability test for multilayer ceramic capacitors
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A new resistor system for high reliability applications
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A new short channel MOSFET structure (UMOST)
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A new thick-film ruthenium-niobium resistor system
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A new type of galvanomagnetic effect for hot electrons in many-valley semiconductors
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An exact analysis of the Method-One maintainability demonstration plan in MIL-STD-471
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An exact derivation of contact resistance to planar devices
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An experimental study of 1.5 keV X-ray radiation effects on CMOS devices
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An experimental study of the indium antimonide thin film transistor
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An expert system to facilitate fault isolation
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An improved approach to locating pinhole defects in MOS and bipolar integrated circuits using liquid crystals
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An improved architecture for advanced universal microprocessor development systems
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An improved moment-matching algorithm for evaluating topevent probability bounds
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An improved neural network realization for reliability analysis
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An initial planning model of computer networks using availability criteria
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An in-line process monitoring method using electron beam induced substrate current
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An innovation in gold paste
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An inspection model with generally distributed restoration and repair times
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An integrated bandgap-reference
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An integrated circuit two-tone generator
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An integrated injection logic (IIL) realization of phase locked loop
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An integrated wide-tunable sine oscillator
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An interactive system for VLSI chip physical design
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An intermittently used n-unit complex system
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An introduction to assemblers and loaders for microprocessor systems
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An introduction to operating systems
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An introduction to plasma processing
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An introduction to value management
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An inventory model with product obsolescence and its implications for high technology industry
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An investigation into marine radar reliability
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An investigation into the reliability of planar transistors
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An investigation into the termination resistance of thin film resistors
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An investigation into the use of computer aided design in thick film circuits
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An investigation of software reliability models
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An investigation of the factors that influence the deposit/etch balance in a radiant-heated silicon epitaxial reactor
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An investigation of the time dependence of current degradation in MOS devices
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Australia builds VLSI skills
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3 |
p. 595-
1 p.
|
artikel
|
| 600 |
Automated board testing: coping with complex circuits
|
|
|
1984
|
100-101 |
3 |
p. 583-
1 p.
|
artikel
|
| 601 |
Automated contactless SEM testing for VLSI development and failure analysis
|
|
|
1983
|
100-101 |
3 |
p. 594-
1 p.
|
artikel
|
| 602 |
Automated mask production for semiconductor technology
|
|
|
1968
|
100-101 |
3 |
p. 284-
1 p.
|
artikel
|
| 603 |
Automated measurement system for the investigation of surface state distribution
|
Price, T.E.
|
|
1983
|
100-101 |
3 |
p. 555-563
9 p.
|
artikel
|
| 604 |
Automated synthesis of pseudo-exhaustive test generator in VLSI BIST design
|
|
|
1996
|
100-101 |
3 |
p. 447-
1 p.
|
artikel
|
| 605 |
Automated tape carrier bonding for hybrids
|
|
|
1978
|
100-101 |
3 |
p. 230-
1 p.
|
artikel
|
| 606 |
Automated wafer processing using robots
|
|
|
1985
|
100-101 |
3 |
p. 586-
1 p.
|
artikel
|
| 607 |
Automatic alignment for direct step and repeat printing on silicon
|
|
|
1979
|
100-101 |
3 |
p. 193-
1 p.
|
artikel
|
| 608 |
Automatic cleaning technique for pellicles
|
|
|
1987
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 609 |
Automatic control and monitoring system for thin-film deposition
|
|
|
1967
|
100-101 |
3 |
p. 257-
1 p.
|
artikel
|
| 610 |
Automatic detection of semiconductor mask defects
|
|
|
1977
|
100-101 |
3 |
p. 213-
1 p.
|
artikel
|
| 611 |
Automatic electronic component failure-rate prediction with MIL-HDBK-217B
|
|
|
1978
|
100-101 |
3 |
p. 351-
1 p.
|
artikel
|
| 612 |
4713815 Automatic fault location system for electronic devices
|
Bryan, Dennis P
|
|
1988
|
100-101 |
3 |
p. 500-
1 p.
|
artikel
|
| 613 |
Automatic in-circuit inspection of printed circuit board assemblies
|
|
|
1980
|
100-101 |
3 |
p. 376-
1 p.
|
artikel
|
| 614 |
Automatic laser resistor trimming
|
|
|
1973
|
100-101 |
3 |
p. 216-
1 p.
|
artikel
|
| 615 |
Automatic manufacture of custom hybrid microelectronic circuits
|
|
|
1976
|
100-101 |
3 |
p. 187-
1 p.
|
artikel
|
| 616 |
Automatic test equipment
|
|
|
1969
|
100-101 |
3 |
p. 247-
1 p.
|
artikel
|
| 617 |
Automatic wire bonder for external connectors for thin film circuits
|
|
|
1972
|
100-101 |
3 |
p. 245-246
2 p.
|
artikel
|
| 618 |
Automating PCB production
|
|
|
1984
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 619 |
Automating the epitaxial process
|
|
|
1975
|
100-101 |
3 |
p. 271-
1 p.
|
artikel
|
| 620 |
Automation applied to repair and maintenance of electronic systems
|
|
|
1975
|
100-101 |
3 |
p. 269-
1 p.
|
artikel
|
| 621 |
Automation of IC manufacturing: control problems
|
|
|
1987
|
100-101 |
3 |
p. 591-
1 p.
|
artikel
|
| 622 |
Automation of implanter equipment
|
|
|
1986
|
100-101 |
3 |
p. 589-
1 p.
|
artikel
|
| 623 |
Availability allocation using a family of hyperbolic cost functions
|
|
|
1976
|
100-101 |
3 |
p. 180-
1 p.
|
artikel
|
| 624 |
Availability analysis of a repairable system with non-repairable standby units
|
|
|
1977
|
100-101 |
3 |
p. 210-
1 p.
|
artikel
|
| 625 |
Availability analysis of a two-unit cold standby system with two switching failure modes
|
Goel, L.R.
|
|
1984
|
100-101 |
3 |
p. 419-423
5 p.
|
artikel
|
| 626 |
Availability measures of human-equipment standby redundant data-flow system with application to NASA deep space station
|
Issa, Tareq N.
|
|
1990
|
100-101 |
3 |
p. 573-583
|
artikel
|
| 627 |
Availability of an (m, N) system with repair
|
|
|
1979
|
100-101 |
3 |
p. 188-189
2 p.
|
artikel
|
| 628 |
Availability of K-out-of-N:G systems with M failure modes
|
Moustafa, Magdi S.
|
|
1996
|
100-101 |
3 |
p. 385-388
4 p.
|
artikel
|
| 629 |
Availability study of ETRR-1 primary cooling system
|
El Messiry, A.M.
|
|
1994
|
100-101 |
3 |
p. 545-553
9 p.
|
artikel
|
| 630 |
Availibility as a criterion of system performance
|
|
|
1975
|
100-101 |
3 |
p. 269-270
2 p.
|
artikel
|
| 631 |
Avalanche breakdown calculations for a planar p-n junction
|
|
|
1967
|
100-101 |
3 |
p. 243-
1 p.
|
artikel
|
| 632 |
Avalanche breakdown in narrow gap semiconductors in crossed fields
|
|
|
1986
|
100-101 |
3 |
p. 586-
1 p.
|
artikel
|
| 633 |
Avalanche breakdown of diffused silicon p-n junctions
|
|
|
1967
|
100-101 |
3 |
p. 253-
1 p.
|
artikel
|
| 634 |
Avalanche-injected electron currents in SiO2 at high injection densities
|
|
|
1975
|
100-101 |
3 |
p. 279-
1 p.
|
artikel
|
| 635 |
A valence bond theory of off-center impurities in silicon
|
|
|
1985
|
100-101 |
3 |
p. 590-591
2 p.
|
artikel
|
| 636 |
A van der Pauw resistor structure for determining mask superposition errors on semiconductor slices
|
|
|
1979
|
100-101 |
3 |
p. 191-192
2 p.
|
artikel
|
| 637 |
AV-8B design for maintainability
|
|
|
1986
|
100-101 |
3 |
p. 576-
1 p.
|
artikel
|
| 638 |
Average mobilities of carriers in subdoped silicon layers
|
|
|
1983
|
100-101 |
3 |
p. 601-
1 p.
|
artikel
|
| 639 |
A versatile design giving both N-type and S-type of negative-resistances
|
|
|
1973
|
100-101 |
3 |
p. 207-
1 p.
|
artikel
|
| 640 |
A versatile integrated logarithmic video amplifier
|
|
|
1968
|
100-101 |
3 |
p. 283-
1 p.
|
artikel
|
| 641 |
A versatile manufacturing method for the production of complex hybrid microelectronics assemblies
|
|
|
1969
|
100-101 |
3 |
p. 256-257
2 p.
|
artikel
|
| 642 |
A versatile packaging system for hybrids
|
|
|
1972
|
100-101 |
3 |
p. 246-
1 p.
|
artikel
|
| 643 |
A vertical submicron SiC thin film transistor
|
|
|
1996
|
100-101 |
3 |
p. 453-454
2 p.
|
artikel
|
| 644 |
A viscosity gauge for pressure measurement in the range 10−6 to 10−4 torr
|
|
|
1967
|
100-101 |
3 |
p. 256-
1 p.
|
artikel
|
| 645 |
A VLSI-ATE selection matrix
|
|
|
1983
|
100-101 |
3 |
p. 591-
1 p.
|
artikel
|
| 646 |
A VLSI bipolar metallization design with three-level wiring and area array solder connections
|
|
|
1983
|
100-101 |
3 |
p. 597-
1 p.
|
artikel
|
| 647 |
A VLSI priority packet queue with inheritance and overwrite
|
|
|
1997
|
100-101 |
3 |
p. 542-
1 p.
|
artikel
|
| 648 |
A 28 volt logic microcircuit
|
|
|
1968
|
100-101 |
3 |
p. 283-
1 p.
|
artikel
|
| 649 |
A wafer level testability approach based on an improved scan insertion technique
|
|
|
1997
|
100-101 |
3 |
p. 542-
1 p.
|
artikel
|
| 650 |
A yield analysis model for hybrid microelectronic circuits
|
|
|
1973
|
100-101 |
3 |
p. 214-
1 p.
|
artikel
|
| 651 |
Bake effects in positive photoresist
|
|
|
1984
|
100-101 |
3 |
p. 591-
1 p.
|
artikel
|
| 652 |
Barrier energies in metal-silicon dioxide-silicon structures
|
|
|
1967
|
100-101 |
3 |
p. 250-
1 p.
|
artikel
|
| 653 |
Basic considerations in integrated circuit design
|
|
|
1965
|
100-101 |
3 |
p. 306-
1 p.
|
artikel
|
| 654 |
Basic problems for electromigration in VLSI applications
|
|
|
1983
|
100-101 |
3 |
p. 593-
1 p.
|
artikel
|
| 655 |
Basis sets for the study of point defects in solids using Green's-function methods
|
|
|
1980
|
100-101 |
3 |
p. 386-
1 p.
|
artikel
|
| 656 |
Batch acceptance sampling by attributes to reduce overall costs
|
|
|
1970
|
100-101 |
3 |
p. 217-
1 p.
|
artikel
|
| 657 |
Bathtub failure rate and upside-down bathtub mean residual life
|
|
|
1997
|
100-101 |
3 |
p. 536-
1 p.
|
artikel
|
| 658 |
Bayes analysis for fault location in distributed systems
|
|
|
1996
|
100-101 |
3 |
p. 445-
1 p.
|
artikel
|
| 659 |
Bayes estimation in life testing and reliability: a multivariate case
|
|
|
1975
|
100-101 |
3 |
p. 267-
1 p.
|
artikel
|
| 660 |
Bayesian acceptance sampling
|
|
|
1973
|
100-101 |
3 |
p. 199-
1 p.
|
artikel
|
| 661 |
Bayesian estimation of constant failure rate and unavailability
|
|
|
1983
|
100-101 |
3 |
p. 594-
1 p.
|
artikel
|
| 662 |
Bayesian sequential estimation of two parameters of a Weibull distribution
|
Soman, K.P.
|
|
1994
|
100-101 |
3 |
p. 509-519
11 p.
|
artikel
|
| 663 |
Beam-lead devices for hybrid integrated circuits
|
|
|
1972
|
100-101 |
3 |
p. 247-
1 p.
|
artikel
|
| 664 |
Beam lead technology
|
|
|
1972
|
100-101 |
3 |
p. 240-241
2 p.
|
artikel
|
| 665 |
Beam tape plus automated handling cuts IC manufacturing costs
|
|
|
1978
|
100-101 |
3 |
p. 230-
1 p.
|
artikel
|
| 666 |
4701703 Bed-of-pins test fixture
|
Malloy, James T
|
|
1988
|
100-101 |
3 |
p. 497-
1 p.
|
artikel
|
| 667 |
Be effective—Not down
|
Reiche, Hans
|
|
1973
|
100-101 |
3 |
p. 181-182
2 p.
|
artikel
|
| 668 |
Behaviour of anisotropic conductive joints under mechanical loading
|
Tan, C.W.
|
|
2003
|
100-101 |
3 |
p. 481-486
6 p.
|
artikel
|
| 669 |
Behaviour of a two-unit standby redundant system with imperfect switching and delayed repair
|
Kumar, Ashok
|
|
1980
|
100-101 |
3 |
p. 315-321
7 p.
|
artikel
|
| 670 |
Behaviour of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption and wave soldering
|
|
|
1997
|
100-101 |
3 |
p. 541-542
2 p.
|
artikel
|
| 671 |
Behaviour of film conductance during vacuum deposition
|
|
|
1964
|
100-101 |
3 |
p. 203-
1 p.
|
artikel
|
| 672 |
Behind the “bathtub”-curve A new model and its consequences
|
Møltoft, Jørgen
|
|
1983
|
100-101 |
3 |
p. 489-500
12 p.
|
artikel
|
| 673 |
Bellcore system hardware reliability prediction
|
|
|
1990
|
100-101 |
3 |
p. 617
|
artikel
|
| 674 |
Benefit analysis of a two-unit standby system subject to jerks with installation time
|
Saini, Ashok
|
|
1996
|
100-101 |
3 |
p. 429-434
6 p.
|
artikel
|
| 675 |
Benefits of integrated-circuit burn-in to obtain high reliability parts
|
|
|
1987
|
100-101 |
3 |
p. 582-
1 p.
|
artikel
|
| 676 |
Best linear unbiased estimator of the Rayleigh scale parameter based on fairly large censored samples
|
|
|
1997
|
100-101 |
3 |
p. 535-
1 p.
|
artikel
|
| 677 |
Better Bipolar-MOS process yields linear ICs with good ac and dc specs
|
|
|
1975
|
100-101 |
3 |
p. 271-
1 p.
|
artikel
|
| 678 |
Better understanding of FET operation yields viable monolithic J-FET op. amp.
|
|
|
1973
|
100-101 |
3 |
p. 208-
1 p.
|
artikel
|
| 679 |
Beware of the general-purpose microprocessor
|
|
|
1977
|
100-101 |
3 |
p. 207-
1 p.
|
artikel
|
| 680 |
Bias humidity performance and failure mechanisms of nonhermetic aluminum SIC's in an environment contaminated with Cl2
|
|
|
1984
|
100-101 |
3 |
p. 585-
1 p.
|
artikel
|
| 681 |
Bias humidity performance and failure mechanisms of non-hermetic aluminum SICs in an environment contaminated with Cl2
|
|
|
1983
|
100-101 |
3 |
p. 588-
1 p.
|
artikel
|
| 682 |
Bias influence on corrosion of plastic encapsulated device metal systems
|
|
|
1977
|
100-101 |
3 |
p. 208-
1 p.
|
artikel
|
| 683 |
Bibliography and chapter headings of some useful books on reliability and microminiaturization
|
|
|
1962
|
100-101 |
3 |
p. 271-274
4 p.
|
artikel
|
| 684 |
Bibliography of literature on chemical systems reliability
|
|
|
1986
|
100-101 |
3 |
p. 575-
1 p.
|
artikel
|
| 685 |
Bibliography of literature on transit system reliability
|
Dhillon, Balbir S.
|
|
1982
|
100-101 |
3 |
p. 641-651
11 p.
|
artikel
|
| 686 |
BiCMOS circuitry: the best of both worlds
|
|
|
1990
|
100-101 |
3 |
p. 623
|
artikel
|
| 687 |
Big bubble chips point the way to low-cost memories
|
|
|
1978
|
100-101 |
3 |
p. 356-
1 p.
|
artikel
|
| 688 |
Binary transversal filter
|
Bozic, S.M.
|
|
1979
|
100-101 |
3 |
p. 219-222
4 p.
|
artikel
|
| 689 |
Bipolar chip design for a VLSI microprocessor
|
|
|
1983
|
100-101 |
3 |
p. 596-
1 p.
|
artikel
|
| 690 |
Bipolar LSI computing elements usher in new era of digital design
|
|
|
1975
|
100-101 |
3 |
p. 274-
1 p.
|
artikel
|
| 691 |
Bipolar memories
|
|
|
1975
|
100-101 |
3 |
p. 276-
1 p.
|
artikel
|
| 692 |
Bi-polar technology. A re-evaluation
|
|
|
1975
|
100-101 |
3 |
p. 277-
1 p.
|
artikel
|
| 693 |
Bi-polar technology. Integrated injection logic—present and future
|
|
|
1975
|
100-101 |
3 |
p. 276-
1 p.
|
artikel
|
| 694 |
Birefringent tape—a new, easier technique for separating thin film and printed circuit master drawings with perfect registration
|
|
|
1967
|
100-101 |
3 |
p. 257-
1 p.
|
artikel
|
| 695 |
Bit-slice parts approach ECL speeds with TTL power levels
|
|
|
1979
|
100-101 |
3 |
p. 195-
1 p.
|
artikel
|
| 696 |
Blowholes and Voids: causes and cures
|
|
|
1977
|
100-101 |
3 |
p. 210-
1 p.
|
artikel
|
| 697 |
BLUEs of location and scale parameters of laplace distribution based on type-II censored samples and associated inference
|
Balakrishnan, N.
|
|
1996
|
100-101 |
3 |
p. 371-374
4 p.
|
artikel
|
| 698 |
Board inventories mount
|
|
|
1978
|
100-101 |
3 |
p. 229-
1 p.
|
artikel
|
| 699 |
Board level reliability of a stacked CSP subjected to cyclic bending
|
Wu, J.D
|
|
2002
|
100-101 |
3 |
p. 407-416
10 p.
|
artikel
|
| 700 |
Boat heat-up in diffusion furnaces
|
|
|
1967
|
100-101 |
3 |
p. 250-
1 p.
|
artikel
|
| 701 |
Bonding of fluorine-implanted and annealed silicon
|
|
|
1986
|
100-101 |
3 |
p. 589-
1 p.
|
artikel
|
| 702 |
Bonding systems for microinterconnect tape technology
|
|
|
1978
|
100-101 |
3 |
p. 229-
1 p.
|
artikel
|
| 703 |
Bond-integrity testing of sapphire chips mounted with eutectic preforms
|
|
|
1985
|
100-101 |
3 |
p. 583-
1 p.
|
artikel
|
| 704 |
Bond strength of metal layers on strip line substrates
|
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|
1976
|
100-101 |
3 |
p. 182-
1 p.
|
artikel
|
| 705 |
Book Review
|
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|
1998
|
100-101 |
3 |
p. 472-
1 p.
|
artikel
|
| 706 |
Book Review
|
|
|
1998
|
100-101 |
3 |
p. 471-
1 p.
|
artikel
|
| 707 |
Book Review
|
|
|
1998
|
100-101 |
3 |
p. 473-
1 p.
|
artikel
|
| 708 |
Book Review
|
|
|
1998
|
100-101 |
3 |
p. 475-
1 p.
|
artikel
|
| 709 |
Book Review
|
|
|
1998
|
100-101 |
3 |
p. 477-
1 p.
|
artikel
|
| 710 |
Book Review
|
|
|
1998
|
100-101 |
3 |
p. 474-
1 p.
|
artikel
|
| 711 |
Book Review
|
|
|
1998
|
100-101 |
3 |
p. 478-
1 p.
|
artikel
|
| 712 |
Book review
|
|
|
1999
|
100-101 |
3 |
p. 425-
1 p.
|
artikel
|
| 713 |
Book review
|
|
|
1999
|
100-101 |
3 |
p. 427-
1 p.
|
artikel
|
| 714 |
Book review
|
|
|
1999
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100-101 |
3 |
p. 429-
1 p.
|
artikel
|
| 715 |
Book Review
|
|
|
1998
|
100-101 |
3 |
p. 476-
1 p.
|
artikel
|
| 716 |
Boolean neural network realization of an adder-subtractor cell
|
Singh, H.
|
|
1996
|
100-101 |
3 |
p. 367-369
3 p.
|
artikel
|
| 717 |
Boosting reliability of disk memories
|
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|
1970
|
100-101 |
3 |
p. 219-
1 p.
|
artikel
|
| 718 |
Border traps: Issues for MOS radiation response and long-term reliability
|
Fleetwood, D.M.
|
|
1995
|
100-101 |
3 |
p. 403-428
26 p.
|
artikel
|
| 719 |
Bounds for reliability of k-within two-dimensional consecutive-r-out-of-n failure systems
|
Makri, F.S.
|
|
1996
|
100-101 |
3 |
p. 341-345
5 p.
|
artikel
|
| 720 |
Bounds of age replacement time
|
Nakagawa, T.
|
|
1982
|
100-101 |
3 |
p. 603-609
7 p.
|
artikel
|
| 721 |
Bounds on system reliability when components are dependent
|
Lai, C.D.
|
|
1986
|
100-101 |
3 |
p. 455-459
5 p.
|
artikel
|
| 722 |
Breakdown voitage of planar silicon junctions
|
|
|
1967
|
100-101 |
3 |
p. 246-
1 p.
|
artikel
|
| 723 |
Breakdown walkout in planar p-n junctions
|
|
|
1978
|
100-101 |
3 |
p. 227-
1 p.
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artikel
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| 724 |
Bridging the gap between design and test
|
Kuzel, Gerald L.
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1989
|
100-101 |
3 |
p. 365-370
6 p.
|
artikel
|
| 725 |
Bright future for laser trimming
|
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1976
|
100-101 |
3 |
p. 183-
1 p.
|
artikel
|
| 726 |
Build a sawtooth generator with three ICs
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|
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1971
|
100-101 |
3 |
p. 148-
1 p.
|
artikel
|
| 727 |
Build gated video amplifiers
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1972
|
100-101 |
3 |
p. 241-
1 p.
|
artikel
|
| 728 |
Building-in reliability for silver die attached light emitting diodes
|
Chim, W.K.
|
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1994
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100-101 |
3 |
p. 495-507
13 p.
|
artikel
|
| 729 |
Built-in reliability
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1965
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100-101 |
3 |
p. 301-
1 p.
|
artikel
|
| 730 |
Built-in test strategies for military systems
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1990
|
100-101 |
3 |
p. 621
|
artikel
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| 731 |
Bulk micromachining of Si by lithography and reactive ion etching (LIRIE)
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1997
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100-101 |
3 |
p. 543-
1 p.
|
artikel
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| 732 |
Bulk negative resistance device operated in a relaxation mode
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1970
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100-101 |
3 |
p. 227-
1 p.
|
artikel
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| 733 |
Bump formation for flip chip and CSP by solder paste printing
|
Kloeser, Joachim
|
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2002
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100-101 |
3 |
p. 391-398
8 p.
|
artikel
|
| 734 |
4713611 Burn-in apparatus for integrated circuits mounted on a carrier tape
|
Solstad, Russell V
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1988
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100-101 |
3 |
p. 499-500
2 p.
|
artikel
|
| 735 |
Burn-in effectiveness evaluation a lotus 1-2-3™ application
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1987
|
100-101 |
3 |
p. 586-
1 p.
|
artikel
|
| 736 |
Burn-in: what's in a name?
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1985
|
100-101 |
3 |
p. 581-
1 p.
|
artikel
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| 737 |
Bus-connectable TTL adds a new state to binary logic
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|
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1972
|
100-101 |
3 |
p. 243-
1 p.
|
artikel
|
| 738 |
Busy-period analysis of a one-server two-unit system subject to non-negligible inspection time
|
Gopalan, M.N.
|
|
1983
|
100-101 |
3 |
p. 453-465
13 p.
|
artikel
|
| 739 |
CAD program evaluates circuits, generates tests automatically
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1983
|
100-101 |
3 |
p. 591-
1 p.
|
artikel
|
| 740 |
CAD systems: mapping out tomorrow's ICs
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|
1985
|
100-101 |
3 |
p. 586-
1 p.
|
artikel
|
| 741 |
Calculating the speed of pumping systems
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1967
|
100-101 |
3 |
p. 256-257
2 p.
|
artikel
|
| 742 |
Calculating the time-specific frequency of system failure
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1980
|
100-101 |
3 |
p. 379-
1 p.
|
artikel
|
| 743 |
Calculation of node-pair reliability in large networks with unreliable nodes
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1996
|
100-101 |
3 |
p. 446-
1 p.
|
artikel
|
| 744 |
Calculation of the capacitance of a semiconductor surface, with application to silicon
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1965
|
100-101 |
3 |
p. 309-
1 p.
|
artikel
|
| 745 |
Calculation of thermoelastic stresses in microelectronics
|
Matthys, Lieven
|
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1998
|
100-101 |
3 |
p. 443-448
6 p.
|
artikel
|
| 746 |
Calculations of cutoff frequency, breakdown voltage and capacitance for diffused junctions in thin epitaxial silicon layers
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1967
|
100-101 |
3 |
p. 252-253
2 p.
|
artikel
|
| 747 |
Calendar
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|
2010
|
100-101 |
3 |
p. I-III
nvt p.
|
artikel
|
| 748 |
Calendar of forthcoming events
|
|
|
2002
|
100-101 |
3 |
p. I-VIII
nvt p.
|
artikel
|
| 749 |
Calendar of forthcoming events
|
|
|
2003
|
100-101 |
3 |
p. I-IX
nvt p.
|
artikel
|
| 750 |
Calendar of international conferences, symposia, lectures and meetings of interest
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1994
|
100-101 |
3 |
p. 577-579
3 p.
|
artikel
|
| 751 |
Calendar of international conferences, symposia, lectures and meetings of interest
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1982
|
100-101 |
3 |
p. 323-325
3 p.
|
artikel
|
| 752 |
Calendar of international conferences, symposia, lectures and meetings of interest
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|
1984
|
100-101 |
3 |
p. 367-369
3 p.
|
artikel
|
| 753 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
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|
1986
|
100-101 |
3 |
p. 405-407
3 p.
|
artikel
|
| 754 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
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|
1987
|
100-101 |
3 |
p. 399-403
5 p.
|
artikel
|
| 755 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1983
|
100-101 |
3 |
p. 407-410
4 p.
|
artikel
|
| 756 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
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|
1988
|
100-101 |
3 |
p. 335-339
5 p.
|
artikel
|
| 757 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
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|
1973
|
100-101 |
3 |
p. 183-184
2 p.
|
artikel
|
| 758 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1978
|
100-101 |
3 |
p. 333-335
3 p.
|
artikel
|
| 759 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1978
|
100-101 |
3 |
p. 205-209
5 p.
|
artikel
|
| 760 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1974
|
100-101 |
3 |
p. 151-152
2 p.
|
artikel
|
| 761 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1975
|
100-101 |
3 |
p. 251-252
2 p.
|
artikel
|
| 762 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1972
|
100-101 |
3 |
p. 229-230
2 p.
|
artikel
|
| 763 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1977
|
100-101 |
3 |
p. 183-184
2 p.
|
artikel
|
| 764 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1970
|
100-101 |
3 |
p. 203-205
3 p.
|
artikel
|
| 765 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1976
|
100-101 |
3 |
p. 171-172
2 p.
|
artikel
|
| 766 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1980
|
100-101 |
3 |
p. 173-175
3 p.
|
artikel
|
| 767 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1969
|
100-101 |
3 |
p. 263-265
3 p.
|
artikel
|
| 768 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1979
|
100-101 |
3 |
p. 169-171
3 p.
|
artikel
|
| 769 |
Calibrating microscopic linewidth measurement systems
|
|
|
1987
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 770 |
Calibration of ion implantation systems
|
|
|
1979
|
100-101 |
3 |
p. 203-
1 p.
|
artikel
|
| 771 |
Call for papers
|
|
|
1972
|
100-101 |
3 |
p. 233-
1 p.
|
artikel
|
| 772 |
Call for papers
|
|
|
1970
|
100-101 |
3 |
p. 209-
1 p.
|
artikel
|
| 773 |
Call setup time standards
|
Sultan, Torky I.
|
|
1987
|
100-101 |
3 |
p. 523-530
8 p.
|
artikel
|
| 774 |
CAM system requirements for ASIC manufacturing
|
|
|
1987
|
100-101 |
3 |
p. 590-591
2 p.
|
artikel
|
| 775 |
Can additional electron scattering decrease resistance?
|
|
|
1964
|
100-101 |
3 |
p. 205-
1 p.
|
artikel
|
| 776 |
Capacitance and doping profiles of ion-implanted, buried-channel MOSFETS
|
|
|
1979
|
100-101 |
3 |
p. 202-203
2 p.
|
artikel
|
| 777 |
Capacitance behavior of composites for supercapacitor applications prepared with different durations of graphene/nanoneedle MnO2 reduction
|
Kim, Myeongjin
|
|
2014
|
100-101 |
3 |
p. 587-594
8 p.
|
artikel
|
| 778 |
Capacitance extraction of integrated-circuit interconnects by matrix decomposition based on MEI concept
|
Liu, Y.W.
|
|
2000
|
100-101 |
3 |
p. 451-454
4 p.
|
artikel
|
| 779 |
Capacitance-voltage dependence on zinc-diffused GaAs p-n junctions
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|
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1965
|
100-101 |
3 |
p. 309-
1 p.
|
artikel
|
| 780 |
Capacitives methods of determination of the energy distribution of electron traps in semiconductors
|
|
|
1972
|
100-101 |
3 |
p. 244-
1 p.
|
artikel
|
| 781 |
Capacitor designs aim for IC compatibility
|
|
|
1970
|
100-101 |
3 |
p. 225-
1 p.
|
artikel
|
| 782 |
Capacity consideration in reliability analysis of communication systems
|
|
|
1983
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 783 |
Care in packaging off-the-shelf LSI keeps 32-bit mini-computer compact
|
|
|
1983
|
100-101 |
3 |
p. 599-
1 p.
|
artikel
|
| 784 |
Carrier accumulation and space-charge-limited current flow in fleld-effect transistors
|
|
|
1971
|
100-101 |
3 |
p. 148-
1 p.
|
artikel
|
| 785 |
Carrier collection in a semiconductor quantum well
|
|
|
1979
|
100-101 |
3 |
p. 197-
1 p.
|
artikel
|
| 786 |
Carrier fluctuation noise in a MOSFET channel due to traps in the oxide
|
|
|
1978
|
100-101 |
3 |
p. 233-
1 p.
|
artikel
|
| 787 |
Carrier surface scattering in silicon inversion layers
|
|
|
1965
|
100-101 |
3 |
p. 307-
1 p.
|
artikel
|
| 788 |
Carrier transport and storage effects in Au ion implanted SiO2 structures
|
|
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1973
|
100-101 |
3 |
p. 216-
1 p.
|
artikel
|
| 789 |
Cast: An electrical stress test to monitor single bit failures in flash-EEPROM structures
|
Cappelletti, P.
|
|
1997
|
100-101 |
3 |
p. 473-481
9 p.
|
artikel
|
| 790 |
Catastrophic burn out in power VDMOS field-effect transistors
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|
|
1984
|
100-101 |
3 |
p. 583-
1 p.
|
artikel
|
| 791 |
Cathodic pulverization, its mechanisms, its means of operation, its original applications in the field of thin layers
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1965
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100-101 |
3 |
p. 312-
1 p.
|
artikel
|
| 792 |
CCD and bubble memories: System implications
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1978
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100-101 |
3 |
p. 229-
1 p.
|
artikel
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| 793 |
CCDs bring solid-state benefits to bulk storage for computers
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1978
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100-101 |
3 |
p. 230-
1 p.
|
artikel
|
| 794 |
Ceramic multicomponent modules: a new approach to miniaturization
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1996
|
100-101 |
3 |
p. 451-
1 p.
|
artikel
|
| 795 |
4489397 Chain configurable polycellular wafer scale integrated circuit
|
Lee, KinH
|
|
1985
|
100-101 |
3 |
p. 605-
1 p.
|
artikel
|
| 796 |
CHAMP: The Cranfield Hybrid Automatic Maintenance Program
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1972
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100-101 |
3 |
p. 238-
1 p.
|
artikel
|
| 797 |
Changes in oxygen precipitation density during wafer processing
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1986
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100-101 |
3 |
p. 584-
1 p.
|
artikel
|
| 798 |
Channel-carrier mobility parameters for 4H SiC MOSFETs
|
Linewih, Handoko
|
|
2003
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100-101 |
3 |
p. 405-411
7 p.
|
artikel
|
| 799 |
Characterisation of I2L gates
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1979
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100-101 |
3 |
p. 193-
1 p.
|
artikel
|
| 800 |
Characterisation of I2L gates
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|
1979
|
100-101 |
3 |
p. 193-
1 p.
|
artikel
|
| 801 |
Characterisation of silicon metallization systems using energetic ion backscattering
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1975
|
100-101 |
3 |
p. 278-
1 p.
|
artikel
|
| 802 |
Characteristics and failure analysis of solid tantalum capacitors
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|
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1979
|
100-101 |
3 |
p. 186-
1 p.
|
artikel
|
| 803 |
Characteristics and reliability of 100 Å oxides
|
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|
1985
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100-101 |
3 |
p. 592-
1 p.
|
artikel
|
| 804 |
Characteristics of an indium-tin oxide transparent conductor deposited from organometallic compositions
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1979
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100-101 |
3 |
p. 200-
1 p.
|
artikel
|
| 805 |
Characteristics of parallel-plate transmission lines on silicon-siliconoxide system
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1971
|
100-101 |
3 |
p. 145-
1 p.
|
artikel
|
| 806 |
Characteristics of random telegraph signal noise in time delay integration CMOS image sensor
|
Han, Liqiang
|
|
2013
|
100-101 |
3 |
p. 400-404
5 p.
|
artikel
|
| 807 |
Characteristics of the diamond cut-off wheel for germanium
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1964
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100-101 |
3 |
p. 199-
1 p.
|
artikel
|
| 808 |
Characteristics of the intrinsic defects in unintentionally doped 4H–SiC after thermal annealing
|
Cheng, Ping
|
|
2011
|
100-101 |
3 |
p. 572-575
4 p.
|
artikel
|
| 809 |
Characteristics of the junction-gate field effect transistor with short channel length
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1972
|
100-101 |
3 |
p. 244-
1 p.
|
artikel
|
| 810 |
Characteristics of three-terminal metal-tunnel Oxide-n/p+ devices
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1980
|
100-101 |
3 |
p. 385-
1 p.
|
artikel
|
| 811 |
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
|
Yang, Ping-Feng
|
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2008
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100-101 |
3 |
p. 389-394
6 p.
|
artikel
|
| 812 |
Characterization and screening of SiO2 defects in EEPROM structures
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1984
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100-101 |
3 |
p. 588-
1 p.
|
artikel
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| 813 |
Characterization control, and use of dielectric charge effects in silicon technology
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1970
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100-101 |
3 |
p. 227-
1 p.
|
artikel
|
| 814 |
Characterization of a chromium-gold deposition process for the production of thin film hybrid microcircuits
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1975
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100-101 |
3 |
p. 284-
1 p.
|
artikel
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| 815 |
Characterization of a thick-film resistor conduction mechanism
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1973
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3 |
p. 214-
1 p.
|
artikel
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| 816 |
Characterization of bias sputtered metallization for IC technology
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1985
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100-101 |
3 |
p. 589-
1 p.
|
artikel
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| 817 |
Characterization of CCD technology on 64 × 128 element photosensor
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1976
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100-101 |
3 |
p. 183-
1 p.
|
artikel
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| 818 |
Characterization of die attach failure modes in leadless chip carrier (LCC) packages by auger electron spectroscopy
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1985
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100-101 |
3 |
p. 582-
1 p.
|
artikel
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| 819 |
Characterization of functional relationship between temperature and microelectronic reliability
|
Lall, Pradeep
|
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1995
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3 |
p. 377-402
26 p.
|
artikel
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| 820 |
Characterization of horizontal Bridgman-grown semi-insulating GaAs for ion implantation
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1983
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100-101 |
3 |
p. 604-
1 p.
|
artikel
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| 821 |
Characterization of interface states in thin films of thermally grown SiO2
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1985
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100-101 |
3 |
p. 591-
1 p.
|
artikel
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| 822 |
Characterization of interfacial thermal resistance by acoustic micrography imaging
|
Haque, Shatil
|
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2000
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3 |
p. 465-476
12 p.
|
artikel
|
| 823 |
Characterization of multiple deep level systems in semiconductor junctions by admittance measurements
|
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1974
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100-101 |
3 |
p. 167-
1 p.
|
artikel
|
| 824 |
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus
|
Thijsse, J.
|
|
2008
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100-101 |
3 |
p. 401-407
7 p.
|
artikel
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| 825 |
Characterization of thick-film resistives for maximum production yields
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1971
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100-101 |
3 |
p. 152-
1 p.
|
artikel
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| 826 |
Characterizations of the exponential distribution via mixing distributions
|
Gharib, M.
|
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1996
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100-101 |
3 |
p. 293-305
13 p.
|
artikel
|
| 827 |
Characterizing plasma phosphorus-doped oxides
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1986
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100-101 |
3 |
p. 586-
1 p.
|
artikel
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| 828 |
Charge coupled devices—basic operation and principles
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1977
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100-101 |
3 |
p. 212-
1 p.
|
artikel
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| 829 |
Charge transfer controlled surface interactions between oxygen and CdSe films
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1964
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3 |
p. 204-
1 p.
|
artikel
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| 830 |
Charge-transfer devices filter complex communications signals
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1975
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3 |
p. 274-
1 p.
|
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| 831 |
Chemical and ambient effects on surface conduction is passivated silicon semiconductor
|
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1965
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100-101 |
3 |
p. 308-
1 p.
|
artikel
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| 832 |
Chemically selective, anisotropic plasma etching
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1978
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100-101 |
3 |
p. 235-
1 p.
|
artikel
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| 833 |
CHIL and I2L with passive isolation
|
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1976
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100-101 |
3 |
p. 181-
1 p.
|
artikel
|
| 834 |
Chip checks and compares characters
|
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1979
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100-101 |
3 |
p. 196-
1 p.
|
artikel
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| 835 |
Chip corrosion in plastic packages
|
Berg, Howard M.
|
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1980
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100-101 |
3 |
p. 247-263
17 p.
|
artikel
|
| 836 |
Chip cuts parts count in error correction networks
|
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1979
|
100-101 |
3 |
p. 195-
1 p.
|
artikel
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| 837 |
Chip formats hard-sectored floppies
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1979
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100-101 |
3 |
p. 196-
1 p.
|
artikel
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| 838 |
Chip implantation—alternative in the group technology
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1983
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100-101 |
3 |
p. 595-
1 p.
|
artikel
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| 839 |
Chip makers ride CRT controller wave
|
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|
1980
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100-101 |
3 |
p. 383-
1 p.
|
artikel
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| 840 |
Chip manufacturing: matching production plan with customer requirements
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1996
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100-101 |
3 |
p. 450-
1 p.
|
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| 841 |
Chip-module package interfaces
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1979
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100-101 |
3 |
p. 192-
1 p.
|
artikel
|
| 842 |
4703483 Chip on chip type integrated circuit device
|
Enomoto, Yoshinori
|
|
1988
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100-101 |
3 |
p. 498-
1 p.
|
artikel
|
| 843 |
Chip scale package: ‘a lightly dressed LSI chip’
|
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1997
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100-101 |
3 |
p. 538-
1 p.
|
artikel
|
| 844 |
Chip type aluminum electrolytic capacitors feature SMT-compatibility, low profiles
|
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|
1990
|
100-101 |
3 |
p. 617
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artikel
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| 845 |
Choice of a process inspection scheme for attribute data
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1971
|
100-101 |
3 |
p. 143-
1 p.
|
artikel
|
| 846 |
Chromium/cobalt—an extremely versatile thin-film technology
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1971
|
100-101 |
3 |
p. 152-
1 p.
|
artikel
|
| 847 |
Chromium masks
|
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1970
|
100-101 |
3 |
p. 222-
1 p.
|
artikel
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| 848 |
Circuit cost reduction
|
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1973
|
100-101 |
3 |
p. 206-
1 p.
|
artikel
|
| 849 |
4549101 Circuit for generating test equalization pulse
|
Sood, LalC
|
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1986
|
100-101 |
3 |
p. 600-
1 p.
|
artikel
|
| 850 |
4714876 Circuit for initiating test modes
|
Gay, Richard
|
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1988
|
100-101 |
3 |
p. 500-
1 p.
|
artikel
|
| 851 |
4847838 Circuit for testing the bus structure of a printed wiring card
|
Kralik, Ivan
|
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1990
|
100-101 |
3 |
p. ii
|
artikel
|
| 852 |
Circuit level interconnect reliability study using 3D circuit model
|
He, Feifei
|
|
2010
|
100-101 |
3 |
p. 376-390
15 p.
|
artikel
|
| 853 |
4540857 Circuit testing of telephone grids or the like
|
Parsons, DonaldF
|
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1986
|
100-101 |
3 |
p. 597-
1 p.
|
artikel
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| 854 |
Cleaning processes for HIC's with solder paste
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1985
|
100-101 |
3 |
p. 593-594
2 p.
|
artikel
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| 855 |
Cleanliness and the cleaning of silicon wafers
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1977
|
100-101 |
3 |
p. 213-
1 p.
|
artikel
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| 856 |
Clip-and-read comparator finds IC failures
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1972
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100-101 |
3 |
p. 236-
1 p.
|
artikel
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| 857 |
C-MOS—a status report
|
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1975
|
100-101 |
3 |
p. 276-
1 p.
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artikel
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| 858 |
C-MOS chip set gives new life to twisted pairs for local networks
|
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1983
|
100-101 |
3 |
p. 599-
1 p.
|
artikel
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| 859 |
C-MOS codec splits transmitting, receiving sections
|
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1979
|
100-101 |
3 |
p. 195-
1 p.
|
artikel
|
| 860 |
C-MOS converters resolve 12 bits
|
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1978
|
100-101 |
3 |
p. 356-
1 p.
|
artikel
|
| 861 |
CMOS for high-density gate arrays
|
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1985
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
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| 862 |
C-MOS gets a rise out of LSI
|
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1978
|
100-101 |
3 |
p. 358-
1 p.
|
artikel
|
| 863 |
C-MOS LSI: comparing second-generation approaches
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1980
|
100-101 |
3 |
p. 381-
1 p.
|
artikel
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| 864 |
CMOS single-chip digital signal processor
|
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1985
|
100-101 |
3 |
p. 590-
1 p.
|
artikel
|
| 865 |
8504966 CMOS spare circuit
|
Clemons, DonaldGordon
|
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1986
|
100-101 |
3 |
p. 601-
1 p.
|
artikel
|
| 866 |
C-MOS specifications: Don't take them for granted
|
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1975
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100-101 |
3 |
p. 270-
1 p.
|
artikel
|
| 867 |
CMOS test chip design for process problem debugging and yield prediction experiments
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1987
|
100-101 |
3 |
p. 582-
1 p.
|
artikel
|
| 868 |
C/MOS watch kit aims at potential $50 million market
|
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1972
|
100-101 |
3 |
p. 242-
1 p.
|
artikel
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| 869 |
Codeposition vs layering of sputtered silicide films
|
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1986
|
100-101 |
3 |
p. 587-
1 p.
|
artikel
|
| 870 |
Coding and decoding of Wafers
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1980
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100-101 |
3 |
p. 381-
1 p.
|
artikel
|
| 871 |
Colloquium on Microbonding
|
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1966
|
100-101 |
3 |
p. ii-
1 p.
|
artikel
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| 872 |
Combined hardware/software reliability predictions
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1986
|
100-101 |
3 |
p. 578-
1 p.
|
artikel
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| 873 |
Combining diagnosis and emulation yields fast fault-finding
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1978
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100-101 |
3 |
p. 352-
1 p.
|
artikel
|
| 874 |
Combining functional and structural approaches in test generation for digital systems
|
Ubar, Raimund
|
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1998
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3 |
p. 317-329
13 p.
|
artikel
|
| 875 |
Common-cause failure analysis of a k-out-of-n:G system with repairable units
|
Dhillon, B.S.
|
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1994
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100-101 |
3 |
p. 429-442
14 p.
|
artikel
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| 876 |
Common-chip for use in disk and diskette controllers
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1983
|
100-101 |
3 |
p. 599-
1 p.
|
artikel
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| 877 |
Common market eyes VLSI effort
|
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1979
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3 |
p. 191-
1 p.
|
artikel
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| 878 |
Compact modeling of short-channel effects in symmetric and asymmetric 3-T/4-T double gate MOSFETs
|
Mohammadi, Saeed
|
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2011
|
100-101 |
3 |
p. 543-549
7 p.
|
artikel
|
| 879 |
Companding D/A and A/D converters
|
Nimmo, R.
|
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1981
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100-101 |
3 |
p. 343-353
11 p.
|
artikel
|
| 880 |
Comparative advantages of in-house custom design of MOS LSI
|
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1975
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100-101 |
3 |
p. 271-
1 p.
|
artikel
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| 881 |
Comparative analysis of network reliability algorithms
|
Holovac, Srdjan
|
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1989
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3 |
p. 425-432
8 p.
|
artikel
|
| 882 |
Comparative investigation of thick-film and thin-film components and MIC's up to 16 GHz
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1976
|
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3 |
p. 187-
1 p.
|
artikel
|
| 883 |
Comparative studies of photoresist processing of microelectronics regarding chemical pollution, shortage and cost
|
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1976
|
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3 |
p. 182-
1 p.
|
artikel
|
| 884 |
Compare reliability at a glance
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1971
|
100-101 |
3 |
p. 144-
1 p.
|
artikel
|
| 885 |
Comparison between trap and self-heating induced mobility degradation in AlGaN/GaN HEMTs
|
Kalavagunta, Aditya
|
|
2014
|
100-101 |
3 |
p. 570-574
5 p.
|
artikel
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| 886 |
Comparison of attribute reliability growth models
|
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1984
|
100-101 |
3 |
p. 586-
1 p.
|
artikel
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| 887 |
Comparison of bipolar and MOS integrated circuits
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1969
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100-101 |
3 |
p. 255-
1 p.
|
artikel
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| 888 |
Comparison of different flex materials in high density flip chip on flex applications
|
Palm, Petteri
|
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2003
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3 |
p. 445-451
7 p.
|
artikel
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| 889 |
Comparison of different SOI technologies: assets and liabilities
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1984
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100-101 |
3 |
p. 592-
1 p.
|
artikel
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| 890 |
Comparison of modulation doped effect in negative differential resistance field effect transistors (NDRFETs)
|
Liu, Rong-Chau
|
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1998
|
100-101 |
3 |
p. 367-372
6 p.
|
artikel
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| 891 |
Comparison of predicted and demonstrated reliability and maintainability figures
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1969
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100-101 |
3 |
p. 252-
1 p.
|
artikel
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| 892 |
Comparison of surface recombination effect in GaAs-based heterostructure-emitter and heterostructure-base transistors (HEHBTs)
|
Liu, Rong-Chau
|
|
1998
|
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3 |
p. 361-365
5 p.
|
artikel
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| 893 |
Comparison of theoretical and empirical lifetimes for minority carriers in heavily doped silicon
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1985
|
100-101 |
3 |
p. 591-
1 p.
|
artikel
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| 894 |
Comparison of the structure of amorphous Ge and GaAs
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1975
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100-101 |
3 |
p. 280-
1 p.
|
artikel
|
| 895 |
Comparison of three-state probabilities under steady-state and transient conditions using both Laplace Transforms and Flow-Graph Methods, when applied to four TVA models
|
Qamber, Isa S.
|
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1994
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3 |
p. 463-473
11 p.
|
artikel
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| 896 |
Comparison of type-I and type-II accelerated life tests for selecting the most reliable product
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1996
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3 |
p. 445-
1 p.
|
artikel
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| 897 |
Comparisons of block diagram and Markov method system reliability and mean time to failure results for constant and non-constant unit failure rates
|
Dhillon, B.S.
|
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1997
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3 |
p. 505-509
5 p.
|
artikel
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| 898 |
Competing risks in parallel and series systems
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Jaisingh, Lloyd R.
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1988
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p. 469-485
17 p.
|
artikel
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| 899 |
Complementary MOS offers many advantages to the digital-systems designer
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1973
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3 |
p. 208-209
2 p.
|
artikel
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| 900 |
Complex system reliability with general repair time distributions under head-of-line-repair-discipline
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1974
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3 |
p. 163-
1 p.
|
artikel
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| 901 |
Complex system RMA and T, using Markov models
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1986
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3 |
p. 579-
1 p.
|
artikel
|
| 902 |
Compliant beam lead bonding
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1975
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3 |
p. 271-272
2 p.
|
artikel
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| 903 |
Component availability
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1983
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3 |
p. 588-
1 p.
|
artikel
|
| 904 |
Component failures based on flow distributions
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1990
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3 |
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|
artikel
|
| 905 |
Component reliability under environmental stress
|
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1975
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3 |
p. 266-
1 p.
|
artikel
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| 906 |
Component reliability under nuclear radiation environment
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1975
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3 |
p. 263-
1 p.
|
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| 907 |
Component value spread and network function tolerances: an optimal design procedure
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1972
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3 |
p. 237-
1 p.
|
artikel
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| 908 |
Compound availability measures for a two-unit standby system
|
Kapur, P.K.
|
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1990
|
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3 |
p. 425-429
|
artikel
|
| 909 |
Compound Poisson approximation in reliability theory
|
|
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1997
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3 |
p. 535-
1 p.
|
artikel
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| 910 |
Comprehensive model for humidity testing correlation
|
|
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1987
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3 |
p. 583-
1 p.
|
artikel
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| 911 |
Compressing test patterns to fit into LSI testers
|
|
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1979
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3 |
p. 189-
1 p.
|
artikel
|
| 912 |
Computer-aided design of an n-MOS custom IC-“Subscriber Chip” of the 32-lines microprocessor based PAX (private automatic exchange) system
|
Srivastava, Ashok
|
|
1985
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100-101 |
3 |
p. 425-436
12 p.
|
artikel
|
| 913 |
Computer aided design of IC and LSI devices
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1971
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3 |
p. 146-
1 p.
|
artikel
|
| 914 |
Computer aided integrated circuit design
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1969
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3 |
p. 257-
1 p.
|
artikel
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| 915 |
Computer aided layout of microcircuits
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1969
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3 |
p. 255-
1 p.
|
artikel
|
| 916 |
Computer-aided prediction of failure rates for complex electronic telecommunication systems
|
Nitsch, R.
|
|
1989
|
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3 |
p. 331-336
6 p.
|
artikel
|
| 917 |
Computer-aided sequential testing for equipment reliability
|
|
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1975
|
100-101 |
3 |
p. 268-
1 p.
|
artikel
|
| 918 |
Computer aided stress analysis of digital circuits
|
|
|
1986
|
100-101 |
3 |
p. 578-
1 p.
|
artikel
|
| 919 |
Computer-aided thermal analysis of a hybrid multistage active bandpass filter/amplifier
|
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|
1977
|
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3 |
p. 219-
1 p.
|
artikel
|
| 920 |
Computer aids for reliability prediction and spares provisioning
|
|
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1980
|
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3 |
p. 379-
1 p.
|
artikel
|
| 921 |
Computer analysis of punch-through in MOSFETs
|
|
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1979
|
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3 |
p. 199-
1 p.
|
artikel
|
| 922 |
Computer analysis of wire bond pull test data
|
|
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1986
|
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3 |
p. 575-
1 p.
|
artikel
|
| 923 |
Computer applications to the hybrid microelectronic circuit design
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|
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1973
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3 |
p. 214-
1 p.
|
artikel
|
| 924 |
Computer-assisted testing system for power supply units—reduce quality assurance costs
|
|
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1986
|
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3 |
p. 580-
1 p.
|
artikel
|
| 925 |
Computer controlled electron-beam projection mask aligner
|
|
|
1975
|
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3 |
p. 285-
1 p.
|
artikel
|
| 926 |
Computer controlled optical microprojection system for one micron structures
|
|
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1980
|
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3 |
p. 381-
1 p.
|
artikel
|
| 927 |
Computer controlled test systems—can hybrid circuit manufacturers employ them successfully?
|
|
|
1973
|
100-101 |
3 |
p. 213-214
2 p.
|
artikel
|
| 928 |
Computerized fault tree analyses at Duke Power Company
|
|
|
1978
|
100-101 |
3 |
p. 229-
1 p.
|
artikel
|
| 929 |
Computerized mask-making for complex memory chips
|
|
|
1971
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100-101 |
3 |
p. 146-147
2 p.
|
artikel
|
| 930 |
Computerized Testing of thin-film circuit conductors
|
|
|
1972
|
100-101 |
3 |
p. 246-
1 p.
|
artikel
|
| 931 |
4488299 Computerized versatile and modular test system for electrical circuits
|
Fellhauer, Michae
|
|
1985
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3 |
p. 603-
1 p.
|
artikel
|
| 932 |
Computer networks and distributed systems
|
Sherif, Yosef S.
|
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1988
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3 |
p. 419-467
49 p.
|
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|
| 933 |
Computer partitioning improves long-term reliability in space
|
|
|
1968
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100-101 |
3 |
p. 271-
1 p.
|
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|
| 934 |
Computer's aid for integrated circuit mask production
|
|
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1969
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3 |
p. 256-
1 p.
|
artikel
|
| 935 |
Computers that are “never” down
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|
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1986
|
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3 |
p. 575-
1 p.
|
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|
| 936 |
Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)
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1996
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3 |
p. 441-
1 p.
|
artikel
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| 937 |
Conduction mechanisms in thick film microcircuits. Semiannual technical report
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1975
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100-101 |
3 |
p. 285-
1 p.
|
artikel
|
| 938 |
Conduction mechanisms of silicon oxide/titanium oxide MOS stack structures
|
Tinoco, J.C.
|
|
2008
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100-101 |
3 |
p. 370-381
12 p.
|
artikel
|
| 939 |
Conduction phenomena in Nb-Nb2O5-Au thin film structures fabricated by various techniques
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1978
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100-101 |
3 |
p. 363-
1 p.
|
artikel
|
| 940 |
Conduction Processes in thick film resistors. Part I
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1977
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100-101 |
3 |
p. 218-
1 p.
|
artikel
|
| 941 |
Conduction processes in thick film resistors. Part II
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1977
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100-101 |
3 |
p. 218-
1 p.
|
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| 942 |
Conduction properties of lightly doped, polycrystalline silicon
|
|
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1979
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100-101 |
3 |
p. 197-
1 p.
|
artikel
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| 943 |
Conduction studies in silicon nitride; dark currents and photocurrents
|
|
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1978
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100-101 |
3 |
p. 361-
1 p.
|
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|
| 944 |
Conduction theory applied to thick-film resistors
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|
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1976
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100-101 |
3 |
p. 187-
1 p.
|
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| 945 |
Conduction through TiO2 thin films with large ionic space charge
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1968
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100-101 |
3 |
p. 279-
1 p.
|
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| 946 |
Conductivity increase of amorphous Si and Ge by Mn
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1978
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100-101 |
3 |
p. 231-
1 p.
|
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| 947 |
Conference report
|
Jacobs, Richard M.
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1971
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100-101 |
3 |
p. 137-140
4 p.
|
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|
| 948 |
Conference report
|
Thomas, J.W.
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1970
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3 |
p. 207-208
2 p.
|
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| 949 |
Conference report
|
Jacobs, Richard M
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1978
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3 |
p. 343-350
8 p.
|
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|
| 950 |
Conference report 20th Annual Reliability and Maintainability Symposium
|
Jacobs, R.M.
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1974
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100-101 |
3 |
p. 157-159
3 p.
|
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|
| 951 |
Conference report 19th Annual Reliability and Maintainability Symposium, U.S.A.
|
Jacobs, Richard M.
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1973
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100-101 |
3 |
p. 191-197
7 p.
|
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|
| 952 |
Conference report 18th Annual Reliability Symposium, U.S.A.
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Jacobs, Richard M.
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1972
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3 |
p. 257-261
5 p.
|
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| 953 |
Conference report 6th International Conference on Pattern Recognition
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Lang, Manfred
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1983
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3 |
p. 413-414
2 p.
|
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| 954 |
Confidence bounds on reliability for the inverse Gaussian model
|
|
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1980
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100-101 |
3 |
p. 379-
1 p.
|
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| 955 |
Considerations in the hermetic packaging of hybrid microcircuits
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|
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1985
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100-101 |
3 |
p. 594-
1 p.
|
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| 956 |
Constraint solver for generalized IC layout
|
|
|
1985
|
100-101 |
3 |
p. 586-587
2 p.
|
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| 957 |
Consumer electronics heading for a year of improvements, paced by monolithic ICs
|
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1974
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3 |
p. 166-
1 p.
|
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| 958 |
Contact and relaxation behaviour of aluminium conductor materials in the solderless wire-wrap technique, Part 1
|
|
|
1980
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100-101 |
3 |
p. 376-
1 p.
|
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| 959 |
Contact injection into dielectric films in microelectronic structures
|
Pitt, C.W.
|
|
1970
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100-101 |
3 |
p. 239-266
28 p.
|
artikel
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| 960 |
Contact noise in thick film resistors
|
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1979
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100-101 |
3 |
p. 200-
1 p.
|
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| 961 |
Contact stress and wear study for type characters
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1979
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3 |
p. 188-
1 p.
|
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| 962 |
Contribution to the study of the vicinal surfaces of GaAs application to homoepitaxy
|
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1977
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3 |
p. 217-
1 p.
|
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| 963 |
4714839 Control circuit for disabling or enabling the provision of redundancy
|
Chung, Shine C
|
|
1988
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100-101 |
3 |
p. 500-
1 p.
|
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| 964 |
Controlled anisotropic etching of polysilicon
|
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1983
|
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3 |
p. 601-
1 p.
|
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|
| 965 |
Controlled diffraction as the basis of an out-of-contact masking system
|
|
|
1973
|
100-101 |
3 |
p. 208-
1 p.
|
artikel
|
| 966 |
Control of diffusion induced dislocations in phosphorus diffused silicon
|
|
|
1967
|
100-101 |
3 |
p. 247-
1 p.
|
artikel
|
| 967 |
Control of electrostatic discharge damage to semiconductors
|
|
|
1975
|
100-101 |
3 |
p. 265-
1 p.
|
artikel
|
| 968 |
Control of pre-trim variables in thick film resistor processing
|
|
|
1979
|
100-101 |
3 |
p. 200-
1 p.
|
artikel
|
| 969 |
Control of the encapsulation material as an aid to long term reliability in plastic encapsulated semiconductor components (PEDs)
|
Harrison, JC
|
|
1977
|
100-101 |
3 |
p. 233-244
12 p.
|
artikel
|
| 970 |
Correction for BIT detectability measurement error
|
|
|
1987
|
100-101 |
3 |
p. 586-
1 p.
|
artikel
|
| 971 |
Correct the process, not the product
|
|
|
1986
|
100-101 |
3 |
p. 576-
1 p.
|
artikel
|
| 972 |
Correlating tropical exposure of plastic encapsulated devices with laboratory tests
|
|
|
1980
|
100-101 |
3 |
p. 376-
1 p.
|
artikel
|
| 973 |
Correlation between cyclic strain range and low-cycle fatigue life of metals
|
|
|
1965
|
100-101 |
3 |
p. 303-
1 p.
|
artikel
|
| 974 |
Correlation between the presence of dislocations and vacancies in N-Type gallium arsenide
|
|
|
1972
|
100-101 |
3 |
p. 236-
1 p.
|
artikel
|
| 975 |
Corrigendum to “An analytical approach to calculate effective channel length in graphene nanoribbon field effect transistors” [Microelectron. Reliab. 53 (4) (2013) 540–543]
|
Ghadiry, M.
|
|
2014
|
100-101 |
3 |
p. 662-
1 p.
|
artikel
|
| 976 |
Corrosion failure of Al-Mg alloy bonding wires in plastic packages
|
|
|
1987
|
100-101 |
3 |
p. 582-
1 p.
|
artikel
|
| 977 |
Cosmic ray induced failures in high power semiconductor devices
|
|
|
1997
|
100-101 |
3 |
p. 534-
1 p.
|
artikel
|
| 978 |
Co-sputtered cermet films
|
|
|
1968
|
100-101 |
3 |
p. 282-
1 p.
|
artikel
|
| 979 |
Cost analysis in a two-unit standby system with a regular repairman and patience time
|
Goyal, Vibha
|
|
1984
|
100-101 |
3 |
p. 453-459
7 p.
|
artikel
|
| 980 |
Cost analysis in two-unit warm standby models with a regular repairman and patience time
|
Murari, K.
|
|
1985
|
100-101 |
3 |
p. 473-483
11 p.
|
artikel
|
| 981 |
Cost analysis of a multi-component screening system in the paper industry
|
Kumar, Dinesh
|
|
1990
|
100-101 |
3 |
p. 457-461
|
artikel
|
| 982 |
Cost analysis of an electronic repairable redundant system with critical human errors
|
Gupta, P.P.
|
|
1986
|
100-101 |
3 |
p. 417-421
5 p.
|
artikel
|
| 983 |
Cost analysis of a system with partial failure mode and abnormal weather conditions
|
Goel, L.R.
|
|
1985
|
100-101 |
3 |
p. 461-466
6 p.
|
artikel
|
| 984 |
Cost: a reliability factor
|
|
|
1965
|
100-101 |
3 |
p. 301-
1 p.
|
artikel
|
| 985 |
Cost-benefit analysis and joint availability measures
|
Gopalan, M.N.
|
|
1986
|
100-101 |
3 |
p. 483-489
7 p.
|
artikel
|
| 986 |
Cost-benefit analysis of a one out of n : G system with repair and preventive maintenance
|
Gopalan, M.N.
|
|
1986
|
100-101 |
3 |
p. 519-534
16 p.
|
artikel
|
| 987 |
Cost-benefit analysis of a one-server two-unit system subject to shock and degradation
|
Gopalan, M.N.
|
|
1986
|
100-101 |
3 |
p. 499-518
20 p.
|
artikel
|
| 988 |
Cost-benefit analysis of a one-server two-unit system subject to two types of failure
|
Subramanyam Naidu, R.
|
|
1983
|
100-101 |
3 |
p. 441-443
3 p.
|
artikel
|
| 989 |
Cost-benefit analysis of A 1-server n-unit system subject to general repair and inspection
|
Subramanyam Naidu, R.
|
|
1983
|
100-101 |
3 |
p. 531-540
10 p.
|
artikel
|
| 990 |
Cost-benefit analysis of a 1-server 2-unit system subject to different repair strategies
|
Gopalan, M.N.
|
|
1982
|
100-101 |
3 |
p. 393-397
5 p.
|
artikel
|
| 991 |
Cost-benefit analysis of a system with inspection, replacement and two types of repair
|
Singh, S.K.
|
|
1988
|
100-101 |
3 |
p. 383-389
7 p.
|
artikel
|
| 992 |
Cost-benefit analysis of a two-unit cold standby system subject to slow switch
|
|
|
1986
|
100-101 |
3 |
p. 579-580
2 p.
|
artikel
|
| 993 |
Cost-benefit analysis of a two-unit warm standby reliability system with two types of repair facilities
|
Mokaddis, G.S.
|
|
1993
|
100-101 |
3 |
p. 335-348
14 p.
|
artikel
|
| 994 |
Cost-benefit analysis of one-server two-unit hot standby system with imperfect switch subject to adjustable repair
|
Gopalan, M.N.
|
|
1986
|
100-101 |
3 |
p. 453-454
2 p.
|
artikel
|
| 995 |
Cost-benefit analysis of one-server two-unit imperfect switch system subject to multistage repairs
|
Gopalan, M.N.
|
|
1985
|
100-101 |
3 |
p. 541-548
8 p.
|
artikel
|
| 996 |
Cost effective accelerated testing and analysis
|
|
|
1986
|
100-101 |
3 |
p. 579-
1 p.
|
artikel
|
| 997 |
Cost effectiveness of burn-in procedures of semiconductor devices and integrated circuits
|
Vassilev, V.Z.
|
|
1989
|
100-101 |
3 |
p. 453-458
6 p.
|
artikel
|
| 998 |
Cost-effective software safety analysis
|
|
|
1990
|
100-101 |
3 |
p. 618
|
artikel
|
| 999 |
Cost effective testing techniques for LSI components
|
|
|
1977
|
100-101 |
3 |
p. 209-
1 p.
|
artikel
|
| 1000 |
Cost optimal, parallel reliability systems with fixed repair sanction
|
Venugopal, N.
|
|
1987
|
100-101 |
3 |
p. 419-422
4 p.
|
artikel
|
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