Digitale Bibliotheek
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                             133 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A constitutive single crystal model for the silicon mechanical behavior: Applications to the stress induced by silicided lines and STI in MOS technologies Cacho, F.
2007
100-101 2-3 p. 161-167
7 p.
artikel
2 4947375 Addressing of redundant columns and rows of an integrated circuit memory Gaultier, JeanMarie
1991
100-101 2-3 p. x-xi
nvt p.
artikel
3 Advanced numerical prototyping methods in modern engineering applications – Optimisation for micro-electronic package reliability Wymysłowski, A.
2007
100-101 2-3 p. 280-289
10 p.
artikel
4 Advanced structural similarity rules for the BGA package family van Driel, W.D.
2007
100-101 2-3 p. 205-214
10 p.
artikel
5 A method for evaluation of number class intervals of histogram Brkić, D.M.
1991
100-101 2-3 p. 245-248
4 p.
artikel
6 An algorithm to solve integer programming problems: An efficient tool for reliability design Misra, Krishna B.
1991
100-101 2-3 p. 285-294
10 p.
artikel
7 Analysis of a complex system composed of two sub-systems with their standbys Gupta, Rakesh
1991
100-101 2-3 p. 453-463
11 p.
artikel
8 Analysis of Cu/low-k bond pad delamination by using a novel failure index van Gils, M.A.J.
2007
100-101 2-3 p. 179-186
8 p.
artikel
9 Analysis of d.c. and a.c. anomalous latch-up effects in commercial CMOS integrated circuits Zanoni, Enrico
1991
100-101 2-3 p. 249-254
6 p.
artikel
10 Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly Van Steenberge, Nele
2007
100-101 2-3 p. 215-222
8 p.
artikel
11 An efficient approach for multiple criteria redundancy optimization problems Misra, Krishna B.
1991
100-101 2-3 p. 303-321
19 p.
artikel
12 A new two-dimensional threshold voltage model for cylindrical, fully-depleted, surrounding-gate (SG) MOSFETs Chiang, T.K.
2007
100-101 2-3 p. 379-383
5 p.
artikel
13 4907931 Apparatus for handling semiconductor wafers Mallory, ChesterL
1991
100-101 2-3 p. i-
1 p.
artikel
14 4931726 Apparatus for testing semiconductor device Kasukabe, Susumu
1991
100-101 2-3 p. vii-
1 p.
artikel
15 4900948 Apparatus providing signals for burn-in of integrated circuits Hamilton, Harold
1991
100-101 2-3 p. i-
1 p.
artikel
16 Application of an efficient search technique for optimal design of a computer communication network Sharma, Usha
1991
100-101 2-3 p. 337-341
5 p.
artikel
17 Application of simulation-based decision making in product development of an RF module Lindgren, Mats
2007
100-101 2-3 p. 302-309
8 p.
artikel
18 Applications of a search algorithm to reliability design problems Misra, Krishna B.
1991
100-101 2-3 p. 295-301
7 p.
artikel
19 A practical method of binomial reliability assessment Wang, Hong-Zhou
1991
100-101 2-3 p. 255-256
2 p.
artikel
20 A stuck fault model for dynamic CMOS combinational circuits Ismaeel, Asad A.
1991
100-101 2-3 p. 407-427
21 p.
artikel
21 A threshold-voltage model of SiGe-channel pMOSFET without Si cap layer Zou, X.
2007
100-101 2-3 p. 391-394
4 p.
artikel
22 4947545 Automated burn-in system Gussman, Robert
1991
100-101 2-3 p. xi-
1 p.
artikel
23 Availability and frequency of failures of a system in the presence of chance common-cause shock failures Madhusudana Verma, S.
1991
100-101 2-3 p. 265-269
5 p.
artikel
24 Bibliography on electrical conduction in thick film resistors Dziedzic, Andrzej
1991
100-101 2-3 p. 549-558
10 p.
artikel
25 4949341 Built-in self test method for application specific integrated circuit libraries Lopez, David
1991
100-101 2-3 p. xi-
1 p.
artikel
26 4926117 Burn-in board having discrete test capability Nevill, LelandR
1991
100-101 2-3 p. vi-
1 p.
artikel
27 Carbon/polyesterimide thick-film resistive composites – Experimental characterization and theoretical analysis of physicochemical, electrical and stability properties Dziedzic, Andrzej
2007
100-101 2-3 p. 354-362
9 p.
artikel
28 CHE failure in a two-unit standby system with slow switch, repair and post repair Goel, L.R.
1991
100-101 2-3 p. 219-222
4 p.
artikel
29 Correlation between chemistry of polymer building blocks and microelectronics reliability Bressers, H.J.L.
2007
100-101 2-3 p. 290-294
5 p.
artikel
30 Cost analysis of a one-unit repairable system subject to on-line preventive maintenance and/or repair Gopalan, M.N.
1991
100-101 2-3 p. 223-228
6 p.
artikel
31 Creep of thermally aged SnAgCu-solder joints Wiese, S.
2007
100-101 2-3 p. 223-232
10 p.
artikel
32 4929889 Data path chip test architecture Seiler, LarryD
1991
100-101 2-3 p. vii-
1 p.
artikel
33 Dependability evaluation of Altera FPGA-based embedded systems subjected to SEUs Zarandi, Hamid R.
2007
100-101 2-3 p. 461-470
10 p.
artikel
34 Design of reconfigurable fault-tolerant VLSI/WSI processor array structures Noore, A.
1991
100-101 2-3 p. 481-489
9 p.
artikel
35 Dynamic responses and solder joint reliability under board level drop test Luan, Jing-en
2007
100-101 2-3 p. 450-460
11 p.
artikel
36 Dynamic void formation in a DD-copper-structure with different metallization geometry Weide-Zaage, Kirsten
2007
100-101 2-3 p. 319-325
7 p.
artikel
37 Effect of different temperature cycling profiles on the crack initiation and propagation of Sn–3.5Ag wave soldered solder joints Andersson, C.
2007
100-101 2-3 p. 266-272
7 p.
artikel
38 Effect of filler concentration of rubbery shear and bulk modulus of molding compounds Yang, D.G.
2007
100-101 2-3 p. 233-239
7 p.
artikel
39 Effect of stress voltages on voltage acceleration and lifetime projections for ultra-thin gate oxides Abadeer, W.W.
2007
100-101 2-3 p. 395-400
6 p.
artikel
40 4932028 Error log system for self-testing in very large scale integrated circuit (VLSI) units Katircioglu, Haluk
1991
100-101 2-3 p. viii-
1 p.
artikel
41 Evidence that N2O is a stronger oxidizing agent than O2 for both Ta2O5 and bare Si below 1000°C and temperature for minimum low-K interfacial oxide for high-K dielectric on Si Lau, W.S.
2007
100-101 2-3 p. 429-433
5 p.
artikel
42 Examination of degradation mechanism due to negative bias temperature stress from a perspective of hole energy for accurate lifetime prediction Watanabe, Kazufumi
2007
100-101 2-3 p. 409-418
10 p.
artikel
43 Excess noise as an indicator of digital integrated circuit reliability Jones, B.K.
1991
100-101 2-3 p. 351-361
11 p.
artikel
44 Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices Khatir, Z.
2007
100-101 2-3 p. 422-428
7 p.
artikel
45 Fatigue analysis of miniaturized lead-free solder contacts based on a novel test concept Roellig, Mike
2007
100-101 2-3 p. 187-195
9 p.
artikel
46 FEM-based method to determine mechanical stress evolution during process flow in microelectronics, application to stress–voiding Orain, S.
2007
100-101 2-3 p. 295-301
7 p.
artikel
47 4937655 Film segment having integrated circuit chip bonded thereto and fixture therefor Miyazaki, Tatsuya
1991
100-101 2-3 p. ix-
1 p.
artikel
48 4920785 Hermeticity testing method and system Etess, Edward
1991
100-101 2-3 p. v-
1 p.
artikel
49 Influence of substrate thickness on thermal impedance of microelectronic structures Vermeersch, B.
2007
100-101 2-3 p. 437-443
7 p.
artikel
50 Inkjettable conductive adhesive for use in microelectronics and microsystems technology Kolbe, Jana
2007
100-101 2-3 p. 331-334
4 p.
artikel
51 4918377 Integrated circuit reliability testing Buehler, MartinG
1991
100-101 2-3 p. iv-
1 p.
artikel
52 4918379 Integrated monolithic circuit having a test bus Jongepier, Abraham
1991
100-101 2-3 p. iv-
1 p.
artikel
53 4937659 Interconnection system for integrated circuit chips Chall, Louis
1991
100-101 2-3 p. ix-x
nvt p.
artikel
54 4918335 Interconnection system for integrated circuit chips Chall, LouisE
1991
100-101 2-3 p. iii-iv
nvt p.
artikel
55 Investigation of environmental reliability of optical polymer waveguides embedded on printed circuit boards Immonen, Marika P.
2007
100-101 2-3 p. 363-371
9 p.
artikel
56 Investigations of the influence of dicing techniques on the strength properties of thin silicon Schoenfelder, Stephan
2007
100-101 2-3 p. 168-178
11 p.
artikel
57 Isotropic conductive adhesives: Future trends, possibilities and risks Morris, James E.
2007
100-101 2-3 p. 328-330
3 p.
artikel
58 4920445 Junction-breakdown protection semiconductor device Jun, DongSoo
1991
100-101 2-3 p. v-
1 p.
artikel
59 4949157 Large scale integrated circuit Minami, Eiichi
1991
100-101 2-3 p. xi-
1 p.
artikel
60 4937475 Laser programmable integrated circuit Matthew Rhodes, F
1991
100-101 2-3 p. ix-
1 p.
artikel
61 Local area network implementation of petri net reachability analysis Anneberg, L.
1991
100-101 2-3 p. 491-499
9 p.
artikel
62 Low-distortion 4th order programmable Butterworth filter Teresa Sanz, M.
2007
100-101 2-3 p. 471-476
6 p.
artikel
63 Low voltage stress induced leakage current and time to breakdown in ultra-thin (1.2–2.3nm) oxides Petit, C.
2007
100-101 2-3 p. 401-408
8 p.
artikel
64 4930439 Mask-repairing device Sato, Mitsuyoshi
1991
100-101 2-3 p. vii-
1 p.
artikel
65 4927505 Metallization scheme providing adhesion and barrier properties Sharma, RavinderK
1991
100-101 2-3 p. vi-
1 p.
artikel
66 4937826 Method and apparatus for sensing defects in integrated circuit elements Gheewala, TusharR
1991
100-101 2-3 p. x-
1 p.
artikel
67 4947105 Method and circuit for testing integrated circuit modules Unger, Bernhard
1991
100-101 2-3 p. x-
1 p.
artikel
68 4937203 Method and configuration for testing electronic circuits and integrated circuit chips using a removable overlay layer Eichelberger, CharlesW
1991
100-101 2-3 p. ix-
1 p.
artikel
69 4918385 Method and process for testing the reliability of integrated circuit (IC) chipsand novel IC circuitry for accomplishing same Shreeve, RobertW
1991
100-101 2-3 p. iv-v
nvt p.
artikel
70 4917466 Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby Nakamura, Akio
1991
100-101 2-3 p. iii-
1 p.
artikel
71 4933860 Method for fabricating a radio frequency integrated circuit and product formed thereby Liu, LouisC
1991
100-101 2-3 p. viii-
1 p.
artikel
72 4935378 Method for manufacturing a semiconductor device having more than two conductive layers Mori, Seiichi
1991
100-101 2-3 p. viii-
1 p.
artikel
73 4933042 Method for packaging integrated circuit chips employing a polymer film overlay layer Eichelberger, CharlesW
1991
100-101 2-3 p. viii-
1 p.
artikel
74 4924589 Method of making and testing an integrated circuit Leedy, GlennJ
1991
100-101 2-3 p. vi-
1 p.
artikel
75 4952272 Method of manufacturing probing head for testing equipment of semiconductor large scale integrated circuits Okino, Hironobu
1991
100-101 2-3 p. xiii-
1 p.
artikel
76 4912052 Method of testing semiconductor elements Miyoshi, Motosuke
1991
100-101 2-3 p. ii-
1 p.
artikel
77 Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques Gonda, V.
2007
100-101 2-3 p. 248-251
4 p.
artikel
78 4930101 Microprocessor controlled meter package for a printer Wong, YuenW
1991
100-101 2-3 p. vii-
1 p.
artikel
79 Monte Carlo simulation for improving electromigration lifetime by balancing temperature and structural gradients Gui, X.
1991
100-101 2-3 p. 389-400
12 p.
artikel
80 Multicriteria optimization for combined reliability and redundancy allocation in systems employing mixed redundancies Misra, Krishna B.
1991
100-101 2-3 p. 323-335
13 p.
artikel
81 4912399 Multiple lead probe for integrated circuits in wafer form Greub, HansJ
1991
100-101 2-3 p. ii-iii
nvt p.
artikel
82 New definitions of basic R&M terms Badenius, Duncan
1991
100-101 2-3 p. 525-535
11 p.
artikel
83 Novel shear tools for viscoelastic characterization of packaging polymers van’t Hof, C.
2007
100-101 2-3 p. 240-247
8 p.
artikel
84 Numerical approach to characterization of thermally conductive adhesives Fałat, Tomasz
2007
100-101 2-3 p. 342-346
5 p.
artikel
85 Numerical modeling of warpage induced in QFN array molding process Yang, D.G.
2007
100-101 2-3 p. 310-318
9 p.
artikel
86 On multivariate generalized logistic distribution Ragab, Aisha
1991
100-101 2-3 p. 511-519
9 p.
artikel
87 On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections de Vries, J.W.C.
2007
100-101 2-3 p. 444-449
6 p.
artikel
88 On the effect of power-line disturbances on microcomputer performance Roda, Valentin Obac
1991
100-101 2-3 p. 229-235
7 p.
artikel
89 4952057 Optical fiber backscatter signature generator (OFBSG) Kamikawa, Neil
1991
100-101 2-3 p. xii-xiii
nvt p.
artikel
90 Optimal replacement of a system with imperfect repair Makiš, Viliam
1991
100-101 2-3 p. 381-388
8 p.
artikel
91 Optimization of test parallelism with limited hardware overhead Feng, Sheng
1991
100-101 2-3 p. 271-276
6 p.
artikel
92 Optimizing the thermalsonic bonding process for thick film hybrid IC by the Taguchi Method Yann-Chyn, Jeng
1991
100-101 2-3 p. 501-510
10 p.
artikel
93 Organic thin film transistors with HfO2 high-k gate dielectric grown by anodic oxidation or deposited by sol–gel Tardy, J.
2007
100-101 2-3 p. 372-377
6 p.
artikel
94 Performance trends of Si-based RF transistors Schwierz, F.
2007
100-101 2-3 p. 384-390
7 p.
artikel
95 Physicochemical investigations and nonstandard electrical measurements of inks and thick films—Bibliography Dziedzic, Andrzej
1991
100-101 2-3 p. 537-548
12 p.
artikel
96 Polytronic 2005 Dziedzic, Andrzej
2007
100-101 2-3 p. 327-
1 p.
artikel
97 Pre-emptive repeat priority repairs and failure of non-failed component during system failure of a complex system Singh, I.P.
1991
100-101 2-3 p. 261-264
4 p.
artikel
98 Problems of PCB microvias filling by conductive paste Kisiel, Ryszard
2007
100-101 2-3 p. 335-341
7 p.
artikel
99 4945302 Process and a circuit board for performing tests during burn-in of integrated semi-conductor circuits Janum, ViggoK
1991
100-101 2-3 p. x-
1 p.
artikel
100 4950498 Process for repairing pattern film Kaito, Takashi
1991
100-101 2-3 p. xi-xii
nvt p.
artikel
101 4914814 Process of fabricating a circuit package Behun, JohnR
1991
100-101 2-3 p. iii-
1 p.
artikel
102 Regression models for estimating survival of patients with non-Hodgkin's Lymphoma Alidrisi, Mustafa
1991
100-101 2-3 p. 473-480
8 p.
artikel
103 Reliability analysis of a human operator under several levels of stress Who Kee Chung,
1991
100-101 2-3 p. 367-370
4 p.
artikel
104 Reliability analysis of a non-identical unit parallel system with common-cause failures Dhillon, B.S.
1991
100-101 2-3 p. 429-441
13 p.
artikel
105 Reliability analysis of a series repairable system with multiple failures Chung, Who Kee
1991
100-101 2-3 p. 371-373
3 p.
artikel
106 Reliability analysis of a series system with repair Who Kee Chung,
1991
100-101 2-3 p. 363-365
3 p.
artikel
107 Reliability analysis of a system with a human operator and subject to two failure modes Kumar, Ashok
1991
100-101 2-3 p. 277-283
7 p.
artikel
108 Reliability assessment of computer systems design Bastos Martini, M.R.
1991
100-101 2-3 p. 237-244
8 p.
artikel
109 Reliability assessment of the metallized film capacitors from degradation data Zhao, Jianyin
2007
100-101 2-3 p. 434-436
3 p.
artikel
110 Reliability measures for fail safe computer-based systems Zhou, Zhibang
1991
100-101 2-3 p. 401-406
6 p.
artikel
111 Reliability model of cold standby systems with built-in-test Shao, Jiajun
1991
100-101 2-3 p. 443-451
9 p.
artikel
112 Reliability of SnPb and Pb-free flip–chips under different test conditions Spraul, M.
2007
100-101 2-3 p. 252-258
7 p.
artikel
113 Reliability study of ultrathin oxide films subject to irradiation-then-stress treatment using conductive atomic force microscopy Wu, You-Lin
2007
100-101 2-3 p. 419-421
3 p.
artikel
114 Repair body cost minimization with unreliable Markovian restoration Martynenko, Oleg
1991
100-101 2-3 p. 343-349
7 p.
artikel
115 4951122 Resin-encapsulated semiconductor device Tsubosaki, Kunihiro
1991
100-101 2-3 p. xii-
1 p.
artikel
116 Revised test that a distribution is new better than used Green, Jack R.
1991
100-101 2-3 p. 521-524
4 p.
artikel
117 4908226 Selective area nucleation and growth method for metal chemical vapor deposition using focused ion beams Kubena, Randall
1991
100-101 2-3 p. i-ii
nvt p.
artikel
118 4908690 Semiconductor integrated circuit device with high reliability wiring layers Hata, Masayuk
1991
100-101 2-3 p. ii-
1 p.
artikel
119 4910735 Semiconductor integrated circuit with self-testing Yamashita, Koichi
1991
100-101 2-3 p. ii-
1 p.
artikel
120 4951253 Semiconductor memory system Sahara, Hirosh
1991
100-101 2-3 p. xii-
1 p.
artikel
121 Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology Lee, Chang-Chun
2007
100-101 2-3 p. 196-204
9 p.
artikel
122 Stochastic analysis of a two-unit deteriorating standby system with two switching devices Goel, L.R.
1991
100-101 2-3 p. 213-218
6 p.
artikel
123 4929081 System for detecting defects in a regularly arranged pattern such as an integrated circuit or the like Yamamoto, Yoko
1991
100-101 2-3 p. vi-vii
nvt p.
artikel
124 4922134 Testable redundancy decoder of an integrated semiconductor memory Hoffmann, Kurt
1991
100-101 2-3 p. v-vi
nvt p.
artikel
125 4918691 Testing of integrated circuit modules Chall, Louis
1991
100-101 2-3 p. v-
1 p.
artikel
126 4950980 Test socket for electronic device packages Pfaff, WayneK
1991
100-101 2-3 p. xii-
1 p.
artikel
127 Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages Vandevelde, Bart
2007
100-101 2-3 p. 259-265
7 p.
artikel
128 Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems Wymysłowski, Artur
2007
100-101 2-3 p. 159-160
2 p.
artikel
129 Thermal simulation of UV laser ablation of polyimide Gordon, Péter
2007
100-101 2-3 p. 347-353
7 p.
artikel
130 The Sherif-Dear simple (SDS) Theorem in number theory Sherif, Yosef S.
1991
100-101 2-3 p. 465-471
7 p.
artikel
131 Three-server bulk service queue with service interruptions and exponential repairs Singh, I.P.
1991
100-101 2-3 p. 257-259
3 p.
artikel
132 TMR neural simulation Goben, C.A.
1991
100-101 2-3 p. 375-380
6 p.
artikel
133 Virtual qualification of moisture induced failures of advanced packages van Gils, M.A.J.
2007
100-101 2-3 p. 273-279
7 p.
artikel
                             133 gevonden resultaten
 
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