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                             2875 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A bibliography on silicon dioxide films 1977
100-101 2 p. 116-
1 p.
artikel
2 A 2-bit highly scalable nonvolatile memory cell with two electrically isolated charge trapping sites Man, Tsz Yin
2005
100-101 2 p. 349-354
6 p.
artikel
3 A case study of statistical process control on the prime process using PLASMASK 302U Arshak, K.I.
1995
100-101 2 p. 209-224
16 p.
artikel
4 Accelerated ageing of IMPATT diodes Sinnadurai, F.N
1981
100-101 2 p. 209-219
11 p.
artikel
5 Accelerated electrical testing for improved device reliability 1978
100-101 2 p. 253-
1 p.
artikel
6 Accelerated hot electron effects in DRAMs Yuliasto, Tony T.
1994
100-101 2 p. 197-200
4 p.
artikel
7 Accelerated testing for failures of tantalum capacitors Virkki, J.
2010
100-101 2 p. 217-219
3 p.
artikel
8 Accelerated testing of class A CMOS integrated circuits 1978
100-101 2 p. 252-
1 p.
artikel
9 Accelerated test procedures for semiconductor components 1978
100-101 2 p. 252-
1 p.
artikel
10 Acceleration factor for ageing measurement of dye solar cells Ciammaruchi, Laura
2013
100-101 2 p. 279-281
3 p.
artikel
11 Accurate measurement of the work function of electron-hole drops in germanium 1974
100-101 2 p. 81-
1 p.
artikel
12 AC electrical properties of magnesium and aluminium fluoride thin films 1978
100-101 2 p. 264-
1 p.
artikel
13 A chaos based revitalization of large reliability knowledge bases Dohnal, M.
1993
100-101 2 p. 259-265
7 p.
artikel
14 A characteristic analysis of high-speed integrated circuit chip based on laser probe Xiaojian, Tian
2000
100-101 2 p. 329-332
4 p.
artikel
15 Achieving maintainability by random fault injection 1983
100-101 2 p. 396-
1 p.
artikel
16 A closed loop system for reliability improvement 1987
100-101 2 p. 382-
1 p.
artikel
17 A comparative glossary of semiconductor devices 1968
100-101 2 p. 163-
1 p.
artikel
18 A comparison of early stage hot carrier degradation behaviour in 5 and 3 V sub-micron low doped drain metal oxide semiconductor field effect transistors De Souza, M.M.
2001
100-101 2 p. 169-177
9 p.
artikel
19 A comparison of GaAs and Si processing technology 1983
100-101 2 p. 400-
1 p.
artikel
20 A comparison of MOS processes for VLSI. Part I 1985
100-101 2 p. 395-
1 p.
artikel
21 A comparison of semiconductor devices for high-speed logic 1983
100-101 2 p. 400-
1 p.
artikel
22 A comparison of silver halide systems as applied to today's advanced semiconductor requirements 1983
100-101 2 p. 401-
1 p.
artikel
23 A comparison of some optical microscope measurements of photomask linewidths 1978
100-101 2 p. 255-
1 p.
artikel
24 A comparison of the strength of alumina substrates for different separation techniques 1973
100-101 2 p. 93-
1 p.
artikel
25 A compatible technique for the formation of thin tantalum film resistors on silicon integrated circuits 1967
100-101 2 p. 200-201
2 p.
artikel
26 A complex two-unit parallel system Subramanian, R
1981
100-101 2 p. 273-275
3 p.
artikel
27 A complex two-unit system with random breakdown of repair facility Gururajan, M.
1995
100-101 2 p. 299-302
4 p.
artikel
28 A computer-aided technique for fault detection in combinational circuits Rai, Suresh
1987
100-101 2 p. 263-265
3 p.
artikel
29 A computer algorithm for the analysis of maintained standby redundant systems Kumar, Ashok
1981
100-101 2 p. 175-182
8 p.
artikel
30 A computerized approach to simulating system effectiveness 1972
100-101 2 p. 114-
1 p.
artikel
31 A computer model for integrated circuit transistors including substrate interactions 1969
100-101 2 p. 150-151
2 p.
artikel
32 A conduction-cooled module for high-performance LSI devices 1983
100-101 2 p. 402-
1 p.
artikel
33 A consideration on design of thin-film integrated circuits 1971
100-101 2 p. 131-
1 p.
artikel
34 Acquisition of reliability statements 1976
100-101 2 p. 101-
1 p.
artikel
35 A critical evaluation of tantalum nitride thin film resistors 1965
100-101 2 p. 229-
1 p.
artikel
36 Active and passive components for attachment to thick film circuits 1969
100-101 2 p. 155-
1 p.
artikel
37 Active circuit trimming with abrasives 1972
100-101 2 p. 117-
1 p.
artikel
38 Active filters get more of the action 1973
100-101 2 p. 91-
1 p.
artikel
39 Active filters: part 8. Positive results from negative feedback 1970
100-101 2 p. 120-
1 p.
artikel
40 A data base management (DBMP) program for integrated logistics support (ILS) Christensen, A.
1975
100-101 2 p. 73-89
17 p.
artikel
41 Address generators for linear systolic array Stojčev, M.K.
2010
100-101 2 p. 292-303
12 p.
artikel
42 A decomposition technique for the overall reliability evaluation of large computer communication networks Mandaltsis, D.
1987
100-101 2 p. 299-312
14 p.
artikel
43 ADEE grows with automation trend 1987
100-101 2 p. 383-
1 p.
artikel
44 A depletion load self-aligned technology 1974
100-101 2 p. 79-
1 p.
artikel
45 4612805 Adhesion characterization test site Bruce, JamesA
1987
100-101 2 p. 397-
1 p.
artikel
46 Adhesion of thin film circuits 1981
100-101 2 p. 287-
1 p.
artikel
47 A digital thin-film deposition rate meter 1969
100-101 2 p. 153-154
2 p.
artikel
48 Adjusting of tantalum thin-film resistors 1972
100-101 2 p. 123-
1 p.
artikel
49 Admissibility of a conditionally specified test procedure for time censored life data Johri, S.K.
1993
100-101 2 p. 271-272
2 p.
artikel
50 Adsorption effects on ESR and conductance of rf sputtered a-Si films 1981
100-101 2 p. 288-
1 p.
artikel
51 A dual-gate GaAs FET RF power limiter 1978
100-101 2 p. 257-
1 p.
artikel
52 Advanced modeling of silicon oxidation Wolters, D.R
1998
100-101 2 p. 259-264
6 p.
artikel
53 Advanced rail clamp networks for ESD protection Stockinger, Michael
2005
100-101 2 p. 211-222
12 p.
artikel
54 Advanced thin-film capacitor processes 1967
100-101 2 p. 204-
1 p.
artikel
55 Advance materials in microminiaturization and optical communication 1967
100-101 2 p. 195-
1 p.
artikel
56 Advances in dichlorosilane epitaxial technology 1973
100-101 2 p. 98-
1 p.
artikel
57 Advances in diffusion furnaces for processing large diameter wafers 1969
100-101 2 p. 150-
1 p.
artikel
58 Advances in ESD protection for ICs Vassilev, Vesselin
2013
100-101 2 p. 183-
1 p.
artikel
59 Advances in GaAs ICs highlighted 1983
100-101 2 p. 398-
1 p.
artikel
60 Advances in III–V and II–VI semiconductor compounds 1965
100-101 2 p. 227-
1 p.
artikel
61 Advances in ion implantation production equipment 1976
100-101 2 p. 110-
1 p.
artikel
62 Advances in microelectronics Stojadinović, N.D.
1984
100-101 2 p. 201-203
3 p.
artikel
63 Advances in microminiaturization 1963
100-101 2 p. 158-
1 p.
artikel
64 Advances in SiC power MOSFET technology Dimitrijev, Sima
2003
100-101 2 p. 225-233
9 p.
artikel
65 Advances in the drop-impact reliability of solder joints for mobile applications Wong, E.H.
2009
100-101 2 p. 139-149
11 p.
artikel
66 Advances in the thick-film compositions Hille-Dahl, W.A.
1968
100-101 2 p. 113-116
4 p.
artikel
67 Advances in VLSI plasma etching 1983
100-101 2 p. 399-
1 p.
artikel
68 Aerospace mechanical reliability practise 1983
100-101 2 p. 396-
1 p.
artikel
69 AES investigations of the interface between substrate and chromium films prepared by evaporation and ion plating 1978
100-101 2 p. 267-
1 p.
artikel
70 A fast method for redundancy allocation 1974
100-101 2 p. 77-
1 p.
artikel
71 A fault model for multivalued NMOS dynamic random access memories Venkatapathi Naidu, R.
1989
100-101 2 p. 137-143
7 p.
artikel
72 A first-order kinetics ageing model for the hot-carrier stress of high-voltage MOSFETs Alagi, F.
2011
100-101 2 p. 321-325
5 p.
artikel
73 Ageing characteristics of field effect thin film active devices 1965
100-101 2 p. 230-
1 p.
artikel
74 Ageing defect detection on IGBT power modules by artificial training methods based on pattern recognition Oukaour, A.
2011
100-101 2 p. 386-391
6 p.
artikel
75 Ageing tests on gold layers and bonded contacts 1978
100-101 2 p. 264-
1 p.
artikel
76 A generalized model for the lifetime of microelectronic components, applied to storage conditions Wise, Loren J
2001
100-101 2 p. 317-322
6 p.
artikel
77 Age replacement with leadtime 1977
100-101 2 p. 114-
1 p.
artikel
78 Aging degradation of a Gunn Diode due to induced dislocations 1976
100-101 2 p. 101-
1 p.
artikel
79 Aging degradation of Ni and NiCr-Ni thin film conductor systems 1983
100-101 2 p. 405-
1 p.
artikel
80 A graphical method for optimal reliability allocation Agarwala, R.A.
1983
100-101 2 p. 373-377
5 p.
artikel
81 A gyrator suitable for monolithic, bipolar construction 1971
100-101 2 p. 127-
1 p.
artikel
82 A health indicator method for degradation detection of electronic products Kumar, Sachin
2012
100-101 2 p. 439-445
7 p.
artikel
83 A heuristic method for optimum redundancy allocation in non-coherent systems 1985
100-101 2 p. 391-
1 p.
artikel
84 A hierarchical defect repair approach for hybrid nano/CMOS memory reliability enhancement Habibi, Mehdi
2014
100-101 2 p. 475-484
artikel
85 A high-performance lateral geometry transistor for complementary integrated circuits 1968
100-101 2 p. 172-
1 p.
artikel
86 A high precision alignment device 1969
100-101 2 p. 159-
1 p.
artikel
87 A high voltage, high performance thick film resistor system 1978
100-101 2 p. 265-
1 p.
artikel
88 A history of microelectronics development at the Royal Radar Establishment Dummer, G.W.A.
1965
100-101 2 p. 193-196
4 p.
artikel
89 A hybrid approach to integrated circuits 1965
100-101 2 p. 225-
1 p.
artikel
90 Airborne particle monitoring approaches 0.1 μm 1987
100-101 2 p. 387-
1 p.
artikel
91 Airborne-particle monitoring know-how 1983
100-101 2 p. 400-
1 p.
artikel
92 Aircraft maintenance costs reduced by Jet-engine vibration monitor 1964
100-101 2 p. 139-
1 p.
artikel
93 Air-gap isolated microcircuits-beam-lead devices 1970
100-101 2 p. 117-
1 p.
artikel
94 A Kolmogorov - Smirnov goodness-of-fit test for the two-parameter weibull distribution when the parameters are estimated from the data Parsons, F.G
1982
100-101 2 p. 163-167
5 p.
artikel
95 A k-out-of-N:G redundant system with dependent failure rates and common-cause failures Who Kee Chung,
1988
100-101 2 p. 201-203
3 p.
artikel
96 A laboratory for the development of micromodules 1964
100-101 2 p. 142-
1 p.
artikel
97 AlGaN/GaN HEMT device reliability and degradation evolution: Importance of diffusion processes Kuball, Martin
2011
100-101 2 p. 195-200
6 p.
artikel
98 AlGaN/GaN High Electron Mobility Transistor degradation under on- and off-state stress Douglas, E.A.
2011
100-101 2 p. 207-211
5 p.
artikel
99 Algorithm for reliability evaluation of a reducible network 1977
100-101 2 p. 114-
1 p.
artikel
100 Algorithms for solving reliability models of systems exposed to a two-state environment 1976
100-101 2 p. 103-
1 p.
artikel
101 A life cycle costing methodology for the assessment of process heat generation by solar energy 1985
100-101 2 p. 389-
1 p.
artikel
102 All-digital thermal distribution measurement on field programmable gate array using ring oscillators Yue, Yuan
2015
100-101 2 p. 396-401
6 p.
artikel
103 Allowable power in NiCr film resistors 1983
100-101 2 p. 405-
1 p.
artikel
104 A low-frequency noise model for advanced gate-stack MOSFETs Çelik-Butler, Zeynep
2009
100-101 2 p. 103-112
10 p.
artikel
105 A low-power circuit block for digital telephone exchanges Kasperkovitz, D.
1976
100-101 2 p. 163-170
8 p.
artikel
106 Al surface morphology effect on flip-chip solder bump shear strength Wai Ching Yau, Esther
2004
100-101 2 p. 323-331
9 p.
artikel
107 Alumina substrates for thick-film circuits Waterfield, B.C.
1968
100-101 2 p. 117-119
3 p.
artikel
108 Aluminum interconnections and beam leads on polyimide-coated copper substrates 1973
100-101 2 p. 94-
1 p.
artikel
109 A major step in power hybrids 1972
100-101 2 p. 118-
1 p.
artikel
110 A memory-effective fast algorithm for computing the reliability of complex systems/networks Rueger, W.J.
1987
100-101 2 p. 273-277
5 p.
artikel
111 A method for computing complex system reliability 1973
100-101 2 p. 90-
1 p.
artikel
112 A method for testing and bonding beam-lead devices 1971
100-101 2 p. 125-
1 p.
artikel
113 A method of measuring thicknesses and doping profiles of homoepitaxial thin (from 0.1 μm on) films of silicon and gallium arsenide 1976
100-101 2 p. 106-107
2 p.
artikel
114 A method of redundancy allocation 1974
100-101 2 p. 77-
1 p.
artikel
115 A method of studying thermocompression bonding damage in GaAs using the SEM 1976
100-101 2 p. 105-
1 p.
artikel
116 A method to solve fuzzy reliability optimization problem Utkin, Lev V.
1995
100-101 2 p. 171-181
11 p.
artikel
117 A microelectronic laboratory for universities 1967
100-101 2 p. 197-
1 p.
artikel
118 A minimal capacitor cascade synthesis for integrated circuits Newcomb, R.W.
1967
100-101 2 p. 113-124
12 p.
artikel
119 A mixed poisson model and its application to attribute testing data Xie, W.
1996
100-101 2 p. 133-140
8 p.
artikel
120 A model for doped-oxide-source diffusion with a chemical reaction at the silicon-silicon dioxide interface 1977
100-101 2 p. 119-
1 p.
artikel
121 A model for residual life prediction based on Brownian motion with an adaptive drift Wang, Wenbin
2011
100-101 2 p. 285-293
9 p.
artikel
122 A modified ion source for semiconductor implantation purposes 1987
100-101 2 p. 391-
1 p.
artikel
123 A Monolithic image sensor for a reading aid for the blind 1971
100-101 2 p. 126-127
2 p.
artikel
124 A monolithic integrated Schottky diode for microwave mixers 1976
100-101 2 p. 105-
1 p.
artikel
125 A monolithic integrated sound IF amplifier for TV sets 1969
100-101 2 p. 157-
1 p.
artikel
126 A Monte-Carlo technique for estimating lower confidence limits on system reliability using pass-fail data 1985
100-101 2 p. 392-
1 p.
artikel
127 Amorphous GaP produced by ion implantation 1976
100-101 2 p. 110-111
2 p.
artikel
128 A MOSFET power supply clamp with feedback enhanced triggering for ESD protection in advanced CMOS technologies Smith, Jeremy C.
2005
100-101 2 p. 201-210
10 p.
artikel
129 A multi-component standby system subject to inspection and truncated normal failure time distribution Gupta, Rakesh
1993
100-101 2 p. 127-131
5 p.
artikel
130 A multi-layer thick film interconnection system 1969
100-101 2 p. 155-
1 p.
artikel
131 A multistate system with two repair distributions Goel, L.R.
1983
100-101 2 p. 337-340
4 p.
artikel
132 An accurate model for soft error rate estimation considering dynamic voltage and frequency scaling effects Firouzi, Farshad
2011
100-101 2 p. 460-467
8 p.
artikel
133 An age replacement policy with increasing minimal repair cost Yun, Won Young
1989
100-101 2 p. 153-157
5 p.
artikel
134 An algebraic technique for reliability evaluation 1981
100-101 2 p. 278-
1 p.
artikel
135 An algorithm for automatic prober movement control for better coverage of test sites on a wafer during measurement Gupta, Shobha
1987
100-101 2 p. 281-282
2 p.
artikel
136 An algorithm for fault-tree probabilities using the factoring theorem Page, Lavon B.
1988
100-101 2 p. 273-286
14 p.
artikel
137 An algorithm for obtaining simplified prime implicant sets in fault-tree and event-tree analysis 1985
100-101 2 p. 391-
1 p.
artikel
138 An all-bipolar image sensor 1973
100-101 2 p. 95-
1 p.
artikel
139 Analog-Digital and Digital-Analog conversion G.W.A.D.,
1983
100-101 2 p. 393-
1 p.
artikel
140 Analog output chips shrink a-d conversion software 1978
100-101 2 p. 258-
1 p.
artikel
141 Analogue multiplication with the space-charge-limited surface-channel triode 1965
100-101 2 p. 231-
1 p.
artikel
142 An alternative fault-tree algebra 1981
100-101 2 p. 280-
1 p.
artikel
143 Analysis and synthesis of logical structures on a reliability criterion. A method of synthesis special to sequential logics 1966
100-101 2 p. 180-
1 p.
artikel
144 Analysis of a repairable redundant system with delayed replacement Agarwal, Manju
1981
100-101 2 p. 165-171
7 p.
artikel
145 Analysis of a standby system with dependent repair time and slow switching device Goel, L.R.
1994
100-101 2 p. 383-386
4 p.
artikel
146 Analysis of a two-dissimilar unit cold standby redundant system subject to inspection and random change in units Mokaddis, G.S.
1997
100-101 2 p. 329-334
6 p.
artikel
147 Analysis of a two-unit hot standby system with three modes 1985
100-101 2 p. 390-
1 p.
artikel
148 Analysis of a two-unit parallel redundancy with an imperfect switch Srinivasan, S.K.
1983
100-101 2 p. 309-318
10 p.
artikel
149 Analysis of a two-unit standby system with three modes and imperfect switching device 1985
100-101 2 p. 391-
1 p.
artikel
150 Analysis of a 2-unit (dissimilar) repairable system subject to slow switch Gopalan, M.N.
1985
100-101 2 p. 261-265
5 p.
artikel
151 Analysis of colorimetric system under foggy, thermal and electrical conditions with spice/vhdl-ams Charlot, J.-J.
2000
100-101 2 p. 347-353
7 p.
artikel
152 Analysis of faults located in a circular waveguide two-way pulse attenuation measurements 1976
100-101 2 p. 101-
1 p.
artikel
153 Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging Khor, C.Y.
2013
100-101 2 p. 334-347
14 p.
artikel
154 Analysis of Fowler–Nordheim injection in NO nitrided gate oxide grown on n-type 4H–SiC Li, Hui-Feng
2000
100-101 2 p. 283-286
4 p.
artikel
155 Analysis of N2 plasma to characterize plasma etching systems 1983
100-101 2 p. 398-
1 p.
artikel
156 Analysis of posterior availability distributions of series and parallel systems Sharma, K.K.
1994
100-101 2 p. 379-381
3 p.
artikel
157 Analysis of punch-through breakdown in bulk silicon RF power LDMOS transistors Cortés, I.
2008
100-101 2 p. 173-180
8 p.
artikel
158 Analysis of random failures 1963
100-101 2 p. 156-
1 p.
artikel
159 Analysis of Rb and Cs implantations in silicon by channeling and Hall effect measurements 1971
100-101 2 p. 129-
1 p.
artikel
160 Analysis of space and energy distribution of stress-induced oxide traps Spinelli, A.S.
1999
100-101 2 p. 215-219
5 p.
artikel
161 Analysis of superposition errors in wafer fabrication Matsuzawa, Toshiharu
1977
100-101 2 p. 173-176
4 p.
artikel
162 Analysis of the gate capacitance measurement technique and its application for the evaluation of hot-carrier degradation in submicrometer MOSFETs Hsu, C.T
2001
100-101 2 p. 201-209
9 p.
artikel
163 Analysis of the gate current as a suitable indicator for FET degradation under nonlinear dynamic regime Raffo, Antonio
2011
100-101 2 p. 235-239
5 p.
artikel
164 Analysis of the impurity atom distribution near the diffusion mask for a planar p-n junction 1966
100-101 2 p. 185-
1 p.
artikel
165 Analysis of the noise characteristics of current-feedback operational amplifier Palumbo, Gaetano
2000
100-101 2 p. 321-327
7 p.
artikel
166 Analysis of thermal stresses in metal interconnects with multilevel structures Kilijanski, M.S.
2002
100-101 2 p. 259-264
6 p.
artikel
167 Analysis of two-unit redundant system under partial failure and two types of repairs 1985
100-101 2 p. 388-
1 p.
artikel
168 Analytical determination of resistance of diffused resistors in solid state circuits 1965
100-101 2 p. 225-
1 p.
artikel
169 Analytical solution of the state-dependent Erlangian queue: M/E j /1/N with balking Al-Seedy, R.O.
1996
100-101 2 p. 203-206
4 p.
artikel
170 Analytic study of a stand-by redundant equipment with switching and shelf life failures 1974
100-101 2 p. 77-
1 p.
artikel
171 Analyzing high via resistance 1985
100-101 2 p. 385-
1 p.
artikel
172 An analog median filter with fuzzy adaptation Lemus-López, Javier
2003
100-101 2 p. 203-207
5 p.
artikel
173 An application of DMADV methodology for increasing the yield rate of surveillance cameras Huang, Chiao-Tzu
2010
100-101 2 p. 266-272
7 p.
artikel
174 An approach for evaluating epoxy adhesives for use in hybrid microelectronic assembly 1976
100-101 2 p. 104-
1 p.
artikel
175 An approach to high speed laser trimming of thick film resistors 1981
100-101 2 p. 290-
1 p.
artikel
176 An automatic test set for measuring dopant concentration profiles in epitaxial films 1969
100-101 2 p. 151-
1 p.
artikel
177 An availability prediction method for computer systems 1987
100-101 2 p. 381-382
2 p.
artikel
178 An educational thick film microcircuitry facility 1971
100-101 2 p. 123-
1 p.
artikel
179 An efficient solution procedure for transient Markov processes Eddaifi, D.
1988
100-101 2 p. 235-241
7 p.
artikel
180 An efficient two-dimensional placement algorithm for the master-slice LSI layout 1983
100-101 2 p. 400-
1 p.
artikel
181 An electrically alterable ROM—and it doesn't use nitride 1977
100-101 2 p. 116-
1 p.
artikel
182 An Electronic Design Special Report. MOS on the upswing 1970
100-101 2 p. 116-
1 p.
artikel
183 An Electronic Design special report—Testing 1969
100-101 2 p. 148-
1 p.
artikel
184 An empirical Bayes approach to reliability 1973
100-101 2 p. 85-
1 p.
artikel
185 An engineered package for microminiature elements 1966
100-101 2 p. 180-
1 p.
artikel
186 An engineer's view of the assurance and control of software quality 1983
100-101 2 p. 395-
1 p.
artikel
187 An evaporation cryostat for electrical and optical measurements on ultra-thin metal film under ultra high vacuum conditions 1978
100-101 2 p. 262-
1 p.
artikel
188 A new a.c. sputtering technique for the deposition of thin films 1973
100-101 2 p. 99-
1 p.
artikel
189 A new approach to the calculation of tight-binding surface density of states in thin films 1978
100-101 2 p. 263-
1 p.
artikel
190 A new approach to the topological design of hybrid circuits 1981
100-101 2 p. 289-
1 p.
artikel
191 A new approach to transistor reliability prediction 1964
100-101 2 p. 140-
1 p.
artikel
192 A new bad data detection and identification algorithm 1981
100-101 2 p. 279-
1 p.
artikel
193 A new band-reject filter configuration of three-layer thin-film exponential R-C-KR micro-system Ahmed, Kamal U
1981
100-101 2 p. 241-242
2 p.
artikel
194 A new crossed-film cryotron structure with superimposed controls 1964
100-101 2 p. 146-
1 p.
artikel
195 A new drain current model for short-channel MOSFETs Abbasian, Sadegh
2003
100-101 2 p. 333-338
6 p.
artikel
196 A new frequency independent attenuator in distributed multilayer thin film microsystem Singh, H.R.
1983
100-101 2 p. 379-381
3 p.
artikel
197 A new generation of MOS/bipolar operational amplifiers 1977
100-101 2 p. 117-
1 p.
artikel
198 A new hardware-based fault-tolerant clock synchronization scheme for real-time multiprocessor systems Baek, Yunju
1994
100-101 2 p. 335-349
15 p.
artikel
199 A new high stability resistor system 1978
100-101 2 p. 265-266
2 p.
artikel
200 A new interpretation of the valence band density of states of amorphous group IV-semiconductors 1974
100-101 2 p. 82-
1 p.
artikel
201 A new look at microwave silicon technology 1970
100-101 2 p. 122-123
2 p.
artikel
202 A new method for evaluation of mis structure insulation films Beneš, O.
1971
100-101 2 p. 105-112
8 p.
artikel
203 A new method for fuzzy fault tree analysis Misra, Krishna B.
1989
100-101 2 p. 195-216
22 p.
artikel
204 A new method of bonding metals to thermoplastics 1963
100-101 2 p. 158-
1 p.
artikel
205 A new method of manufacturing multilayer circuit boards 1973
100-101 2 p. 96-
1 p.
artikel
206 A new method to extract diode parameters under the presence of parasitic series and shunt resistance Ranuárez, J.C
2000
100-101 2 p. 355-358
4 p.
artikel
207 A new multi-finger SCR-based structure for efficient on-chip ESD protection Azaı̈s, F.
2005
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208 A new on-chip test structure for real time fatigue analysis in polysilicon MEMS Langfelder, G.
2009
100-101 2 p. 120-126
7 p.
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209 A new partial bound enumeration technique for solving reliability redundancy optimization Jianping, Li
1997
100-101 2 p. 237-242
6 p.
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210 A new process for printing fine conductor lines and spaces on large area substrates 1981
100-101 2 p. 282-
1 p.
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211 A new production technique: ion milling 1981
100-101 2 p. 289-
1 p.
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212 A new scheme for device packaging 1987
100-101 2 p. 385-
1 p.
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213 A new thermocompression bonder 1968
100-101 2 p. 170-171
2 p.
artikel
214 A new thin film transmission line 1966
100-101 2 p. 186-
1 p.
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215 A new two-dimensional analytical subthreshold behavior model for short-channel tri-material gate-stack SOI MOSFET’s Chiang, Te-Kuang
2009
100-101 2 p. 113-119
7 p.
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216 An experimental method to analyse trapping centres in silicon at very low concentrations 1976
100-101 2 p. 108-
1 p.
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217 An experimental model of the microelectronic ultrasonic wire bonding mechanism 1973
100-101 2 p. 92-
1 p.
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218 An experimental verification of the electrostatic field gradient theory for diffused semiconductors 1972
100-101 2 p. 120-
1 p.
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219 An explicit form for system mean life 1978
100-101 2 p. 253-
1 p.
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220 An IC form, Hall-effect devices can take on many new applications 1972
100-101 2 p. 119-
1 p.
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221 An improved method of selecting network topology for optimal terminal reliability Jain, S.P.
1986
100-101 2 p. 255-259
5 p.
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222 An improved minimizing algorithm for the sum of disjoint products with the inversion of a single variable Liu, H.H.
1993
100-101 2 p. 221-238
18 p.
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223 An improved sputter-etching process 1973
100-101 2 p. 175-
1 p.
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224 An installed tape automated bonding unit 1981
100-101 2 p. 282-
1 p.
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225 An integrated circuit switch for auditory research 1971
100-101 2 p. 127-
1 p.
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226 An integrated FM receiver Kasperkovitz, D
1981
100-101 2 p. 183-189
7 p.
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227 An integrated 4GHz balanced transistor amplifier 1968
100-101 2 p. 171-
1 p.
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228 An interpretation of certain A.G.R.E.E. principles Siemaszko, Z.S.
1970
100-101 2 p. 167-176
10 p.
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229 An introduction to Cu electromigration Hau-Riege, Christine S.
2004
100-101 2 p. 195-205
11 p.
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230 An introduction to fault tree analysis with emphasis on failure rate evaluation Nieuwhof, G.W.E.
1975
100-101 2 p. 105-119
15 p.
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231 An introduction to mini and micro computers G.W.A.D,
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100-101 2 p. 314-315
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232 An introduction to printed circuit board technology G.W.A.D.,
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100-101 2 p. 383-
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233 An introduction to the Navy Manufacturing Technology Program for Computerized Thick-Film Printing 1981
100-101 2 p. 288-
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234 An introduction to thick film component technology G.W.A.D,
1982
100-101 2 p. 315-316
2 p.
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235 An investigation of flaws in complex CMOS devices by a scanning photoexcitation technique 1978
100-101 2 p. 251-
1 p.
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236 An investigation of lateral diffusion in silicon 1972
100-101 2 p. 119-
1 p.
artikel
237 An investigation of the mechanical behavior of conductive elastomer interconnects Xie, Jingsong
2001
100-101 2 p. 281-286
6 p.
artikel
238 Anisotropy in layers of anodic oxides of tantalum and titanium 1968
100-101 2 p. 167-
1 p.
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239 Anisotropy of hot electrons in high resistivity silicon—Preliminary results 1968
100-101 2 p. 166-
1 p.
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240 An iterative approach to VLSI circuit lifetime estimation Huang, Min
1993
100-101 2 p. 185-194
10 p.
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241 An M/M/1 ∞ queueing system with feedback Sharda,
1986
100-101 2 p. 261-264
4 p.
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242 An MOS quality and reliability program McKenna, R.
1971
100-101 2 p. 67-74
8 p.
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243 ANN based CMOS ASIC design for improved temperature-drift compensation of piezoresistive micro-machined high resolution pressure sensor Futane, N.P.
2010
100-101 2 p. 282-291
10 p.
artikel
244 Annealing of SiSiO2 interface states using Ar-ion-implant-damage-gettering 1981
100-101 2 p. 290-
1 p.
artikel
245 Announcements 1969
100-101 2 p. 161-167
7 p.
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246 An n unit system with spares Subramanian, R.
1989
100-101 2 p. 95-105
11 p.
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247 Anomalous forward characteristics of a metal-thin epitaxial silicon junction 1972
100-101 2 p. 122-
1 p.
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248 An on-chip sensor to measure and compensate static NBTI-induced degradation in analog circuits Askari, Syed
2013
100-101 2 p. 245-253
9 p.
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249 An optimising technique for a K-out-of-N system Ling, A.H.K.
1975
100-101 2 p. 217-222
6 p.
artikel
250 A note on the preservation of the NBUC class under formation of parallel systems with dissimilar components Cai, Jun
1997
100-101 2 p. 359-360
2 p.
artikel
251 A note on trap recombination in high voltage device structures Benda, Vitezslav
2005
100-101 2 p. 397-401
5 p.
artikel
252 Another self-aligning MOS process has interconnecting advantages 1972
100-101 2 p. 118-
1 p.
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253 A novel mechanical diced trench structure for warpage reduction in wafer level packaging process Zhu, Chunsheng
2015
100-101 2 p. 418-423
6 p.
artikel
254 A parallel algorithm evaluating the reliability of a system with known minimal cuts (paths) Malinowski, Jacek
1997
100-101 2 p. 255-265
11 p.
artikel
255 A parallel redundant complex system with two types of failure under preemptive-repeat repair discipline 1985
100-101 2 p. 389-
1 p.
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256 A percolation study of RTS noise amplitudes in nano-MOSFETs by Monte Carlo simulation Zhongfa, Ma
2010
100-101 2 p. 179-182
4 p.
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257 A percolative simulation of dielectric-like breakdown Pennetta, C
1998
100-101 2 p. 249-253
5 p.
artikel
258 A Petri net approach to enumerating all circuits of a graph 1985
100-101 2 p. 391-
1 p.
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259 A physical based model to predict performance degradation of FinFET accounting for interface state distribution effect due to hot carrier injection Ma, Chenyue
2011
100-101 2 p. 337-341
5 p.
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260 A physical large-signal model for GaN HEMTS including self-heating and trap-related dispersion Mari, D.
2011
100-101 2 p. 229-234
6 p.
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261 A physical model for the dependence of carrier lifetime on doping density in nondegenerate silicon 1983
100-101 2 p. 403-
1 p.
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262 A physical model on electron mobility in InGaAs nMOSFETs with stacked gate dielectric Huang, Y.
2015
100-101 2 p. 342-346
5 p.
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263 A potentiometer network module 1972
100-101 2 p. 122-
1 p.
artikel
264 4736108 Apparatus and method for testing coplanarity of semiconductor components Comstock, RobertL
1989
100-101 2 p. 288-
1 p.
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265 4755746 Apparatus and methods for semiconductor wafer testing Mallory, Cheste
1989
100-101 2 p. 292-293
2 p.
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266 4736375 Apparatus for fast generation of large quantities of test data words in a test facility Tannhauser, Rol
1989
100-101 2 p. 288-
1 p.
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267 4693777 Apparatus for producing semiconductor devices Hazano, Shigeki
1988
100-101 2 p. 330-
1 p.
artikel
268 4733172 Apparatus for testing I.C. chip Smolley, Robert
1989
100-101 2 p. 285-
1 p.
artikel
269 Apparatus for the preparation of passive micro-circuits 1966
100-101 2 p. 186-
1 p.
artikel
270 Application of a quartz crystal thickness monitor in the continuous measurement of thickness of evaporated and sputtered metal films 1971
100-101 2 p. 131-
1 p.
artikel
271 Application of computer to processing the results of tests of semiconductor devices 1976
100-101 2 p. 103-
1 p.
artikel
272 Application of conductive adhesives in microcircuits for “long-life” equipment 1981
100-101 2 p. 280-
1 p.
artikel
273 Application of genetic algorithms for electronic devices placement in structures with heat conduction through the substrate Felczak, M.
2011
100-101 2 p. 453-459
7 p.
artikel
274 Application of laser beams to integrated circuits 1969
100-101 2 p. 160-
1 p.
artikel
275 Application of Low-Power current mode logic 1974
100-101 2 p. 78-
1 p.
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276 Application of Machine Model ESD tester to high volume capacitor reliability testing Meeder, Michael G.
2011
100-101 2 p. 246-251
6 p.
artikel
277 Application of microelectronics in optical precision instrument manufacture 1981
100-101 2 p. 283-
1 p.
artikel
278 Application of noise measurements to the reliability analysis of semiconductor devices 1966
100-101 2 p. 179-
1 p.
artikel
279 Application of quantum defect techniques to photoionization of impurities in semiconductors 1968
100-101 2 p. 160-
1 p.
artikel
280 Application of RAM to communication systems 1977
100-101 2 p. 114-
1 p.
artikel
281 Applications for MeV ion implantation 1987
100-101 2 p. 391-
1 p.
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282 Applications of high-speed data acquisition for semiconductor device yield analysis. Part II 1983
100-101 2 p. 395-
1 p.
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283 Applications of ion implantation in semiconductor processing 1977
100-101 2 p. 123-
1 p.
artikel
284 Applications of microelectronics to aerospace equipment 1970
100-101 2 p. 119-
1 p.
artikel
285 Applications of solid-liquid interdiffusion (SLID) bonding in integrated-circuit fabrication 1967
100-101 2 p. 198-
1 p.
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286 Applied statistics Hamaker, H.C
1962
100-101 2 p. 101-109
9 p.
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287 Approaches to life cycle cost analysis with system availability constraints — A review Ntuen, Celestine A.
1986
100-101 2 p. 341-354
14 p.
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288 Approximations to system reliability using a modular decomposition 1970
100-101 2 p. 113-
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289 A practical approach to printed wiring repair techniques 1977
100-101 2 p. 112-
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290 A practical metric for soft error vulnerability analysis of combinational circuits Raji, Mohsen
2015
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13 p.
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291 A practical tantalum thin-film single-sideband demodulator using RC time-varying and active networks 1968
100-101 2 p. 171-172
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292 A procedure for the evaluation and failure analysis of MOS memory circuits using the scanning electron microscope in potential contrast mode 1973
100-101 2 p. 88-
1 p.
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293 A production parylene coating process for hybrid microcircuits 1978
100-101 2 p. 266-
1 p.
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294 A production reactor for continuous deposition of silicon dioxide 1974
100-101 2 p. 78-
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295 A profile of activities in reliability studies at the university of Windsor Proctor, Charles L.
1975
100-101 2 p. 197-198
2 p.
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296 A programmable pseudo-random noise generator 1981
100-101 2 p. 283-
1 p.
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297 A proposal concerned with electronic component parts field reliability prediction method 1973
100-101 2 p. 84-
1 p.
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298 A prototype assembly facility for CerDip packaging 1973
100-101 2 p. 92-
1 p.
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299 A rating criterion for film resistors 1981
100-101 2 p. 286-
1 p.
artikel
300 A ratio-type goodness-of-fit test for 2-parameter Weibull distributions 1977
100-101 2 p. 114-
1 p.
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301 A recommendation for ceramic over plastic IC packages for 1972 real-time commercial computer systems 1973
100-101 2 p. 93-
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302 A recursive method for network reliability measures evaluation 1985
100-101 2 p. 389-
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303 A reliability analysis of a k-out-of-N:G redundant system with common-cause failures and critical human errors Who Kee Chung,
1990
100-101 2 p. 237-241
5 p.
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304 A reliability assessment of bipolar proms 1977
100-101 2 p. 115-
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305 A reliability failure mode in dynamic MOS circuits—the unopened metal to polysilicon contact window and the floating gate transistor 1978
100-101 2 p. 252-
1 p.
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306 A reliability model for stress vs strength problem Yadav, R.P.S.
1973
100-101 2 p. 119-123
5 p.
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307 A reliability physics model for parallel system Gopalan, M.N.
1983
100-101 2 p. 367-371
5 p.
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308 A reliability report on low power TTL integrated circuits Adams, J.D.
1972
100-101 2 p. 171-175
5 p.
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309 A reparable multistate device with arbitrarily distributed repair times Chung, Who Kee
1981
100-101 2 p. 255-256
2 p.
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310 A review of error propagation analysis in systems Kuo, Way
1983
100-101 2 p. 235-248
14 p.
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311 A review of government-sponsored microminiaturization work in the United Kingdom 1963
100-101 2 p. 158-
1 p.
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312 A review of latchup and electrostatic discharge (ESD) in BiCMOS RF silicon germanium technologies: Part I—ESD Voldman, Steven H.
2005
100-101 2 p. 323-340
18 p.
artikel
313 A review of microelectronic circuit and system design. Part 1 1965
100-101 2 p. 225-
1 p.
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314 A review of new methods and attitudes in reliability engineering 1974
100-101 2 p. 75-
1 p.
artikel
315 A review of plastic packaging for hybrid thick-film circuits 1972
100-101 2 p. 117-118
2 p.
artikel
316 A review of some charge transport properties of silicon 1977
100-101 2 p. 119-
1 p.
artikel
317 A review of standby redundant systems 1981
100-101 2 p. 279-280
2 p.
artikel
318 A review of the growth and structure of thin films of germanium and silicon Newman, R.C.
1964
100-101 2 p. 121-128
8 p.
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319 A review of the limitations of aluminium thin films on semiconductor devices 1976
100-101 2 p. 110-
1 p.
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320 A review of thick film conductors 1977
100-101 2 p. 121-
1 p.
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321 A review of thin film techniques for microelectronics Lloyd, P.
1967
100-101 2 p. 177-187
11 p.
artikel
322 Arrays of microphotographs for microelectronic components 1963
100-101 2 p. 158-
1 p.
artikel
323 A self-focused multichannel electron beam source for annealing of ion-implanted semiconductors 1987
100-101 2 p. 391-
1 p.
artikel
324 A semi-automatic test set for in-circuit testing of diodes 1970
100-101 2 p. 113-
1 p.
artikel
325 A set theoretic method for enumeration of pathsets of non-directed graphs Aziz, M.A.
1995
100-101 2 p. 295-298
4 p.
artikel
326 Ashing process for dry photolithography 1985
100-101 2 p. 394-
1 p.
artikel
327 A simple technique for failure analysis of MOS IC using liquid crystal 1987
100-101 2 p. 380-
1 p.
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328 A simple VLSI spherical particle-induced fault simulator: application to DRAM production process Nakamae, Koji
2000
100-101 2 p. 245-253
9 p.
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329 A single-chip non-recursive digital processor 1983
100-101 2 p. 402-
1 p.
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330 A single-server M/G/1 queueing system subject to breakdowns—some reliability and queueing problems Ying Hui Tang,
1997
100-101 2 p. 315-321
7 p.
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331 A six-state system model Dhillon, Balbir S.
1976
100-101 2 p. 139-
1 p.
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332 A solid circuit multivibrator using a unijunction transistor Ambroziak, A.
1963
100-101 2 p. 133-134
2 p.
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333 A solution of the core-exciton issue for silicon and germanium 1981
100-101 2 p. 285-
1 p.
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334 Aspects of electron resist exposure 1978
100-101 2 p. 268-
1 p.
artikel
335 Aspects of using infrared for electronic circuit diagnosis 1968
100-101 2 p. 161-162
2 p.
artikel
336 Assembling beam-lead sealed-junction integrated-circuit packages 1969
100-101 2 p. 158-
1 p.
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337 Assessing ATE on a cost-avoidance basis 1985
100-101 2 p. 392-
1 p.
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338 Assessing equipment reliability for microwave radio-relay systems Walrond, J.C.
1971
100-101 2 p. 95-103
9 p.
artikel
339 Assessment of silicone encapsulation materials: screening techniques 1978
100-101 2 p. 257-
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340 Assessment of ultra-thin Si wafer thickness in 3D wafer stacking Kim, Eun-Kyung
2010
100-101 2 p. 195-198
4 p.
artikel
341 A standardized hybrid microcircuit design cycle 1971
100-101 2 p. 124-
1 p.
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342 A statistical approach for performance evaluation of 386 and 486 microprocessors Akman, Ibrahim
1996
100-101 2 p. 235-239
5 p.
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343 A statistical approach to the analysis of dielectric breakdown strength of thin insulating films 1978
100-101 2 p. 266-
1 p.
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344 A statistical model for electromigration induced failure in thin-film conductors 1973
100-101 2 p. 89-
1 p.
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345 A status report on equipment reliability—a new approach is indicated 1963
100-101 2 p. 156-
1 p.
artikel
346 A stochastic approach for the anodic-oxidation process for fine adjustment of the thin-film resistors 1973
100-101 2 p. 98-99
2 p.
artikel
347 A study of a time-dependent queueing problem with departures having random memory Sharda,
1985
100-101 2 p. 295-298
4 p.
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348 A study of the interface states in MIS-structures with thin SiO2 and SiO x N y layers using deep level transient spectroscopy Beyer, R.
1999
100-101 2 p. 297-302
6 p.
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349 A study on 1/f noise spectrum generation in nonlinear transmission media and biomedical systems Takagi, Keiji
2003
100-101 2 p. 339-342
4 p.
artikel
350 A study on optimal maintenance of system with exponential distribution 1987
100-101 2 p. 382-
1 p.
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351 A submicron CMOS/SOS process for VLSI 1983
100-101 2 p. 399-
1 p.
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352 A successful approach to vertical stack assemblies of flat packaged microcircuits 1967
100-101 2 p. 205-206
2 p.
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353 A survey of accelerated ageing techniques for solderable substrates 1977
100-101 2 p. 113-
1 p.
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354 A survey of conduction mechanisms in very thin films 1965
100-101 2 p. 228-
1 p.
artikel
355 A survey of crystal-growing processes and equipment 1967
100-101 2 p. 201-
1 p.
artikel
356 A survey of design methods for failure detection in dynamic systems 1977
100-101 2 p. 114-
1 p.
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357 A survey of epitaxial growth processes and equipment 1968
100-101 2 p. 166-
1 p.
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358 A survey on algortthmic aspects in preventive maintenance Lau, H.T.
1985
100-101 2 p. 299-311
13 p.
artikel
359 Asymptotic expansion in the limit theorem for the convergence to laplace distribution El Fahham, M.M.
1997
100-101 2 p. 349-353
5 p.
artikel
360 Asynchronous circuits accelerate access to 256-K read-only memory 1983
100-101 2 p. 402-
1 p.
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361 A systematic method of deriving new semiconducting compounds by structural analogy 1965
100-101 2 p. 227-228
2 p.
artikel
362 A system designer's lament: give us better digital ICs 1972
100-101 2 p. 116-
1 p.
artikel
363 A system of tantalum film microcircuitry Stone Jr., H.A
1962
100-101 2 p. 171-172
2 p.
artikel
364 A system with pre-inspection and two types of repairman Tuteja, R.K.
1994
100-101 2 p. 373-377
5 p.
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365 A TCAD comparative study of power rectifiers: modified P–i–N vs. modified mosaic contact P–i–N diode Aldrete-Vidrio, H.E.
2003
100-101 2 p. 181-188
8 p.
artikel
366 A technique for transient thermal prediction in microminiaturized circuits 1963
100-101 2 p. 158-
1 p.
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367 A technique for transient thermal prediction in microminiaturized circuits 1963
100-101 2 p. 158-
1 p.
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368 A technique to mitigate impact of process, voltage and temperature variations on design metrics of SRAM Cell Islam, A.
2012
100-101 2 p. 405-411
7 p.
artikel
369 A technology of thin-film hybrid microwave circuits 1977
100-101 2 p. 122-
1 p.
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370 A Tellegen's theorem approach to the fault diagnosis of general analog circuits Al-Shanuti, Sulaiman I.
1987
100-101 2 p. 283-297
15 p.
artikel
371 A tester for MOS integrated circuits 1973
100-101 2 p. 86-
1 p.
artikel
372 A test structure for controlling the process of manufacturing MOS circuits 1974
100-101 2 p. 78-
1 p.
artikel
373 ATE system upgrades production efficiency and accuracy 1983
100-101 2 p. 395-
1 p.
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374 A theoretical investigation on the generation current in silicon p-n junctions under reverse bias 1973
100-101 2 p. 98-
1 p.
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375 A thick-film hybrid laser target board 1981
100-101 2 p. 286-
1 p.
artikel
376 A thin-film facility for electrical engineering research 1968
100-101 2 p. 168-
1 p.
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377 A thin-film transistor with an interlayer at the semiconductor-insulator interface 1972
100-101 2 p. 123-
1 p.
artikel
378 A three-unit standby redundant system with repair and preventive maintenance Mokaddis, G.S.
1990
100-101 2 p. 313-325
13 p.
artikel
379 A throttle valve for automatic pressure control in sputtering and reactive sputter etching 1985
100-101 2 p. 394-
1 p.
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380 A two (multicomponent) unit parallel system with standby and common cause failure 1985
100-101 2 p. 388-
1 p.
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381 A two-unit deteriorating standby system with inspection 1985
100-101 2 p. 387-388
2 p.
artikel
382 A two-unit parallel redundant system with three modes and bivariate exponential lifetimes 1985
100-101 2 p. 391-
1 p.
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383 A unified look at the use of successive differentiation and integration in MOSFET model parameter extraction García-Sánchez, Francisco J.
2015
100-101 2 p. 293-307
15 p.
artikel
384 4736374 Automated test apparatus for use with multiple equipment Kump, Donal
1989
100-101 2 p. 288-
1 p.
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385 Automatic control and monitoring system for thin-film deposition 1968
100-101 2 p. 169-
1 p.
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386 Automatic control of large-scale integrated circuit fabrication processes—process control algorithms 1981
100-101 2 p. 282-283
2 p.
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387 Automatic data mining for telemetry database of computer systems Wu, C.-H.
2011
100-101 2 p. 263-269
7 p.
artikel
388 Automatic diffusion furnace system using microprocessor control 1978
100-101 2 p. 256-
1 p.
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389 4835459 Automatic fault insertion system (AFIS) Hamlin, JackW
1990
100-101 2 p. ii-
1 p.
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390 Automatic formation of trial layouts of thin-film microcircuits 1970
100-101 2 p. 125-
1 p.
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391 Automatic inspection system for telecommunications equipment 1976
100-101 2 p. 103-
1 p.
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392 Automatic photo-composition of reticles 1978
100-101 2 p. 256-
1 p.
artikel
393 Automatic positioning of device electrodes using the scanning electron microscope 1966
100-101 2 p. 181-
1 p.
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394 Automatic sputtering of tantalum films for resistor and capacitor fabrication 1965
100-101 2 p. 230-
1 p.
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395 Automatic Testing of electronic equipment 1969
100-101 2 p. 147-167
21 p.
artikel
396 Automating the photo-resist developing process 1967
100-101 2 p. 195-
1 p.
artikel
397 Automation and motor function routines for mask-making 1969
100-101 2 p. 159-
1 p.
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398 Automation in CVD processing 1978
100-101 2 p. 256-
1 p.
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399 Automation of micromodule circuit fabrication and testing 1968
100-101 2 p. 166-
1 p.
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400 Availability analysis of a fault-tolerant computer system 1981
100-101 2 p. 279-
1 p.
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401 Availability analysis of a robot with safety system Dhillon, B.S.
1996
100-101 2 p. 169-177
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402 Availability analysis of a standby complex system having imperfect switch-over device Singh, Jai
1995
100-101 2 p. 285-288
4 p.
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403 Availability analysis of a two-unit cold standby system with two switching failure modes 1985
100-101 2 p. 389-
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404 Availability-based life cycle cost model: A simulation approach Ntuen, Celestine A.
1985
100-101 2 p. 331-342
12 p.
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405 Availability modelling of a vehicle fleet Dhillon, Balbir S.
1986
100-101 2 p. 355-364
10 p.
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406 Availability modelling of ring microcomputer systems Lombardi, F
1982
100-101 2 p. 295-308
14 p.
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407 Availability of a certain item within a system Wollner, E.
1977
100-101 2 p. 143-148
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408 Availability of a system subject to irregular short supervision 1976
100-101 2 p. 102-103
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409 Availability of a system with permissible repair time 1987
100-101 2 p. 381-
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410 Availability of non-independent main unit and N-unit series subsystem subject to shut-off rules Chen, Yow-Mow
1995
100-101 2 p. 159-169
11 p.
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411 Availability of priority standby redundant systems 1972
100-101 2 p. 116-
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412 Availability prediction by using a method of simulation Basker, B.A.
1977
100-101 2 p. 135-141
7 p.
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413 Avalanche breakdown in silicon diffused junctions 1973
100-101 2 p. 86-
1 p.
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414 A variable-ratio frequency divider using micrologic elements 1968
100-101 2 p. 172-
1 p.
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415 A versatile system for controlled electron-beam deposition of thin films 1972
100-101 2 p. 125-
1 p.
artikel
416 A versatile Ta2N-W-Au/SiO2/Al/SiO2 thin-film hybrid microcircuit metallization system 1976
100-101 2 p. 109-110
2 p.
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417 A VHSIC lithography overview 1987
100-101 2 p. 384-
1 p.
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418 A voltage controlled oscillator using a standard integrated circuit 1966
100-101 2 p. 180-
1 p.
artikel
419 A yield calculation method for LSI arrays considering a defect distribution towards a wafer radius 1973
100-101 2 p. 87-
1 p.
artikel
420 Bad-weld detector uses integrated circuits 1967
100-101 2 p. 205-
1 p.
artikel
421 Baldrige-a quality philosophy Jacobs, Richard M.
1993
100-101 2 p. 239-242
4 p.
artikel
422 Band structure of silicon by pseudo-OPW 1971
100-101 2 p. 128-
1 p.
artikel
423 Base transit time of an epitaxial n+pn−n+ bipolar transistor considering Kirk effect Shahidul Hassan, M.M.
2003
100-101 2 p. 327-332
6 p.
artikel
424 Basic integrated circuit failure analysis techniques 1977
100-101 2 p. 111-
1 p.
artikel
425 Basic principles, methods and objectives of reliability operations 1970
100-101 2 p. 109-
1 p.
artikel
426 Batch packaging speeds system assemblies of ICs 1968
100-101 2 p. 170-
1 p.
artikel
427 Bayes estimation of reliability for special k-out-of-m: G systems 1985
100-101 2 p. 390-
1 p.
artikel
428 Bayes estimation of reliability in stress-strength model of Weibull distribution with equal scale parameters Pandey, M.
1986
100-101 2 p. 275-278
4 p.
artikel
429 Bayes estimation of the reliability of a system under a random environment governed by a Dirichlet prior Kumar, S.
1989
100-101 2 p. 255-265
11 p.
artikel
430 Bayesian confidence limits for the reliability of mixed exponential and distribution-free cascade subsystems 1972
100-101 2 p. 111-
1 p.
artikel
431 Bayesian decision analysis of the hazard rate for a two-parameter Weibull process 1973
100-101 2 p. 86-
1 p.
artikel
432 Bayesian inference in mixtures of two exponentials Pandey, M.
1988
100-101 2 p. 217-221
5 p.
artikel
433 Bayes prediction results for the inverse gaussian distribution utilizing guess values of parameters Upadhyay, S.K.
1994
100-101 2 p. 351-355
5 p.
artikel
434 BCB-to-oxide bonding technology for 3D integration Lin, S.L.
2012
100-101 2 p. 352-355
4 p.
artikel
435 B-747 component reliability program 1973
100-101 2 p. 89-
1 p.
artikel
436 Beam-lead and wire thermocompression bonding 1972
100-101 2 p. 117-
1 p.
artikel
437 Beam lead bonding to thick-film conductors 1972
100-101 2 p. 123-
1 p.
artikel
438 Beam-leaded tantalum thin-film capacitors 1970
100-101 2 p. 126-
1 p.
artikel
439 Behavior of Cu(In,Ga)Se2 solar cells under light/damp heat over time Yanagisawa, Takeshi
2004
100-101 2 p. 229-235
7 p.
artikel
440 Behavior of thick film resistors deposited on thick film dielectric layers 1971
100-101 2 p. 130-
1 p.
artikel
441 Beryllia Ceramics in microelectronic applications 1977
100-101 2 p. 116-
1 p.
artikel
442 Bias dependence of TID radiation responses of 0.13μm partially depleted SOI NMOSFETs Ning, Bingxu
2013
100-101 2 p. 259-264
6 p.
artikel
443 Bibliography of current publications concerned with statistical techniques (including SPC) in general, specific statistical techniques, applicable software; also:cost of quality, deming, related history, Japanese approaches, procurement, QFD, training, TQM and selected general quality articles Anjard Sr, RonaldP.
1993
100-101 2 p. 195-209
15 p.
artikel
444 Bibliography of literature on nuclear system reliability 1985
100-101 2 p. 385-
1 p.
artikel
445 Bibliography of literature on reliability in automotive industries Dhillon, Balbir S.
1987
100-101 2 p. 361-373
13 p.
artikel
446 Bibliography of literature on safety factors Dhillon, B.S.
1989
100-101 2 p. 267-280
14 p.
artikel
447 Bibliography of literature on testability Dhillon, B.S.
1990
100-101 2 p. 375-415
41 p.
artikel
448 Binary Ag-In ohmic contacts to GaAs and GaSb 1976
100-101 2 p. 108-109
2 p.
artikel
449 Biographies 1975
100-101 2 p. 241-246
6 p.
artikel
450 Bipolar device packaging—electrical, thermal, and mechanical stress considerations 1985
100-101 2 p. 394-
1 p.
artikel
451 Bipolar. MOS large-scale integration vie for spotlight as device designers meet 1976
100-101 2 p. 103-
1 p.
artikel
452 Birefringent tape—a new, easier technique for separating thin-film and printed circuit master drawings with perfect registration 1967
100-101 2 p. 195-
1 p.
artikel
453 4096 bit and larger bipolar static random access memories 1981
100-101 2 p. 283-
1 p.
artikel
454 Blazed diffraction gratings fabricated using X-ray lithography: fabrication, modeling and simulation Hagouel, Paul Isaac
2003
100-101 2 p. 249-258
10 p.
artikel
455 Bonding-failure analysis with electron beam and nuclear scattering techniques 1981
100-101 2 p. 290-
1 p.
artikel
456 Bonding refractory sputtering targets 1983
100-101 2 p. 399-
1 p.
artikel
457 Bonding thin films and small foils 1965
100-101 2 p. 228-
1 p.
artikel
458 Bonding wire microelectronic interconnections 1981
100-101 2 p. 281-
1 p.
artikel
459 Book review amendment G.W.A.D.,
1977
100-101 2 p. 125-
1 p.
artikel
460 Boom squeezes captive chip makers 1985
100-101 2 p. 392-393
2 p.
artikel
461 Boron-implanted silicon resistors 1978
100-101 2 p. 266-
1 p.
artikel
462 Boundary conditions for pn heterojunctions 1985
100-101 2 p. 397-
1 p.
artikel
463 4471483 Branched labyrinth wafer-scale integrated circuit Chamberlain, JohnT
1985
100-101 2 p. 404-
1 p.
artikel
464 Breakdown and reliability of p-MOS devices with stacked RPECVD oxide/nitride gate dielectric under constant voltage stress Lee, Yi-Mu
2004
100-101 2 p. 207-212
6 p.
artikel
465 Breakdown fields and conduction mechanisms in thin Ta2O5 layers on Si for high density DRAMs Atanassova, E.
2002
100-101 2 p. 157-173
17 p.
artikel
466 Breakdown properties of metal/NIDOS SiO2/silicon structures Temple-Boyer, P
1999
100-101 2 p. 187-190
4 p.
artikel
467 Bridge transfer in sealed contacts—theory and life expectancy 1976
100-101 2 p. 102-
1 p.
artikel
468 Building-up of system level ESD modeling: Impact of a decoupling capacitance on ESD propagation Monnereau, N.
2013
100-101 2 p. 221-228
8 p.
artikel
469 Build power amplifiers with IC drivers 1974
100-101 2 p. 79-80
2 p.
artikel
470 Built-in getter-ion pumps 1974
100-101 2 p. 83-
1 p.
artikel
471 Built-in-test for fail-safe design 1987
100-101 2 p. 383-
1 p.
artikel
472 Built-in-test verification techniques 1987
100-101 2 p. 383-
1 p.
artikel
473 Bureau of ships maintainability specification 1964
100-101 2 p. 142-
1 p.
artikel
474 Burn-in G.W.A.D.,
1983
100-101 2 p. 391-392
2 p.
artikel
475 Burn-in: a new emphasis 1983
100-101 2 p. 396-
1 p.
artikel
476 Burn-in programs for repairable systems 1974
100-101 2 p. 76-
1 p.
artikel
477 Busy-period analysis of a two-unit warm standby system with inspection time Subramanyam Naidu, R.
1983
100-101 2 p. 341-346
6 p.
artikel
478 Cables and accessories: some trends in standardization, rationalization and ratings 1970
100-101 2 p. 112-113
2 p.
artikel
479 CAFTA+: a comprehensive fault tree development work station 1987
100-101 2 p. 383-
1 p.
artikel
480 Calculating the S-T up and down distributions of a class of stochastic networks Kiu, Sun-Wah
1987
100-101 2 p. 313-326
14 p.
artikel
481 Calculation of the breakdown characteristics of bipolar transistors using a two-dimensional model 1976
100-101 2 p. 102-
1 p.
artikel
482 Calendar 2009
100-101 2 p. I-IV
nvt p.
artikel
483 Calendar 2010
100-101 2 p. I-II
nvt p.
artikel
484 Calendar for forthcoming events 2003
100-101 2 p. I-VIII
nvt p.
artikel
485 Calendar of international conferences, symposia, lectures and meetings of interest 1994
100-101 2 p. 387-389
3 p.
artikel
486 Calendar of international conferences, symposia, lectures and meetings of interest 1993
100-101 2 p. 283-
1 p.
artikel
487 Calendar of international conferences, symposia, lectures and meetings of interest 1997
100-101 2 p. 377-378
2 p.
artikel
488 Calendar of international conferences, symposia, lectures and meetings of interest 1996
100-101 2 p. 291-292
2 p.
artikel
489 Calendar of international conferences, symposia, lectures and meetings of interest 1983
100-101 2 p. 201-204
4 p.
artikel
490 Calendar of international conferences, symposia, lectures and meetings of interest 1981
100-101 2 p. 145-146
2 p.
artikel
491 Calendar of international conferences, symposia, lectures and meetings of interest 1988
100-101 2 p. 167-169
3 p.
artikel
492 Calendar of international conferences, symposia, lectures and meetings of interest 1986
100-101 2 p. 205-207
3 p.
artikel
493 Calendar of international conferences, symposia, lectures and meetings of interest 1985
100-101 2 p. 207-210
4 p.
artikel
494 Calendar of international conferences, symposia, lectures and meetings of interest 1987
100-101 2 p. 201-205
5 p.
artikel
495 Calendar of international conferences, symposia, lectures and meetings of interest 1989
100-101 2 p. 81-85
5 p.
artikel
496 Calendar of international conferences, symposia, lectures and meetings of interest 1976
100-101 2 p. 93-94
2 p.
artikel
497 Calendar of international conferences, symposia, lectures and meetings of interest 1978
100-101 2 p. 235-238
4 p.
artikel
498 Calendar of international conferences, symposia, lectures and meetings of interest 1973
100-101 2 p. 75-76
2 p.
artikel
499 Calendar of international conferences, symposia, lectures and meetings of interest 1977
100-101 2 p. 99-100
2 p.
artikel
500 Calendar of international conferences, symposia, lectures and meetings of interest 1972
100-101 2 p. 99-101
3 p.
artikel
501 Calendar of international conferences, symposia, lectures and meetings of interest 1970
100-101 2 p. 89-92
4 p.
artikel
502 Calendar of international conferences, symposia, lectures and meetings of interest 1971
100-101 2 p. 117-120
4 p.
artikel
503 Calendar of international conferences, symposia, lectures and meetings of interest 1974
100-101 2 p. 61-62
2 p.
artikel
504 Call for papers 1997
100-101 2 p. 371-376
6 p.
artikel
505 Calls for papers 1972
100-101 2 p. 107-109
3 p.
artikel
506 Can plastic encapsulated microcircuits provide reliability with economy? 1971
100-101 2 p. 122-
1 p.
artikel
507 Capacitively coupled transmission line pulsing cc-TLP––a traceable and reproducible stress method in the CDM-domain Wolf, Heinrich
2005
100-101 2 p. 279-285
7 p.
artikel
508 Capacitors compatible with thick film circuit technology 1969
100-101 2 p. 156-
1 p.
artikel
509 Capacitors for monolithic integrated circuits 1967
100-101 2 p. 191-
1 p.
artikel
510 Capacitors-reliability, life and the relevance of circuit design 1967
100-101 2 p. 191-192
2 p.
artikel
511 Capture cross sections of the gold donor and acceptor states in n-type Czochralski silicon 1983
100-101 2 p. 403-
1 p.
artikel
512 Carbon in silicon: properties and impact on devices 1983
100-101 2 p. 404-
1 p.
artikel
513 Carbon Interstitial in electron-irradiated silicon 1977
100-101 2 p. 123-
1 p.
artikel
514 Case studies of the decreasing failure rate phenomena in mixed populations 1965
100-101 2 p. 221-
1 p.
artikel
515 Case study: Root cause of fluorine detection during TiN ARC layer corrosion of AlSiCu metal lines Naoe, Takuya
2015
100-101 2 p. 411-417
7 p.
artikel
516 Catastrophic events: actual risk versus sociental impact 1983
100-101 2 p. 397-
1 p.
artikel
517 Cause-effect alarm failure analysis for nuclear reactor protection system EDM modules Roca, J.L.
1995
100-101 2 p. 241-249
9 p.
artikel
518 CDI integrated circuits: the best of MOS and bipolars 1973
100-101 2 p. 91-
1 p.
artikel
519 Cermet resistors by reactive sputtering 1967
100-101 2 p. 205-
1 p.
artikel
520 Changes in electrical characteristics of AlTi contacts on silicon Brezeanu, G.
1988
100-101 2 p. 205-211
7 p.
artikel
521 Changes in the characteristics of CuInGaSe2 solar cells under light irradiation and during recovery: degradation analysis by the feeble light measuring method Yanagisawa, Takeshi
2002
100-101 2 p. 219-223
5 p.
artikel
522 Characterisation of emitter/base leakage currents in SiGe HBTs produced using selective epitaxy Lamb, A.C
2001
100-101 2 p. 273-279
7 p.
artikel
523 Characterisation of real surface of silicon by ellipsometry 1978
100-101 2 p. 259-
1 p.
artikel
524 Characteristic energy losses of electrons in copper, silver and gold 1963
100-101 2 p. 159-
1 p.
artikel
525 Characteristics of broadband parametric amplifiers using filter networks 1964
100-101 2 p. 148-
1 p.
artikel
526 Characteristics of silicon doped low-energy ion implantation 1967
100-101 2 p. 197-198
2 p.
artikel
527 Characteristics of soft metals for electrical connexions Taylor, T.C.
1967
100-101 2 p. 125-130
6 p.
artikel
528 Characteristics of some chromium resistor films 1967
100-101 2 p. 205-
1 p.
artikel
529 Characteristic values of ultra high frequency diodes and their measurement (Part I) 1963
100-101 2 p. 157-
1 p.
artikel
530 Characterization of film defects in silicon epitaxial wafers 1965
100-101 2 p. 227-
1 p.
artikel
531 Characterization of gold-gold thermocompression bonding 1976
100-101 2 p. 105-
1 p.
artikel
532 Characterization of oxide etching and wafer cleaning using vapor phase anhydrous hydrofluoric acid and ozone Bauer, A.J.
1999
100-101 2 p. 311-316
6 p.
artikel
533 Characterization of reaction bonded Au and Ag thick film metallizations 1978
100-101 2 p. 256-
1 p.
artikel
534 Characterization of the hot-electron-induced degradation in thin SiO2 gate oxides Cartier, E
1998
100-101 2 p. 201-211
11 p.
artikel
535 Characterizations through failure rate and mean residual life transforms Roy, Dilip
1993
100-101 2 p. 141-142
2 p.
artikel
536 Charge storage by irradiation with UV light in non-biased MNOS structures 1978
100-101 2 p. 259-
1 p.
artikel
537 Charging control on high energy implanters: A process requirement demonstrated by plasma damage monitoring Cantin, C.
2009
100-101 2 p. 209-214
6 p.
artikel
538 Chemical analyses of thick-film gold conductor inks 1976
100-101 2 p. 109-
1 p.
artikel
539 Chemicals for semiconductor processing 1973
100-101 2 p. 93-
1 p.
artikel
540 Chemical vapor deposition of inorganic glass films 1983
100-101 2 p. 398-
1 p.
artikel
541 Chemical vapor deposition systems for glass passivation of integrated circuits 1976
100-101 2 p. 104-
1 p.
artikel
542 Chemical vapor deposition, trends and equipment 1983
100-101 2 p. 398-
1 p.
artikel
543 Chemisorption of atomic oxygen on silicon surface 1983
100-101 2 p. 403-
1 p.
artikel
544 Chip controls floppy-disk drives 1981
100-101 2 p. 284-
1 p.
artikel
545 Chip detects errors in 25 ns 1981
100-101 2 p. 283-
1 p.
artikel
546 Chip-package substrate cushions dense, high-speed circuitries 1983
100-101 2 p. 399-
1 p.
artikel
547 Choosing logic for microcircuits 1964
100-101 2 p. 142-
1 p.
artikel
548 Chrome photoplates can improve both mask and device yields 1969
100-101 2 p. 159-
1 p.
artikel
549 Chromium redistribution in ion-implanted GaAs 1985
100-101 2 p. 398-
1 p.
artikel
550 Chromium thin film as a barrier to the interaction of Pd2Si with Al 1978
100-101 2 p. 259-
1 p.
artikel
551 Circuit applications of field-effect transistors. Part 1. Input circuits 1965
100-101 2 p. 227-
1 p.
artikel
552 Circuit board interlayer connexion 1967
100-101 2 p. 206-
1 p.
artikel
553 Circuit design boosts 15-V C-MOS process to drive 60-V displays 1983
100-101 2 p. 402-
1 p.
artikel
554 4694372 Circuit diagnosis and control device Sibeud, Jean-Paul
1988
100-101 2 p. 330-331
2 p.
artikel
555 Circuit module implements practical self-testing 1983
100-101 2 p. 402-
1 p.
artikel
556 Circuit module implements practical self-testing 1983
100-101 2 p. 395-
1 p.
artikel
557 Classification of macroscopic defects contained in p-type EFG ribbon silicon 1987
100-101 2 p. 388-
1 p.
artikel
558 Classification of reliability tests 1973
100-101 2 p. 85-86
2 p.
artikel
559 Cleaners and cleaning for components and microelectronics 1971
100-101 2 p. 123-
1 p.
artikel
560 Clean rooms: designed to kill 1970
100-101 2 p. 119-
1 p.
artikel
561 CLEO lights way to optical ICs 1985
100-101 2 p. 393-
1 p.
artikel
562 CMOS3cell library G.W.A.D.,
1988
100-101 2 p. 325-326
2 p.
artikel
563 C-MOS 256-K RAM with wideband output stands by on microwatts 1985
100-101 2 p. 397-
1 p.
artikel
564 C-MOS microprocessor wakes itself up 1981
100-101 2 p. 283-
1 p.
artikel
565 C-MOS read-only memory mates with a host of processors 1981
100-101 2 p. 283-
1 p.
artikel
566 CMOS reliability Gallace, L.J
1978
100-101 2 p. 287-304
18 p.
artikel
567 Cmos reliability: A useful case history to revise extrapolation effectiveness, length and slope of the learning curve Brambilla, P
1981
100-101 2 p. 191-201
11 p.
artikel
568 4590388 CMOS spare decoder circuit Clemons, DonaldG
1987
100-101 2 p. 393-
1 p.
artikel
569 CMOS—the emerging VLSI technology 1987
100-101 2 p. 384-
1 p.
artikel
570 C/MOS unites with silicon gate to yield micropower technology 1972
100-101 2 p. 118-
1 p.
artikel
571 Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip Carrasco, Juan A.
2004
100-101 2 p. 339-350
12 p.
artikel
572 Combined in-circuit and functional tests: Model and application Sultan, Torky I.
1987
100-101 2 p. 279-280
2 p.
artikel
573 Combining vertex decompositions with factoring in an all-terminal network reliability algorithm Page, Lavon B.
1990
100-101 2 p. 249-263
15 p.
artikel
574 COMCAN—A computer code for common-cause analysis 1978
100-101 2 p. 254-
1 p.
artikel
575 Commercial application of thick-film hybrid microelectronic packaging 1970
100-101 2 p. 126-
1 p.
artikel
576 Common-cause failures and critical human errors in repairable and non-repairable systems Who Kee Chung,
1990
100-101 2 p. 243-247
5 p.
artikel
577 Common cause hazard analysis for random glitches 1983
100-101 2 p. 397-
1 p.
artikel
578 Comparative reliability analysis of simplex and redundant systems Dhillon, Balbir S.
1985
100-101 2 p. 343-356
14 p.
artikel
579 Comparative reliability study of n +−n and n +−n−n + Gunn diodes Mojzes, I.
1989
100-101 2 p. 131-132
2 p.
artikel
580 Comparative reliability tests on silicon-planar-switching transistors of european and U.S. manufacture Guekos, G.
1967
100-101 2 p. 143-162
20 p.
artikel
581 Comparative study of AlGaN/GaN HEMTs robustness versus buffer design variations by applying Electroluminescence and electrical measurements Ivo, P.
2011
100-101 2 p. 217-223
7 p.
artikel
582 Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems Harsányi, Gábor
2001
100-101 2 p. 229-237
9 p.
artikel
583 Comparing of system reliabilities of repairable coherent systems in a changing environment Deng, Yonglu
1994
100-101 2 p. 317-321
5 p.
artikel
584 Comparison between the properties of amorphous and crystalline Ta2O5 thin films deposited on Si Chaneliere, C.
1999
100-101 2 p. 261-268
8 p.
artikel
585 Comparison of a simulation and an exact method for reliability evaluation of large networks using a personal computer Kalyan, R.
1989
100-101 2 p. 133-136
4 p.
artikel
586 Comparison of enameled steel substrate properties for thick film use 1981
100-101 2 p. 285-
1 p.
artikel
587 Comparison of Monte Carlo techniques for obtaining system-reliability confidence limits 1981
100-101 2 p. 279-
1 p.
artikel
588 Comparison of predicted microwave radio outages 1971
100-101 2 p. 123-
1 p.
artikel
589 Comparison of screen-printed with vacuum-deposited film resistors under thermal cycling environment Mead, M.R.
1968
100-101 2 p. 145-146
2 p.
artikel
590 Comparison of Thai's theory with experimental boron doping profiles in silicon, diffused from boron nitride sources 1981
100-101 2 p. 284-
1 p.
artikel
591 Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues Grauby, Stéphane
2008
100-101 2 p. 204-211
8 p.
artikel
592 Comparison of two unit cold standby reliability models with three types of repair facilities 1985
100-101 2 p. 388-
1 p.
artikel
593 COMPAS; A multichip LSI routing program 1976
100-101 2 p. 105-
1 p.
artikel
594 Compatibility and testing of electronic components G.W.A.D.,
1973
100-101 2 p. 103-104
2 p.
artikel
595 Compatible circuits highlight microelectronics symposium 1965
100-101 2 p. 224-
1 p.
artikel
596 Complementary MOS circuits in process control instrumentation 1973
100-101 2 p. 92-
1 p.
artikel
597 Complex MOS circuit arrays 1971
100-101 2 p. 128-
1 p.
artikel
598 Complex system maintainability verification with limited samples Miao, Qiang
2011
100-101 2 p. 294-299
6 p.
artikel
599 Complex system reliability with exponential repair time distributions under head-of-line-repair-discipline Gupta, P.P.
1973
100-101 2 p. 151-158
8 p.
artikel
600 Complex system reliability with general repair time distributions under preemptive repeat repair discipline Gupta, P.P.
1973
100-101 2 p. 145-150
6 p.
artikel
601 Complex system reliability with general repair time distributions under preemptive resume repair discipline 1974
100-101 2 p. 76-77
2 p.
artikel
602 Component data for statistical circuit analysis 1973
100-101 2 p. 88-
1 p.
artikel
603 Component parts reliability programmes in USAERDL 1964
100-101 2 p. 140-
1 p.
artikel
604 Component reliability exposed to thermal neutron environment—I Yadav, R.P.S.
1977
100-101 2 p. 149-153
5 p.
artikel
605 Component reliability in telecommunications equipment—part 1 1967
100-101 2 p. 192-
1 p.
artikel
606 Component reliability in telecommunications equipment—part 2 1967
100-101 2 p. 194-
1 p.
artikel
607 Component verification system 1981
100-101 2 p. 278-
1 p.
artikel
608 Comprehensive ESD protection for RF inputs Hyvonen, Sami
2005
100-101 2 p. 245-254
10 p.
artikel
609 Computer-aided design for integrated circuits 1968
100-101 2 p. 172-
1 p.
artikel
610 Computer aided design of adjustable thin film resistors 1981
100-101 2 p. 286-
1 p.
artikel
611 Computer-aided geometrical layout test for designing integrated circuits 1976
100-101 2 p. 104-
1 p.
artikel
612 4837502 Computer-aided, logic pulsing probe for locating faulty circuits on a printed circuit card Ugenti, Michael
1990
100-101 2 p. ii-iii
nvt p.
artikel
613 Computer aids for responsible engineer for the reliability of a system 1969
100-101 2 p. 169-171
3 p.
artikel
614 Computer aids for VLSI design G.W.A.D.,
1988
100-101 2 p. 324-325
2 p.
artikel
615 Computer controlled imaging system for automatic hybrid inspection 1981
100-101 2 p. 286-
1 p.
artikel
616 Computer control of the manufacture of electron beam processed microelectronic modules 1968
100-101 2 p. 173-
1 p.
artikel
617 Computerized thermal analysis of hybrid circuits 1978
100-101 2 p. 261-
1 p.
artikel
618 Computer model and charge transport studies in short gate charge-coupled devices 1977
100-101 2 p. 118-119
2 p.
artikel
619 Computer program for designing optimal networks with MOS gates 1973
100-101 2 p. 91-
1 p.
artikel
620 Computer screening technique for higher reliability 1965
100-101 2 p. 221-
1 p.
artikel
621 Computer simulation and analysis techniques for reliable circuit design Hochwald, W.
1966
100-101 2 p. 97-128
32 p.
artikel
622 Computer simulation methods applied to hybrid integrated circuits 1970
100-101 2 p. 117-
1 p.
artikel
623 Concepts for calculating frequency of system failure 1981
100-101 2 p. 278-
1 p.
artikel
624 Concerning the nature and the characteristics of thin dielectric layers prepared by the anodic oxidisation of titanium, tantalum and niobium 1968
100-101 2 p. 167-
1 p.
artikel
625 Conductance associated with interface states in MOS tunnel structures 1973
100-101 2 p. 97-98
2 p.
artikel
626 Conduction cooling for an LSI package: a one-dimensional approach 1983
100-101 2 p. 401-402
2 p.
artikel
627 Conduction in discontinuous metal films 1967
100-101 2 p. 202-
1 p.
artikel
628 Conduction processes in high value thick film resistors 1978
100-101 2 p. 261-
1 p.
artikel
629 Conductor crossovers provided by a combined thin-film and thick-film technology 1977
100-101 2 p. 120-
1 p.
artikel
630 Conference report 1970
100-101 2 p. 93-
1 p.
artikel
631 Conference report Report of the Fourth Conference of the Israel Society for Quality Assurance Jacobs, Richard M.
1983
100-101 2 p. 213-214
2 p.
artikel
632 Conferences, symposia, lectures and meetings of interest 1969
100-101 2 p. 169-171
3 p.
artikel
633 Confidence intervals for the ratio of two poisson means and poisson predictor intervals 1971
100-101 2 p. 121-
1 p.
artikel
634 Confidence limits on the failure rate and a rapid projection nomogram for the lognormal distribution 1985
100-101 2 p. 387-
1 p.
artikel
635 Configurations of series-parallel networks with maximum reliability Gutjahr, Walter J.
1996
100-101 2 p. 247-253
7 p.
artikel
636 Congestion-reliability-availability relationship in packet-switching computer networks 1985
100-101 2 p. 390-
1 p.
artikel
637 4465972 Connection arrangement for printed circuit board testing apparatus Sokolich, JamesM
1985
100-101 2 p. 401-402
2 p.
artikel
638 Consequence of microcrystallite model for some amorphous elemental semiconductors 1972
100-101 2 p. 121-
1 p.
artikel
639 Considerations concerning the reliability of relay transmitters 1967
100-101 2 p. 196-
1 p.
artikel
640 4517659 Constant-distance structure polycellular very large scale integrated circuit Chamberlain, JohnT
1986
100-101 2 p. 402-403
2 p.
artikel
641 Contactless nondestructive technique for the measurement of minority-carrier lifetime and diffusion length in silicon 1978
100-101 2 p. 260-
1 p.
artikel
642 4686468 Contact set for test apparatus for testing integrated circuit package Lee, Kenneth
1988
100-101 2 p. 327-
1 p.
artikel
643 Contamination control of high purity water 1985
100-101 2 p. 394-
1 p.
artikel
644 Contamination prevention and protection for process gases 1985
100-101 2 p. 396-
1 p.
artikel
645 Contamination problems in the semiconductor industry 1969
100-101 2 p. 149-150
2 p.
artikel
646 Contour deposition—a new epitaxial deposition technique for semiconductor devices and integrated circuits 1967
100-101 2 p. 201-
1 p.
artikel
647 Contribution a l'étude de la ségrégation de surface 1977
100-101 2 p. 120-
1 p.
artikel
648 Control factors in the manufacture of thick-film circuits Russell, R.F.
1968
100-101 2 p. 121-122
2 p.
artikel
649 4514846 Control fault detection for machine recovery and diagnostics prior to malfunction Federico, AnthonyM
1986
100-101 2 p. 400-
1 p.
artikel
650 Controlled collapse reflow chip joining 1970
100-101 2 p. 117-118
2 p.
artikel
651 Controlled doping of germanium layers made by the evaporation-condensation method 1967
100-101 2 p. 200-
1 p.
artikel
652 Controlling airborne particles 1985
100-101 2 p. 395-396
2 p.
artikel
653 Controlling oxygen in silicon: key to higher VLSI circuit yields 1983
100-101 2 p. 401-
1 p.
artikel
654 Control MOS/LSI yield by design 1972
100-101 2 p. 118-
1 p.
artikel
655 Control of resistivity, microstructure, and stress in electron beam evaporated tungsten films 1974
100-101 2 p. 84-
1 p.
artikel
656 Converters adjust to LSI, Bi-fet or amps emerge 1978
100-101 2 p. 257-
1 p.
artikel
657 Cooperative effects between arsenic and boron in silicon during simultaneous diffusions from ion implanted and chemical source predepositions 1974
100-101 2 p. 83-84
2 p.
artikel
658 Copper thick film materials: a perspective 1981
100-101 2 p. 286-
1 p.
artikel
659 Correlation between laboratory test and field part failure rates 1978
100-101 2 p. 254-
1 p.
artikel
660 Correlation between thermal resistance, channel temperature, infrared thermal maps and failure mechanisms in low power MESFET devices Canali, C.
1989
100-101 2 p. 117-124
8 p.
artikel
661 Corrosion failure modes in a TAB200 test vehicle 1987
100-101 2 p. 382-
1 p.
artikel
662 Corrosion of solder-coated TiPdAu thin-film conductors in a moist chlorine atmosphere 1978
100-101 2 p. 263-
1 p.
artikel
663 Corrosion protection for semiconductor packaging 1985
100-101 2 p. 395-
1 p.
artikel
664 Cost analysis in a two-unit standby system with a regular repairman and patience time 1985
100-101 2 p. 391-
1 p.
artikel
665 Cost analysis of a system with common cause failure and two types of repair facilities Garg, Rajiv
1985
100-101 2 p. 281-284
4 p.
artikel
666 Cost analysis of a three-state two-unit repairable system 1985
100-101 2 p. 390-
1 p.
artikel
667 Cost analysis of a two dissimilar-unit cold standby redundant system subject to inspection and two types of repair Mokaddis, G.S.
1997
100-101 2 p. 335-340
6 p.
artikel
668 Cost analysis of a two unit repairable system subject to on-line preventive maintenance and/or repair Gopalan, M.N.
1995
100-101 2 p. 251-258
8 p.
artikel
669 Cost-benefit analysis of a one-server two-unit cold standby system with repair and preventive maintenance Gopalan, M.N.
1985
100-101 2 p. 267-269
3 p.
artikel
670 Cost-benefit analysis of a single server three-unit redundant system with inspection, delayed replacement and two types of repair Gupta, Rakesh
1986
100-101 2 p. 247-253
7 p.
artikel
671 Cost-benefit analysis of a two-unit system subject to random service Gopalan, M.N.
1985
100-101 2 p. 313-323
11 p.
artikel
672 Cost effectiveness of computerized laboratory automation 1976
100-101 2 p. 103-
1 p.
artikel
673 Cost efficiency of thick-film conductors 1976
100-101 2 p. 109-
1 p.
artikel
674 Cost function analysis of a three-state repairable system 1985
100-101 2 p. 388-
1 p.
artikel
675 Cost limit replacement policy under minimal repair Park, Kyung S.
1983
100-101 2 p. 347-349
3 p.
artikel
676 Cost optimizing system to evaluate reliability (COSTER) 1978
100-101 2 p. 253-
1 p.
artikel
677 Counting and identifying particles in high purity water 1983
100-101 2 p. 398-
1 p.
artikel
678 Courses 1974
100-101 2 p. 65-
1 p.
artikel
679 Courses 1973
100-101 2 p. 79-81
3 p.
artikel
680 Courses in microelectronics and reliability 1972
100-101 2 p. 105-106
2 p.
artikel
681 Courses in microelectronics and reliability 1970
100-101 2 p. 85-86
2 p.
artikel
682 Cr-Cu and Cr-Cu-Cr thin film metallization 1974
100-101 2 p. 83-
1 p.
artikel
683 Critical factors influencing the voltage robustness of AlGaN/GaN HEMTs Cäsar, M.
2011
100-101 2 p. 224-228
5 p.
artikel
684 Critical temperatures for the observation of valley-splitting in Si-MOSFETS 1981
100-101 2 p. 285-
1 p.
artikel
685 Critical time of the lognormal distribution Chang, Dong Shang
1994
100-101 2 p. 261-266
6 p.
artikel
686 Crystallization of amorphous titanium dioxide films prepared by vacuum evaporation 1967
100-101 2 p. 202-
1 p.
artikel
687 Crystal oscillator using integrated circuit amplifiers 1966
100-101 2 p. 180-
1 p.
artikel
688 Current and future uses of vacuum deposition 1973
100-101 2 p. 101-
1 p.
artikel
689 Current-leakage kinetics across tinned Cr/Cu lands having epoxy overlay 1987
100-101 2 p. 379-
1 p.
artikel
690 Current noise of resin type and cermet type thick film resistors 1981
100-101 2 p. 287-
1 p.
artikel
691 4517511 Current probe signal processing circuit employing sample and hold technique to locate circuit faults Suto, AnthonyJ
1986
100-101 2 p. 401-402
2 p.
artikel
692 Current supply lines for rapid integrated circuits on two-plane printed circuit boards 1976
100-101 2 p. 105-
1 p.
artikel
693 Current transport and formation of energy structures in narrow Au/n-GaAs Schottky diodes Mamedov, R.K.
2012
100-101 2 p. 418-424
7 p.
artikel
694 Current transport in metal-semiconductor-metal (MSM) structures 1972
100-101 2 p. 121-
1 p.
artikel
695 Current-voltage relations for thin-film tunnelling structures 1965
100-101 2 p. 228-
1 p.
artikel
696 Custom-designed MOS arrays for use in digital systems 1973
100-101 2 p. 92-
1 p.
artikel
697 Custom LSI fades into background 1974
100-101 2 p. 77-
1 p.
artikel
698 Custom v.l.s.i. circuits for man-machine interaction: an automatic design method 1987
100-101 2 p. 387-
1 p.
artikel
699 Cutting of thin carbon films with a CO2-gas laser—II Experiments on cylindrical bodies De Jong, M.
1969
100-101 2 p. 89-96
8 p.
artikel
700 Cutting of thin carbon films with a CO2-gas laser—I Theoretical considerations and experiments on flat plates Siekman, J.G.
1969
100-101 2 p. 85-88
4 p.
artikel
701 Cutting of thin carbon films with a CO2-gas laser—I. Theoretical considerations and experiments on flat plates 1970
100-101 2 p. 126-
1 p.
artikel
702 Cylindrical diode continuous vacuum sputtering equipment for laboratory and high volume production 1974
100-101 2 p. 82-83
2 p.
artikel
703 Data communication Stojcev, Mile
2005
100-101 2 p. 403-404
2 p.
artikel
704 Data processing, LSI will help to bring sight to the blind 1974
100-101 2 p. 80-
1 p.
artikel
705 D.C. sputtering process: its characterization and its problems when applied to tin-dioxide thin-films 1981
100-101 2 p. 289-
1 p.
artikel
706 Debugging computer programs. A survey with special emphasis on ALGOL 1973
100-101 2 p. 89-
1 p.
artikel
707 Decapsulation of epoxy devices using oxygen plasma 1978
100-101 2 p. 256-
1 p.
artikel
708 4835464 Decoupling apparatus for use with integrated circuit tester Slye, BradleyD
1990
100-101 2 p. ii-
1 p.
artikel
709 Decrease of FET threshold voltage due to boron depletion during thermal oxidation 1972
100-101 2 p. 120-
1 p.
artikel
710 Degradation mechanisms in polysilicon emitter bipolar junction transistors for digital applications Vendrame, Loris
2000
100-101 2 p. 207-230
24 p.
artikel
711 Degradation of electron irradiated MOS capacitors Candelori, A.
1999
100-101 2 p. 227-233
7 p.
artikel
712 Degradation of MNOS memory transistor characteristics and failure mechanism model 1973
100-101 2 p. 87-
1 p.
artikel
713 Deionized water for integrated circuit fabrication 1974
100-101 2 p. 78-
1 p.
artikel
714 Denser process gets the most out of bipolar VLSI 1985
100-101 2 p. 396-397
2 p.
artikel
715 Density functional theory applied to the calculation of dielectric constant of low-k materials Courtot-Descharles, A.
1999
100-101 2 p. 279-284
6 p.
artikel
716 Dependence of hole velocity upon electric field and hole density for p-type silicon 1968
100-101 2 p. 167-
1 p.
artikel
717 Dependence of the Au/SnO x /n-LTPS/glass thin film MOS Schottky diode CO gas sensing performances on operating temperature Juang, Feng-Renn
2012
100-101 2 p. 425-429
5 p.
artikel
718 Depletion layer and capacitance calculations for gaussian diffused junctions 1969
100-101 2 p. 151-
1 p.
artikel
719 Depletion layer calculations for error function diffused junctions 1970
100-101 2 p. 123-124
2 p.
artikel
720 Deposition and monitoring apparatus for preparing passive microcircuits. Part 4 1965
100-101 2 p. 232-
1 p.
artikel
721 Deposition and monitoring apparatus for preparing passive microcircuits. Part 3 1965
100-101 2 p. 231-232
2 p.
artikel
722 Deposition of ferrite films by sputtering in a glow discharge 1968
100-101 2 p. 168-
1 p.
artikel
723 Deposition of germanium films by sputtering 1967
100-101 2 p. 204-
1 p.
artikel
724 Deposition of silicon dioxide films by the reaction of SiCl4 or SiHCl3 with water vapour 1968
100-101 2 p. 169-
1 p.
artikel
725 Deposition parameter effects on vapour-deposited zinc films 1967
100-101 2 p. 203-
1 p.
artikel
726 Description and use of the dynamic memory TMS 4062 1973
100-101 2 p. 96-
1 p.
artikel
727 Design and analysis of a fault-tolerant reconfigurable random access memory chip Mehdi, Kamal A.
1994
100-101 2 p. 297-315
19 p.
artikel
728 Design and construction of an automatic transistor testing and sorting machine 1963
100-101 2 p. 156-
1 p.
artikel
729 Design and control of a high precision electron beam machine 1968
100-101 2 p. 173-
1 p.
artikel
730 Design and development of a 68-lead nonhermetic leaded chip carrier 1981
100-101 2 p. 287-
1 p.
artikel
731 Design and fabrication of a thin-film starvation amplifier 1969
100-101 2 p. 154-
1 p.
artikel
732 Design and production of hybrid circuit artwork 1981
100-101 2 p. 289-
1 p.
artikel
733 Design and use of a laser interferometer for ultrasonic bonding studies 1977
100-101 2 p. 123-
1 p.
artikel
734 Design charts for transient response of thin-film networks 1966
100-101 2 p. 188-
1 p.
artikel
735 Design error diagnosis in digital circuits with stuck-at fault model Jutman, A.
2000
100-101 2 p. 307-320
14 p.
artikel
736 Designer's check list for reliable, producible transistor circuits 1963
100-101 2 p. 157-
1 p.
artikel
737 Designers weigh options for 256-K dynamic-RAM processes 1985
100-101 2 p. 396-
1 p.
artikel
738 Design for good matching in multichannel low-noise amplifier for recording neuronal signals in modern neuroscience experiments Dąbrowski, W.
2004
100-101 2 p. 351-361
11 p.
artikel
739 Design for maintainability with particular reference to domestic radio and television receivers 1968
100-101 2 p. 161-
1 p.
artikel
740 Designing a burn-in facility 1977
100-101 2 p. 115-
1 p.
artikel
741 Designing and manufacturing surface mount assemblies 1987
100-101 2 p. 386-
1 p.
artikel
742 Designing a television line flywheel generator using a phase-locked loop integrated circuit 1973
100-101 2 p. 94-95
2 p.
artikel
743 Designing considerations for building high-frequency hybrid ICs 1970
100-101 2 p. 118-
1 p.
artikel
744 Designing digital equipment with semiconductor networks 1963
100-101 2 p. 159-
1 p.
artikel
745 Designing for reliability in the automatic washing machine with a micro-computer 1987
100-101 2 p. 382-
1 p.
artikel
746 Designing for testability 1985
100-101 2 p. 393-
1 p.
artikel
747 Designing MOS systems for radiation environments 1970
100-101 2 p. 118-
1 p.
artikel
748 Designing sequential life test with type I censoring 1987
100-101 2 p. 381-
1 p.
artikel
749 Designing with diff-amp and op-amp ICs 1970
100-101 2 p. 117-
1 p.
artikel
750 Designing with high power hybrid control circuits 1973
100-101 2 p. 100-
1 p.
artikel
751 Designing with nitride-type EAROMs 1978
100-101 2 p. 258-
1 p.
artikel
752 Design issues of a three-dimensional packaging scheme for power modules Haque, Shatil
2001
100-101 2 p. 295-305
11 p.
artikel
753 Design limitations in large bipolar PROMs 1981
100-101 2 p. 281-
1 p.
artikel
754 Design of adaptive procedures for fault detection and isolation 1972
100-101 2 p. 115-
1 p.
artikel
755 Design of a fully CMOS compatible 3-μm size color pixel Langfelder, G.
2010
100-101 2 p. 169-173
5 p.
artikel
756 Design of a 3-micron CMOS cell library 1985
100-101 2 p. 395-
1 p.
artikel
757 Design optimization of ESD protection and latchup prevention for a serial I/O IC Huang, Chih-Yao
2004
100-101 2 p. 213-221
9 p.
artikel
758 Design system for semi-custom VLSI circuits 1985
100-101 2 p. 393-
1 p.
artikel
759 Design the accidents out of your product! 1971
100-101 2 p. 121-
1 p.
artikel
760 Design verification system for large-scale LSI designs 1983
100-101 2 p. 402-
1 p.
artikel
761 Destructive reverse breakdown in large area phosphorus diffused high voltage silicon n+p junctions 1968
100-101 2 p. 160-
1 p.
artikel
762 Detecting metal particles in semiconductor device housings 1968
100-101 2 p. 160-
1 p.
artikel
763 Detection and accelerated testing of vibration-induced connector wear 1985
100-101 2 p. 387-
1 p.
artikel
764 Detection and processing of secondary electron signals for pattern re-registration in scanning electron beam exposure 1978
100-101 2 p. 268-
1 p.
artikel
765 Determination of all hamiltonian paths and circuits and the minimal feedback set in a graph through Petri nets Hura, G.S.
1987
100-101 2 p. 223-227
5 p.
artikel
766 Determination of impurity distribution profiles in silicon epitaxial wafers 1965
100-101 2 p. 227-
1 p.
artikel
767 Determination of optimal overhaul intervals and inspection frequencies—A case study Basker, B.A.
1978
100-101 2 p. 313-315
3 p.
artikel
768 Determination of parts per billion of oxygen in silicon 1971
100-101 2 p. 129-
1 p.
artikel
769 Determination of reliability parameters of a digital multiplex frame strategy using Markov chains and a state reduction method 1985
100-101 2 p. 392-
1 p.
artikel
770 Determination of stress in films on single crystalline silicon substrates 1966
100-101 2 p. 182-
1 p.
artikel
771 Determination of the relative nitrogen doping level of tantalum nitride resistor film by means of the Seebeck effect 1973
100-101 2 p. 99-
1 p.
artikel
772 Developing the quality assurance requirements for a custom thin-film circuit program 1968
100-101 2 p. 162-
1 p.
artikel
773 Development and production of hybrid circuits for microwave radio links 1978
100-101 2 p. 261-
1 p.
artikel
774 Development of a reliability strategy for new IC component family and process Kohoutek, Henry J.
1983
100-101 2 p. 383-389
7 p.
artikel
775 Development of generalized theory of floating-emitter potential based on studies of germanium and silicon transistors 1974
100-101 2 p. 81-
1 p.
artikel
776 Development of integrated microwave components for ground-based phased arrays (Electronic steering module) 1970
100-101 2 p. 119-
1 p.
artikel
777 Developments in hybrid technology relating to high performance applications 1977
100-101 2 p. 120-
1 p.
artikel
778 Developments likely to improve the reliability of plastic encapsulated devices Jones, R.O.
1978
100-101 2 p. 273-278
6 p.
artikel
779 4686606 Device for cooling integrated circuit chip Yamada, Minoru
1988
100-101 2 p. 327-
1 p.
artikel
780 4604572 Device for testing semiconductor devices at a high temperature Horiuchi, Akinor
1987
100-101 2 p. 395-
1 p.
artikel
781 4516072 Device for use in testing printed circuit board components Marpoe, Gary
1986
100-101 2 p. 401-
1 p.
artikel
782 Diagnostic programming: costs and benefits 1983
100-101 2 p. 397-
1 p.
artikel
783 Diameter correction factors for the resistivity measurement of semiconductor slices 1963
100-101 2 p. 159-
1 p.
artikel
784 Diamond scribers start to give way to laser machines, slurry saws, new etch methods 1971
100-101 2 p. 125-
1 p.
artikel
785 Diborane for boron diffusion into silicon 1968
100-101 2 p. 165-
1 p.
artikel
786 Die Bonding principles and considerations 1969
100-101 2 p. 158-
1 p.
artikel
787 Dielectrically isolated silicon with a sharp impurity gradient 1968
100-101 2 p. 165-
1 p.
artikel
788 Dielectric and ferroelectric properties of Perovskite Pb(Zr, Ti)O3 films deposited by sputtering on Si substrate Vélu, G.
1999
100-101 2 p. 241-250
10 p.
artikel
789 Dielectric characterization of ferroelectric thin films deposited on silicon Legrand, C.
1999
100-101 2 p. 251-256
6 p.
artikel
790 Dielectric dispersion and polarization effects in thin transition metal oxide films 1978
100-101 2 p. 264-
1 p.
artikel
791 Dielectric isolation techniques for integrated circuits Bosnell, J.R.
1976
100-101 2 p. 113-122
10 p.
artikel
792 Dielectric properties of thin films 1963
100-101 2 p. 160-
1 p.
artikel
793 Dielectric Properties of thin insulating films of photoresist material 1966
100-101 2 p. 189-
1 p.
artikel
794 Dielectric thin films through rf sputtering 1967
100-101 2 p. 204-
1 p.
artikel
795 Different chip interconnecting techniques 1981
100-101 2 p. 282-
1 p.
artikel
796 Differential amplifier grown in silicon block 1963
100-101 2 p. 159-
1 p.
artikel
797 Differing product-safety needs needn't bar universal designs 1983
100-101 2 p. 400-
1 p.
artikel
798 Diffusion and reactions in gold films 1983
100-101 2 p. 404-
1 p.
artikel
799 Diffusion of boron in silicon 1969
100-101 2 p. 150-
1 p.
artikel
800 Diffusion of boron into silicon from doped oxide source 1981
100-101 2 p. 284-
1 p.
artikel
801 Diffusion of phosphorus into silicon using phosphine gas as a source 1976
100-101 2 p. 107-
1 p.
artikel
802 4510439 Digital circuit multi-test system with automatic setting of test pulse levels Roth, Rolf
1986
100-101 2 p. 397-
1 p.
artikel
803 Digital-IC models for computer-aided design. Part 2: TTL flip-flops 1974
100-101 2 p. 77-
1 p.
artikel
804 Digital image correlation for solder joint fatigue reliability in microelectronics packages Sun, Yaofeng
2008
100-101 2 p. 310-318
9 p.
artikel
805 Direct current conductivity in amorphous semiconductors 1973
100-101 2 p. 96-
1 p.
artikel
806 Direct exposure of photoresist by projection 1969
100-101 2 p. 159-
1 p.
artikel
807 Direct mounting of chip carriers on printed wiring board 1983
100-101 2 p. 400-
1 p.
artikel
808 Direct thickness measurement in lapping process 1985
100-101 2 p. 394-
1 p.
artikel
809 Direct-write pyrolytic laser deposition 1987
100-101 2 p. 392-
1 p.
artikel
810 Discharge sputtering 1973
100-101 2 p. 100-101
2 p.
artikel
811 Discrete renewal processes 1972
100-101 2 p. 115-
1 p.
artikel
812 Discussing complementary MOS 1973
100-101 2 p. 91-
1 p.
artikel
813 Discussion of “optimization by Integer programming of constrained reliability problems with several modes of failure” 1983
100-101 2 p. 396-
1 p.
artikel
814 Distributed circuit design 1965
100-101 2 p. 224-
1 p.
artikel
815 Distribution function relaxation times in gallium arsenide 1978
100-101 2 p. 259-
1 p.
artikel
816 Distribution of a random variable defined through a constitutive equation Ferris-Prabhu, A.V.
1976
100-101 2 p. 153-157
5 p.
artikel
817 Distribution of time to non-availability of a reliability system 1974
100-101 2 p. 77-
1 p.
artikel
818 Dominating the maximum likelihood estimator in predicting reliability Jaisingh, Lloyd R.
1987
100-101 2 p. 345-350
6 p.
artikel
819 Doping solids with ions 1969
100-101 2 p. 160-
1 p.
artikel
820 Double diffused MOSFETs 1974
100-101 2 p. 79-
1 p.
artikel
821 Double-implanted subvolt JFETs 1983
100-101 2 p. 401-
1 p.
artikel
822 Downtime of the service station in M/G/1 queueing system with repairable service station Tang, Ying Hui
1996
100-101 2 p. 199-202
4 p.
artikel
823 Drainage ratio impact on void creation in gold interconnect Littleton, Dave
2011
100-101 2 p. 240-245
6 p.
artikel
824 Drift velocities of carriers in degenerate semiconductors 1976
100-101 2 p. 107-
1 p.
artikel
825 Dual RF diode/DC magnetron sputtered aluminum alloy films for VLSI 1983
100-101 2 p. 404-
1 p.
artikel
826 Dynamic environment factors in determining electronic assembly reliability Fiderer, Leo
1975
100-101 2 p. 173-193
21 p.
artikel
827 Dynamic mechanism reliability by Monte Carlo methods 1968
100-101 2 p. 161-
1 p.
artikel
828 Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages Wu, Y.P.
2004
100-101 2 p. 295-302
8 p.
artikel
829 Dynamic testing of integrated circuits 1972
100-101 2 p. 116-
1 p.
artikel
830 4739258 Dynamic testing of thin-film conductor Schwarz, JamesA
1989
100-101 2 p. 286-
1 p.
artikel
831 4598308 Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die James, ChristopherD
1987
100-101 2 p. 395-
1 p.
artikel
832 E-beam systems arrive, flexible circuits fluorish 1978
100-101 2 p. 267-
1 p.
artikel
833 Economical failure analysis for microprocessors 1981
100-101 2 p. 280-
1 p.
artikel
834 Economic considerations in inspection for lot acceptance 1977
100-101 2 p. 115-
1 p.
artikel
835 Edge acuity and resolution in positive type photoresist systems 1978
100-101 2 p. 256-
1 p.
artikel
836 Edge emissions of ion-implanted CdS 1978
100-101 2 p. 268-
1 p.
artikel
837 Editorial 1998
100-101 2 p. iii-iv
nvt p.
artikel
838 Editorial 1999
100-101 2 p. 159-
1 p.
artikel
839 Editorial Ryerson, Clifford M
1982
100-101 2 p. 145-
1 p.
artikel
840 Editorial Dummer, G.W.A.
1969
100-101 2 p. 79-
1 p.
artikel
841 Editorial Ersland, Peter
2011
100-101 2 p. 187-
1 p.
artikel
842 Editorial Ersland, Peter
2014
100-101 2 p. 341
artikel
843 Editor's note 1971
100-101 2 p. i-
1 p.
artikel
844 Educational needs for reliability and maintainability Harris, A.P.
1975
100-101 2 p. 233-237
5 p.
artikel
845 Education in reliability engineering de Souza, Alban A.P.
1975
100-101 2 p. 215-216
2 p.
artikel
846 Effective mass and intrinsic concentration in silicon 1968
100-101 2 p. 166-
1 p.
artikel
847 Effective method for evaluation of semiconductor laser quality Li, Hongyan
2000
100-101 2 p. 333-337
5 p.
artikel
848 Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning Heo, W.
2012
100-101 2 p. 412-417
6 p.
artikel
849 Effect of autoclave test on anisotropic conductive joints Tan, C.W.
2003
100-101 2 p. 279-285
7 p.
artikel
850 Effect of diffused oxygen and gold on surface properties of oxidized silicon 1968
100-101 2 p. 164-165
2 p.
artikel
851 Effect of drain voltage on channel temperature and reliability of pseudomorphic InP-based HEMTs Dammann, M.
2000
100-101 2 p. 287-291
5 p.
artikel
852 Effect of electron irradiation on lithium-doped silicon 1971
100-101 2 p. 129-
1 p.
artikel
853 Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps Zhao, Qinghua
2013
100-101 2 p. 321-326
6 p.
artikel
854 Effect of ferroelectric polarization on insulated-gate thin-film transistor parameters 1967
100-101 2 p. 204-
1 p.
artikel
855 Effect of firing temperature and glass content on the electrical properties of thick film capacitors 1983
100-101 2 p. 405-
1 p.
artikel
856 Effect of linear emitter recombination on OCVD determination of lifetime in p-i-n diodes 1983
100-101 2 p. 403-
1 p.
artikel
857 Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance Ito, Shinya
2002
100-101 2 p. 201-209
9 p.
artikel
858 Effect of N2O nitridation on the electrical properties of MOS gate oxides Pacelli, A
1998
100-101 2 p. 239-242
4 p.
artikel
859 Effect of planarization on VLSI processing 1987
100-101 2 p. 386-
1 p.
artikel
860 Effect of statistical dependencies in strict consecutive-k-out-of-n:F systems Rushdi, Ali M.
1988
100-101 2 p. 309-318
10 p.
artikel
861 Effect of the discharging and recharging of the stress generated oxide charge in metal–oxide–semiconductor capacitors on the low field leakage current Meinertzhagen, A
1998
100-101 2 p. 221-225
5 p.
artikel
862 Effect of the Model Uniform Product Liability Act in Quality Assurance Jacobs, Richard M
1981
100-101 2 p. 263-268
6 p.
artikel
863 Effect of ytterbium doping on the optical and electrical properties of intrinsic In2O3 thin films Dakhel, A.A.
2010
100-101 2 p. 211-216
6 p.
artikel
864 Effects in Auger electron spectroscopy due to the probing electrons and sputtering 1978
100-101 2 p. 267-
1 p.
artikel
865 Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application Hwang, J.S.
2008
100-101 2 p. 293-299
7 p.
artikel
866 Effects of bulk trapping on the memory characteristics of thick-oxide MNOS variable-threshold capacitors 1974
100-101 2 p. 78-79
2 p.
artikel
867 Effects of different drop test conditions on board-level reliability of chip-scale packages Lai, Yi-Shao
2008
100-101 2 p. 274-281
8 p.
artikel
868 Effects of diffused nickel on the silicon-silicon dioxide interface 1974
100-101 2 p. 81-
1 p.
artikel
869 Effects of diffusion current on characteristics of metal-oxide (insulator)-semiconductor transistors 1967
100-101 2 p. 201-
1 p.
artikel
870 Effects of dislocations in silicon transistors with implanted bases 1978
100-101 2 p. 268-269
2 p.
artikel
871 Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu Kim, K.S.
2003
100-101 2 p. 259-267
9 p.
artikel
872 Effects of grain-boundary trapping-state energy distribution on the activation energy of resistivity of polycrystalline-silicon films 1985
100-101 2 p. 397-
1 p.
artikel
873 Effects of high field stresses on threshold voltage of CMOS transistors Stojadinović, N.
1985
100-101 2 p. 275-279
5 p.
artikel
874 Effects of ionizing radiation on oxidized silicon surfaces and planar devices 1968
100-101 2 p. 165-
1 p.
artikel
875 Effects of latent damage of recrystallization on lead free solder joints Mayyas, Ahmad
2014
100-101 2 p. 447-456
artikel
876 Effects of ‘Latent Damage’ on pad cratering: Reduction in life and a potential change in failure mode Raghavan, Venkatesh Arasanipalai
2013
100-101 2 p. 303-313
11 p.
artikel
877 Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler Kim, Hyomi
2010
100-101 2 p. 258-265
8 p.
artikel
878 Effects of nuclear radiation on a high-reliability silicon power diode three-junction capacitance 1972
100-101 2 p. 121-
1 p.
artikel
879 Effects of process variables on thick-film resistors 1972
100-101 2 p. 122-
1 p.
artikel
880 Effects of temperature on current instabilities caused by recombination centers in semiconductors 1974
100-101 2 p. 80-
1 p.
artikel
881 Effects of temperature on high-frequency transistors 1963
100-101 2 p. 156-
1 p.
artikel
882 Efficiency and programming of automatic artwork generators 1971
100-101 2 p. 125-
1 p.
artikel
883 Efficient silicon compilation of digital control specifications 1987
100-101 2 p. 387-
1 p.
artikel
884 Efforts and outlay made by manufacturers to achieve a high reliability of electronic equipment for military applications 1965
100-101 2 p. 223-
1 p.
artikel
885 Electrical and thermal stability of AuGeNi OHMIC contacts to GaAs fabricated with in situ RF sputter cleaning 1987
100-101 2 p. 388-
1 p.
artikel
886 Electrical characteristics of “B”-implanted p-channel MNOS transistors 1976
100-101 2 p. 110-
1 p.
artikel
887 Electrical characteristics of large scale integration (LSI) MOSFETs at very high temperatures. Part II: experiment 1985
100-101 2 p. 395-
1 p.
artikel
888 Electrical characteristics of large scale integration (LSI) MOSFETs at very high temperatures. Part I; theory 1985
100-101 2 p. 393-
1 p.
artikel
889 Electrical characteristics of large-scale integration silicon MOSFET's at very high temperatures, Part III: modeling and circuit behaviour 1985
100-101 2 p. 387-
1 p.
artikel
890 Electrical characterization of MS and MIS structures on AlGaN/AlN/GaN heterostructures Arslan, Engin
2011
100-101 2 p. 370-375
6 p.
artikel
891 Electrical characterization of packages for high-speed integrated circuits 1987
100-101 2 p. 387-
1 p.
artikel
892 Electrical characterization of ultra-shallow n+p junctions formed by AsH3 plasma immersion implantation Yang, B.L
2000
100-101 2 p. 277-281
5 p.
artikel
893 Electrical contacts: research and reliability 1968
100-101 2 p. 159-
1 p.
artikel
894 4733394 Electrically programmable semiconductor memory showing redundance Giebel, Burkhard
1989
100-101 2 p. 286-
1 p.
artikel
895 Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions Yoon, Jeong-Won
2014
100-101 2 p. 410-416
artikel
896 Electrical properties of evaporated cerium oxide films 1970
100-101 2 p. 125-126
2 p.
artikel
897 Electrical properties of n-type epitaxial films of silicon on sapphire formed by vacuum evaporation 1970
100-101 2 p. 125-
1 p.
artikel
898 Electrical properties of thin RF sputtered Ta2O5 films after constant current stress Pecovska-Gjorgjevich, M.
2003
100-101 2 p. 235-241
7 p.
artikel
899 Electrical properties of uncontaminated PbTe films on Mica substrates prepared by molecular beam deposition 1978
100-101 2 p. 262-263
2 p.
artikel
900 Electrical stress effect on RF power characteristics of SiGe hetero-junction bipolar transistors Huang, Sheng-Yi
2008
100-101 2 p. 193-199
7 p.
artikel
901 Electrical testing for process evaluations Wada, Yasuo
1981
100-101 2 p. 159-163
5 p.
artikel
902 Electrical testing of bare silicon chips prior to hybrid fabrication 1978
100-101 2 p. 263-
1 p.
artikel
903 Electrical transport in thick film resistors 1981
100-101 2 p. 288-
1 p.
artikel
904 Electric breakdowns and breakdown mechanisms in ultra-thin silicon oxides Jackson, J.C
1999
100-101 2 p. 171-179
9 p.
artikel
905 Electric measurement of impurity concentration in p-type epitaxially grown and ion-implanted base regions 1981
100-101 2 p. 291-
1 p.
artikel
906 Electromechanical switching devices—Reliability, life and the relevance of circuit design Leighton, A.G.
1966
100-101 2 p. 161-173
13 p.
artikel
907 Electromigration behavior in Cu/Sn–8Zn–3Bi/Cu solder joint Liu, Lijuan
2010
100-101 2 p. 251-257
7 p.
artikel
908 Electromigration & electronic device degradation Pešić, B.
1997
100-101 2 p. 370-
1 p.
artikel
909 Electromigration in gold-silver alloys 1973
100-101 2 p. 93-
1 p.
artikel
910 Electromigration on oxide steps Wild, Andreas
1988
100-101 2 p. 243-255
13 p.
artikel
911 Electromigration reliability of interconnections in RF low noise amplifier circuit He, Feifei
2012
100-101 2 p. 446-454
9 p.
artikel
912 Electron beam exposure system for integrated circuits Tarui, Y.
1969
100-101 2 p. 101-104
4 p.
artikel
913 Electron beam heating of a thin film on a highly conducting substrate 1968
100-101 2 p. 173-
1 p.
artikel
914 Electron beam induced potential contrast on unbiased planar transistors 1968
100-101 2 p. 173-
1 p.
artikel
915 Electron beam—now a practical LSI production tool 1978
100-101 2 p. 266-
1 p.
artikel
916 Electron-beam resists for lift-off processing with potential application to Josephson integrated circuits 1981
100-101 2 p. 291-
1 p.
artikel
917 Electron-beam system makes masks for integrated circuits 1977
100-101 2 p. 122-
1 p.
artikel
918 Electron beam welding in the manufacture of electronic components 1968
100-101 2 p. 174-
1 p.
artikel
919 Electron current through metal-insulator-metal sandwiches 1964
100-101 2 p. 144-
1 p.
artikel
920 4832250 Electronic circuit board rework and repair system Spigarelli, Donald
1990
100-101 2 p. i-
1 p.
artikel
921 Electronic engineering in 1973 1963
100-101 2 p. 158-
1 p.
artikel
922 Electronic interconnection at room temperature with gallium alloy 1966
100-101 2 p. 181-
1 p.
artikel
923 Electronic system reliability—an American viewpoint 1964
100-101 2 p. 139-
1 p.
artikel
924 Electron microprobe analysis of HgTe thin films 1972
100-101 2 p. 122-
1 p.
artikel
925 Electron mobilities in organic semiconductors 1964
100-101 2 p. 145-
1 p.
artikel
926 Electron scattering mechanisms in n-type epitaxial GaP 1967
100-101 2 p. 199-200
2 p.
artikel
927 Electron-sensitive film-forming materials and their uses in semiconductor technology 1977
100-101 2 p. 117-
1 p.
artikel
928 Electron transport mechanism of tungsten trioxide powder thin film studied by investigating effect of annealing on resistivity Li, Wei
2015
100-101 2 p. 407-410
4 p.
artikel
929 Electron trapping levels in silicon dioxide thermally grown on silicon 1973
100-101 2 p. 97-
1 p.
artikel
930 Electron trapping noise in SOS MOS field-effect transistors operated in the linear region 1978
100-101 2 p. 258-
1 p.
artikel
931 Electron traps created in gate oxides by Fowler–Nordheim injections Auriel, G.
1998
100-101 2 p. 227-231
5 p.
artikel
932 Electrostatic discharge (ESD) protection of N-type silicon controlled rectifier with P-type MOSFET pass structure for high voltage operating I/O application Kim, Kil-Ho
2013
100-101 2 p. 205-207
3 p.
artikel
933 Electrostatic discharge failure mechanisms and models 1983
100-101 2 p. 395-
1 p.
artikel
934 Encapsulation of high reliability devices 1974
100-101 2 p. 76-
1 p.
artikel
935 Endpoint detection in a batch loaded planar etcher 1983
100-101 2 p. 398-
1 p.
artikel
936 Engineering reliability management Dhillon, Balbir S.
1983
100-101 2 p. 215-234
20 p.
artikel
937 Engineering reliability: New techniques and applications G.W.A.D,
1982
100-101 2 p. 316-317
2 p.
artikel
938 English-Russian dictionary of reliability and quality control G.W.A.D.,
1977
100-101 2 p. 125-
1 p.
artikel
939 Entretien du matériel d'électronique et fiabilité Guyot, C.
1965
100-101 2 p. 145-155
11 p.
artikel
940 Environmental factors governing field reliability of plastic transistors and integrated circuits 1973
100-101 2 p. 88-
1 p.
artikel
941 Environmental stress screening (ESS) demonstrate its value in the field 1987
100-101 2 p. 383-
1 p.
artikel
942 Environmental testing of electronic components—part 1 1967
100-101 2 p. 193-
1 p.
artikel
943 Environmental testing of electronic components—part 2 1967
100-101 2 p. 192-
1 p.
artikel
944 EPIC: a cost-effective plastic chip carrier for VLSI packaging 1987
100-101 2 p. 385-
1 p.
artikel
945 Epitaxial films produced on germanium and silicon surfaces by the vacuum deposition of silver 1965
100-101 2 p. 226-
1 p.
artikel
946 Epitaxial growth and growth defects 1969
100-101 2 p. 152-
1 p.
artikel
947 Epitaxial growth of silicon from SiH4 in the temperature range 800–1150°C 1973
100-101 2 p. 96-
1 p.
artikel
948 Epitaxial silicon for bipolar integrated circuits 1985
100-101 2 p. 393-394
2 p.
artikel
949 Epitaxial vapor growth of crystal Ge 1963
100-101 2 p. 158-
1 p.
artikel
950 Epoxy bonding in hybrid microelectronic circuits 1977
100-101 2 p. 121-122
2 p.
artikel
951 Equipment and methods for simulating ambient conditions 1965
100-101 2 p. 221-
1 p.
artikel
952 Equipment availability and logistic principles 1978
100-101 2 p. 254-
1 p.
artikel
953 Equipment designer's approach to packaging of hybrid microcircuits 1971
100-101 2 p. 131-
1 p.
artikel
954 Equipment reliability 1963
100-101 2 p. 155-
1 p.
artikel
955 Equipment reliability and the environment Harris, J.
1970
100-101 2 p. 145-152
8 p.
artikel
956 Erratum 1997
100-101 2 p. 379-
1 p.
artikel
957 Erratum 1988
100-101 2 p. 333-
1 p.
artikel
958 Erratum 1989
100-101 2 p. 295-
1 p.
artikel
959 Error analysis in sampling theory 1967
100-101 2 p. 191-
1 p.
artikel
960 4612640 Error checking and correction circuitry for use with an electrically-programmable and electrically-erasable memory array Mehrotra, Sanja
1987
100-101 2 p. 396-397
2 p.
artikel
961 Error data logger 1972
100-101 2 p. 114-
1 p.
artikel
962 Error propagation analysis using FPGA-based SEU-fault injection Ejlali, Alireza
2008
100-101 2 p. 319-328
10 p.
artikel
963 Errors in life prediction due to temperature inaccuracies Stanley, I.W
1981
100-101 2 p. 173-174
2 p.
artikel
964 ESD–RF co-design methodology for the state of the art RF-CMOS blocks Vassilev, V.
2005
100-101 2 p. 255-268
14 p.
artikel
965 ESD SPICE model and measurements for a hard disk drive Wallash, Al
2005
100-101 2 p. 305-311
7 p.
artikel
966 Estimating activation energies for multi-mode failures Nappa, Dario
2014
100-101 2 p. 349-353
artikel
967 Estimating substrate area and density for hybrid microcircuits 1973
100-101 2 p. 99-100
2 p.
artikel
968 Estimating the optimum position for restoring organs in non-cascaded redundant networks 1970
100-101 2 p. 113-
1 p.
artikel
969 Estimating the reliability of electronic tubes with the aid of truncated life tests 1973
100-101 2 p. 86-
1 p.
artikel
970 Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling Tohmyoh, Hironori
2013
100-101 2 p. 314-320
7 p.
artikel
971 Estimation of reliability for silicon devices irradiated with electrons 1987
100-101 2 p. 392-
1 p.
artikel
972 Estimation of reliability of a component under multiple stresses Ferdous, J.
1995
100-101 2 p. 279-283
5 p.
artikel
973 Estimation of storage of spare replacement/maintainance equipment 1987
100-101 2 p. 382-
1 p.
artikel
974 Estimation of temperature rise in electron beam heating of thin films 1968
100-101 2 p. 174-
1 p.
artikel
975 Estimation of the reliability function using the delay-time models Attia, A.F.
1997
100-101 2 p. 323-327
5 p.
artikel
976 Estimation of total errors in software Islam, M
1982
100-101 2 p. 281-285
5 p.
artikel
977 Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM Cho, Seunghyun
2008
100-101 2 p. 300-309
10 p.
artikel
978 Estimators for parameters of a series system under an attribute life test situation 1977
100-101 2 p. 114-
1 p.
artikel
979 Eutectic bonding semiconductor dice to metallized ceramic substrates 1966
100-101 2 p. 184-185
2 p.
artikel
980 Evaluating ion implanter options 1987
100-101 2 p. 391-
1 p.
artikel
981 Evaluation of component quality for military and space applications 1977
100-101 2 p. 113-
1 p.
artikel
982 Evaluation of conditional failure density from hazard rate 1972
100-101 2 p. 115-
1 p.
artikel
983 Evaluation of film and filmless radiographic systems for the non-destructive testing of thin materials and electronic assemblies 1964
100-101 2 p. 148-
1 p.
artikel
984 Evaluation of materials and processes for integrated microwave circuits 1970
100-101 2 p. 115-
1 p.
artikel
985 Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds Rooney, Daniel T.
2005
100-101 2 p. 379-390
12 p.
artikel
986 Evaporated As2S3—reproduction fidelity for microelectronics 1985
100-101 2 p. 394-
1 p.
artikel
987 Evaporated circuits incorporating a thin film transistor 1963
100-101 2 p. 159-
1 p.
artikel
988 Evaporated integrated microcircuitry for electronic systems Moore, David WM.
1963
100-101 2 p. 129-132
4 p.
artikel
989 Evaporated silicon thin-film transistors 1968
100-101 2 p. 169-170
2 p.
artikel
990 Evaporated single element metal film resistors 1966
100-101 2 p. 188-189
2 p.
artikel
991 Evaporation induced corrosion of YZ-LiNb03 1985
100-101 2 p. 386-
1 p.
artikel
992 Evaporation induced frequency shift in S.A.W. filter 1985
100-101 2 p. 385-
1 p.
artikel
993 Evaporation, sputtering and ion-plating; pros and cons 1974
100-101 2 p. 82-
1 p.
artikel
994 Evolutionary derivation of optimal test sets for neural network based analog and mixed signal circuits fault diagnosis approach Seyyed Mahdavi, S.J.
2009
100-101 2 p. 199-208
10 p.
artikel
995 Excess surface currents in p-n junctions and bipolar transistors 1972
100-101 2 p. 120-
1 p.
artikel
996 Exchange and dipolar fields in phosphorus-doped silicon measured by electron spin echoes 1974
100-101 2 p. 81-
1 p.
artikel
997 Expanding the horizons of optical projection lithography 1983
100-101 2 p. 401-
1 p.
artikel
998 Experience in 3-micron processing: a 10 volt n-well CMOS process 1985
100-101 2 p. 393-
1 p.
artikel
999 Experience relating to the operational reliability of diodes and transistors 1965
100-101 2 p. 221-
1 p.
artikel
1000 Experimental and simulation studies of resistivity in nanoscale copper films Emre Yarimbiyik, A.
2009
100-101 2 p. 127-134
8 p.
artikel
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