| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A bibliography on silicon dioxide films
|
|
|
1977
|
100-101 |
2 |
p. 116-
1 p.
|
artikel
|
| 2 |
A 2-bit highly scalable nonvolatile memory cell with two electrically isolated charge trapping sites
|
Man, Tsz Yin
|
|
2005
|
100-101 |
2 |
p. 349-354
6 p.
|
artikel
|
| 3 |
A case study of statistical process control on the prime process using PLASMASK 302U
|
Arshak, K.I.
|
|
1995
|
100-101 |
2 |
p. 209-224
16 p.
|
artikel
|
| 4 |
Accelerated ageing of IMPATT diodes
|
Sinnadurai, F.N
|
|
1981
|
100-101 |
2 |
p. 209-219
11 p.
|
artikel
|
| 5 |
Accelerated electrical testing for improved device reliability
|
|
|
1978
|
100-101 |
2 |
p. 253-
1 p.
|
artikel
|
| 6 |
Accelerated hot electron effects in DRAMs
|
Yuliasto, Tony T.
|
|
1994
|
100-101 |
2 |
p. 197-200
4 p.
|
artikel
|
| 7 |
Accelerated testing for failures of tantalum capacitors
|
Virkki, J.
|
|
2010
|
100-101 |
2 |
p. 217-219
3 p.
|
artikel
|
| 8 |
Accelerated testing of class A CMOS integrated circuits
|
|
|
1978
|
100-101 |
2 |
p. 252-
1 p.
|
artikel
|
| 9 |
Accelerated test procedures for semiconductor components
|
|
|
1978
|
100-101 |
2 |
p. 252-
1 p.
|
artikel
|
| 10 |
Acceleration factor for ageing measurement of dye solar cells
|
Ciammaruchi, Laura
|
|
2013
|
100-101 |
2 |
p. 279-281
3 p.
|
artikel
|
| 11 |
Accurate measurement of the work function of electron-hole drops in germanium
|
|
|
1974
|
100-101 |
2 |
p. 81-
1 p.
|
artikel
|
| 12 |
AC electrical properties of magnesium and aluminium fluoride thin films
|
|
|
1978
|
100-101 |
2 |
p. 264-
1 p.
|
artikel
|
| 13 |
A chaos based revitalization of large reliability knowledge bases
|
Dohnal, M.
|
|
1993
|
100-101 |
2 |
p. 259-265
7 p.
|
artikel
|
| 14 |
A characteristic analysis of high-speed integrated circuit chip based on laser probe
|
Xiaojian, Tian
|
|
2000
|
100-101 |
2 |
p. 329-332
4 p.
|
artikel
|
| 15 |
Achieving maintainability by random fault injection
|
|
|
1983
|
100-101 |
2 |
p. 396-
1 p.
|
artikel
|
| 16 |
A closed loop system for reliability improvement
|
|
|
1987
|
100-101 |
2 |
p. 382-
1 p.
|
artikel
|
| 17 |
A comparative glossary of semiconductor devices
|
|
|
1968
|
100-101 |
2 |
p. 163-
1 p.
|
artikel
|
| 18 |
A comparison of early stage hot carrier degradation behaviour in 5 and 3 V sub-micron low doped drain metal oxide semiconductor field effect transistors
|
De Souza, M.M.
|
|
2001
|
100-101 |
2 |
p. 169-177
9 p.
|
artikel
|
| 19 |
A comparison of GaAs and Si processing technology
|
|
|
1983
|
100-101 |
2 |
p. 400-
1 p.
|
artikel
|
| 20 |
A comparison of MOS processes for VLSI. Part I
|
|
|
1985
|
100-101 |
2 |
p. 395-
1 p.
|
artikel
|
| 21 |
A comparison of semiconductor devices for high-speed logic
|
|
|
1983
|
100-101 |
2 |
p. 400-
1 p.
|
artikel
|
| 22 |
A comparison of silver halide systems as applied to today's advanced semiconductor requirements
|
|
|
1983
|
100-101 |
2 |
p. 401-
1 p.
|
artikel
|
| 23 |
A comparison of some optical microscope measurements of photomask linewidths
|
|
|
1978
|
100-101 |
2 |
p. 255-
1 p.
|
artikel
|
| 24 |
A comparison of the strength of alumina substrates for different separation techniques
|
|
|
1973
|
100-101 |
2 |
p. 93-
1 p.
|
artikel
|
| 25 |
A compatible technique for the formation of thin tantalum film resistors on silicon integrated circuits
|
|
|
1967
|
100-101 |
2 |
p. 200-201
2 p.
|
artikel
|
| 26 |
A complex two-unit parallel system
|
Subramanian, R
|
|
1981
|
100-101 |
2 |
p. 273-275
3 p.
|
artikel
|
| 27 |
A complex two-unit system with random breakdown of repair facility
|
Gururajan, M.
|
|
1995
|
100-101 |
2 |
p. 299-302
4 p.
|
artikel
|
| 28 |
A computer-aided technique for fault detection in combinational circuits
|
Rai, Suresh
|
|
1987
|
100-101 |
2 |
p. 263-265
3 p.
|
artikel
|
| 29 |
A computer algorithm for the analysis of maintained standby redundant systems
|
Kumar, Ashok
|
|
1981
|
100-101 |
2 |
p. 175-182
8 p.
|
artikel
|
| 30 |
A computerized approach to simulating system effectiveness
|
|
|
1972
|
100-101 |
2 |
p. 114-
1 p.
|
artikel
|
| 31 |
A computer model for integrated circuit transistors including substrate interactions
|
|
|
1969
|
100-101 |
2 |
p. 150-151
2 p.
|
artikel
|
| 32 |
A conduction-cooled module for high-performance LSI devices
|
|
|
1983
|
100-101 |
2 |
p. 402-
1 p.
|
artikel
|
| 33 |
A consideration on design of thin-film integrated circuits
|
|
|
1971
|
100-101 |
2 |
p. 131-
1 p.
|
artikel
|
| 34 |
Acquisition of reliability statements
|
|
|
1976
|
100-101 |
2 |
p. 101-
1 p.
|
artikel
|
| 35 |
A critical evaluation of tantalum nitride thin film resistors
|
|
|
1965
|
100-101 |
2 |
p. 229-
1 p.
|
artikel
|
| 36 |
Active and passive components for attachment to thick film circuits
|
|
|
1969
|
100-101 |
2 |
p. 155-
1 p.
|
artikel
|
| 37 |
Active circuit trimming with abrasives
|
|
|
1972
|
100-101 |
2 |
p. 117-
1 p.
|
artikel
|
| 38 |
Active filters get more of the action
|
|
|
1973
|
100-101 |
2 |
p. 91-
1 p.
|
artikel
|
| 39 |
Active filters: part 8. Positive results from negative feedback
|
|
|
1970
|
100-101 |
2 |
p. 120-
1 p.
|
artikel
|
| 40 |
A data base management (DBMP) program for integrated logistics support (ILS)
|
Christensen, A.
|
|
1975
|
100-101 |
2 |
p. 73-89
17 p.
|
artikel
|
| 41 |
Address generators for linear systolic array
|
Stojčev, M.K.
|
|
2010
|
100-101 |
2 |
p. 292-303
12 p.
|
artikel
|
| 42 |
A decomposition technique for the overall reliability evaluation of large computer communication networks
|
Mandaltsis, D.
|
|
1987
|
100-101 |
2 |
p. 299-312
14 p.
|
artikel
|
| 43 |
ADEE grows with automation trend
|
|
|
1987
|
100-101 |
2 |
p. 383-
1 p.
|
artikel
|
| 44 |
A depletion load self-aligned technology
|
|
|
1974
|
100-101 |
2 |
p. 79-
1 p.
|
artikel
|
| 45 |
4612805 Adhesion characterization test site
|
Bruce, JamesA
|
|
1987
|
100-101 |
2 |
p. 397-
1 p.
|
artikel
|
| 46 |
Adhesion of thin film circuits
|
|
|
1981
|
100-101 |
2 |
p. 287-
1 p.
|
artikel
|
| 47 |
A digital thin-film deposition rate meter
|
|
|
1969
|
100-101 |
2 |
p. 153-154
2 p.
|
artikel
|
| 48 |
Adjusting of tantalum thin-film resistors
|
|
|
1972
|
100-101 |
2 |
p. 123-
1 p.
|
artikel
|
| 49 |
Admissibility of a conditionally specified test procedure for time censored life data
|
Johri, S.K.
|
|
1993
|
100-101 |
2 |
p. 271-272
2 p.
|
artikel
|
| 50 |
Adsorption effects on ESR and conductance of rf sputtered a-Si films
|
|
|
1981
|
100-101 |
2 |
p. 288-
1 p.
|
artikel
|
| 51 |
A dual-gate GaAs FET RF power limiter
|
|
|
1978
|
100-101 |
2 |
p. 257-
1 p.
|
artikel
|
| 52 |
Advanced modeling of silicon oxidation
|
Wolters, D.R
|
|
1998
|
100-101 |
2 |
p. 259-264
6 p.
|
artikel
|
| 53 |
Advanced rail clamp networks for ESD protection
|
Stockinger, Michael
|
|
2005
|
100-101 |
2 |
p. 211-222
12 p.
|
artikel
|
| 54 |
Advanced thin-film capacitor processes
|
|
|
1967
|
100-101 |
2 |
p. 204-
1 p.
|
artikel
|
| 55 |
Advance materials in microminiaturization and optical communication
|
|
|
1967
|
100-101 |
2 |
p. 195-
1 p.
|
artikel
|
| 56 |
Advances in dichlorosilane epitaxial technology
|
|
|
1973
|
100-101 |
2 |
p. 98-
1 p.
|
artikel
|
| 57 |
Advances in diffusion furnaces for processing large diameter wafers
|
|
|
1969
|
100-101 |
2 |
p. 150-
1 p.
|
artikel
|
| 58 |
Advances in ESD protection for ICs
|
Vassilev, Vesselin
|
|
2013
|
100-101 |
2 |
p. 183-
1 p.
|
artikel
|
| 59 |
Advances in GaAs ICs highlighted
|
|
|
1983
|
100-101 |
2 |
p. 398-
1 p.
|
artikel
|
| 60 |
Advances in III–V and II–VI semiconductor compounds
|
|
|
1965
|
100-101 |
2 |
p. 227-
1 p.
|
artikel
|
| 61 |
Advances in ion implantation production equipment
|
|
|
1976
|
100-101 |
2 |
p. 110-
1 p.
|
artikel
|
| 62 |
Advances in microelectronics
|
Stojadinović, N.D.
|
|
1984
|
100-101 |
2 |
p. 201-203
3 p.
|
artikel
|
| 63 |
Advances in microminiaturization
|
|
|
1963
|
100-101 |
2 |
p. 158-
1 p.
|
artikel
|
| 64 |
Advances in SiC power MOSFET technology
|
Dimitrijev, Sima
|
|
2003
|
100-101 |
2 |
p. 225-233
9 p.
|
artikel
|
| 65 |
Advances in the drop-impact reliability of solder joints for mobile applications
|
Wong, E.H.
|
|
2009
|
100-101 |
2 |
p. 139-149
11 p.
|
artikel
|
| 66 |
Advances in the thick-film compositions
|
Hille-Dahl, W.A.
|
|
1968
|
100-101 |
2 |
p. 113-116
4 p.
|
artikel
|
| 67 |
Advances in VLSI plasma etching
|
|
|
1983
|
100-101 |
2 |
p. 399-
1 p.
|
artikel
|
| 68 |
Aerospace mechanical reliability practise
|
|
|
1983
|
100-101 |
2 |
p. 396-
1 p.
|
artikel
|
| 69 |
AES investigations of the interface between substrate and chromium films prepared by evaporation and ion plating
|
|
|
1978
|
100-101 |
2 |
p. 267-
1 p.
|
artikel
|
| 70 |
A fast method for redundancy allocation
|
|
|
1974
|
100-101 |
2 |
p. 77-
1 p.
|
artikel
|
| 71 |
A fault model for multivalued NMOS dynamic random access memories
|
Venkatapathi Naidu, R.
|
|
1989
|
100-101 |
2 |
p. 137-143
7 p.
|
artikel
|
| 72 |
A first-order kinetics ageing model for the hot-carrier stress of high-voltage MOSFETs
|
Alagi, F.
|
|
2011
|
100-101 |
2 |
p. 321-325
5 p.
|
artikel
|
| 73 |
Ageing characteristics of field effect thin film active devices
|
|
|
1965
|
100-101 |
2 |
p. 230-
1 p.
|
artikel
|
| 74 |
Ageing defect detection on IGBT power modules by artificial training methods based on pattern recognition
|
Oukaour, A.
|
|
2011
|
100-101 |
2 |
p. 386-391
6 p.
|
artikel
|
| 75 |
Ageing tests on gold layers and bonded contacts
|
|
|
1978
|
100-101 |
2 |
p. 264-
1 p.
|
artikel
|
| 76 |
A generalized model for the lifetime of microelectronic components, applied to storage conditions
|
Wise, Loren J
|
|
2001
|
100-101 |
2 |
p. 317-322
6 p.
|
artikel
|
| 77 |
Age replacement with leadtime
|
|
|
1977
|
100-101 |
2 |
p. 114-
1 p.
|
artikel
|
| 78 |
Aging degradation of a Gunn Diode due to induced dislocations
|
|
|
1976
|
100-101 |
2 |
p. 101-
1 p.
|
artikel
|
| 79 |
Aging degradation of Ni and NiCr-Ni thin film conductor systems
|
|
|
1983
|
100-101 |
2 |
p. 405-
1 p.
|
artikel
|
| 80 |
A graphical method for optimal reliability allocation
|
Agarwala, R.A.
|
|
1983
|
100-101 |
2 |
p. 373-377
5 p.
|
artikel
|
| 81 |
A gyrator suitable for monolithic, bipolar construction
|
|
|
1971
|
100-101 |
2 |
p. 127-
1 p.
|
artikel
|
| 82 |
A health indicator method for degradation detection of electronic products
|
Kumar, Sachin
|
|
2012
|
100-101 |
2 |
p. 439-445
7 p.
|
artikel
|
| 83 |
A heuristic method for optimum redundancy allocation in non-coherent systems
|
|
|
1985
|
100-101 |
2 |
p. 391-
1 p.
|
artikel
|
| 84 |
A hierarchical defect repair approach for hybrid nano/CMOS memory reliability enhancement
|
Habibi, Mehdi
|
|
2014
|
100-101 |
2 |
p. 475-484
|
artikel
|
| 85 |
A high-performance lateral geometry transistor for complementary integrated circuits
|
|
|
1968
|
100-101 |
2 |
p. 172-
1 p.
|
artikel
|
| 86 |
A high precision alignment device
|
|
|
1969
|
100-101 |
2 |
p. 159-
1 p.
|
artikel
|
| 87 |
A high voltage, high performance thick film resistor system
|
|
|
1978
|
100-101 |
2 |
p. 265-
1 p.
|
artikel
|
| 88 |
A history of microelectronics development at the Royal Radar Establishment
|
Dummer, G.W.A.
|
|
1965
|
100-101 |
2 |
p. 193-196
4 p.
|
artikel
|
| 89 |
A hybrid approach to integrated circuits
|
|
|
1965
|
100-101 |
2 |
p. 225-
1 p.
|
artikel
|
| 90 |
Airborne particle monitoring approaches 0.1 μm
|
|
|
1987
|
100-101 |
2 |
p. 387-
1 p.
|
artikel
|
| 91 |
Airborne-particle monitoring know-how
|
|
|
1983
|
100-101 |
2 |
p. 400-
1 p.
|
artikel
|
| 92 |
Aircraft maintenance costs reduced by Jet-engine vibration monitor
|
|
|
1964
|
100-101 |
2 |
p. 139-
1 p.
|
artikel
|
| 93 |
Air-gap isolated microcircuits-beam-lead devices
|
|
|
1970
|
100-101 |
2 |
p. 117-
1 p.
|
artikel
|
| 94 |
A Kolmogorov - Smirnov goodness-of-fit test for the two-parameter weibull distribution when the parameters are estimated from the data
|
Parsons, F.G
|
|
1982
|
100-101 |
2 |
p. 163-167
5 p.
|
artikel
|
| 95 |
A k-out-of-N:G redundant system with dependent failure rates and common-cause failures
|
Who Kee Chung,
|
|
1988
|
100-101 |
2 |
p. 201-203
3 p.
|
artikel
|
| 96 |
A laboratory for the development of micromodules
|
|
|
1964
|
100-101 |
2 |
p. 142-
1 p.
|
artikel
|
| 97 |
AlGaN/GaN HEMT device reliability and degradation evolution: Importance of diffusion processes
|
Kuball, Martin
|
|
2011
|
100-101 |
2 |
p. 195-200
6 p.
|
artikel
|
| 98 |
AlGaN/GaN High Electron Mobility Transistor degradation under on- and off-state stress
|
Douglas, E.A.
|
|
2011
|
100-101 |
2 |
p. 207-211
5 p.
|
artikel
|
| 99 |
Algorithm for reliability evaluation of a reducible network
|
|
|
1977
|
100-101 |
2 |
p. 114-
1 p.
|
artikel
|
| 100 |
Algorithms for solving reliability models of systems exposed to a two-state environment
|
|
|
1976
|
100-101 |
2 |
p. 103-
1 p.
|
artikel
|
| 101 |
A life cycle costing methodology for the assessment of process heat generation by solar energy
|
|
|
1985
|
100-101 |
2 |
p. 389-
1 p.
|
artikel
|
| 102 |
All-digital thermal distribution measurement on field programmable gate array using ring oscillators
|
Yue, Yuan
|
|
2015
|
100-101 |
2 |
p. 396-401
6 p.
|
artikel
|
| 103 |
Allowable power in NiCr film resistors
|
|
|
1983
|
100-101 |
2 |
p. 405-
1 p.
|
artikel
|
| 104 |
A low-frequency noise model for advanced gate-stack MOSFETs
|
Çelik-Butler, Zeynep
|
|
2009
|
100-101 |
2 |
p. 103-112
10 p.
|
artikel
|
| 105 |
A low-power circuit block for digital telephone exchanges
|
Kasperkovitz, D.
|
|
1976
|
100-101 |
2 |
p. 163-170
8 p.
|
artikel
|
| 106 |
Al surface morphology effect on flip-chip solder bump shear strength
|
Wai Ching Yau, Esther
|
|
2004
|
100-101 |
2 |
p. 323-331
9 p.
|
artikel
|
| 107 |
Alumina substrates for thick-film circuits
|
Waterfield, B.C.
|
|
1968
|
100-101 |
2 |
p. 117-119
3 p.
|
artikel
|
| 108 |
Aluminum interconnections and beam leads on polyimide-coated copper substrates
|
|
|
1973
|
100-101 |
2 |
p. 94-
1 p.
|
artikel
|
| 109 |
A major step in power hybrids
|
|
|
1972
|
100-101 |
2 |
p. 118-
1 p.
|
artikel
|
| 110 |
A memory-effective fast algorithm for computing the reliability of complex systems/networks
|
Rueger, W.J.
|
|
1987
|
100-101 |
2 |
p. 273-277
5 p.
|
artikel
|
| 111 |
A method for computing complex system reliability
|
|
|
1973
|
100-101 |
2 |
p. 90-
1 p.
|
artikel
|
| 112 |
A method for testing and bonding beam-lead devices
|
|
|
1971
|
100-101 |
2 |
p. 125-
1 p.
|
artikel
|
| 113 |
A method of measuring thicknesses and doping profiles of homoepitaxial thin (from 0.1 μm on) films of silicon and gallium arsenide
|
|
|
1976
|
100-101 |
2 |
p. 106-107
2 p.
|
artikel
|
| 114 |
A method of redundancy allocation
|
|
|
1974
|
100-101 |
2 |
p. 77-
1 p.
|
artikel
|
| 115 |
A method of studying thermocompression bonding damage in GaAs using the SEM
|
|
|
1976
|
100-101 |
2 |
p. 105-
1 p.
|
artikel
|
| 116 |
A method to solve fuzzy reliability optimization problem
|
Utkin, Lev V.
|
|
1995
|
100-101 |
2 |
p. 171-181
11 p.
|
artikel
|
| 117 |
A microelectronic laboratory for universities
|
|
|
1967
|
100-101 |
2 |
p. 197-
1 p.
|
artikel
|
| 118 |
A minimal capacitor cascade synthesis for integrated circuits
|
Newcomb, R.W.
|
|
1967
|
100-101 |
2 |
p. 113-124
12 p.
|
artikel
|
| 119 |
A mixed poisson model and its application to attribute testing data
|
Xie, W.
|
|
1996
|
100-101 |
2 |
p. 133-140
8 p.
|
artikel
|
| 120 |
A model for doped-oxide-source diffusion with a chemical reaction at the silicon-silicon dioxide interface
|
|
|
1977
|
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Analysis of a 2-unit (dissimilar) repairable system subject to slow switch
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A new band-reject filter configuration of three-layer thin-film exponential R-C-KR micro-system
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A new method to extract diode parameters under the presence of parasitic series and shunt resistance
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ANN based CMOS ASIC design for improved temperature-drift compensation of piezoresistive micro-machined high resolution pressure sensor
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A physical model for the dependence of carrier lifetime on doping density in nondegenerate silicon
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A physical model on electron mobility in InGaAs nMOSFETs with stacked gate dielectric
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4736108 Apparatus and method for testing coplanarity of semiconductor components
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4733172 Apparatus for testing I.C. chip
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Application of Low-Power current mode logic
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Application of Machine Model ESD tester to high volume capacitor reliability testing
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Applications of ion implantation in semiconductor processing
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Applications of microelectronics to aerospace equipment
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Applied statistics
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A practical approach to printed wiring repair techniques
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A procedure for the evaluation and failure analysis of MOS memory circuits using the scanning electron microscope in potential contrast mode
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A production reactor for continuous deposition of silicon dioxide
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A profile of activities in reliability studies at the university of Windsor
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A prototype assembly facility for CerDip packaging
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A recommendation for ceramic over plastic IC packages for 1972 real-time commercial computer systems
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A reliability analysis of a k-out-of-N:G redundant system with common-cause failures and critical human errors
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A reliability assessment of bipolar proms
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A reliability failure mode in dynamic MOS circuits—the unopened metal to polysilicon contact window and the floating gate transistor
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Burn-in: a new emphasis
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1983
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Burn-in programs for repairable systems
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1974
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Busy-period analysis of a two-unit warm standby system with inspection time
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1983
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100-101 |
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6 p.
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Cables and accessories: some trends in standardization, rationalization and ratings
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1970
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2 p.
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CAFTA+: a comprehensive fault tree development work station
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1987
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Calculating the S-T up and down distributions of a class of stochastic networks
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Kiu, Sun-Wah
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100-101 |
2 |
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14 p.
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Calculation of the breakdown characteristics of bipolar transistors using a two-dimensional model
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Calendar
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2009
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Calendar
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2010
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Calendar for forthcoming events
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Calendar of international conferences, symposia, lectures and meetings of interest
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Calendar of international conferences, symposia, lectures and meetings of interest
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1997
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1983
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4 p.
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1981
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Calendar of international conferences, symposia, lectures and meetings of interest
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1988
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Calendar of international conferences, symposia, lectures and meetings of interest
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1986
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Calendar of international conferences, symposia, lectures and meetings of interest
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4 p.
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Calendar of international conferences, symposia, lectures and meetings of interest
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1987
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5 p.
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Calendar of international conferences, symposia, lectures and meetings of interest
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5 p.
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1976
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2 p.
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Calendar of international conferences, symposia, lectures and meetings of interest
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4 p.
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Calendar of international conferences, symposia, lectures and meetings of interest
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1973
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2 p.
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1977
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2 p.
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Calendar of international conferences, symposia, lectures and meetings of interest
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1972
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3 p.
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4 p.
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1971
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4 p.
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1974
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2 p.
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Call for papers
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1997
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6 p.
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Calls for papers
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1972
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2 |
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3 p.
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Can plastic encapsulated microcircuits provide reliability with economy?
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1971
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2 |
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Capacitively coupled transmission line pulsing cc-TLP––a traceable and reproducible stress method in the CDM-domain
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Wolf, Heinrich
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2005
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7 p.
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Capacitors compatible with thick film circuit technology
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1969
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2 |
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1 p.
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Capacitors for monolithic integrated circuits
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Capacitors-reliability, life and the relevance of circuit design
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1967
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Capture cross sections of the gold donor and acceptor states in n-type Czochralski silicon
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1983
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2 |
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Carbon in silicon: properties and impact on devices
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2 |
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Carbon Interstitial in electron-irradiated silicon
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2 |
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Case studies of the decreasing failure rate phenomena in mixed populations
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Case study: Root cause of fluorine detection during TiN ARC layer corrosion of AlSiCu metal lines
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7 p.
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Catastrophic events: actual risk versus sociental impact
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Cause-effect alarm failure analysis for nuclear reactor protection system EDM modules
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9 p.
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CDI integrated circuits: the best of MOS and bipolars
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Cermet resistors by reactive sputtering
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Changes in electrical characteristics of AlTi contacts on silicon
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Brezeanu, G.
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7 p.
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Changes in the characteristics of CuInGaSe2 solar cells under light irradiation and during recovery: degradation analysis by the feeble light measuring method
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Yanagisawa, Takeshi
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2002
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5 p.
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Characterisation of emitter/base leakage currents in SiGe HBTs produced using selective epitaxy
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2001
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7 p.
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Characterisation of real surface of silicon by ellipsometry
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Characteristic energy losses of electrons in copper, silver and gold
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Characteristics of broadband parametric amplifiers using filter networks
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Characteristics of silicon doped low-energy ion implantation
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1967
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2 |
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2 p.
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Characteristics of soft metals for electrical connexions
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Taylor, T.C.
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1967
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2 |
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6 p.
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Characteristics of some chromium resistor films
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Characteristic values of ultra high frequency diodes and their measurement (Part I)
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1963
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2 |
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Characterization of film defects in silicon epitaxial wafers
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Characterization of gold-gold thermocompression bonding
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Characterization of oxide etching and wafer cleaning using vapor phase anhydrous hydrofluoric acid and ozone
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6 p.
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Characterization of reaction bonded Au and Ag thick film metallizations
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Characterization of the hot-electron-induced degradation in thin SiO2 gate oxides
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Cartier, E
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Characterizations through failure rate and mean residual life transforms
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Charge storage by irradiation with UV light in non-biased MNOS structures
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Charging control on high energy implanters: A process requirement demonstrated by plasma damage monitoring
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Chemical analyses of thick-film gold conductor inks
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Chemicals for semiconductor processing
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Chemical vapor deposition of inorganic glass films
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Chemical vapor deposition systems for glass passivation of integrated circuits
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Chemical vapor deposition, trends and equipment
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Chemisorption of atomic oxygen on silicon surface
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Chip controls floppy-disk drives
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Chip detects errors in 25 ns
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Chip-package substrate cushions dense, high-speed circuitries
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Choosing logic for microcircuits
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Chrome photoplates can improve both mask and device yields
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Chromium redistribution in ion-implanted GaAs
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Chromium thin film as a barrier to the interaction of Pd2Si with Al
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Circuit applications of field-effect transistors. Part 1. Input circuits
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Circuit board interlayer connexion
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Circuit design boosts 15-V C-MOS process to drive 60-V displays
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4694372 Circuit diagnosis and control device
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Circuit module implements practical self-testing
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Circuit module implements practical self-testing
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Classification of macroscopic defects contained in p-type EFG ribbon silicon
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Classification of reliability tests
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Cleaners and cleaning for components and microelectronics
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Clean rooms: designed to kill
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CLEO lights way to optical ICs
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CMOS3cell library
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C-MOS 256-K RAM with wideband output stands by on microwatts
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C-MOS microprocessor wakes itself up
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C-MOS read-only memory mates with a host of processors
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Cmos reliability: A useful case history to revise extrapolation effectiveness, length and slope of the learning curve
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4590388 CMOS spare decoder circuit
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CMOS—the emerging VLSI technology
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C/MOS unites with silicon gate to yield micropower technology
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Combinatorial methods for the evaluation of yield and operational reliability of fault-tolerant systems-on-chip
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Combined in-circuit and functional tests: Model and application
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Combining vertex decompositions with factoring in an all-terminal network reliability algorithm
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COMCAN—A computer code for common-cause analysis
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Commercial application of thick-film hybrid microelectronic packaging
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Common-cause failures and critical human errors in repairable and non-repairable systems
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Comparative reliability analysis of simplex and redundant systems
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Comparative reliability tests on silicon-planar-switching transistors of european and U.S. manufacture
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Conference report Report of the Fourth Conference of the Israel Society for Quality Assurance
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4465972 Connection arrangement for printed circuit board testing apparatus
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4517659 Constant-distance structure polycellular very large scale integrated circuit
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Deionized water for integrated circuit fabrication
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|
|
1974
|
100-101 |
2 |
p. 78-
1 p.
|
artikel
|
| 714 |
Denser process gets the most out of bipolar VLSI
|
|
|
1985
|
100-101 |
2 |
p. 396-397
2 p.
|
artikel
|
| 715 |
Density functional theory applied to the calculation of dielectric constant of low-k materials
|
Courtot-Descharles, A.
|
|
1999
|
100-101 |
2 |
p. 279-284
6 p.
|
artikel
|
| 716 |
Dependence of hole velocity upon electric field and hole density for p-type silicon
|
|
|
1968
|
100-101 |
2 |
p. 167-
1 p.
|
artikel
|
| 717 |
Dependence of the Au/SnO x /n-LTPS/glass thin film MOS Schottky diode CO gas sensing performances on operating temperature
|
Juang, Feng-Renn
|
|
2012
|
100-101 |
2 |
p. 425-429
5 p.
|
artikel
|
| 718 |
Depletion layer and capacitance calculations for gaussian diffused junctions
|
|
|
1969
|
100-101 |
2 |
p. 151-
1 p.
|
artikel
|
| 719 |
Depletion layer calculations for error function diffused junctions
|
|
|
1970
|
100-101 |
2 |
p. 123-124
2 p.
|
artikel
|
| 720 |
Deposition and monitoring apparatus for preparing passive microcircuits. Part 4
|
|
|
1965
|
100-101 |
2 |
p. 232-
1 p.
|
artikel
|
| 721 |
Deposition and monitoring apparatus for preparing passive microcircuits. Part 3
|
|
|
1965
|
100-101 |
2 |
p. 231-232
2 p.
|
artikel
|
| 722 |
Deposition of ferrite films by sputtering in a glow discharge
|
|
|
1968
|
100-101 |
2 |
p. 168-
1 p.
|
artikel
|
| 723 |
Deposition of germanium films by sputtering
|
|
|
1967
|
100-101 |
2 |
p. 204-
1 p.
|
artikel
|
| 724 |
Deposition of silicon dioxide films by the reaction of SiCl4 or SiHCl3 with water vapour
|
|
|
1968
|
100-101 |
2 |
p. 169-
1 p.
|
artikel
|
| 725 |
Deposition parameter effects on vapour-deposited zinc films
|
|
|
1967
|
100-101 |
2 |
p. 203-
1 p.
|
artikel
|
| 726 |
Description and use of the dynamic memory TMS 4062
|
|
|
1973
|
100-101 |
2 |
p. 96-
1 p.
|
artikel
|
| 727 |
Design and analysis of a fault-tolerant reconfigurable random access memory chip
|
Mehdi, Kamal A.
|
|
1994
|
100-101 |
2 |
p. 297-315
19 p.
|
artikel
|
| 728 |
Design and construction of an automatic transistor testing and sorting machine
|
|
|
1963
|
100-101 |
2 |
p. 156-
1 p.
|
artikel
|
| 729 |
Design and control of a high precision electron beam machine
|
|
|
1968
|
100-101 |
2 |
p. 173-
1 p.
|
artikel
|
| 730 |
Design and development of a 68-lead nonhermetic leaded chip carrier
|
|
|
1981
|
100-101 |
2 |
p. 287-
1 p.
|
artikel
|
| 731 |
Design and fabrication of a thin-film starvation amplifier
|
|
|
1969
|
100-101 |
2 |
p. 154-
1 p.
|
artikel
|
| 732 |
Design and production of hybrid circuit artwork
|
|
|
1981
|
100-101 |
2 |
p. 289-
1 p.
|
artikel
|
| 733 |
Design and use of a laser interferometer for ultrasonic bonding studies
|
|
|
1977
|
100-101 |
2 |
p. 123-
1 p.
|
artikel
|
| 734 |
Design charts for transient response of thin-film networks
|
|
|
1966
|
100-101 |
2 |
p. 188-
1 p.
|
artikel
|
| 735 |
Design error diagnosis in digital circuits with stuck-at fault model
|
Jutman, A.
|
|
2000
|
100-101 |
2 |
p. 307-320
14 p.
|
artikel
|
| 736 |
Designer's check list for reliable, producible transistor circuits
|
|
|
1963
|
100-101 |
2 |
p. 157-
1 p.
|
artikel
|
| 737 |
Designers weigh options for 256-K dynamic-RAM processes
|
|
|
1985
|
100-101 |
2 |
p. 396-
1 p.
|
artikel
|
| 738 |
Design for good matching in multichannel low-noise amplifier for recording neuronal signals in modern neuroscience experiments
|
Dąbrowski, W.
|
|
2004
|
100-101 |
2 |
p. 351-361
11 p.
|
artikel
|
| 739 |
Design for maintainability with particular reference to domestic radio and television receivers
|
|
|
1968
|
100-101 |
2 |
p. 161-
1 p.
|
artikel
|
| 740 |
Designing a burn-in facility
|
|
|
1977
|
100-101 |
2 |
p. 115-
1 p.
|
artikel
|
| 741 |
Designing and manufacturing surface mount assemblies
|
|
|
1987
|
100-101 |
2 |
p. 386-
1 p.
|
artikel
|
| 742 |
Designing a television line flywheel generator using a phase-locked loop integrated circuit
|
|
|
1973
|
100-101 |
2 |
p. 94-95
2 p.
|
artikel
|
| 743 |
Designing considerations for building high-frequency hybrid ICs
|
|
|
1970
|
100-101 |
2 |
p. 118-
1 p.
|
artikel
|
| 744 |
Designing digital equipment with semiconductor networks
|
|
|
1963
|
100-101 |
2 |
p. 159-
1 p.
|
artikel
|
| 745 |
Designing for reliability in the automatic washing machine with a micro-computer
|
|
|
1987
|
100-101 |
2 |
p. 382-
1 p.
|
artikel
|
| 746 |
Designing for testability
|
|
|
1985
|
100-101 |
2 |
p. 393-
1 p.
|
artikel
|
| 747 |
Designing MOS systems for radiation environments
|
|
|
1970
|
100-101 |
2 |
p. 118-
1 p.
|
artikel
|
| 748 |
Designing sequential life test with type I censoring
|
|
|
1987
|
100-101 |
2 |
p. 381-
1 p.
|
artikel
|
| 749 |
Designing with diff-amp and op-amp ICs
|
|
|
1970
|
100-101 |
2 |
p. 117-
1 p.
|
artikel
|
| 750 |
Designing with high power hybrid control circuits
|
|
|
1973
|
100-101 |
2 |
p. 100-
1 p.
|
artikel
|
| 751 |
Designing with nitride-type EAROMs
|
|
|
1978
|
100-101 |
2 |
p. 258-
1 p.
|
artikel
|
| 752 |
Design issues of a three-dimensional packaging scheme for power modules
|
Haque, Shatil
|
|
2001
|
100-101 |
2 |
p. 295-305
11 p.
|
artikel
|
| 753 |
Design limitations in large bipolar PROMs
|
|
|
1981
|
100-101 |
2 |
p. 281-
1 p.
|
artikel
|
| 754 |
Design of adaptive procedures for fault detection and isolation
|
|
|
1972
|
100-101 |
2 |
p. 115-
1 p.
|
artikel
|
| 755 |
Design of a fully CMOS compatible 3-μm size color pixel
|
Langfelder, G.
|
|
2010
|
100-101 |
2 |
p. 169-173
5 p.
|
artikel
|
| 756 |
Design of a 3-micron CMOS cell library
|
|
|
1985
|
100-101 |
2 |
p. 395-
1 p.
|
artikel
|
| 757 |
Design optimization of ESD protection and latchup prevention for a serial I/O IC
|
Huang, Chih-Yao
|
|
2004
|
100-101 |
2 |
p. 213-221
9 p.
|
artikel
|
| 758 |
Design system for semi-custom VLSI circuits
|
|
|
1985
|
100-101 |
2 |
p. 393-
1 p.
|
artikel
|
| 759 |
Design the accidents out of your product!
|
|
|
1971
|
100-101 |
2 |
p. 121-
1 p.
|
artikel
|
| 760 |
Design verification system for large-scale LSI designs
|
|
|
1983
|
100-101 |
2 |
p. 402-
1 p.
|
artikel
|
| 761 |
Destructive reverse breakdown in large area phosphorus diffused high voltage silicon n+p junctions
|
|
|
1968
|
100-101 |
2 |
p. 160-
1 p.
|
artikel
|
| 762 |
Detecting metal particles in semiconductor device housings
|
|
|
1968
|
100-101 |
2 |
p. 160-
1 p.
|
artikel
|
| 763 |
Detection and accelerated testing of vibration-induced connector wear
|
|
|
1985
|
100-101 |
2 |
p. 387-
1 p.
|
artikel
|
| 764 |
Detection and processing of secondary electron signals for pattern re-registration in scanning electron beam exposure
|
|
|
1978
|
100-101 |
2 |
p. 268-
1 p.
|
artikel
|
| 765 |
Determination of all hamiltonian paths and circuits and the minimal feedback set in a graph through Petri nets
|
Hura, G.S.
|
|
1987
|
100-101 |
2 |
p. 223-227
5 p.
|
artikel
|
| 766 |
Determination of impurity distribution profiles in silicon epitaxial wafers
|
|
|
1965
|
100-101 |
2 |
p. 227-
1 p.
|
artikel
|
| 767 |
Determination of optimal overhaul intervals and inspection frequencies—A case study
|
Basker, B.A.
|
|
1978
|
100-101 |
2 |
p. 313-315
3 p.
|
artikel
|
| 768 |
Determination of parts per billion of oxygen in silicon
|
|
|
1971
|
100-101 |
2 |
p. 129-
1 p.
|
artikel
|
| 769 |
Determination of reliability parameters of a digital multiplex frame strategy using Markov chains and a state reduction method
|
|
|
1985
|
100-101 |
2 |
p. 392-
1 p.
|
artikel
|
| 770 |
Determination of stress in films on single crystalline silicon substrates
|
|
|
1966
|
100-101 |
2 |
p. 182-
1 p.
|
artikel
|
| 771 |
Determination of the relative nitrogen doping level of tantalum nitride resistor film by means of the Seebeck effect
|
|
|
1973
|
100-101 |
2 |
p. 99-
1 p.
|
artikel
|
| 772 |
Developing the quality assurance requirements for a custom thin-film circuit program
|
|
|
1968
|
100-101 |
2 |
p. 162-
1 p.
|
artikel
|
| 773 |
Development and production of hybrid circuits for microwave radio links
|
|
|
1978
|
100-101 |
2 |
p. 261-
1 p.
|
artikel
|
| 774 |
Development of a reliability strategy for new IC component family and process
|
Kohoutek, Henry J.
|
|
1983
|
100-101 |
2 |
p. 383-389
7 p.
|
artikel
|
| 775 |
Development of generalized theory of floating-emitter potential based on studies of germanium and silicon transistors
|
|
|
1974
|
100-101 |
2 |
p. 81-
1 p.
|
artikel
|
| 776 |
Development of integrated microwave components for ground-based phased arrays (Electronic steering module)
|
|
|
1970
|
100-101 |
2 |
p. 119-
1 p.
|
artikel
|
| 777 |
Developments in hybrid technology relating to high performance applications
|
|
|
1977
|
100-101 |
2 |
p. 120-
1 p.
|
artikel
|
| 778 |
Developments likely to improve the reliability of plastic encapsulated devices
|
Jones, R.O.
|
|
1978
|
100-101 |
2 |
p. 273-278
6 p.
|
artikel
|
| 779 |
4686606 Device for cooling integrated circuit chip
|
Yamada, Minoru
|
|
1988
|
100-101 |
2 |
p. 327-
1 p.
|
artikel
|
| 780 |
4604572 Device for testing semiconductor devices at a high temperature
|
Horiuchi, Akinor
|
|
1987
|
100-101 |
2 |
p. 395-
1 p.
|
artikel
|
| 781 |
4516072 Device for use in testing printed circuit board components
|
Marpoe, Gary
|
|
1986
|
100-101 |
2 |
p. 401-
1 p.
|
artikel
|
| 782 |
Diagnostic programming: costs and benefits
|
|
|
1983
|
100-101 |
2 |
p. 397-
1 p.
|
artikel
|
| 783 |
Diameter correction factors for the resistivity measurement of semiconductor slices
|
|
|
1963
|
100-101 |
2 |
p. 159-
1 p.
|
artikel
|
| 784 |
Diamond scribers start to give way to laser machines, slurry saws, new etch methods
|
|
|
1971
|
100-101 |
2 |
p. 125-
1 p.
|
artikel
|
| 785 |
Diborane for boron diffusion into silicon
|
|
|
1968
|
100-101 |
2 |
p. 165-
1 p.
|
artikel
|
| 786 |
Die Bonding principles and considerations
|
|
|
1969
|
100-101 |
2 |
p. 158-
1 p.
|
artikel
|
| 787 |
Dielectrically isolated silicon with a sharp impurity gradient
|
|
|
1968
|
100-101 |
2 |
p. 165-
1 p.
|
artikel
|
| 788 |
Dielectric and ferroelectric properties of Perovskite Pb(Zr, Ti)O3 films deposited by sputtering on Si substrate
|
Vélu, G.
|
|
1999
|
100-101 |
2 |
p. 241-250
10 p.
|
artikel
|
| 789 |
Dielectric characterization of ferroelectric thin films deposited on silicon
|
Legrand, C.
|
|
1999
|
100-101 |
2 |
p. 251-256
6 p.
|
artikel
|
| 790 |
Dielectric dispersion and polarization effects in thin transition metal oxide films
|
|
|
1978
|
100-101 |
2 |
p. 264-
1 p.
|
artikel
|
| 791 |
Dielectric isolation techniques for integrated circuits
|
Bosnell, J.R.
|
|
1976
|
100-101 |
2 |
p. 113-122
10 p.
|
artikel
|
| 792 |
Dielectric properties of thin films
|
|
|
1963
|
100-101 |
2 |
p. 160-
1 p.
|
artikel
|
| 793 |
Dielectric Properties of thin insulating films of photoresist material
|
|
|
1966
|
100-101 |
2 |
p. 189-
1 p.
|
artikel
|
| 794 |
Dielectric thin films through rf sputtering
|
|
|
1967
|
100-101 |
2 |
p. 204-
1 p.
|
artikel
|
| 795 |
Different chip interconnecting techniques
|
|
|
1981
|
100-101 |
2 |
p. 282-
1 p.
|
artikel
|
| 796 |
Differential amplifier grown in silicon block
|
|
|
1963
|
100-101 |
2 |
p. 159-
1 p.
|
artikel
|
| 797 |
Differing product-safety needs needn't bar universal designs
|
|
|
1983
|
100-101 |
2 |
p. 400-
1 p.
|
artikel
|
| 798 |
Diffusion and reactions in gold films
|
|
|
1983
|
100-101 |
2 |
p. 404-
1 p.
|
artikel
|
| 799 |
Diffusion of boron in silicon
|
|
|
1969
|
100-101 |
2 |
p. 150-
1 p.
|
artikel
|
| 800 |
Diffusion of boron into silicon from doped oxide source
|
|
|
1981
|
100-101 |
2 |
p. 284-
1 p.
|
artikel
|
| 801 |
Diffusion of phosphorus into silicon using phosphine gas as a source
|
|
|
1976
|
100-101 |
2 |
p. 107-
1 p.
|
artikel
|
| 802 |
4510439 Digital circuit multi-test system with automatic setting of test pulse levels
|
Roth, Rolf
|
|
1986
|
100-101 |
2 |
p. 397-
1 p.
|
artikel
|
| 803 |
Digital-IC models for computer-aided design. Part 2: TTL flip-flops
|
|
|
1974
|
100-101 |
2 |
p. 77-
1 p.
|
artikel
|
| 804 |
Digital image correlation for solder joint fatigue reliability in microelectronics packages
|
Sun, Yaofeng
|
|
2008
|
100-101 |
2 |
p. 310-318
9 p.
|
artikel
|
| 805 |
Direct current conductivity in amorphous semiconductors
|
|
|
1973
|
100-101 |
2 |
p. 96-
1 p.
|
artikel
|
| 806 |
Direct exposure of photoresist by projection
|
|
|
1969
|
100-101 |
2 |
p. 159-
1 p.
|
artikel
|
| 807 |
Direct mounting of chip carriers on printed wiring board
|
|
|
1983
|
100-101 |
2 |
p. 400-
1 p.
|
artikel
|
| 808 |
Direct thickness measurement in lapping process
|
|
|
1985
|
100-101 |
2 |
p. 394-
1 p.
|
artikel
|
| 809 |
Direct-write pyrolytic laser deposition
|
|
|
1987
|
100-101 |
2 |
p. 392-
1 p.
|
artikel
|
| 810 |
Discharge sputtering
|
|
|
1973
|
100-101 |
2 |
p. 100-101
2 p.
|
artikel
|
| 811 |
Discrete renewal processes
|
|
|
1972
|
100-101 |
2 |
p. 115-
1 p.
|
artikel
|
| 812 |
Discussing complementary MOS
|
|
|
1973
|
100-101 |
2 |
p. 91-
1 p.
|
artikel
|
| 813 |
Discussion of “optimization by Integer programming of constrained reliability problems with several modes of failure”
|
|
|
1983
|
100-101 |
2 |
p. 396-
1 p.
|
artikel
|
| 814 |
Distributed circuit design
|
|
|
1965
|
100-101 |
2 |
p. 224-
1 p.
|
artikel
|
| 815 |
Distribution function relaxation times in gallium arsenide
|
|
|
1978
|
100-101 |
2 |
p. 259-
1 p.
|
artikel
|
| 816 |
Distribution of a random variable defined through a constitutive equation
|
Ferris-Prabhu, A.V.
|
|
1976
|
100-101 |
2 |
p. 153-157
5 p.
|
artikel
|
| 817 |
Distribution of time to non-availability of a reliability system
|
|
|
1974
|
100-101 |
2 |
p. 77-
1 p.
|
artikel
|
| 818 |
Dominating the maximum likelihood estimator in predicting reliability
|
Jaisingh, Lloyd R.
|
|
1987
|
100-101 |
2 |
p. 345-350
6 p.
|
artikel
|
| 819 |
Doping solids with ions
|
|
|
1969
|
100-101 |
2 |
p. 160-
1 p.
|
artikel
|
| 820 |
Double diffused MOSFETs
|
|
|
1974
|
100-101 |
2 |
p. 79-
1 p.
|
artikel
|
| 821 |
Double-implanted subvolt JFETs
|
|
|
1983
|
100-101 |
2 |
p. 401-
1 p.
|
artikel
|
| 822 |
Downtime of the service station in M/G/1 queueing system with repairable service station
|
Tang, Ying Hui
|
|
1996
|
100-101 |
2 |
p. 199-202
4 p.
|
artikel
|
| 823 |
Drainage ratio impact on void creation in gold interconnect
|
Littleton, Dave
|
|
2011
|
100-101 |
2 |
p. 240-245
6 p.
|
artikel
|
| 824 |
Drift velocities of carriers in degenerate semiconductors
|
|
|
1976
|
100-101 |
2 |
p. 107-
1 p.
|
artikel
|
| 825 |
Dual RF diode/DC magnetron sputtered aluminum alloy films for VLSI
|
|
|
1983
|
100-101 |
2 |
p. 404-
1 p.
|
artikel
|
| 826 |
Dynamic environment factors in determining electronic assembly reliability
|
Fiderer, Leo
|
|
1975
|
100-101 |
2 |
p. 173-193
21 p.
|
artikel
|
| 827 |
Dynamic mechanism reliability by Monte Carlo methods
|
|
|
1968
|
100-101 |
2 |
p. 161-
1 p.
|
artikel
|
| 828 |
Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages
|
Wu, Y.P.
|
|
2004
|
100-101 |
2 |
p. 295-302
8 p.
|
artikel
|
| 829 |
Dynamic testing of integrated circuits
|
|
|
1972
|
100-101 |
2 |
p. 116-
1 p.
|
artikel
|
| 830 |
4739258 Dynamic testing of thin-film conductor
|
Schwarz, JamesA
|
|
1989
|
100-101 |
2 |
p. 286-
1 p.
|
artikel
|
| 831 |
4598308 Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
|
James, ChristopherD
|
|
1987
|
100-101 |
2 |
p. 395-
1 p.
|
artikel
|
| 832 |
E-beam systems arrive, flexible circuits fluorish
|
|
|
1978
|
100-101 |
2 |
p. 267-
1 p.
|
artikel
|
| 833 |
Economical failure analysis for microprocessors
|
|
|
1981
|
100-101 |
2 |
p. 280-
1 p.
|
artikel
|
| 834 |
Economic considerations in inspection for lot acceptance
|
|
|
1977
|
100-101 |
2 |
p. 115-
1 p.
|
artikel
|
| 835 |
Edge acuity and resolution in positive type photoresist systems
|
|
|
1978
|
100-101 |
2 |
p. 256-
1 p.
|
artikel
|
| 836 |
Edge emissions of ion-implanted CdS
|
|
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1978
|
100-101 |
2 |
p. 268-
1 p.
|
artikel
|
| 837 |
Editorial
|
|
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1998
|
100-101 |
2 |
p. iii-iv
nvt p.
|
artikel
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| 838 |
Editorial
|
|
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1999
|
100-101 |
2 |
p. 159-
1 p.
|
artikel
|
| 839 |
Editorial
|
Ryerson, Clifford M
|
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1982
|
100-101 |
2 |
p. 145-
1 p.
|
artikel
|
| 840 |
Editorial
|
Dummer, G.W.A.
|
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1969
|
100-101 |
2 |
p. 79-
1 p.
|
artikel
|
| 841 |
Editorial
|
Ersland, Peter
|
|
2011
|
100-101 |
2 |
p. 187-
1 p.
|
artikel
|
| 842 |
Editorial
|
Ersland, Peter
|
|
2014
|
100-101 |
2 |
p. 341
|
artikel
|
| 843 |
Editor's note
|
|
|
1971
|
100-101 |
2 |
p. i-
1 p.
|
artikel
|
| 844 |
Educational needs for reliability and maintainability
|
Harris, A.P.
|
|
1975
|
100-101 |
2 |
p. 233-237
5 p.
|
artikel
|
| 845 |
Education in reliability engineering
|
de Souza, Alban A.P.
|
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1975
|
100-101 |
2 |
p. 215-216
2 p.
|
artikel
|
| 846 |
Effective mass and intrinsic concentration in silicon
|
|
|
1968
|
100-101 |
2 |
p. 166-
1 p.
|
artikel
|
| 847 |
Effective method for evaluation of semiconductor laser quality
|
Li, Hongyan
|
|
2000
|
100-101 |
2 |
p. 333-337
5 p.
|
artikel
|
| 848 |
Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinning
|
Heo, W.
|
|
2012
|
100-101 |
2 |
p. 412-417
6 p.
|
artikel
|
| 849 |
Effect of autoclave test on anisotropic conductive joints
|
Tan, C.W.
|
|
2003
|
100-101 |
2 |
p. 279-285
7 p.
|
artikel
|
| 850 |
Effect of diffused oxygen and gold on surface properties of oxidized silicon
|
|
|
1968
|
100-101 |
2 |
p. 164-165
2 p.
|
artikel
|
| 851 |
Effect of drain voltage on channel temperature and reliability of pseudomorphic InP-based HEMTs
|
Dammann, M.
|
|
2000
|
100-101 |
2 |
p. 287-291
5 p.
|
artikel
|
| 852 |
Effect of electron irradiation on lithium-doped silicon
|
|
|
1971
|
100-101 |
2 |
p. 129-
1 p.
|
artikel
|
| 853 |
Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn–3.5Ag solder bumps
|
Zhao, Qinghua
|
|
2013
|
100-101 |
2 |
p. 321-326
6 p.
|
artikel
|
| 854 |
Effect of ferroelectric polarization on insulated-gate thin-film transistor parameters
|
|
|
1967
|
100-101 |
2 |
p. 204-
1 p.
|
artikel
|
| 855 |
Effect of firing temperature and glass content on the electrical properties of thick film capacitors
|
|
|
1983
|
100-101 |
2 |
p. 405-
1 p.
|
artikel
|
| 856 |
Effect of linear emitter recombination on OCVD determination of lifetime in p-i-n diodes
|
|
|
1983
|
100-101 |
2 |
p. 403-
1 p.
|
artikel
|
| 857 |
Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance
|
Ito, Shinya
|
|
2002
|
100-101 |
2 |
p. 201-209
9 p.
|
artikel
|
| 858 |
Effect of N2O nitridation on the electrical properties of MOS gate oxides
|
Pacelli, A
|
|
1998
|
100-101 |
2 |
p. 239-242
4 p.
|
artikel
|
| 859 |
Effect of planarization on VLSI processing
|
|
|
1987
|
100-101 |
2 |
p. 386-
1 p.
|
artikel
|
| 860 |
Effect of statistical dependencies in strict consecutive-k-out-of-n:F systems
|
Rushdi, Ali M.
|
|
1988
|
100-101 |
2 |
p. 309-318
10 p.
|
artikel
|
| 861 |
Effect of the discharging and recharging of the stress generated oxide charge in metal–oxide–semiconductor capacitors on the low field leakage current
|
Meinertzhagen, A
|
|
1998
|
100-101 |
2 |
p. 221-225
5 p.
|
artikel
|
| 862 |
Effect of the Model Uniform Product Liability Act in Quality Assurance
|
Jacobs, Richard M
|
|
1981
|
100-101 |
2 |
p. 263-268
6 p.
|
artikel
|
| 863 |
Effect of ytterbium doping on the optical and electrical properties of intrinsic In2O3 thin films
|
Dakhel, A.A.
|
|
2010
|
100-101 |
2 |
p. 211-216
6 p.
|
artikel
|
| 864 |
Effects in Auger electron spectroscopy due to the probing electrons and sputtering
|
|
|
1978
|
100-101 |
2 |
p. 267-
1 p.
|
artikel
|
| 865 |
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application
|
Hwang, J.S.
|
|
2008
|
100-101 |
2 |
p. 293-299
7 p.
|
artikel
|
| 866 |
Effects of bulk trapping on the memory characteristics of thick-oxide MNOS variable-threshold capacitors
|
|
|
1974
|
100-101 |
2 |
p. 78-79
2 p.
|
artikel
|
| 867 |
Effects of different drop test conditions on board-level reliability of chip-scale packages
|
Lai, Yi-Shao
|
|
2008
|
100-101 |
2 |
p. 274-281
8 p.
|
artikel
|
| 868 |
Effects of diffused nickel on the silicon-silicon dioxide interface
|
|
|
1974
|
100-101 |
2 |
p. 81-
1 p.
|
artikel
|
| 869 |
Effects of diffusion current on characteristics of metal-oxide (insulator)-semiconductor transistors
|
|
|
1967
|
100-101 |
2 |
p. 201-
1 p.
|
artikel
|
| 870 |
Effects of dislocations in silicon transistors with implanted bases
|
|
|
1978
|
100-101 |
2 |
p. 268-269
2 p.
|
artikel
|
| 871 |
Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu
|
Kim, K.S.
|
|
2003
|
100-101 |
2 |
p. 259-267
9 p.
|
artikel
|
| 872 |
Effects of grain-boundary trapping-state energy distribution on the activation energy of resistivity of polycrystalline-silicon films
|
|
|
1985
|
100-101 |
2 |
p. 397-
1 p.
|
artikel
|
| 873 |
Effects of high field stresses on threshold voltage of CMOS transistors
|
Stojadinović, N.
|
|
1985
|
100-101 |
2 |
p. 275-279
5 p.
|
artikel
|
| 874 |
Effects of ionizing radiation on oxidized silicon surfaces and planar devices
|
|
|
1968
|
100-101 |
2 |
p. 165-
1 p.
|
artikel
|
| 875 |
Effects of latent damage of recrystallization on lead free solder joints
|
Mayyas, Ahmad
|
|
2014
|
100-101 |
2 |
p. 447-456
|
artikel
|
| 876 |
Effects of ‘Latent Damage’ on pad cratering: Reduction in life and a potential change in failure mode
|
Raghavan, Venkatesh Arasanipalai
|
|
2013
|
100-101 |
2 |
p. 303-313
11 p.
|
artikel
|
| 877 |
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
|
Kim, Hyomi
|
|
2010
|
100-101 |
2 |
p. 258-265
8 p.
|
artikel
|
| 878 |
Effects of nuclear radiation on a high-reliability silicon power diode three-junction capacitance
|
|
|
1972
|
100-101 |
2 |
p. 121-
1 p.
|
artikel
|
| 879 |
Effects of process variables on thick-film resistors
|
|
|
1972
|
100-101 |
2 |
p. 122-
1 p.
|
artikel
|
| 880 |
Effects of temperature on current instabilities caused by recombination centers in semiconductors
|
|
|
1974
|
100-101 |
2 |
p. 80-
1 p.
|
artikel
|
| 881 |
Effects of temperature on high-frequency transistors
|
|
|
1963
|
100-101 |
2 |
p. 156-
1 p.
|
artikel
|
| 882 |
Efficiency and programming of automatic artwork generators
|
|
|
1971
|
100-101 |
2 |
p. 125-
1 p.
|
artikel
|
| 883 |
Efficient silicon compilation of digital control specifications
|
|
|
1987
|
100-101 |
2 |
p. 387-
1 p.
|
artikel
|
| 884 |
Efforts and outlay made by manufacturers to achieve a high reliability of electronic equipment for military applications
|
|
|
1965
|
100-101 |
2 |
p. 223-
1 p.
|
artikel
|
| 885 |
Electrical and thermal stability of AuGeNi OHMIC contacts to GaAs fabricated with in situ RF sputter cleaning
|
|
|
1987
|
100-101 |
2 |
p. 388-
1 p.
|
artikel
|
| 886 |
Electrical characteristics of “B”-implanted p-channel MNOS transistors
|
|
|
1976
|
100-101 |
2 |
p. 110-
1 p.
|
artikel
|
| 887 |
Electrical characteristics of large scale integration (LSI) MOSFETs at very high temperatures. Part II: experiment
|
|
|
1985
|
100-101 |
2 |
p. 395-
1 p.
|
artikel
|
| 888 |
Electrical characteristics of large scale integration (LSI) MOSFETs at very high temperatures. Part I; theory
|
|
|
1985
|
100-101 |
2 |
p. 393-
1 p.
|
artikel
|
| 889 |
Electrical characteristics of large-scale integration silicon MOSFET's at very high temperatures, Part III: modeling and circuit behaviour
|
|
|
1985
|
100-101 |
2 |
p. 387-
1 p.
|
artikel
|
| 890 |
Electrical characterization of MS and MIS structures on AlGaN/AlN/GaN heterostructures
|
Arslan, Engin
|
|
2011
|
100-101 |
2 |
p. 370-375
6 p.
|
artikel
|
| 891 |
Electrical characterization of packages for high-speed integrated circuits
|
|
|
1987
|
100-101 |
2 |
p. 387-
1 p.
|
artikel
|
| 892 |
Electrical characterization of ultra-shallow n+p junctions formed by AsH3 plasma immersion implantation
|
Yang, B.L
|
|
2000
|
100-101 |
2 |
p. 277-281
5 p.
|
artikel
|
| 893 |
Electrical contacts: research and reliability
|
|
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1968
|
100-101 |
2 |
p. 159-
1 p.
|
artikel
|
| 894 |
4733394 Electrically programmable semiconductor memory showing redundance
|
Giebel, Burkhard
|
|
1989
|
100-101 |
2 |
p. 286-
1 p.
|
artikel
|
| 895 |
Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions
|
Yoon, Jeong-Won
|
|
2014
|
100-101 |
2 |
p. 410-416
|
artikel
|
| 896 |
Electrical properties of evaporated cerium oxide films
|
|
|
1970
|
100-101 |
2 |
p. 125-126
2 p.
|
artikel
|
| 897 |
Electrical properties of n-type epitaxial films of silicon on sapphire formed by vacuum evaporation
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|
|
1970
|
100-101 |
2 |
p. 125-
1 p.
|
artikel
|
| 898 |
Electrical properties of thin RF sputtered Ta2O5 films after constant current stress
|
Pecovska-Gjorgjevich, M.
|
|
2003
|
100-101 |
2 |
p. 235-241
7 p.
|
artikel
|
| 899 |
Electrical properties of uncontaminated PbTe films on Mica substrates prepared by molecular beam deposition
|
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|
1978
|
100-101 |
2 |
p. 262-263
2 p.
|
artikel
|
| 900 |
Electrical stress effect on RF power characteristics of SiGe hetero-junction bipolar transistors
|
Huang, Sheng-Yi
|
|
2008
|
100-101 |
2 |
p. 193-199
7 p.
|
artikel
|
| 901 |
Electrical testing for process evaluations
|
Wada, Yasuo
|
|
1981
|
100-101 |
2 |
p. 159-163
5 p.
|
artikel
|
| 902 |
Electrical testing of bare silicon chips prior to hybrid fabrication
|
|
|
1978
|
100-101 |
2 |
p. 263-
1 p.
|
artikel
|
| 903 |
Electrical transport in thick film resistors
|
|
|
1981
|
100-101 |
2 |
p. 288-
1 p.
|
artikel
|
| 904 |
Electric breakdowns and breakdown mechanisms in ultra-thin silicon oxides
|
Jackson, J.C
|
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1999
|
100-101 |
2 |
p. 171-179
9 p.
|
artikel
|
| 905 |
Electric measurement of impurity concentration in p-type epitaxially grown and ion-implanted base regions
|
|
|
1981
|
100-101 |
2 |
p. 291-
1 p.
|
artikel
|
| 906 |
Electromechanical switching devices—Reliability, life and the relevance of circuit design
|
Leighton, A.G.
|
|
1966
|
100-101 |
2 |
p. 161-173
13 p.
|
artikel
|
| 907 |
Electromigration behavior in Cu/Sn–8Zn–3Bi/Cu solder joint
|
Liu, Lijuan
|
|
2010
|
100-101 |
2 |
p. 251-257
7 p.
|
artikel
|
| 908 |
Electromigration & electronic device degradation
|
Pešić, B.
|
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1997
|
100-101 |
2 |
p. 370-
1 p.
|
artikel
|
| 909 |
Electromigration in gold-silver alloys
|
|
|
1973
|
100-101 |
2 |
p. 93-
1 p.
|
artikel
|
| 910 |
Electromigration on oxide steps
|
Wild, Andreas
|
|
1988
|
100-101 |
2 |
p. 243-255
13 p.
|
artikel
|
| 911 |
Electromigration reliability of interconnections in RF low noise amplifier circuit
|
He, Feifei
|
|
2012
|
100-101 |
2 |
p. 446-454
9 p.
|
artikel
|
| 912 |
Electron beam exposure system for integrated circuits
|
Tarui, Y.
|
|
1969
|
100-101 |
2 |
p. 101-104
4 p.
|
artikel
|
| 913 |
Electron beam heating of a thin film on a highly conducting substrate
|
|
|
1968
|
100-101 |
2 |
p. 173-
1 p.
|
artikel
|
| 914 |
Electron beam induced potential contrast on unbiased planar transistors
|
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|
1968
|
100-101 |
2 |
p. 173-
1 p.
|
artikel
|
| 915 |
Electron beam—now a practical LSI production tool
|
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|
1978
|
100-101 |
2 |
p. 266-
1 p.
|
artikel
|
| 916 |
Electron-beam resists for lift-off processing with potential application to Josephson integrated circuits
|
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|
1981
|
100-101 |
2 |
p. 291-
1 p.
|
artikel
|
| 917 |
Electron-beam system makes masks for integrated circuits
|
|
|
1977
|
100-101 |
2 |
p. 122-
1 p.
|
artikel
|
| 918 |
Electron beam welding in the manufacture of electronic components
|
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|
1968
|
100-101 |
2 |
p. 174-
1 p.
|
artikel
|
| 919 |
Electron current through metal-insulator-metal sandwiches
|
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|
1964
|
100-101 |
2 |
p. 144-
1 p.
|
artikel
|
| 920 |
4832250 Electronic circuit board rework and repair system
|
Spigarelli, Donald
|
|
1990
|
100-101 |
2 |
p. i-
1 p.
|
artikel
|
| 921 |
Electronic engineering in 1973
|
|
|
1963
|
100-101 |
2 |
p. 158-
1 p.
|
artikel
|
| 922 |
Electronic interconnection at room temperature with gallium alloy
|
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|
1966
|
100-101 |
2 |
p. 181-
1 p.
|
artikel
|
| 923 |
Electronic system reliability—an American viewpoint
|
|
|
1964
|
100-101 |
2 |
p. 139-
1 p.
|
artikel
|
| 924 |
Electron microprobe analysis of HgTe thin films
|
|
|
1972
|
100-101 |
2 |
p. 122-
1 p.
|
artikel
|
| 925 |
Electron mobilities in organic semiconductors
|
|
|
1964
|
100-101 |
2 |
p. 145-
1 p.
|
artikel
|
| 926 |
Electron scattering mechanisms in n-type epitaxial GaP
|
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|
1967
|
100-101 |
2 |
p. 199-200
2 p.
|
artikel
|
| 927 |
Electron-sensitive film-forming materials and their uses in semiconductor technology
|
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1977
|
100-101 |
2 |
p. 117-
1 p.
|
artikel
|
| 928 |
Electron transport mechanism of tungsten trioxide powder thin film studied by investigating effect of annealing on resistivity
|
Li, Wei
|
|
2015
|
100-101 |
2 |
p. 407-410
4 p.
|
artikel
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| 929 |
Electron trapping levels in silicon dioxide thermally grown on silicon
|
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|
1973
|
100-101 |
2 |
p. 97-
1 p.
|
artikel
|
| 930 |
Electron trapping noise in SOS MOS field-effect transistors operated in the linear region
|
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|
1978
|
100-101 |
2 |
p. 258-
1 p.
|
artikel
|
| 931 |
Electron traps created in gate oxides by Fowler–Nordheim injections
|
Auriel, G.
|
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1998
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100-101 |
2 |
p. 227-231
5 p.
|
artikel
|
| 932 |
Electrostatic discharge (ESD) protection of N-type silicon controlled rectifier with P-type MOSFET pass structure for high voltage operating I/O application
|
Kim, Kil-Ho
|
|
2013
|
100-101 |
2 |
p. 205-207
3 p.
|
artikel
|
| 933 |
Electrostatic discharge failure mechanisms and models
|
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|
1983
|
100-101 |
2 |
p. 395-
1 p.
|
artikel
|
| 934 |
Encapsulation of high reliability devices
|
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|
1974
|
100-101 |
2 |
p. 76-
1 p.
|
artikel
|
| 935 |
Endpoint detection in a batch loaded planar etcher
|
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|
1983
|
100-101 |
2 |
p. 398-
1 p.
|
artikel
|
| 936 |
Engineering reliability management
|
Dhillon, Balbir S.
|
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1983
|
100-101 |
2 |
p. 215-234
20 p.
|
artikel
|
| 937 |
Engineering reliability: New techniques and applications
|
G.W.A.D,
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1982
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100-101 |
2 |
p. 316-317
2 p.
|
artikel
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| 938 |
English-Russian dictionary of reliability and quality control
|
G.W.A.D.,
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1977
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100-101 |
2 |
p. 125-
1 p.
|
artikel
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| 939 |
Entretien du matériel d'électronique et fiabilité
|
Guyot, C.
|
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1965
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100-101 |
2 |
p. 145-155
11 p.
|
artikel
|
| 940 |
Environmental factors governing field reliability of plastic transistors and integrated circuits
|
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1973
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100-101 |
2 |
p. 88-
1 p.
|
artikel
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| 941 |
Environmental stress screening (ESS) demonstrate its value in the field
|
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1987
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100-101 |
2 |
p. 383-
1 p.
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artikel
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| 942 |
Environmental testing of electronic components—part 1
|
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1967
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100-101 |
2 |
p. 193-
1 p.
|
artikel
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| 943 |
Environmental testing of electronic components—part 2
|
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1967
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100-101 |
2 |
p. 192-
1 p.
|
artikel
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| 944 |
EPIC: a cost-effective plastic chip carrier for VLSI packaging
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1987
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100-101 |
2 |
p. 385-
1 p.
|
artikel
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| 945 |
Epitaxial films produced on germanium and silicon surfaces by the vacuum deposition of silver
|
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1965
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100-101 |
2 |
p. 226-
1 p.
|
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| 946 |
Epitaxial growth and growth defects
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1969
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100-101 |
2 |
p. 152-
1 p.
|
artikel
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| 947 |
Epitaxial growth of silicon from SiH4 in the temperature range 800–1150°C
|
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|
1973
|
100-101 |
2 |
p. 96-
1 p.
|
artikel
|
| 948 |
Epitaxial silicon for bipolar integrated circuits
|
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|
1985
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100-101 |
2 |
p. 393-394
2 p.
|
artikel
|
| 949 |
Epitaxial vapor growth of crystal Ge
|
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1963
|
100-101 |
2 |
p. 158-
1 p.
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artikel
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| 950 |
Epoxy bonding in hybrid microelectronic circuits
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1977
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100-101 |
2 |
p. 121-122
2 p.
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artikel
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| 951 |
Equipment and methods for simulating ambient conditions
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1965
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100-101 |
2 |
p. 221-
1 p.
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artikel
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| 952 |
Equipment availability and logistic principles
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1978
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100-101 |
2 |
p. 254-
1 p.
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artikel
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| 953 |
Equipment designer's approach to packaging of hybrid microcircuits
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1971
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100-101 |
2 |
p. 131-
1 p.
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artikel
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| 954 |
Equipment reliability
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1963
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100-101 |
2 |
p. 155-
1 p.
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artikel
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| 955 |
Equipment reliability and the environment
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Harris, J.
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1970
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100-101 |
2 |
p. 145-152
8 p.
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artikel
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| 956 |
Erratum
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1997
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100-101 |
2 |
p. 379-
1 p.
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artikel
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| 957 |
Erratum
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1988
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100-101 |
2 |
p. 333-
1 p.
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| 958 |
Erratum
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1989
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100-101 |
2 |
p. 295-
1 p.
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artikel
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| 959 |
Error analysis in sampling theory
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1967
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100-101 |
2 |
p. 191-
1 p.
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artikel
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| 960 |
4612640 Error checking and correction circuitry for use with an electrically-programmable and electrically-erasable memory array
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Mehrotra, Sanja
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1987
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100-101 |
2 |
p. 396-397
2 p.
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artikel
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| 961 |
Error data logger
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1972
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100-101 |
2 |
p. 114-
1 p.
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artikel
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| 962 |
Error propagation analysis using FPGA-based SEU-fault injection
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Ejlali, Alireza
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2008
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100-101 |
2 |
p. 319-328
10 p.
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artikel
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| 963 |
Errors in life prediction due to temperature inaccuracies
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Stanley, I.W
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1981
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100-101 |
2 |
p. 173-174
2 p.
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artikel
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| 964 |
ESD–RF co-design methodology for the state of the art RF-CMOS blocks
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Vassilev, V.
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2005
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100-101 |
2 |
p. 255-268
14 p.
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artikel
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| 965 |
ESD SPICE model and measurements for a hard disk drive
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Wallash, Al
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2005
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100-101 |
2 |
p. 305-311
7 p.
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artikel
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| 966 |
Estimating activation energies for multi-mode failures
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Nappa, Dario
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2014
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100-101 |
2 |
p. 349-353
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artikel
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| 967 |
Estimating substrate area and density for hybrid microcircuits
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1973
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100-101 |
2 |
p. 99-100
2 p.
|
artikel
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| 968 |
Estimating the optimum position for restoring organs in non-cascaded redundant networks
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1970
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100-101 |
2 |
p. 113-
1 p.
|
artikel
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| 969 |
Estimating the reliability of electronic tubes with the aid of truncated life tests
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1973
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100-101 |
2 |
p. 86-
1 p.
|
artikel
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| 970 |
Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling
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Tohmyoh, Hironori
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2013
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100-101 |
2 |
p. 314-320
7 p.
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artikel
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| 971 |
Estimation of reliability for silicon devices irradiated with electrons
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1987
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100-101 |
2 |
p. 392-
1 p.
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artikel
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| 972 |
Estimation of reliability of a component under multiple stresses
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Ferdous, J.
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1995
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100-101 |
2 |
p. 279-283
5 p.
|
artikel
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| 973 |
Estimation of storage of spare replacement/maintainance equipment
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1987
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100-101 |
2 |
p. 382-
1 p.
|
artikel
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| 974 |
Estimation of temperature rise in electron beam heating of thin films
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1968
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100-101 |
2 |
p. 174-
1 p.
|
artikel
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| 975 |
Estimation of the reliability function using the delay-time models
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Attia, A.F.
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1997
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100-101 |
2 |
p. 323-327
5 p.
|
artikel
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| 976 |
Estimation of total errors in software
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Islam, M
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1982
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100-101 |
2 |
p. 281-285
5 p.
|
artikel
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| 977 |
Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM
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Cho, Seunghyun
|
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2008
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100-101 |
2 |
p. 300-309
10 p.
|
artikel
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| 978 |
Estimators for parameters of a series system under an attribute life test situation
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1977
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100-101 |
2 |
p. 114-
1 p.
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artikel
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| 979 |
Eutectic bonding semiconductor dice to metallized ceramic substrates
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1966
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100-101 |
2 |
p. 184-185
2 p.
|
artikel
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| 980 |
Evaluating ion implanter options
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1987
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100-101 |
2 |
p. 391-
1 p.
|
artikel
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| 981 |
Evaluation of component quality for military and space applications
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1977
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100-101 |
2 |
p. 113-
1 p.
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artikel
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| 982 |
Evaluation of conditional failure density from hazard rate
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1972
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100-101 |
2 |
p. 115-
1 p.
|
artikel
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| 983 |
Evaluation of film and filmless radiographic systems for the non-destructive testing of thin materials and electronic assemblies
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1964
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100-101 |
2 |
p. 148-
1 p.
|
artikel
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| 984 |
Evaluation of materials and processes for integrated microwave circuits
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1970
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100-101 |
2 |
p. 115-
1 p.
|
artikel
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| 985 |
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
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Rooney, Daniel T.
|
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2005
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100-101 |
2 |
p. 379-390
12 p.
|
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| 986 |
Evaporated As2S3—reproduction fidelity for microelectronics
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1985
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100-101 |
2 |
p. 394-
1 p.
|
artikel
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| 987 |
Evaporated circuits incorporating a thin film transistor
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1963
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100-101 |
2 |
p. 159-
1 p.
|
artikel
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| 988 |
Evaporated integrated microcircuitry for electronic systems
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Moore, David WM.
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1963
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100-101 |
2 |
p. 129-132
4 p.
|
artikel
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| 989 |
Evaporated silicon thin-film transistors
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1968
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100-101 |
2 |
p. 169-170
2 p.
|
artikel
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| 990 |
Evaporated single element metal film resistors
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1966
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100-101 |
2 |
p. 188-189
2 p.
|
artikel
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| 991 |
Evaporation induced corrosion of YZ-LiNb03
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1985
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100-101 |
2 |
p. 386-
1 p.
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artikel
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| 992 |
Evaporation induced frequency shift in S.A.W. filter
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1985
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100-101 |
2 |
p. 385-
1 p.
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artikel
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| 993 |
Evaporation, sputtering and ion-plating; pros and cons
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1974
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100-101 |
2 |
p. 82-
1 p.
|
artikel
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| 994 |
Evolutionary derivation of optimal test sets for neural network based analog and mixed signal circuits fault diagnosis approach
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Seyyed Mahdavi, S.J.
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2009
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100-101 |
2 |
p. 199-208
10 p.
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artikel
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| 995 |
Excess surface currents in p-n junctions and bipolar transistors
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1972
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2 |
p. 120-
1 p.
|
artikel
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| 996 |
Exchange and dipolar fields in phosphorus-doped silicon measured by electron spin echoes
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1974
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100-101 |
2 |
p. 81-
1 p.
|
artikel
|
| 997 |
Expanding the horizons of optical projection lithography
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1983
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100-101 |
2 |
p. 401-
1 p.
|
artikel
|
| 998 |
Experience in 3-micron processing: a 10 volt n-well CMOS process
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1985
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100-101 |
2 |
p. 393-
1 p.
|
artikel
|
| 999 |
Experience relating to the operational reliability of diodes and transistors
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1965
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100-101 |
2 |
p. 221-
1 p.
|
artikel
|
| 1000 |
Experimental and simulation studies of resistivity in nanoscale copper films
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Emre Yarimbiyik, A.
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2009
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100-101 |
2 |
p. 127-134
8 p.
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artikel
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