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                             120 results found
no title author magazine year volume issue page(s) type
1 Acceleration of the goodness-on-fit test by using the programme for EDA. A proposal of BWP on the Weibull plot and a study of applying BWP to censored data 1993
 100-101 13 p. 2063-
1 p.
 article
2 A color vision inspection system for integrated circuit manufacturing 1993
 100-101 13 p. 2071-
1 p.
 article
3 A computer-based model for system level reliability and maintainability allocation 1993
 100-101 13 p. 2061-
1 p.
 article
4 A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling 1993
 100-101 13 p. 2056-
1 p.
 article
5 Advancing the state of the art in high-performance logic and array technology 1993
 100-101 13 p. 2072-
1 p.
 article
6 A four-level VLSI bipolar metallization design with chemical-mechanical planarization 1993
 100-101 13 p. 2068-
1 p.
 article
7 A fracture mechanics approach to thermal fatigue life prediction of solder joints 1993
 100-101 13 p. 2057-
1 p.
 article
8 A generalization of consecutive-k-out-of-n:F systems 1993
 100-101 13 p. 2064-
1 p.
 article
9 A method of threshold voltage and current gain factor estimation for CMOS IC input transistors Pidin, S.
 1993
 100-101 13 p. 2047-2052
6 p.
 article
10 A method to estimate the acceleration factor for subassemblies 1993
 100-101 13 p. 2056-
1 p.
 article
11 An ad hoc query interface for IC-CIM databases 1993
 100-101 13 p. 2065-
1 p.
 article
12 Analysis of a conceptual automated rework facility for printed wiring assembly manufacturing systems 1993
 100-101 13 p. 2058-
1 p.
 article
13 Analysis of microwave scattering from semiconductor wafers 1993
 100-101 13 p. 2072-2073
2 p.
 article
14 An architecture for the development of real-time fault diagnosis systems using model-based reasoning 1993
 100-101 13 p. 2061-
1 p.
 article
15 An improved lower bound for the right tail of the reliability function under a type-two censoring plan Arsham, H.
 1993
 100-101 13 p. 2031-2038
8 p.
 article
16 A novel multichip module assembly approach using gold ball flip-chip bonding 1993
 100-101 13 p. 2066-
1 p.
 article
17 Application of electron and ion beam analysis techniques to microelectronics 1993
 100-101 13 p. 2075-
1 p.
 article
18 Approximation for the variance of the waiting time in a GI/G/1 queue Bhat, Vasanthakumar N.
 1993
 100-101 13 p. 1997-2002
6 p.
 article
19 A proposed magnetically enhanced reactive ion etcher for ULSI 1993
 100-101 13 p. 2074-
1 p.
 article
20 A semi-analytical method to predict printed circuit board package temperatures 1993
 100-101 13 p. 2057-
1 p.
 article
21 A simple microwave method for monitoring the conductivity of semiconductor epitaxial layers 1993
 100-101 13 p. 2072-
1 p.
 article
22 A simplified life estimation for LSI plastic package on thermal shock testing 1993
 100-101 13 p. 2058-
1 p.
 article
23 A statistical approach to quality control of non-normal lithographical overlay distributions 1993
 100-101 13 p. 2064-
1 p.
 article
24 A study of how to estimate contact reliability of connectors 1993
 100-101 13 p. 2058-
1 p.
 article
25 A study of long time reliability test of mold-encapsulated ICs 1993
 100-101 13 p. 2058-
1 p.
 article
26 A study of the effect of ultrasonic cleaning on component quality—hybrid devices 1993
 100-101 13 p. 2066-
1 p.
 article
27 Availability of consecutive-k-out-of-n:F system 1993
 100-101 13 p. 2062-2063
2 p.
 article
28 Availability of systems with two failure states 1993
 100-101 13 p. 2063-2064
2 p.
 article
29 Bayes shrinkage estimation of reliability and the parameters of a finite range failure time model Pandey, M.
 1993
 100-101 13 p. 2039-2042
4 p.
 article
30 Bipolar VLSI—an application for a high-performance microcontroller 1993
 100-101 13 p. 2071-
1 p.
 article
31 Bond wireless multichip packaging technology for high-speed circuits 1993
 100-101 13 p. 2067-
1 p.
 article
32 Case study of Bayes parameter estimation of exponential distribution 1993
 100-101 13 p. 2060-
1 p.
 article
33 CCD, multi-chip innovations evoke echoes of past 1993
 100-101 13 p. 2065-
1 p.
 article
34 Characterization and modelling of packages by a time-domain reflectometry approach 1993
 100-101 13 p. 2069-
1 p.
 article
35 Chip capacitors meet size, reliability requirements 1993
 100-101 13 p. 2056-2057
2 p.
 article
36 Comparison of N-MOSFET lifetime estimates based on GIDL enhancement and transconductance degradation as criteria 1993
 100-101 13 p. 2059-
1 p.
 article
37 Comparison of plastic and hermetic microcircuits under temperature cycling and temperature humidity bias 1993
 100-101 13 p. 2058-
1 p.
 article
38 Compensating effects in time-dependent dielectric breakdown 1993
 100-101 13 p. 2056-
1 p.
 article
39 Computer aided reliability modelling and applications in semiconductor manufacturing 1993
 100-101 13 p. 2059-
1 p.
 article
40 Concurrent thermal designs of PCBs: balancing accuracy with time constraints 1993
 100-101 13 p. 2057-
1 p.
 article
41 Conductance fluctuations in solids caused by defect migration 1993
 100-101 13 p. 2073-
1 p.
 article
42 Control of batch processing systems in semiconductor wafer fabrication facilities 1993
 100-101 13 p. 2057-
1 p.
 article
43 Design and evaluation of fault-tolerant 32-Bis microcomputer system 1993
 100-101 13 p. 2062-
1 p.
 article
44 Designing a custom VLSI moment invariant data signal processor 1993
 100-101 13 p. 2071-2072
2 p.
 article
45 Designing for maintainability: computerized human models 1993
 100-101 13 p. 2055-
1 p.
 article
46 Deterministic reliability-modeling of dynamic redundancy 1993
 100-101 13 p. 2064-
1 p.
 article
47 Development and analysis of an automated test system for the thermal characterization of IC packaging technologies 1993
 100-101 13 p. 2070-
1 p.
 article
48 Device interconnection technology for advanced thermal conduction modules 1993
 100-101 13 p. 2071-
1 p.
 article
49 Diagnosing mixed-signal board failures 1993
 100-101 13 p. 2059-
1 p.
 article
50 Digital characteristics of a CMOS ternary inverter at the liquid nitrogen temperature Srivastava, A.
 1993
 100-101 13 p. 1957-1962
6 p.
 article
51 Dose perturbation by wafer charging during ion implantation 1993
 100-101 13 p. 2074-2075
2 p.
 article
52 Dépôts de nitrure de silicium et de silice par méthode photochimique. Passivation de la surface d'InP par (NH4)2 S x . Application au MISFET-InP 1993
 100-101 13 p. 2073-2074
2 p.
 article
53 Dynamic fault-tree models for fault-tolerant computer systems 1993
 100-101 13 p. 2060-2061
2 p.
 article
54 Effect of microscale thermal conduction on the packing limit of silicon-on-insulator electronic devices 1993
 100-101 13 p. 2069-
1 p.
 article
55 Effects of oxygen implantation in GaAs 1993
 100-101 13 p. 2075-
1 p.
 article
56 Efficient computation of the sensitivity of k-out-of-n system reliability Rushdi, Ali M.
 1993
 100-101 13 p. 1963-1979
17 p.
 article
57 Encapsulant for nonhermetic multichip packaging applications 1993
 100-101 13 p. 2066-
1 p.
 article
58 Estimation of a composite hazard rate model Ananda, Malwane M.A.
 1993
 100-101 13 p. 2013-2019
7 p.
 article
59 Estimation of reliability in a multicomponent stress-strength model Borhan Uddin, Md.
 1993
 100-101 13 p. 2043-2046
4 p.
 article
60 Evaluation of manufacturing variables in the reliability of surface mount capacitors 1993
 100-101 13 p. 2059-
1 p.
 article
61 Expert judgement in maintenance optimization 1993
 100-101 13 p. 2064-
1 p.
 article
62 Failure analysis of semiconductor by infrared emission microscope 1993
 100-101 13 p. 2058-
1 p.
 article
63 High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution 1993
 100-101 13 p. 2067-
1 p.
 article
64 Integrated circuitry produces compact solid-state relays 1993
 100-101 13 p. 2057-
1 p.
 article
65 Integrated processing for microelectronics science and technology 1993
 100-101 13 p. 2065-
1 p.
 article
66 Intelligent fault isolation and diagnosis for communication satellite systems 1993
 100-101 13 p. 2062-
1 p.
 article
67 Investigation of conduction mechanism in thick film resistors trimmed by the pulse voltage method 1993
 100-101 13 p. 2074-
1 p.
 article
68 MAG-EX: a magnetics fabrication expert system focusing expert systems technology on improving quality control 1993
 100-101 13 p. 2060-
1 p.
 article
69 Makers accelerate speed of chip mounters 1993
 100-101 13 p. 2067-
1 p.
 article
70 Makers develop dense chip mounting for IC memory cards 1993
 100-101 13 p. 2071-
1 p.
 article
71 Manufacturability of rapid-thermal oxidation of silicon: oxide thickness, oxide thickness variation, and system dependency 1993
 100-101 13 p. 2073-
1 p.
 article
72 Maximum likelihood estimation of Weibull parameters in a renewal process based on remaining life from a specified time 1993
 100-101 13 p. 2063-
1 p.
 article
73 Modification of “SPICE” for simulation of coupled packaging interconnections 1993
 100-101 13 p. 2070-2071
2 p.
 article
74 Multichip routing and placement 1993
 100-101 13 p. 2066-
1 p.
 article
75 Numerical modeling of advanced semiconductor devices 1993
 100-101 13 p. 2055-2056
2 p.
 article
76 On comparison of MTBF between four redundant systems Meng, Fan Chin
 1993
 100-101 13 p. 1987-1990
4 p.
 article
77 On some basic notions of stochastic multiobjective programming problems with random parameters in the constraints El-Banna, Abou-Zaid H.
 1993
 100-101 13 p. 1981-1986
6 p.
 article
78 On the common-emitter breakdown voltage of bipolar junction transistors 1993
 100-101 13 p. 2072-
1 p.
 article
79 On the introduction of fuzzy inference to reliability analysis method 1993
 100-101 13 p. 2064-
1 p.
 article
80 Optimal design of partially accelerated life tests for the exponential distribution under type-I censoring 1993
 100-101 13 p. 2065-
1 p.
 article
81 Optimum simple ramp-tests for the Weibull distribution and type I censoring 1993
 100-101 13 p. 2061-2062
2 p.
 article
82 Overview of packaging for the IBM enterprise system/9000 based on the glass-ceramic copper/thin film thermal conduction module 1993
 100-101 13 p. 2069-
1 p.
 article
83 Packaging technology for the NEC SX-3 Supercomputers 1993
 100-101 13 p. 2069-
1 p.
 article
84 Performability of integrated software-hardware components of real-time parallel and distributed systems 1993
 100-101 13 p. 2060-
1 p.
 article
85 Plasma-based dry etching techniques in the silicon integrated circuit technology 1993
 100-101 13 p. 2069-2070
2 p.
 article
86 Predicting software errors, during development, using nonlinear regression models: a comparative study 1993
 100-101 13 p. 2061-
1 p.
 article
87 Publications, notices, calls for papers, etc. 1993
 100-101 13 p. 2077-
1 p.
 article
88 Quality process modelling; continuous electrical resistance annealing of copper wire 1993
 100-101 13 p. 2059-
1 p.
 article
89 Rapid integrated-circuit reliability simulation and its application to testing 1993
 100-101 13 p. 2056-
1 p.
 article
90 Redundant task-allocation in multicomputer systems 1993
 100-101 13 p. 2065-
1 p.
 article
91 Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages 1993
 100-101 13 p. 2068-2069
2 p.
 article
92 Reliability of a consecutive k-out-of-r-from-n:F system 1993
 100-101 13 p. 2060-
1 p.
 article
93 Reliability of surface mount electronics assemblies cleaned using CFC-113-free techniques 1993
 100-101 13 p. 2066-2067
2 p.
 article
94 Reliability optimization of systems by a surrogate-constraints algorithm 1993
 100-101 13 p. 2063-
1 p.
 article
95 Reliability theory for large linear systems with helping neighbours 1993
 100-101 13 p. 2060-
1 p.
 article
96 Renewal approximations of the doubly stochastic Poisson processes Bhat, Vasanthakumar N.
 1993
 100-101 13 p. 1991-1996
6 p.
 article
97 Rigorous theory and simplified model of the band-to-band tunneling in silicon 1993
 100-101 13 p. 2073-
1 p.
 article
98 SAMPAN: an expert system architecture for maintenance of Alcatel 1000 E10 exchanges 1993
 100-101 13 p. 2062-
1 p.
 article
99 Simulation of ultra thin film SOI transistors using a non-local ballistic model for impact ionisation 1993
 100-101 13 p. 2075-
1 p.
 article
100 S-parameter-based IC interconnect transmission line characterization 1993
 100-101 13 p. 2070-
1 p.
 article
101 Stress-induced dislocations in silicon integrated circuits 1993
 100-101 13 p. 2059-
1 p.
 article
102 Surface mounting technology adapts to new environment 1993
 100-101 13 p. 2067-
1 p.
 article
103 Targeting zero-defect manufacturing 1993
 100-101 13 p. 2060-
1 p.
 article
104 The closeness for {NBU} and {NWU} Hai-Yan, Gu
 1993
 100-101 13 p. 2053-2054
2 p.
 article
105 Thermal analysis of a substrate with power dissipation in the vias 1993
 100-101 13 p. 2068-
1 p.
 article
106 Thermal enhancements for a thin film chip carrier 1993
 100-101 13 p. 2069-
1 p.
 article
107 Thermal resistance simulation of IC packages using a three-dimensional boundary element method 1993
 100-101 13 p. 2066-
1 p.
 article
108 Thermomechanical assessment of plastic coated TAB chips 1993
 100-101 13 p. 2067-
1 p.
 article
109 The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules 1993
 100-101 13 p. 2068-
1 p.
 article
110 The single chip versus multichip packaging option for digital CMOS in the 1990s 1993
 100-101 13 p. 2070-
1 p.
 article
111 Time-domain characterization of interconnect discontinuities in high-speed circuits 1993
 100-101 13 p. 2072-
1 p.
 article
112 Training of semiconductor failure analysis engineers 1993
 100-101 13 p. 2055-
1 p.
 article
113 Transient thermal gradients across solder interconnections in electronic systems 1993
 100-101 13 p. 2056-
1 p.
 article
114 Ultra-dense: an MCM-based three-dimensional digital signal processor 1993
 100-101 13 p. 2072-
1 p.
 article
115 Ultra-miniature chip components change mounting methods 1993
 100-101 13 p. 2056-
1 p.
 article
116 Ultra-miniature relays must meet rigorous specifications 1993
 100-101 13 p. 2059-
1 p.
 article
117 Uncertainty importance of multistate system components Utkin, Lev V.
 1993
 100-101 13 p. 2021-2029
9 p.
 article
118 Useful and available RAM data banks Harris, A.P.
 1993
 100-101 13 p. 2003-2012
10 p.
 article
119 Wafer level evaluation techniques of electromigration of Al wiring 1993
 100-101 13 p. 2067-2068
2 p.
 article
120 Why failure rates observe Zipf's law in operational software 1993
 100-101 13 p. 2062-
1 p.
 article
                             120 results found
 
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