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                             827 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A Bayes classifier when the class distributions come from a common multivariate normal distribution 1992
100-101 12 p. 1787-
1 p.
artikel
2 A Bayes method for assessing product-reliability during development testing 1994
100-101 12 p. 1961-1962
2 p.
artikel
3 A case study of IC storage failures in Taipei trains Zhang, Y
1998
100-101 12 p. 1811-1816
6 p.
artikel
4 Acceleration test method of IC card 1992
100-101 12 p. 1783-
1 p.
artikel
5 Accounting for bandstructure effects in the hydrodynamic model: a first-order approach for silicon device simulation 1992
100-101 12 p. 1796-1797
2 p.
artikel
6 A compact test structure for characterisation of leakage currents in sub-micron CMOS technologies Ning, Zhenqiu
2001
100-101 12 p. 1939-1945
7 p.
artikel
7 A comparative study of self-heating effect of nMOSFETs fabricated on SGOI and SGSOAN substrates Liu, Hongxia
2010
100-101 12 p. 1942-1950
9 p.
artikel
8 A comparison of the optical projection lithography simulators in SAMPLE and PROLITH 1992
100-101 12 p. 1795-
1 p.
artikel
9 Activation energy of drain-current degradation in GaN HEMTs under high-power DC stress Wu, Yufei
2014
100-101 12 p. 2668-2674
7 p.
artikel
10 Adhesion of arbitrary-shaped thin-film microstructures Bhate, Dhruv
2007
100-101 12 p. 2014-2024
11 p.
artikel
11 Advanced assembly methods: multichip modules and flipchip technology 1994
100-101 12 p. 1968-
1 p.
artikel
12 Advanced electronic prognostics through system telemetry and pattern recognition methods Lopez, Leon
2007
100-101 12 p. 1865-1873
9 p.
artikel
13 Advanced ultrapure wafer systems with low dissolved oxygen for native oxide free wafer processing 1992
100-101 12 p. 1794-
1 p.
artikel
14 Advances widen uses for chip monolithic ceramic capacitors 1994
100-101 12 p. 1953-
1 p.
artikel
15 A failure analysis for LSIs using FIB technology 1992
100-101 12 p. 1785-
1 p.
artikel
16 A fast and efficient technique to apply Selective TMR through optimization Ruano, Oscar
2011
100-101 12 p. 2388-2401
14 p.
artikel
17 A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chips 1992
100-101 12 p. 1799-
1 p.
artikel
18 A fully on-chip ESD protection UWB-band low noise amplifier using GaAs enhancement-mode dual-gate pHEMT technology Chiu, Hsien-Chin
2011
100-101 12 p. 2137-2142
6 p.
artikel
19 A general characterization and simulation method for deposition and etching technology 1992
100-101 12 p. 1795-
1 p.
artikel
20 A generalized algorithm for evaluating distributed-program reliability 1994
100-101 12 p. 1959-
1 p.
artikel
21 A generic cell controller for the automated VLSI manufacturing facility 1992
100-101 12 p. 1792-
1 p.
artikel
22 Aging characteristics of ZnO–V2O5-based varistors for surge protection reliability Nahm, Choon-W.
2014
100-101 12 p. 2836-2842
7 p.
artikel
23 Aging of the over-voltage protection elements caused by over-voltages Osmokrovic, Predrag
2002
100-101 12 p. 1959-1966
8 p.
artikel
24 A G|M|M system with M|M switch and orientation time for the repair facility Sarma, Yadavalli V.S.
1992
100-101 12 p. 1663-1666
4 p.
artikel
25 A grain structure based statistical simulation of electromigration damage in chip level interconnect lines Korhonen, T.M.
2000
100-101 12 p. 2053-2060
8 p.
artikel
26 A heuristic approach to optimal assignment of components to a parallel-series network 1992
100-101 12 p. 1781-1782
2 p.
artikel
27 A heuristic task assignment algorithm to maximize reliability of a distributed system 1994
100-101 12 p. 1959-
1 p.
artikel
28 A hierarchical approach to large circuit symbolic simulation Đorđević, S.
2001
100-101 12 p. 2041-2049
9 p.
artikel
29 A high-level VLSI design for ultra-dense instruction set computer architectures 1994
100-101 12 p. 1970-
1 p.
artikel
30 A hybrid silicon carbide differential amplifier for 350°C operation 1994
100-101 12 p. 1969-
1 p.
artikel
31 A linearly dependent service rate for the queue: M/M/1/N with general balk function, reflecting barrier, reneging and an additional server for longer queues Abou El-Ata, M.O.
1992
100-101 12 p. 1693-1698
6 p.
artikel
32 A low cost manufacturing process for high density hybrid components based on multilayer polyimide—ceramic structures 1994
100-101 12 p. 1973-
1 p.
artikel
33 Aluminium recrystallization of transistor due to repeated pulses and the countermeasure 1992
100-101 12 p. 1783-
1 p.
artikel
34 A maintenance planning and business case development model for the application of prognostics and health management (PHM) to electronic systems Sandborn, Peter A.
2007
100-101 12 p. 1889-1901
13 p.
artikel
35 A 0.18μm CMOS ring VCO for clock and data recovery applications Sánchez-Azqueta, C.
2011
100-101 12 p. 2351-2356
6 p.
artikel
36 A mechanism of threshold voltage changes for WN x gate GaAs MESFETs in high temperature storage life tests Kitaura, Y.
1995
100-101 12 p. 1515-1520
6 p.
artikel
37 A method of adhesion strength test for thick film 1994
100-101 12 p. 1973-
1 p.
artikel
38 A methodological approach for predictive reliability: Practical case studies Frémont, H.
2012
100-101 12 p. 3035-3042
8 p.
artikel
39 A microelectronic test structure and numerical algorithm for characterization of liquid immersion heat transfer 1994
100-101 12 p. 1967-1968
2 p.
artikel
40 A model for length of saturation velocity region in double-gate Graphene nanoribbon transistors Ghadiry, M.H.
2011
100-101 12 p. 2143-2146
4 p.
artikel
41 A model for the channel noise of MESFETs including hot electron effects Forbes, L.
1999
100-101 12 p. 1773-1786
14 p.
artikel
42 A multichip package for high-speed logic die 1994
100-101 12 p. 1968-
1 p.
artikel
43 A multilevel epoxy substrate for flip-chip hybrid multichip module applications 1992
100-101 12 p. 1798-1799
2 p.
artikel
44 Analogue and mixed-signal IC design 1992
100-101 12 p. 1794-
1 p.
artikel
45 Analysis and resolution of a thermally accelerated early life failure mechanism in a 40V GaN FET Gajewski, Donald A.
2014
100-101 12 p. 2675-2681
7 p.
artikel
46 Analysis method of pooled data for accelerated life testing Seki, T.
1998
100-101 12 p. 1931-1934
4 p.
artikel
47 Analysis of burn-in time using the general law of reliability Baskin, E.M
2002
100-101 12 p. 1967-1974
8 p.
artikel
48 Analysis of electrically conductive silver ink on stretchable substrates under tensile load Merilampi, Sari
2010
100-101 12 p. 2001-2011
11 p.
artikel
49 Analysis of interior degradation of a laser waveguide using an OBIC monitor Takeshita, Tatsuya
2007
100-101 12 p. 2135-2140
6 p.
artikel
50 Analysis of monitoring policies Gopalan, M.N.
1992
100-101 12 p. 1681-1686
6 p.
artikel
51 Analysis of resistive bridging fault detection in BiCMOS digital IC's 1994
100-101 12 p. 1952-1953
2 p.
artikel
52 Analysis of two stage sampling plain with imperfect inspection 1994
100-101 12 p. 1958-
1 p.
artikel
53 Analytical threshold voltage model for cylindrical surrounding-gate MOSFET with electrically induced source/drain extensions Li, Cong
2011
100-101 12 p. 2053-2058
6 p.
artikel
54 An analytical effective channel-length modulation model for velocity overshoot in submicron MOSFETs based on energy-balance formulation Lim, K.Y.
2002
100-101 12 p. 1857-1864
8 p.
artikel
55 An aqueous developable photoimageable silver conductor composition for high density electronic packaging Umarji, G.G.
2005
100-101 12 p. 1903-1909
7 p.
artikel
56 An ATM switch hardware technologies using multichip packaging 1994
100-101 12 p. 1966-1967
2 p.
artikel
57 An automated ultrasonic inspection approach for flip chip solder joint assessment Yang, Ryan S.H.
2012
100-101 12 p. 2995-3001
7 p.
artikel
58 An electric double-layer capacitor with high capacitance and low resistance 1992
100-101 12 p. 1784-1785
2 p.
artikel
59 An equipment model for polysilicon LPC VD 1992
100-101 12 p. 1797-
1 p.
artikel
60 An ESD test reduction method for complex devices Maksimovic, Dejan
2009
100-101 12 p. 1465-1469
5 p.
artikel
61 A new algorithm for reliability evaluation of telecommunication networks with link-capacities Qiu, Liu Yan
1994
100-101 12 p. 1943-1946
4 p.
artikel
62 A new compact model for external latchup Farbiz, Farzan
2009
100-101 12 p. 1447-1454
8 p.
artikel
63 A new hole mobility model for hydrodynamic simulation Lee, Chanho
2000
100-101 12 p. 2019-2022
4 p.
artikel
64 A new method for extracting the effective channel length of MOSFETs Ortiz-Conde, A.
1998
100-101 12 p. 1867-1870
4 p.
artikel
65 A new method to compute reliability of repairable m-out-of-n systems by arbitrary distributions Gurov, S.V.
1994
100-101 12 p. 1877-1889
13 p.
artikel
66 A new statistical methodology predicting chip failure probability considering electromigration Sun, Ted
2013
100-101 12 p. 1979-1986
8 p.
artikel
67 An examination of the applicability of the DNP metric on first level reliability assessments in underfilled electronic packages Dauksher, W.
2003
100-101 12 p. 2011-2020
10 p.
artikel
68 An experimental study of the thermally activated processes in polycrystalline silicon thin film transistors Michalas, L.
2007
100-101 12 p. 2058-2064
7 p.
artikel
69 An explicit multi-exponential model for semiconductor junctions with series and shunt resistances Lugo-Muñoz, Denise
2011
100-101 12 p. 2044-2048
5 p.
artikel
70 An extensible fault-tolerant network architecture 1994
100-101 12 p. 1970-
1 p.
artikel
71 An IGBT DC subcircuit model with non-destructive parameters extraction and comparison with measurements Yuan, Shoucai
2002
100-101 12 p. 1991-1996
6 p.
artikel
72 An investigation into warpages, stresses and keep-out zone in 3D through-silicon-via DRAM packages Tsai, M.Y.
2014
100-101 12 p. 2898-2904
7 p.
artikel
73 An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler Yim, Byung-Seung
2014
100-101 12 p. 2944-2950
7 p.
artikel
74 Anisotropic conductive film flip chip joining using thin chips Jokinen, Erja
2002
100-101 12 p. 1913-1920
8 p.
artikel
75 Anomalies in interpreting a fault tree 1994
100-101 12 p. 1958-
1 p.
artikel
76 A note on expected Fisher information for the Burr XII distribution Watkins, A.J.
1997
100-101 12 p. 1849-1852
4 p.
artikel
77 A partial-SOI LDMOSFET with triangular buried-oxide for breakdown voltage improvement Saremi, Mehdi
2011
100-101 12 p. 2069-2076
8 p.
artikel
78 A plug-and-play wideband RF circuit ESD protection methodology: T-diodes Linten, D.
2009
100-101 12 p. 1440-1446
7 p.
artikel
79 A point-by-point multiple sweep numerical algorithm for dopant profiling based on C-V data 1992
100-101 12 p. 1786-
1 p.
artikel
80 A pooling procedure for life-test data 1994
100-101 12 p. 1960-
1 p.
artikel
81 Application of a ‘surrogate’ layer for lower bending stress in a vulnerable material of a tri-material body Suhir, E.
1998
100-101 12 p. 1949-1954
6 p.
artikel
82 Application of 1/f noise measurements to the characterization of near-interface oxide traps in ULSI n-MOSFETs Villa, S.
1998
100-101 12 p. 1919-1923
5 p.
artikel
83 Application of reliability concepts in automatic identification 1994
100-101 12 p. 1958-
1 p.
artikel
84 Application of RPN analysis to parameter optimization of passive components Chen, K.S.
2010
100-101 12 p. 2012-2019
8 p.
artikel
85 Application of statistical analysis to determine the priority for improving LSI technology 1992
100-101 12 p. 1790-
1 p.
artikel
86 Application of three-parameter lognormal distribution in EM data analysis Li, Baozhen
2006
100-101 12 p. 2049-2055
7 p.
artikel
87 Applying statistics to find the causes of variability in aluminum evaporation: a case study 1992
100-101 12 p. 1797-
1 p.
artikel
88 A quantitative technique to analyze materials trade-off for SEM “E” 1992
100-101 12 p. 1796-
1 p.
artikel
89 A recursive algorithm evaluating the exact reliability of a consecutive κ-within-m-out-of-n:F system Malinowski, Jacek
1995
100-101 12 p. 1461-1465
5 p.
artikel
90 A reliability comparison of InGaP/GaAs HBTs with and without passivation ledge Yan, B.P
2001
100-101 12 p. 1959-1963
5 p.
artikel
91 A reliability model for connector contacts 1992
100-101 12 p. 1782-
1 p.
artikel
92 A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive Li, Jue
2012
100-101 12 p. 2962-2969
8 p.
artikel
93 A review of gate tunneling current in MOS devices Ranuárez, Juan C.
2006
100-101 12 p. 1939-1956
18 p.
artikel
94 A review of HVI technology Qiao, Ming
2014
100-101 12 p. 2704-2716
13 p.
artikel
95 A review of testing methods for mixed-signal ICs 1994
100-101 12 p. 1953-
1 p.
artikel
96 A review of the skin effect as applied to thin film interconnections 1992
100-101 12 p. 1799-
1 p.
artikel
97 A sampling scheme for estimating the reliability of a series system 1994
100-101 12 p. 1961-
1 p.
artikel
98 A self-consistent extraction procedure for source/drain resistance in MOSFETs Chang, Yang-Hua
2011
100-101 12 p. 2049-2052
4 p.
artikel
99 ASIC device technology holds key to rapid progress of LSI technology 1994
100-101 12 p. 1970-
1 p.
artikel
100 ASIC technology makes remarkable strides 1994
100-101 12 p. 1969-1970
2 p.
artikel
101 ASIC testing upgraded 1992
100-101 12 p. 1796-
1 p.
artikel
102 A simplified graphical method for deriving system steady-state probability 1994
100-101 12 p. 1956-
1 p.
artikel
103 A simulation-based multi-objective design optimization of electronic packages under thermal cycling and bending Xu, Leon
2004
100-101 12 p. 1977-1983
7 p.
artikel
104 A sputter-etching target and rotational carousel for multilayer films 1994
100-101 12 p. 1965-
1 p.
artikel
105 Assembling and troubleshooting microcomputers Second edition Popentiu, Florin
1992
100-101 12 p. 1777-
1 p.
artikel
106 Assessing the performance of crack detection tests for solder joints Ridout, Stephen
2006
100-101 12 p. 2122-2130
9 p.
artikel
107 Assessment of acceleration models used for BGA solder joint reliability studies Yang, Liyu
2009
100-101 12 p. 1546-1554
9 p.
artikel
108 A standardized method for CMOS unit process development 1992
100-101 12 p. 1784-
1 p.
artikel
109 A statistical approach to characterizing the reliability of systems utilizing HBT devices Chen, Yuan
2005
100-101 12 p. 1869-1874
6 p.
artikel
110 A straightforward analytical method for extraction of semiconductor device transient thermal parameters Masana, F.N.
2007
100-101 12 p. 2122-2128
7 p.
artikel
111 A study of a method for evaluating small size samples—judgement of small numbers of test data taking into account variability 1992
100-101 12 p. 1785-
1 p.
artikel
112 A study of defects induced in GaAs by plasma etching 1992
100-101 12 p. 1798-
1 p.
artikel
113 A study of ESD-induced defects in high-voltage nMOS and pMOS transistors 1992
100-101 12 p. 1784-
1 p.
artikel
114 A survey of reliability-prediction procedures for microelectronic devices 1992
100-101 12 p. 1784-
1 p.
artikel
115 A survey of the thermal stability of an active heat sink De Baetselier, Erwin
1997
100-101 12 p. 1805-1812
8 p.
artikel
116 Asynchronous reliability growth for multi-device in same type 1992
100-101 12 p. 1786-
1 p.
artikel
117 A systematic evaluation of factors influencing TAB inner lead reliability 1994
100-101 12 p. 1950-
1 p.
artikel
118 A system for production use of high-level synthesis 1994
100-101 12 p. 1969-
1 p.
artikel
119 Atomic-layer-deposited silicon-nitride/SiO2 stack––a highly potential gate dielectrics for advanced CMOS technology Nakajima, Anri
2002
100-101 12 p. 1823-1835
13 p.
artikel
120 A two-unit priority standby system subject to random shocks and Releigh failure-time distribution Gupta, Rakesh
1992
100-101 12 p. 1713-1723
11 p.
artikel
121 A two-unit standby system with imperfect switch, preventive maintenance and correlated failures and repairs Goel, L.R.
1992
100-101 12 p. 1687-1691
5 p.
artikel
122 A unique approach to teaching electronic packaging 1994
100-101 12 p. 1962-1963
2 p.
artikel
123 Author Index 2001
100-101 12 p. 2091-2095
5 p.
artikel
124 Author Index for Volume 46 2006
100-101 12 p. XVII-XXII
nvt p.
artikel
125 Author index for Volume 44 2004
100-101 12 p. 2049-2054
6 p.
artikel
126 Author index for Volume 45 - autogenerate 2005
100-101 12 p. 1969-1976
8 p.
artikel
127 Author Index to Volume 42 2002
100-101 12 p. 2029-2034
6 p.
artikel
128 Author Index to Volume 42 2003
100-101 12 p. 2113-2119
7 p.
artikel
129 Automated vision system for inspection of IC pads and bonds 1994
100-101 12 p. 1952-
1 p.
artikel
130 Automated visual inspection system for bonded IC wires 1994
100-101 12 p. 1953-
1 p.
artikel
131 Availability, MTTF and cost analysis of a three-state parallel redundant multi-component system under critical human failures Elias, S.S.
1992
100-101 12 p. 1741-1761
21 p.
artikel
132 Availability of a parallel system with preventive maintenance and common-cause failures 1992
100-101 12 p. 1787-
1 p.
artikel
133 Availability of systems with partially observable failures 1992
100-101 12 p. 1787-
1 p.
artikel
134 Availability of the crystallization system in the sugar industry under common-cause failure 1992
100-101 12 p. 1781-
1 p.
artikel
135 A VLSI placement method using Tabu search 1992
100-101 12 p. 1791-
1 p.
artikel
136 A yield improvement technique in severe process, voltage, and temperature variations and extreme voltage scaling Radfar, Mohsen
2014
100-101 12 p. 2813-2823
11 p.
artikel
137 Back gate bias method of threshold voltage control for the design of low voltage CMOS ternary logic circuits Srivastava, A.
2000
100-101 12 p. 2107-2110
4 p.
artikel
138 Bayes credibility intervals for the left-truncated exponential distribution Calabria, R.
1994
100-101 12 p. 1897-1907
11 p.
artikel
139 Bayes estimation of hazard and acceleration in accelerated testing 1992
100-101 12 p. 1789-
1 p.
artikel
140 Behaviour analysis and performability of a co-operative motion system modelled by Petri Net 1994
100-101 12 p. 1955-
1 p.
artikel
141 Binary and phase shifting mask design for optical lithography 1992
100-101 12 p. 1795-
1 p.
artikel
142 Board level drop test and simulation of leaded and lead-free BGA-PCB assembly Qu, Xin
2007
100-101 12 p. 2197-2204
8 p.
artikel
143 Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages Tee, Tong Yan
2004
100-101 12 p. 1957-1965
9 p.
artikel
144 Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA Tee, Tong Yan
2006
100-101 12 p. 2131-2138
8 p.
artikel
145 Board testers merge in-circuit and functional test 1992
100-101 12 p. 1796-
1 p.
artikel
146 Book review 1998
100-101 12 p. 1977-
1 p.
artikel
147 Book review 1998
100-101 12 p. 1975-1976
2 p.
artikel
148 Breakdown characteristics of emitter-base and collector-base junctions of silicon bipolar junction transistors 1992
100-101 12 p. 1782-
1 p.
artikel
149 Bulk feeding technology for small, rectangular chip components 1994
100-101 12 p. 1965-
1 p.
artikel
150 Bulk oxide charge and slow states in Si–SiO2 structures generated by RIE-mode plasma Paskaleva, A
2000
100-101 12 p. 2033-2037
5 p.
artikel
151 Burn-in: still a hot topic 1992
100-101 12 p. 1781-
1 p.
artikel
152 Calendar 2009
100-101 12 p. I-II
nvt p.
artikel
153 Calendar 2010
100-101 12 p. I-II
nvt p.
artikel
154 Calendar of forthcoming events 1997
100-101 12 p. 1883-1893
11 p.
artikel
155 Capability indices for non-normal distributions with an application in electrolytic capacitor manufacturing Pearn, W.L.
1997
100-101 12 p. 1853-1858
6 p.
artikel
156 Capacitance of disk capacitors 1994
100-101 12 p. 1949-
1 p.
artikel
157 Capacitors adopt new technologies compatible with product trends 1992
100-101 12 p. 1782-
1 p.
artikel
158 Card connectors adopt to wide variety of IC memory cards 1994
100-101 12 p. 1970-
1 p.
artikel
159 CCGA packages for space applications Ghaffarian, Reza
2006
100-101 12 p. 2006-2024
19 p.
artikel
160 CDM tests on interface test chips for the verification of ESD protection concepts Brodbeck, Tilo
2009
100-101 12 p. 1470-1475
6 p.
artikel
161 Characteristics degradation of the SiGe HBT under electromagnetic field stress Alaeddine, A.
2010
100-101 12 p. 1961-1966
6 p.
artikel
162 Characteristic study of anisotropic-conductive film for chip-on-film packaging Chang, Shyh-Ming
2001
100-101 12 p. 2001-2009
9 p.
artikel
163 Characterization and FE analysis on the shear test of electronic materials Gonzalez, M.
2004
100-101 12 p. 1915-1921
7 p.
artikel
164 Characterization of gas transport through micromachined submicron channels in silicon 1994
100-101 12 p. 1971-
1 p.
artikel
165 Characterization of InGaAs-ALGaAs-GaAs heteroepitaxial structures by transmission electron microscopy and energy dispersive spectroscopy 1994
100-101 12 p. 1971-1972
2 p.
artikel
166 Characterization of the transient behavior of gated/STI diodes and their associated BJT in the CDM time domain Manouvrier, Jean-Robert
2009
100-101 12 p. 1424-1432
9 p.
artikel
167 Charge trapping and reliability characteristics of ultra-thin HfYO x films on n-GaAs substrates Das, P.S.
2010
100-101 12 p. 1924-1930
7 p.
artikel
168 Classification of high-voltage varistors into groups of differentiated quality Hasse, Lech
2009
100-101 12 p. 1483-1490
8 p.
artikel
169 CMOS Telecom Data converters; Angel Rodriguez-Vazquez, Fernando Medeiro, Edmond Janssens, editors. Kluwer Academic Publishers, Boston; 2003. Hardcover, 588pp, plus XXXIII, 128 euro. ISBN 1-4020-7546-4 Stojcev, Mile
2004
100-101 12 p. 2029-2030
2 p.
artikel
170 Communication requirements spur changes in small chip filters, ceramic resonators 1994
100-101 12 p. 1951-
1 p.
artikel
171 Compact modeling and simulation of Random Telegraph Noise under non-stationary conditions in the presence of random dopants Wirth, G.
2012
100-101 12 p. 2955-2961
7 p.
artikel
172 Comparative evaluation of optical waveguides as alternative interconnections for high performance packaging 1992
100-101 12 p. 1793-1794
2 p.
artikel
173 Comparative study of submicron BiCMOS technologies 1992
100-101 12 p. 1792-
1 p.
artikel
174 Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy Islam, M.N
2003
100-101 12 p. 2031-2037
7 p.
artikel
175 Comparison of electrical stress-induced charge carrier generation/trapping and related degradation of SiO2 and HfO2/SiO2 gate dielectric stacks Samanta, Piyas
2010
100-101 12 p. 1907-1914
8 p.
artikel
176 Comparison of methods for determining the capacitance of planar transmission lines with application to multichip module characterization 1994
100-101 12 p. 1966-
1 p.
artikel
177 Compatability of common MCM-D dielectric with scanning laser ablation via generation processes 1994
100-101 12 p. 1974-
1 p.
artikel
178 Component procurement and allocation for products assembled to forecast: risk-pooling effects 1994
100-101 12 p. 1954-
1 p.
artikel
179 Computation availability of crossbar systems in a non-uniform traffic environment Atiquzzaman, M.
1994
100-101 12 p. 1931-1937
7 p.
artikel
180 Computerized continuous sampling plans with finite production 1994
100-101 12 p. 1956-
1 p.
artikel
181 Concept of accelerated life test and implementation—a study on evaluation for solder joint fatigue of automotive electronic components 1992
100-101 12 p. 1782-1783
2 p.
artikel
182 Concept of smart integrated life consumption monitoring system for electronics Rouet, Vincent
2007
100-101 12 p. 1921-1927
7 p.
artikel
183 Concurrent error detection and fault-tolerance in linear analog circuits using continuous checksums 1994
100-101 12 p. 1953-1954
2 p.
artikel
184 Concurrent testing in high level synthesis Ismaeel, A.A.
2000
100-101 12 p. 2095-2106
12 p.
artikel
185 Conduction mechanisms in thermal nitride and dry gate oxides grown on 4H-SiC Ouennoughi, Z.
2013
100-101 12 p. 1841-1847
7 p.
artikel
186 Conductive adhesives for through holes and blind vias metallization Kisiel, Ryszard
2005
100-101 12 p. 1935-1940
6 p.
artikel
187 Connectors for IC memory cards developed for higher reliability 1992
100-101 12 p. 1785-
1 p.
artikel
188 Consecutive-2-out-of-n:F systems with node and link failures 1994
100-101 12 p. 1955-
1 p.
artikel
189 Constitutive modeling on creep deformation for a SnPb-based composite solder reinforced with microsized Cu particles Shi, Yaowu
2010
100-101 12 p. 2020-2025
6 p.
artikel
190 Contents of volume 46 2006
100-101 12 p. III-XVI
nvt p.
artikel
191 Contents of Volume 44 2004
100-101 12 p. 2035-2048
14 p.
artikel
192 Contents of Volume 45 - autogenerate 2005
100-101 12 p. 1953-1968
16 p.
artikel
193 Controlling of conduction mechanism and electronic parameters of silicon–metal junction by mixed Methylene Blue/2′-7′-dichlorofluorescein Soylu, M.
2013
100-101 12 p. 1901-1906
6 p.
artikel
194 Controlling of electrical and interface state density properties of ZnO:Co/p-silicon diode structures by compositional fraction of cobalt dopant Yakuphanoglu, F.
2011
100-101 12 p. 2195-2199
5 p.
artikel
195 Cooperative Hybrid ARQ in Solar Powered Wireless Sensor Networks Jalali, Fatemeh
2012
100-101 12 p. 3043-3052
10 p.
artikel
196 Corrosion behavior, whisker growth, and electrochemical migration of Sn–3.0Ag–0.5Cu solder doping with In and Zn in NaCl solution Hua, L.
2011
100-101 12 p. 2274-2283
10 p.
artikel
197 Corrosion-induced degradation of GaAs PHEMTs under operation in high humidity conditions Hisaka, Takayuki
2009
100-101 12 p. 1515-1519
5 p.
artikel
198 Corrosion of thin film aluminum metallization: conformal coating materials 1994
100-101 12 p. 1950-
1 p.
artikel
199 Cost analysis of a two-unit repairable system subject to on-line preventive maintenance and/or repair Gopalan, M.N.
1992
100-101 12 p. 1675-1679
5 p.
artikel
200 Cost optimization of maintenance scheduling for a system with assured reliability 1992
100-101 12 p. 1788-
1 p.
artikel
201 Counting the number of minimum cuts in undirected multigraphs 1992
100-101 12 p. 1788-
1 p.
artikel
202 Coupled electro-thermal simulation of a DC/DC converter Vellvehi, Miquel
2007
100-101 12 p. 2114-2121
8 p.
artikel
203 Crack propagation in multilayer thin-film structures of electronic packages using the peridynamic theory Agwai, A.
2011
100-101 12 p. 2298-2305
8 p.
artikel
204 Creativity and discipline—quality management in software 1994
100-101 12 p. 1963-
1 p.
artikel
205 Current-dependent hot-electron stresses on InGaP-gated and AlGaAs-gated low noise PHEMTs Huang, Hou-Kuei
2006
100-101 12 p. 2038-2043
6 p.
artikel
206 Customized glass sealant for ceramic substrates for high temperature electronic application Sharif, Ahmed
2014
100-101 12 p. 2905-2910
6 p.
artikel
207 Cut off frequency and transit time analysis of lightly doped drain (LDD) MOSFETs Thomas, Ciby
1998
100-101 12 p. 1955-1961
7 p.
artikel
208 DC and pulsed measurements of on-state breakdown voltage in GaAs MESFETs and InP-based HEMTs Meneghesso, Gaudenzio
1999
100-101 12 p. 1759-1763
5 p.
artikel
209 Decapsulation technique using electrochemical etching for failure analysis of WLCSP n-type Si assembled module devices Naoe, Takuya
2012
100-101 12 p. 3017-3021
5 p.
artikel
210 Decision theory in maintenance strategy for a two-unit redundant standby system 1994
100-101 12 p. 1959-1960
2 p.
artikel
211 Decrease in on-state gate current of AlGaN/GaN HEMTs by recombination-enhanced defect reaction of generated hot carriers investigated by TCAD simulation Sasaki, Hajime
2014
100-101 12 p. 2662-2667
6 p.
artikel
212 Deep-depletion-layer impact-ionization-induced gate-oxide breakdown in thin-oxide n-MOSFETs 1994
100-101 12 p. 1971-
1 p.
artikel
213 Defect detection of flip-chip solder joints using modal analysis Liu, Junchao
2012
100-101 12 p. 3002-3010
9 p.
artikel
214 Defect generation in InGaN/GaN light-emitting diodes under forward and reverse electrical stresses Cao, X.A.
2003
100-101 12 p. 1987-1991
5 p.
artikel
215 Deformation analysis in microstructures and micro-devices Liu, Zhanwei
2007
100-101 12 p. 2226-2230
5 p.
artikel
216 Degradation behavior of the active region and passive region in buried heterostructure (BH) distributed Bragg reflector (DBR) lasers Mawatari, H.
1999
100-101 12 p. 1857-1861
5 p.
artikel
217 Degradation mechanism of concentrator solar receivers without protection layer Hong, Hwen-Fen
2013
100-101 12 p. 1927-1932
6 p.
artikel
218 Degradation mechanisms of GaAs PHEMTs in high humidity conditions Hisaka, Takayuki
2005
100-101 12 p. 1894-1900
7 p.
artikel
219 Degradation of AlGaAs/GaAs HBTs induced by hot carriers Song, Chung-Kun
1998
100-101 12 p. 1907-1912
6 p.
artikel
220 Degradation of d.c. parameters in enhancement mode WN x self-aligned gate GaAs MESFETs under high temperature stress Mun, Jae Kyoung
1999
100-101 12 p. 1793-1800
8 p.
artikel
221 Degradation of thermal interface materials for high-temperature power electronics applications Skuriat, R.
2013
100-101 12 p. 1933-1942
10 p.
artikel
222 Degradation of thin oxides during electrical stress Bersuker, Gennadi
2001
100-101 12 p. 1923-1931
9 p.
artikel
223 Degradation transformation in spinel-type functional thick-film ceramic materials Klym, H.
2014
100-101 12 p. 2843-2848
6 p.
artikel
224 Delay fault testing using partial multiple scan chains Bareisa, Eduardas
2013
100-101 12 p. 2070-2077
8 p.
artikel
225 Demagnifying ion projection a promising alternative to optical and X-ray lithography 1994
100-101 12 p. 1974-1975
2 p.
artikel
226 Design and analysis of noise margin, write ability and read stability of organic and hybrid 6-T SRAM cell Kumar, Brijesh
2014
100-101 12 p. 2801-2812
12 p.
artikel
227 Design and control of RF power amplifier; Alireza Shirvani, Bruce Wooley. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 149, plus XVI, 127 euro. ISBN 1-4020-7562-6 Stojcev, Mile
2004
100-101 12 p. 2031-2032
2 p.
artikel
228 Design and fabrication of neurostimulator implants—selected problems Zaraska, W.
2005
100-101 12 p. 1930-1934
5 p.
artikel
229 Design and simulation of a test pattern for three-dimensional latch-up analysis 1994
100-101 12 p. 1960-
1 p.
artikel
230 Design of a new test structure for the study of electromigration with early resistance change measurements De Ceuninck, W.
1997
100-101 12 p. 1813-1816
4 p.
artikel
231 Design of a novel fault-tolerant voter circuit for TMR implementation to improve reliability in digital circuits Kshirsagar, R.V.
2009
100-101 12 p. 1573-1577
5 p.
artikel
232 Design of a self-testing and self-repairing structure for highly hierarchical ultra-large capacity memory chip 1994
100-101 12 p. 1965-
1 p.
artikel
233 Design optimization of gate-silicided ESD NMOSFETs in a 45nm bulk CMOS technology Alvarez, David
2009
100-101 12 p. 1417-1423
7 p.
artikel
234 Design rule related defects formation Hsieh, Y.F.
1998
100-101 12 p. 1871-1880
10 p.
artikel
235 Detailed investigation of the effects of La and Al content on the electrical characteristics and reliability properties of La–Al–O gate dielectrics Suzuki, Masamichi
2010
100-101 12 p. 1920-1923
4 p.
artikel
236 Determination of thermal resistance using Gummel measurement for InGaP/GaAs HBTs Chang, Yang-Hua
2006
100-101 12 p. 2074-2078
5 p.
artikel
237 Determining constant voltage lifetimes for silicon nitride capacitors in a GaAs IC process by a step stress method Whitman, Charles
2005
100-101 12 p. 1882-1893
12 p.
artikel
238 Development of an RF IV waveform based stress test procedure for use on GaN HFETs McGenn, William
2012
100-101 12 p. 2880-2883
4 p.
artikel
239 Development of the high speed temperature cycle test 1992
100-101 12 p. 1792-
1 p.
artikel
240 Dielectric thinning model applied to metal insulator metal capacitors with Al2O3 dielectric Allers, K.H.
2009
100-101 12 p. 1520-1528
9 p.
artikel
241 Diffusion approximations to the dependability of a transport system Yadavalli, V.S.S.
1995
100-101 12 p. 1495-1499
5 p.
artikel
242 Direct bonding of GaAs films on silicon circuits by epitaxial liftoff 1994
100-101 12 p. 1971-
1 p.
artikel
243 Direct correlation between reliability and pH changes of phosphors for white light-emitting diodes Choi, Minho
2014
100-101 12 p. 2849-2852
4 p.
artikel
244 Discrete reliability-growth models based on a learning-curve property 1994
100-101 12 p. 1956-
1 p.
artikel
245 Discussion of failures and their causes in electronic devices (belong to MTTF system) 1992
100-101 12 p. 1785-
1 p.
artikel
246 DRAMs hold sway in semiconductor memory fields 1992
100-101 12 p. 1796-
1 p.
artikel
247 Drop simulation/experimental verification and shock resistance improvement of TFT–LCD monitors Pan, Min-Chun
2007
100-101 12 p. 2249-2259
11 p.
artikel
248 DSP based overcurrent relay using fuzzy bang–bang controller Goh, Yin Lee
2011
100-101 12 p. 2366-2373
8 p.
artikel
249 Dynamic behavior of resistive faults in nanometer technology Kunchwar, Mayuri
2007
100-101 12 p. 2141-2146
6 p.
artikel
250 Dynamic flow measurements of capillary underfill through a bump array in flip chip package Lee, Seok Hwan
2010
100-101 12 p. 2078-2083
6 p.
artikel
251 Dynamic hot-carrier induced degradation in n-channel polysilicon thin-film transistors Tassis, D.H.
2006
100-101 12 p. 2032-2037
6 p.
artikel
252 Eastern Europe in the global microelectronics marketplace 1994
100-101 12 p. 1963-
1 p.
artikel
253 E-beam test system with higher performance by improving signal source 1992
100-101 12 p. 1799-
1 p.
artikel
254 Editorial Ersland, Peter
2014
100-101 12 p. 2649-
1 p.
artikel
255 Editorial Reiche, Hans
1994
100-101 12 p. 1863-
1 p.
artikel
256 Editorial Ersland, Peter
2012
100-101 12 p. 2863-
1 p.
artikel
257 Editorial Ersland, Peter
2005
100-101 12 p. 1868-
1 p.
artikel
258 Editorial board 2011
100-101 12 p. IFC-
1 p.
artikel
259 Editorial ESD reliability special section Vassilev, Vesselin
2009
100-101 12 p. 1405-1406
2 p.
artikel
260 Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads Gain, Asit Kumar
2011
100-101 12 p. 2306-2313
8 p.
artikel
261 Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol–gel method with catalyst HF He, Z.W.
2006
100-101 12 p. 2062-2066
5 p.
artikel
262 Effect of displacement rate on ball shear properties for Sn–37Pb and Sn–3.5Ag BGA solder joints during isothermal aging Koo, Ja-Myeong
2007
100-101 12 p. 2169-2178
10 p.
artikel
263 Effect of electron irradiation on morphological, compositional and electrical properties of nanocluster carbon thin films grown using room temperature based cathodic arc process for large area microelectronics De, Shounak
2014
100-101 12 p. 2740-2746
7 p.
artikel
264 Effect of moisture condensation on long-term reliability of crystalline silicon photovoltaic modules Park, Nochang
2013
100-101 12 p. 1922-1926
5 p.
artikel
265 Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads Fouzder, Tama
2010
100-101 12 p. 2051-2058
8 p.
artikel
266 Effect of solder creep on the reliability of large area die attachment Zhuang, W.D.
2001
100-101 12 p. 2011-2021
11 p.
artikel
267 Effect of solder pads on the fatigue life of FBGA memory modules under harmonic excitation by using a global–local modeling technique Cinar, Yusuf
2013
100-101 12 p. 2043-2051
9 p.
artikel
268 Effect of substrate flexibility on solder joint reliability Liu, Xingsheng
2002
100-101 12 p. 1883-1891
9 p.
artikel
269 Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu Peng, Weiqun
2007
100-101 12 p. 2161-2168
8 p.
artikel
270 Effect of voids on the reliability of BGA/CSP solder joints Yunus, Mohammad
2003
100-101 12 p. 2077-2086
10 p.
artikel
271 Effects of alloying elements on microstructure and thermal aging properties of Au bonding wire Kim, Hyung-Giun
2011
100-101 12 p. 2250-2256
7 p.
artikel
272 Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface Pang, X.Y.
2011
100-101 12 p. 2330-2335
6 p.
artikel
273 Effects of InGaP heteropassivation on reliability of GaAs HBTs Song, Chung-Kun
1999
100-101 12 p. 1817-1822
6 p.
artikel
274 Effects of parylene coating on the thermal fatigue life of solder joints in ceramic packages 1994
100-101 12 p. 1948-
1 p.
artikel
275 Effects of PCBM concentration on the electrical properties of the Au/P3HT:PCBM/n-Si (MPS) Schottky barrier diodes Tüzün Özmen, Özge
2014
100-101 12 p. 2766-2774
9 p.
artikel
276 Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration Chen, Kuo-Ming
2006
100-101 12 p. 2104-2111
8 p.
artikel
277 Effects of width scaling and layout variation on dual damascene copper interconnect electromigration Lin, M.H.
2007
100-101 12 p. 2100-2108
9 p.
artikel
278 Effects of zirconium doping on the characteristics of tin oxide thin film transistors Han, Dong-Suk
2013
100-101 12 p. 1875-1878
4 p.
artikel
279 Efficient critical area measurements of IC layout applied to quality and reliability enhancement Allan, Gerard A.
1997
100-101 12 p. 1825-1833
9 p.
artikel
280 Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion van der Sluis, O.
2007
100-101 12 p. 1975-1982
8 p.
artikel
281 Electrical characterization of oxide in MOS devices using low energy electron beam filling of traps 1994
100-101 12 p. 1975-
1 p.
artikel
282 Electrical design technology for low dielectric constant multilayer ceramic substrate 1992
100-101 12 p. 1793-
1 p.
artikel
283 Electrical measurements of voltage stressed Al2O3/GaAs MOSFET Tang, Z.
2007
100-101 12 p. 2082-2087
6 p.
artikel
284 Electric testers lead in market growth electric measuring instruments 1992
100-101 12 p. 1781-
1 p.
artikel
285 Electro- and thermo-migration induced failure mechanisms in Package on Package Meinshausen, L.
2012
100-101 12 p. 2889-2906
18 p.
artikel
286 Electromechanical controlled phased array dumbbell EBG beam steerer Fu, Jeffrey S.
2010
100-101 12 p. 2093-2097
5 p.
artikel
287 Electronic circuit reliability modeling Bernstein, Joseph B.
2006
100-101 12 p. 1957-1979
23 p.
artikel
288 Electronic equipment packaging technology Gavrilescu, Dana
1992
100-101 12 p. 1778-
1 p.
artikel
289 Electronic prognostics – A case study using global positioning system (GPS) Brown, Douglas W.
2007
100-101 12 p. 1874-1881
8 p.
artikel
290 Electronic prognostics for switched mode power supplies Goodman, Douglas
2007
100-101 12 p. 1902-1906
5 p.
artikel
291 Encapsulation of naked dies for bulk silicon etching with TMAH Liebert, Silke
2002
100-101 12 p. 1939-1944
6 p.
artikel
292 Erratum to “Determining factors affecting ESD failure voltage using DOE” [Microelectron. Reliab. 46 (2006) 1228–1237] Whitman, Charles
2006
100-101 12 p. 2160-
1 p.
artikel
293 Erratum to “On the reliability of electrostatic NEMS/MEMS devices: Review of present knowledge on the dielectric charging and stiction failure mechanisms and novel characterization methodologies” [MR 51/9–11 (2011) 1810–1818] Zaghloul, Usama
2011
100-101 12 p. 2416-
1 p.
artikel
294 Erratum to “Reliability results of HBTs with an InGaP emitter” [Microelectron. Reliab. 46 (2006) 1261–1271] Whitman, Charles S.
2006
100-101 12 p. 2159-
1 p.
artikel
295 ESD robust high-voltage active clamps Notermans, Guido
2009
100-101 12 p. 1433-1439
7 p.
artikel
296 ESD robustness of thin-film devices with different layout structures in LTPS technology Deng, Chih-Kang
2006
100-101 12 p. 2067-2073
7 p.
artikel
297 Estimating the reliability of electrical connectors 1992
100-101 12 p. 1782-
1 p.
artikel
298 Estimation and testing in an imperfect-inspection model 1994
100-101 12 p. 1957-
1 p.
artikel
299 Estimation of network reliability using graph evolution models 1992
100-101 12 p. 1789-
1 p.
artikel
300 Estimation of the reliability of digital systems implemented on programmable devices Vasiltsov, Igor V.
2000
100-101 12 p. 2087-2093
7 p.
artikel
301 Estimators for type-II censored (log) normal samples 1992
100-101 12 p. 1789-
1 p.
artikel
302 Estimators of two-parameter Weibull distributions from incomplete data with residual lifetimes 1994
100-101 12 p. 1959-
1 p.
artikel
303 Evaluate the orderings of risk for failure problems using a more general RPN methodology Chang, Kuei-Hu
2009
100-101 12 p. 1586-1596
11 p.
artikel
304 Evaluating nanotribological behavior of annealing Si0.8Ge0.2/Si films Wu, Ming-Jhang
2011
100-101 12 p. 2223-2227
5 p.
artikel
305 Evaluation and comparison of fault-tolerant software techniques 1994
100-101 12 p. 1955-1956
2 p.
artikel
306 Evaluation of compatibility of thick-film PTC thermistors and LTCC structures Belavič, Darko
2005
100-101 12 p. 1924-1929
6 p.
artikel
307 Evaluation of reliability and metallurgical integrity of wire bonds and lead free solder joints on flexible printed circuit board sample modules Rooney, Daniel T.
2007
100-101 12 p. 2152-2160
9 p.
artikel
308 Evaluation of solder joint strengths under ball impact test Lai, Yi-Shao
2007
100-101 12 p. 2179-2187
9 p.
artikel
309 Evolution of GaAs ICs containing ferroelectric capacitor 1994
100-101 12 p. 1952-
1 p.
artikel
310 Exact fiducial bounds for the reliability of series systems with components having exponential time to failure distributions El-Mawaziny, Ahmed H.
1992
100-101 12 p. 1667-1673
7 p.
artikel
311 Examination of hot carrier effects of the AlGaAs/InGaAs pHEMT through device simulation Steighner, Jason B.
2012
100-101 12 p. 2932-2940
9 p.
artikel
312 Examination of the voltage screening method in power MOSFET 1992
100-101 12 p. 1783-
1 p.
artikel
313 Experimental investigation on the performance of CPU coolers: Effect of heat pipe inclination angle and the use of nanofluids Yousefi, T.
2013
100-101 12 p. 1954-1961
8 p.
artikel
314 Experimental study and theoretical prediction of aging induced frequency shift of crystal resonators and oscillators Roh, Y.S.
2003
100-101 12 p. 1993-2000
8 p.
artikel
315 Experimental study of filling behaviors in the underfill encapsulation of a flip-chip Shih, Meng-Fu
2009
100-101 12 p. 1555-1562
8 p.
artikel
316 Explanation of impact load curve in ball impact test in relation to thermal aging Daito, Tomoya
2013
100-101 12 p. 2005-2011
7 p.
artikel
317 Exponentiated Weibull family for analyzing bathtub failure-rate data 1994
100-101 12 p. 1959-
1 p.
artikel
318 Exposure technology suits semiconductor mass-production 1992
100-101 12 p. 1796-
1 p.
artikel
319 Extraction of the lateral distribution of interface traps in MOSFETs by a novel combined gated-diode technique He, Jin
2001
100-101 12 p. 1953-1957
5 p.
artikel
320 Fabrication and enhanced field emission properties of novel silicon nanostructures Ravipati, Srikanth
2010
100-101 12 p. 1973-1976
4 p.
artikel
321 Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant 1994
100-101 12 p. 1966-
1 p.
artikel
322 Facing the challenge of designing for Cu/low-k reliability van Driel, W.D.
2007
100-101 12 p. 1969-1974
6 p.
artikel
323 Factors affecting the interconnection resistance and yield in multilayer polyimide—copper structures 1994
100-101 12 p. 1966-
1 p.
artikel
324 Failure analysis and improvement of 60V power UMOSFET Wang, Debo
2014
100-101 12 p. 2782-2787
6 p.
artikel
325 Failure analysis of electronic devices and materials 1992
100-101 12 p. 1799-
1 p.
artikel
326 Failure analysis of power modules: a look at the packaging and reliability of large IGBT's 1994
100-101 12 p. 1951-
1 p.
artikel
327 Failure criteria of flip chip joints during accelerated testing Stepniak, Frank
2002
100-101 12 p. 1921-1930
10 p.
artikel
328 Failure mechanism for excessive deformation 1992
100-101 12 p. 1790-
1 p.
artikel
329 Failure-mechanism models for creep and creep rupture 1994
100-101 12 p. 1949-
1 p.
artikel
330 Failure mechanisms of pure silver, pure aluminum and silver–aluminum alloy under high current stress Misra, E.
2006
100-101 12 p. 2096-2103
8 p.
artikel
331 Failure models for mechanical wear modes and mechanisms 1994
100-101 12 p. 1947-
1 p.
artikel
332 Failure rate estimation of known failure mechanisms of electronic packages Yang, Liyu
2009
100-101 12 p. 1563-1572
10 p.
artikel
333 Fast and accurate statistical characterization of standard cell libraries Brusamarello, Lucas
2011
100-101 12 p. 2341-2350
10 p.
artikel
334 Fast and stable computation of optical propagation in micro-waveguides with loss Zhu, Jianxin
2009
100-101 12 p. 1529-1536
8 p.
artikel
335 Fatigue and thermal fatigue damage analysis of thin metal films Zhang, G.P.
2007
100-101 12 p. 2007-2013
7 p.
artikel
336 Fatigue life evaluation of wire bonds in LED packages using numerical analysis Zhang, Sung-Uk
2014
100-101 12 p. 2853-2859
7 p.
artikel
337 Fault diagnosis of reconfigurable multipipelines using boundary scans 1992
100-101 12 p. 1788-
1 p.
artikel
338 Fault-tolerance considerations for redundant binary-tree dynamic random-access-memory (RAM) chips 1992
100-101 12 p. 1791-
1 p.
artikel
339 Feasible approach for processes integration of CMOS transistor gate/side-wall spacer patterning fabrication Weng, Chun-Jen
2010
100-101 12 p. 1951-1960
10 p.
artikel
340 Feature extraction and damage-precursors for prognostication of lead-free electronics Lall, Pradeep
2007
100-101 12 p. 1907-1920
14 p.
artikel
341 Finding the most vital edge with respect to K-terminal reliability in series-parallel networks 1994
100-101 12 p. 1957-
1 p.
artikel
342 Finite-difference time-domain analysis of pulse propagation in multichip module interconnects 1994
100-101 12 p. 1966-
1 p.
artikel
343 Finite element analysis for solder ball failures in chip scale package Lee, Taekoo
1998
100-101 12 p. 1941-1947
7 p.
artikel
344 Finite element based fatigue life estimation of the solder joints with effect of intermetallic compound growth Chiou, Yung-Chuan
2011
100-101 12 p. 2319-2329
11 p.
artikel
345 Finite-element model-based fault diagnosis, a case study of a ceramic pressure sensor structure Zarnik, Marina Santo
2007
100-101 12 p. 1950-1957
8 p.
artikel
346 Finite element simulation of package stress in transfer molded MEMS pressure sensors Krondorfer, Rudolf
2004
100-101 12 p. 1995-2002
8 p.
artikel
347 Flexible simulation of a complex semiconductor manufacturing line using a rule-based system 1994
100-101 12 p. 1963-1964
2 p.
artikel
348 Flip-chip structure transient thermal model Fedasyuk, D.
2001
100-101 12 p. 1965-1970
6 p.
artikel
349 Formation of shallow p + n junctions by implanting BF2 ions into thin cobalt films on silicon substrates 1992
100-101 12 p. 1800-
1 p.
artikel
350 Formation of SiO2 on contact surface and its effect on contact reliability 1994
100-101 12 p. 1954-
1 p.
artikel
351 Four Japanese microchip makers develop 256M-bit DRAMs 1994
100-101 12 p. 1969-
1 p.
artikel
352 Functional delay test generation based on software prototype Bareisa, Eduardas
2009
100-101 12 p. 1578-1585
8 p.
artikel
353 Functional fault models for non-scan sequential circuits Bareisa, Eduardas
2011
100-101 12 p. 2402-2411
10 p.
artikel
354 Fuzzy consecutive-k-out-of-n:F system reliability Cheng, Ching-Hsue
1994
100-101 12 p. 1909-1922
14 p.
artikel
355 Fuzzy reliability of repairable systems in the possibility context Utkin, Lev V.
1994
100-101 12 p. 1865-1876
12 p.
artikel
356 Generic reliability figures of merit design tools for surface mount solder attachments 1994
100-101 12 p. 1953-
1 p.
artikel
357 Goodness-of-fit tests for the power-law process 1992
100-101 12 p. 1787-
1 p.
artikel
358 Growth of tin whiskers for lead-free plated leadframe packages in high humid environments and during thermal cycling Nakadaira, Yoshikuni
2007
100-101 12 p. 1928-1949
22 p.
artikel
359 Hazard-rate tolerance method for an opportunistic-replacement policy 1992
100-101 12 p. 1785-1786
2 p.
artikel
360 High fluence 1.8MeV proton irradiation effects on n-type MOS capacitors Arinero, R.
2011
100-101 12 p. 2093-2096
4 p.
artikel
361 High-level ASIC design tools 1992
100-101 12 p. 1795-
1 p.
artikel
362 High-performance System Design: Circuits and Logic; Vojin Oklobdzija (Ed.), IEEE Press Series on Microelectronic Systems, New York, 1999. Hardcover, 537 pp., IEEE Order No. PC 5765, ISBN: 0-7803-4716-1, $110 Stojcev, M
2000
100-101 12 p. 2129-
1 p.
artikel
363 High resolution thermal simulation of electronic components Hanreich, G
2000
100-101 12 p. 2069-2076
8 p.
artikel
364 High-speed video analysis for kink formation in a bond wire looping Han, Lei
2014
100-101 12 p. 2935-2943
9 p.
artikel
365 High-speed VLSI interconnect modelling based on s-parameter measurements 1994
100-101 12 p. 1964-
1 p.
artikel
366 High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height Amalu, Emeka H.
2012
100-101 12 p. 2982-2994
13 p.
artikel
367 High-temperature performance of state-of-the-art triple-gate transistors Akarvardar, K.
2007
100-101 12 p. 2065-2069
5 p.
artikel
368 High temperature physical modeling and verification of a novel 4H-SiC lateral JFET structure Zhong, Xueqian
2013
100-101 12 p. 1848-1856
9 p.
artikel
369 Hole tunneling from valence band and hot-carrier induced hysteresis effect in 0.13μm partially depleted silicon-on-insulator n-MOSFETs Zhou, Jianhua
2011
100-101 12 p. 2077-2080
4 p.
artikel
370 Hot electron degradation effects in 0.14 μm AlInAs/GaInAs/InP HEMTs Nawaz, M
1999
100-101 12 p. 1765-1771
7 p.
artikel
371 Hot-electron effects on AlGaAs/InGaAs/GaAs PHEMTs under accelerated DC stresses Huang, Hou-Kuei
2006
100-101 12 p. 2025-2031
7 p.
artikel
372 Hybrid technology opens new development paths 1992
100-101 12 p. 1799-
1 p.
artikel
373 Hydrostatic high pressure studies of polymer thick-film resistors Dziedzic, Andrzej
1998
100-101 12 p. 1893-1898
6 p.
artikel
374 ICs going on a 3-V diet 1992
100-101 12 p. 1796-
1 p.
artikel
375 IC’s radiation effects modeling and estimation Belyakov, V.V
2000
100-101 12 p. 1997-2018
22 p.
artikel
376 I DDQ testing makes a comeback 1994
100-101 12 p. 1952-
1 p.
artikel
377 IMAPS Poland 2004—Guest Editorial Dziedzic, Andrzej
2005
100-101 12 p. 1901-1902
2 p.
artikel
378 Impact of bias conditions on performance degradation in SiGe HBTs irradiated by 10MeV Br ion Sun, Yabin
2014
100-101 12 p. 2728-2734
7 p.
artikel
379 Impact of bilayer character on High K gate stack dielectrics breakdown obtained by conductive atomic force microscopy Foissac, R.
2013
100-101 12 p. 1857-1862
6 p.
artikel
380 Impact of board and component metallizations on microstructure and reliability of lead-free solder joints Zbrzezny, A.R.
2007
100-101 12 p. 2205-2214
10 p.
artikel
381 Impact of gate metal work-function engineering for enhancement of subthreshold analog/RF performance of underlap dual material gate DG-FET Kundu, Atanu
2014
100-101 12 p. 2717-2722
6 p.
artikel
382 Impact of gate oxide nitridation process on 1/f noise in 0.18 μm CMOS Da Rold, M
2001
100-101 12 p. 1933-1938
6 p.
artikel
383 Impact of high-power stress on dynamic ON-resistance of high-voltage GaN HEMTs Jin, Donghyun
2012
100-101 12 p. 2875-2879
5 p.
artikel
384 Implantation damage and its effect on channelling 1994
100-101 12 p. 1974-
1 p.
artikel
385 Implications of gate-edge electric field in AlGaN/GaN high electron mobility transistors during OFF-state degradation Sun, H.
2014
100-101 12 p. 2650-2655
6 p.
artikel
386 Implications of thermal instability on HBT power amplifier reliability Chivukula, Venkata
2014
100-101 12 p. 2688-2696
9 p.
artikel
387 Improved thermal management for GaN power electronics: Silver diamond composite packages Faqir, M.
2012
100-101 12 p. 3022-3025
4 p.
artikel
388 Improving an LDMOST by variation of lateral doping on epitaxial-layer drift region Chang, Yang-Hua
2011
100-101 12 p. 2059-2063
5 p.
artikel
389 Improving the deflection of wire bonds in stacked chip scale package (CSP) Yao, Y.F.
2003
100-101 12 p. 2039-2045
7 p.
artikel
390 Improving the power cycling performance of the emitter contact of IGBT modules: Implementation and evaluation of stitch bond layouts Özkol, Emre
2014
100-101 12 p. 2796-2800
5 p.
artikel
391 Impurity profile extraction from semiconductor chips of cellular construction 1994
100-101 12 p. 1949-
1 p.
artikel
392 Index 1998
100-101 12 p. 1993-1996
4 p.
artikel
393 Index 2000
100-101 12 p. 2147-2152
6 p.
artikel
394 Index 1999
100-101 12 p. 1899-1902
4 p.
artikel
395 Influence of channel layer and passivation layer on the stability of amorphous InGaZnO thin film transistors Zhan, Runze
2013
100-101 12 p. 1879-1885
7 p.
artikel
396 Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint Lee, Kiju
2011
100-101 12 p. 2290-2297
8 p.
artikel
397 Influence of halogen-free compound and lead-free solder paste on on-board reliability of green CSP (chip scale package) Chung, Cho-Liang
2005
100-101 12 p. 1916-1923
8 p.
artikel
398 Influence of matrix viscoelastic properties on thermal conductivity of TCA – Numerical approach Falat, Tomasz
2007
100-101 12 p. 1989-1996
8 p.
artikel
399 Influence of series resistances and interface coupling on the transconductance of fully-depleted silicon-on-insulator MOSFETs 1992
100-101 12 p. 1783-
1 p.
artikel
400 Influence of substrate temperature to prepare (103) oriented AlN films Lee, Maw-Shung
2010
100-101 12 p. 1984-1987
4 p.
artikel
401 Influence of surface states on the voltage robustness of AlGaN/GaN HFET power devices Wespel, M.
2014
100-101 12 p. 2656-2661
6 p.
artikel
402 Influence of TCE concentration in thermal oxidation on reliability of SiC MOS capacitors under Fowler–Nordheim electron injection Yang, B.L.
2006
100-101 12 p. 2044-2048
5 p.
artikel
403 Influence of the surface roughness of the bottom electrode on the resistive-switching characteristics of Al/Al2O3/Al and Al/Al2O3/W structures fabricated on glass at 300°C Molina, Joel
2014
100-101 12 p. 2747-2753
7 p.
artikel
404 Influence of the surrounding ambient on the reliability of the electrical characterization of thin oxide layers using an atomic force microscope Hourani, W.
2011
100-101 12 p. 2097-2101
5 p.
artikel
405 Infrared thermography maintains PCB reliability 1994
100-101 12 p. 1951-
1 p.
artikel
406 InP/GaAs0.51Sb0.49/InP fully self-aligned double heterojunction bipolar transistors with a C-doped base: a preliminary reliability study Bolognesi, C.R.
1999
100-101 12 p. 1833-1838
6 p.
artikel
407 Inside front cover - Editorial board 2009
100-101 12 p. IFC-
1 p.
artikel
408 Inside front cover - Editorial board 2013
100-101 12 p. IFC-
1 p.
artikel
409 Inside front cover - Editorial board 2014
100-101 12 p. IFC-
1 p.
artikel
410 Inside front cover - Editorial board 2012
100-101 12 p. IFC-
1 p.
artikel
411 Inside front cover - Editorial board 2010
100-101 12 p. IFC-
1 p.
artikel
412 In situ monitoring of epitaxial film thickness by IEMI 1992
100-101 12 p. 1798-
1 p.
artikel
413 Integrated circuit, hybrid, and multichip module package design guidelines A focus on reliability G.W.A.D.,
1994
100-101 12 p. 1978-1979
2 p.
artikel
414 Integrated circuit production yield assurance based on yield analysis 1994
100-101 12 p. 1950-1951
2 p.
artikel
415 Integrated circuits for the S560 undersea transmission system 1992
100-101 12 p. 1789-
1 p.
artikel
416 Integrated process capability analysis with an application in backlight module Huang, M.L.
2002
100-101 12 p. 2009-2014
6 p.
artikel
417 Integrating reliability into microelectronics manufacturing G.W.A.D.,
1994
100-101 12 p. 1979-1980
2 p.
artikel
418 Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations Kuo, Chin-Hung
2013
100-101 12 p. 2012-2017
6 p.
artikel
419 International IEEE conference on the business of electronic product reliability and liability 2002
100-101 12 p. I-II
nvt p.
artikel
420 Interval estimation of avilability of a series system 1992
100-101 12 p. 1788-
1 p.
artikel
421 Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method Cheng, Hsin-En
2014
100-101 12 p. 2881-2897
17 p.
artikel
422 Introduction to special section on electronic systems prognostics and health management Sandborn, Peter
2007
100-101 12 p. 1847-1848
2 p.
artikel
423 Investigating the CDM susceptibility of IC’s at package and wafer level by capacitive coupled TLP Wolf, Heinrich
2009
100-101 12 p. 1476-1481
6 p.
artikel
424 Investigation of high performance Edge Lifted Capacitors reliability for GaAs and GaN MMIC technology Weng, Ming-Hung
2014
100-101 12 p. 2697-2703
7 p.
artikel
425 Investigation of novel attributes of single halo dual-material double gate MOSFETs for analog/RF applications Mohankumar, N.
2009
100-101 12 p. 1491-1497
7 p.
artikel
426 Investigation of reliability improvements on die bonding and wire bonding process of IC 1992
100-101 12 p. 1783-
1 p.
artikel
427 Investigation of the characteristics of overhang bonding for 3-D stacked dies in microelectronics packaging Li, Junhui
2011
100-101 12 p. 2236-2242
7 p.
artikel
428 Investigation of the electrical transport mechanism in VO x thin films Axelevitch, A.
2011
100-101 12 p. 2119-2123
5 p.
artikel
429 Investigation of the shift of hot spot in lateral diffused LDMOS under ESD conditions Qian, Qinsong
2010
100-101 12 p. 1935-1941
7 p.
artikel
430 Investigation on the abnormal resistive switching induced by ultraviolet light exposure based on HfOx film Chang, Kow-Ming
2010
100-101 12 p. 1931-1934
4 p.
artikel
431 Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions Kozlowska, Anna
2006
100-101 12 p. 2079-2084
6 p.
artikel
432 Ion beam milling effect on surface properties of HgCdTe 1992
100-101 12 p. 1799-
1 p.
artikel
433 Ion bombardment influence on the Cr Auger autoionization structure 1994
100-101 12 p. 1975-
1 p.
artikel
434 IR microscopic observation of plastic coated TAB inner lead bonds degrading during thermal cycling 1992
100-101 12 p. 1784-
1 p.
artikel
435 Isothermal aging effects on flex cracking of multilayer ceramic capacitors with standard and flexible terminations Keimasi, Mohammadreza
2007
100-101 12 p. 2215-2225
11 p.
artikel
436 Issues in accelerated electromigration of solder bumps Rinne, Glenn A.
2003
100-101 12 p. 1975-1980
6 p.
artikel
437 Is the power-law model applicable beyond the direct tunneling regime? Duschl, Rainer
2005
100-101 12 p. 1861-1867
7 p.
artikel
438 Japanese parts makers see ISO9000 certification as growth stimulus 1994
100-101 12 p. 1948-
1 p.
artikel
439 Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test Yoon, Jeong-Won
2013
100-101 12 p. 2036-2042
7 p.
artikel
440 Junction temperature management of IGBT module in power electronic converters Zhou, Luowei
2014
100-101 12 p. 2788-2795
8 p.
artikel
441 Large area flexible lighting foils using distributed bare LED dies on polyester substrates van den Ende, D.A.
2013
100-101 12 p. 1907-1915
9 p.
artikel
442 Large capacitance electric double layer capacitor using activated carbon-carbon composite 1994
100-101 12 p. 1951-
1 p.
artikel
443 Large-scale 0–1 fuzzy goal programming and its application to reliability optimization problem 1994
100-101 12 p. 1954-1955
2 p.
artikel
444 Laser-based electro-optic testing of multichip module structures Mechtel, D.M.
1998
100-101 12 p. 1847-1853
7 p.
artikel
445 Laser moiré interferometry for fatigue life prediction of lead-free solders Tunga, Krishna
2010
100-101 12 p. 2026-2036
11 p.
artikel
446 Lasting quality 1994
100-101 12 p. 1947-
1 p.
artikel
447 Laterally inhomogeneous barrier analysis of identically prepared Cd/CdS/n-Si/Au–Sb structures by SILAR method Güzeldir, B.
2011
100-101 12 p. 2179-2184
6 p.
artikel
448 Leakage current and defect characterization of p+n-source/drain diodes Roll, Guntrade
2011
100-101 12 p. 2081-2085
5 p.
artikel
449 Life cycle cost impact of using prognostic health management (PHM) for helicopter avionics Scanff, E.
2007
100-101 12 p. 1857-1864
8 p.
artikel
450 Lifetime investigation and prediction of metallized polypropylene film capacitors Li, Zhiwei
2013
100-101 12 p. 1962-1967
6 p.
artikel
451 Lightly Al-doped Ta2O5: Electrical properties and mechanisms of conductivity Spassov, D.
2011
100-101 12 p. 2102-2109
8 p.
artikel
452 Linewidth measurements struggle with submicron processes 1992
100-101 12 p. 1792-
1 p.
artikel
453 Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection Noae, Takuya
2013
100-101 12 p. 1829-1840
12 p.
artikel
454 Long term storage reliability of antifuse field programmable gate arrays Patil, Nishad
2013
100-101 12 p. 2052-2056
5 p.
artikel
455 Low and high temperature device reliability investigations of buried p-channel MOSFETs of a 0.17 μm technology Ambatiello, Alexander
2001
100-101 12 p. 1915-1921
7 p.
artikel
456 Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature Zhu, Yongxin
2014
100-101 12 p. 2922-2928
7 p.
artikel
457 Low cycle fatigue performance of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints Qin, H.B.
2014
100-101 12 p. 2911-2921
11 p.
artikel
458 Lowering manufacturing defects analysis costs 1994
100-101 12 p. 1950-
1 p.
artikel
459 Low-frequency noise as a tool for characterization of nearband impurities in silicon 1992
100-101 12 p. 1797-
1 p.
artikel
460 Low frequency noise in nMOSFETs with subnanometer EOT hafnium-based gate dielectrics Magnone, P.
2007
100-101 12 p. 2109-2113
5 p.
artikel
461 Low temperature delamination of plastic encapsulated microcircuits McCluskey, P
1998
100-101 12 p. 1829-1834
6 p.
artikel
462 Low temperature fabrication of a ZnO nanoparticle thin-film transistor suitable for flexible electronics Vidor, F.F.
2014
100-101 12 p. 2760-2765
6 p.
artikel
463 Low-voltage CMOS log companding analog design; Francisco Sera-Graells, Andoracion Rueda, Jose L. Huertas. Kluwer Academic Publishers, Boston; 2003. Hardcover, pp. 192, plus XXV, 117 euro. ISBN 1-4020-7445-X Stojcev, Mile
2004
100-101 12 p. 2033-2034
2 p.
artikel
464 LSI current leakage spots detecting system 1992
100-101 12 p. 1784-
1 p.
artikel
465 LSI fabrication technology enters giga-bit age 1992
100-101 12 p. 1792-
1 p.
artikel
466 LSI failure analysis using focused laser beam heating Nikawa, Kiyoshi
1997
100-101 12 p. 1841-1847
7 p.
artikel
467 Maintenance minimization for competitive advantage A life cycle approach for product manufacturers and end users G.W.A.D.,
1994
100-101 12 p. 1977-1978
2 p.
artikel
468 Making ohmic contacts to AIIIBV semiconductor devices: the role of interfacial reactions in OHMIC contact formation 1992
100-101 12 p. 1797-
1 p.
artikel
469 Manufacturers continue shrinking dimensions of chip parts 1994
100-101 12 p. 1963-
1 p.
artikel
470 Market mixed, applications expand for hybrid ICs 1992
100-101 12 p. 1799-
1 p.
artikel
471 Markov process based reliability model for laser diodes in space radiation environment Liu, Yun
2014
100-101 12 p. 2735-2739
5 p.
artikel
472 MARVLE: a VLSI chip for data compression using tree-based codes 1994
100-101 12 p. 1969-
1 p.
artikel
473 Material failure mechanisms and damage models 1992
100-101 12 p. 1790-
1 p.
artikel
474 Measurement of high electrical current density effects in solder joints Ye, Hua
2003
100-101 12 p. 2021-2029
9 p.
artikel
475 Measuring seam/crack formation in interconnect metallization Zampardi, Peter J.
2012
100-101 12 p. 2870-2874
5 p.
artikel
476 Measuring the through-plane elastic modulus of thin polymer films in situ van Soestbergen, M.
2007
100-101 12 p. 1983-1988
6 p.
artikel
477 Mechanical and electrical properties of ultra-thin chips and flexible electronics assemblies during bending van den Ende, D.A.
2014
100-101 12 p. 2860-2870
11 p.
artikel
478 Mechanical and environmental durability of roll-to-roll printed silver nanoparticle film using a rapid laser annealing process for flexible electronics Yang, Min
2014
100-101 12 p. 2871-2880
10 p.
artikel
479 Metal defect yield and reliability relationships Roesch, William J.
2005
100-101 12 p. 1875-1881
7 p.
artikel
480 Metal gates and gate-deposition-induced defects in Ta2O5 stack capacitors Atanassova, E.
2007
100-101 12 p. 2088-2093
6 p.
artikel
481 Methodology for accurate extrapolation of InGaP/GaAs HBT safe operating area (SOA) for variations in emitter area and ballast resistor size Howell, Robert S.
2014
100-101 12 p. 2682-2687
6 p.
artikel
482 Microcarrier for LSI chip used in the HITAC M-880 processor group 1992
100-101 12 p. 1794-
1 p.
artikel
483 Microchannel gate temperature analysis Kim, Q.
1998
100-101 12 p. 1823-1827
5 p.
artikel
484 Microcurrent, ultra-miniature switches offer reliable contact 1994
100-101 12 p. 1950-
1 p.
artikel
485 Microprocessor-based quality testing of devices containing gases 1992
100-101 12 p. 1784-
1 p.
artikel
486 Microstructural considerations for ultrafine lead free solder joints Huang, Zhiheng
2007
100-101 12 p. 1997-2006
10 p.
artikel
487 Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders Wiese, S.
2004
100-101 12 p. 1923-1931
9 p.
artikel
488 Microstructure, electric flame-off characteristics and tensile properties of silver bonding wires Hsueh, Hao-Wen
2011
100-101 12 p. 2243-2249
7 p.
artikel
489 Minimal paths and cuts of networks exposed to common-cause failures 1992
100-101 12 p. 1787-1788
2 p.
artikel
490 Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride Wong, C.K.
2006
100-101 12 p. 2056-2061
6 p.
artikel
491 Model based maintenance for MANs 1994
100-101 12 p. 1947-
1 p.
artikel
492 Modeling and simulation of power electronic modules with microchannel coolers for thermo-mechanical performance Xu, Ling
2014
100-101 12 p. 2824-2835
12 p.
artikel
493 Modeling latent and patent failures of electronic products Yan, Li
1995
100-101 12 p. 1501-1510
10 p.
artikel
494 Modeling of hetero-interface potential and threshold voltage for tied and separate nanoscale InAlAs–InGaAs symmetric double-gate HEMT Rathi, Servin
2009
100-101 12 p. 1508-1514
7 p.
artikel
495 Modeling of multilevel structures: a general method for analyzing stress evolution during processing 1992
100-101 12 p. 1793-
1 p.
artikel
496 Modeling read SNM considering both soft oxide breakdown and negative bias temperature instability Afzal, Behrouz
2012
100-101 12 p. 2948-2954
7 p.
artikel
497 Modelling by Bayes empirical Bayes and data analysis 1992
100-101 12 p. 1786-
1 p.
artikel
498 Modelling of band tails and their effects in minority carrier transport in heavily doped silicon 1992
100-101 12 p. 1797-
1 p.
artikel
499 Models for the Si-SiO2 interface degradation at low injected electron fluences 1994
100-101 12 p. 1972-
1 p.
artikel
500 Modified K-S, A-D and C-vM tests for the Pareto distribution with unknown location and scale parameters 1992
100-101 12 p. 1787-
1 p.
artikel
501 Module frequency estimation and noise budget limitations/trade-offs in multichip modules as a function of CMOS chips integration 1994
100-101 12 p. 1958-1959
2 p.
artikel
502 Moisture absorption and diffusion characterisation of packaging materials––advanced treatment Wong, E.H.
2003
100-101 12 p. 2087-2096
10 p.
artikel
503 Monitoring of power dissipated in microelectronic structures Dziurdzia, Piotr
2001
100-101 12 p. 1971-1978
8 p.
artikel
504 Morphology changes in solder joints––experimental evidence and physical understanding Müller, W.H.
2004
100-101 12 p. 1901-1914
14 p.
artikel
505 MoSi2 layer formation by ion implantation through metal technique 1992
100-101 12 p. 1800-
1 p.
artikel
506 Multi-function protective relay on FPGA Manzoul, M.A.
1998
100-101 12 p. 1963-1968
6 p.
artikel
507 Multimetal DTAB packages for a 125-MHz computer 1994
100-101 12 p. 1964-
1 p.
artikel
508 Multi-physics modeling in virtual prototyping of electronic packages––combined thermal, thermo-mechanical and vapor pressure modeling Fan, X.J.
2004
100-101 12 p. 1967-1976
10 p.
artikel
509 Multiple high-voltage pulse stressing of conventional thick-film resistors Stanimirović, I.
2007
100-101 12 p. 2242-2248
7 p.
artikel
510 Multi-vibrational hydrogen release: Physical origin of T bd,Q bd power-law voltage dependence of oxide breakdown in ultra-thin gate oxides Ribes, G.
2005
100-101 12 p. 1842-1854
13 p.
artikel
511 n-Al0.15Ga0.85N/p-6H–SiC heterostructure and based bipolar transistor Alivov, Ya.I.
2010
100-101 12 p. 2090-2092
3 p.
artikel
512 Nanotribological properties of ALD-processed bilayer TiO2/ZnO films Wang, Wun-Kai
2014
100-101 12 p. 2754-2759
6 p.
artikel
513 NASA evaluates automated inspection systems 1994
100-101 12 p. 1959-
1 p.
artikel
514 NBTI model development with regression analysis Katsetos, Anastasios A.
2009
100-101 12 p. 1498-1502
5 p.
artikel
515 New analytical polycrystalline-silicon thin-film transistor model for computer aided design and parameter extraction 1992
100-101 12 p. 1798-
1 p.
artikel
516 New humidity sensors offer reliable performance 1994
100-101 12 p. 1956-
1 p.
artikel
517 New mode crack of LSI package in the solder reflow process 1994
100-101 12 p. 1968-
1 p.
artikel
518 New packaging of a chip on a board by a unique printing method 1992
100-101 12 p. 1793-
1 p.
artikel
519 New positive charge trapping dynamics in SiO2 gate oxide, based on bulk impact ionization processes under Fowler–Nordheim stress Samanta, Piyas
1998
100-101 12 p. 1969-1973
5 p.
artikel
520 New trim configurations for laser trimmed thick-film resistors—theoretical analysis, numerical simulation and experimental verification Wroński, Marek
2005
100-101 12 p. 1941-1948
8 p.
artikel
521 Noise as a tool for non-destructive testing of single-crystal silicon solar cells Chobola, Z
2001
100-101 12 p. 1947-1952
6 p.
artikel
522 Note on disjoint products algorithms 1992
100-101 12 p. 1788-
1 p.
artikel
523 [No title] Naikan, Vallayil N.A.
2013
100-101 12 p. 2078-
1 p.
artikel
524 [No title] Davidović, Vojkan
2013
100-101 12 p. 2079-
1 p.
artikel
525 [No title] Fantini, Fausto
1999
100-101 12 p. 1721-
1 p.
artikel
526 [No title] Stojcev, Mile
2007
100-101 12 p. 2287-2288
2 p.
artikel
527 [No title] Stojcev, Mile
2007
100-101 12 p. 2282-2283
2 p.
artikel
528 [No title] Stojcev, Mile
2007
100-101 12 p. 2289-2290
2 p.
artikel
529 [No title] Stojcev, Mile
2007
100-101 12 p. 2284-2286
3 p.
artikel
530 [No title] Stojcev, Mile
2005
100-101 12 p. 1951-1952
2 p.
artikel
531 [No title] Stojcev, Mile
2005
100-101 12 p. 1949-1950
2 p.
artikel
532 Novel charge neutralization techniques applicable to wide current range of FIB processing in FIB-SEM combined system Komoda, Hirotaka
2006
100-101 12 p. 2085-2095
11 p.
artikel
533 Novel radiation hardened latch design considering process, voltage and temperature variations for nanoscale CMOS technology Nan, Haiqing
2011
100-101 12 p. 2086-2092
7 p.
artikel
534 Numerical study of ductile failure morphology in solder joints under fast loading conditions Shen, Y.-L.
2010
100-101 12 p. 2059-2070
12 p.
artikel
535 Observation and mechanism explanation of the parasitic charge pumping current Dai, Mingzhi
2010
100-101 12 p. 1915-1919
5 p.
artikel
536 Off-state drain breakdown mechanisms of VDMOS with anti-JFET implantation Tam, Wing-Shan
2011
100-101 12 p. 2064-2068
5 p.
artikel
537 On a stochastic model of a non-Markovian time-dependent queueing system with general intertransition time distribution Sharma, S.D.
1992
100-101 12 p. 1657-1661
5 p.
artikel
538 On-chip system level protection of FM antenna pin with improved linearity Notermans, Guido
2011
100-101 12 p. 2129-2136
8 p.
artikel
539 On computing reliability-measures of Boolean circuits 1992
100-101 12 p. 1788-
1 p.
artikel
540 On-line hazard aversion: a Bayes approach 1994
100-101 12 p. 1957-
1 p.
artikel
541 On-state and off-state stress-induced degradation in unhydrogenated solid phase crystallized polysilicon thin film transistors Kouvatsos, Dimitrios N
2002
100-101 12 p. 1875-1882
8 p.
artikel
542 On the analytical description of ageing kinetics in ceramic manganite-based NTC thermistors Balitska, V.O
2002
100-101 12 p. 2003-2007
5 p.
artikel
543 On the assessment of voids in the thermal interface material on the thermal performance of a silicon chip package Ramos-Alvarado, Bladimir
2013
100-101 12 p. 1987-1995
9 p.
artikel
544 On the correlation between radiation-induced oxide- and border-trap effects in the gate-oxide nMOSFET’s Djezzar, Boualem
2002
100-101 12 p. 1865-1874
10 p.
artikel
545 On the determination of the time-dependent degradation laws and device lifetime in deep submicron n- and p- channel SOI MOSFETs Renn, S.-H
1998
100-101 12 p. 1817-1822
6 p.
artikel
546 On the modelling of digital circuits for the test pattern generation for device input faults Dokouzyannis, Stavros P.
1994
100-101 12 p. 1923-1929
7 p.
artikel
547 On the optimum thickness to test dielectric reliability, in an integrated technology of power devices Oussalah, Slimane
2000
100-101 12 p. 2047-2051
5 p.
artikel
548 On the profile of frequency and voltage dependent interface states and series resistance in (Ni/Au)/Al0.22Ga0.78N/AlN/GaN heterostructures by using current–voltage (I–V) and admittance spectroscopy methods Demirezen, S.
2011
100-101 12 p. 2153-2162
10 p.
artikel
549 On the relationship between yield and cycle time in semiconductor wafer fabrication 1992
100-101 12 p. 1785-
1 p.
artikel
550 On the reliability of a cold standby system attended by a single repairman Vanderperre, E.J.
1995
100-101 12 p. 1511-1513
3 p.
artikel
551 On the role of fluorine in BF2 implanted silicon 1992
100-101 12 p. 1799-1800
2 p.
artikel
552 On the short and long term degradation of GaInP/GaAs heterojunction bipolar transistors Borgarino, M.
1999
100-101 12 p. 1823-1832
10 p.
artikel
553 Open contact analysis of single bit failure in 0.18 μm technology Song, Zhigang
2002
100-101 12 p. 1997-2001
5 p.
artikel
554 Operand Width Aware Hardware Reuse: A low cost fault-tolerant approach to ALU design in embedded processors Fazeli, Mahdi
2011
100-101 12 p. 2374-2387
14 p.
artikel
555 Optimal cost-effective design of triple-modular-redundancy with-spares systems 1994
100-101 12 p. 1960-
1 p.
artikel
556 Optimal design of life testing for ULSI circuit manufacturing 1992
100-101 12 p. 1790-
1 p.
artikel
557 Optimal designs of (k, n − k + 1)-out-of-n:F systems (subject to 2 failure modes) 1992
100-101 12 p. 1789-
1 p.
artikel
558 Optimal placement of electronic devices in forced convective cooling conditions Felczak, M.
2009
100-101 12 p. 1537-1545
9 p.
artikel
559 Optimal reliability allocation of redundant units and repair facilities by arbitrary failure and repair distributions Gurov, Sergey V.
1995
100-101 12 p. 1451-1460
10 p.
artikel
560 Optimization of average-run-length properties of control charts using recurrent events 1994
100-101 12 p. 1960-1961
2 p.
artikel
561 Optimization of flexible printed circuit board electronics in the flow environment using response surface methodology Leong, W.C.
2013
100-101 12 p. 1996-2004
9 p.
artikel
562 Optimum simple step-stress accelerated life-tests with competing causes of failure 1992
100-101 12 p. 1790-
1 p.
artikel
563 Organic inverter: Theoretical analysis using load matching technique Omar, S.
2011
100-101 12 p. 2173-2178
6 p.
artikel
564 Organizational learning across critical linkages: the case of captive ASIC design and manufacturing 1994
100-101 12 p. 1964-
1 p.
artikel
565 Oxidation of Au4Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175°C Breach, C.D.
2006
100-101 12 p. 2112-2121
10 p.
artikel
566 Oxide precipitate-related luminescence in silicon 1992
100-101 12 p. 1797-
1 p.
artikel
567 Package and solder joint reliability analysed by FEM simulation and experiments Vandevelde, Bart
2004
100-101 12 p. 1891-1892
2 p.
artikel
568 Packages reflect diverse needs, technologies among device users 1994
100-101 12 p. 1964-
1 p.
artikel
569 Packaging a 150-W bipolar ECL microprocessor 1994
100-101 12 p. 1968-
1 p.
artikel
570 Packaging of GaAs signal processors on multichip modules 1992
100-101 12 p. 1794-
1 p.
artikel
571 Parallel-concurrent fault simulation 1994
100-101 12 p. 1955-
1 p.
artikel
572 Parallel processing of fault trees on a locally distributed multiple-processor network 1994
100-101 12 p. 1956-1957
2 p.
artikel
573 Parametric FE-approach to flip-chip reliability under various loading conditions Wunderle, B.
2004
100-101 12 p. 1933-1945
13 p.
artikel
574 Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach Yang, D.G.
2004
100-101 12 p. 1947-1955
9 p.
artikel
575 Particle deposition and removal in wet cleaning processes for ULSI manufacturing 1992
100-101 12 p. 1794-1795
2 p.
artikel
576 Passivation schemes for copper-polymer thin-film interconnections used in multichip modules 1994
100-101 12 p. 1973-
1 p.
artikel
577 Performance analysis of multilayer interconnections for megabit static random access memory chip 1994
100-101 12 p. 1952-
1 p.
artikel
578 Performance-reliability—models and quality management 1994
100-101 12 p. 1948-
1 p.
artikel
579 Photoacoustic inspection of thermal properties of layered structure with pulse excitations Suszynski, Zbigniew
2005
100-101 12 p. 1910-1915
6 p.
artikel
580 Photosensitivity n-channel ZnO phototransistor for optoelectronic applications: Modeling of ZnO TFT Yakuphanoglu, F.
2011
100-101 12 p. 2200-2204
5 p.
artikel
581 Photothermal formation of copper conductors on multichip module substrates using a Nd: YAG laser 1994
100-101 12 p. 1974-
1 p.
artikel
582 Physical model for the power-law voltage and current acceleration of TDDB Haggag, A.
2005
100-101 12 p. 1855-1860
6 p.
artikel
583 Plasma charging damage during contact hole etch in high-density plasma etcher Tsui, Bing-Yue
2000
100-101 12 p. 2039-2046
8 p.
artikel
584 Plasma-charging damage in ultra-thin gate oxide Cheung, Kin P
2000
100-101 12 p. 1981-1986
6 p.
artikel
585 Poisson shock models leading to new classes of non-monotonic aging life distributions Pandey, Aniruddha
2011
100-101 12 p. 2412-2415
4 p.
artikel
586 Polarity asymmetry of stress and charge trapping behavior of thin Hf- and Zr-silicate layers Paskaleva, A.
2007
100-101 12 p. 2094-2099
6 p.
artikel
587 Polyamic alkyl esters: versatile polyimide precursors for improved dielectric coatings 1992
100-101 12 p. 1794-
1 p.
artikel
588 Power amplifier for ultra high frequency using conventional silicon NMOS IC technology 1992
100-101 12 p. 1796-
1 p.
artikel
589 Power-law voltage acceleration: A key element for ultra-thin gate oxide reliability Wu, Ernest Y.
2005
100-101 12 p. 1809-1834
26 p.
artikel
590 Power rectifier model including self heating effects Strollo, Antonio G.M.
1998
100-101 12 p. 1899-1906
8 p.
artikel
591 Practical scheduling and line optimization technology for ASIC manufacturing lines 1994
100-101 12 p. 1964-
1 p.
artikel
592 Precision comparison of surface temperature measurement techniques for GaAs IC's 1994
100-101 12 p. 1962-
1 p.
artikel
593 Predicting conducting yarn failure in woven electronic textiles de Vries, Hans
2014
100-101 12 p. 2956-2960
5 p.
artikel
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2007
100-101 12 p. 2231-2241
11 p.
artikel
595 Prediction intervals for future failures in the exponential distribution under hybrid censoring 1992
100-101 12 p. 1787-
1 p.
artikel
596 Prediction of crack growth in IC passivation layers He, Y.T.
2004
100-101 12 p. 2003-2009
7 p.
artikel
597 Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms Zehe, A.
2002
100-101 12 p. 1849-1855
7 p.
artikel
598 Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods van Driel, W.D.
2004
100-101 12 p. 2019-2027
9 p.
artikel
599 Prediction of product yield distributions from wafer parametric measurements of CMOS circuits 1992
100-101 12 p. 1783-
1 p.
artikel
600 Prediction of thermo-mechanical integrity of wafer backend processes Gonda, V.
2004
100-101 12 p. 2011-2017
7 p.
artikel
601 Printed wiring boards with silver through-holes help lower costs 1994
100-101 12 p. 1950-
1 p.
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602 Probabilistic analysis of CMOS physical defects in VLSI circuits for test coverage improvement Blyzniuk, M.
2001
100-101 12 p. 2023-2040
18 p.
artikel
603 Problems of semiconductor wafer geometry characterization 1992
100-101 12 p. 1784-
1 p.
artikel
604 Procedure for design optimization of a T-cap flip chip package Ni, Chin-Yu
2002
100-101 12 p. 1903-1911
9 p.
artikel
605 Procedure for evaluation of thermal management requirements in a laser diode structure Kamath, Rajesh R.
1997
100-101 12 p. 1817-1823
7 p.
artikel
606 Process capability indices and product reliability Ramakrishnan, Bharatwaj
2001
100-101 12 p. 2067-2070
4 p.
artikel
607 Process integration, architecture and simulation of a GHz-BiCMOS ULSI technology 1994
100-101 12 p. 1967-
1 p.
artikel
608 Process variation aware dual-Vth assignment technique for low power nanoscale CMOS design Mande, Sudhakar S.
2011
100-101 12 p. 2357-2365
9 p.
artikel
609 Prognostics implementation of electronics under vibration loading Gu, Jie
2007
100-101 12 p. 1849-1856
8 p.
artikel
610 Progress in devices produces distinctive wares 1992
100-101 12 p. 1792-
1 p.
artikel
611 Progress in gate array technology widens applications 1992
100-101 12 p. 1796-
1 p.
artikel
612 Quadratic statistics for the goodness-of-fit test of the inverse Gaussian distribution 1992
100-101 12 p. 1787-
1 p.
artikel
613 Quality and reliability of technical systems theory - practice - management G.W.A.D.,
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100-101 12 p. 1981-1982
2 p.
artikel
614 Quantitative reliability analysis of flip–chip packages under thermal–cyclic loading and in consideration of parameter uncertainties Hsu, Yao
2011
100-101 12 p. 2284-2289
6 p.
artikel
615 Quantum size impacts on the threshold voltage in nanocrystalline silicon thin film transistors Mao, Ling-Feng
2013
100-101 12 p. 1886-1890
5 p.
artikel
616 QUISC3: a distributed processing silicon compiler 1992
100-101 12 p. 1790-
1 p.
artikel
617 Rapid estimation for parameterized components in high-level synthesis 1994
100-101 12 p. 1954-
1 p.
artikel
618 Rapid IC performance yield and distribution prediction using a rotation of the circuit parameter principals components Horan, John
1998
100-101 12 p. 1913-1918
6 p.
artikel
619 Reactive ion milling—thinning of compound semiconductors 1994
100-101 12 p. 1975-
1 p.
artikel
620 Recent advances of nanolead-free solder material for low processing temperature interconnect applications Jiang, Hongjin
2013
100-101 12 p. 1968-1978
11 p.
artikel
621 Reduction of defects in TSV filled with Cu by high-speed 3-step PPR for 3D Si chip stacking Hong, Sung Chul
2011
100-101 12 p. 2228-2235
8 p.
artikel
622 Relative figures of merit for chip-to-MCM substrate interconnection methods 1994
100-101 12 p. 1965-1966
2 p.
artikel
623 Relaxation effects in high-voltage barium titanate nonlinear ceramic disk capacitors 1994
100-101 12 p. 1949-1950
2 p.
artikel
624 Reliability analysis method in the presence of fuzziness attached to operating time Huang, H.-Z.
1995
100-101 12 p. 1483-1487
5 p.
artikel
625 Reliability analysis of a Markovian deteriorating system Jain, Sudha
1994
100-101 12 p. 1939-1941
3 p.
artikel
626 Reliability and availability analysis of cold standby system with repair and multiple non-critical and critical errors Who Kee Chung,
1994
100-101 12 p. 1891-1896
6 p.
artikel
627 Reliability and design of 2-dimensional consecutive k-out-of-n systems 1994
100-101 12 p. 1957-
1 p.
artikel
628 Reliability aspects of gate oxide under ESD pulse stress Ille, Adrien
2009
100-101 12 p. 1407-1416
10 p.
artikel
629 Reliability assessment based on accelerated degradation: a case study 1992
100-101 12 p. 1789-
1 p.
artikel
630 Reliability assurance of terminal system by use of terminal system simulation test (terminal-SST) facilities 1992
100-101 12 p. 1786-
1 p.
artikel
631 Reliability bounds and other inequalities for discrete life distributions Sengupta, Debasis
1995
100-101 12 p. 1473-1478
6 p.
artikel
632 Reliability characteristics of GaAs and InP-based heterojunction bipolar transistors Pavlidis, Dimitris
1999
100-101 12 p. 1801-1808
8 p.
artikel
633 Reliability considerations of III-nitride microelectronic devices Würfl, Joachim
1999
100-101 12 p. 1737-1757
21 p.
artikel
634 Reliability estimation using doubly-censored field data 1994
100-101 12 p. 1955-
1 p.
artikel
635 Reliability evaluation of a limited-flow network in terms of minimal cutsets 1994
100-101 12 p. 1962-
1 p.
artikel
636 Reliability evaluation of bonding wires in power transistor modules under power cycling test 1992
100-101 12 p. 1784-
1 p.
artikel
637 Reliability evaluation of ultra-thin CSP using new flip-chip bonding technology––double-sided CSP and single-sided CSP Nishida, Kazuto
2003
100-101 12 p. 2065-2075
11 p.
artikel
638 Reliability growth of fault-tolerant software 1994
100-101 12 p. 1961-
1 p.
artikel
639 Reliability investigation of InGaP/GaAs HBTs under current and temperature stress Rezazadeh, A.A.
1999
100-101 12 p. 1809-1816
8 p.
artikel
640 Reliability issues in III–V compound semiconductor devices: optical devices and GaAs-based HBTs Ueda, Osamu
1999
100-101 12 p. 1839-1855
17 p.
artikel
641 Reliability matrix solution to multiple mechanism prediction Bernstein, Joseph B.
2014
100-101 12 p. 2951-2955
5 p.
artikel
642 Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load Chiu, Tz-Cheng
2010
100-101 12 p. 2037-2050
14 p.
artikel
643 Reliability of a general consecutive-k-out-n:F system 1994
100-101 12 p. 1956-
1 p.
artikel
644 Reliability of a k-out-of-n warm-standby system 1992
100-101 12 p. 1785-
1 p.
artikel
645 Reliability of aluminum-bearing ohmic contacts to SiC under high current density Downey, Brian P.
2010
100-101 12 p. 1967-1972
6 p.
artikel
646 Reliability of checkpointed real-time systems using time redundancy 1994
100-101 12 p. 1962-
1 p.
artikel
647 Reliability of compound semiconductor devices for space applications Kayali, Sammy
1999
100-101 12 p. 1723-1736
14 p.
artikel
648 Reliability of imperfect switching of cold stanby systems with multiple non-critical and critical errors Chung, Who Kee
1995
100-101 12 p. 1479-1482
4 p.
artikel
649 Reliability of microBGA assembly using no-flow underfill Tu, P.L.
2001
100-101 12 p. 1993-2000
8 p.
artikel
650 Reliability of multistage production systems controlled by automated visual inspection 1994
100-101 12 p. 1960-
1 p.
artikel
651 Reliability of surface-mounted anisotropically conductive adhesive joints 1994
100-101 12 p. 1951-
1 p.
artikel
652 Reliability of three-state device systems with simultaneous failures 1994
100-101 12 p. 1961-
1 p.
artikel
653 Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device Yamada, Y.
2007
100-101 12 p. 2147-2151
5 p.
artikel
654 Reliability studies and design improvement of mirror image CSP assembly Xie, Dongji
2002
100-101 12 p. 1931-1937
7 p.
artikel
655 Reliability study of Sn–Ag–Cu–Ce soldered joints in quad flat packages Zhang, Liang
2010
100-101 12 p. 2071-2077
7 p.
artikel
656 Reliable study of digital IC circuits with margin voltage among variable DC power supply, electromagnetic interference and conducting wire antenna Tsai, Han-Chang
2003
100-101 12 p. 2001-2009
9 p.
artikel
657 Reliable ultra-low-voltage low-power probabilistic-based noise-tolerant latch design Wey, I-Chyn
2013
100-101 12 p. 2057-2069
13 p.
artikel
658 Replacement policy for a partially observable Markov descision process model using fuzzy data 1994
100-101 12 p. 1958-
1 p.
artikel
659 Research refines fuzzy logic technology, clarified artificial intelligence use 1992
100-101 12 p. 1781-
1 p.
artikel
660 Residual stresses in microelectronics induced by thermoset packaging materials during cure Meuwissen, Marcel H.H.
2004
100-101 12 p. 1985-1994
10 p.
artikel
661 Resistance adjustment with short-pulse Nd: YAG laser for RuO2-based thick-film resistors buried in polyimide film 1994
100-101 12 p. 1974-
1 p.
artikel
662 Resistance computations for multilayer packaging structures by applying the boundary element method 1992
100-101 12 p. 1794-
1 p.
artikel
663 Review of reliability issues of metal-semiconductor-metal and avalanche photodiode photonic detectors Brennan, Kevin F
1999
100-101 12 p. 1873-1883
11 p.
artikel
664 Rise-time effects in grounded gate nMOS transistors under transmission line pulse stress Boselli, Gianluca
2000
100-101 12 p. 2061-2067
7 p.
artikel
665 Robustness of the exponential sequential probability ratio test (SPRT) when Weibull distributed failures are transformed using a “known” shape parameter Hauck, Daryl J.
1997
100-101 12 p. 1835-1840
6 p.
artikel
666 Rotating crucible electron beam evaporation technique for the deposition of multicomponent oxide films 1994
100-101 12 p. 1975-
1 p.
artikel
667 Sample sizes for estimating the Weibull hazard function from censored samples 1992
100-101 12 p. 1786-
1 p.
artikel
668 Self-protection capability of integrated NLDMOS power arrays in ESD pulse regimes Aliaj, Blerina
2011
100-101 12 p. 2015-2030
16 p.
artikel
669 Self-pruning binary tree architectures for improved interconnection fault tolerance 1992
100-101 12 p. 1791-
1 p.
artikel
670 Sensitivity of multimode bidirectional optoelectronic modules to electrostatic discharges Neitzert, H.C.
1999
100-101 12 p. 1863-1871
9 p.
artikel
671 Shortest bayes credibility intervals for the lognormal failure model Chen, Keh-Wei
1997
100-101 12 p. 1859-1863
5 p.
artikel
672 Sidewall defects of AlGaN/GaN HEMTs evaluated by low frequency noise analysis Chiu, Hsien-Chin
2013
100-101 12 p. 1897-1900
4 p.
artikel
673 Silicon-implanted SiO2 for nonvolatile memory applications 1994
100-101 12 p. 1971-
1 p.
artikel
674 Silicon nitride etch characteristics in SF6/O2 and C3F6O/O2 plasmas and evaluation of their global warming effects Kim, I.J.
2012
100-101 12 p. 2970-2974
5 p.
artikel
675 Simple enumeration of minimal cutsets separating two vertices in a class of undirected planar graphs 1992
100-101 12 p. 1787-
1 p.
artikel
676 Simplified terrain identification and component fatigue damage estimation model for use in a health and usage monitoring system Heine, Richard
2007
100-101 12 p. 1882-1888
7 p.
artikel
677 SIMS depth profiling of implanted layers in silicon under N2 + ion bombardment 1994
100-101 12 p. 1973-
1 p.
artikel
678 SIMS study of silicon oxynitride prepared by oxidation of silicon-rich silicon nitride layer Poon, M.C
2001
100-101 12 p. 2071-2074
4 p.
artikel
679 Simulation and fabrication of magnetic rotary microgenerator with multipolar Nd/Fe/B magnet Pan, C.T.
2007
100-101 12 p. 2129-2134
6 p.
artikel
680 Simulation model and parameter extraction of Field-Stop (FS) IGBT Tang, Yong
2012
100-101 12 p. 2920-2931
12 p.
artikel
681 Simulation of crosstalk in high-speed multilayer off-chip interconnections 1994
100-101 12 p. 1969-
1 p.
artikel
682 Simulation of flicker noise in gate-all-around Silicon Nanowire MOSFETs including interface traps Anandan, P.
2014
100-101 12 p. 2723-2727
5 p.
artikel
683 Society of reliability engineers bulletin Reiche, Hans
1992
100-101 12 p. 1779-
1 p.
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684 Software reliability handbook Popentiu, Fl.
1992
100-101 12 p. 1775-1776
2 p.
artikel
685 Software reliability measurement and assessment based on nonhomogeneous Poisson process models: A survey Yamada, Shigeru
1992
100-101 12 p. 1763-1773
11 p.
artikel
686 Soldering system innovations 1994
100-101 12 p. 1949-
1 p.
artikel
687 Solder joint reliability of a polymer reinforced wafer level package Kim, Deok-Hoon
2002
100-101 12 p. 1837-1848
12 p.
artikel
688 Solder joint reliability of a thin small outline package (TSOP) 1994
100-101 12 p. 1952-
1 p.
artikel
689 Stability analysis in multiwall carbon nanotube bundle interconnects Haji-Nasiri, Saeed
2012
100-101 12 p. 3026-3034
9 p.
artikel
690 Stability of the J–V characteristics of (BEHP-PPV)-co-(MEH-PPV) based light-emitting diodes Sánchez, J.C.
2009
100-101 12 p. 1503-1507
5 p.
artikel
691 Stacked solder bumping technology for improved solder joint reliability Liu, Xingsheng
2001
100-101 12 p. 1979-1992
14 p.
artikel
692 State-of-the-art multichip modules for avionics 1992
100-101 12 p. 1791-
1 p.
artikel
693 Statistical bin limits—an approach to wafer disposition in IC fabrication 1992
100-101 12 p. 1795-
1 p.
artikel
694 Statistical modelling in manufacturing: adapting a diagnostic tool to real-time applications 1994
100-101 12 p. 1957-
1 p.
artikel
695 Statistics of solder joint alignment for optoelectronic components 1994
100-101 12 p. 1952-
1 p.
artikel
696 Stochastic analysis of a two-dissimilar unit warm standby redundant system with two types of repair facilities Mokaddis, G.S.
1995
100-101 12 p. 1467-1472
6 p.
artikel
697 Stochastic analysis of a two-unit cold standby system subject to maximum operation and repair time Singh, S.K.
1995
100-101 12 p. 1489-1493
5 p.
artikel
698 Stochastic analysis of standby systems with common-cause failures and human errors Dhillon, Balbir S.
1992
100-101 12 p. 1699-1712
14 p.
artikel
699 Strategic alliances for microelectronics development 1994
100-101 12 p. 1963-
1 p.
artikel
700 Stress induced gate–drain leakage current in ultra-thin gate oxide Petit, C.
2007
100-101 12 p. 2070-2081
12 p.
artikel
701 Structural health monitoring of solder joints in QFN package Gershman, I.
2012
100-101 12 p. 3011-3016
6 p.
artikel
702 Studies on the heat removal features of stacked SOI structures with a dedicated field solver program (SUNRED) Kohári, Zs
1998
100-101 12 p. 1881-1891
11 p.
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703 Study of proton irradiation effects on AlGaN/GaN high electron mobility transistors Lv, Ling
2011
100-101 12 p. 2168-2172
5 p.
artikel
704 Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects Chiu, Y.W
2002
100-101 12 p. 1945-1951
7 p.
artikel
705 Study of the electrolyte-insulator-semiconductor field-effect transistor (EISFET) with applications in biosensor design Waleed Shinwari, M.
2007
100-101 12 p. 2025-2057
33 p.
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706 Study of thinned Si wafer warpage in 3D stacked wafers Kim, Youngrae
2010
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6 p.
artikel
707 Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs Li, Junhui
2011
100-101 12 p. 2210-2215
6 p.
artikel
708 Study on low-Ag content Sn–Ag–Zn/Cu solder joints Luo, Tingbi
2013
100-101 12 p. 2018-2029
12 p.
artikel
709 Study on the shear strength degradation of ACA joints induced by different hygrothermal aging conditions Wu, Guanghua
2013
100-101 12 p. 2030-2035
6 p.
artikel
710 Substrate-engineered GGNMOS for low trigger voltage ESD in 65nm CMOS process Ma, Fei
2011
100-101 12 p. 2124-2128
5 p.
artikel
711 Suppressing effect of the moisture absorption in the semiconductor SMDs by the use of a dry-cabinet 1992
100-101 12 p. 1784-
1 p.
artikel
712 Suppression of interfacial boron accumulation and defect density in molecular beam epitaxial silicon 1994
100-101 12 p. 1973-
1 p.
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713 Surface mounting of very fine pitch components: a new challenge 1994
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1 p.
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714 Surface texturing of multilayer Ag-Cu films by sputter-etching 1994
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1 p.
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715 Synthesis creep behavior of Sn63Pb37 under the applied stress and electric current Xuan, Fu-Zhen
2011
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5 p.
artikel
716 System failure-frequency analysis using a differential operator 1992
100-101 12 p. 1788-
1 p.
artikel
717 System-level modelling in VHDL 1992
100-101 12 p. 1790-
1 p.
artikel
718 Systems adopt advanced technology for testing IC devices 1994
100-101 12 p. 1950-
1 p.
artikel
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100-101 12 p. 1785-
1 p.
artikel
720 Tantalum electrolytic capacitors evolve with chip technology 1992
100-101 12 p. 1782-
1 p.
artikel
721 Technological and economical aspects of mega-chip development 1994
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1 p.
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722 Technologies and reliability of modern embedded flash cells Sikora, Axel
2006
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26 p.
artikel
723 Technology constraints in the VLSI implementation of digital mobile radio terminals 1992
100-101 12 p. 1789-
1 p.
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724 Technology independent ASIC design methodology 1992
100-101 12 p. 1795-
1 p.
artikel
725 Temperature dependent electrical and dielectric properties of Sn/p-Si metal–semiconductor (MS) structures Karataş, Şükrü
2011
100-101 12 p. 2205-2209
5 p.
artikel
726 Temperature stability of electro-thermally and piezoelectrically actuated silicon carbide MEMS resonators Wood, G.S.
2010
100-101 12 p. 1977-1983
7 p.
artikel
727 Terminal-pair reliability of tree-type computer communication networks 1992
100-101 12 p. 1786-
1 p.
artikel
728 Test coupons as an aid to process control of the PCB manufacturing and assembly processes 1992
100-101 12 p. 1792-1793
2 p.
artikel
729 Test dominates MCM assembly 1992
100-101 12 p. 1795-
1 p.
artikel
730 Testing machines enhance yield, throughput in mobilecom production 1994
100-101 12 p. 1968-
1 p.
artikel
731 Testing process capability for one-sided specification limit with application to the voltage level translator Lin, P.C.
2002
100-101 12 p. 1975-1983
9 p.
artikel
732 Testing process precision for truncated normal distributions Pearn, W.L.
2007
100-101 12 p. 2275-2281
7 p.
artikel
733 Test program ensures IC reliability 1992
100-101 12 p. 1782-
1 p.
artikel
734 The application of exploratory data analysis techniques to reliability data 1992
100-101 12 p. 1786-
1 p.
artikel
735 The application of laser process technology to thin film packaging 1994
100-101 12 p. 1973-
1 p.
artikel
736 The Burr type XII distribution as a failure model under various loss functions Moore, Deborah
2000
100-101 12 p. 2117-2122
6 p.
artikel
737 The cost of product liability for small vs large firms 1994
100-101 12 p. 1958-
1 p.
artikel
738 The design of second-order bit sliced infinite impulse response digital filter chips using CIRCAD II 1992
100-101 12 p. 1795-1796
2 p.
artikel
739 The effect of memory-management policies on system reliability 1994
100-101 12 p. 1947-1948
2 p.
artikel
740 The effect of polyimide surface chemistry and morphology on critical stress intensity factor Amagai, Masazumi
2000
100-101 12 p. 2077-2086
10 p.
artikel
741 The effect of resistor geometry on current noise 1994
100-101 12 p. 1972-1973
2 p.
artikel
742 The effect of small-signal AC voltages on C–V characterization and parameter extraction of SiO2 thin films Zhang, Hongguo
2003
100-101 12 p. 1981-1985
5 p.
artikel
743 The effect of surface modification and catalytic metal contact on methane sensing performance of nano-ZnO–Si heterojunction sensor Bhattacharyya, P.
2011
100-101 12 p. 2185-2194
10 p.
artikel
744 The effects of duty cycle and voltage swing of gate pulse on the AC-stress-induced degradation of nMOSFETs with N2O gate oxides Zeng, X
1998
100-101 12 p. 1925-1929
5 p.
artikel
745 The effects of 12MeV electron irradiation on the electrical characteristics of the Au/Aniline blue/p-Si/Al device Aydoğan, Şakir
2011
100-101 12 p. 2216-2222
7 p.
artikel
746 The effects of process induced gate-to-source/drain junction separation in MOSFET structures Rowlands, David
1998
100-101 12 p. 1855-1866
12 p.
artikel
747 The effects of rheological and wetting properties on underfill filler settling and flow voids in flip chip packages Wang, Jinlin
2007
100-101 12 p. 1958-1966
9 p.
artikel
748 The effects of SiO2 barrier between active layer and substrate on the performance and reliability of polycrystalline silicon thin film transistors Wang, Y.Z
1998
100-101 12 p. 1835-1846
12 p.
artikel
749 The evaluation for the chromatic characteristics of LED module under electrical and thermal coupling analysis Fu, Han Kuei
2013
100-101 12 p. 1916-1921
6 p.
artikel
750 The evolving role of defects and contamination in semiconductor manufacturing 1994
100-101 12 p. 1949-
1 p.
artikel
751 The Hi-noon neural simulator and its applications Damper, R.I.
2001
100-101 12 p. 2051-2065
15 p.
artikel
752 The influence of adatom diffusion on coverage and emission current fluctuations Tarasenko, A.A.
2000
100-101 12 p. 2023-2031
9 p.
artikel
753 The influence of assisted ion beam bombardment on structure and electrical characteristics of HfSiO dielectric synthesized by DIBSD Yang, X.M.
2011
100-101 12 p. 2115-2118
4 p.
artikel
754 The measure of effect in an expert system for automatic generation of fault trees 1992
100-101 12 p. 1785-
1 p.
artikel
755 The midrange and high temperature dependence of vacuum deposited NiCr thin film resistors 1994
100-101 12 p. 1972-
1 p.
artikel
756 The model parameter extraction and simulation for the effects of gamma irradiation on the DC characteristics of InGaP/GaAs single heterojunction bipolar transistors Zhang, Jincan
2012
100-101 12 p. 2941-2947
7 p.
artikel
757 The optimization design of bump interconnections in flip chip packages from the electrical standpoint Liu, De-Shin
2002
100-101 12 p. 1893-1901
9 p.
artikel
758 Theory and measurement of quantization effects on Si-SiO2 interface trap modelling 1992
100-101 12 p. 1798-
1 p.
artikel
759 The partitioning of linear registers for testing applications 1994
100-101 12 p. 1967-
1 p.
artikel
760 The peaks in the electric derivative curves and optic derivative curves of GaAs/GaAlAs high-power QW lasers Liyun, Qi
2000
100-101 12 p. 2123-2128
6 p.
artikel
761 The preliminary draft of a proposed restatement (third) of Torts: products liability 1994
100-101 12 p. 1948-
1 p.
artikel
762 Thermal and voltage instabilities of hafnium oxide films prepared by sputtering technique Wong, Hei
2013
100-101 12 p. 1863-1867
5 p.
artikel
763 Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges Otiaba, K.C.
2011
100-101 12 p. 2031-2043
13 p.
artikel
764 Thermally driven reliability issues in microelectronic systems: status-quo and challenges Lasance, Clemens J.M.
2003
100-101 12 p. 1969-1974
6 p.
artikel
765 Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems Wymysłowski, Artur
2007
100-101 12 p. 1967-1968
2 p.
artikel
766 Thermal oxidation of silicon and residual fixed charge 1994
100-101 12 p. 1972-
1 p.
artikel
767 Thermal reliability of VCO using InGaP/GaAs HBTs Liu, Xiang
2011
100-101 12 p. 2147-2152
6 p.
artikel
768 Thermal stability investigations of AlGaN/GaN HEMTs with various high work function gate metal designs Chiu, Hsien-Chin
2011
100-101 12 p. 2163-2167
5 p.
artikel
769 Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment Karppinen, J.S.
2010
100-101 12 p. 1994-2000
7 p.
artikel
770 The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy Silva, Bismarck Luiz
2014
100-101 12 p. 2929-2934
6 p.
artikel
771 The Siemens high-level synthesis system CALLAS 1994
100-101 12 p. 1965-
1 p.
artikel
772 The study on failure mechanisms of bond pad metal peeling: Part A––Experimental investigation Jeon, Insu
2003
100-101 12 p. 2047-2054
8 p.
artikel
773 The study on failure mechanisms of bond pad metal peeling: Part B––Numerical analysis Jeon, Insu
2003
100-101 12 p. 2055-2064
10 p.
artikel
774 The TDDB power-law model—Physics and experimental evidences Vollertsen, Rolf-Peter
2005
100-101 12 p. 1807-1808
2 p.
artikel
775 The transient analysis of latch-up in CMOS transmission gate induced by laser Qiu, Weicheng
2014
100-101 12 p. 2775-2781
7 p.
artikel
776 The transistor modeling problem again Ratschek, H.
1992
100-101 12 p. 1725-1740
16 p.
artikel
777 Thickness and temperature dependence of the leakage current in hafnium-based Si SOI MOSFETs Kim, Jiseok
2012
100-101 12 p. 2907-2913
7 p.
artikel
778 Thickness determination of thin SiO2 on silicon 1992
100-101 12 p. 1798-
1 p.
artikel
779 Thin film, thick film microstrip band pass filter: a comparison and effect of bulk overlay Rane, Sunit
2002
100-101 12 p. 1953-1958
6 p.
artikel
780 Thin oxide grown on heavily channel-implanted substrate by using a low temperature wafer loading and N2pre-annealing process 1994
100-101 12 p. 1974-
1 p.
artikel
781 Threshold voltage shift in 0.1 μm self-aligned-gate GaAs MESFETs under bias stress and related degradation of ultra-high-speed digital ICs Fukai, Yoshino K.
1999
100-101 12 p. 1787-1792
6 p.
artikel
782 Throughput optimized architectural synthesis 1994
100-101 12 p. 1970-
1 p.
artikel
783 Time-dependent dielectric breakdown (TDDB) distribution in n-MOSFET with HfSiON gate dielectrics under DC and AC stressing Hirano, Izumi
2013
100-101 12 p. 1868-1874
7 p.
artikel
784 Time-dependent dielectric wearout technique with temperature effect for reliability test of ultrathin (<2.0 nm) single layer and dual layer gate oxides Wu, Yider
2000
100-101 12 p. 1987-1995
9 p.
artikel
785 Time-independent elastic–plastic behaviour of solder materials Wiese, S.
2004
100-101 12 p. 1893-1900
8 p.
artikel
786 Time lag and permeation in multilayer polymer coatings 1994
100-101 12 p. 1965-
1 p.
artikel
787 Title section, volume, contents and author index, volume 32, 1992 1992
100-101 12 p. i-xiv
nvt p.
artikel
788 Torsional stiffness and fatigue study of surface-mounted compliant leaded systems 1994
100-101 12 p. 1951-1952
2 p.
artikel
789 Total dose effects on power-MOSFET switching converters Pizano, J.E
1998
100-101 12 p. 1935-1939
5 p.
artikel
790 Total dose response studies of n-channel SOI MOSFETs for low power CMOS circuits Srivastava, A.
2000
100-101 12 p. 2111-2115
5 p.
artikel
791 TRACE—traceability and reliability assuring computerized environment 1992
100-101 12 p. 1783-
1 p.
artikel
792 Trade-offs in cycle time management: hot lots 1992
100-101 12 p. 1788-
1 p.
artikel
793 Transformations and resynthesis for testability of RT-level control-data path specifications 1994
100-101 12 p. 1965-
1 p.
artikel
794 Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition Yeh, Chang-Lin
2007
100-101 12 p. 2188-2196
9 p.
artikel
795 Transient interferometric mapping of carrier plasma during external transient latch-up phenomena in latch-up test structures and I/O cells processed in CMOS technology Heer, Michael
2009
100-101 12 p. 1455-1464
10 p.
artikel
796 Transistor-level to gate-level comprehensive fault synthesis for n-input primitive gates Sedaghat, Reza
2006
100-101 12 p. 2149-2158
10 p.
artikel
797 Trap detection in electrically stressed AlGaN/GaN HEMTs using optical pumping Cheney, D.J.
2012
100-101 12 p. 2884-2888
5 p.
artikel
798 Trench DMOS interface trap characterization by three-terminal charge pumping measurement Izuddin, I.
2012
100-101 12 p. 2914-2919
6 p.
artikel
799 Trends and outlook for micromachining and micromechatronics 1992
100-101 12 p. 1792-
1 p.
artikel
800 Trends in reliability, miniature designs push control relay market toward ¥200 billion level 1992
100-101 12 p. 1782-
1 p.
artikel
801 Trends spur chip parts production, technology gains 1992
100-101 12 p. 1792-
1 p.
artikel
802 Tunneling component suppression in charge pumping measurement and reliability study for high-k gated MOSFETs Lu, Chun-Chang
2011
100-101 12 p. 2110-2114
5 p.
artikel
803 Two-dimensional model of impurity diffusion in polysilicon-silicon structures 1992
100-101 12 p. 1797-
1 p.
artikel
804 Ultra-shallow n+p junction formed by PH3 and AsH3 plasma immersion ion implantation Yang, B.L
2002
100-101 12 p. 1985-1989
5 p.
artikel
805 Understanding and modeling of internal transient latch-up susceptibility in CMOS inverters due to microwave pulses Chen, Jie
2013
100-101 12 p. 1891-1896
6 p.
artikel
806 Unified apparent bandgap narrowing in n- and p-type silicon 1992
100-101 12 p. 1797-
1 p.
artikel
807 Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages Perkins, Andy
2007
100-101 12 p. 2260-2274
15 p.
artikel
808 Using a new bathtub curve to correlate quality and reliability Roesch, William J.
2012
100-101 12 p. 2864-2869
6 p.
artikel
809 Using a test site for the rapid introduction of 32-kb bipolar RAM 1992
100-101 12 p. 1790-
1 p.
artikel
810 Using intuitionistic fuzzy sets for fault-tree analysis on printed circuit board assembly Shu, Ming-Hung
2006
100-101 12 p. 2139-2148
10 p.
artikel
811 Using yield models to accelerate learning curve progress 1992
100-101 12 p. 1781-
1 p.
artikel
812 1.8V–3GHz CMOS limiting amplifier with efficient frequency compensation Garcia del Pozo, J.M.
2010
100-101 12 p. 2084-2089
6 p.
artikel
813 Via high resistance failure analysis of LSI devices induced by multiple factors related to process and design Naoe, Takuya
2012
100-101 12 p. 2975-2981
7 p.
artikel
814 VLSI architectural design of SDH products 1992
100-101 12 p. 1791-
1 p.
artikel
815 VLSI architectures for discrete wavelet transforms 1994
100-101 12 p. 1970-
1 p.
artikel
816 VLSI design of an M-path decoder IC suitable for bidirectional decoding of convolutional codes 1994
100-101 12 p. 1968-1969
2 p.
artikel
817 VLSI implementation of error correcting codes 1992
100-101 12 p. 1796-
1 p.
artikel
818 VLSI technology requirements for an ATM variable bit rate video codec 1992
100-101 12 p. 1789-
1 p.
artikel
819 Void formation at the interface in Sn/Cu solder joints Yang, Yang
2011
100-101 12 p. 2314-2318
5 p.
artikel
820 Void formation over limiting current density and impurity analysis of TSV fabricated by constant-current pulse-reverse modulation Lin, Nay
2013
100-101 12 p. 1943-1953
11 p.
artikel
821 Voltage acceleration of time-dependent breakdown of ultra-thin gate dielectrics Pompl, Thomas
2005
100-101 12 p. 1835-1841
7 p.
artikel
822 Voting mechanisms in distributed systems 1992
100-101 12 p. 1790-1791
2 p.
artikel
823 Wafer-level packaging of silicon to glass with a BCB intermediate layer using localised laser heating Lorenz, N.
2011
100-101 12 p. 2257-2262
6 p.
artikel
824 Warpage evolution of overmolded ball grid array package during post-mold curing thermal process Chiu, Tz-Cheng
2011
100-101 12 p. 2263-2273
11 p.
artikel
825 Weaknesses of the conventional three-state model in station-oriented reliability evaluation Billinton, R.
1997
100-101 12 p. 1799-1804
6 p.
artikel
826 World abstract on microelectronics and reliability 1. Realibility—General 1997
100-101 12 p. 1865-1881
17 p.
artikel
827 Zero-defect sputter deposition metallization method for high volume manufacturing of grafted multilayer thin film modules 1994
100-101 12 p. 1972-
1 p.
artikel
                             827 gevonden resultaten
 
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