Digitale Bibliotheek
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                             3138 gevonden resultaten
nr titel auteur tijdschrift jaar jaarg. afl. pagina('s) type
1 A bakeable vacuum evaporator for the deposition of large area thin-film circuits 1969
100-101 1 p. 71-
1 p.
artikel
2 A Bayesian estimate of reliability in the Weibull distribution Jayaram, Y.G.
1974
100-101 1 p. 29-32
4 p.
artikel
3 A Bayesian scheme for sequentially testing a multi-component system 1977
100-101 1 p. 16-
1 p.
artikel
4 A bilevel thin film hybrid circuit containing crossovers, resistors, capacitors, and integrated circuits 1974
100-101 1 p. 19-
1 p.
artikel
5 A 12 bit monolithic IC D to A converter 1971
100-101 1 p. 23-
1 p.
artikel
6 A brief review of selected aspects of the materials science of ball bonding Breach, C.D.
2010
100-101 1 p. 1-20
20 p.
artikel
7 A broad-band thin-film lumped-element circulator for 1·7 GHz band 1974
100-101 1 p. 19-
1 p.
artikel
8 A buried N + SIC integrated Hall element 1973
100-101 1 p. 26-
1 p.
artikel
9 AC analysis of nanoscale GME-TRC MOSFET for microwave and RF applications Malik, Priyanka
2012
100-101 1 p. 151-158
8 p.
artikel
10 AC and DC conductivity in amorphous silicon-hydrogen films 1984
100-101 1 p. 187-
1 p.
artikel
11 A case study approach to the reliability of shipborne electronic systems 1976
100-101 1 p. 20-
1 p.
artikel
12 A case study approach to the reliability of shipborne electronic systems Shove, P.L.
1975
100-101 1 p. 57-62
6 p.
artikel
13 A case study of component failures 1964
100-101 1 p. 69-
1 p.
artikel
14 Accelearted life testing of flexible printed circuits. Part I—Test program and typical results 1977
100-101 1 p. 14-15
2 p.
artikel
15 Accelerated ageing of IMPATT diodes 1982
100-101 1 p. 132-
1 p.
artikel
16 Accelerated life testing of flexible printed circuits Part II—Failure modes in flexible printed circuits coated with UV-cured resins 1977
100-101 1 p. 15-
1 p.
artikel
17 Accelerated life tests of ceramic capacitors 1990
100-101 1 p. 193-194
2 p.
artikel
18 Acceleration factors for plastic encapsulated semiconductor devices and their relationship to field performance Reich, Bernard
1975
100-101 1 p. 63-66
4 p.
artikel
19 Acceptor-like gold level in n-type silicon 1987
100-101 1 p. 189-
1 p.
artikel
20 Accuracy of approx confidence bounds using censored Weibull regression data from accelerated life tests 1991
100-101 1 p. 203-
1 p.
artikel
21 Accuracy of conventional inversion charge modeling in scaled down MOS devices Bose, S.C.
1988
100-101 1 p. 15-17
3 p.
artikel
22 Accuracy of simplified printed circuit board finite element models Amy, Robin Alastair
2010
100-101 1 p. 86-97
12 p.
artikel
23 A chemical polish method for the preparation of silicon substrates for epitaxial deposition Fairhurst, K.M.
1966
100-101 1 p. 15-16
2 p.
artikel
24 A circuit packaging model for high-speed computer technology 1964
100-101 1 p. 70-71
2 p.
artikel
25 A cloud model-based method for the analysis of accelerated life test data Zhang, Wenjin
2015
100-101 1 p. 123-128
6 p.
artikel
26 A cluster-modified Poisson model for estimating defect density and yield 1991
100-101 1 p. 209-
1 p.
artikel
27 A CMOS/SOS Reliability Study 1977
100-101 1 p. 15-
1 p.
artikel
28 A comparison of duplicate and triplicate redundancy schemes for binary logical networks Cluley, J.C.
1964
100-101 1 p. 51-59
9 p.
artikel
29 A comprehensive approach to IC design and fabrication 1983
100-101 1 p. 194-
1 p.
artikel
30 A comprehensive model of PMOS NBTI degradation Alam, M.A.
2005
100-101 1 p. 71-81
11 p.
artikel
31 A comprehensive test sequence for the electron beam exposure system 1983
100-101 1 p. 198-
1 p.
artikel
32 A computer algorithm for optimal maintenance of standby redundant systems 1982
100-101 1 p. 136-
1 p.
artikel
33 A computer algorithm for the analysis of maintained standby redundant systems 1982
100-101 1 p. 139-
1 p.
artikel
34 A conception for reliability prediction and estimation of MOS integrated circuits Dimitrov, Stojan
1990
100-101 1 p. 27-34
8 p.
artikel
35 A control system for the evaporation of silicon monoxide insulating films 1963
100-101 1 p. 79-
1 p.
artikel
36 A critical review of human performance reliability predictive methods 1974
100-101 1 p. 9-
1 p.
artikel
37 A critique of chip-joining techniques 1971
100-101 1 p. 21-22
2 p.
artikel
38 A critique of Mil-Hdbk-217E reliability prediction methods 1990
100-101 1 p. 194-
1 p.
artikel
39 Active redundancy in analogue electronic systems 1976
100-101 1 p. 19-
1 p.
artikel
40 Adapting mechanical models to fit electronics 1991
100-101 1 p. 199-
1 p.
artikel
41 A data base management (DBMP) program for integrated logistics support (ILS) 1976
100-101 1 p. 19-
1 p.
artikel
42 A data information system for RIW contracts 1982
100-101 1 p. 133-
1 p.
artikel
43 A degradation model for metallized polyester capacitors Specchiulli, G.
1987
100-101 1 p. 145-163
19 p.
artikel
44 A detailed analysis of the metal-semiconductor contact 1975
100-101 1 p. 27-28
2 p.
artikel
45 Adhesion improvement of Epoxy Molding Compound – Pd Preplated leadframe interface using shaped nickel layers Ni, Mingzhi
2012
100-101 1 p. 206-211
6 p.
artikel
46 Adhesive strength of thick-film PdAg conductors 1972
100-101 1 p. 27-
1 p.
artikel
47 Admissibility of a conditionally specified test procedure for life data Saxena, S.K.
1985
100-101 1 p. 59-60
2 p.
artikel
48 Admittance of p-n junctions containing traps 1973
100-101 1 p. 24-25
2 p.
artikel
49 A 2D threshold-voltage model for small MOSFET with quantum-mechanical effects Xu, J.P.
2008
100-101 1 p. 23-28
6 p.
artikel
50 Advanced process technology for VLSI circuits 1982
100-101 1 p. 141-
1 p.
artikel
51 Advances in crystal growing technology 1966
100-101 1 p. 90-
1 p.
artikel
52 Advances in doped oxides as diffusion sources 1969
100-101 1 p. 68-
1 p.
artikel
53 Advances in epoxy die-attach 1976
100-101 1 p. 21-
1 p.
artikel
54 Advances in silicon epitaxial technology 1969
100-101 1 p. 68-
1 p.
artikel
55 Advances in silicon technology for the semiconductor industry, Part I 1984
100-101 1 p. 178-
1 p.
artikel
56 A dynamic bias system for burn-in or thermal endurance treatments of 8085A microprocessors Shaw, R.N
1982
100-101 1 p. 117-130
14 p.
artikel
57 A dynamic reconfiguration scheme for mega bit Static Random Access Memories Rayapati, Venkatapathi N.
1994
100-101 1 p. 107-114
8 p.
artikel
58 Aerospace computer technology catches up with ground gear 1973
100-101 1 p. 24-
1 p.
artikel
59 A fast method for redundancy allocation 1974
100-101 1 p. 13-
1 p.
artikel
60 A fault-tolerant cache architecture based on binary set partitioning Zarandi, Hamid R.
2006
100-101 1 p. 86-99
14 p.
artikel
61 A fault tolerant implementation of the Goertzel algorithm Gao, Z.
2014
100-101 1 p. 335-337
3 p.
artikel
62 A fault-tolerant system architecture for Navy applications 1984
100-101 1 p. 172-
1 p.
artikel
63 A finite weakest-link model of lifetime distribution of high-k gate dielectrics under unipolar AC voltage stress Le, Jia-Liang
2012
100-101 1 p. 100-106
7 p.
artikel
64 A flexible bathtub hazard model for non-repairable systems with uncensored data Jaisingh, Lloyd R.
1987
100-101 1 p. 87-103
17 p.
artikel
65 A function-fit model for the hard breakdown I–V characteristics of ultra-thin oxides in MOS structures Miranda, E.
2005
100-101 1 p. 175-178
4 p.
artikel
66 A generalized modular redundancy scheme for enhancing fault tolerance of combinational circuits El-Maleh, Aiman H.
2014
100-101 1 p. 316-326
11 p.
artikel
67 A general theory of software-reliability modeling 1991
100-101 1 p. 205-
1 p.
artikel
68 Aging effects in gold thermocompression bonds to complex metallizations 1971
100-101 1 p. 16-
1 p.
artikel
69 A good QA can help you survive 1977
100-101 1 p. 11-
1 p.
artikel
70 A high density thick film multilayer process for LSI circuits 1975
100-101 1 p. 30-
1 p.
artikel
71 A high voltage photo-voltaic battery using a single silicon wafer Bradshaw, G
1962
100-101 1 p. 97-98
2 p.
artikel
72 A hybrid integrated silicon diode array for visible earth-horizon sensing 1975
100-101 1 p. 33-
1 p.
artikel
73 A hybrid simulation/analytic approach for computer communication systems via exponential limit theorems Sumita, Ushio
1988
100-101 1 p. 1-5
5 p.
artikel
74 Air bridge and via hole technology for GaAs based microwave devices 1990
100-101 1 p. 197-
1 p.
artikel
75 Aircraft maintenance and reliability Fukushima, M.
1972
100-101 1 p. 41-46
6 p.
artikel
76 A laboratory electron beam machine Perkins, K.D.
1965
100-101 1 p. 35-36
2 p.
artikel
77 A large scale hybrid thermal print head 1984
100-101 1 p. 186-
1 p.
artikel
78 Albedo horizon sensor using hybrid circuitry 1973
100-101 1 p. 23-
1 p.
artikel
79 ALE—a carrier aircraft availability model 1977
100-101 1 p. 17-
1 p.
artikel
80 Algorithm for automatic alignment in 2D space by object transformation Kim, Hyong Tae
2006
100-101 1 p. 100-108
9 p.
artikel
81 Algorithms for generating minimal cutsets by inversion 1987
100-101 1 p. 186-
1 p.
artikel
82 A life-cycle cost viewpoint of software maintainability 1983
100-101 1 p. 191-
1 p.
artikel
83 A low-frequency noise study of hot-carrier stressing effects in submicron Si p-MOSFETs Vasina, P
1998
100-101 1 p. 23-27
5 p.
artikel
84 Alternative CMOS or alternative to CMOS? Deleonibus, S
2001
100-101 1 p. 3-12
10 p.
artikel
85 Al thermomigration applied to the formation of deep junctions for power device insulation Dilhac, J-M.
1999
100-101 1 p. 23-27
5 p.
artikel
86 Aluminum conductor failure by mass transport 1970
100-101 1 p. 15-
1 p.
artikel
87 Aluminum ultrasonic joining in spider and wire connections 1972
100-101 1 p. 20-
1 p.
artikel
88 ALU, multiplier chips zip through IEEE floating-point operations 1984
100-101 1 p. 182-
1 p.
artikel
89 A Markov approach to wear-out modelling Bobbio, Andrea
1983
100-101 1 p. 113-119
7 p.
artikel
90 A 0.11 μm CMOS technology featuring copper and very low k interconnects with high performance and reliability Takao, Yoshihiro
2002
100-101 1 p. 15-25
11 p.
artikel
91 A measurement technique of time-dependent dielectric breakdown in MOS capacitors 1975
100-101 1 p. 21-
1 p.
artikel
92 A metal-oxide-semiconductor (MOS) hall element 1967
100-101 1 p. 75-
1 p.
artikel
93 A method for designing non-linear thick-film potentiometric displacement transducers 1976
100-101 1 p. 26-
1 p.
artikel
94 A method for investigation of fluctuations in doping concentration and minority-carrier diffusion length in semiconductors by scanning electron microscope 1977
100-101 1 p. 22-23
2 p.
artikel
95 A method for statistical tolerance calculation 1967
100-101 1 p. 67-
1 p.
artikel
96 A method for the rapid and economical generation of hybrid LSI circuits 1975
100-101 1 p. 32-
1 p.
artikel
97 A method of assessing the risks associated with reliability demonstration testing 1972
100-101 1 p. 16-
1 p.
artikel
98 A method of redundancy allocation 1974
100-101 1 p. 13-
1 p.
artikel
99 A method of studying thermocompression bonding damage in GaAs using the SEM 1976
100-101 1 p. 14-
1 p.
artikel
100 A 20 MHz digital frequency meter using ttl integrated circuits (Part 1) 1972
100-101 1 p. 20-21
2 p.
artikel
101 A micro-contacting spider to test wafers for integrated circuits 1976
100-101 1 p. 21-
1 p.
artikel
102 A microelectronics interconnexion method 1967
100-101 1 p. 72-73
2 p.
artikel
103 A mixed CMOS-DMOS-JFET technology for switching circuits with high voltage output stages Podmiotko, W.J.
1987
100-101 1 p. 33-37
5 p.
artikel
104 A model for burn-in programs for components with eliminateable defects 1977
100-101 1 p. 14-
1 p.
artikel
105 A model for computation of second breakdown in transistors 1971
100-101 1 p. 16-
1 p.
artikel
106 A model for the reliability estimation of space systems 1964
100-101 1 p. 70-
1 p.
artikel
107 A model of maintenance decision errors 1983
100-101 1 p. 190-
1 p.
artikel
108 A model of OHMIC contacts to semiconducts 1976
100-101 1 p. 25-26
2 p.
artikel
109 A model to quantify reliability of human performance in man-machine systems Raouf, A.
1978
100-101 1 p. 155-163
9 p.
artikel
110 A modified SEM type EB direct writing system and its application on MOS LSI fabrication 1983
100-101 1 p. 199-
1 p.
artikel
111 A moments compiler for computing Bayes intervals for complex systems 1984
100-101 1 p. 174-
1 p.
artikel
112 A monolithic channel filter—manufacture with a new technology 1972
100-101 1 p. 21-22
2 p.
artikel
113 A monolithic radiation-hardened operational amplifier 1971
100-101 1 p. 22-
1 p.
artikel
114 A monolithic silicon class B hearing aid amplifier 1967
100-101 1 p. 80-
1 p.
artikel
115 A Monte Carlo method for determining confidence bounds on reliability and availability of maintained systems 1987
100-101 1 p. 185-
1 p.
artikel
116 Amplification of acoustic waves in semiconductors with dominants ionized impurity scattering 1977
100-101 1 p. 25-
1 p.
artikel
117 A multi-state system model Dhillon, Balbir S.
1977
100-101 1 p. 55-56
2 p.
artikel
118 An advanced area scaling approach for semiconductor burn-in Kurz, Daniel
2015
100-101 1 p. 129-137
9 p.
artikel
119 An aid to efficient maintenance Mortley, W.S.
1964
100-101 1 p. 1-2
2 p.
artikel
120 An algebraic expression to count the number of chips on a wafer 1990
100-101 1 p. 199-
1 p.
artikel
121 An algebraic method for reliability calculations Gupta, P.P.
1987
100-101 1 p. 19-23
5 p.
artikel
122 Analog IP blocks Stojcev, Mile
2005
100-101 1 p. 195-196
2 p.
artikel
123 Analyses of two difference 1-server systems 1977
100-101 1 p. 16-
1 p.
artikel
124 Analysis and mitigation of BTI aging in register file: An application driven approach Kothawade, Saurabh
2013
100-101 1 p. 105-113
9 p.
artikel
125 Analysis can take the heat off power semiconductors 1974
100-101 1 p. 15-
1 p.
artikel
126 Analysis for the reliability of the intrinsic base ion implantation of a 3 Ghz I2L bipolar process from the measure of integrated resistances: From the results, setting of rules for an expert system Loheac, J.-L.
1997
100-101 1 p. 179-186
8 p.
artikel
127 Analysis of a communication system with imperfect repair Pignal, Pierre I.
1987
100-101 1 p. 165-169
5 p.
artikel
128 Analysis of an on-surface transit system with correlated failures and repairs Goel, L.R.
1994
100-101 1 p. 165-169
5 p.
artikel
129 Analysis of a repairable redundant system with delayed replacement 1982
100-101 1 p. 138-139
2 p.
artikel
130 Analysis of a vibration-induced micro-generator with a helical micro-spring and induction coil Lu, W.L.
2012
100-101 1 p. 262-270
9 p.
artikel
131 Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps Chang, Y.W.
2013
100-101 1 p. 41-46
6 p.
artikel
132 Analysis of failures during qualification approval testing of diodes and thyristors 1987
100-101 1 p. 182-
1 p.
artikel
133 Analysis of failures in spacecraft and aircraft components 1970
100-101 1 p. 15-
1 p.
artikel
134 Analysis of fault tolerant computer systems Sumita, U.
1987
100-101 1 p. 65-78
14 p.
artikel
135 Analysis of high temperature effects on performances and hot-carrier degradation in DC/AC stressed 0.35 μm n-MOSFETs Bravaix, A.
1999
100-101 1 p. 35-44
10 p.
artikel
136 Analysis of InGaAs/InP multi-quantum-well structures by ion backscattering 1990
100-101 1 p. 202-
1 p.
artikel
137 Analysis of in situ monitored thermal cycling benefits for wireless packaging early reliability evaluation Ferrara, Michael
2012
100-101 1 p. 9-15
7 p.
artikel
138 Analysis of latch-up neighborhood effects in VLSI CMOS input and output stages Quincke, Jörg
1990
100-101 1 p. 105-122
18 p.
artikel
139 Analysis of 7 models for the 2-dissimilar-unit, warm standby, redundant system 1977
100-101 1 p. 16-
1 p.
artikel
140 Analysis of 1-out-of-2:G warm-standby repairable system 1987
100-101 1 p. 185-
1 p.
artikel
141 Analysis of pesudo-reliability of a combat tank system and its optimal design 1977
100-101 1 p. 17-
1 p.
artikel
142 Analysis of printed wiring board assembly system 1991
100-101 1 p. 208-
1 p.
artikel
143 Analysis of reliability bounds for series, parallel and k-out-of-n system configuration Gupta, Rakesh
1994
100-101 1 p. 183-185
3 p.
artikel
144 Analysis of reliability bounds for two-unit parallel and standby reparable systems Gupta, Rakesh
1995
100-101 1 p. 113-115
3 p.
artikel
145 Analysis of 1-server n-unit parallel system subject to different service strategies Gopalan, M.N.
1986
100-101 1 p. 191-196
6 p.
artikel
146 Analysis of temperature dependence of CMOS transistors' threshold voltage Prijić, Z.D.
1991
100-101 1 p. 33-37
5 p.
artikel
147 Analysis of two-unit redundant system under partial failure and two types of repairs Goel, L.R.
1984
100-101 1 p. 21-24
4 p.
artikel
148 Analytical approach to hot electron transport in small size Mosfet's 1982
100-101 1 p. 142-
1 p.
artikel
149 Analytical approximation to the queuing model: (HE3/HE3/1):(GD/∞/∞) for maintainability Kuo, Way
1988
100-101 1 p. 59-73
15 p.
artikel
150 Analytical estimates of stress around a doubly periodic arrangement of through-silicon vias Udupa, Anirudh
2013
100-101 1 p. 63-69
7 p.
artikel
151 Analytical methods for calculating the characteristic impedance of finite-thickness microstrip lines 1977
100-101 1 p. 20-
1 p.
artikel
152 Analytical model for threshold voltage of double gate bilayer graphene field effect transistors Saeidmanesh, M.
2014
100-101 1 p. 44-48
5 p.
artikel
153 Analytical study of a standby redundant intermittently working complex system Bajaj, C.P.
1971
100-101 1 p. 43-51
9 p.
artikel
154 Analytic study of a stand-by redundant equipment with switching and shelf life failures 1974
100-101 1 p. 13-
1 p.
artikel
155 An analysis of cooling methods for reliable operation of components 1963
100-101 1 p. 80-
1 p.
artikel
156 An analysis of the effect of impurity diffusion on current density in tunnel diodes 1964
100-101 1 p. 73-
1 p.
artikel
157 An analysis of the vacuum sealing process between turned surfaces 1969
100-101 1 p. 69-
1 p.
artikel
158 An analysis of voltage bias stressing characteristics of tantalum thin film capacitor 1973
100-101 1 p. 27-
1 p.
artikel
159 An analytical avalanche breakdown model for double gate MOSFET Cho, Edward Namkyu
2015
100-101 1 p. 38-41
4 p.
artikel
160 An analytic approach to performing a maintainability demonstration 1991
100-101 1 p. 206-
1 p.
artikel
161 Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices Zhang, Liang
2014
100-101 1 p. 281-286
6 p.
artikel
162 An approach in the life cycle cost of integrated logistic support Roca, J.L.
1987
100-101 1 p. 25-27
3 p.
artikel
163 An approach to a standard topology for digital hybrid integrated circuits 1972
100-101 1 p. 18-
1 p.
artikel
164 An approach to ensure stability of precision laser trimmed thick film resistors Joshi, Anil G.
1983
100-101 1 p. 161-165
5 p.
artikel
165 An approach to field repair of avionics computers 1971
100-101 1 p. 17-
1 p.
artikel
166 An approach to high reliability for a spacecraft IRU 1983
100-101 1 p. 190-
1 p.
artikel
167 An approach to the minimization of misclassification in the repair of equipment 1971
100-101 1 p. 17-
1 p.
artikel
168 An approximate model for boron drive diffusions in oxidizing ambients 1976
100-101 1 p. 25-
1 p.
artikel
169 An assessment of the value of triplicated redundancy in digital systems Longden, M.
1966
100-101 1 p. 39-55
17 p.
artikel
170 An automated gaging and sorting machine 1977
100-101 1 p. 20-
1 p.
artikel
171 An automated integrated circuit layout design program of a systematic chip using building blocks 1973
100-101 1 p. 21-
1 p.
artikel
172 An automated integrated circuit layout design program of a systematic chip using building blocks 1973
100-101 1 p. 22-
1 p.
artikel
173 An automated methodology for generating a fault tree 1991
100-101 1 p. 207-
1 p.
artikel
174 An effecient algorithm for computing global reliability of a network 1990
100-101 1 p. 196-
1 p.
artikel
175 An efficient algorithm for deducing the minimal cuts and reliability indices of a general network configuration 1977
100-101 1 p. 17-
1 p.
artikel
176 An efficient technique to select logic nodes for single event transient pulse-width reduction Mahatme, Nihaar N.
2013
100-101 1 p. 114-117
4 p.
artikel
177 An electrically excited acoustic emission test technique for screening multilayer ceramic capacitors 1990
100-101 1 p. 193-
1 p.
artikel
178 An evaluation method for deposited thin film interfacial interconnexions 1967
100-101 1 p. 77-
1 p.
artikel
179 An evaluation of 32 bit microprocessors for a fault-tolerant application 1987
100-101 1 p. 183-
1 p.
artikel
180 An evaluation of palladium and palladium silver alloy in a dual-in-line package switch 1983
100-101 1 p. 188-
1 p.
artikel
181 An evaluation of silicon damage resulting from ultrasonic wire bonding 1977
100-101 1 p. 15-
1 p.
artikel
182 A new algorithm for computing the reliability of complex networks by the cut method Hanzhong, Chi
1994
100-101 1 p. 175-177
3 p.
artikel
183 A new algorithm for network system reliability Chen, Hua Cheng
1985
100-101 1 p. 35-40
6 p.
artikel
184 A new approach to high temperature crystal growth from the melt 1974
100-101 1 p. 18-
1 p.
artikel
185 A new approach to memory testing 1977
100-101 1 p. 16-
1 p.
artikel
186 A new approach to the attainment of the highest possible reliability in tantalum capacitors 1966
100-101 1 p. 85-
1 p.
artikel
187 A new CMOS IC structure and its characterization Živić, Z.
1985
100-101 1 p. 123-146
24 p.
artikel
188 A new computer-aided simulation model for polycrystalline silicon film resistors 1984
100-101 1 p. 185-186
2 p.
artikel
189 A new developed transient-behaviour solution technique for reliability evaluation of electrical systems Qamber, Isa S.
1996
100-101 1 p. 71-81
11 p.
artikel
190 A new electrothermal average model of the diode–transistor switch Górecki, Krzysztof
2008
100-101 1 p. 51-58
8 p.
artikel
191 A new failure mechanism by corrosion of tungsten in a tungsten plug process Bothra, S.
1999
100-101 1 p. 59-68
10 p.
artikel
192 A new family of monolithic A/D converter circuits and their applications 1977
100-101 1 p. 22-
1 p.
artikel
193 A new generation of displacement transducers 1976
100-101 1 p. 23-
1 p.
artikel
194 A new high-performance co-firable paste system 1972
100-101 1 p. 27-
1 p.
artikel
195 A new increasing failure rate model for life time data Siddiqui, S.A.
1995
100-101 1 p. 109-111
3 p.
artikel
196 A newly developed model for stress induced slit-like voiding 1991
100-101 1 p. 200-
1 p.
artikel
197 A new mathematical approach to multi-area power system reliability evaluation Pathak, Rajesh
1995
100-101 1 p. 73-80
8 p.
artikel
198 A new method for lifetime prediction of electronic devices 1982
100-101 1 p. 139-
1 p.
artikel
199 A new method for system reliability evaluation 1975
100-101 1 p. 22-
1 p.
artikel
200 A new method to calculate the failure frequency of noncoherent systems 1991
100-101 1 p. 203-
1 p.
artikel
201 A new method to compute reliability of repairable series systems by arbitrary distributions Gurov, Sergey V.
1995
100-101 1 p. 81-85
5 p.
artikel
202 A new method to determine the failure frequency of a complex system 1975
100-101 1 p. 22-
1 p.
artikel
203 A new projection printer 1975
100-101 1 p. 25-
1 p.
artikel
204 A new self-scanned photodiode array 1972
100-101 1 p. 21-
1 p.
artikel
205 A new shrinkage estimator for the exponential scale parameter Singh, Housila P.
1996
100-101 1 p. 105-107
3 p.
artikel
206 A new SILO process for VLSI isolation using N2 + ion implantation 1990
100-101 1 p. 202-
1 p.
artikel
207 A new surface preparation and bevelling technique for spreading resistance measurements on N- and P-type silicon 1976
100-101 1 p. 24-
1 p.
artikel
208 A new technique for imaging the logic state of passivated conductors: biased resistive contrast imaging 1991
100-101 1 p. 200-
1 p.
artikel
209 An externally controllable monolithic operational amplifier 1973
100-101 1 p. 24-
1 p.
artikel
210 Angle-resolved photoelectron spectroscopy on gate insulators Hattori, T.
2007
100-101 1 p. 20-26
7 p.
artikel
211 An image system for fast positioning and accuracy inspection of ball grid array boards Lin, Chern-Sheng
2001
100-101 1 p. 119-128
10 p.
artikel
212 An improved method for a redundancy optimization problem Dakshina Murty, V.
1985
100-101 1 p. 93-95
3 p.
artikel
213 An improved microwave silicon MESFET 1972
100-101 1 p. 23-
1 p.
artikel
214 An improved minimizing algorithm for sum of disjoint products 1991
100-101 1 p. 204-
1 p.
artikel
215 An improved multilevel cell programming technique for 4-bits/cell localized trapping SONOS memory devices Xu, Yue
2013
100-101 1 p. 118-122
5 p.
artikel
216 An improved technique for etching aluminium interconnect patterns on integrated circuits Hines, R.E.
1971
100-101 1 p. 59-
1 p.
artikel
217 An inexpensive electron beam lithographic system and its application to monolithic circuit fabrication 1987
100-101 1 p. 190-
1 p.
artikel
218 An inspection policy for one-unit system subject to revealed and unrevealed failures Adachi, Kouichi
1981
100-101 1 p. 51-62
12 p.
artikel
219 An inspection policy for one-unit system subject to revealed and unrevealed failures 1982
100-101 1 p. 139-
1 p.
artikel
220 An insulated gate bipolar transistor employing the plugged n+ anode Chun, J.H
1999
100-101 1 p. 29-33
5 p.
artikel
221 An integrated A.M. radio 1969
100-101 1 p. 75-76
2 p.
artikel
222 An integrated analog switch using a bidirectional transistor 1967
100-101 1 p. 80-
1 p.
artikel
223 An integrated circuit time code generator 1969
100-101 1 p. 75-
1 p.
artikel
224 An integrated FM receiver 1982
100-101 1 p. 141-
1 p.
artikel
225 An integrated radar system. Part 1: Statistical approach to fault analysis in system design. Part 2: Practical switching arrangement for integrated marine radar system with particular reference to an installation on board SS. Canberra 1964
100-101 1 p. 69-
1 p.
artikel
226 An integro-differential equation related to Gaver's parallel system Vanderperre, E.J.
1995
100-101 1 p. 87-89
3 p.
artikel
227 An introduction to analogue techniques in MOST integrated circuits 1969
100-101 1 p. 64-
1 p.
artikel
228 An introduction to fault tree analysis with emphasis on failure rate evaluation 1976
100-101 1 p. 17-
1 p.
artikel
229 An investigation into the crystallization and electric flame-off characteristics of 20μm copper wires Hung, Fei-Yi
2011
100-101 1 p. 21-24
4 p.
artikel
230 An investigation of corrosion on integrated circuits via pressure-temperature-humidity-bias stressing 1991
100-101 1 p. 200-
1 p.
artikel
231 An investigation of inversion layer induced leakage current in abrupt p-n junctions 1971
100-101 1 p. 25-
1 p.
artikel
232 An investigation of Sn pest in pure Sn and Sn-based solders Peng, Weiqun
2009
100-101 1 p. 86-91
6 p.
artikel
233 An investigation of surface effect on glass-passivated p-n junctions 1977
100-101 1 p. 24-
1 p.
artikel
234 An ion implanted bipolar silicon integrated circuit process Sanders, I.R.
1977
100-101 1 p. 75-80
6 p.
artikel
235 An 8-level 3-bit cell programming technique in NOR-type nano-scaled SONOS memory devices Xu, Yue
2014
100-101 1 p. 331-334
4 p.
artikel
236 Annealing and thickness related performance and degradation of polymer solar cells Zhao, Zhouying
2013
100-101 1 p. 123-128
6 p.
artikel
237 Announcement 1990
100-101 1 p. 17-
1 p.
artikel
238 Announcement 1986
100-101 1 p. 199-
1 p.
artikel
239 Anodizing silicon is economical way to isolate IC elements 1976
100-101 1 p. 22-
1 p.
artikel
240 Anomalous diffusion of Al into SiC 1972
100-101 1 p. 23-
1 p.
artikel
241 Anomalous frequency dependence of conductivity of amorphous semiconductor films 1977
100-101 1 p. 25-
1 p.
artikel
242 Anomalous microstructure formed at the interface between copper ribbon and tin-deposited copper plate by ultrasonic bonding Maeda, Masakatsu
2011
100-101 1 p. 130-136
7 p.
artikel
243 Anomalous temperature dependence of resistivity in heavily doped germanium 1977
100-101 1 p. 24-
1 p.
artikel
244 A non-homogeneous Markov model for phased-mission reliability analysis 1991
100-101 1 p. 204-
1 p.
artikel
245 A nonparametric-Bayes reliability-growth model 1991
100-101 1 p. 205-
1 p.
artikel
246 An optimal maintenance policy for a 2-unit parallel system with degraded states 1975
100-101 1 p. 22-
1 p.
artikel
247 An optimising technique for a K-out-of-N system 1976
100-101 1 p. 18-
1 p.
artikel
248 A note on “A finite range distribution of failure times” Lai, C.D.
1986
100-101 1 p. 183-189
7 p.
artikel
249 A note on a multi-unit system with r repair facility Sridharan, V.
1991
100-101 1 p. 85-89
5 p.
artikel
250 A note on computing environments and network reliability Page, Lavon B.
1991
100-101 1 p. 185-186
2 p.
artikel
251 A note on constructing the confidence bounds of the failure rate for the inverse Gaussian distribution Chang, Dong Shang
1994
100-101 1 p. 187-190
4 p.
artikel
252 A note on microprocessor typology Colin, Bernard
1990
100-101 1 p. 67-87
21 p.
artikel
253 A note on the statistics of reliability assessment Lukis, L.W.F.
1974
100-101 1 p. 51-54
4 p.
artikel
254 A novel fast technique for detecting voiding damage in IC interconnects Foley, S.
2000
100-101 1 p. 87-97
11 p.
artikel
255 An overview of pattern delineation technology in the semiconductor industry 1987
100-101 1 p. 188-
1 p.
artikel
256 An overview of photomasking technology in the past decade 1972
100-101 1 p. 18-
1 p.
artikel
257 An overview of radiation effects on electronics in the space telecommunications environment Fleetwood, Daniel M.
2000
100-101 1 p. 17-26
10 p.
artikel
258 An SiO2-Ta2O5 thin film capacitor 1974
100-101 1 p. 20-
1 p.
artikel
259 An ultrasonic bond, monometallic, gold interconnection technique for integrated packages 1974
100-101 1 p. 15-
1 p.
artikel
260 A numerical analysis of avalanche breakdown in short-channel MOSFETs 1982
100-101 1 p. 131-132
2 p.
artikel
261 A Petri net approach to minimize ROM in microprogrammed digital computers 1983
100-101 1 p. 191-
1 p.
artikel
262 A photo-patternable stress relief material for plastic packaged integrated circuits 1990
100-101 1 p. 194-
1 p.
artikel
263 A physical approach on SCOBIC investigation in VLSI Beauchêne, T.
2003
100-101 1 p. 173-177
5 p.
artikel
264 A plasma oxidation process for removing photoresist films 1972
100-101 1 p. 20-
1 p.
artikel
265 4907230 Apparatus and method for testing printed circuit boards and their components Heller, Rik
1991
100-101 1 p. vii-
1 p.
artikel
266 Apparatus for controlled electron beam co-deposition of alloy films 1970
100-101 1 p. 24-
1 p.
artikel
267 4677375 Apparatus for testing integrated circuit Nakaie, Toshiyuki
1988
100-101 1 p. 164-165
2 p.
artikel
268 4523145 Apparatus for the automated handling and testing of electronic modules Gray, GeorgeG
1986
100-101 1 p. 202-203
2 p.
artikel
269 4454413 Apparatus for tracking integrated circuit devices Morton, WilliamD
1985
100-101 1 p. 203-
1 p.
artikel
270 Application of a software reliability model to decide software release time Shanthikumar, J.G.
1983
100-101 1 p. 41-59
19 p.
artikel
271 Application of a two-layer planarization process to VLSI intermetal dielectric and trench isolation processes 1990
100-101 1 p. 197-
1 p.
artikel
272 Application of automatic alignment to MOS processing in projection printing 1984
100-101 1 p. 179-180
2 p.
artikel
273 Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules Musallam, Mahera
2014
100-101 1 p. 172-181
10 p.
artikel
274 Application of forward gated-diode R–G current method in extracting F–N stress-induced interface traps in SOI NMOSFETs He, Jin
2002
100-101 1 p. 145-148
4 p.
artikel
275 Application of laser systems to microelectronics and silicon wafer dicing 1971
100-101 1 p. 27-
1 p.
artikel
276 Application of MIL-STD-781B to redundant systems 1972
100-101 1 p. 16-
1 p.
artikel
277 Application of MOS in consumer and industrial equipment 1973
100-101 1 p. 23-
1 p.
artikel
278 Application of non-destructive testing to inspection of soldered joints 1990
100-101 1 p. 192-
1 p.
artikel
279 Application of optoelectronics to semiconductor microcircuits 1967
100-101 1 p. 72-
1 p.
artikel
280 Application of scanning electron microscopy to integrated circuit failure 1971
100-101 1 p. 17-
1 p.
artikel
281 Application of signature analysis technique for microprocessor based systems 1987
100-101 1 p. 185-
1 p.
artikel
282 Application of stochastic analysis technique in various disciplines Rana, Virendra Singh
1994
100-101 1 p. 61-74
14 p.
artikel
283 Application of the Eyring Model to capacitor aging data 1966
100-101 1 p. 85-86
2 p.
artikel
284 Application of the optimal control model for the human operator to reliability assessment 1974
100-101 1 p. 11-
1 p.
artikel
285 Application of the polysilicon edge sealed LOCOS process in scaled VLSI circuit fabrication 1990
100-101 1 p. 198-
1 p.
artikel
286 Application of the scanning electron microscope to semiconductor device structures Thornhill, J.W.
1965
100-101 1 p. 97-98
2 p.
artikel
287 Application of the scanning electron microscope to semiconductors 1970
100-101 1 p. 21-
1 p.
artikel
288 Application of the sequential t-test to maintainability demonstration 1976
100-101 1 p. 19-
1 p.
artikel
289 Application of the surrogate constraints algorithm to optimal reliability design of systems Hikita, Mitsunori
1986
100-101 1 p. 35-38
4 p.
artikel
290 Applications of focused ion beams to microlithography 1984
100-101 1 p. 188-
1 p.
artikel
291 Applications of high-speed data acquisition for semiconductor device yield analysis, Part I 1983
100-101 1 p. 188-
1 p.
artikel
292 Applications of inorganic and organic thick films in electronic equipment 1967
100-101 1 p. 76-77
2 p.
artikel
293 Applications of profile simulation for thin film deposition and etching processes 1983
100-101 1 p. 197-
1 p.
artikel
294 Applications of temperature phase measurements to IC testing Altet, J.
2004
100-101 1 p. 95-103
9 p.
artikel
295 Application specific LSIs for specialized and short-life products enjoy an expanding market 1990
100-101 1 p. 196-
1 p.
artikel
296 Applying fasteners effectively 1967
100-101 1 p. 69-
1 p.
artikel
297 Applying just-in-time in a wafer fab: a case study 1990
100-101 1 p. 199-
1 p.
artikel
298 Approaches to software reliability prediction 1983
100-101 1 p. 189-
1 p.
artikel
299 Approximate confidence intervals for reliability of a series system 1977
100-101 1 p. 16-
1 p.
artikel
300 Approximate solutions for a coupled pair of microstrip lines in microwave integrated circuits 1970
100-101 1 p. 20-21
2 p.
artikel
301 Approximate steady-state solutions for Markov systems based upon the transition-rate matrix deviation concept Nahman, J.M.
1994
100-101 1 p. 7-15
9 p.
artikel
302 Approximate system availability models 1970
100-101 1 p. 16-
1 p.
artikel
303 A practical approach to the testing of a high-volume custom linear IC 1984
100-101 1 p. 182-
1 p.
artikel
304 A practical method of optimizing system life cycle costs vs availability Werden, Robert B.
1978
100-101 1 p. 1-7
7 p.
artikel
305 A precision measurement of film thicknesses 1969
100-101 1 p. 70-
1 p.
artikel
306 A prediction of the photoresist influence on integrated circuit yield 1967
100-101 1 p. 73-
1 p.
artikel
307 A priority multi-component system with spares Kalpakam, S.
1987
100-101 1 p. 79-85
7 p.
artikel
308 A probabilistic cost-based method for evaluation of operational improvements of nuclear reactors 1987
100-101 1 p. 183-184
2 p.
artikel
309 A procedure for assessing the reliability of short circuited concentration photovoltaic systems in outdoor degradation conditions Fucci, Raffaele
2014
100-101 1 p. 182-187
6 p.
artikel
310 A procedure for solving general integer programming problems Misra, Kavita
1994
100-101 1 p. 157-163
7 p.
artikel
311 A property of counting process in multivariate renewal theory Chandrasekar, B.
1996
100-101 1 p. 111-113
3 p.
artikel
312 A punched-tape comparator using integrated circuits Forte, P.D.
1964
100-101 1 p. 45-48
4 p.
artikel
313 A quasi-Bayes estimate of the failure intensity of a reliability-growth model 1983
100-101 1 p. 189-
1 p.
artikel
314 A quasilossless time-variable synthesis suitable for integrated circuits Newcomb, R.W
1968
100-101 1 p. 45-52
8 p.
artikel
315 A radio frequency dielectric sputtering system with non-grounded electrodes 1969
100-101 1 p. 73-74
2 p.
artikel
316 A rational approach to stress screening vibration 1982
100-101 1 p. 137-138
2 p.
artikel
317 Are electromigration failures lognormally distributed? 1991
100-101 1 p. 202-
1 p.
artikel
318 A reliability evaluation of plastic packaged semiconductor components 1976
100-101 1 p. 14-
1 p.
artikel
319 A reliability model for SAC solder covering isothermal mechanical cycling and thermal cycling conditions Herkommer, Dominik
2010
100-101 1 p. 116-126
11 p.
artikel
320 A reliability model for stress vs strength problem 1974
100-101 1 p. 9-
1 p.
artikel
321 A reliability of different metal contacts with amorphous carbon Paul, S
2002
100-101 1 p. 141-143
3 p.
artikel
322 A reliability physics model for dissimilar two-unit standby system with single repair facility Gopalan, M.N.
1985
100-101 1 p. 17-23
7 p.
artikel
323 A reliability warranty concept for the FMS environment 1983
100-101 1 p. 192-
1 p.
artikel
324 A repairable multistate device with arbitrarily distributed repair times 1982
100-101 1 p. 138-
1 p.
artikel
325 A repairable system with N failure modes and K standby units Yamashiro, Mitsuo
1982
100-101 1 p. 53-57
5 p.
artikel
326 A repairable system with N failure modes and one standby unit 1982
100-101 1 p. 137-
1 p.
artikel
327 A repairable system with partial and catastrophic failure modes 1982
100-101 1 p. 138-
1 p.
artikel
328 A repairable system with partial and catastrophic failure modes Yamashiro, Mitsuo
1981
100-101 1 p. 97-101
5 p.
artikel
329 A resistometric method to characterize electromigration at the wafer level Scorzoni, A.
1990
100-101 1 p. 123-132
10 p.
artikel
330 A review of British work on microminiaturization techniques Dummer, G.W.A
1962
100-101 1 p. 39-40
2 p.
artikel
331 A review of CCD imaging technology 1977
100-101 1 p. 18-
1 p.
artikel
332 A review of electrostatic discharge (ESD) in advanced semiconductor technology Voldman, Steven H.
2004
100-101 1 p. 33-46
14 p.
artikel
333 A review of fine-line lithographic techniques: present and future 1982
100-101 1 p. 140-
1 p.
artikel
334 A review of new methods and attitudes in reliability engineering 1973
100-101 1 p. 16-
1 p.
artikel
335 A review of new methods and attitudes in reliability engineering 1974
100-101 1 p. 9-10
2 p.
artikel
336 A review of RAM testing methodologies 1984
100-101 1 p. 182-
1 p.
artikel
337 A review of some recent vacuum studies 1971
100-101 1 p. 27-
1 p.
artikel
338 A review of the electronic reliability design handbook 1983
100-101 1 p. 187-
1 p.
artikel
339 A review of the fundamentals of vacuum metallurgy 1972
100-101 1 p. 26-
1 p.
artikel
340 A review of the technological and electromagnetic limitations of hybrid circuits for microwave applications 1973
100-101 1 p. 28-
1 p.
artikel
341 A review of the use of electro-thermal simulations for the analysis of heterostructure FETs Sozzi, Giovanna
2007
100-101 1 p. 65-73
9 p.
artikel
342 A review of ULSI failure analysis techniques for DRAMs. Part II: Defect isolation and visualization Ruprecht, Michael
2003
100-101 1 p. 17-41
25 p.
artikel
343 A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products Shnawah, Dhafer Abdulameer
2012
100-101 1 p. 90-99
10 p.
artikel
344 Argon-boron double implantation in silicon 1990
100-101 1 p. 201-
1 p.
artikel
345 As2-ambient activation and alloyed-ohmic-contact studies of Si+-ion-implanted Al0.3Ga0.7 As/GaAs modulation-doped structures 1987
100-101 1 p. 191-
1 p.
artikel
346 A scale model of general repair Finkelstein, M.S.
1993
100-101 1 p. 41-44
4 p.
artikel
347 ASEE concentrates on manufacturing science for VLSI 1987
100-101 1 p. 186-
1 p.
artikel
348 Ashing process for dry photolithography Singh, Awatar
1984
100-101 1 p. 165-
1 p.
artikel
349 A simple apparatus for d.c. bias sputtering 1971
100-101 1 p. 27-
1 p.
artikel
350 A simple approximation for IFR weibull renewal functions Spearman, Mark L.
1989
100-101 1 p. 73-80
8 p.
artikel
351 A simple approximation to the renewal function 1991
100-101 1 p. 205-
1 p.
artikel
352 A simple estimation of transverse response of high-g accelerometers by a free-drop-bar method Bao, Haifei
2009
100-101 1 p. 66-73
8 p.
artikel
353 A simple fault-diagnosis system with periodic testing 1991
100-101 1 p. 205-
1 p.
artikel
354 A simple method for determining the impurity distribution near a p-n junction 1966
100-101 1 p. 88-
1 p.
artikel
355 A simple method for evaluating the transient thermal response of semiconductor devices Shammas, N.Y.A
2002
100-101 1 p. 109-117
9 p.
artikel
356 A simple method for modeling VLSI yields 1983
100-101 1 p. 195-
1 p.
artikel
357 A simple model for the thermo-mechaincal deformations of plated-through-holes in multilayer printed wiring boards 1977
100-101 1 p. 15-
1 p.
artikel
358 A simplified approach to hybrid thermal design 1974
100-101 1 p. 19-
1 p.
artikel
359 A single-chip digital signal processor for telecommunication applications 1983
100-101 1 p. 195-
1 p.
artikel
360 A software evaluation: results and recommendations 1984
100-101 1 p. 172-
1 p.
artikel
361 Aspects for the design of integrated MIS circuits 1976
100-101 1 p. 22-
1 p.
artikel
362 Aspects of accelerated ageing tests used on connectors and terminals for the U.K. external telephone network 1984
100-101 1 p. 171-
1 p.
artikel
363 Aspects of multi-layered thick-film hybrids 1972
100-101 1 p. 26-
1 p.
artikel
364 A square ring on square ring (SoS) ceramic strength testing technique for VLSI packaging Villani, Angelo
2000
100-101 1 p. 131-144
14 p.
artikel
365 Assembly catching up with productivity needs 1987
100-101 1 p. 187-
1 p.
artikel
366 Assessing component life from field service tests 1971
100-101 1 p. 18-
1 p.
artikel
367 Assessment of micropackaged integrated circuits in high reliability applications 1984
100-101 1 p. 170-
1 p.
artikel
368 Associative memory chips: fast, versatile—and here 1971
100-101 1 p. 22-
1 p.
artikel
369 Assured reliability in soldered connections 1964
100-101 1 p. 67-
1 p.
artikel
370 Assuring VLSI quality and reliability with test patterns 1984
100-101 1 p. 170-171
2 p.
artikel
371 A step forward in the transient thermal characterization of chips and packages Szkely, V.
1999
100-101 1 p. 89-96
8 p.
artikel
372 A strategy for damage assessment of thermally stressed copper vias in microelectronic printed circuit boards Weinberg, K.
2008
100-101 1 p. 68-82
15 p.
artikel
373 A study in flip-chip UBM/bump reliability with effects of SnPb solder composition Wu, J.D.
2006
100-101 1 p. 41-52
12 p.
artikel
374 A study of a time dependent queueing system with two parallel channels (Miss) Sharda,
1988
100-101 1 p. 7-9
3 p.
artikel
375 A study of electromigration in aluminum and aluminum-silicon thin film resistors using noise technique 1990
100-101 1 p. 200-
1 p.
artikel
376 A study of evaporated nickel chromium films as potentiometer tracks McIntyre, D.A.
1966
100-101 1 p. 7-8
2 p.
artikel
377 A study of metal-insulator transitions 1974
100-101 1 p. 16-
1 p.
artikel
378 A study of nanoparticles in Sn–Ag based lead free solders Amagai, Masazumi
2008
100-101 1 p. 1-16
16 p.
artikel
379 A study of new shallow diffusion techniques in silicon for microwave structures 1972
100-101 1 p. 19-
1 p.
artikel
380 A study of some factors influencing the wear resistance of lubricated gold contacts 1984
100-101 1 p. 170-
1 p.
artikel
381 A study of surface charge induced inversion failure of junction isolated monolithic silicon integrated circuits 1977
100-101 1 p. 13-
1 p.
artikel
382 A study of the contacts of a diffused resistor 1972
100-101 1 p. 21-
1 p.
artikel
383 A study of the dielectric breakdown of thermally grown SiO2 by the self-quenching technique 1976
100-101 1 p. 25-
1 p.
artikel
384 A study of the effects of tunneling currents and reliability of sub-2 nm gate oxides on scaled n-MOSFETs Yang, Nian
2001
100-101 1 p. 37-46
10 p.
artikel
385 A study of the influence of inter-metal dielectrics on electromigration performance Foley, Sean
1998
100-101 1 p. 107-113
7 p.
artikel
386 A study of the interface-trap activation kinetics in the Negative Bias Temperature Instability Alagi, Filippo
2014
100-101 1 p. 22-29
8 p.
artikel
387 A study of thermal transpiration using ultrahigh-vacuum techniques 1966
100-101 1 p. 93-94
2 p.
artikel
388 A study on the leakage current of poly-Si TFTs fabricated by metal induced lateral crystallization Ihn, Tae-Hyung
1999
100-101 1 p. 53-58
6 p.
artikel
389 A study on the performance and reliability of magnetostatic actuated RF MEMS switches Lin, Ta-Hsuan
2009
100-101 1 p. 59-65
7 p.
artikel
390 A study on the tensile fracture mechanism of 15μm copper wire after EFO process Huang, I-Ting
2011
100-101 1 p. 25-29
5 p.
artikel
391 A survey of chip joining techniques 1970
100-101 1 p. 18-
1 p.
artikel
392 A survey of 1982 testing trends 1983
100-101 1 p. 192-
1 p.
artikel
393 A suspended boat loader based on the cantilever principle 1984
100-101 1 p. 179-
1 p.
artikel
394 A switching-algebraic analysis of consecutive-k-out-of-n:F systems Rushdi, Ali M.
1987
100-101 1 p. 171-174
4 p.
artikel
395 Asymptotic distribution of Bayes estimators in censored type-1 samples from a mixed exponential population 1987
100-101 1 p. 185-
1 p.
artikel
396 A system reliability and maintainability simulation exercise Rehg, Virgil R.
1978
100-101 1 p. 31-34
4 p.
artikel
397 A systems approach to 1-μm NMOS 1984
100-101 1 p. 180-
1 p.
artikel
398 A technique for measuring the impurity concentration of silicon-on-sapphire films using C-V plots 1977
100-101 1 p. 25-26
2 p.
artikel
399 A test approach for commercial communication satellites Beisel, F.
1977
100-101 1 p. 91-97
7 p.
artikel
400 A test for lateral nonuniformities in mos devices using only capacitanse curves 1974
100-101 1 p. 17-
1 p.
artikel
401 A test of the equality of survival distributions based on paired observations from conditionally independent exponential distributions 1987
100-101 1 p. 183-
1 p.
artikel
402 A thick-film resistor glaze of precision properties 1970
100-101 1 p. 23-
1 p.
artikel
403 A thin-film high sheet resistivity material 1974
100-101 1 p. 18-
1 p.
artikel
404 A thin-film multilayering technique for hybrid microcircuits 1975
100-101 1 p. 33-
1 p.
artikel
405 A thin-film resistance element, tailored by thermal oxidation 1970
100-101 1 p. 23-
1 p.
artikel
406 A thorough investigation of MOSFETs NBTI degradation Huard, V.
2005
100-101 1 p. 83-98
16 p.
artikel
407 A threshold voltage model for short-channel MOSFETs taking into account the varying depth of channel depletion layers around the source and drain Baishya, Srimanta
2008
100-101 1 p. 17-22
6 p.
artikel
408 A thyristor protected against di/dt-failure at breakover turnon 1975
100-101 1 p. 20-
1 p.
artikel
409 A time-dependent availability measure for a reparable system subject to catastrophic failures 1991
100-101 1 p. 206-
1 p.
artikel
410 A transformerless modulator suitable for integrated circuits Bozic, S.M.
1969
100-101 1 p. 9-12
4 p.
artikel
411 A two-dimensional mathematical analysis of the diffused semiconductor resistor 1969
100-101 1 p. 67-
1 p.
artikel
412 A two duplex unit standby system with two types of repair Singh, H.R.
1988
100-101 1 p. 11-14
4 p.
artikel
413 A two-level sparing approach for plug-in modules 1984
100-101 1 p. 170-
1 p.
artikel
414 A two-unit parallel redundant system with three modes and bivariate exponential lifetimes Goel, L.R.
1984
100-101 1 p. 25-28
4 p.
artikel
415 Author index 1981
100-101 1 p. vi-
1 p.
artikel
416 Author index 1982
100-101 1 p. viii-
1 p.
artikel
417 4902969 Automated burn-in system Gussman, RobertL
1991
100-101 1 p. v-
1 p.
artikel
418 8602166 Automated circuit tester Littlebury, Hugh
1987
100-101 1 p. 197-
1 p.
artikel
419 Automated epitaxy improves microcircuit uniformity 1966
100-101 1 p. 90-
1 p.
artikel
420 Automated metal etch system for IC-manufacture 1976
100-101 1 p. 21-
1 p.
artikel
421 Automated thermal reliability analysis of hybrids 1984
100-101 1 p. 185-
1 p.
artikel
422 Automatic drawing of integrated circuit masks. A new layout algorithm 1975
100-101 1 p. 25-
1 p.
artikel
423 Automatic fault diagnosis on analogue boards 1977
100-101 1 p. 17-
1 p.
artikel
424 Automatic out-of-contact mask alignment 1976
100-101 1 p. 21-
1 p.
artikel
425 Automatic plasma machines for stripping photoresist 1971
100-101 1 p. 20-
1 p.
artikel
426 Availability analysis of a two-unit (dissimilar) parallel system with inspection and bivariate exponential life times Goel, L.R.
1985
100-101 1 p. 77-80
4 p.
artikel
427 Availability and frequency measures of a non-identical two component system in the presence of common cause shock failures Verma, S.Madhusudana
1994
100-101 1 p. 147-151
5 p.
artikel
428 Availability and MTTF analysis of a three-state parallel redundant multi-component system under critical human failures Gupta, P.P.
1986
100-101 1 p. 63-68
6 p.
artikel
429 Availability and MTTF analysis of a three state repairable redundant electronic equipment under critical human errors Gupta, P.P.
1986
100-101 1 p. 57-62
6 p.
artikel
430 Availability considerations for satellite links 1984
100-101 1 p. 173-174
2 p.
artikel
431 Availability of a two-unit standby system with switchover time and proper initialization of connect switching Kumar, Ashok
1981
100-101 1 p. 113-115
3 p.
artikel
432 Availability of a two-unit standby system with switchover time and proper initialization of connect switching 1982
100-101 1 p. 138-
1 p.
artikel
433 Availability of the system with general repair time distributions and shut-off rules Chen, Yow-Mow
1993
100-101 1 p. 13-19
7 p.
artikel
434 Avalanche breakdown in complementary diodes 1977
100-101 1 p. 13-
1 p.
artikel
435 Average conductivity of complementary-error and Gaussian doped layers in Gallium arsenide 1982
100-101 1 p. 141-
1 p.
artikel
436 A versatile boron diffusion process 1977
100-101 1 p. 20-21
2 p.
artikel
437 A versatile digital frequency synthesizer for use in mobile radio communication sets 1967
100-101 1 p. 79-
1 p.
artikel
438 Avionics Testing 1976
100-101 1 p. 18-
1 p.
artikel
439 A VME bus compatible ADC interface chip Shekhar, Chandra
1987
100-101 1 p. 61-63
3 p.
artikel
440 Avoidance of stiction in the release of highly boron doped micro-actuators fabricated using BESOI substrates Rosa, M.A
1999
100-101 1 p. 139-142
4 p.
artikel
441 Avoiding IC system design pitfalls 1969
100-101 1 p. 64-65
2 p.
artikel
442 A voltage calibration technique of electro-optic probing for characterization internal to IC’s chip Liu, Hongfei
2007
100-101 1 p. 82-87
6 p.
artikel
443 A wavelet analysis of 1/f and white noise in microwave transistors Ferrante, Gaetano
2001
100-101 1 p. 99-104
6 p.
artikel
444 Back-contact resistor network pares wire count in ECL hybrids 1983
100-101 1 p. 196-
1 p.
artikel
445 Back-up support plates for silicon wafers 1966
100-101 1 p. 90-
1 p.
artikel
446 Ball formation processes in aluminum bonding wire 1987
100-101 1 p. 187-
1 p.
artikel
447 Ball grid array reliability assessment for aerospace applications Ghaffarian, R
1999
100-101 1 p. 107-112
6 p.
artikel
448 Barriers to total quality management in the Department of Defense 1991
100-101 1 p. 199-
1 p.
artikel
449 Basic chemistry and mechanisms of plasma etching 1984
100-101 1 p. 178-
1 p.
artikel
450 Batch bonded crossovers for thin film circuits 1977
100-101 1 p. 28-
1 p.
artikel
451 Bayes comparison of 2 lognormal reliability functions 1991
100-101 1 p. 202-
1 p.
artikel
452 Bayes' equation, reliability, and multiple hypothesis testing 1973
100-101 1 p. 16-
1 p.
artikel
453 Bayes estimates of pointwise and interval availability with type I censored samples Krishna, H.
1995
100-101 1 p. 33-36
4 p.
artikel
454 Bayes estimators of exponential parameters utilizing a guessed guarantee with specified confidence Singh, Umesh
1994
100-101 1 p. 141-145
5 p.
artikel
455 Bayesian approach to prediction with outliers from the Burr type X model Jaheen, Zeinhum F.
1995
100-101 1 p. 45-47
3 p.
artikel
456 Bayesian confidence limits for the availability of systems 1976
100-101 1 p. 17-
1 p.
artikel
457 Bayesian confidence limits for the reliability of mixed cascade and parallel independent exponential subsystems 1975
100-101 1 p. 22-23
2 p.
artikel
458 Bayesian estimation of reliability function and hazard rate Siddiqui, S.A.
1991
100-101 1 p. 53-57
5 p.
artikel
459 Bayes shrinkage estimators of Weibull parameters 1987
100-101 1 p. 182-
1 p.
artikel
460 Beam-leads, versatile chips with a built-in interconnection system 1972
100-101 1 p. 19-
1 p.
artikel
461 Beam-lead technology 1967
100-101 1 p. 72-
1 p.
artikel
462 Behavioural analysis of a paper production system with different repair policies Kumar, Dinesh
1991
100-101 1 p. 47-51
5 p.
artikel
463 Benefit analysis of concurrent redundancy techniques 1982
100-101 1 p. 136-
1 p.
artikel
464 Beryllium—a high reliability metallization 1977
100-101 1 p. 14-
1 p.
artikel
465 Bias-dependent small-signal parameters of Schottky contact microstrip lines 1975
100-101 1 p. 26-
1 p.
artikel
466 Bias-humidity performance of encapsulated and unencapsulated Ti-Pd-Au thin-film conductors in an environment contaminated with Cl2 1977
100-101 1 p. 26-27
2 p.
artikel
467 Bias-stress-induced increase in parasitic resistance of InP-based InAlAs/InGaAs HEMTs Suemitsu, Tetsuya
2002
100-101 1 p. 47-52
6 p.
artikel
468 Bibliography for reliability and availability of stochastic systems 1977
100-101 1 p. 13-
1 p.
artikel
469 Bibliography of literature on computer hardware reliability Dhillon, Balbir S
1986
100-101 1 p. 131-153
23 p.
artikel
470 Bibliography of literature on reliability in civil engineering Dhillon, Balbir S.
1986
100-101 1 p. 99-121
23 p.
artikel
471 BIGFET makes IGFET more versatile 1973
100-101 1 p. 22-
1 p.
artikel
472 Biographies 1978
100-101 1 p. 223-234
12 p.
artikel
473 Bipolar circuit design for a 5000-circuit VLSI gate array 1982
100-101 1 p. 140-
1 p.
artikel
474 Bipolar LSI: 10,000 gates in sight 1976
100-101 1 p. 23-
1 p.
artikel
475 Bipolar LSI takes a new direction with integrated injection logic 1975
100-101 1 p. 26-
1 p.
artikel
476 Birth-death and bug counting 1984
100-101 1 p. 176-
1 p.
artikel
477 Bistable noise in p-n junctions 1972
100-101 1 p. 23-
1 p.
artikel
478 BIT analysis and design reliability 1984
100-101 1 p. 172-
1 p.
artikel
479 32-bit processor chip integrates major system functions 1984
100-101 1 p. 181-
1 p.
artikel
480 Bold Koreans push into leading-edge ICs 1984
100-101 1 p. 177-
1 p.
artikel
481 Bonded crossovers for thin film circuits 1973
100-101 1 p. 27-
1 p.
artikel
482 Bond reliability under humid environment for coated copper wire and bare copper wire Uno, Tomohiro
2011
100-101 1 p. 148-156
9 p.
artikel
483 Book review 1999
100-101 1 p. 147-
1 p.
artikel
484 Book review 1999
100-101 1 p. 149-
1 p.
artikel
485 Book review 1999
100-101 1 p. 145-
1 p.
artikel
486 Boost reliability in your op-amp circuit. Build in redundancy and get automatic compensation for internal failures 1969
100-101 1 p. 63-
1 p.
artikel
487 Boron and phosphorous diffusion through an SiO2 layer from a doped polycrystalline Si source under various drive-in ambients 1976
100-101 1 p. 23-
1 p.
artikel
488 Borophosphosilicate glass for VLSI device fabrication 1987
100-101 1 p. 187-
1 p.
artikel
489 Brazing to low-temperature-fired thick films 1991
100-101 1 p. 210-
1 p.
artikel
490 Bridging the analog and digital worlds with linear ICs 1973
100-101 1 p. 21-
1 p.
artikel
491 Britain takes the lead on hybrid components 1982
100-101 1 p. 142-
1 p.
artikel
492 Bubble domain memories. Present achievements and future applications 1977
100-101 1 p. 18-
1 p.
artikel
493 Bubbles rise from the lab 1977
100-101 1 p. 18-
1 p.
artikel
494 Build a linear-IC phase-locked loop 1969
100-101 1 p. 76-
1 p.
artikel
495 Building circuits that test themselves 1990
100-101 1 p. 195-
1 p.
artikel
496 Building C-MOS, bipolar circuits on monolithic chip enhances IC specs 1975
100-101 1 p. 26-
1 p.
artikel
497 Bulk and interface imperfections in semiconductors 1977
100-101 1 p. 14-
1 p.
artikel
498 Bulk leakage in avalanche diodes due to siliconmetallization reactions 1976
100-101 1 p. 24-
1 p.
artikel
499 Buried wire multilayer ceramics 1972
100-101 1 p. 18-
1 p.
artikel
500 CAD system coordinates complete semicustom chip design 1984
100-101 1 p. 179-
1 p.
artikel
501 CAD systems: meeting the challenge of VLSI design 1984
100-101 1 p. 178-
1 p.
artikel
502 CAD tools for custom IC layout 1987
100-101 1 p. 188-
1 p.
artikel
503 Calculation of diagnostic tests for digital circuits 1976
100-101 1 p. 16-
1 p.
artikel
504 Calculation of distribution coefficients of donors in III–V Semiconductors 1975
100-101 1 p. 28-
1 p.
artikel
505 Calculation of the electric field enhancement for a degenerate diffusion process 1983
100-101 1 p. 195-
1 p.
artikel
506 Calculation of the Required Number of Spare Parts Tomášek, K.F.
1970
100-101 1 p. 77-78
2 p.
artikel
507 Calculation of the turn-on behaviour of MOST 1975
100-101 1 p. 29-30
2 p.
artikel
508 Calendar 2002
100-101 1 p. I-VII
nvt p.
artikel
509 Calendar 2009
100-101 1 p. I-
1 p.
artikel
510 Calendar 2010
100-101 1 p. I-II
nvt p.
artikel
511 Calendar for forthcoming events 2003
100-101 1 p. I-VI
nvt p.
artikel
512 Calendar of international conferences, symposia, lectures and meetings of interest 1995
100-101 1 p. 153-157
5 p.
artikel
513 Calendar of international conferences, symposia, lectures and meetings of interest 1991
100-101 1 p. 193-195
3 p.
artikel
514 Calendar of international conferences, symposia, lectures and meetings of interest 1993
100-101 1 p. 113-114
2 p.
artikel
515 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1986
100-101 1 p. 1-3
3 p.
artikel
516 Calendar of international conferences, symposia, lectures and meetings of interest 1990
100-101 1 p. 1-4
4 p.
artikel
517 Calendar of international conferences, symposia, lectures and meetings of interest 1981
100-101 1 p. 1-3
3 p.
artikel
518 Calendar of international conferences, symposia, lectures and meetings of interest 1985
100-101 1 p. 1-4
4 p.
artikel
519 Calendar of international conferences, symposia, lectures and meetings of interest 1984
100-101 1 p. 1-3
3 p.
artikel
520 Calendar of international conferences, symposia, lectures and meetings of interest 1973
100-101 1 p. 1-2
2 p.
artikel
521 Calendar of international conferences, symposia, lectures and meetings of interest 1977
100-101 1 p. 3-5
3 p.
artikel
522 Calendar of international conferences, symposia, lectures and meetings of interest 1975
100-101 1 p. 3-4
2 p.
artikel
523 Calendar of international conferences, symposia, lectures and meetings of interest 1974
100-101 1 p. 1-2
2 p.
artikel
524 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1970
100-101 1 p. 7-9
3 p.
artikel
525 Calendar of international conferences, symposia, lectures and meetings of interest 1972
100-101 1 p. 3-4
2 p.
artikel
526 Calendar of International Conferences, Symposia, Lectures and Meetings of Interest 1976
100-101 1 p. 1-2
2 p.
artikel
527 Calendar of international conferences, symposia, lectures and meetings of interest 1971
100-101 1 p. 5-7
3 p.
artikel
528 Call for papers 1971
100-101 1 p. 9-
1 p.
artikel
529 Call for papers press release 1977
100-101 1 p. 7-9
3 p.
artikel
530 Call for Papers: Reliability Issues in Power Electronics 2015
100-101 1 p. 292-
1 p.
artikel
531 Calls for papers 1972
100-101 1 p. 7-
1 p.
artikel
532 1975 Canadian SRE reliability symposium 1975
100-101 1 p. 12-
1 p.
artikel
533 Can electron beam mask making keep pace with advancing technology? 1984
100-101 1 p. 188-
1 p.
artikel
534 Capability studies—Comparative methods 1975
100-101 1 p. 23-
1 p.
artikel
535 Capacitors Girling, D.S.
1967
100-101 1 p. 35-51
17 p.
artikel
536 Carbon and composite carbon-metal films deposited in an rf glow discharge operated in organic gases 1987
100-101 1 p. 189-
1 p.
artikel
537 Carrier concentration and minority carrier lifetime measurement in semiconductor epitaxial by the MOS capacitance method 1967
100-101 1 p. 74-
1 p.
artikel
538 4444309 Carrier for a leadless integrated circuit chip Morton, WilliamD
1985
100-101 1 p. 201-
1 p.
artikel
539 Carrier mobility in laser-annealed silicon-on-sapphire films 1982
100-101 1 p. 143-
1 p.
artikel
540 Carrier recombination and lifetime in highly doped silicon 1984
100-101 1 p. 183-
1 p.
artikel
541 Carrier transport across metal-semiconductor barriers 1971
100-101 1 p. 23-
1 p.
artikel
542 Cathode/heater-insulation failure in oxide-cathode valves 1966
100-101 1 p. 85-
1 p.
artikel
543 Causal approach to reliability 1970
100-101 1 p. 13-
1 p.
artikel
544 Centrifugal on-center, flood-spray developing of positive photoresist 1984
100-101 1 p. 179-
1 p.
artikel
545 Ceramic Substrate Strength Testing 1975
100-101 1 p. 25-26
2 p.
artikel
546 Change in d.c. and 1/f noise characteristics of n-submicron MOSFETs due to hot-carrier degradation Vandamme, L.K.J.
1998
100-101 1 p. 29-35
7 p.
artikel
547 Change your surfactant formula and use etch baths for a week 1990
100-101 1 p. 197-
1 p.
artikel
548 Characteristic electron energy losses in germanium 1976
100-101 1 p. 23-24
2 p.
artikel
549 Characteristic of copper wire and transient analysis on wirebonding process Hsu, Hsiang-Chen
2011
100-101 1 p. 179-186
8 p.
artikel
550 Characteristics and origin of emitter-collector shorts, or “Pipes”, in Multi-emitter power transistors 1974
100-101 1 p. 10-
1 p.
artikel
551 Characteristics of metal/tunnel-oxide/n/p+ silicon switching devices—II. Two-dimensional effects in oxide-isolated structures 1983
100-101 1 p. 195-
1 p.
artikel
552 Characteristics of multi-layered metallizations consisting of tantalum and aluminium on silicon and/or SiO2 1975
100-101 1 p. 25-
1 p.
artikel
553 Characteristics of non-vacuum deposited metal films for electronic circuitry 1967
100-101 1 p. 76-
1 p.
artikel
554 Characteristics of P-channel MOS field effect transistors with ion-implanted channels 1973
100-101 1 p. 30-
1 p.
artikel
555 Characterization and modeling of flicker noise in junction field-effect transistor with source and drain trench isolation Fu, Y.
2007
100-101 1 p. 46-50
5 p.
artikel
556 Characterization of a Chromium-gold deposition process for the production of thin film hybrid microcircuits 1975
100-101 1 p. 31-
1 p.
artikel
557 Characterization of interface defects related to negative-bias temperature instability in ultrathin plasma-nitrided SiON/Si〈100〉 systems Fujieda, Shinji
2005
100-101 1 p. 57-64
8 p.
artikel
558 Characterization of plasma etching for semiconductor applications 1977
100-101 1 p. 20-
1 p.
artikel
559 Characterization of SiO using fine features of X-ray K emission spectra 1972
100-101 1 p. 22-
1 p.
artikel
560 Characterization of solder interfaces using laser flash metrology Chiu, Chia-Pin
2002
100-101 1 p. 93-100
8 p.
artikel
561 Characterizing, modeling, and analyzing soft error propagation in asynchronous and synchronous digital circuits Bany Hamad, Ghaith
2015
100-101 1 p. 238-250
13 p.
artikel
562 Charge-coupled devices—a new approach to MIS device structures 1972
100-101 1 p. 18-19
2 p.
artikel
563 Charge induced instability in 709 operational amplifiers 1973
100-101 1 p. 21-
1 p.
artikel
564 Charge loss in metal-nitride-oxide-semiconductor (MNOS) devices at high temperatures 1984
100-101 1 p. 182-
1 p.
artikel
565 Charge transfer in charge-coupled devices in the presence of interface states 1977
100-101 1 p. 25-
1 p.
artikel
566 Checking request policies for a one-unit system and their comparisons 1982
100-101 1 p. 136-
1 p.
artikel
567 Chemical impurities and structural imperfections in semiconductor silicon. Part II 1984
100-101 1 p. 182-183
2 p.
artikel
568 Chemical vapor deposition of titanium dioxide film in microelectronics 1975
100-101 1 p. 32-
1 p.
artikel
569 Chemical vapour deposition of metal silicides from organometallic compounds with silicon-metal bonds 1987
100-101 1 p. 188-
1 p.
artikel
570 Chip architecture: a revolution brewing 1984
100-101 1 p. 178-
1 p.
artikel
571 Chip on paper technology utilizing anisotropically conductive adhesive for smart label applications Rasul, Jad S.
2004
100-101 1 p. 135-140
6 p.
artikel
572 Choosing contact materials 1969
100-101 1 p. 61-62
2 p.
artikel
573 Chopper-stabilized op amp combines MOS and bipolar elements on one chip 1974
100-101 1 p. 15-
1 p.
artikel
574 Circuit design and parameters in thin-film technology Jenny, F.F.
1963
100-101 1 p. 19-24
6 p.
artikel
575 Circuit design considerations for integrated circuits 1964
100-101 1 p. 73-
1 p.
artikel
576 Circuit design for thick-film hybrids 1971
100-101 1 p. 25-
1 p.
artikel
577 4829237 Circuit device having a self-testing function and a testing method thereof Segawa, Hirosh
1990
100-101 1 p. i-
1 p.
artikel
578 Circuit failure asymmetries for reliability improvement in digital circuits 1967
100-101 1 p. 71-
1 p.
artikel
579 Classical and Bayes approaches to environmental stress screening (ESS): a comparison 1991
100-101 1 p. 206-
1 p.
artikel
580 Cleaning and contamination of electronics components and assemblies G.W.A.D.,
1987
100-101 1 p. 180-
1 p.
artikel
581 Cleaning by ultrasonics 1964
100-101 1 p. 75-
1 p.
artikel
582 Clean room garments: where from here? 1984
100-101 1 p. 178-
1 p.
artikel
583 Clean rooms 1971
100-101 1 p. 18-
1 p.
artikel
584 Clean room technology: the concept of total environmental control for advanced industries 1987
100-101 1 p. 186-
1 p.
artikel
585 Clock aligner based on delay locked loop with double edge synchronization Stojčev, Mile
2008
100-101 1 p. 158-166
9 p.
artikel
586 C-MOS chip set streamlines floating-point processing 1983
100-101 1 p. 194-
1 p.
artikel
587 CMOS integrated circuit reliability 1982
100-101 1 p. 132-
1 p.
artikel
588 CMOS integrated circuit reliability Schnable, George L.
1981
100-101 1 p. 33-50
18 p.
artikel
589 CMOS reliability: a useful case history to revise extrapolation effectiveness, length and slope of the learning curve 1982
100-101 1 p. 133-
1 p.
artikel
590 C-MOS teams with liquid crystals to make a reliable digital VOM 1974
100-101 1 p. 15-
1 p.
artikel
591 CMOS VLSI reliability test model Lisenker, Boris
1997
100-101 1 p. 115-120
6 p.
artikel
592 CMSO finally gets it all together 1973
100-101 1 p. 20-
1 p.
artikel
593 Cognitive reliability in manned systems 1974
100-101 1 p. 11-
1 p.
artikel
594 Coherent structures of non-identical components 1964
100-101 1 p. 69-
1 p.
artikel
595 Cold crucible for the processing of silicon and allied reactive materials 1966
100-101 1 p. 90-
1 p.
artikel
596 Combined analog/digital LSI design using I2L gate arrays 1983
100-101 1 p. 194-
1 p.
artikel
597 Combined electron and ion beam processes for microelectronics Broers, A.N.
1965
100-101 1 p. 103-104
2 p.
artikel
598 Combined hardware and software availability 1982
100-101 1 p. 137-
1 p.
artikel
599 Combined hardware/software reliability models 1983
100-101 1 p. 189-
1 p.
artikel
600 Combining failure rate data from various sources Schäbe, H.
1996
100-101 1 p. 47-54
8 p.
artikel
601 Coming up fast from behind—denser bipolar devices 1972
100-101 1 p. 20-
1 p.
artikel
602 Comment on the dependence of Rq and current noise on grain size in thick film resistors (RFR's) 1987
100-101 1 p. 190-
1 p.
artikel
603 Common-cause failure analysis of a non-identical unit parallel system with arbitrarily distributed repair times Dhillon, B.S.
1993
100-101 1 p. 87-103
17 p.
artikel
604 Compact failure modeling for devices subject to electrostatic discharge stresses – A review pertinent to CMOS reliability simulation Miao, Meng
2015
100-101 1 p. 15-23
9 p.
artikel
605 Comparative analysis of RF LDMOS capacitance reliability under accelerated ageing tests Belaïd, M.A.
2007
100-101 1 p. 59-64
6 p.
artikel
606 Comparative study of thick film dielectrics 1984
100-101 1 p. 186-
1 p.
artikel
607 Comparison of GaAs device approaches for ultrahigh-speed VLSI 1983
100-101 1 p. 193-194
2 p.
artikel
608 Comparison of I-V, CV, and chemical data for quality control studies of SiO x N y films on Si 1990
100-101 1 p. 190-
1 p.
artikel
609 Comparison of mean time to first failure and mean up time Singh, Chanan
1983
100-101 1 p. 79-90
12 p.
artikel
610 Comparison of memory chip organizations vs reliability in virtual memories 1984
100-101 1 p. 174-175
2 p.
artikel
611 Comparison of models for redistribution of dopants in silicon during thermal oxidation 1974
100-101 1 p. 16-
1 p.
artikel
612 Comparison of self-heating effect in GAA and SOI mosfets Francis, P.
1997
100-101 1 p. 61-75
15 p.
artikel
613 Comparison of some physical properties of resistance—heat and electron-gun evaporated SiO films 1969
100-101 1 p. 71-
1 p.
artikel
614 Comparison of the linear least squares and nonlinear least squares spheres Chen, Keh-Wei
1996
100-101 1 p. 37-46
10 p.
artikel
615 Comparison of two unit cold standby reliability models with three types of repair facilities Murari, K.
1984
100-101 1 p. 35-49
15 p.
artikel
616 Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests Kar, Yap Boon
2013
100-101 1 p. 164-173
10 p.
artikel
617 Compatibility of glassy materials for monolithic packaging 1970
100-101 1 p. 19-
1 p.
artikel
618 Competition between the buckling-driven delamination and wrinkling in compressed thin coatings Tarasovs, S.
2012
100-101 1 p. 296-299
4 p.
artikel
619 Complementary MOS field-effect transistors on high-resistivity silicon substrates 1970
100-101 1 p. 21-22
2 p.
artikel
620 Complementary transistors in integrated circuits 1971
100-101 1 p. 19-
1 p.
artikel
621 4523144 Complex probe card for testing a semiconductor wafer Okubo, Masao
1986
100-101 1 p. 202-
1 p.
artikel
622 Complex system reliability with exponential repair time distributions under head-of-line-repair-discipline 1974
100-101 1 p. 11-
1 p.
artikel
623 Complex system reliability with general repair time distributions under preemptive repeat repair discipline 1974
100-101 1 p. 11-
1 p.
artikel
624 Complex system reliability with general repair time distributions under preemptive resume repair discipline 1974
100-101 1 p. 13-
1 p.
artikel
625 Component data for statistical circuit analysis Jensen, F.
1972
100-101 1 p. 79-85
7 p.
artikel
626 Component design, construction and evaluation for satellites 1964
100-101 1 p. 68-
1 p.
artikel
627 Component level ESD testing Verhaege, Koen
1998
100-101 1 p. 115-128
14 p.
artikel
628 Component properties of co-sputtered Ta-Al alloy films 1970
100-101 1 p. 23-
1 p.
artikel
629 Component quality assurance: which plan is better? 1977
100-101 1 p. 14-
1 p.
artikel
630 Component reliability in orbiting satellites 1963
100-101 1 p. 78-
1 p.
artikel
631 Component reliability in post office equipment 1963
100-101 1 p. 77-
1 p.
artikel
632 Component reliability. Part 1: Failure data bears watching 1976
100-101 1 p. 14-
1 p.
artikel
633 Component reliability. Part 2: Hearing from users and vendors 1976
100-101 1 p. 14-
1 p.
artikel
634 Computational modelling for reliable flip-chip packaging at sub-100μm pitch using isotropic conductive adhesives Stoyanov, S.
2007
100-101 1 p. 132-141
10 p.
artikel
635 Computer-aided circuit analysis using S P I C E G.W.A.D.,
1990
100-101 1 p. 184-
1 p.
artikel
636 Computer-aided coarse grid layout technique for photomasks 1977
100-101 1 p. 19-
1 p.
artikel
637 Computer aided design for photomask production 1971
100-101 1 p. 20-
1 p.
artikel
638 Computer aided design of hybrid circuits 1984
100-101 1 p. 186-187
2 p.
artikel
639 Computer aided thermal design of LSI packages 1973
100-101 1 p. 21-
1 p.
artikel
640 Computer architecture and design G.W.A.D.,
1990
100-101 1 p. 182-183
2 p.
artikel
641 Computer calculation of device circuit, equipment and system reliability 1973
100-101 1 p. 16-
1 p.
artikel
642 Computer-communication network reliability: trends and issues 1982
100-101 1 p. 138-
1 p.
artikel
643 Computer-communication network reliability: Trends and issues Soi, Inder M.
1981
100-101 1 p. 79-95
17 p.
artikel
644 Computer-generated models abridge thermal analysis of packaged VLSI 1983
100-101 1 p. 194-
1 p.
artikel
645 Computer generates thin-film circuit masks 1969
100-101 1 p. 77-
1 p.
artikel
646 Computer helps design of complementary MOS logic 1973
100-101 1 p. 21-
1 p.
artikel
647 Computer methods for circuit analysis and design (second edition) G.W.A.D.,
1994
100-101 1 p. 191-192
2 p.
artikel
648 Computers and microprocessors components and systems Popentiu, Florin
1993
100-101 1 p. 111-
1 p.
artikel
649 Computers help design reliable telephone systems 1975
100-101 1 p. 22-
1 p.
artikel
650 Computer simulated and channelling studies of damage distributions in phosphorus implanted silicon 1990
100-101 1 p. 201-
1 p.
artikel
651 Computing instationary availability for maintained systems Schäbe, H.
1996
100-101 1 p. 55-70
16 p.
artikel
652 Computing 2-terminal reliability for radio-broadcast networks 1991
100-101 1 p. 203-204
2 p.
artikel
653 Condensation of injected electrons and holes in silicon 1975
100-101 1 p. 29-
1 p.
artikel
654 Condition assessment and fault prognostics of microelectromechanical systems Medjaher, K.
2014
100-101 1 p. 143-151
9 p.
artikel
655 Conductibilité thermique des éléments dans les circuits hybrides Berlicki, T.M.
1985
100-101 1 p. 101-103
3 p.
artikel
656 Confidence intervals and tests of hypotheses for the reliability of a 2-parameter Weibull system 1983
100-101 1 p. 191-
1 p.
artikel
657 Confidence limits on the failure rate and a rapid projection nomogram for the lognormal distribution Jordan, A.S.
1984
100-101 1 p. 101-124
24 p.
artikel
658 Configuring computer suites for system performance, reliability, and availability—a systems approach 1982
100-101 1 p. 133-
1 p.
artikel
659 Connecting devices for electronic systems—some general design considerations 1976
100-101 1 p. 14-
1 p.
artikel
660 Consecutive k-out-of-n:F system with sequential failures and a single repair Elias, S.S.
1994
100-101 1 p. 39-51
13 p.
artikel
661 Constrained optimum test configuration for reliability acceptance tests incorporating environmental stresses 1976
100-101 1 p. 17-
1 p.
artikel
662 Consumer integrated circuits in amateur design 1973
100-101 1 p. 23-24
2 p.
artikel
663 Contact potential measurements on thin SIO2 films 1975
100-101 1 p. 29-
1 p.
artikel
664 Contamination control in integrated circuits 1971
100-101 1 p. 16-
1 p.
artikel
665 4578637 Continuity/leakage tester for electronic circuits Allen, RichardJ
1987
100-101 1 p. 195-
1 p.
artikel
666 Contracting for life cycle cost to improve system affordability 1982
100-101 1 p. 134-
1 p.
artikel
667 Contributions of materials technology to semiconductor devices 1963
100-101 1 p. 79-
1 p.
artikel
668 Control and documentation in burn-in 1987
100-101 1 p. 181-
1 p.
artikel
669 Controlled phosphorus diffusion into silicon from P2O5 vpaour using a red phosphorous source 1966
100-101 1 p. 88-
1 p.
artikel
670 Controlling heat transport during crystal pulling 1974
100-101 1 p. 16-
1 p.
artikel
671 Controlling hybrid quality 1990
100-101 1 p. 200-
1 p.
artikel
672 Controlling part dimensions during fabrication and heat treatment 1966
100-101 1 p. 85-
1 p.
artikel
673 Control of boron diffusion in polysilicon for constructing overlapping polysilicon gate charge-coupled devices Srivastava, A.
1983
100-101 1 p. 179-181
3 p.
artikel
674 Control of defects in the heteroepitaxial growth of GaAs on silicon 1991
100-101 1 p. 210-
1 p.
artikel
675 Control of quality and reliability in the massproduction of electronic equipment 1971
100-101 1 p. 18-
1 p.
artikel
676 Control of stray effects in hybrid microcircuit design 1975
100-101 1 p. 31-
1 p.
artikel
677 Conversion of silicon nitride into silicon dioxide through the influence of oxygen 1972
100-101 1 p. 23-
1 p.
artikel
678 Copper Wire Bonding Mayer, Michael
2011
100-101 1 p. 1-2
2 p.
artikel
679 Copper wire bonding package decapsulation using the anodic protection method Endoh, Hirohiko
2015
100-101 1 p. 207-212
6 p.
artikel
680 Correction to a paper by Srivastava, Garg and Govil Kapur, P.K.
1974
100-101 1 p. 57-58
2 p.
artikel
681 Correlation between predicted cause of SRAM failures and in-line defect data Coppens, Peter
2001
100-101 1 p. 53-57
5 p.
artikel
682 Correlation of bright spots with crystal defects in silicon vidicons 1972
100-101 1 p. 14-
1 p.
artikel
683 Correlation of silver migration with temperature-humiditybias (THB) failures in multilayer ceramic capacitors 1990
100-101 1 p. 191-192
2 p.
artikel
684 Correlation techniques applied to evaluating vacuum deposition of thin film nichrome resistor arrays 1967
100-101 1 p. 77-
1 p.
artikel
685 Correlative sea mist corrosion testing for electronic devices 1976
100-101 1 p. 15-
1 p.
artikel
686 Correspondence of types I & II censored-sample estimators 1984
100-101 1 p. 176-
1 p.
artikel
687 Corrigendum to “Junction temperature management of IGBT module in power electronic converters” [Microelectron. Reliab. 54 (2014) 2788–2795] Zhou, Luowei
2015
100-101 1 p. 291-
1 p.
artikel
688 Cost analysis, availability and MTTF of a three state standby complex system under common cause and human failures Pandey, D.
1995
100-101 1 p. 91-95
5 p.
artikel
689 Cost analysis of a one server two unit system subject to two types of repair and arbitrary distributions Singh, S.K.
1987
100-101 1 p. 49-53
5 p.
artikel
690 Cost analysis of a 3-state 2-unit reparable system Gupta, P.P.
1984
100-101 1 p. 55-59
5 p.
artikel
691 Cost analysis of a three-state repairable redundant complex system under various modes of failures Gupta, P.P.
1986
100-101 1 p. 69-73
5 p.
artikel
692 Cost analysis of a two dissimilar cold standby system with preventive maintenance and replacement of standby Rander, M.C.
1994
100-101 1 p. 171-174
4 p.
artikel
693 Cost analysis of a two-unit cold standby system with two types of operation and repair Goel, L.R.
1985
100-101 1 p. 71-75
5 p.
artikel
694 Cost analysis of a two unit priority standby system with imperfect switch and arbitrary distributions Goel, L.R.
1985
100-101 1 p. 65-69
5 p.
artikel
695 Cost analysis of a two-unit standby system with delayed replacement and better utilization of units Goel, L.R.
1985
100-101 1 p. 81-86
6 p.
artikel
696 Cost-benefit analysis of an n-unit repairable adaptive system Vijayakumar, A.
1985
100-101 1 p. 31-34
4 p.
artikel
697 Cost-benefit analysis of a one-server two-unit standby system subject to imperfect switching device, random inspection and k-failure modes Gupta, Rakesh
1986
100-101 1 p. 7-11
5 p.
artikel
698 Cost-benefit analysis of a one-server two-unit warm standby system subject to different inspection strategies Subramanyam Naidu, R.
1983
100-101 1 p. 121-128
8 p.
artikel
699 Cost-benefit analysis of a two-unit adaptive system with slow switch Gopalan, M.N.
1985
100-101 1 p. 25-30
6 p.
artikel
700 Cost-benefit analysis of one-server two-unit system subject to slow switch and random service Gopalan, M.N.
1985
100-101 1 p. 183-194
12 p.
artikel
701 Cost effective burn-in and replacement times 1976
100-101 1 p. 19-
1 p.
artikel
702 Cost function analysis of a 3-state reparable system Gupta, P.P.
1984
100-101 1 p. 51-53
3 p.
artikel
703 Cost of reliability improvement 1970
100-101 1 p. 14-
1 p.
artikel
704 Cost—reliability optimal release policies for software systems 1987
100-101 1 p. 185-186
2 p.
artikel
705 Cost-risk procedures for weapon system risk analysis 1982
100-101 1 p. 136-
1 p.
artikel
706 Cost-space optimal (N∗ , m, n∗) parallel-series systems Venugopal, N.
1989
100-101 1 p. 9-15
7 p.
artikel
707 Course 1972
100-101 1 p. 5-
1 p.
artikel
708 Course 1973
100-101 1 p. 3-5
3 p.
artikel
709 Courses 1974
100-101 1 p. 5-6
2 p.
artikel
710 Courses 1975
100-101 1 p. 8-
1 p.
artikel
711 Courses in microelectronics and reliability 1970
100-101 1 p. 3-6
4 p.
artikel
712 Creep and tensile behaviour of lead-rich lead-tin solder alloys 1990
100-101 1 p. 191-
1 p.
artikel
713 Criteria for maintenance, checking and replacement intervals 1963
100-101 1 p. 78-
1 p.
artikel
714 Criteria for the identification of a probability distribution based on analysis of life test data 1964
100-101 1 p. 69-
1 p.
artikel
715 Criteria to reduce failures induced from conveyed electromagnetic interferences on CMOS operational amplifiers Graffi, S.
1997
100-101 1 p. 95-113
19 p.
artikel
716 Critical mechanical design evaluation of electronic communication systems 1972
100-101 1 p. 17-
1 p.
artikel
717 Critical relationships between particle size, composition, and microstructure in thick-film resistors 1990
100-101 1 p. 200-
1 p.
artikel
718 Crossovers for interconnections on substrates 1970
100-101 1 p. 19-
1 p.
artikel
719 Crosstalk noise modeling of multiwall carbon nanotube (MWCNT) interconnects using finite-difference time-domain (FDTD) technique Ramesh Kumar, Vobulapuram
2015
100-101 1 p. 155-163
9 p.
artikel
720 4575746 Crossunders for high density SOS integrated circuits Dingwall, AndrewGF
1987
100-101 1 p. 194-
1 p.
artikel
721 Crystal slicing equipment directions 1983
100-101 1 p. 193-
1 p.
artikel
722 CSAM: A clock skew-aware aging mitigation technique Eghbalkhah, Behzad
2015
100-101 1 p. 282-290
9 p.
artikel
723 Cubic β-silicon carbide films on silicon substrates 1966
100-101 1 p. 88-
1 p.
artikel
724 Current controlled negative resistance in semiconductors 1971
100-101 1 p. 24-
1 p.
artikel
725 Current developments in microminiaturization Bobenrieth, A.
1964
100-101 1 p. 35-38
4 p.
artikel
726 Current liquid crystal display technology 1977
100-101 1 p. 17-18
2 p.
artikel
727 Current transport mechanism of polysilicon-emitter transistor Srivastava, A.
1991
100-101 1 p. 27-31
5 p.
artikel
728 Custom chip adds frequency to hand-held meter's repertoire 1983
100-101 1 p. 194-
1 p.
artikel
729 Custom design of thin-film hybrid circuits 1971
100-101 1 p. 26-
1 p.
artikel
730 Custom ICs spread their influence 1983
100-101 1 p. 193-
1 p.
artikel
731 Customized ICs make up d-a converter 1975
100-101 1 p. 27-
1 p.
artikel
732 Cut down on power transistor failures 1969
100-101 1 p. 61-
1 p.
artikel
733 Cutset analysis of networks using basic minimal paths and network decomposition 1987
100-101 1 p. 182-183
2 p.
artikel
734 Cut system testing and trouble shooting 1973
100-101 1 p. 19-
1 p.
artikel
735 Cu wire bond microstructure analysis and failure mechanism Yu, Cheng-Fu
2011
100-101 1 p. 119-124
6 p.
artikel
736 Cu wire bond parameter optimization on various bond pad metallization and barrier layer material schemes England, Luke
2011
100-101 1 p. 81-87
7 p.
artikel
737 Cyclic bending reliability of wafer-level chip-scale packages Lai, Yi-Shao
2007
100-101 1 p. 111-117
7 p.
artikel
738 Cyclotron resonance at Na+-doped Si-Si02 interfaces 1982
100-101 1 p. 142-
1 p.
artikel
739 Cylindrical geometry sputtering apparatus 1966
100-101 1 p. 93-
1 p.
artikel
740 Damped transient power clamps for improved ESD protection of CMOS Hunter, Bradford L.
2006
100-101 1 p. 77-85
9 p.
artikel
741 Data communications testing and troubleshooting second edition Popentiu, Florin
1993
100-101 1 p. 110-
1 p.
artikel
742 D.C. performance of short-channel ion-implanted GaAs MESFETs (the role of gate length shortening) 1991
100-101 1 p. 211-
1 p.
artikel
743 Decision rule for an exponential reliability function Jòz̀wiak, Ireneusz J.
1991
100-101 1 p. 71-73
3 p.
artikel
744 Deep metal-related centres in germanium 1983
100-101 1 p. 196-
1 p.
artikel
745 Deep UV exposure technology 1983
100-101 1 p. 193-
1 p.
artikel
746 Degradation analysis of secondary lens system and its effect on performance of LED-based luminaire Kim, Dae-Suk
2014
100-101 1 p. 131-137
7 p.
artikel
747 Degradation and recovery of AlGaAs/GaAs p-HEMT irradiated by high-energy particle Ohyama, H.
2001
100-101 1 p. 79-85
7 p.
artikel
748 Degradation dynamics, recovery, and characterization of negative bias temperature instability Ershov, M.
2005
100-101 1 p. 99-105
7 p.
artikel
749 Degradation mechanism of GaAs MESFETs Mun, Jae Kyoung
1998
100-101 1 p. 171-178
8 p.
artikel
750 Degradation mechanism of power devices under di/dt thermal shocks: turn-on of a TRIAC in Q3 Forster, S.
2003
100-101 1 p. 89-98
10 p.
artikel
751 Degradation of RuO2 thin films in hydrogen atmosphere at temperatures between 150 and 250 °C Jelenkovic, Emil V
2003
100-101 1 p. 49-55
7 p.
artikel
752 4401904 Delay circuit used in semiconductor memory device White, LionelS
1984
100-101 1 p. 195-
1 p.
artikel
753 Delay regulation—a circuit solution to the power/performance tradeoff 1982
100-101 1 p. 140-
1 p.
artikel
754 4587480 Delay testing method for CMOS LSI and VLSI integrated circuits Zasio, John
1987
100-101 1 p. 197-
1 p.
artikel
755 Density adds MOS-design challenge 1976
100-101 1 p. 22-
1 p.
artikel
756 Density of thin evaporated aluminium films 1966
100-101 1 p. 96-
1 p.
artikel
757 Deposition and evaluation on thin films by d.c. ion beam sputtering 1973
100-101 1 p. 29-
1 p.
artikel
758 Deposition of Fe3O4 on oxidized activated carbon by hydrazine reducing method for high performance supercapacitor Oh, Ilgeun
2015
100-101 1 p. 114-122
9 p.
artikel
759 Deposition of tin oxide system resistance film through the droplet flash vapour deposition process 1967
100-101 1 p. 76-
1 p.
artikel
760 Depth profiling techniques for the elemental analysis of semiconductor layers 1991
100-101 1 p. 210-
1 p.
artikel
761 Derivative MIL-STD-781C truncated sequential tests 1983
100-101 1 p. 192-
1 p.
artikel
762 Design and simulation of micromechanical thermal converter for RF power sensor microsystem Jakovenko, Jiri
2004
100-101 1 p. 141-148
8 p.
artikel
763 Design considerations for a flip-chip joining technique 1971
100-101 1 p. 21-
1 p.
artikel
764 Design considerations for a hybrid power series regulator 1972
100-101 1 p. 19-
1 p.
artikel
765 Design considerations for an integrated low-noise preamplifier 1966
100-101 1 p. 86-87
2 p.
artikel
766 Design considerations of hybrid integrated active RC filters 1975
100-101 1 p. 33-
1 p.
artikel
767 Design criteria for low distortion in feedback OPAMP circuits; Bjornar Hernes, Trond Saether, Kluwer Academic Publishers, Boston, 2003. Hardcover, pp. 160, plus XXV, 110 €. ISBN 1-4020-7356-9 Stojcev, Mile
2004
100-101 1 p. 181-182
2 p.
artikel
768 Design curves for integrated uniform thin film band-pass filter Singh, H.R.
1983
100-101 1 p. 183-184
2 p.
artikel
769 Design for manufacturability and yield 1991
100-101 1 p. 209-
1 p.
artikel
770 Design i-f stages with monolithic ICs 1969
100-101 1 p. 77-
1 p.
artikel
771 Designing differential FET inputs with overall performance in mind 1972
100-101 1 p. 20-
1 p.
artikel
772 Designing reliability into telephone cables 1973
100-101 1 p. 18-
1 p.
artikel
773 Designing the maximum performance into bit-slice minicomputers 1977
100-101 1 p. 22-
1 p.
artikel
774 Design of a 108 pin VLSI package with low thermal resistance 1984
100-101 1 p. 180-
1 p.
artikel
775 Design of experiments to investigate reliability for solder joints PBGA package under high cycle fatigue Wu, Mei-Ling
2010
100-101 1 p. 127-139
13 p.
artikel
776 Design of highly reliable tree architectures 1990
100-101 1 p. 195-
1 p.
artikel
777 Design of planar rectangular microelectronic inductors 1975
100-101 1 p. 31-32
2 p.
artikel
778 Design of plasma deposition reactors 1984
100-101 1 p. 179-
1 p.
artikel
779 Design of polymer resists for electron lithography 1975
100-101 1 p. 26-
1 p.
artikel
780 Design of precision thin film resistive networks 1975
100-101 1 p. 33-
1 p.
artikel
781 Design of precision thin film resistive networks Bredenkamp, G.L.
1974
100-101 1 p. 49-50
2 p.
artikel
782 Design of 2xVDD-tolerant mixed-voltage I/O buffer against gate-oxide reliability and hot-carrier degradation Tsai, Hui-Wen
2010
100-101 1 p. 48-56
9 p.
artikel
783 Design optimization of SiGe BiCMOS Silicon Controlled Rectifier for Charged Device Model (CDM) protection applications Cui, Qiang
2014
100-101 1 p. 57-63
7 p.
artikel
784 Design trade-offs in availability warranties 1982
100-101 1 p. 133-
1 p.
artikel
785 Detecting and diagnosing latent quality losses 1983
100-101 1 p. 190-
1 p.
artikel
786 4577149 Detection of catastrophic failure of dielectric, improper connection, and temperature of a printed circuit assembly via one wire Zbinden, Terry
1987
100-101 1 p. 194-
1 p.
artikel
787 Detection of failures in combinational digital circuits 1972
100-101 1 p. 16-
1 p.
artikel
788 Detection of resistivity variation in a semiconductor pellet with an electron beam Munakata, C.
1967
100-101 1 p. 27-32
6 p.
artikel
789 Determination of diffusion, partition and sticking coefficients for boron, phosphorus and antimony in silicon 1976
100-101 1 p. 24-
1 p.
artikel
790 Determination of generation lifetime from the small-signal transient behaviour of MOS capacitors 1976
100-101 1 p. 24-
1 p.
artikel
791 Determination of service effectiveness to individual terminals in multiterminal capacity-limited systems 1984
100-101 1 p. 177-
1 p.
artikel
792 Determination of test intervals in certain repairable standby protective systems 1976
100-101 1 p. 16-
1 p.
artikel
793 Determination of the capture cross-section of hole-trapping centres in SiO2 1974
100-101 1 p. 17-18
2 p.
artikel
794 Determination of the dice forward I–V characteristics of a power diode from a packaged device and its applications Tan, Cher Ming
2005
100-101 1 p. 179-184
6 p.
artikel
795 Determination of threshold power for semiconductor melting during laser annealing 1987
100-101 1 p. 191-
1 p.
artikel
796 Determining optimal redundancy for systems with random lifetimes 1991
100-101 1 p. 204-
1 p.
artikel
797 Determining optimum burn-in and replacement times using Bayesian decision theory 1973
100-101 1 p. 18-
1 p.
artikel
798 Developing a decision support system for optimizing automated wafer fabrication 1991
100-101 1 p. 207-208
2 p.
artikel
799 Development and application of thin-film techniques 1969
100-101 1 p. 72-
1 p.
artikel
800 Development of a multiple intermittent fault testing strategy 1984
100-101 1 p. 172-
1 p.
artikel
801 Development of a peripheral vision command indicator for instrument flight 1964
100-101 1 p. 76-
1 p.
artikel
802 Development of beam-lead RF integrated circuits 1976
100-101 1 p. 22-
1 p.
artikel
803 Development of COS/MOS technology 1975
100-101 1 p. 24-
1 p.
artikel
804 Development of generalized theory of floating-emitter potential based on studies of germanium and silicon transistors 1974
100-101 1 p. 15-
1 p.
artikel
805 Development of large thick-film multilayers assemblies 1973
100-101 1 p. 27-
1 p.
artikel
806 Development problems of microelectronic circuits 1966
100-101 1 p. 86-
1 p.
artikel
807 Developments in copper alloys for semiconductor connectors and packages 1972
100-101 1 p. 22-
1 p.
artikel
808 Developments in products, technology and design tools 1984
100-101 1 p. 180-
1 p.
artikel
809 Device, circuit and technology scaling to micron and submicron dimensions 1984
100-101 1 p. 181-
1 p.
artikel
810 Device failure analysis by scanning electron microscopy Thornton, P.R.
1969
100-101 1 p. 33-42
10 p.
artikel
811 4575747 Device for protecting film-mounted integrated circuits against destruction due to electrostatic charges Fritz, Otmar
1987
100-101 1 p. 194-
1 p.
artikel
812 4889242 Device for testing and sorting electronic components, more particularly integrated circuit chips Willberg, HansH
1991
100-101 1 p. i-ii
nvt p.
artikel
813 3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials Belhenini, Soufyane
2014
100-101 1 p. 13-21
9 p.
artikel
814 Diagnostic-strategy selection for series systems 1991
100-101 1 p. 205-206
2 p.
artikel
815 Diamond structure versus Wurtzite structure for silicon 1982
100-101 1 p. 142-
1 p.
artikel
816 4396933 Dielectrically isolated semiconductor devices Magdo, IngridE
1984
100-101 1 p. 196-
1 p.
artikel
817 Dielectric properties of thin insulating films of photoresist material 1966
100-101 1 p. 95-
1 p.
artikel
818 Dielectric Reliability Measurement Methods: A Review Martin, Andreas
1998
100-101 1 p. 37-72
36 p.
artikel
819 Differential thermal expansion in microelectronic systems 1990
100-101 1 p. 198-
1 p.
artikel
820 Diffusion length measurements of thin amorphous silicon layers 1990
100-101 1 p. 199-200
2 p.
artikel
821 Diffusion of excitons and electron-hole drops in germanium 1976
100-101 1 p. 24-
1 p.
artikel
822 Diffusion of ion-implanted 83Kr KCl, including the effects of channeling, radiation damage and divalent doping 1973
100-101 1 p. 30-
1 p.
artikel
823 Diffusion of zinc into ion-implanted gallium arsenide 1983
100-101 1 p. 198-199
2 p.
artikel
824 Digital applications of MOS integrated circuits 1969
100-101 1 p. 76-
1 p.
artikel
825 Digital-circuit reliability through redundancy Sorensen, A.A
1962
100-101 1 p. 27-37
11 p.
artikel
826 Digital-IC models for computer-aided design—1. TTL NAND gates 1974
100-101 1 p. 14-
1 p.
artikel
827 Digital integrated circuit testing from a quality perspective G.W.A.D.,
1994
100-101 1 p. 194-195
2 p.
artikel
828 Digital signal processing hits stride with 64-bit correlator IC 1982
100-101 1 p. 141-
1 p.
artikel
829 Digital simulation of magnetic Czochralski flow under various laboratory conditions for silicon growth 1984
100-101 1 p. 182-
1 p.
artikel
830 Digraph matrix analysis 1987
100-101 1 p. 185-
1 p.
artikel
831 Diodes for Hybrid Integrated Circuits 1974
100-101 1 p. 18-
1 p.
artikel
832 DIPLOG. A new range of thick-film hybrid integrated circuits 1969
100-101 1 p. 75-
1 p.
artikel
833 Direct chip interconnect using polymer bonding 1991
100-101 1 p. 208-
1 p.
artikel
834 Direct computation of expected numbers of failures and repairs via integral equation approach Inagaki, Toshiyuki
1985
100-101 1 p. 105-109
5 p.
artikel
835 Direct temperature measurement of integrated microelectronic devices by thermally induced leakage currents Pieper, Klaus-Willi
2001
100-101 1 p. 133-136
4 p.
artikel
836 Discharge treated thin films Singh, Awatar
1983
100-101 1 p. 185-
1 p.
artikel
837 Discrete convolution in power system reliability 1983
100-101 1 p. 191-
1 p.
artikel
838 4899107 Discrete die burn-in for nonpackaged die Corbett, TimJ
1991
100-101 1 p. v-
1 p.
artikel
839 Dislocation multiplication inside contact holes Hsieh, Y.F.
1999
100-101 1 p. 15-22
8 p.
artikel
840 Dislocation reactions in silicon web-dendrite crystals 1967
100-101 1 p. 73-
1 p.
artikel
841 Dislocations in GaAs produced by device fabrication 1975
100-101 1 p. 29-
1 p.
artikel
842 Distributed redundancy in two-layer threshold logic networks 1970
100-101 1 p. 17-
1 p.
artikel
843 Distribution-free confidence bound for Pr(Y < X) of an r-out-of-k system 1987
100-101 1 p. 185-
1 p.
artikel
844 Distribution of residual system-life after partial failures 1990
100-101 1 p. 196-
1 p.
artikel
845 Distribution of time to failure of consecutive k-out-of-n: F systems 1991
100-101 1 p. 204-
1 p.
artikel
846 Distribution of time to non-availability of a reliability system 1974
100-101 1 p. 12-
1 p.
artikel
847 DMOS FET parameter drift kinetics from microscopic modeling Alagi, F.
2010
100-101 1 p. 57-62
6 p.
artikel
848 Dodge transducer failures with a RAMP. This highly reliable op amp automatically corrects for the failure of one or more of its redundant inputs 1969
100-101 1 p. 63-
1 p.
artikel
849 Dopant density from maximum-minimum capacitance ratio of implanted MOS structures 1983
100-101 1 p. 198-
1 p.
artikel
850 Doping compensation for increased robustness of fast recovery silicon diodes Vobecký, J.
2010
100-101 1 p. 32-38
7 p.
artikel
851 Doping dependence of second breakdown in a p-n junction 1972
100-101 1 p. 14-15
2 p.
artikel
852 Déphaseurs microélectronique en bande X et KU 1973
100-101 1 p. 22-
1 p.
artikel
853 Drain breakdown in submicron MOSFETs: a review Wong, Hei
2000
100-101 1 p. 3-15
13 p.
artikel
854 Drain current saturation at high drain voltage due to pinch off instead of velocity saturation in sub-100nm metal–oxide–semiconductor transistors Lau, W.S.
2009
100-101 1 p. 1-7
7 p.
artikel
855 Drift of the breakdown voltage in highly doped planar junctions 1974
100-101 1 p. 16-
1 p.
artikel
856 Drift of the breakdown voltage in highly doped planar junctions Verwey, J.F.
1973
100-101 1 p. 51-56
6 p.
artikel
857 Drift velocity of electrons and holes and associated anisotropic effects in silicon 1972
100-101 1 p. 24-
1 p.
artikel
858 Dry etch development for silicon processing within a teaching institution 1990
100-101 1 p. 197-
1 p.
artikel
859 Dry etching systems: gearing up for larger wafers 1987
100-101 1 p. 187-
1 p.
artikel
860 Dry etching technology for fine line devices 1982
100-101 1 p. 140-
1 p.
artikel
861 Dry film photoresists in microelectronics 1977
100-101 1 p. 20-
1 p.
artikel
862 D− state in silicon 1977
100-101 1 p. 22-
1 p.
artikel
863 Dynamic and steady-state solutions for a general availability model 1987
100-101 1 p. 184-
1 p.
artikel
864 Dynamic element matching puts trimless converters on chip 1984
100-101 1 p. 179-
1 p.
artikel
865 Dynamic IC testing made easy 1969
100-101 1 p. 63-
1 p.
artikel
866 Dynamic malfunction limits in high-speed TTL and ECL integrated digital gates Abdel-Latif, M.
1973
100-101 1 p. 57-58
2 p.
artikel
867 Dynamic malfunction limits in high-speed TTL and ECL integrated digital gates 1974
100-101 1 p. 14-
1 p.
artikel
868 4409672 Dynamic semiconductor memory device Takemae, Yoshihir
1984
100-101 1 p. 191-
1 p.
artikel
869 Early applications of laser direct patterning: direct writing and excimer projection 1987
100-101 1 p. 191-
1 p.
artikel
870 Early implementation/Measurement of testability 1982
100-101 1 p. 133-134
2 p.
artikel
871 Early reliability assessment by using deep censoring Schafft, Harry A.
2003
100-101 1 p. 1-16
16 p.
artikel
872 E-beam machines paired with optics pare wafer costs 1982
100-101 1 p. 142-
1 p.
artikel
873 EBSD measurements of elastic strain fields in a GaN/sapphire structure Luo, J.F.
2006
100-101 1 p. 178-182
5 p.
artikel
874 Echo capsule for medical use—a battery-less endoradiosonde 1964
100-101 1 p. 72-
1 p.
artikel
875 Economical attainment of high reliability 1976
100-101 1 p. 17-18
2 p.
artikel
876 Economical electrical life testing of toggle switches Bora, J.S.
1972
100-101 1 p. 93-
1 p.
artikel
877 Economical RGB colour decoder with three ICs 1975
100-101 1 p. 27-
1 p.
artikel
878 Economic analysis of the M/M/R machine repair problem with warm standbys Sivazlian, B.D.
1989
100-101 1 p. 25-35
11 p.
artikel
879 Economic design of maintained reliability systems Ntuen, Celestine A.
1989
100-101 1 p. 3-7
5 p.
artikel
880 Economic justification for reliability improvement on consumer products 1963
100-101 1 p. 78-
1 p.
artikel
881 Economic problems connected with the introduction of integrated circuits 1966
100-101 1 p. 86-
1 p.
artikel
882 Editor Board 1970
100-101 1 p. IFC-
1 p.
artikel
883 Editorial 1998
100-101 1 p. iii-
1 p.
artikel
884 Editorial Stojadinovic, Ninoslav
2001
100-101 1 p. 1-
1 p.
artikel
885 Editorial Stojadinović, Ninoslav
1997
100-101 1 p. iii-v
nvt p.
artikel
886 Editorial 1999
100-101 1 p. 1-
1 p.
artikel
887 Editorial 1962
100-101 1 p. 1-
1 p.
artikel
888 Editorial Board 1995
100-101 1 p. IFC-
1 p.
artikel
889 Editorial Board 1997
100-101 1 p. IFC-
1 p.
artikel
890 Editorial Board 1993
100-101 1 p. IFC-
1 p.
artikel
891 Editorial Board 1991
100-101 1 p. IFC-
1 p.
artikel
892 Editorial Board 1996
100-101 1 p. IFC-
1 p.
artikel
893 Editorial Board 1994
100-101 1 p. IFC-
1 p.
artikel
894 Editorial Board 1989
100-101 1 p. IFC-
1 p.
artikel
895 Editorial Board 1988
100-101 1 p. IFC-
1 p.
artikel
896 Editorial Board 1987
100-101 1 p. IFC-
1 p.
artikel
897 Editorial Board 1985
100-101 1 p. IFC-
1 p.
artikel
898 Editorial Board 1990
100-101 1 p. IFC-
1 p.
artikel
899 Editorial Board 1984
100-101 1 p. IFC-
1 p.
artikel
900 Editorial Board 1986
100-101 1 p. IFC-
1 p.
artikel
901 Editorial Board 1983
100-101 1 p. IFC-
1 p.
artikel
902 Editorial Board 1982
100-101 1 p. ii-
1 p.
artikel
903 Editorial Board 1981
100-101 1 p. IFC-
1 p.
artikel
904 Editorial Board 1966
100-101 1 p. IFC-
1 p.
artikel
905 Editorial Board 1971
100-101 1 p. IFC-
1 p.
artikel
906 Editorial Board 1968
100-101 1 p. IFC-
1 p.
artikel
907 Editorial Board 1973
100-101 1 p. IFC-
1 p.
artikel
908 Editorial Board 1977
100-101 1 p. IFC-
1 p.
artikel
909 Editorial Board 1978
100-101 1 p. IFC-
1 p.
artikel
910 Editorial Board 1972
100-101 1 p. IFC-
1 p.
artikel
911 Editorial Board 1976
100-101 1 p. IFC-
1 p.
artikel
912 Editorial Board 1974
100-101 1 p. IFC-
1 p.
artikel
913 Editorial Board 1965
100-101 1 p. IFC-
1 p.
artikel
914 Editorial Board 1967
100-101 1 p. IFC-
1 p.
artikel
915 Editorial Board 1975
100-101 1 p. IFC-
1 p.
artikel
916 Editorial Board 1969
100-101 1 p. IFC-
1 p.
artikel
917 Editorial Board 1963
100-101 1 p. IFC-
1 p.
artikel
918 Editorial Board 1964
100-101 1 p. IFC-
1 p.
artikel
919 Editor's note 1964
100-101 1 p. 79-
1 p.
artikel
920 Effective recombination levels in N- and P-Type silicon irradiated by 4·5 MeV Electrons 1974
100-101 1 p. 17-
1 p.
artikel
921 Effective threshold energy for pair production in nonpolar semiconductors 1977
100-101 1 p. 24-
1 p.
artikel
922 Effect of age in vitreous As2Se3 thin films 1983
100-101 1 p. 196-
1 p.
artikel
923 Effect of binding force between silver paste and silicon on power degradation of crystalline silicon solar module Yang, Hong
2014
100-101 1 p. 188-191
4 p.
artikel
924 Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution Xu, H.
2011
100-101 1 p. 113-118
6 p.
artikel
925 Effect of burn-in on mean residual life 1987
100-101 1 p. 181-
1 p.
artikel
926 Effect of deposition conditions on stability of sputtered oxide in MOS structures Jelenkovic, Emil V.
1997
100-101 1 p. 159-169
11 p.
artikel
927 Effect of electrical and thermal stress on low-frequency noise characteristics of laser diodes Chen, X.Y
2001
100-101 1 p. 105-110
6 p.
artikel
928 Effect of electron band structure on energy distribution of secondaries in silicon 1990
100-101 1 p. 200-
1 p.
artikel
929 Effect of fast cooling on diffusion-induced imperfections in silicon 1967
100-101 1 p. 73-
1 p.
artikel
930 Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding Pequegnat, A.
2011
100-101 1 p. 43-52
10 p.
artikel
931 Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface Shen, Jun
2014
100-101 1 p. 252-258
7 p.
artikel
932 Effect of microwave radiation on the properties of Ta2O5–Si microstructures Atanassova, E.
2005
100-101 1 p. 123-135
13 p.
artikel
933 Effect of mold compound components on moisture-induced degradation of gold-aluminum bonds in epoxy encapsulated devices 1991
100-101 1 p. 202-
1 p.
artikel
934 Effect of nitridation on the reliability of thick gate oxides Wu, C.-T.
2003
100-101 1 p. 43-47
5 p.
artikel
935 Effect of nitrogen ion bombardment at copper-alumina interface 1991
100-101 1 p. 211-
1 p.
artikel
936 Effect of oxidation-induced positive charges on the kinetics of silicon oxidation 1983
100-101 1 p. 196-
1 p.
artikel
937 Effect of reliability programs on life cycle cost — A case history Bertschy, Roland G.
1978
100-101 1 p. 9-14
6 p.
artikel
938 Effect of reverse substrate bias on ultra-thin gate oxide n-MOSFET degradation under different stress modes Zhao, Yao
2006
100-101 1 p. 164-168
5 p.
artikel
939 Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling Lin, Y.C.
2005
100-101 1 p. 143-154
12 p.
artikel
940 Effect of surface reconstruction on the adsorption of Ge on clean Si (111) 1984
100-101 1 p. 183-
1 p.
artikel
941 Effect of the drop impact on BGA/CSP package reliability Mishiro, Kinuko
2002
100-101 1 p. 77-82
6 p.
artikel
942 Effect of the model uniform product liability act in quality assurance 1982
100-101 1 p. 138-
1 p.
artikel
943 Effect of the presence of an inversion layer in an MPN structure 1983
100-101 1 p. 195-
1 p.
artikel
944 Effect of thermal etching on silicon epitaxial growth by vacuum sublimation 1976
100-101 1 p. 24-25
2 p.
artikel
945 Effects of complex alloy additions on electromigration in aluminium thin films 1973
100-101 1 p. 28-
1 p.
artikel
946 Effects of Cu on the interfacial reactions between Sn–8Zn–3Bi–xCu solders and Cu substrate Liu, Lijuan
2014
100-101 1 p. 259-264
6 p.
artikel
947 Effects of design automation on the reliability and maintainability design of electronic systems Arsenault, J.E.
1978
100-101 1 p. 143-153
11 p.
artikel
948 Effects of different test profiles of temperature cycling tests on the reliability of RFID tags Lahokallio, Sanna
2015
100-101 1 p. 93-100
8 p.
artikel
949 Effects of dust on various lubricated sliding contacts 1991
100-101 1 p. 200-
1 p.
artikel
950 Effects of electrical stressing in power VDMOSFETs Stojadinovic, N.
2005
100-101 1 p. 115-122
8 p.
artikel
951 Effects of electrical stress on mid-gap interface trap density and capture cross sections in n-MOSFETs characterized by pulsed interface probing measurements Kwon, Hyuck In
2004
100-101 1 p. 47-51
5 p.
artikel
952 Effects of gamma-ray irradiation on polycrystalline silicon thin-film transistors Hastas, N.A.
2003
100-101 1 p. 57-60
4 p.
artikel
953 Effects of humidity and organic coating on surface potential propagation in passivated devices 1972
100-101 1 p. 14-
1 p.
artikel
954 Effects of image force and tunneling on current transport in metal-semiconductor (Schottky Barrier) contacts 1971
100-101 1 p. 24-
1 p.
artikel
955 Effects of inhomogeneous negative bias temperature stress on p-channel MOSFETs of analog and RF circuits Schlünder, Christian
2005
100-101 1 p. 39-46
8 p.
artikel
956 Effects of nuclear radiation on a high-reliability silicon power diode—4. Analysis of reverse bias characteristics 1975
100-101 1 p. 20-
1 p.
artikel
957 Effects of package and process variation on 2.4GHz analog integrated circuits Szymañski, Andrzej
2006
100-101 1 p. 189-193
5 p.
artikel
958 Effects of TMF heating rates on damage accumulation and resultant mechanical behavior of Sn–Ag based solder joints Lee, J.G.
2007
100-101 1 p. 118-131
14 p.
artikel
959 Effects of underfill materials on the reliability of low-K flip-chip packaging Chen, K.M.
2006
100-101 1 p. 155-163
9 p.
artikel
960 Effects of Weibull hazard rate on common cause failure analysis of reliability networks Dhillon, Balbir S.
1978
100-101 1 p. 59-65
7 p.
artikel
961 Effects of wire quality and capillary maintenance on bonding reliability 1976
100-101 1 p. 13-14
2 p.
artikel
962 Effet de valence en éléctromigration dans l'argent 1971
100-101 1 p. 16-
1 p.
artikel
963 Efficient computer-aided failure analysis of integrated circuits using scanning electron microscopy 1987
100-101 1 p. 182-
1 p.
artikel
964 Efficient estimation of the mean of an exponential distribution when two outliers are present Alexander, T.Leo
1995
100-101 1 p. 57-63
7 p.
artikel
965 Efficient implementation of error correction codes in hash tables Reviriego, P.
2014
100-101 1 p. 338-340
3 p.
artikel
966 Efficient management of critically important systems Malik, Mazhar Ali Khan
1978
100-101 1 p. 173-178
6 p.
artikel
967 Efficient parametric yield optimization of VLSI circuit by uniform design sampling method Jing, Ming-e
2005
100-101 1 p. 155-162
8 p.
artikel
968 Efficient photoemission from GaAs epitaxial layers 1970
100-101 1 p. 21-
1 p.
artikel
969 Efficient simulation of impurity redistribution in VLSI fabrication processes 1990
100-101 1 p. 190-
1 p.
artikel
970 Electrical applications of thin-films produced by metallo-Organic Deposition 1975
100-101 1 p. 30-
1 p.
artikel
971 Electrical breakdown in very thin Al2O3 films 1976
100-101 1 p. 27-
1 p.
artikel
972 Electrical characteristics and memory behavior of GE3N4-GaAs MIS devices 1983
100-101 1 p. 195-
1 p.
artikel
973 Electrical characteristics of the SiO2-Si interface near midgap and in weak inversion 1975
100-101 1 p. 28-29
2 p.
artikel
974 Electrical characterization of Al-SiO2-Si (N-type ) tunnel structures, influence of LPCVD and LPO2 oxide growth technologies on the properties of the Si-SiO2 interface 1984
100-101 1 p. 182-
1 p.
artikel
975 Electrical conduction by percolation in thick film resistors 1977
100-101 1 p. 26-
1 p.
artikel
976 4456978 Electrically alterable read only memory semiconductor device made by low pressure chemical vapor deposition process Morley, RichardM
1985
100-101 1 p. 204-
1 p.
artikel
977 Electrically and radiation induced leakage currents in thin oxides Scarpa, A
2000
100-101 1 p. 57-67
11 p.
artikel
978 Electrical measurements as early indicators of electromigration failure Jones, B.K.
1995
100-101 1 p. 13-25
13 p.
artikel
979 Electrical measurements on ion-implanted LPCVD polycrystalline silicon films 1984
100-101 1 p. 187-
1 p.
artikel
980 Electrical properties of n-type Si layers doped with proton bombardment induced shallew donors 1973
100-101 1 p. 26-
1 p.
artikel
981 Electrical qualification of new ultrathin integration techniques Cazarré, A.
2003
100-101 1 p. 111-115
5 p.
artikel
982 Electrical reliability aspects of HfO2 high-k gate dielectrics with TaN metal gate electrodes under constant voltage stress Chatterjee, S.
2006
100-101 1 p. 69-76
8 p.
artikel
983 Electrical surface properties of semi-insulating and ion implanted GaAs revealed by thermo-optical acousto-electric voltage method 1983
100-101 1 p. 199-
1 p.
artikel
984 Electrical testing for process evaluations 1982
100-101 1 p. 139-
1 p.
artikel
985 Electrical transport in thick film (Cermet) resistors 1984
100-101 1 p. 186-
1 p.
artikel
986 Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps Meinshausen, L.
2015
100-101 1 p. 192-200
9 p.
artikel
987 Electrolytic capacitors and their reliability 1963
100-101 1 p. 77-
1 p.
artikel
988 Electromagnetic Compatibility G.W.A.D.,
1993
100-101 1 p. 108-109
2 p.
artikel
989 Electromechanical switching devices: reliability, life and the relevance of circuit design 1967
100-101 1 p. 69-
1 p.
artikel
990 Electromigration damage in AlCu thin films 1972
100-101 1 p. 15-
1 p.
artikel
991 Electromigration testing—a current problem 1975
100-101 1 p. 24-
1 p.
artikel
992 Electron and hole mobilities in inversion layers on thermally oxidized silicon surfaces 1966
100-101 1 p. 92-
1 p.
artikel
993 Electron and ion beams in microelectronic fabrication processes 1973
100-101 1 p. 30-
1 p.
artikel
994 Electron beam direct writing technology applied to 512 Kbit ROM with 1 μm geometry 1983
100-101 1 p. 199-
1 p.
artikel
995 Electron Beam Evaporated aluminium oxide gate silicon transistors 1975
100-101 1 p. 33-34
2 p.
artikel
996 Electron beam exposure system for integrated circuits 1970
100-101 1 p. 24-
1 p.
artikel
997 Electron-beam fabricated high-speed digital GaAs integrated circuits 1983
100-101 1 p. 198-
1 p.
artikel
998 Electron beam induced conductivity in “PET” and “FEP” 1984
100-101 1 p. 188-
1 p.
artikel
999 Electron-beam-induced currents in simple device structures 1977
100-101 1 p. 28-
1 p.
artikel
1000 Electron-beam microfabrication equipment for microcircuit research and production 1975
100-101 1 p. 34-
1 p.
artikel
                             3138 gevonden resultaten
 
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