no |
title |
author |
magazine |
year |
volume |
issue |
page(s) |
type |
1 |
ACD grows up—fast
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |
2 |
A generalization of the concept of the integrated circuits
|
Tarui, Yasuo |
|
1971 |
10 |
4 |
p. 227-228 2 p. |
article |
3 |
Algebraic properties of faults in logic networks
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |
4 |
Automatic mask alignment in MOS/LSI processing
|
|
|
1971 |
10 |
4 |
p. 250-251 2 p. |
article |
5 |
Calculation of confidence limits for MTBF and λ
|
|
|
1971 |
10 |
4 |
p. 287-290 4 p. |
article |
6 |
Calendar of International Conferences, Symposia, Lectures and Meetings of Interest
|
|
|
1971 |
10 |
4 |
p. 231-233 3 p. |
article |
7 |
Calls for papers
|
|
|
1971 |
10 |
4 |
p. 245-246 2 p. |
article |
8 |
Capacitive keys, simpler circuits add up to reliable keyboard
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
9 |
Ceramics for packaging
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
10 |
Changes of mobility along a depletion type MOS transistor channel
|
|
|
1971 |
10 |
4 |
p. 254- 1 p. |
article |
11 |
Characteristics and applications of bias sputtering
|
|
|
1971 |
10 |
4 |
p. 256- 1 p. |
article |
12 |
Compatibility between thin and thick film techniques
|
|
|
1971 |
10 |
4 |
p. 256- 1 p. |
article |
13 |
Control of r.f. sputtered film properties through substrate tuning
|
|
|
1971 |
10 |
4 |
p. 257-258 2 p. |
article |
14 |
Counter design using microelectronic circuits
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |
15 |
Courses in microelectronics and reliability
|
|
|
1971 |
10 |
4 |
p. 239-240 2 p. |
article |
16 |
Courses in microelectronics and reliability
|
|
|
1971 |
10 |
4 |
p. 241-244 4 p. |
article |
17 |
Current trends and future developments in optoelectronic displays
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |
18 |
D.c. arc anodic plasma oxidation—a new vacuum process for solid state device fabrication
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
19 |
Depletion-mode devices hike speed of MOS random access memory
|
|
|
1971 |
10 |
4 |
p. 258- 1 p. |
article |
20 |
Designing an LSI memory system that outperforms cores—economically
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
21 |
Determining of the extent of long-term reliability tests
|
Tomášek, K.F. |
|
1971 |
10 |
4 |
p. 285-286 2 p. |
article |
22 |
Digital ICS + VOR = simpler navigation
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
23 |
Distributed-lumped-active network realizations of a delay line suitable for microelectronic applications
|
Dutta Roy, S.C. |
|
1971 |
10 |
4 |
p. 277-283 7 p. |
article |
24 |
Divide frequencies by an integer
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
25 |
Electron activity coefficients in heavily doped semiconductors with small effective mass
|
|
|
1971 |
10 |
4 |
p. 255- 1 p. |
article |
26 |
Electronic properties of amorphous semiconductors
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
27 |
Electron tunneling in clean Al-insulator-normal metal junction
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
28 |
Electropolishing silicon
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
29 |
Excited 1s levels of Bi donors in Si
|
|
|
1971 |
10 |
4 |
p. 254- 1 p. |
article |
30 |
Fast logic extends range of high-frequency counters
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
31 |
Film thickness measurement by absolute methods
|
|
|
1971 |
10 |
4 |
p. 257- 1 p. |
article |
32 |
Gases for the electronic industry—a changing technology
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
33 |
Glass, its vital role in semiconductor packaging
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
34 |
Glaze resistor paste preparation
|
|
|
1971 |
10 |
4 |
p. 256- 1 p. |
article |
35 |
High-temperature behavior of GaAs junctions prepared by different techniques
|
|
|
1971 |
10 |
4 |
p. 255- 1 p. |
article |
36 |
ICs ignore noise
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
37 |
Improvements in reliability of metal film resistors
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |
38 |
Influence of surface band bending on the incorporation of impurities in semiconductors: Te in GaAs
|
|
|
1971 |
10 |
4 |
p. 255-256 2 p. |
article |
39 |
Inside electronic watches: a micropower movement
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
40 |
Integrated-circuit digital logic families
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
41 |
Integrated circuits for communications applications
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
42 |
Investigation of the distribution of aluminium in silicon in alloy p−n junctions
|
|
|
1971 |
10 |
4 |
p. 254-255 2 p. |
article |
43 |
Investigation of the influence of technology on Si-SiO2 system and MOS structure electrical properties
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
44 |
Ionic contamination-induced degradation of low current h FE
|
|
|
1971 |
10 |
4 |
p. 249- 1 p. |
article |
45 |
Items of interest
|
|
|
1971 |
10 |
4 |
p. 229- 1 p. |
article |
46 |
Josephson effects in thin film “Weak-Links”
|
|
|
1971 |
10 |
4 |
p. 256- 1 p. |
article |
47 |
Junction-coating resins improve s. c. performance
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
48 |
Laser tests ICs with light touch
|
|
|
1971 |
10 |
4 |
p. 258- 1 p. |
article |
49 |
Life testing relays and electromechanical devices
|
|
|
1971 |
10 |
4 |
p. 249- 1 p. |
article |
50 |
Light sensitive CdS thin films with temperature resistant contacts
|
Kortlandt, J. |
|
1971 |
10 |
4 |
p. 261-267 7 p. |
article |
51 |
Low cost digital I.C.'s yield three-phase signal generator
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
52 |
Metal-insulator transition metal oxides
|
|
|
1971 |
10 |
4 |
p. 253-254 2 p. |
article |
53 |
Metallization systems for integrated circuits
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |
54 |
Modern electronic maintenance principles
|
G.W.A.D., |
|
1971 |
10 |
4 |
p. 259- 1 p. |
article |
55 |
Molybdenum gates open the door to faster MOS memories
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
56 |
M.S.I. counters generate arithmetic functions
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
57 |
New IC market: electronic watches
|
|
|
1971 |
10 |
4 |
p. 252-253 2 p. |
article |
58 |
Papers to be published in future issues
|
|
|
1971 |
10 |
4 |
p. 260- 1 p. |
article |
59 |
Part 1. Plastic-ceramic duel stirs up new design concepts for LSI packages
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
60 |
Performance degradation of bidirectional triode thyristors due to di/dt stress
|
|
|
1971 |
10 |
4 |
p. 249-250 2 p. |
article |
61 |
Phased locked loops plus ICs—and, presto, better circuitry!
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
62 |
Phenomena occurring at the Al-Si interface during the formation of p−n junction
|
|
|
1971 |
10 |
4 |
p. 255- 1 p. |
article |
63 |
Process and performance characteristics of “Birox” thick-film resistor compositions
|
|
|
1971 |
10 |
4 |
p. 257- 1 p. |
article |
64 |
Recent United Kingdom patents in microelectronics
|
|
|
1971 |
10 |
4 |
p. 247-248 2 p. |
article |
65 |
Recombination in strongly excited silicon
|
|
|
1971 |
10 |
4 |
p. 255- 1 p. |
article |
66 |
Reliability assessment myths and misuse of statistics
|
|
|
1971 |
10 |
4 |
p. 249- 1 p. |
article |
67 |
1971 Reliability Physics Symposium
|
|
|
1971 |
10 |
4 |
p. 235-238 4 p. |
article |
68 |
Semivacancy pair in crystalline silicon
|
|
|
1971 |
10 |
4 |
p. 253- 1 p. |
article |
69 |
Shallow acceptor states in semiconductors—the local strain field
|
|
|
1971 |
10 |
4 |
p. 254- 1 p. |
article |
70 |
Some properties of thick film niobate capacitors
|
|
|
1971 |
10 |
4 |
p. 257- 1 p. |
article |
71 |
Systems organisation
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
72 |
Tantalum nitride thin film resistors with low TCR
|
|
|
1971 |
10 |
4 |
p. 256- 1 p. |
article |
73 |
The application of electron/ion beam technology to microelectronics
|
|
|
1971 |
10 |
4 |
p. 258- 1 p. |
article |
74 |
The economics of operator participation in automatic testing
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |
75 |
The economics of thick film hybrid microcircuit production
|
|
|
1971 |
10 |
4 |
p. 257- 1 p. |
article |
76 |
The impact of the silicon gate process on the application of MOS circuits
|
|
|
1971 |
10 |
4 |
p. 252- 1 p. |
article |
77 |
The influence of geometry and conductive terminations on thick film resistors
|
|
|
1971 |
10 |
4 |
p. 258- 1 p. |
article |
78 |
Theory of tunneling into interface states
|
|
|
1971 |
10 |
4 |
p. 254- 1 p. |
article |
79 |
The role of thin films in the electron devices
|
|
|
1971 |
10 |
4 |
p. 257- 1 p. |
article |
80 |
The third dimension in thick-films multilayer technology
|
|
|
1971 |
10 |
4 |
p. 257- 1 p. |
article |
81 |
Thick film conductor adhesion testing
|
Anjard, R.P. |
|
1971 |
10 |
4 |
p. 269-274 6 p. |
article |
82 |
Thin film analysis by Auger Electron Spectroscopy
|
|
|
1971 |
10 |
4 |
p. 258- 1 p. |
article |
83 |
Thin-film circuits benefit r.f. sputtering technique
|
|
|
1971 |
10 |
4 |
p. 257- 1 p. |
article |
84 |
Those aren't movie reels—they're 35-mm. rolls of ICs
|
|
|
1971 |
10 |
4 |
p. 251- 1 p. |
article |
85 |
Variation of the carrier concentration of epitaxial GaAs without addition of dopants
|
|
|
1971 |
10 |
4 |
p. 255- 1 p. |
article |
86 |
Velocity field measurements of electrons in p-type material
|
|
|
1971 |
10 |
4 |
p. 254- 1 p. |
article |
87 |
What's available in MSI?
|
|
|
1971 |
10 |
4 |
p. 250- 1 p. |
article |