| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
A consideration on design of thin-film integrated circuits
|
|
|
1971
|
10 |
2 |
p. 131-
1 p.
|
artikel
|
| 2 |
A gyrator suitable for monolithic, bipolar construction
|
|
|
1971
|
10 |
2 |
p. 127-
1 p.
|
artikel
|
| 3 |
A method for testing and bonding beam-lead devices
|
|
|
1971
|
10 |
2 |
p. 125-
1 p.
|
artikel
|
| 4 |
A Monolithic image sensor for a reading aid for the blind
|
|
|
1971
|
10 |
2 |
p. 126-127
2 p.
|
artikel
|
| 5 |
Analysis of Rb and Cs implantations in silicon by channeling and Hall effect measurements
|
|
|
1971
|
10 |
2 |
p. 129-
1 p.
|
artikel
|
| 6 |
An educational thick film microcircuitry facility
|
|
|
1971
|
10 |
2 |
p. 123-
1 p.
|
artikel
|
| 7 |
A new method for evaluation of mis structure insulation films
|
Beneš, O.
|
|
1971
|
10 |
2 |
p. 105-112
8 p.
|
artikel
|
| 8 |
An integrated circuit switch for auditory research
|
|
|
1971
|
10 |
2 |
p. 127-
1 p.
|
artikel
|
| 9 |
An MOS quality and reliability program
|
McKenna, R.
|
|
1971
|
10 |
2 |
p. 67-74
8 p.
|
artikel
|
| 10 |
Application of a quartz crystal thickness monitor in the continuous measurement of thickness of evaporated and sputtered metal films
|
|
|
1971
|
10 |
2 |
p. 131-
1 p.
|
artikel
|
| 11 |
Assessing equipment reliability for microwave radio-relay systems
|
Walrond, J.C.
|
|
1971
|
10 |
2 |
p. 95-103
9 p.
|
artikel
|
| 12 |
A standardized hybrid microcircuit design cycle
|
|
|
1971
|
10 |
2 |
p. 124-
1 p.
|
artikel
|
| 13 |
Band structure of silicon by pseudo-OPW
|
|
|
1971
|
10 |
2 |
p. 128-
1 p.
|
artikel
|
| 14 |
Behavior of thick film resistors deposited on thick film dielectric layers
|
|
|
1971
|
10 |
2 |
p. 130-
1 p.
|
artikel
|
| 15 |
Calendar of international conferences, symposia, lectures and meetings of interest
|
|
|
1971
|
10 |
2 |
p. 117-120
4 p.
|
artikel
|
| 16 |
Can plastic encapsulated microcircuits provide reliability with economy?
|
|
|
1971
|
10 |
2 |
p. 122-
1 p.
|
artikel
|
| 17 |
Cleaners and cleaning for components and microelectronics
|
|
|
1971
|
10 |
2 |
p. 123-
1 p.
|
artikel
|
| 18 |
Comparison of predicted microwave radio outages
|
|
|
1971
|
10 |
2 |
p. 123-
1 p.
|
artikel
|
| 19 |
Complex MOS circuit arrays
|
|
|
1971
|
10 |
2 |
p. 128-
1 p.
|
artikel
|
| 20 |
Confidence intervals for the ratio of two poisson means and poisson predictor intervals
|
|
|
1971
|
10 |
2 |
p. 121-
1 p.
|
artikel
|
| 21 |
Design the accidents out of your product!
|
|
|
1971
|
10 |
2 |
p. 121-
1 p.
|
artikel
|
| 22 |
Determination of parts per billion of oxygen in silicon
|
|
|
1971
|
10 |
2 |
p. 129-
1 p.
|
artikel
|
| 23 |
Diamond scribers start to give way to laser machines, slurry saws, new etch methods
|
|
|
1971
|
10 |
2 |
p. 125-
1 p.
|
artikel
|
| 24 |
Editor's note
|
|
|
1971
|
10 |
2 |
p. i-
1 p.
|
artikel
|
| 25 |
Effect of electron irradiation on lithium-doped silicon
|
|
|
1971
|
10 |
2 |
p. 129-
1 p.
|
artikel
|
| 26 |
Efficiency and programming of automatic artwork generators
|
|
|
1971
|
10 |
2 |
p. 125-
1 p.
|
artikel
|
| 27 |
Equipment designer's approach to packaging of hybrid microcircuits
|
|
|
1971
|
10 |
2 |
p. 131-
1 p.
|
artikel
|
| 28 |
Experiments concerning the life testing of semiconductor devices—II. Life testing of transistors in switching operation mode
|
Kemény, A.P.
|
|
1971
|
10 |
2 |
p. 75-86
12 p.
|
artikel
|
| 29 |
Failure Rate/MTBF
|
|
|
1971
|
10 |
2 |
p. 121-
1 p.
|
artikel
|
| 30 |
Ferromagnetism in thin films
|
|
|
1971
|
10 |
2 |
p. 130-
1 p.
|
artikel
|
| 31 |
Film thickness measurement by monitoring methods
|
|
|
1971
|
10 |
2 |
p. 131-
1 p.
|
artikel
|
| 32 |
Fine line technologies for microelectronic devices
|
|
|
1971
|
10 |
2 |
p. 124-
1 p.
|
artikel
|
| 33 |
Geometry dependence of thick film resistors
|
|
|
1971
|
10 |
2 |
p. 126-
1 p.
|
artikel
|
| 34 |
Hermetic sealing of integrated circuit packages
|
|
|
1971
|
10 |
2 |
p. 125-
1 p.
|
artikel
|
| 35 |
IC comparator separates sync pulses
|
|
|
1971
|
10 |
2 |
p. 127-
1 p.
|
artikel
|
| 36 |
ICs pick frequencies for untuned power amplifier
|
|
|
1971
|
10 |
2 |
p. 127-
1 p.
|
artikel
|
| 37 |
Integrated circuits for the industrial world
|
|
|
1971
|
10 |
2 |
p. 123-
1 p.
|
artikel
|
| 38 |
Integrated tantalum film RC circuits
|
|
|
1971
|
10 |
2 |
p. 131-
1 p.
|
artikel
|
| 39 |
Intermetallic formation in gold-aluminum systems
|
|
|
1971
|
10 |
2 |
p. 129-130
2 p.
|
artikel
|
| 40 |
Inversion layers in abrupt p-n junctions
|
|
|
1971
|
10 |
2 |
p. 128-
1 p.
|
artikel
|
| 41 |
Ion implantation gives MOS ROM bipolar speed
|
|
|
1971
|
10 |
2 |
p. 132-
1 p.
|
artikel
|
| 42 |
Limitations of the MIS capacitance method resulting from semiconductor properties
|
|
|
1971
|
10 |
2 |
p. 130-
1 p.
|
artikel
|
| 43 |
Measuring integrated electronic device geometry via HF-NO-H2O vapor stain
|
|
|
1971
|
10 |
2 |
p. 129-
1 p.
|
artikel
|
| 44 |
Measuring techniques for trimming thick film resistors
|
|
|
1971
|
10 |
2 |
p. 127-
1 p.
|
artikel
|
| 45 |
Mechanism of failure in high voltage mica paper capacitors
|
|
|
1971
|
10 |
2 |
p. 122-
1 p.
|
artikel
|
| 46 |
Microcircuit packaging and assembly—State of the art
|
|
|
1971
|
10 |
2 |
p. 125-
1 p.
|
artikel
|
| 47 |
Multilayered hybrid LSI using insulating film deposited by RF sputtering
|
|
|
1971
|
10 |
2 |
p. 125-
1 p.
|
artikel
|
| 48 |
Multi-valley effective-mass approximation of shallow donor levels in silicon
|
|
|
1971
|
10 |
2 |
p. 129-
1 p.
|
artikel
|
| 49 |
Nonparametric reliability and its uses
|
|
|
1971
|
10 |
2 |
p. 122-
1 p.
|
artikel
|
| 50 |
Permittivity of glass-ceramic materials for thick film capacitor dielectric
|
|
|
1971
|
10 |
2 |
p. 126-
1 p.
|
artikel
|
| 51 |
Phonon-induced hopping transitions in germanium and silicon
|
|
|
1971
|
10 |
2 |
p. 128-
1 p.
|
artikel
|
| 52 |
Point-wise availability of an electronic system with reduced efficiency class of components
|
Das, P.
|
|
1971
|
10 |
2 |
p. 61-66
6 p.
|
artikel
|
| 53 |
Preparation and properties of 10-μF/in2 thin-film capacitors
|
|
|
1971
|
10 |
2 |
p. 127-
1 p.
|
artikel
|
| 54 |
Properties of thin films of zinc oxide prepared by a chemical spray method
|
|
|
1971
|
10 |
2 |
p. 131-
1 p.
|
artikel
|
| 55 |
Reliability of a repairable multicomponent system with redundancy in parallel
|
|
|
1971
|
10 |
2 |
p. 122-
1 p.
|
artikel
|
| 56 |
Reliability test plan
|
|
|
1971
|
10 |
2 |
p. 121-
1 p.
|
artikel
|
| 57 |
Resin systems for encapsulation of microelectronic packages
|
|
|
1971
|
10 |
2 |
p. 124-
1 p.
|
artikel
|
| 58 |
Resistance anomalies in Ag-PdO Thick-film resistors
|
|
|
1971
|
10 |
2 |
p. 126-
1 p.
|
artikel
|
| 59 |
Rigid and non-rigid beam-lead substrates
|
|
|
1971
|
10 |
2 |
p. 124-
1 p.
|
artikel
|
| 60 |
Selection parameters for hybrid bonding alloys
|
|
|
1971
|
10 |
2 |
p. 123-124
2 p.
|
artikel
|
| 61 |
Silicon defect structure induced by arsenic diffusion and subsequent steam oxidation
|
|
|
1971
|
10 |
2 |
p. 122-
1 p.
|
artikel
|
| 62 |
Solder sealing of large complex hybrid microcircuits
|
|
|
1971
|
10 |
2 |
p. 124-
1 p.
|
artikel
|
| 63 |
Solving problems in metal-oxide-semiconductors
|
|
|
1971
|
10 |
2 |
p. 128-
1 p.
|
artikel
|
| 64 |
Stress concentration in silicon-insulator interfaces
|
|
|
1971
|
10 |
2 |
p. 127-128
2 p.
|
artikel
|
| 65 |
Technological advances in large-scale integration
|
|
|
1971
|
10 |
2 |
p. 123-
1 p.
|
artikel
|
| 66 |
Termination interface reaction with non-palladium resistors and its effect on apparent sheet resistivity
|
|
|
1971
|
10 |
2 |
p. 126-
1 p.
|
artikel
|
| 67 |
Tests on thick film resistors
|
Russell, R.F.
|
|
1971
|
10 |
2 |
p. 115-
1 p.
|
artikel
|
| 68 |
The application of the STD process to hybrid microelectronics
|
|
|
1971
|
10 |
2 |
p. 125-
1 p.
|
artikel
|
| 69 |
The application of thin-film techniques to microwave integrated circuits
|
|
|
1971
|
10 |
2 |
p. 130-
1 p.
|
artikel
|
| 70 |
The interconnection and packaging of thick film microcircuits
|
|
|
1971
|
10 |
2 |
p. 124-
1 p.
|
artikel
|
| 71 |
The latest word in leak detection
|
|
|
1971
|
10 |
2 |
p. 123-
1 p.
|
artikel
|
| 72 |
The Metal-Nitride-Oxide-Silicon (MNOS) Transistor—Characteristics and applications
|
|
|
1971
|
10 |
2 |
p. 126-
1 p.
|
artikel
|
| 73 |
The residual gases and vacuum deposited 20KÅ thick Al films
|
|
|
1971
|
10 |
2 |
p. 130-
1 p.
|
artikel
|
| 74 |
Thermal design problems with high speed ICs—Part 2
|
|
|
1971
|
10 |
2 |
p. 124-
1 p.
|
artikel
|
| 75 |
Thick and thin film resistors: performance and reliability comparisons
|
|
|
1971
|
10 |
2 |
p. 126-
1 p.
|
artikel
|
| 76 |
Thin film deposition technology
|
|
|
1971
|
10 |
2 |
p. 130-
1 p.
|
artikel
|
| 77 |
Thin film physics in microelectronics
|
|
|
1971
|
10 |
2 |
p. 131-
1 p.
|
artikel
|
| 78 |
Transient responses of a pulsed MIS-capacitor
|
|
|
1971
|
10 |
2 |
p. 128-
1 p.
|
artikel
|
| 79 |
Two band model for negative magnetoresistance in heavily doped semiconductors
|
|
|
1971
|
10 |
2 |
p. 129-
1 p.
|
artikel
|
| 80 |
Valence-band deformation potentials for the III–V compounds
|
|
|
1971
|
10 |
2 |
p. 128-
1 p.
|
artikel
|
| 81 |
Yes, redundancy increases reliability
|
|
|
1971
|
10 |
2 |
p. 122-123
2 p.
|
artikel
|
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