| nr |
titel |
auteur |
tijdschrift |
jaar |
jaarg. |
afl. |
pagina('s) |
type |
| 1 |
Accurate reliability analysis of concurrent checking circuits employing an efficient analytical method
|
An, T.
|
|
2015
|
|
3-4 |
p. 696-703
8 p.
|
artikel
|
| 2 |
A dual-rail compact defect-tolerant multiplexer
|
Ben Dhia, A.
|
|
2015
|
|
3-4 |
p. 662-670
9 p.
|
artikel
|
| 3 |
Ageing and thermal recovery of advanced SiGe heterojunction bipolar transistors under long-term mixed-mode and reverse stress conditions
|
Fischer, G.G.
|
|
2015
|
|
3-4 |
p. 498-507
10 p.
|
artikel
|
| 4 |
A mid-value select voter
|
Krstic, M.D.
|
|
2005
|
|
3-4 |
p. 733-738
6 p.
|
artikel
|
| 5 |
An accurate closed-expression model for FinFETs parasitic resistance
|
Pereira, A.S.N.
|
|
2015
|
|
3-4 |
p. 470-480
11 p.
|
artikel
|
| 6 |
Analysis of hot-carrier degradation in a SOI LDMOS transistor with a steep retrograde drift doping profile
|
Cortés, I.
|
|
2005
|
|
3-4 |
p. 493-498
6 p.
|
artikel
|
| 7 |
An efficient BTX sensor based on p-type nanoporous titania thin films
|
Dutta, K.
|
|
2015
|
|
3-4 |
p. 558-564
7 p.
|
artikel
|
| 8 |
An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model
|
George, Elviz
|
|
2015
|
|
3-4 |
p. 582-587
6 p.
|
artikel
|
| 9 |
A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure
|
Vanstreels, K.
|
|
2005
|
|
3-4 |
p. 753-759
7 p.
|
artikel
|
| 10 |
A return on investment analysis of applying health monitoring to LED lighting systems
|
Chang, Moon-Hwan
|
|
2015
|
|
3-4 |
p. 527-537
11 p.
|
artikel
|
| 11 |
A review of CMOS latchup and electrostatic discharge (ESD) in bipolar complimentary MOSFET (BiCMOS) Silicon Germanium technologies: Part II—Latchup
|
Voldman, Steven H.
|
|
2005
|
|
3-4 |
p. 437-455
19 p.
|
artikel
|
| 12 |
A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
|
Tsang, C.F.
|
|
2005
|
|
3-4 |
p. 517-525
9 p.
|
artikel
|
| 13 |
Bandwidth of integrated photodiodes in standard CMOS for CD/DVD applications
|
Radovanović, Saša
|
|
2005
|
|
3-4 |
p. 705-710
6 p.
|
artikel
|
| 14 |
Bipolar SCR ESD devices
|
Vashchenko, V.A.
|
|
2005
|
|
3-4 |
p. 457-471
15 p.
|
artikel
|
| 15 |
Burnout properties of microwave pulse injected on GaAs PHEMT
|
Zhang, Cunbo
|
|
2015
|
|
3-4 |
p. 508-513
6 p.
|
artikel
|
| 16 |
Characterization and modeling of power MOSFET switching times variations under constant electrical stress
|
Sezgin, Hatice Gül
|
|
2015
|
|
3-4 |
p. 492-497
6 p.
|
artikel
|
| 17 |
Characterization of bump arrays at RF/microwave frequencies
|
Ndip, Ivan N.
|
|
2005
|
|
3-4 |
p. 551-558
8 p.
|
artikel
|
| 18 |
Characterization of flexural and thermo-mechanical behavior of plastic ball grid package assembly using moiré interferometry
|
Joo, Jinwon
|
|
2005
|
|
3-4 |
p. 637-646
10 p.
|
artikel
|
| 19 |
Chemical and diffusion-controlled curing kinetics of an underfill material
|
He, Yi
|
|
2005
|
|
3-4 |
p. 689-695
7 p.
|
artikel
|
| 20 |
Cross-layer investigation of continuous-time sigma–delta modulator under aging effects
|
Cai, Hao
|
|
2015
|
|
3-4 |
p. 645-653
9 p.
|
artikel
|
| 21 |
Degradation behavior by DC-accelerated and pulse-current stress in Co/Cr/Y/Al/Ni co-doped ZnO–PrO1.83-based varistors
|
Nahm, Choon-W.
|
|
2015
|
|
3-4 |
p. 565-571
7 p.
|
artikel
|
| 22 |
Design and analyze of transient-induced latch-up in RS485 transceiver with on-chip TVS
|
Jiang, Qi
|
|
2015
|
|
3-4 |
p. 637-644
8 p.
|
artikel
|
| 23 |
Design of a folded cascode opamp with increased immunity to conducted electromagnetic interference in 0.18μm CMOS
|
Richelli, Anna
|
|
2015
|
|
3-4 |
p. 654-661
8 p.
|
artikel
|
| 24 |
Detailed study and projection of hard breakdown evolution in ultra-thin gate oxides
|
Suehle, J.S.
|
|
2005
|
|
3-4 |
p. 419-426
8 p.
|
artikel
|
| 25 |
Development of a fast method for optimization of Au ball bond process
|
Gomes, J.
|
|
2015
|
|
3-4 |
p. 602-607
6 p.
|
artikel
|
| 26 |
Effect of aluminum concentration on the microstructure and mechanical properties of Sn–Cu–Al solder alloy
|
Yang, Li
|
|
2015
|
|
3-4 |
p. 596-601
6 p.
|
artikel
|
| 27 |
Electrothermal characterization of silicon-on-glass VDMOSFETs
|
Nenadović, N.
|
|
2005
|
|
3-4 |
p. 541-550
10 p.
|
artikel
|
| 28 |
Elimination of stress induced dislocation in deep Poly Sinker LDMOS technology
|
Xu, Xiangming
|
|
2015
|
|
3-4 |
p. 486-491
6 p.
|
artikel
|
| 29 |
Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate
|
Waris, Tuomas F.
|
|
2005
|
|
3-4 |
p. 665-673
9 p.
|
artikel
|
| 30 |
Evaluation of parasitic capacitances for interconnection buses crossing in different layers
|
Jarosz, A.
|
|
2005
|
|
3-4 |
p. 761-765
5 p.
|
artikel
|
| 31 |
Extended Sensor Reliability Evaluation Method in multi-sensor control systems
|
Łęczycki, Paweł
|
|
2015
|
|
3-4 |
p. 671-678
8 p.
|
artikel
|
| 32 |
Failure mechanisms in thermal inkjet printhead analyzed by experiments and numerical simulation
|
Lim, Ji-hyuk
|
|
2005
|
|
3-4 |
p. 473-478
6 p.
|
artikel
|
| 33 |
Fatigue life and resistance analysis of COG assemblies under hygrothermal aging
|
Zhang, Wenguo
|
|
2015
|
|
3-4 |
p. 623-629
7 p.
|
artikel
|
| 34 |
Flip chip attachment on flexible LCP substrate using an ACF
|
Frisk, L.
|
|
2005
|
|
3-4 |
p. 583-588
6 p.
|
artikel
|
| 35 |
Gate dielectric breakdown in the time-scale of ESD events
|
Weir, Bonnie E.
|
|
2005
|
|
3-4 |
p. 427-436
10 p.
|
artikel
|
| 36 |
Hot carrier effect on the bipolar transistors’ response to electromagnetic interference
|
Xiong, Cen
|
|
2015
|
|
3-4 |
p. 514-519
6 p.
|
artikel
|
| 37 |
Hybrid reliability assessment for packaging prototyping
|
Lu, Hua
|
|
2005
|
|
3-4 |
p. 597-609
13 p.
|
artikel
|
| 38 |
Impact of gate-leakage currents on CMOS circuit performance
|
Marras, Alessandro
|
|
2005
|
|
3-4 |
p. 499-506
8 p.
|
artikel
|
| 39 |
Impact of wafer charging on hot carrier reliability and optimization of latent damage detection methodology in advanced CMOS technologies
|
Goguenheim, D.
|
|
2005
|
|
3-4 |
p. 487-492
6 p.
|
artikel
|
| 40 |
Improving reliability of beveled power semiconductor devices passivated by SIPOS
|
Wang, Ying
|
|
2005
|
|
3-4 |
p. 535-539
5 p.
|
artikel
|
| 41 |
Improving the power cycling performance of IGBT modules by plating the emitter contact
|
Özkol, Emre
|
|
2015
|
|
3-4 |
p. 552-557
6 p.
|
artikel
|
| 42 |
Improving the reliability of the Benes network for use in large-scale systems
|
Jahanshahi, Mohsen
|
|
2015
|
|
3-4 |
p. 679-695
17 p.
|
artikel
|
| 43 |
Inside front cover - Editorial board
|
|
|
2015
|
|
3-4 |
p. IFC-
1 p.
|
artikel
|
| 44 |
Intermediate wafer level bonding and interface behavior
|
Pan, C.T.
|
|
2005
|
|
3-4 |
p. 657-663
7 p.
|
artikel
|
| 45 |
Leakage current study and relevant defect localization in integrated circuit failure analysis
|
Wu, Chunlei
|
|
2015
|
|
3-4 |
p. 463-469
7 p.
|
artikel
|
| 46 |
Low voltage SILC and P- and N-MOSFET gate oxide reliability
|
Petit, C.
|
|
2005
|
|
3-4 |
p. 479-485
7 p.
|
artikel
|
| 47 |
Maximum pulse current estimation for high accuracy power capability prediction of a Li-Ion battery
|
Lee, Seongjun
|
|
2015
|
|
3-4 |
p. 572-581
10 p.
|
artikel
|
| 48 |
Measuring process capability based on C PK with gauge measurement errors
|
Pearn, W.L.
|
|
2005
|
|
3-4 |
p. 739-751
13 p.
|
artikel
|
| 49 |
Microstructure, tensile and electrical properties of gold-coated silver bonding wire
|
Tseng, Yi-Wei
|
|
2015
|
|
3-4 |
p. 608-612
5 p.
|
artikel
|
| 50 |
Modeling, simulation and temperature compensation of porous polysilicon capacitive humidity sensor using ANN technique
|
Islam, T.
|
|
2005
|
|
3-4 |
p. 697-703
7 p.
|
artikel
|
| 51 |
MOS current divider based PGA
|
Sanz, M. Teresa
|
|
2005
|
|
3-4 |
p. 727-732
6 p.
|
artikel
|
| 52 |
MOSFET channel resistance characterization from the triode region to impact ionization region with the inductive breakdown network
|
Lee, Chie-In
|
|
2015
|
|
3-4 |
p. 481-485
5 p.
|
artikel
|
| 53 |
100 μm Pitch flip chip on foil assemblies with adhesive interconnections
|
de Vries, J.
|
|
2005
|
|
3-4 |
p. 527-534
8 p.
|
artikel
|
| 54 |
Novel concepts for reliability technology
|
Ryu, Dongsu
|
|
2005
|
|
3-4 |
p. 611-622
12 p.
|
artikel
|
| 55 |
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards
|
Siau, Sam
|
|
2005
|
|
3-4 |
p. 675-687
13 p.
|
artikel
|
| 56 |
Real-time fault-tolerance with hot-standby topology for conditional sum adder
|
Mukherjee, Atin
|
|
2015
|
|
3-4 |
p. 704-712
9 p.
|
artikel
|
| 57 |
Reliability of thin films: Experimental study on mechanical and thermal behavior of indium tin oxide and poly(3,4-ethylenedioxythiophene)
|
Alkhazaili, Atif
|
|
2015
|
|
3-4 |
p. 538-546
9 p.
|
artikel
|
| 58 |
Response surface models for efficient, modular estimation of solder joint reliability in area array packages
|
Zhang, L.
|
|
2005
|
|
3-4 |
p. 623-635
13 p.
|
artikel
|
| 59 |
Review of add-on process modules for high-frequency silicon technology
|
Burghartz, J.N.
|
|
2005
|
|
3-4 |
p. 409-418
10 p.
|
artikel
|
| 60 |
Robust dual-direction SCR with low trigger voltage, tunable holding voltage for high-voltage ESD protection
|
Wang, Yang
|
|
2015
|
|
3-4 |
p. 520-526
7 p.
|
artikel
|
| 61 |
SiLK™ etch optimization and electrical characterization for 0.13 μm interconnects
|
Murthy, Ramana
|
|
2005
|
|
3-4 |
p. 507-516
10 p.
|
artikel
|
| 62 |
Study of anisotropic conductive adhesive joint behavior under 3-point bending
|
Rizvi, M.J.
|
|
2005
|
|
3-4 |
p. 589-596
8 p.
|
artikel
|
| 63 |
Systematic evaluation of thermal interface materials—a case study in high power amplifier design
|
Maguire, Luke
|
|
2005
|
|
3-4 |
p. 711-725
15 p.
|
artikel
|
| 64 |
Temperature mapping by μ-Raman spectroscopy over cross-section area of power diode in forward biased conditions
|
Kociniewski, T.
|
|
2015
|
|
3-4 |
p. 547-551
5 p.
|
artikel
|
| 65 |
The effect of the echo-time of a bipolar pulse waveform on molten metallic droplet formation by squeeze mode piezoelectric inkjet printing
|
Wu, Cheng-Han
|
|
2015
|
|
3-4 |
p. 630-636
7 p.
|
artikel
|
| 66 |
The formation and growth of intermetallic compounds and shear strength at Sn–Zn solder/Au–Ni–Cu interfaces
|
Kim, K.S.
|
|
2005
|
|
3-4 |
p. 647-655
9 p.
|
artikel
|
| 67 |
The fundamentals of thermal-mass diffusion analogy
|
Wong, E.H.
|
|
2015
|
|
3-4 |
p. 588-595
8 p.
|
artikel
|
| 68 |
Theoretical investigation on hermeticity testing of MEMS packages based on MIL-STD-883E
|
Tao, Yi
|
|
2005
|
|
3-4 |
p. 559-566
8 p.
|
artikel
|
| 69 |
Ultra-thin high-density LSI packaging substrate for advanced CSPs and SiPs
|
Shimoto, Tadanori
|
|
2005
|
|
3-4 |
p. 567-574
8 p.
|
artikel
|
| 70 |
Vacuum effect on the void formation of the molded underfill process in flip chip packaging
|
Guo, Xue-Ru
|
|
2015
|
|
3-4 |
p. 613-622
10 p.
|
artikel
|
| 71 |
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly
|
Lai, Yi-Shao
|
|
2005
|
|
3-4 |
p. 575-582
8 p.
|
artikel
|
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