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                                       Details for article 4 of 9 found articles
 
 
  In-situ X-ray Microscopy of Crack-Propagation to Study Fracture Mechanics of On-Chip Interconnect Structures
 
 
Title: In-situ X-ray Microscopy of Crack-Propagation to Study Fracture Mechanics of On-Chip Interconnect Structures
Author: Kutukova, Kristina
Liao, Zhongquan
Werner, Stephan
Guttmann, Peter
Standke, Yvonne
Gluch, Jürgen
Schneider, Gerd
Zschech, Ehrenfried
Appeared in: MRS advances
Paging: Volume 3 () nr. 39 pages 2305-2310
Year: 2018-04-29
Contents:
Publisher: Springer International Publishing, Cham
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 4 of 9 found articles
 
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