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Journal description
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Details for article 10 of 32 found articles
| Title: |
Die-embedded glass packaging for 6G wireless applications |
| Author: |
Jia, Xiaofan Li, Xingchen Moon, Kyoung-Sik Swaminathan, Madhavan |
| Appeared in: |
MRS advances |
| Paging: | Volume 7 () nr. 29 pages 630-634 |
| Year: |
2022-08-23 |
| Contents: | |
| Publisher: |
Springer International Publishing, Cham |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 10 of 32 found articles
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