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Journal description
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Details for article 7 of 15 found articles
| Title: |
Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing |
| Author: |
Wang, Fengjiang Chen, Hong Li, Dongyang Zhang, Zhijie Wang, Xiaojing |
| Appeared in: |
Electronic materials letters |
| Paging: | Volume 15 (2018) nr. 1 pages 36-48 |
| Year: |
2018 |
| Contents: | |
| Publisher: |
The Korean Institute of Metals and Materials, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 15 found articles
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