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                                       Details for article 119 of 143 found articles
 
 
  THE APPLICATION OF THE THERMOGRAVIMETRIC ANALYSIS (TGA) AND OF THE DIFFERENTIAL THERMAL ANALYSIS (DTA) FOR RAPID THERMAL ENDURANCE TESTING OF ELECTRICAL INSULATING MATERIALS
 
 
Title: THE APPLICATION OF THE THERMOGRAVIMETRIC ANALYSIS (TGA) AND OF THE DIFFERENTIAL THERMAL ANALYSIS (DTA) FOR RAPID THERMAL ENDURANCE TESTING OF ELECTRICAL INSULATING MATERIALS
Author: P. Budrugeac
E. Segal
Appeared in: Analele Universitatii Bucuresti. Chimie
Paging: Volume XIV (2005) nr. I-II pages 241-246
Year: 2005
Contents: The thermogravimetric analysis (TGA) and the differential thermal analysis (DTA)were applied to investigations of aging processes in some electroinsulating polymeric materials(glass reinforced epoxy resin, NBR ( two sorts), styrenated unsatured polyester resin,hydrogenated NBR (T80), polychloroprene rubber , EPR) and to the measurement of agingreaction rates. It is shown that thermal analysis curves (TG and DTA) can be used for planningthermally accelerated aging experiments which are used for the thermal lifetime evaluation bythe method given in IEC 216. Some results concerning isothermal and non-isothermal aging ofthe above mentioned materials are presented and discussed. The obtained results show that,except EPR, for each investigated material, the value of activation energy corresponding toisothermal degradation of a mechanical property is close to the value of activation energy rapidevaluated from TGA or DTA data. The rapid method for thermal lifetime evaluation whichconsists in the rapid determination of the activation energy from thermal analysis data and theplotting of only one isotherm of accelerated aging, corresponding to the maximum admittedtemperature for accelerated aging, was checked. The results presented in this work show that theTGA and DTA methods should be included among the analytical methods used for thermalendurance testing of insulating materials.
Publisher: Ars Docendi Publishing House (provided by DOAJ)
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 119 of 143 found articles
 
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