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Details van artikel 5 van 36 gevonden artikelen
| Titel: |
A Novel Approach for Cooling Electronics Using a Combined Heat Pipe andThermoelectric Module |
| Auteur: |
Banjerd Saengchandr Nitin V. Afzulpurkar |
| Verschenen in: |
American journal of engineering and applied sciences |
| Paginering: | Jaargang 2 (2009) nr. 4 pagina's 603-610 |
| Jaar: |
2009 |
| Inhoud: |
The development of effective cooling systems for microprocessors, specifically for CPU andother computer chips, is greatly important due to growth of high speed performance chips, which operateat elevated heat rates. The same issues apply for adjacent units including RAM and HDD alsocontributing to overall generation of heat inside computer. Problem statement: Conventional coolingsystem for desktop PC has many problems, especially cooling performance. Lifespan of devices andreliable operation are largely dependent on junction temperature. Total power dissipation of recentlyintroduced, new generation microprocessors had been increasing rapidly, pushing desktop systemcooling technology close to its limits. <br > Approach: Present research focused on a system for removal ofdissipated heat that combined the advantages of heat pipe and thermoelectric modules. Proposedresearch presented a numerical analysis of a novel cooling system for electronics. Configurationstudied concerns microprocessors and other computer ships. Simulations performed in this researchwere based on use of computational fluid dynamics and results obtained in terms of coolingefficiencies were compared to those of the traditional cooling. Heat resistance and temperature of eachcomponent were investigated in this modeling. <br > Results: Lowest core temperature was foundbelow 75°C and total thermal resistance of cooling system is 0.095°C/W. Conclusion/Recommendations: Proposed cooling systems had sufficient capacity for cooling200 W heat dissipation. Temperature of proposed cooling system is lower than both existingcooling systems. Temperature of all components, CPU, heat pipe, TEC and heat sink were below75°C. Thermal resistance characteristic of a cooling system had a major effect on coolingperformance. |
| Uitgever: |
Science Publications (provided by DOAJ) |
| Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
Details van artikel 5 van 36 gevonden artikelen
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