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Details van artikel 7 van 17 gevonden artikelen
| Titel: |
Finite Element Modeling of Diffusional Creep with Explicit Consideration of Enhanced Vacancy Diffusivity in a Finite Region Adjacent to the Grain Interface |
| Auteur: |
Tsukrov, I. Grychanyuk, V. M. Gross, T. S. |
| Verschenen in: |
Mechanics of advanced materials & structures |
| Paginering: | Jaargang 15 (2008) nr. 6-7 pagina's 533-539 |
| Jaar: |
2008-08 |
| Inhoud: |
We propose a finite element model to analyze diffusional creep and stress relaxation in grains with several atomic monolayers thick grain boundary region of enhanced diffusivity. Our model is motivated by the need to study deformations in submicron integrated circuit interconnect structures during the thermal annealing step of the fabrication procedure. On the length scale of modern interconnects, deformations do not conform to the assumptions of classical theories of diffusion creep. We employ a coupled formulation which relates vacancy concentration field and stress field through the creep strains in polycrystals. The approach has been implemented in the commercially available finite element software package with user-defined subroutines. We validate the model for the case of stress relaxation in one-dimensional grain array by comparing finite element results to the predictions of classical theories. We use our model to study the effect of grain size on creep rate in a polycrystal under external load. |
| Uitgever: |
Taylor & Francis |
| Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
Details van artikel 7 van 17 gevonden artikelen
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