|
| << vorige | volgende >> |
Tijdschrift beschrijving
Alle jaargangen van het bijbehorende tijdschrift
Alle afleveringen van het bijbehorende jaargang
Alle artikelen van de bijbehorende aflevering
Details van artikel 3 van 6 gevonden artikelen
| Titel: |
SELECTING A TEMPERATURE TIME HISTORY FOR PREDICTING FATIGUE LIFE OF MICROELECTRONICS SOLDER JOINTS |
| Auteur: |
Basaran, Cemal Dishongh, Terry Zhao, Ying |
| Verschenen in: |
Journal of thermal stresses |
| Paginering: | Jaargang 24 (2001) nr. 11 pagina's 1063-1083 |
| Jaar: |
2001-11-01 |
| Inhoud: |
Temperature cycling tests are standard industry practice for determining the thermomechanical fatigue life of solder joints. Industry-standard temperature profiles usually start from room temperature, then go to a high temperature, then to a cold temperature, and then back to room temperature. In addition, most of the time, the temperature profile contains dwell times at the highest and lowest temperatures. The dwell time at a high temperature corresponds to the on-state storage of the device, and the cold-temperature dwell time simulates the off-state storage of the device. In this study, the actual temperature history of a Ball Grid Array (BGA) package in a laptop computer was measured in situ. Experimental reliability studies were conducted using the in situ measured temperature history as well as industry-standard temperature history. This article presents the influence of temperature history on solder joint fatigue life. In order to measure deformations in the solder joint under cycling loading, a new Moire interferometry grating replication technique was developed to be able to measure strain field during fatigue testing. |
| Uitgever: |
Taylor & Francis |
| Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
Details van artikel 3 van 6 gevonden artikelen
| << vorige | volgende >> |