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| Titel: |
NUMERICAL INVESTIGATION OF TRANSIENT THERMAL STRESSES OF WORKPIECE IN SURFACE GRINDING |
| Auteur: |
Tsai, H. H. Hocheng, H. |
| Verschenen in: |
Journal of thermal stresses |
| Paginering: | Jaargang 19 (1996) nr. 6 pagina's 565-578 |
| Jaar: |
1996-09-01 |
| Inhoud: |
Thermal stresses on a ground surface are one of the main concerns during surface grinding. The purpose of this article is to investigate the three-dimensional thermal stresses induced by grinding represented by a moving triangular heat source. The solutions of transient thermal stresses are derived by the Goodier's thermoelastic potential and Galerkin functions. The stresses are calculated numerically by the inverse Fourier transformation and integration of Simpson's 3/8 rule. Results show that the stress in the direction of the grinding depth is compressive and larger than the tensile stress along the feed direction. The stresses near the grinding zone change drastically. The workpiece feedrate is the main factor affecting the normal stresses. Cooling is essential in surface grinding, which can effectively reduce the normal stresses to zero or perhaps to negative value. |
| Uitgever: |
Taylor & Francis |
| Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
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