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                                       Details for article 32 of 129 found articles
 
 
  A simulation study of new multi-objective composite dispatching rules, CONWIP, and push lot release in semiconductor fabrication
 
 
Title: A simulation study of new multi-objective composite dispatching rules, CONWIP, and push lot release in semiconductor fabrication
Author: Bahaji, N.
Kuhl, M. E.
Appeared in: International journal of production research
Paging: Volume 46 (2008) nr. 14 pages 3801-3824
Year: 2008-07
Contents: This paper evaluates dispatching rules and order release policies in two wafer fabrication facilities (thereafter referred to as 'fab') representing ASIC (application specific integrated circuit) and low-mix high-volume production. Order release policies were fixed-interval (push) release, and constant work-in-process (CONWIP) (pull) policy. Following rigorous fab modelling and statistical analysis, new composite dispatching rules were found to be robust for average and variance of flow time, as well as due-date adherence measures, in both production modes.
Publisher: Taylor & Francis
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 32 of 129 found articles
 
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