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                                       Details for article 3 of 9 found articles
 
 
  Epoxy Resin Based Polyamides as Epoxy Curing Agents
 
 
Title: Epoxy Resin Based Polyamides as Epoxy Curing Agents
Author: Baraiya, Rajesh
Thakkar, Jatin R.
Appeared in: International journal of polymeric materials
Paging: Volume 36 (1997) nr. 3-4 pages 189-196
Year: 1997-04-01
Contents: Novel bis ester 1,1'-(1-methyl ethylidene) bis[4-{1-(1-imino-4-ethyl benzoate)-2-pro-panolyloxy}] benzene was prepared by the reaction of epoxy resin, diglycidyl ether of bisphenol-A (DGEBA) and 4-aminoethyl benzoate. The polyamides (PAs) were prepared by the condensation of this novel bis ester with three aliphatic diamines viz; diethylene triamine (DETA), triethylene tetramine (TETA) and polyethylene amine (PEA). The resultant PAs were characterised by infrared spectroscopy (IR). The number average molecular weight (MBn) was estimated by non-aqueous conductometric titration. As produced, polyamides may act as epoxy curing agent, the kinetic study of the PA-epoxy resin system has been established by differential scanning calorimetry (DSC) and the kinetic parameters have been evaluated. Neat PA-epoxy cured products have also been characterized by thermogravimetric analysis (TGA). The glass fiber reinforced composites of the produced PA-epoxy system have been fabricated and were characterized by Flexural strength (FS), Interlaminar shear strength (ILSS) and Rockwell hardness.
Publisher: Taylor & Francis
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 3 of 9 found articles
 
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