Novel bis ester namely 1,1'-(1-methylethylidene) bis[4-{1-(1-imino-4-ethyl benzoate)-2-propano-lyloxy]benzene was prepared by the reaction of epoxy resin, diglycidyl ether of bisphenol-A-(DGEBA) and 4-amino ethyl benzoate. The polyamides (PAs) were prepared by the condensation of bis ester derivative with various aliphatic diamines viz., 1,2-ethylene diamine (EDA), 1,3-propylene diamine (PDA), 1,4-butylene diamine (BDA) and 1,6-hexamethylene diamine (HMDA). The resultant novel epoxy resin based PAs were characterized by infrared spectroscopy and number average molecular weight (Mn). As produced, polyamides may act as epoxy curing agent, the kinetic study of the PA-epoxy resin system has been established by differential scanning calorimetry (DSC) and the kinetic parameters have been evaluated. Neat PA-epoxy cured products have also been characterized by thermogravimetric analysis (TGA).