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| Titel: |
Process engineering issues of CSD-based thin-film multi-level ceramic capacitors |
| Auteur: |
Watt, Michael M. |
| Verschenen in: |
Integrated ferroelectrics |
| Paginering: | Jaargang 26 (1999) nr. 1-4 pagina's 163-186 |
| Jaar: |
1999-10-01 |
| Inhoud: |
The TFMLC (Thin-film Multi-level Ceramic Capacitor) is conceptually straightforward. However its relatively gradual emergence has been partly due to generic process engineering issues encountered by all practitioners which compound the normal challenges of fabricating single-level ferroelectric thin-film capacitors. The CSD (Chemical Solution Deposition) approach to ferroelectric thin-film formation has always promised favourable techno-economics based on its apparent simplicity and relatively low equipment cost. It is also inherently convenient to introduce ferroelectric material improvement or substitution simply by a change of solution chemistry. This paper assesses the merits and limitations of CSD-based approaches to the TFMLC in the context of the above-mentioned generic process engineering issues. |
| Uitgever: |
Taylor & Francis |
| Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
Details van artikel 24 van 31 gevonden artikelen
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