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Details for article 2 of 5 found articles
| Title: |
DIRECT LIQUID COOLING OF ELECTRONIC CHIPS BY SINGLE-PHASE FORCED CONVECTION OF FC-72 |
| Author: |
Tou, K. W. Xu, G. P. Tso, C. P. |
| Appeared in: |
Experimental heat transfer |
| Paging: | Volume 11 (1998) nr. 2 pages 121-134 |
| Year: |
1998-04-01 |
| Contents: |
Experimental studies of single-phase heat transfer with the working fluid FC-72 from a single chip and a four-in-line chip module mounted on one wall of a vertical rectangular channel are carried out. Both flush-mounted and protruding chip configurations are investigated with the channel height being equal to the ship length. The Reynolds number based on chip length ranged from 2.2 × 103 to 6.3 × 104 (3.0 × 103 < ReD < 8.4 × 104) for an inlet temperature of 25°C. Results for a single flush-mounted chip are in good agreement with those obtained for the most upstream chip of the multichip module. Heat transfer data of a single heated protruding chip located downstream agree well with the results from the single flush-mounted chip. Heat transfer coefficients from flush-mounted chips are less than those from protruding chips. |
| Publisher: |
Taylor & Francis |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 5 found articles
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