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                                       Details for article 6 of 9 found articles
 
 
  Rheoforging of thin case for IT devices with optimal process parameters and new type die design
 
 
Title: Rheoforging of thin case for IT devices with optimal process parameters and new type die design
Author: Jeon, Yong Phil
Bolouri, Amir
Seo, Hyung Yoon
Kim, Jong Deok
Kang, Chung Gil
Appeared in: Proceedings of the institution of mechanical engineers. Part C: Journal of mechanical engineering science
Paging: Volume 228 (2014) nr. 6 pages 1021-1028
Year: 2014-04
Contents:
Publisher: SAGE Publications, Sage UK: London, England
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 6 of 9 found articles
 
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