Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching
Titel:
Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching
Auteur:
Paik, Kyung W.Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA Ruoff, Arthur L.Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA
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