Adhesion enhancement of polyimide on copper by Ar ion beam etching of copper
Titel:
Adhesion enhancement of polyimide on copper by Ar ion beam etching of copper
Auteur:
Paik, Kyung W.Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA Ruoff, Arthur L.Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA
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