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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 4 of 7 found articles
| Title: |
Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition |
| Author: |
Wang, B. Eberhardt, W. Kück, H. |
| Appeared in: |
Journal of adhesion science and technology |
| Paging: | Volume 18 (2004) nr. 8 pages 883-891 |
| Year: |
2004-08-01 |
| Contents: | |
| Publisher: |
Brill, Leiden/Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 4 of 7 found articles
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