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Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 2 of 6 found articles
| Title: |
Adhesion characteristics of underfill resins with flip chip package components |
| Author: |
Sham, Man-Lung Kim, Jang-Kyo |
| Appeared in: |
Journal of adhesion science and technology |
| Paging: | Volume 17 (2003) nr. 14 pages 1923-1944 |
| Year: |
2003-12-20 |
| Contents: | |
| Publisher: |
Brill, Leiden/Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 2 of 6 found articles
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