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Journal description
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Details for article 5 of 7 found articles
| Title: |
Improvement in the adhesion between copper metal and polyimide substrate by plasma polymer deposition of cyano compounds onto polyimide |
| Author: |
Inagaki, N. Tasaka, S. Ohmori, H. Mibu, S. |
| Appeared in: |
Journal of adhesion science and technology |
| Paging: | Volume 10 (1996) nr. 3 pages 243-256 |
| Year: |
1996-01-01 |
| Contents: | |
| Publisher: |
Brill, Leiden/Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 7 found articles
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