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Journal description
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Details for article 7 of 15 found articles
| Title: |
Effect of Non-conductive Film on the Reliability of Multi-chip Package Bonded Using Ultrasonic Energy |
| Author: |
Lee, Jong-Bum Lee, Jong-Gun Ha, Sang-Su Jung, Seung-Boo |
| Appeared in: |
Journal of adhesion science and technology |
| Paging: | Volume 25 (2011) nr. 18 pages 2475-2482 |
| Year: |
2011-08-01 |
| Contents: | |
| Publisher: |
Brill, Leiden/Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 7 of 15 found articles
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