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Journal description
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Details for article 3 of 12 found articles
| Title: |
A novel MD/FE coupled model for numerical investigation of interfacial thermal resistance in MEMS/NEMS packaging |
| Author: |
Yang, Ping Liao, Ningbo |
| Appeared in: |
Composite interfaces |
| Paging: | Volume 15 (2008) nr. 6 pages 561-575 |
| Year: |
2008-08-01 |
| Contents: | |
| Publisher: |
Brill, Leiden/Boston |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 3 of 12 found articles
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