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  A new soft-particle DEM model of micro-particle impact integrated adhesive, elastoplastic and microslip behaviors
 
 
Title: A new soft-particle DEM model of micro-particle impact integrated adhesive, elastoplastic and microslip behaviors
Author: Dong, Yunshan
Si, Fengqi
Jin, Wei
Cao, Yue
Ren, Shaojun
Appeared in: Advanced powder technology
Paging: Volume 31 () nr. 9 pages 3960-3973
Year: 2020
Contents:
Publisher: The Society of Powder Technology Japan
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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