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                                       Details for article 9 of 16 found articles
 
 
  Modeling complex packing structures and their thermal properties
 
 
Title: Modeling complex packing structures and their thermal properties
Author: Jia, X.
Gopinathan, N.
Williams, R. A.
Appeared in: Advanced powder technology
Paging: Volume 13 (2002) nr. 1 pages 55-71
Year: 2002-03-01
Contents:
Publisher: Brill, Leiden/Boston
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 16 found articles
 
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