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                                       Details for article 10 of 10 found articles
 
 
  Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions
 
 
Title: Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions
Author: SUBRAMANIAN, K. N.
Appeared in: Fatigue & fracture of engineering materials and structures
Paging: Volume 30 (2007) nr. 5 pages 420-431
Year: 2007-05
Contents:
Publisher: Blackwell Publishing Ltd, Oxford, UK
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 10 of 10 found articles
 
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