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                                       Details for article 10 of 14 found articles
 
 
  Patterned wafer bonding using ultraviolet adhesive
 
 
Title: Patterned wafer bonding using ultraviolet adhesive
Author: Zhuo, Rui
Liao, Guanglan
Liu, Wenliang
Nie, Lei
Shi, Tielin
Appeared in: Frontiers of mechanical engineering
Paging: Volume 6 (2011) nr. 2 pages 214-218
Year: 2011
Contents:
Publisher: SP Higher Education Press, Heidelberg
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 10 of 14 found articles
 
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