|
Cutting edge preparation of microdrills by shear thickening polishing for improved hole quality in electronic PCBs |
|
|
|
Titel: |
Cutting edge preparation of microdrills by shear thickening polishing for improved hole quality in electronic PCBs |
Auteur: |
Wang, Jiahuan Ke, Mingfeng Liao, Jiepei Zhou, Yu Goel, Saurav Verma, Jaya Wang, Xu Guo, Weigang Yuan, Julong Lyu, Binghai |
Verschenen in: |
Frontiers of mechanical engineering |
Paginering: |
Jaargang 19 () nr. 2 pagina's xx |
Jaar: |
2024-05-30 |
Inhoud: |
|
Uitgever: |
Higher Education Press, Beijing |
Bronbestand: |
Elektronische Wetenschappelijke Tijdschriften |
|
|
|
|