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  All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing
 
 
Title: All-SiC Fiber-Optic Sensor Based on Direct Wafer Bonding for High Temperature Pressure Sensing
Author: Liang, Ting
Li, Wangwang
Lei, Cheng
Li, Yongwei
Li, Zhiqiang
Xiong, Jijun
Appeared in: Photonic sensors
Paging: Volume 12 () nr. 2 pages 130-139
Year: 2021-10-02
Contents:
Publisher: Springer Singapore, Singapore
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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 Koninklijke Bibliotheek - National Library of the Netherlands