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                                       Details for article 9 of 12 found articles
 
 
  Leaflet Stresses During Full Device Simulation of Crimping to 6 mm in Transcatheter Aortic Valve Implantation, TAVI
 
 
Title: Leaflet Stresses During Full Device Simulation of Crimping to 6 mm in Transcatheter Aortic Valve Implantation, TAVI
Author: Bressloff, N. W.
Appeared in: Cardiovascular engineering and technology
Paging: Volume 13 () nr. 5 pages 735-750
Year: 2022-03-01
Contents:
Publisher: Springer International Publishing, Cham
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 12 found articles
 
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