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                                       Details for article 9 of 11 found articles
 
 
  Sequence assembly using next generation sequencing data—challenges and solutions
 
 
Title: Sequence assembly using next generation sequencing data—challenges and solutions
Author: Chin, Francis Y. L.
Leung, Henry C. M.
Yiu, S. M.
Appeared in: Science China life sciences
Paging: Volume 57 (2014) nr. 11 pages 1140-1148
Year: 2014
Contents:
Publisher: Science China Press, Beijing
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 9 of 11 found articles
 
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