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                                       Details for article 22 of 50 found articles
 
 
  Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
 
 
Title: Numerical modeling of the transient liquid phase bonding process of Ni using Ni-B-Cr ternary filler metal
Author: Ohsasa, K.
Narita, T.
Shinmura, T.
Appeared in: Journal of phase equilibria
Paging: Volume 20 (1999) nr. 3 pages 199-206
Year: 1999
Contents:
Publisher: Springer-Verlag, New York
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 22 of 50 found articles
 
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 Koninklijke Bibliotheek - National Library of the Netherlands