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Journal description
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Details for article 14 of 31 found articles
| Title: |
Investigation on Thermal Conductivity and Solidification Process of Molten Slags by Using Copper Finger Dip Test |
| Author: |
Gu, Shaopeng Wen, Guanghua Yang, Changlin Guo, Junli Tang, Ping Liu, Qiang |
| Appeared in: |
Transactions of the Indian Institute of Metals |
| Paging: | Volume 72 () nr. 12 pages 3139-3151 |
| Year: |
2019 |
| Contents: | |
| Publisher: |
Springer India, New Delhi |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 14 of 31 found articles
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