|
| << previous | next >> |
Journal description
All volumes of the corresponding journal
All issues of the corresponding volume
All articles of the corresponding issues
Details for article 5 of 14 found articles
| Title: |
Evaluation of thermal deformation in electronic packages |
| Author: |
Beom, Hyeon Gyu Jeong, Kyoung Moon |
| Appeared in: |
KSME international journal |
| Paging: | Volume 14 (2000) nr. 2 pages 251-260 |
| Year: |
2000 |
| Contents: | |
| Publisher: |
Korean Society of Mechanical Engineers, Seoul |
| Source file: |
Elektronische Wetenschappelijke Tijdschriften |
Details for article 5 of 14 found articles
| << previous | next >> |