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  A cooling system using wickless heat pipes for multichip modules: Experiment and analysis
 
 
Title: A cooling system using wickless heat pipes for multichip modules: Experiment and analysis
Author: Rhi, S. H.
Kim, W. T.
Lee, Y.
Appeared in: KSME international journal
Paging: Volume 11 () nr. 2 pages 208-220
Year: 2008-09-01
Contents:
Publisher: Korean Society of Mechanical Engineers, Seoul
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

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