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                                       Details for article 5 of 8 found articles
 
 
  On the Fracture Toughness Measurement of Thin Film Coated Silicon Wafers
 
 
Title: On the Fracture Toughness Measurement of Thin Film Coated Silicon Wafers
Author: Yang, Chris
Pham, John
Appeared in: SILICON
Paging: Volume 7 (2014) nr. 1 pages 27-30
Year: 2014
Contents:
Publisher: Springer Netherlands, Dordrecht
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 5 of 8 found articles
 
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