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                                       Details for article 19 of 34 found articles
 
 
  Numerical Investigation on the Effect of Thermal Gate Moving Rate on Directional Solidification Process
 
 
Title: Numerical Investigation on the Effect of Thermal Gate Moving Rate on Directional Solidification Process
Author: Su, Wenjia
Guan, Zhicheng
Li, Jiulong
Zhang, Zhen
Li, Jiaqi
Appeared in: SILICON
Paging: Volume 15 () nr. 7 pages 3103-3112
Year: 2022-11-30
Contents:
Publisher: Springer Netherlands, Dordrecht
Source file: Elektronische Wetenschappelijke Tijdschriften
 
 

                             Details for article 19 of 34 found articles
 
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